AD-A260 182

RL-TR-93-21, Part 1 (of two)Final Technical ReportFebruary 1993

STEP STRESS TESTING OFRECEIVERITRANSMITTERUNITS

Hughes Aircraft Company

Steve Burnett, David Huch, Larry James, Stephen Mueller,Peggy Tran

DTICS ELECTE

FEB12 199353

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APPRVVED FOR PUBLIC RELEASE; DISTRIBUTION UNLIMITED.

93-02510"III""l'll

Rome LaboratoryAir Force Materiel Command

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NCY USE ONLY (Leave Blank) 2 REPORT DATE a. REPORT TYPE AND DATES COVEREDFebruary 1993 Final Jul 91 - Jun 92

4. TITlE AND SUBTITLE 5. FUNDING NUMBERSSTEP STRESS TESTING OF RECEIVER/TRANSMITTER UNITS C - F30602-89-D-0100,

Task 9PE - 33601F

SAUTHOR(S) PR - 2487Steve Burnett, David Huch, Larry James, TA - QBStephen Mueller, Peggy Tran vIT - 12

7. PERFORMING ORGANIZATION NAME(S) AND ADDRESS(ES) & PERFORMING ORGANIZATIONHughes Aircraft Company REPORT NUMBERGround Systems GroupFullerton CA 92634 N/A

9. SPONSORING/MONITORING AGENCY NAME(S) AND ADDRESSES) 10. SPONSORING/`MONITORING

Rome Laboratory (ERSR) AGENCY REPORT NUMBER

525 Brooks Rd RL-TR-93-21, Pt 1Griffiss AFB NY 13441-4505 (of two)

11. SUPPLEMENTARY NOTES

Rome Laboratory Project Engineer: Timothy J. Donovan/ERSR/(315) 330-2608

Prepared for .iT Research Institute, Rome NY 13440-2069

12a. DISTRIBU11ON/AVAiLABIUTY STATEMENT 12b. DISTRIBUTION CODE

Approved for public release; distribution unlimited.

a3 ABSTRACT~J-'.'n 2WSacJThis report has been prepared to summarize a test validation effort for anaccelerated life testing model which uses a wide parametric Bayesian AnalysisMethodology. Step stress testing was performed on seven (7) Joint TacticalInfor'mation Distribution System (JTIDS) Class 1 synthesizer - detector, radiofrequency assemblies. Failure data and analyses are provided. The report addressesissues concerning how to demonstrate high reliability (Mean-Time-Between-Failurevalues of 10,000 hours or more) on procured Air Force systems without incurringexcessive testing costs.

14. SUBJECT TERMS i& NUMBER OF PAGESAccelerated Life Testing, Failure Rate (MTBF) 184Step Stress Testing it PRICE CODE

7. SECURITY CLASFICATION 1I&SECURIYCLASSIFICATION II aSECURITYCLASSFICATION 20. U•MIWTON OF ABSTRACT

U FLR IED OF OPE OF_ ABSTRACT _?,DUNCASSIFIED UNCLASSIFIED UJL

Mm Stw d ForA 290 2.•.S)Prectba by ANSIdmiag-lu

p CONTENTS

1. INTRODUCTION .............................................................................................. 1

1.1 General ................................................................................................................ 11.2 Scope ................................................................................................................... 11.3 Applicable Documents ................................................................................... 11.4 Test Objective ............................................................................................... 1

2. ACCELERATED LIFE TEST (ALT) SUMMARY ...................................... 1

2.1 Methodology ................................................................................................. 12.2 Test Setup and Trial Run ............................................................................... 32.3 Conformal Coating Analysis ......................................................................... 32.4 Test Data/Results ......................................................................................... 32.5 Failure Analysis ............................................................................................ 3

3. RELIABILITY ANALYSIS ........................................................................ 3

3.1 Prediction Methodology ................................................................................ 33.1.1 MIL-HDBK-217 Predictions ........................................................................ 33.1.1 Prediction Ground Rules and Assumption ..................................................... 5S3.1.2 Failure Rate Prediction Results...............................63.2 Field Estimates ............................................................................................... 7

FIGURES

Fig= EMg

1.1-1 Project Schedule ............................................................................................. 22.1-1 Step-Stress Test Flow Diagram .................................................................... 4

TABLES

Iabk 2W

3.1.2-1 Predicted Test Article Reliability Summary .................................................. 6

APPENDIX A Reliability PredictionsAPPENDIX B Trial Step-Stress Test RunAPPENDIX C Conformal Coating AnalysisS APPENDIX D Test Data/ResultsAPPENDIX E Failure Analyses

i

1. INTRODUCTION

1.1 General. This test report is being prepared under Subcontract No. DOOO-07 inaccordance with Para. 4.1.9 of the Revised Statement of Work for Task #9 dated14 May 1991. The testing/analysis is part of an effort being conducted under primecontract No. F30602-89-D-0100 for Rome Labs. Modification No. 06 (23 August 1991)incorporated Delivery Order G0001 into the basic subcontract and provided partialfunding. Modification No. 07 (10 September 1991) fully funded D/O G0001.Additionally, Hughes Aircraft Company internally funded a portion of the effort duringthe 4th quarter of 1991.

The project schedule is shown in Figure 1. 1- 1.

1.2 S=. Since 1989, Hughes has participated on a Total Quality Management (TQM)panel with other industry and government representatives to attempt to resolve some ofthe issues concerning how to demonstrate high reliability (MTBFs of 10,000 hours ormore) on procured Air Force systems without incurring excessive costs or putting a drainon personnel resources. The panel converged on a step-stress accelerated life testing(ALT) approach using a Bayesian modeling approach. Hughes Aircraft was tasked toestablish a relatively short term step-stress testing method and conduct the testing onseven production (fielded) configuration Receiver/Transmitter (R/T) modules.

1.3 Applicable Documents,

1) MIL-HDBK-217 Military Handbook:Rev. E Reliability Prediction of Electronic

Equipment

S 2) CDRL J003-OO1A R&D Test & Acceptance PlanFINAL

1.4 TIes .Qkitv. The objective of this test was to gather data for incorporation in anoverall validation study of the ALT approach as applied to electronic units. Morespecifically, the test results using the team-developed ALT were compared with actualfield results. This activity serves as one of three model validation efforts scheduledpreviously by the team.

2. ACCELERATED LIFE TEST (ALT) SUMMARY

2.1 M. Historical data on the test article from both airborne and groundenvironments were used to evaluate the ALT approach. Estimates of the "prior"reliability of the unit at each stress step for both environments were based onMIL-HDBK-217 (ref. 1 above) failure rates computed at a benign environment adjustedfor the appropriate component stress ratios. As part of the test effort, failed componentswere analyzed to identify failure cause. The failure causes were checked to determinewhether the design limits of the unit were exceeded or whether correlation, if any, withfield failure modes could be established.

After all units have either failed or survived the final stress step (constituting a singlepass), an estimate was generated for both airborne and ground environments to comparewith the corresponding estimates using historical failure data.

1

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The test items are residual production assets consisting of seven R/T units, hereafterreferred to as Unit(s) Under Test (UUT). The units are production configuration identicalto fielded units. Additionally, each UUT went through the same test and stress-screeningas a production spare prior to being subjected to the step-stress testing. Each UUT wassubjected to six cycles of powered and monitored temperature cycling at the next higherassembly level. Afterwards, each unit passed test at the next higher assembly and its ownunit test (ref. 2 above) prior to being declared ready for step-stress testing. The overallStep-Stress Test Flow Diagram is shown in Figure 2. 1-1.

2.2 Test Setup and Trial Run. A trial test of the step-stress testing was performed on asample unit (not a UUT) during the November 1991 time frame. The informationresulting from that trial test is contained in Appendix B and consists of the following:

"• Text of Appendix D of the Test Plan (ref. 1 above), Trial Step-Stress Test Run"* Thermal Evaluation Test Journal"* Thermal Survey, Data Printout and Plots"* Test Data Shects, Performance Monitoring"* Data Reduction, Tables and Plots"* Unit Modification & Equipment Setup

2.3 Conformal Coating Analysis. Severe discoloration of the conformal coating wasobserved on the UUT's after going through all test steps. An analysis was conductedfollowing testing of the second unit to determine the integrity of the material; the resultsare contained in Appendix C.

2.4 Test Data/Results. The results of testing the seven UUT's is as follows:

UNIT RESULTS

1 Passed all steps2 Passed all steps3 Passed all steps4 Failed at Step 95 Failed at Step 106 Failed at Step 77 Failed at Step 10

The detailed test data/results are contained in Appendix D and consist of Step-Stress TestData Sheets, data printouts, temperature plots, thermal log, and initial Trouble & FailureReport (if applicable).

2.5 Fail= Analy. The detailed failure analyses including photographs are containedin Appendix E.

3. RELIABILITY ANALYSIS

3.1 Prediction Methodology.

3.1.1 MtL-HDBK-217 Predictions. Reliability predictions were performed bycomputing and combining the stress failure rates of all the electronic components in the

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4

test unit. The stress failure rates were determined through the use of MIL-HDBK-217and the results of thermal analyses (provided in Appendix B) and SPICE electricalanalyses. The thermal and electrical stresses (in the form of case temperature, voltage,current, and power) were combined with the physical characteristics (e.g. number of pins,technology) and manufacturing features (e.g., quality level of screening program) of eachcomponent and entered into the applicable MIL-HDBK-217 failure rate equation. Theequations were executed using a spreadsheet for each applied voltage, temperature, andenvironmental condition under study.

3.1.1 Prediction Ground Rules and Assumption. The following ground rules were used incalculating component failure rates:

1) The physical characteristics and manufacturing features of each componentwere determined through the use of the part list included on the test articledrawings and MLL-HDBK-217 tables.

2) Electrical stress ratios were computed as the ratio of the applied stress (asdetermined by the electrical circuit analyses) to the maximum rating according tothe component specification (commercial or military as appropriate). Stress ratiosof less than 1% were rounded up to 1%.

3) Discrete R.F. filter failure rates were derived by the part count predictionmethod (Section 5.2 of MIL-HDBK-217) because there was insufficient dataavailable to perform stress based failure rate predictions.

4) Inductive device (R.F. coils and transformers) failure rates were extrapolatedproportionately to wirewound resistor R3 in the Detector module beyond Step 0.This was done because the MIL-HDBK-217 inductive device failure rateequations were not applicable to the range of test temperatures.

5) The quality factors for internal hybrid components were equated to the discretecomponents used in the test article.

6) The electrical stress ratios for internal hybrid components were assumed to be30% (as supplier stress analysis was not available).

7) Measured thermocouple data was utilized to the maximum extent possible.

8) The temperatures of the internal hybrid components were assumed to be 10degrees Centigrade above the hybrid case temperatures.

9) Discrete components were assumed to have case temperatures equal to thecompartment temperatures.

10) Thermocouple data was extrapolated for steps 9 and 10 based on temperaturedifferentials above the chamber temperature at step 8.

11) The VCO hybrid case temperature was assumed to be 20 degrees Centigradeabove the environmental chamber temparature, and all other hybrids 10 degreesabove, based on the thermocouple data.

I5

3.1.2 Failure Rate Prediction Results. Predictions were established for each appliedtemperature and voltage condition under study. Predicted component failure ratesummaries are provided in Appendix A, showing the total (for the entire part quantity)failure rates for each part at each condition. The predicted test article reliability summary(Table 3.1.2-1) shows predicted failure rates and Mean Times Between Failures (MTBF)at each stress condition.

Predictions are provided for the following conditions:

- 25 degrees Centigrade, Ground Benign (Gb) environment.

- 25 degrees Centigrade, Ground Fixed (Gf) environment.

- 25 degrees Centigrade, Airborne Inhabited Cargo (Aic) environment.

- Steps 1 through 10, the temperature and voltage conditions defined in the mainbody of this test report, in a Ground Benign (Gb) environment.

TABLE 3.2. 1-1 - PREDICTED TEST ARTICLE RELIABILITY SUMMARY

Failure Rate MTBFCondition (per nil. hrs.) (Hours)

25C, Gb 8.68 11526225C, Gf 32.07 3118025C, Aic 48.16 20763Step 0 22.04 45373Step 1 24.80 40325Step 2 28.39 35225Step 3 32.07 31177Step 4 39.96 25024Step 5 48.48 20628Step 6 56.01 17854Step 7 67.82 14746Step 8 84.93 11774Step 9 113.59 8804Step 10 144.63 6914

I65

3.2 FielEstimat. Field failure experience for July of 1985 through July of 1989 wasreviewed and it was determined that there had been four (4) failures of the test article.Field operating experience for July of 1985 through June of 1988 was obtained, whichwas then extrapolated through July of 1989. The equipment operating hours and failuredata experience were then used to determine the observed MTBF in each fieldenvironment as summarized below:

Airborne GroundEnvironment Environment

Operating Hours 13,200 86,800

Failures 2 (a,b) 2 (b,c)

Observed MTBF 6600 43,400

Failure description:

a) Replaced R40 and U3 in the detector.b) Failed fault isolation test, no repair data.c) Fractured solder joints.

APPENDIX A

Reliability Predictions

APPENDIX A

Reliability Abbreviations

Gf - Ground Fixed Environment

Aic - Airborne Inhabited Cargo Environment

Step - Temperature and voltage conditions asdefined in main body of test plan

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APPENDIX B

Trial Step-Stress Test Run

S

HUGHES AIRCRAFT COMPANY

INTE1RDEPARTMENTAL CORRESPONDENCE

TO: Dcpt ENB cc: Project Distribution DATE: 12 February 1992ORG: IA-72-XX REF: 92/1A72.301 001

SUBJECT: Trial Step-Stress Test Run FROM:S.D. MuclgfTest Data for Appendix D BLDG: 675 MAlL STA.7 Z314

EXT: 1-8360 ORG.CODE: 1A-72-30

ABSTRACT: A trial test of the Step-Stress Testing of Receiver/Transmitter Units was performed on asample unit (part number-100, MSN 349) on 25 November through 27 November 1991, with additionaltesting on 17 December 1992. The testing was performed to resolve requirements to be included in theR & D Test & Acceptance Plan (CDRL J003-001) being provided under contract F30602-89-D-0100/0009(Subcontract No. DOOO-07 submitted to TIT Research Institute, Rome NY). The information contained in thisENB consists of data generated from the trial test and used in the preparation of Appendix D Trial Step-Stress Test Run; an integral part of the R & D Test & Acceptance Plan.

The contents of this ENB is as follows:

section 1: Text of Appendix D, Trial Step-Stress Test Run

section 2: Thermal Evaluation Test Journalsection 3: Thermal Survey, Data Printouts and PlotsSection 4: Test Data Sheets, Performance Monitoringsection 5: Data Reduction, Tables and Plotssection 6: Unit Modification & Equipment Setup

The following individuals have provided contributions to this ENB and provided technical support in thetrial test effort:

S. D. Mueller, B. J. Armstrong, J. R. Switzer, W. T. Clark.

Additional support with test equpment & faciliti was provided by:

J. J. DeBellis, G. 11 Kwan, D. E. Arter.

ENB Project Distribution:

B. J. Armstrong (EvrnetlEngineer) R. A. Doctor* J. J. DcBeIlis*S. R. Burnett (Reliability Engineer) W. T. Clark G. H. Kwan*D. Huch (Progmm anwger) J. . Switter'- D. E. Arter"L E. James (Project Manar)S. D. Muler (Degp Enge) Abstract only

001

SECTION 1

Text of Appendix DTrial Step-Stress Test Run

written by S. D. Muellerwith the support of B. J. Armstrong

002

IAPPENDIX D. TRIAL STEP-STRESS TEST RUN

1.1 General. This Appendix D is prepared to fulfill the requirements for additiondetails specified within the body of text comprising the R & D Test & Acceptance Plan.The information contained herein is required for performing the Step-Stress test andconstitutes an integral part of the test plan.

1.2 p1. Appendix D completes the specification of test requirements and testprocedures needed for implementation of the Step-Stress test plan. Provided in thisAppendix are specific values requires by the test plan and which were previouslyunknown when drafted. A trial Step-Stress test run was conducted using a sample unitsimilar to those which will undergo the formal testing. Data accumulated andobservations made during the course of the trial test run serve as the basis for alldeterminations and limitations represented herein. The investigation conducted by trialtesting focused upon the following three topics of test implementation and areelaborated upon in subsequent paragraphs of this Appendix:DA) The thermal chamber temperature setting for each step of the Step-Stress test

required to obtain the Step-Stress levels specified for component temperature. Thetemperature differentials and/or tolerances characterizing the thermal chamber,UUT ambient air, and component/compartment air.

B) The contribution to component/compartment air temperature as a result of thesupply voltage stress levels increasing component power dissipation and heatgenerated. Increased confidence of supply voltage Step-Stress levels to accelerateUUT stress and effects upon UUT performance or limitations on design.

C) The criteria and tolerances required to obtain environmental equilibrium of theUUT at each step of the Step-Stress test. The thermal ramp rate and UUT stabilityto achieve dwell at Step-Stress Level. The relationship between chamber/UUTambient air and UUT chassis flange thermocouple readings.

1.3 Trial Test Sample UInit Defined, The trial test sample unit is similar in form, fit andfunction to the seven production (fielded) R/T modules assigned for formal Step-Stresstesting per this test plan. The sample unit, identified as MSN 349, was of a partnumber-100 configuration, which has been superseded through production upgrades,retrofit and stress screening process to the current part number-103 configuration nowfielded. The primary differences between the -100 and -103 configurations of the same

D-1

003

part number, and limitations on test data results within the scope of this Appendix, arelisted below:

A) Design change: The design and processes changes which have evolved since theinitial -100 version to the currently fielded -103 unit are as follows:

All carbon composition resistors (RCR-type) used on the -100 unit were upgraded tometal film resistors (RLR-type) on the current -103 version. The RLR-type resistorsimprove temperature and humidity stability and have greater reliability. This shouldhave no impact on the average temperatures measured within the UUT.

The voltage controlled oscillator (VCO) hybrid on the -100 unit's Synthesizer cardrepresents the greatest variation between the two configurations. The -100 unit'sVCO has agreater operating frequency range than the -103 version hybrid, and wasinitially designed to accommodate a variety of circuit applications. The -103 versionVCO hybrid improves RF operation over a smaller frequency range. Specifiedtemperature extremes and power requirements remain similar between the two partversions, however, the internal layout and assembly processes of each VCO may bedifferent. The LC-circuit elements to the control voltage input of the VCO havep also been changed to accommodate the VCO's configuration.

The -103 unit Synthesizer incorporates a part change for transistor Q9 which wasoverstressed under the -100 version. The -100 employed Q9 was stressed undernormal operating conditions and therefore can represent a worst case condition forthis test. Also, zener diode CR5 was upgraded on the -103 unit to a better-than partto improve ramp discharge. No impact is anticipated upon temperatures measured.

The -100 Detector card lacks the two decibel (2-dB) resistive pi-attenuator at eachsynthesized signal input. These attenuators are included in the -103 design and wererequired to improve RF impedance matching with the next assembly. This absencewas overcome for the -100 trial test run by providing this RF attenuation externally.Heat generated by the resistive attenuators are minute.

Also noteworthy is the variations in custom hybrid packaging found upon visualinspection of either -100 or -103 units. A specific part may have one of three typicalpackages employing hermetic seals by soldering or welding of the cover to theheader. Covers and headers may vary in mass, plating, and surface area. The lowerprofile packages with welded seals are more prevalent on the -103 version unitssince they represent the latest in packaging design. However, all packagingtechniques can be utilized in the current assembly. .

D-2

004

B) Conformal coating: The cards of the -100 are not conformally coated. Thepolyurethane coating applied to -103 units will impede convection of componentheat to the compartment air and therefore the majority of heat transfer will beprimarily conduction to the card's ground plain and chassis. Although this affectsthe process by which heat will be transferred, this should not pose a significantincrease in compartment air temperature and should assist in a more uniformdistribution of heat throughout the compartment.

C) Stress screning: The sample unit (-100) lacks the stress screening for powered andmonitored thermal cycling and unpowered random vibration. The current units(-103 configuration) undergo the stress screening process intended to seek outfailures in parts and workmanship and prove unit reliability. The lack of stressscreening of the -100 used did not impact the trial test as defined in the Scope of thisAppendix.

2. Trial..•stRun. A trial test run utilizing the Step-Stress test plan was conducted upona part number-100 sample unit, MSN 349, on 25 November through 27 November 1991,with additional testing on 17 December 1991. Each of the four days of testing wereconducted by the design engineer and environmental engineer, and concentrated uponthose topics listed in the Scope of paragraph 1.2 above. The objective of the trial testrun was to measure parameters to aid writing of the test plan. An investigativeapproach was used and deviations from the test plan and test profile were required torepeat measurements, or proof concepts. This trial test run was not intended to providedata sufficient for formal validation of the Step-Stress test method or ALT approach.The following paragraphs represent the culmination of the trial test run and the specificvalues affecting test implementation required for this test plan. Justifications areprovided for values derived from the test data, with test data provided as required todemonstrate the concept or result. All raw data including temperature printouts, plots,test data sheets, observations, photographs, drawings, data analyses and notes generatedthrough this trial test run will be collected and filed by the design engineer in anEngineering Notebook.

2.1 Step-Stress Test Requirements. The following establishes requirements forinclusion in the Step-Stress test plan:

2.1.1 Tem rature and Supply ag Sresses. Table D-1 provides the calibratedchamber setting at each Step-Stress level to achieve the required componenttemperature stress. The byproduct of voltage stress has been removed. In addition, theaccuracy of the particular thermal chamber used (HAC ID# H-B07567) has beenp factored in to these established settings. Table D-1 will be used throughout the Step-

D-3

005

chamber identified above. A discussion of technical approach and data analysisfollows.

TABLE D-1: STEP-STRESS LEVEL CHAMBER SETTINGS

STEP COMPONENT CALIBRATEDSTRESS TEMPERATURE CHME

LEVEL STRESS SETTING

0 +70 + 611 +78 + 692 +86 +773 +94 + 854 +102 + 94

5 +110 +102

6 +118 +1117 +126 +119

8 +134 +1279 +142 +135

10 +150 +143

As stated in the Step-Stress test plan paragraph 2.2.1, a distinction was made betweenthe temperature a component sees versus the temperature the UUT sees. The thermalchamber is set to maintain the UUT at a constant temperature for each Step-Stresslevel. The air temperature within the chassis' compartments, which the componentsexperience, will be greater than the air surrounding the UUT, i.e., the temperature towhich the chamber is set. Component temperature has been established as the baselinefor determination of chamber setting.

The effects of increased supply voltage stress upon the UUT were found to be ameasurable contributor to the air temperature through additional component heatdissipation within the chassis' compartments. An effort was required to quantify thethermal effects due to each incremental increases in voltage stress so that a cleardistinction between stress environments (temperature stress or supply voltage stress)could be drawn. In other words, the two stress environments should be maintained asindependent. In determining the component stress level due solely to temperaturestress, the thermal byproduct of voltage stress had to be cancelled out in determining aproper chamber setting.

Figure D-1 shows the locations and identifies the thermocouples affixed to the trial testunit. For this discussion only thermocouples TC2 (chamber's UUT ambient air), TC1(UUT chassis flange), TO (A3 component's compartment air), TC4 (A4 component's

D-4

006

compartment air), and TC5 (A2 component's compartment air) are being addressed.Thermocouples TC3, TC4, and TC5 are suspended above the components at the centerof each compartment to record the ambient air. The remaining nine thermocouplesserved to provide case temperature data which was used to evaluate stability criteria(paragraph 2.12 of this Appendix) and for use in reliability predictions of Appendix E.

The data measured during each stress level dwell are summarized in Table D-2 andTable D-3. Table D-2 covers temperature data for cases where the temperature stresswas changed to various Levels, n, while leaving the voltage stress at a constant nominalvalue (Level 0). Table D-3 applies to those cases where both temperature and voltagestresses were changes to the same stress Levels, n/n. Raw data used in computationsare in the form of computer printouts taken every 4 or 5-minutes from the thermo-couple readings. The plots of the thermocouple readings every 1-minute for each day ofthe trial run are provided by Figure D-2 through Figure D-5.

In Table D-2 and D-3, the average component's compartment air temperature, Tcmp, hasbeen computed by averaging the data points of the suspended compartment thermo-couples (TC3, TC4, and TC5) with the unit at dwell (environmental equilibrium). Tcmpis used to compute the calibrated chamber setting, TSET, required to achieve a desiredcomponent stress level, TcSL, for each incremental step of the Step-Stress profile. Withno voltage stress applied the equation can be simplified (see Table D-2). To adjust theoriginal trial test chamber setting, Tset, to the proper calibrated TSET we need onlydetermine the difference between the measured data, Trap, and the desired stress level,TCSL and add accordingly:

TSET = Tset + (TcsL - Tcmp) for case without voltage stress.

One resultant of the case without voltage stress is the constant that exists for anytemperature level. The difference between the measured UUT ambient airtemperature, Tamb, and the averaged component's compartment temperatures, Tcmp, is aconstant 10.1 OC. Knowing this, we can find the contribution voltage stress has inincreasing the average compartment air temperature. From Table D-3 we discover thatat any stress Level n, where voltage and temperature stresses are at their designatedStep-Stress Test Level per Table 2.3-1, that the heat generated by the components (dueto voltage stress) is 0.6 oC times the stress Level n.

The trial test run on the sample UUT was only conducted through to stress Level 8. Inthe course of Day 4 testing, the unit experienced failure of the A2 Synthesizer (J5) RFpower output at stress Level 6 without voltage stress applied. No noticeable effect uponaverage compartment temperature was observed so testing continued to the end of the

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work day. The calibrated chamber setting for Levels 9 and 10 of Table D-1 wereobtained by extrapolating from a graph of the previously determined values.

2.1.2 Environmental Equilibrium. Environmental equilibrium is achieved when theUUT components have realized the changes due to stepping of the ambient air temp-erature and voltage stresses, and have reached steady-state operation at the new level.Equilibrium has been defined as <-, 2 oC change over a 1-hour period (.•<,_0.5 OC in 15-minutes) for the UUT components. To determine equilibrium, the environmentalengineer monitored thermocouple measurements at the locations depicted in FigureD-1, and recorded their values throughout each test run. Figures D-2 through D-5 showthose thermocouples plotted during the trial test. The remaining thermocouple dataand plots (not shown) are filed in the Engineering Notebook. The engineer utilized thetrial test data in achieving the thermal ramp rate and in determining the stabilizationtime necessary to reach equilibrium prior to beginning of dwell at the new stress level.The resultant of this engineer's effort provides the basis for thermal criteria which willbe used to conduct the Step-Stress testing of the seven production (fielded) R/Tmodules using the designated thermal chamber, HAC ID# H-B07567.

The chamber air temperature, without external control, will inherently ramp at about"3 "C/minute. For a step-stress increase of 8 °C, the effects upon the component'scompartment air was a ramp rate less than the 2 oC/minute criteria specified in the TestPlan. Figure D-6, starting at transition time zero, shows that both UUT chassis flangeand compartment air temperatures lag the chamber air; and are far less than what canbe considered thermal shock per MIL-STD-202 or MIL-STD-810 (air temperature).The condition of <2 oC/minute, as experienced by the components, remained true forboth increasing and decreasing stepped transitions; and could easily accommodatesingle chamber air steps of 24 OC without using the chamber's programmable controller.This allows the test operator to use the chamber manual mode (see paragraph 2.3.1 ofthis Appendix) for decreasing the chamber setting when verification of an anomaly iswarranted per paragraph 2.4.2 of the Step-Stress Test Plan.

As shown in Figure D-6, sufficient time must be afforded to the UUT to undergo thetransition to the next Step-Stress level, and achieve equilibrium. This stabilization timeis based upon the ramp rate and transition step size, and as determined by the thermalchamber and UUT response. The UUT required at least 20-minutes to reach 90%component stability; with 100% component stability obtained within 40 to 60-minutes.In the Step-Stress testing of the seven production (fielded) R/T modules the stresslevels will be controlled at increments of 8 OC (temperature) and 0.2 Vdc/0.3 Vdc (5and 15 supply voltages, respectively) with each transition preceded by the prior step's1-hour dwell. Thirty (30) minutes has therefore, been allotted as sufficient componentstabilization time from the outset of transition to the beginning of the next dwell period.

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2.2 LT Limitations At Test. A limitation on the performance of the UUT wasencountered on the first day of the trial test run. The following documents the eventwhich led to modification of the UUT for subsequent Step-Stress testing.

On Day 1 of the trial test an anomaly occurred with the UUT's Detector card, A4. Atan A4 compartment temperature of + 68 oC the digital output bits railed to theirpositive offset indicating a problem with the -5 volt offset voltage, and subsequently the-15 Vdc line from which it is derived. No short circuits or increase in supply currentswere indicated on the power supply meter. After completing Level 0 and Level 1excursions for the day, the unit was returned to room temperature where the problemhad ceased and Detector operation had returned to normal.

Upon inspection of the UUT, it was noted that the wirewound 2-watt (at + 25 CC)resistor R4 had been extremely hot showing scorch marks on itself, the zener diodeVR1, the printed wiring board, and the tantalum capacitor C4 beside it. In addition, thethermocouple wire for TC8 which was routed above R4 had singed insulation,explaining the overload condition recorded for TC8. TC8 was inspected with no breaksin insulation found, therefore ruling out the possibility that the wires had caused a shortcircuit. TC8 was used for the remainder of the three days of trial testing.

The -5 volts is derived from the -15 Vdc supply line using a series 93.1 ohm powerresistor R4 and 5.1 volt zener diode VR1. The resistor should typically operate at1-watt, or 50% of its capacity. MIL-HDBK-217 Table 5.1.6.4-8 and MIL-R-39007Figure 6 (RWR80-type resistor) indicates that temperatures up to + 150 CC areapplicable for this percentage of rated power. The temperature of R4 & VR1 weremeasured Day 1 with a spare thermocouple inside the chamber with the UUT coverremoved. The chamber air was measured at + 33 OC (TC2). R4 was found to be 35 "Chotter than the chamber air, with VR1 18 OC warmer.

It is possible that with the covered UUT A4 compartment temperature at + 68 CC, thatthe resistor R4 temperature was upwards of + 100 oC, but still within rating. Throughconvection of heat to the surroundings, R4 effectively heated up the adjacent zenerS diode VR1 and thermally causing it to cease normal operation. The scorching ofadjacent surroundings is a supporting observation. On conformally coated A4 Detector

D- 15

017

cards the design engineer has also observed scorching of the conformal coating in directcontact with the power resistor A4 in the past, but has never encountered a failure atspecified operating temperature. The conformal coating may impede the convection ofheat to VR1 and provide heat transfer by conduction to the card's ground plain thusalleviating this thermal shut-down effect as observed in the trial test run.

The trial testing for the remaining three days proceeded with a modification to thesample unit. Resistor R4 and zener diode VR1 were removed entirely from the circuitand an external -5.1 Vdc auxiliary supply was used to provide the necessary regulatedfixed voltage to the circuitry.

On 3 December 1991 this event was discussed at the technical interchange meeting ofthe joint industry/government Process Action Team. Through our discussion acompromise was reached which would allow removal of the "weak link" created bythermal effects of R4 and VR1 which could dominate and obscure the Detectoroperation at increasing Step-Stress levels beyond the UUT'1s maximum operatingspecification. The compromise required that only the R4/VR1 produced output couldbe isolated from the circuit and that it must be monitored across a suitable external loadresistor. This gives a comparable operating environment to R4 and VR1. Thedependent circuitry will then be supplied by an external -5 volt auxiliary supply insubstitution for the R4/VR1 output. The dependent circuitry would be considered asbeing driven by a regulated source allowing the auxiliary supply to be fixed at a constant-5 Vdc throughout the test.

2.2.1 Pretest Conditioning-UUT Modification. Modification of the Detector card'sR4/VR1 circuitry on each UUT prior to test is detailed in the Rework/ModificationPlanning which follows. Prior to applying power to the UUT, the modification shouldbe visually inspected and continuity tested. Provided in paragraph 2.3 of this Appendixare the test setup, test procedure, and supplemental data sheet to be used in associationwith the modification for UUT Step-Stress testing.

2.3 Test Setup & Procedures. The following establishes the requirements for test setupand procedures necessary for utilizing the special test box as shown set up in Figure D-7.The test box allows measurement of supply currents and a supplemental test for theUUT modification as follows:

A) To monitor and then measure the UUT's supply currents at dwell utilize the testpoints provided on the special test box. The test points are connected across eachvoltage supplies 0.1 ohm sense resistor, allowing current to be measured with avoltmeter. The voltage reading taken must be multiplied by 10 (as instructed on thetest box) to convert to the proper milliampere (mA) reading.

D-16018

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B) The load resistor for the R4/VR1 output modification to the UUT (paragraph 2.2of this Appendix) is also provided by this test box. The current requirements of thedependent circuitry was measured on the sample unit using an auxiliary -5.1 Vdcsupply. A 91 ohm load resistor is serving as the load. A Supplemental Step-StressTest Data Sheet is supplied in this Appendix D, and is used to record the R4/VR1voltage across this load at each Step-Stress level test. An auxiliary supply connectedto the test box provides the regulated voltage to the dependent circuitry. Theauxiliary supply is to be fixed at a constant -5.1 Vdc throughout the test.

2.3.1 Chamber Pr rminguide & Profile. Control of the UUrTs thermalenvironment is provided by utilizing the programmable functions of the thermalchamber, Model S-4 with Model 2800 controller. Included in this Appendix is a twopage Chamber Programming Guide and Chamber Program Profile providing theoperating instructions and programs for the chamber.

Program #1 takes the UUT from room temperature up to the starting point for the test,Step-Stress Level 0. The test operator is allowed a maximum of 2-hours at Interval 2 toverify the test setup, voltage stress settings, and assure UUT thermal stabilization priorto proceeding to Program #2 and beginning the Step-Stress testing.

Program #2 is used to conduct the Step-Stress test, establishing the calibrated chambersetting, transition rate, and stabilization/dwell times for each Step-Stress Level for theduration of the test. The program begins with the 1-hour dwell at Level 0 where testingper Test Plan paragraph 2.6 commences. The program continues with a 1-minutetransition Interval to the next Level and is maintained for 1-hour 29-minute at thatLevel. The UUT experiences a <2 OC/minute ramp, shall be allowed 30-minutesstabilization time by the tester, and UUT testing during the remaining 1-hour dwell.Program #2 continues automatically through to Level 10.

Manual mode operation is required for failure verification of an anomaly requiringinterruption of Program #2 to return to the previous Step-Stress Level per Test Planparagraph 2.4.2. Manual mode operating instructions are provided in the ChamberProgramming Guide. If the anomaly cannot be substantiated, the operator selects theProgram #2 Interval of the next Step-Stress level after the Step-Stress level where thenon-confirmed failure originated. The even-numbered Intervals provide thesetransitions using the operating instructions in the Programming Guide.

Program #3 is used to return the UUT to Level 0 for retest upon verification of afailure during the Step-Stress test. Program #3 Interval 3 will return the UUT to roomtemperature as will Program #4.

D-19

021

SUPPLEMENTAL (APPENDIX D)

STEP-STRESS TEST DATA SHEETShwee 1.of1

UUT Serial Number ( s __ Test Date: _ _ _ _ _

Tester. (K-. A £mp be-)

STEP-STRESS Level (s.aws- i)s:

[UUT PERFORMANCE TEST DATA MRPORMANCIEWoNMRmNG

RESISTORPZENER DIODE MODIFICATION At Dwell; For the modified resistor/zener diode subcircuit, record thevoltage across the LOAD RESISTOR at this STEP-SRESS LeveL

Start TEST:

Voltage scrao LOAD RESISTOR: (Vdc) (ra to Ap-mdiZ D -N5 d)

End TEST:(riME IMRMN)

DETAILS: A4 DETECTOR CIRCUITCARD MODIFICATIONFOR AUX. CONSTANT -5 Vdc SU PPLY

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D-20

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EnterPROGRAM NMBR. Press N~i keyfollowing eachvalue entered.

PROGRAM NMBR 1 2 3 4

INITVAL1 (°C) 25 61 133 61

INTERVAL 1 1 1 1FINALVAL (°C) 61 61 61 25INTVLTIME (HR.MN) 0.18 1.0 0.36 0.18AUX - - - -NEXTINT 2 2 2 2

INTERVAL 2 2 2 2FINALVAL (°C) 61 69 61 25INTVLTIME (HR.MN) 20 0.01 3.0 1.0AUX - - - -NEXTINT 3 3 3 3

INTERVAL 3 3 3 3FINALVAL (0Q 25 69 25INTVLTIME (FIR.MN) 0.18 1.29 0.18 Presswokey.AUX - -NEXTINT 4 4 4INTERVAL 4 4 4

FINTVLTIME (HR.N) Pressm key. 0.01 Press TOPkeyAUXNEXTINT 5

INTERVAL 5FINALVAL PC) 77INTVL11ME (HR.MN) 1.29AUXNEXTINT 6

Continue PROGRAM2: Repeat INTERVALs4 and 5 above using VARIABLEs below.INTERVAL 6&7 8&9 10&11 12&13 14&15 16&17 18&19 20&21FINALVAL (oC) 85 94 102 111 119 127 135 143

INTERVAL 22FINALVAL (oc) 61INTVLTIME (HR.MN) 0.40AUXNEXTINT 23

NTERVAL 23FINALVAL (OC) 61INTVLTIME (H RMN) 310AUXNEXTINT 24

INTERVAL 24FINALVAL (0 C) pk ,ITVL'nME (HRMN) 59ik9AUX TEST

1 - keyimnrulpt & holds INTERVAL [=-] key continues program INTERVAL1mesndtemperature.

D-22

024

SECTION 2

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Thermal SurveyData Printouts and Plots

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EXP 61-SCAN e7@--11-2S-!9-S6-2S EXP 91--SCAN 09S--11-25*19-11-26. SXp 91--SCAN 9-12925Therm.al S TerolSuve!Nolr hu.s S'o!r1

ch- 011 22.6 deg-C ch 91 22.1 deg25 ch, 01 22.i degSch. e2 22.2 de2C o~0 23d-~o~0 52dgch- e3 22.4 do-S ch 63 22.3 dogC ch* 02 25.1 de-

91 24dg.Cchi e3 22.4 dogC ch- e4 22.3 deg-cch 91 22.! dog-S -5 2. oCc~9 22dgch- a6 22.1 do.-C ch 65 22.2 dagC ch- L5 22;.3 dog..Cch- 976 22.4 deg_ L97 2.4dg ch- 97 2. dogSCh* 67 22.2 degC as- 69 22.1- degC ch- 99 s22 .7 degScch 99 22.3 de2_C ch 99 22.3 dogC ch. e7 22. 6 deg.C

ch- 19 22.1 dsg.C ch- 16 21. 1 de2.C ch 1A9 23.9 degC* ch .11 22.1 dogS ch- 1 22-.3 dogS ch a1! 22.4 deg Ch12 22.2 deg c-1 22.2 deg2.. ch- 12 23.2 degC-

ch-1 2. !~g c1i 22.3 deg-C c h 13 22.2 dogCfch -1 2 2 2 .4 d e a _c h 1 2 -2 .2. d eo g 5 ch - 1 4 2 2 .5 d eg _C

o hg~ c h - 12 . 2 2 .g 5Ch !4 2. dg.C .1 22.3 dog5C

h.1 32dgCch- IS 24.7 degSC ch' 1S 23.4 deZCN.~ 17 32.7 do- h S 2. de_ ch' LZ z. oe@_C

ch1 30dg h- 17 24.0 de2gS ch- 17 25c.a degCch- 19 23.2 de_ ch- 18 2S.3 deQSP ch- 193 2s.1 dogSC

-Ch IS 25.3 deg5C c- is 25.2 degC

EXP 91--SCAN Q75--11-25-19-ei-26EMP 61-SCAN e99YP-2 .1.62 X 1--SCAN 0-12193:

I M ~ ~ ~ ~ h e r m e-I~~~~ S u v y M e e "ý h r a u v y u l r w T e m l S r v e v !M u e le r 'ch- 91 21.9 dgCc-a -. e- h A1 2. e-ch, e2? . dog..C ch 22.1 dog_C oh9 2.bdgoh- 63 22.1 dog-C v 0~dg 2 25.9 ee;_Cch- 64 22.3 dQ2C ch- 613 22.3 de;gS ch- 03 25.9 degCch-a 22.5 dsg..C ch- 9l 22.5 dagC ch V 27.4 dt2gSe ch-6 05o OS 22 dog c: 5 2: dgC4h- es 22.4 dog..C ch- 967 22.2 de2_5 ch- 67 22.4 deg5Cch V9 22.4 dcg5 ch- 97 22.2 der.C ch- as 22.3 de2gSch- 69 22.1 de~r ch6 24d h- 97 22.6 dogS

ch- 16 2.6dgSs 22.2 degC ch- 19 22.3 deg Ceh- 19 22.2 dorg5 ch- 01 22.4 dsgC c-1 25dch- 12 22.2 dog_5 chl 22.4 dogC ch- 1s 23.5 degCch- 13 22.2 dmg..C ch, 13 22.6 dsajw ch- 13L 22.4 deo-Cch- 142 24dn h 22.22. dogC Ch 14 22.4 desg5ch- 13 22.3 degC c h- 12 22.4 dogS ch, 12 22.5 dn-cch* 16 224. d9og5 ch- 16 24.9 deg_.C ch- 13 25.9 dogS

ch 17 .29.1 do..C ch- 17 24.9 dsg_.C ch- 17 2S.1 dec-Cch- 9 .29.1 djL.C ch- 17 24.9 dsgC ch- 19 'B.1 dog..C

Oh1 31d h- 19 2S.6 dag2C. ch* 12 256S dogC

D ~- AY IQ 13

EXPoi-sc~ 1±--125l35-S XP @!--SCAN !2--151-52 91 I--sAnm !ie--n-z125es2~Therr-al Survey/Mutler" Thermal Suveymie~er he" Surv.ey'!!ueizr-

ch* W1 25.9 deG-.C h, 0W 27.4 deGC ch- e1 26.? dea CCh- 02 24.9 doag-C ch. 02 25.7 deagC -chý e2 2E.0 deg;.Cch - 03 2s.0 deg;Cch 3.3dg -o 270 c.ch- 04 27.4 d3sýC_ -h, LA 1. 2e. de- h l 2. S_-h~ 05e 22.4 deg...C Ch* - so24de- ch- 05 22.5 dogCc- LIS 22.9 decC C 95e 22.2 degC ch- e6 46.3 deg C-4- 97 22.9 deogC oh - 07 Me. de;_C ch V? 27.9 de-.CoW 09e 22.7 degC ch* 09 22.4 degC ch- es 27.5 de2_C

es 0 23.5 degQS oh- e9 22.7 d9oC ch -0A9 22.9 degCA.1 23.3 do2_C oW- 10E 29.1 degC chW 10 2P.4 de;_C

Ch. 11 23.0 deQC c-* 11 22.4 de;_C ch. 1! 22.1 de;_Coh 2 2h- 12 22:e 12- 223 eg 12 22.5 dtgCoW- 13 22.6 dCQC oW13 226 d~ a cIn- 13 224 de;gCch 14 22.7 deQC Ch- 14 22.S degC ch- 14 22.9 degCc-* oW 1 - 22.!. de!;C Ch. 15 22.4 degC oh. is 23.9 deg rch, ! 6 25.1 dog-C Ch. .15 27.e de2C ch. 16 27.2 deg-CoW- 17 26.2 degC ch- 17 27.2 degC ch- 17 27.2 eegCch- le 26.4 degS oW 19h. 27.5 deogC ch. 19 27.E deg CoW- 1s 26 .7 deg5C Ch i9 27.5 degC oh. 1.9 27.9 deg;S

EMP 01--SCAN 11-12142.EYP 01--SCAN 130--11-2E19-ES2e EXP 01--SCAN M -12-01

ch. 01 25.S deg_.C ch. 91 25.5 deg-.C Ch. 91 27.5 degCCh'- 22 25.9 doQgS ch. 02 25.2 deogS ch 0 A2 27.3 de;_

cS~dg h- 03 26.5 deg- P Ch 03 27.4 dogSCV 0 2e.3 de2_C oh. 04 29.4 degC et 04e 29.2 dsgC

ch- O5 22.4 degC Ch. OE 22.2 degC Ch. 2s 32.3 degCCh. es 22.4 dsgC ch. es 22.3 degC ch- 05 42.5 degCCh. 07 31.S deQC ch- 07 2e.1 degC ch 07 27.9 deg_Cch 09 22.4 doo.C chW 00 24.2 degC oW% h 09 2S.5 de;_C

coh. es 22.9 degS oW 09he 22.8 dtgSC o- 09S 22.1 degC* Ch. 1A 22.9 dft;S ch 10L 25.6 deg-C ch- I1L 27.7 de;_C

ch. 11 22.3 darC ch' U 22 .4 lie-. Poh- 11 22 .2 de;_Cch1 29dg h- 12 2. deg A-;C Ih 2 2. e

Ch 3 2.6 dg h. 13 22.5 dW, wh- 13 22.2 deQCch- 14 22.7 dogC ch- 1.3 23.2 degC Ch 14 23.0 dtgjoh. 15 22.6 degS oW- 11 2.2. degC Ch. !1 23.1 degSCCh. IS 226. de2-C oh- is 27.0 dec C ~h . 15 2!.2 de=-^

Ch. 17 26.5 cerC ch 17 27.2 de- P Ch. 17 277. 2 deQCch- 19 26.9 degC Ch. Is 27.5 dez-C oh S 19 ;7.9 dt;-C

zh 19 27.1 degC -h- i9 27.? cgC ch- is 27.9 de

EXP 01--SCAN UP-125942 ep 0--SCAN 13-1-52-12:EYP 01--SCAN !E2--11-25'20-1521maThormal Survey/Muslar" Thermal Survey/mueior Thsrme! SurVoYM'UMI~o*

of 1 2E.4 deg-P. =h 91 277.2 dosg oh- '1 27.! deg.Cch, 02 2S.2 de2_C ch- 02 26.2 degC Ch- 02_ 2S.2 dagCoh- 03 25.5 de2 -C o* 03 27.4 deg ch. 03 25.7 dtgCCh. 04 27.9 do;..C oh- 04 20.7 de2gS~ ch- 94 29.3 dogSCCh. es 22.4 dogS ch- OS 22.2 dqQgS Ch~ *-p -. -- 295 je,,_Ch. 96 22.4 d9QC oh* 05 22.1 dogC ch e6 33.0 degCch- 07 26.! degCý ch- 07 29.3 dogS ch- 07 27.6 deQ.CCh. 00 22.3 degC ch- 09 29.0 deC oh- es 27.7 degCch- 39 22.5 deg.C -h- 0! 22.7 dogSC oh- 09 22.1 dt2gS

C h 10 23.3 de2_C ;h- le 29.5 dogC Ch. le 27.3 dogSoW- 11 22.4 dsO~r ch- 11 22.4 dogC oh- 11 22.3 doGCoh- 12 .22.3 deg_ . oh 12 22.3 deoC ch- 12 22.3 de- rch 13 22.3 dsgC ch LW 3 22.4 dtuC oh- 13 23.9 de2gCch. 14 22.4 degC ch. 14 23.9 d9o-C ch- 14 23.1 dogCch, 1S 22.4 doogS oh, IS 22.6 decC ch. IS 22.9 deQCoh- 16 26.5 deo5r Ch. Is 27.3 deg..C ch. 15 27.0 do;gSch- 17 25.7 d*g..C - Bh--r,--27.S- .eg_.f-- - oh- 17 27.! deOLCoh- 13 26.5 deg...C ch- 1! 27.9 dogC ch- 19 2" S degCch, 19 27.1 dea_.C ch- 19 29.0 degC Ch- 19 27.7 do _C

'~.t, -. I AYPAG

2. 2 O"

!X e-SCANt1S-!222Z EMP e1--SCANj 179--11-25-29-35-76 Exp ei--sc~~is-mz*WThoral Survea-!Muolt' mThermal Survay!Muslar Tg" u~-~Mss

ch 91e 29.3 deg_.C . h, 91 27.1 dsg_.C ch. e1 27.4 dog CCh. 92 28.5 d92_C ch. e2 26.9 deg-C -o'0 55d

* Ch. 93 27. 4 degC Ch. e3 26.7 dog C ch, 93 25.5 deg Cch- 01 2!.! de-C Ek 94 29.6 dogC Ch. 04 27.9 deg.-CCh. as 39.9 dsgC ch, 95 26.3 deg rh9 90d~ch- 06 31.e deQC Ch. 0 2e.9 der.C ch OS 289. decgCch- e7 29.9 degC ch 7 27.9 deg_ Ch. e? 27.6 de:;CCh es 27.9 degC ch- 09 27.7 de;-S oh 9 9 27.4 do- Cch, 0s 22.1 dog_ ah- 9! ME. degC ~ 29dch, 19 27.9 de;_C Ch. I0 27.E dog-C ch- 10 27.3 dgCh* !1 22.4 dagC cO* 11 22.3 deg o W 2. dgch -12 22.3 de2_C Ch 1 22.2 der.C h12 22.0 d r__Cgh* 13 23.9 do._C ch. 13 22.9 deg5C ch -13 22.1 dog-Cch 14 23.1 dgC2 ch. 14 22.9 do- -C ch 14 22.3 d9ZCch, 16 23.4 degC ch. 15 23.? deC Ch- IS 23.9 deg rch' 16 27.3 deoC Ch 15 27.! de-C o-1 78dgCh- 17 27.5 dzg._C ch- 17 27.2 deQC C IS 27.0 eegCch 12 27.9 de2_C Ch Is 2?.? degC ch- ?72.1 dec-Cch 12 29.2 degC ch. is 29.6 do.g3c-V3 2. d-f

ch- 19 27.6 deogC

EMP 01-SCAN ISO--! I- 2S -2e-2E 2S EMP 01--SCAN15-1252-iE E.VP 9--SCiN 1!9--11-25-2e-5Sm Tkg.1 5l Srey!MUoer-n Thermal1 Sy/rvoyueler Therma uvy!uIr

ch, 01 29.5 der.C ch. @1 27.! dog c 9 7. dg

ah- 93 27.5 deg C ch. 03 2. deSch. 93 7. do~

2753 .6 d. o - 0 3 1. de-.- Cli L 29.6 do g5ch V5 29.3 c.-

ch- 95 29.3 deQC oh- 06 29.e deg cSes 3. degCoh- V7 29.0 dog5 Ch! je;. ; ioS0 - 64dch. 09 29.9 degC Ch 09 27.9 dogS oh- 97 34.1 do:Soh- e9 33.7 deogS oh- 99 2M. deg..C ~9 41 dCh. 19L 27.9 do;.C Ch- 19E 27.6 deg r ch 9 9 31.! do;._Cohv 11 22.4 degC Ch- !1 22.4 -ýC o 1 9. d

ch- 11 22.2 derSc h- 12 22.2 doSQ_ oh- 12 22.1 de;_C h1 2.2dgoh- 13 22.9 degC oh- 13 22.7 degC oh- 12 222de-oh- 14 22.9 deg_ c h- 14 23.0 degC c-1 2.2 dog-S

Ch. S 2.e dg-CchIS 2.9 e2_Cch.14 2.3 d8eg5oh-h 15 23.9 dsC h 6 3. dg~h- !S Z! S7. d%- oh - is 272 c 5 4. d

CN* P7 27?.6 d5Q_ ch- 17 2A o-1E 34cgch-~ is 2. e- h 9 2. q_ h- 17 37.1 deQC

oh- 19S 29!. !29egS oh- 19 27. de2_C oh- I9 29.8 d22gS- *h-1S 2.3 og o- 9 2.6do5ch- 19 29.1 deg_5

21:00 TURN ON UUT PWR TO

EXP 91--SCAN 165--11-25-20-31-26 EMP 91--SCAN 199--11-25-20-I5-25 CHECK STATION SETUPThermal Survoy!Muelsr* Thermal Survey!Mueler' Exp 81--SCAN 16-12-10

IThermal Suvy/M4.jg1.'

oh- el 29.5 dcS h. 91 27.7 de- roh- 92 29.4 deC oh 2 27.9 deg_ 1 262dgoh- 93 27.9 de2_C oh- 03 27.3 deoS o0- 92. 74.3 deg Coh- e4 29.2 do;..C oh. e4 29.7 d_ oh- _3 3;a.1 deg_5

ohoa h- e4 31.5 de2_Coh-2 do- c~'~ h- aS 29.4 de-..C oh- 95 31.7 da2gSch- 66 29.4 deg_.C oh- 0s 28.9 do- h s 46dgCch- V7 29.1 d92g5 oh- 97 27.e doo..C ~ 46d~

Ch s oh - V7 40.4 de2_Coh-09 29.1 d*2_.C ch 98 2?.7 dogCh 9 395dgCh- 99 29.9 de._c oh- 69 29.4 de;_C oh- 09 39.! dogCoh- it 27.9 do". c h- I6 27.7 ds2g5 Ch- 19 30.3 degC

oh- 1! 22.3 deg..c oh- 11 22.4 d#2oCgSe 3.3d-oh- 12 22.2 deoC oh- 12 22.2 d*QS oh- 11 21.9 doQ2S

ch*13 227 ogCoh- 1? 21.9 degCoh- 13 22.9 d9UC c h1 27dc h- 13 21.9 dogCoh- 14 23.0 de2_S ch- 14 22.9 d922. oh- 14 22.2 deQ.Coh, 1S 23.4 deg_.C c h- 16 23.1 d2.~C o-1 43d;.oh - 19 2?.! dogSC ch, 16 27.3 d*2.C oh- 1 241.3 dsgC

ch- 17 27.9 dsa_.C ch- 17 27.4 dog..Cch 6 4. ds_

ch- 10 29.1 d9GLC ch- 19 27.7 dog-C oh. I7 3S4.6 de2_Cch. is 21.3 dog..C oh- 19 29.8 do;-C ch- 19 33.6 d*2_5

- . - :.7 . .~~~, o-1 33da

V--: V,.b

. . . . . . . . . . . . . . . . . . .

£1CP 91--SCAN 29-1~5165EXP 91--SCAN 215--11ZE21-2P2±26 EMP @1--SCAN 29-1S154 Thernol Sur-vey!Nuae1r* 4WThorma Survey/muo!er' 4W Thermal Surtvy/u!-oer'

ch. @I 2E.2 deg-C ch' 91. ZS.S deg-.C ch. ei 25.9 dea.Cc h @ 2 24.3 d- -.h e2 24.5 dogC -ch- E2 23.5 de2_C. h 3 3. eCch. 93 32.5 derC ch. 93, 32.? de- rch- 94 34.1 ds2gC eh - 4 35.9 dzgC c h.- 94 3S.9 do:Cch- 65 33.2 do;.C ch. es 35.2 derC ch. LS 34.9 deQCch es 37.6 d9gC ch. es 4e.4 drnC_C ch- es 39.7 de;_Cah* V7 43.3 d*oC ch - 7 16.9 d9QS -_h -7 V.E6 dt2.Cch- e9 42.6 d t ^C ch- e9 46.4 dC2.C ch. @9 46.2 dBsCc 11 -99 43.5 degC ch es 14.4 deQC ch. es 43.9 de-

ch- 19 39.1 dea..C ch. 16 41.9 deg -C ch- le 41.1 degCch I 22.6 deQC ch. 11 21.9 dtC ch 1 22.9 de-Crch 12 22.6 degC ch. 12 21.9 de;_C ch- 12 21.9 ee;_Cch 13 22.e dezC ch- 13 21.9 deg.C ch- 1.3 22.1 de-Cch- 14 22.3 degC ch- 14 22.3 dec;C ch. 14 22.5 degCCh IS 24.1 de2_C_ -. h15I 24.S desgC ch. IS 24.7 de;_C

ch. 1s 44.7 dt;C'. ch. 16 47.8 de;_C ch- 16 47.4 de;_Cch 17 47.6 degC ch- 17 51.6 do- 1 ch- 17 59.6 dagCth- 19 3e.9 de2_C ch* 1 t 42.7 de-C h ell8i 42.3 degC_ch 19 35.6 d62gC ch. c~4. dg h- 193 39.9 degC

OpThermal Surey/Muter' &Tharmsl Survey!M-ieler* 4M Thermal Survey!¶uaeor'

h61 25.9 dzg...C ch. el 25S.3 deGC 0 @1 24.6 d*25cfr 62O 24.6 d9sgC ch- @2 24.2 de;_C ch. e2 23.4 de;_Ccl! 33 32.2 ~g~c ch- 03 31.4 degC ch. @V 41.2 degS

cft 04 31.9 de2_C ch- 94 34.9 deg.C ch 9 4 41!.4 do- rch- 95 34.4 deg C or e5 33.2 de.P ch. OS 41.4 de;-;

ch' es 39.1 deg-C oýh- O6 37.E egc ch. e5 41.9 deg_5

ch- e? 4S. 2 degC ch- 01 42.2 deC ch. 97 Ee.9 do;gC.ch- 99 44.S de2_C -.h- 99e 42.4 de;C ch. @8 59.4 d82-Cch. es 4C -.. S ch. e9 4e.7 deCC c h- es 47.7 dog-Czh- 19 49.1 dog2S ch. 19 39.5 de;gS Ch* A9 5.3 dsgC

c.11 21.9 degS ch- 1! 22.6 deg- C ch- 11 22.1I deQCch 12 21.9 dftQC ch- 12 22.9 de2S ch. 22 22.1 deg -ch 13 21.9 d&QgC ch. 13 22.1 degC ch. 13 22.1 dog-Cch 14 22.3 do-P ch - 14 22.4 degC ch. 14 22.4 de2gS

ch 1S 24.1 deg..C ch- 1S 24.7 dog- ch. is 25.0 degC-h- 16 46.42 d92g5 ch- 1S 42.4 degS ch- 15 52.9 0 :

ch- 1? 4.91 0022- h , 17 E-45. dnoS ch- 17 S5.A de2gSch. 19 49.7 dogC h1 39.7 de;C ch- 19 46.3 dog rch. Is 39.4 do-._ c h. 19 x9.? dogC ch. i9 43.2 dez-C

I__SCN P !-SCANEMP 91--SCAN 240--11-25-21-46.

Thermial Survey/fuelor' Ther.'a' Sur-voy!Mueler* hra ure!ulr

ch @1 26.2 deg..C ch. 91 2E.1 deg_ ch. e1 24.6 deg-C

ch 92 25.9 degC ct, @ 2 23.7 dogSr ch. @2 23.7 da2_Coh- 13 32.7 dc2_C ch- N3 32.5 deogS ch- e3 44.3 degC

cPV @ 4 35.2 der,_C ch 94 35.2 do...C ch- e4 43.9 dug_.Cch. @5 3S.6 dogSC ch- 65 34.4 dsgS ch- e5 43.7 dogC~ch- 06 39.3 degS c- e5, 39.4 dsg_.C ch es 44.1 d8m-Coh* e? 4S.2 dtg..C ch. e7 45.6 de2gS ch, @7 53.2 degCch- @9 4S.7 do_ ch. f2 45.3 dogSC ch- 69 S2.9 dog5.Cch f9 43.6 deg..*C ch- 09 43.0 d*2_.C Ich. 6! 59.1 dog2..ch. 19 46.9 dar_.C ch. 16 46.9 deg.C ch 19 49.7 ds2_Cch 11 21.9 de2_C ch- 11- 22.1 cO h- It 22.A der...Cch. 12 21.9 deg.C ch- 12 22.1 doL.C c h- 12 21.9 doGCch, 13 22.A deGS ch. 13 22.1 der.. h1 22'.e decgch* 14 22.3 dsg..C ch, 14 22.4 dea-.C ch- 14 22.4 deL.Cch- 19 24.6 de2_.C ch 19 2S9. deg..C ch- IS 25.2 dea..Cch* 11 47.1 doe..C ch 19 46.9 de2.C ch- 19 54.4 dog.-Cch- 17 10.5 deG5C ch 17 49.9 dog..C oh- 17 67.2 d9g..C

,h 19 42.1 d9C_.C c ii 16l 41.3 deg-C th 19 49.7 d eu..C

e o-, 3l. de_ .. 19 39.3 dogSC ch 19 454dog_.C

f .

UAY V.4~R4.

F ~ 4 *

Eli-SCAN25-l225 56-AN Np 2S-1-S2-E2 X 1--SCAN 2S-l252Z1i25

W Thermal Surv.oy.'Mumole Thor-Mal Surva./Nuslor" Thorns!1 Survoy!MusIsr"

ch- 91 24.5 dca..C ch* 01 2A.4 dog-C ch* 6. 39.7 dsgC

Col. e2 23.4 degC Ch- 8? 24. do-" Ch- e2 3e0. deg-C

ch- @3 45.7 de2_C ch 93 49. d*'.C 0 3.! d9_C

ch- V4 45.4 eg2- Col. 64 49.0 dogc ch, 64 42.6 dsogC

ch- es 45.2 dog C ch- @5 47.4 degC oh- 65 3S.9 do;C

ch- 66 45.5 d-GS ch- 66 47.9 dog.. ;h- es 42.3 deg-C

+- V7 S4.9 dsoC_ Ch6 h- 67 17.6 decCoh 9 S. a_ h, 69 57.3 deg C ch- e9 49.S deo-V

ch- 69 54.4 :182C ch- 62 54.5 de2.C -h- 69 !.9.i degC

ch* 16 56.3 doeC ch 16 53. deCh- 16 48.5 de;_C

Ch. 11 22.6 deQC Ch 1 22.3 deQC ch- 11 22.5 degC

Ch* 12 21.9 ds-~f ch- 12 22.3 demC ~ 2 2. oC61- 13 22A de-C ch, 13 22.3 d agC Ch- 13 22.7 deg..C

ch- 14 22.3 dtZC ohc42.5d~h- 14 24.3 de-C,

ch- 15 25.! dtg..rC ch, 15 24.1 dogC IS -. 5 3.1 dea_

ch- !19 55.9 deg-C oh, 17 61.4 dogC is 1 53.5 degC

ch- 17 S9.7 degC ch- 19 S3.2 do-ch 19 47.4 degC_

ch- 19 56.4 doQC oh- 19 499h-. o 19 !7.4 dsgC

ch, 19 Me. dog-C c-1 99d2Cc.I 17dg

~ 6~~CA 26~1!2S21556 XP 61--SCAN ?---?2125Eyp 61--SCAN 26-1S25Z

Th~,%ral qu-~yN 4 l,~Thermal Surve,!Nusler" Thermral Surve-;I¶y!Mue-a

Col- 1 244 - - -24.4 4.4;_ cC h- 61 32.9 dag..C

ch. 62 33.6 de;_C ch- e2 23.9 daC ch. 92 393dsC

ch- @3 4E.! de_ oh- 63 49.9 dogC - och - 3 454de-cc-e .5de2_C oh 4 q~ s~ h- 04 41.9 deQ-

oh- 04 45.5 ohr ý- LAS 47.? d*2_r ch- GE 43.3 dec-C

oh- 05 46.2 dg- oh- LAE 4e.5 degC ch. 66 4S.9 deQCch 5 4. h- e7 57.6 dag Cch 7 1. deC

oh- e? 56.6 d.- oh- t9 57.3 d c- ? 1. dsQ _Coh 9 5.7dc h- e9 S5.6 deg-C 0 52.60 deg C

ch. V9 62.! dsgC -c-16 53.6 dec-.C ch 6 66d~

* ch- 16 51.4 dog-C c h- 10 4S.3 dt;gS

ch, m2. da;_C ch,- 22.2 dog5C oh, !1 22.0 degCch 12. 22. ;C_

oh- 12 21.9 dec05 ohý1- 13 22.31 h1 2 de;_5oh 14 21 dsg5 h- 14 22.7 do-5 rh 4 241d-22.1 dog.C och 16 2. d h 15 24.2 deg;C

oh 5 4 3 d s 5o - 16 2 2. 7 d e -_ o h - 1 4 2 4. 1 C eg roh- iS 57.1 dog_ *I 2. e5

oh- IS S9.9 de;_C ch- 17 56.9 dagC ch 17Is2do.

oh- 19 51.6 degC oh- 19 53.9 dog-C ch 19 48.9 dm52-

oh- 19 4S.2 dag-5 ohC95. h- 19 46.3 de;g5-

22:15 SET CHAMBER TO +400 CCH1ECK THERMOCOUPLE SETUP"..

EMP 01--$CAN 2S5--11'2-22~-?1-S EXF 61-SCAN 276-1-!2S 221-5*Z Exp @1--SCAýN 6-15231

4W Themral Survey/Musler 4W Therm-al Survey/Muslar" Thra Survsy!Mueler"

ch- 61 24.5 do...C oh- e1 42.6 dog..C oh- @1 46.1 deg..C

oh- 62 24.2 deC -h o- 02 36. do2_ z 92 ooh- 3 475 d~~C h- 03 43.7 deg_5 oh-0 392d;

ch,13 7. deC h- 4 4.1dtoCoh- 63 q7.9 dsQ5oh- e4 47.4 d*2_C ohc44.1dg h- e4 47.2 deaC

ch- es 3.9. dacCch 5I 47.3 do". ch o4. *2 h- es 4S.4 dep_5

ch 6 47.3 dsgC ch 6 4. h- @6 4e.5 dag_.Cch h- 67 61.3 dt2_C

ch, 67 51.7 do h 99 S9.9 doL ch- 6? 52.5 dag..C

ch- 33 51.5 do"C oh- 69 51.0 degC ch-o S.0 ~ch- 69 93.1 de;._C oh- 09 65.6 dog-..C

ch* 13 52.3 degC ohc65. e.. h- 69 S3.1 deg...C

ch- 11 21.9 d~g..C ohc12.3d~h- 16 512.9 deg_.C

oh- 12 21.3 do,2. cht- 12 22.4 d*2C oh- .12 22.1 dsgCoh- 3 226 d,.Cch- 13 22.4 8ag5. to-~ 22~~

ch, 14 22.4 dog..C ch1 36dg. h- 13 22.3 d*2gSch- 144 23.! deC

Ch' 14 23.1 dooL5 ch 5 2. dg.Ch- 14 23.5 deL.C

Ch* It 57.9 do" h- Is S3.5 dea2 h 5CE e-oh- 11 57.3 do@~ oh 17 54.9 do-.~ h 1 73dg~~~~~~~~h o17 67ds.Co-15 5. e

ch- 13 529.5 deu.C ch- 19 50.3 de...C ch- 19 S75.4 de..C

ch- 13 49.1 isLC ch 3 4.9da. h- 19 4e.1 dog-.C

v . ,'- ... . .

-7. -t: L.-'

4i.~.- .

EXP SI--SCAN 296--11-25-2236-25WThemr!al Survey/flueier*

ch- 91 4e.4 dagCch- 62 39.7 de.g..

oh- 64 '.9. dg.Ca.. 64 '9.6 dog-ch. @5 49.1 dzgCch- @6 49.9 deQCch- 67 S3.1 deQC

oh- eg 55.3 deo..Coh- 99 55.6 da2gSoh- 16 53.1 degCch- 1.1 22.1 d92_Cch. 12ý 22.2 de2-Cch- 13 22.2 dog-ch' 14 73.1 doG5-

C h- 15 23.5 de;_.CCh. is 57.1 derg5ch- 17 59.3 dog..Cch- le 53.1 der._5ch- 19 59.8 dog..C

EMP 91--SCAN 29S--I1I25-22-4!2fi

So Thermal SurvoV!"utier"

ch. e1 40.6 deg.Cch- @2 4.e.2 decgC

ch.3 49.5 0 e gCoh @ 4 49.6 degS-ch. 615 49.6 deg...Coh- @6 56.6 dog..Cch- 67 52.S dog-Cch. 119 65.5 degCch. 69 55.6 dog5rch- 16 53.6 dog-.C. h- 11 22.1 d*2_CCh. 12 22.2 dsgCch- 13 22.3 dog..Coh- 14 23.5 d~oh- I5 24.3 degCgh 16 56.9 dsg..C_oh- 17 55.9 dog_5

oh. 19 54.6 de;...Coh- 19 61.7 dog..C

START TRIAL TEST PAGE 7 (DAY 1)

Lo. I.

:4 AI PAGE 6OFI'3,

S~08V

- - - - - - - - - - - - - - - -- O9S•

06E

09E

-- OEE

z 1, 1 Pom

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w- dflni1 iiS 0L DIIIInon (n 03MMOd08

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oo I- - -" - - - 0

E3 -6P - - - - - - 0

DAY 1: PAGE 6A OF 13

04

DAY 1; 11-25-91 to 11-26-91STEP-STRESS TRIAL TEST EXP SI--SCAN eze-~-I126-238e9. EXP 81--SCAN 835-11-2S-23-244s

22:50 START PLOT; +40 0C; UUT OFF 4 Therm~al Survey!IMueer' 4WTher!al Su-vey/m.-glar,

EXP Si--SCAN 6eS--11-2522-544S ch- 61 4O.1 dt2C ch- e1 35.9 de;_cThermal Survey/Muslor" ch- 6? 39.9 de2_C ch. e2 39.9 dog-C

0Ch. 83 49.3 de2_C c* N3 36.1 de;_Ce1 39.6 d*2_C Ch. 84 40.4 de2_C ch. 84 35.3 degC

W~.6 95d h. OE 48.? dseC ch- 86 33.6 do;C

ch- 83 41.4 d*2_C Ch. es 48.3 de2_C ch- 86 34.5 deCch~84 1.7do ~ch'767 48.4 d*2 ~8 34. d C

ch- 04 41.3 de_ 4_4 uC ch 0-7 3A4. degCch- 25 41.7 doQC ch 69 48.4 de2_C ch~ 89 3..d

c-9 417deogC ch- 16 48. 4 do; C ch- 18 33.4 de2_Cch- 67 41.7 derC _h 1 2. eC ch. 11 22.3 doCch- 89 42.1 deoC ch- 12 11dQcc-1 22.3 degC -

ch- 619 42.2 dagiiC c'I ._ h z 2. ech. is 42.e do-r ch- 13 22.4 de2_C ch* 13 22.3 de;_C

ch 1 2. eo h- 14 23.9 dergC c* !14 2!.3 de2_Cch- 12 22.2 de;SC Ch. IS 23.5 de22c 24.2 de

chch 12 22.3 dsdek Q_2. dCCh. 13 22.3 d2-c 7 4. dogC C ch 15S 36.1 deg Cch- 14 23.S deQC th- 17 48. dogC ch- 17 35.0 de^ Cch- IS 22.9 dog-C Ch. is 48.5 dogCh-1 34.7 de2-cch- 19 41.7 degC chh 1I4.5S~~1 33.9 da;C.ch, 17 41.S der_.C 0ch- 19 42.2 de;_.C 23:25; +40 C; TURN UUT PWR ONch- 19 42.3 dog-.C (SETUP CAL COMPLETE)

EXP 81--SCAN 822--1-2S-231j445 BEGIN TO SAMPLE TEMP.JW Thermal Survey'/Mueler' EMP 61--SCAN 8G-1S~A

sxp 81--SCAN88-1225 ch~ 61e 35.4 do- r ch- 81 A9.2 dec-CThermal Survey!Mu.ol e 2 3. der.C ch. 82 48.6 deQCwh e3 37.9 deg-C ch 03 3. e

~ 48. dogSch 6 4 35.3 de2-C Ih-3---------ch e 4. 65- 37. I g ch- e! 4e.5 de2_C

ch. e2 48.3 deg-C ch- 86 37.1 de2_C ch. 86 48.8 dezgc

ch- e3 48.9 decg5 ch- 87 37.9 deg.- ch. e7 4S.9 degCch- 84 41.8 de- ch. es 39.4 dsgC ch 89 47.4 degCch- 85 4e.9 deg5 . ch- 89 39.7 deg5 h-e 43.9 de.%Cch 76 41.9 degC ch I1L 39.6 degC ch I A 3. e_

67 4. oCcv11 23.1 deogSh .11 222de-89 41!.? deg2SC.1 2. s69. 4s1.2 do;._C ch. 13 23.1 de2_C ch, 12 22. de4*

ch 18 41.1 de2_C ch 13 23.1 do-r Ch. 13 22.4 degCch- 11 22.6 dosSh14C ch- 14 25.0 dogSCch. 1?2 2,2A deggS ch. 15 23.5 degSCC.I ?. ech- 13 22.4 d*2g.C c 1h 39.9 de;-C I N 16 39.1 deg C~ 14 ch- 17 39.9 dog-C ch1 3.1dgch 4 24.3 d*2_C ~ 9 3. Sch- !9 43.8 dez r

ch- 15 24.5 doogS

ch. Is 41.6 degg.C ch 19 39.5 do..C Ch. 19 41.3 deQSch- 17 41.6 dog..Cch 19 41.2 dog5Coh- 19 41.3 dog_.C

EY.P 61--SCAN 938--11-2S2319-4E CUP e1--SCAN eq45-!-12S53_3i4S44W Thermal Survfly!MueO1O" Thermal1 Survey!Mueler-

EXP SI--SCAN 915--11-2523-e445 ch. 61 35.3 dogS_ ch 61 43.2 dogSrThermal Survey/flugel" ch- 62 32.1 de2_C ch- 6? 48.9 deQCWch, e3 35.4 dogSý ch- 63 41.4 degS

6h 1 46.6 deg-C Ch- 4 33.2 d.gC th 84 44.2 degCch- 92 39.9 degC ch- @5 33.1 dosSC ch. 85 45.2 dog rch 63 46.5 dogC ch- 66eo S 44.? dogSC

uh 4 4.6do h- 87 34.5 de2_C ch -87 59.7 dsgCch, IS 46.3 dtgS ch- 09 35.2 do.._C t h, 9e S1.1 decLCch Is 49.S ds_ ch Is 6. d2 ch. 69 58.4 deg..Cch, 97 48.6 djL.C th- 11 39.1 de2_.C th. it 43.5 dcg..Cch.* ee 46.7 d*g..C ch- 12 22.S dec_.C th 11 22.2 dog -ch- 39 40.7 d*C,* 1? 225 og 12 22.3 dogSc

:%~ ~* 4.7 dUOSch- 13 22.6 deo hr1 2. dgc% If 4.6 de%.C ch-14 25.9 dogLCc 3 2. s2

12IL 22.2 d..c.C ch IS 23.3 degC th IS .2S.1 dog_.Cch-1 22.3 d*GC ch- 16 36.4 d92...C ch- 16 442S. doa2..oh. 13 22.3 deg_.C ch- 17 36.2 dogC ch 17 4739 dog5Ch,14 24.3 dog..C oh 19m3'fjjo~ 8 4 ~..

15 23.6 dogC F1 ch 1 4562 d*2_Cis 4639 d~oS LC".

oh- 17 4.6£ d~g..C .

t h - I t 4 6 37 d t g _ C 4 ... - .. ~~.... Is.... eL

~ 4A:V !:DA

'' ,p --~r I.46

SX 91-SCN SS-1-2-2-5-4 EP l--SCAN 9-l20 94EYP-61--SCAN-t959--1L-25-23-39'S Therm--Sal 6Sur--112523-5 45 hrm Susr oy/!ouele

oh 61 e ma Surveydo us.. ch .01 45.9 degc- ch- 0 1 4E.1 d e;-.Cc h -0 24 .1~o 44 13.9g d e _ C h - 0 ? 4 0 .3 d .- p

ch- 03 51.9 de-@oh0 5. dg

0 3 47.5 dor-C ch- ei 49.7 dt;_C el 49.S deu-C

oh 6 49.8 d22_C z 1. 5 2.! deg r h- 05 S!. a ; C~h 0 4 . d g - 1ch - OE 49.9 dt;-Se ch es 46.4 dug5O ch- 07 Mse de L ch- 07 5,7.1 dogSrch- 6? 53.9 dogSC ch- ~ 09 59.3 dogSh-13 SLach- 09 55.0 dog-C ch- 09 57.9 de ch- 09 57.9 d~-ch- 69 54.1 degC ch- 16 55.3 dogr ch- 16 55.6 de;_5

Oh-10 505 o~ ~ 1 2.1 doSch- 11 21.7 de;-Cch s S. gch 11 22.3 de.-c-o2 21edeSch- 11 22.4 degC ch- 12 22.2 d*-C ch- 12 21.'A deg- fch- 13 22.9 der-C Ch 13 22.4 degS o 13 22 .3 dogSCch 3 229dQ. h 14 27.5 de._C~o 4 70dg

ch- !5 2?4 de_1 ch- 1S 23.3 de;gC ch- 15 23.2 degSCch s 2. eo h- is M9. deg5 Ch. 15 59.7 de-C

ch 15 54.7 d9QC ch- 17 52.1 de ch- 17 52.3 dA.-

chý 17 57.7 dogC Ch 19I 54.3 de- ch- 19 54.4 dtgCCh 19I 583.5 decC ch- 19 53.0 do- ch- 19 53.1 dogSCch- 19 49.2 degSC

EXP e1--SCAN e79--11.2S2359~o 4C EV0 01--SCAN 9 -128 4SEVP 01--SCA eSS--11-25-2314445i 4W Thermal Survwymueer. 4 Thernl Survey/Mueer'

01ona 45.!oh-0 5 ch 01e 45.9 de.gS ch- 02 40.5 de;gc

ch- 02 41.1 degC ch- 92 41.5 de.gC ch- 03 52.1 deg-Cch- 93 41.1 deZS ch- 03 E52.2 de-Cch 3 21 eS

ch 3 57. oo h- 834 49.9 doQ._C ch- e4 49.5 deg-Cch- 04 49.3 dec- ch- 05 52.3 de_ ch- OS 51.9 dec pch- e5 Se. decC ch- 05 49.3 d9- ch- OE 49.9 de.gS

ch- LAS 47.7 dogC ch- 07 S7.2 deQCh07 5,ch- 67 5.1 dogC ch- 09 59.4 de2gS ch- 09 59.3 de2gS

ch- 69 S7.2 d*Q_.C oh.' 09 58.2 dogC ch- L E7.9 de-Ch.' 10 55.6 de;C ch- 10 55.7 de;gS10 i 53.4 deQg ck L11 22.2 d o 1 217 og

!1 22.2 do5 ch 12 223c h- 12 21.9 de;gS12 22. 22.ogS_

o.h- 13 22.9" dogSC ch. 13 22ý.7 de-gC ch- 13 22.3 deG-Sch,- 14 25.8 dogS ch- 14 27;.5 d..p ch- 14 25.3 deg-C

ch 4 -5. eo h- 15 24.3 ds._ c h-' is 22.9 devSch- 15 24.1 do,... ch- 15 59.9 doc c h-' 15 S9.7 dep..C

ch- 15 57.7 de2_C ch- 17 52.4 d egP ch- 17 52.3 dec-C

ch- 19 52e.5I dogS- ch- 19 54.5 derC ch- 19 --4.3 - e; foh- 19 51.2 dogC ch- 19 53.3 degSC ch- 19 53.0 dogS~

START DATA AVG EXP 01--SCAN 27S 11 2--e9415!4 M Th rm l S rv y/ ue orEMP 01--SCAN *60-11-25-23-49-45 EX? oma @1-SAN rv-1!2500045Musla ure'/uoo

OW Thtrmol Surv*YlNu&!9o' I,.~u ch- el 4.1 eIQrCh- 611 46.2 dez5 ch- e1 46.1 dogSCch- 61 46.5 d....C ch- 62 46.5 degCh 2 409dg.

oh- 62 41.4 de2gC ch- 63 52.2 d*2_C oh- e3 52.6 dog...oh- 63 51.3 deaf -ch- e4 -49.5- de2gS ch- 64 49.4 degSCch- @4 49.1 dsg_.C ch- 05 S2.1 dog..C c h- e5 51.9 deg-ch- f5 51.5 deg..C C h- 66 49.1 deg_.C ch- 62-. dg.Cch- H6 46.6 d92..C ch- 6? 57.2 deg_.C ch- 67 57.6 dog...Coh- 67 56.2 do...C ch 9 5.4dg h- 098 59.2 deg..C

ch so 59.4 dou-ch- to 57.2 dog-.C ch- 69 59.1 dor..C oh- 69 57.9 dog-Sch- 16 54.7 de2g5 ch 9 5 7dg h- 16 55.5 dog-.Cch- it 22.1 do-C roh- 11 21.9 deo-Cch- 11 21.9 dog..C oh - 12 22.1 ds;_C ch- 12 21.9 dea-rCch- 12 21.9 doo-C oh' 13 22.6 d*2_C oh- 13 22.4 deg-ch- 13 22.6 dtg...C ch- 14 27.3 dog-C c h- 14 26.3 dsg..Cch- 14 27.1 8mg..C oh- 15 23.2 doogSh I 29 o-ch-IS~j 24.2 deg..C oh s 5. *_ h- 16 22.9 dea-.C

ch- 17 52.4 dog..C oh- 17 642. deg..C,t-17 61.5 deCC oh- 19 545S deg.C ch- 19 54.2 d*2.C19 6 3 .6 dto-.C oh53 .2 d*2-C oh O5 6 d g

40 -

EMP Si--SCAN * -l150 4 EXP 01--SCAN I10--1125E00-39-I EMP 0i--SCAN 125--1115S00 P-!EIýThormal Suvf/MOr ~ Thermal Suveym~uelert JWThermal Survey/mueIer-

ch- 01 !6.*9 deg.C ch- el 57.3 da- P. ch- 01 E3.1 dog Cch- 02 40.5 d a-C oh- 0? 57.9 de::C ch- e2 59.0 do--C

e3 51.9 dzQC c h 0 3 51.2 8e;_C ch- e3 59.7 de;-C94 49.3 de2_C ch- 04 S9.7 de;C ch- 04 56.5 deQCec'* 0 S1.7 dog-C ch- e5 59.5 deg -C ch- O5 59.2 dagC

ch- 06 i9.7 deaC ch- 05 59.3 deQC ch- 05 65.9 deg-Cch- 07 E56.9 do- C ck 0,7 55.8 degC ch- 07 75.5 deZCch- e9 59.! dg-C ch- 99 overload de;_C ch. 09 Dyrvid1 *i;_ch- 09 57.7 degC ch- e9 53.5 de;.C ch- 09 73.5 de_oh- le 55.4 doz-C ch- 10K 53.3 deQC ch' le 72.5 de2gCch- 11 21.7 deQC ch- 11 21.5 deQC ch- 11 23.9 deg-Cch- 12 21.9 deC ch- 12 21.7 de2_C ch- 12 21.0 degCch- 13 22.3 de2_C ch- 13 22.1 degC ch 13 25.3 degCch- 1A 25.7 degC ch- 14 2S.5 degC ch- 14 2e.4 de;_Cch- 15 23.S de--C- ch- IS 22.9 dc;_C ch- 1S 24.1 de-.Cch- Is 59.6 de2_C ch- 16 58.4 deg -C c h 15E 77.0 dee;Cch- 17 52.2 degC ch- 17 71.2 de2-C ch- 17 79.7 de;Cch- I9 54.1 degC ch- 19 52.9 de;_C ch- 1s 71. d -- Cch- 19 52.2 degC 'h- is 59.9 dsgC ch- 19 SSA de_

END DATA AVG.

EMP 01--SCAN 1 -- 25095EMP 01--SCAN IS1!504 EMP 01--SCAN 130--11S-250594SSThra Surve1 Nfua!o* IM Thra Survty/Mueler" If Thrmal Su- - .1ML..-r

ch- @1 4S.9 degU c h- a! 50.7 dag-C ch- 01 E3.9 de;Cch- 02 39.9 dem.C ch- e2 S9.1 de;_C ch- 02 59.2 deQ-cch e3 51.9 dog-C ch- e3 S5.5 deg-C ch- 03 7e.5 degCch- 04 IS.! de;-C ch- V~ 5.9 deg-C ch- LA4 57.3ý de;-Cch es 51.7 eeg-C ch- OS 54.1 deg 0 ch- 05 5 9.0 degCch- 05 49.7 de2gC ch- OS 52.2 deCch- 05 5.5dCch 07 55.9 de;g3 ch- 07 70.9 de C ch- V7 75.7 de.gCch- 0S 59.2 de2_C ch e9 cverlead de;_.C ch- 09 Zveroad deogSch- 09 57.7 de2_C ch- LAS ME. degC ch- es 74.5 de;_.C-h-0 5.4 dg ch- 10 59.2 de;_C ch- 1e 73.S degC

11 2.9 do.2C .h I 22.3 ds;gC c ,1 23.9 de;_C1 220deg.C ch, 12 22.3 ds;-C ch- 12 21.0 de;gC

ch- 13 22.4 dt2g3 ch 13 22.5 deg ch- 13 25.0 deg-Cch -14 25.! dtegC ch- !14 25.5 de-C ch- 14 27.9 de;_Lch- IS 23.5 degC oh- 1.5 23.3 deg5 Ch- 15 24.1 deQCch .15 S9.5 deg3r- ch. IS 7:. 3 ch--"E 7.1--_

ch- 17 52.2 d!c;_C ch- 17 7S.? de;C ch- 17 Be.5 d e _r

ch- 19 54.1 dtg a ch- 19 57.5 de ch- 19 72.9 de;_Coh- 1.9 52.9 dezg5 ch- 19 S4.9 d~gC ch 19 70.3 deg._C

START DATA AVG.EXP 01--SCAN 105--11-2S-e-34-!S EXP 01--SCAN 1-126S495 01--SCAN 3 -!20 45

w Thermal Survey/Musle?, 4 Thermal Survey!Mueler* Thermal Survey/Muslar"

ch- 01 50.1 dog..C -_h 01e 62.S degC ch LAI 54.3 deg-5ch0 2.6 d:2_C ch- e2 S9.8 *_ ch. 02 59.3 dogSC

ch- @3 53.9 d a-C oh -03 69.2 de;5 -oh- V3 71.! deZCch- @4 51.7 dog oh- e4 SS.2 deQ..C ch- 84 E7.9 d2g..Cch- IS 52.9 de2gSr ch- 05 66.9 d*2_C ch 05 5s9.5 d922-ch IS 51.5 d92_.C ch- IS 64.6 deg_... *h IS 6. d.

ch- 07 59.2 de2_C ch- 0? 74.8 de- r ch- 07 77.2 de2_Cch- 09 overload d@2..c LOOSE TC? oh- 09 overload d.QC ch- IS overload dogSch 09 59.1 decC ch. I9 71.8 de2. c-h LAS 75.1 de-oh- 10 66.8 dGL.C ch- 10 70.9 de2..C ch- Is 74.1 deg_.Cch- 11 21.6 d*GL.C ch- 11 23.9 da:_C oh- 11 23.3 do- rch 12 21.7 dogSC ch- 12 24.1 decS oh- 12 23.9 de2gSch 13 22.3 dea_5 oh- 13 25.5 deoC ch- 13 2S.9 decgSch- 14 29.4 de...C ch- 14 29.1 do...C ch- 14 25.9 deg..Cch 16 22.7 dac..C ch- 1S 24.e deg-.C ch- 1S 24.3 doogS

c-11 61.0 d*2_rf ch 16 7S.4 doa..C oh- 16 79.6 d*o.Ce 17 63*4 dea-.C ch- 17 72.1 doL.CC ch- 17 91.0 do -Ch. is 50S dOG.C ch- 19 70.4 dog..C ch- 19 73.4 d*2-Ch-19 63.6 d...C ch- 19 67.8 dtgC ch- 19 7038 dogfC

C -C

E'P 1-SCN S--12EM44P 01--SCAN 7-il2-J eIEXP SI-SCAN 140--II-2660109-4S X l5CNTemlSre!ulIf Thermal Survsy/Mws1.t* Thermal SuvyMulr ft ra uve'M1r

ch-~~c 01 1 1Sde_ f- l P. e_

ch. 91 64.5 dag-C -h0-A5 o. h- 02 59. 3 deg-Cch- e2 59.3 deg-C :.02 E9.3 degC ch 03 71.5 degC

0C 13d Ch. 0V 71.4 deg -1,h -04 58.3 de;_C

e4 69.6 dagC S1 0 4 57.6 deg ch- 05S 59.9 degCch e S9. de7.4 _~C

ch- 9S E9. do- 55. d2hC 07 E7. deach.e 67.2 de;-C ch 07 73.9 degC ch. 07 77.9~ de- r

C.V 77.5 de2_C ch O overoa deQC ch- 09 7ve .7a de- P

ch. es over-load da;_C ch- 0? 7S.7 82;_C c. es 74.7 de;_Cch- 09 75.4 ds2_C ch 10 74.7 ~C~ 1 2. de;_C

It~ 712. eC . 1 2.3 dagC ch- 12 23.5 deg.ch- 12 24.0 d92ch 12 23.7 de gC' ch1 4. eC

Ch. 13 25.! de;C ch- 14 25.5 deg-Cch 13 24.e da2_C ;h" 12 25.7 de.-C -_ h 1 21.7 degC

ch - 14 27.0 dt;-C * ii 24.5 d_ ch- 15 739. degCch. IS 24.1 da;SC ch. 15 79.! d2QC -h !7 891. de;_Cch 15 78 .9 degC r h E 7. e_ h 17 91.4 ýS

ch 17 91. 19 3.8dCch- 19 91.3 deg C ch a87. eC1 71.4 A.-

ch 8 73.5 de_ .i 9SdgC ch- 19 59.5 de;CC

c 1! 7. eC01:25 LEVEL 0; TURN A4 PWR OFF 01:40 RAP OLEVEL 1; +68 C

AT CONNECTOR; DETECTORS (+78 C COMPONENT AVG.)ARE RAILED TOWARDS +5V E 1-SCNEMP 01--SCAN I0-1519A

ThP 0--S2 ure/iN!~ Thermal Survey!Mus1!r* hra re!ulr

=h0 5. ch. 01 57.0 deg rch. el2 54.4 degP ACch- 61 S4.5 do; C c-e 93dt- h 2 E.

ch 02 S9.2 de ch- 02 71.3 de2_C ch- 03 72.8 de;_C

ch- LA4 S9.2 de r ch 015 57.7 de;_C ch -7. e~

ch- LAS E9.9 -d- r -.6 59 59.1 de-

ch. 96 57.3 deg Ch 07 57.0 e-C ch 07 79.S degCch- 07 77.8 de-C ch. e7 75.loa deC c-. 089 ver-12ad dtQ_ch- 089 ovesrload de-C 0h 09 7S1- e ch. 09 75.1 deg Cch- es 7S.5 degC ch. 743 _C Ch- 1LA 75.3 deg C

ie 74.5 de;-C 12 ?43 de_ ch. 227Ie.

d:~C .h I2 23.3 - c 1 251 e;c !13 25.4 deQC -ch 13 2-.- 23eE;CZ

ch 1 258 d;C h- 14 25 .9 de.-C h1 252d;

ch- 153 79.1 degC ch 13 7S.0 ee_ ch 15 -9. - --~ 7 914da h- 17 81.2 dezC _S172. da;_C

ch. 19 73.8 de;_C h18 732.1 e C ch. 18 74.8 de;_Cch, 19 71.3 deC 1 7. de2_C ch 19 72.1 :e;_S

ch. 19 74.6 degC ch. 01 64.6 dea.C c1 019 72.6 degC

ch- 62 7!.3 62Q_ TU.N A4g PhR BA3 75.N

71 9 6.6 de2..C ch- 64 69.1 de92.c *_ch. 64 69.3 de;..C ch- e3 69.4 dtg._C ch- e3 7S3. deg.C

ch- 67 77.9 do-.. ch- 67 77.6 de8..C ch- 67 90.9 degCCh 59 ove .3a d ae -C ch 69 69.loa de gC ch -69 73.loa As - "ch 69 75.5 decCC ch 69 79.6 deQ3

Or~ 66 75.7 de.C Ch 16e 674.3 d22 C ch- 16 79.6 d-LCc. *17 74.7 dtg...C ch- 99 23.2oa de:_.C c h- so ov 3.5a d9_Cch g over23.1 dtZC ch 12 23.5 dtQ2C ch- 12 24.6 degCco 19 23.7 de2_.C ch 13 24.9 de2oC ch- 13 75.1 deCch 13e 26.2 d*2.C ch- 14 26.1 dagC ch. 14 25.7 de,-Cch* 1 2. 9- h 2 2. di_ ch- 12 24.9 de-.C

c-12 23.7 dsg_.C Ch. 13 24.1 de...C ch- 13 92.7 de.GCgh- 13 24.2 d~g.C ch. 16 79.6 dt:_.C ch. 17 95.1 decC

ch. 79.2 IS.. 24. id 1. de.17 91.5 d*;.C ch. 16 73.7 de22..Cc~1 73d.

73 I 2.! dea.C chv 15 71.2 daig.C ch IS 72.7 de2_C

12 71.4 dea_.C ~.... EN....A-G*...:

~ ¾ T~t~1f~JIA.

EXP SI--SCAN Ev-!15"54 01e--SCAN 2e@9.I1265._09 !S EMP Si--SCAN 21S-126-02 2115IwTher'ma1 Survey/!.ueler* Thema Surv.ey/Mueier'4 Thermal Sur'.'.y!Muejer

Ch- 61 78.8 dog-C ch '*21dQCC. 01 72.5 ,4e

ch- 62 55.7 dm;... Ch- -1 72.1 ded e_;1. deg c7 h- 02 E7.1 dog-C ch2- SI

__k. 0h 3 79.0 do; 0h r0H 3 79.4A~84 73.9 de2.C e. 9 7B.7 deg- Ch- el 75.1 deg

65 75.3 deoC ch6 73d h- eS 77.7 degCch-es 73. dQCch- O 7.9 tgC h- e7 75.: de;-C

ch- e7 92.e de;C-r ch 07 9S.1 deQC ch 90 oeS. ,'d e;_Cch- 99 over1oad d~gC ch- O9 cv.erced deQ-C ch- Oe 93.5-a de;Cch- 89 99.5 deoC h-. 89 9.(AG h 8 8.7~

ch± 3. Ch- 11 22.9 de;_S .h .2 23.4 deQ-cch- 12 24.! de;C -ch- 10 2359C~ 3 24.3 deg~

h- I13 25.0.d2C eh_3 24.oh 4.2. eC.'1 25.3 deeC Ch. 14 22.5 de;Cch. 15 41d2Cc-1 23.9 deQC ch, 12 23.7 degC

ch- 14 26.7 degC '1 23.5 A7 ch- 15 97.S de2_C

ch- 17 9E.9 de-C c-~ 17 95.5 degS- ch- 17 e9.2 degCch- 19 79.80 dsQC ch- 19 91.2 deQC ch- !9 91.5 de;_Cch- IS 76.5 d5e.C Ck* 19 79.7 de2_C ch- 19 '79.2 dez-c

EMP 01--SCAN 9-1250S4 EXP 61--SCAN 2e5--1125-02!4-45 EMP 01--SCAN 220T-11-E0 .~2S.A0

ch- 81 71.S d5QC Ch- 61 72.4 dag-C ch- 01 72.S degCch- 02 E5.9 a- C 61. 0' S7.1 O!C ch- LA 2 57.! de;_C

ch- 03 78.6 de;_C ch. 03 79.2 de_ ch- 03 79.S ee;_C:h. 04 1 ?^deh- 94 7E.0 de;_C ch -04 75.1 ,ýeg_ch- eS 75.3 degC OS 77Ede_ ch- e5 77.9 ds;_Cch- OE 74.e deg-C ch- LAE 7S.1 deg

-h- e? 93.9 degC .7.1d;.C-ch - 07 eS.7 degCch- 69 overicad deQC c-~ 07 95.4c dezC Ch 'A9 over! Dad deg_.C

ch s 9. s2 h- 08 9 93.3a degC p/h 2 ?7Edg

ch- 10 91.1 degC ch- 10s 92. A de -oh - 10 LA 2.7 de...C

!2. 23.S 7;;_ 71 Ad. A- r. ~ 2.

oh'~~~h 14 2. 12 .1

Ch-.1 _S2dQCC-I '7.0 ch- 14 2S.0 de;_Cch- 1S 24.1 de2c c. s ' '~ h- 15 24.0 de;_C

."." ~h 7--------- -- ch-~h 17 e90g7d.-1 S .2 e-(ch- IS. 1 aoC-11

o 19 9. d;Sh- 19 9l1. de;-C ch' I9 91.7 d QCch- 1e 77.5 deQC ch- 19 79.0 ds2C ch- !9 72.3 deD-C

START DATA AVG.EMP 61--SCANM 19--16'2044 Ee 61-CAN z~-1's:±'5EXP 01--SCAN 22S--lI'2E-02-3!4S

ft Thorns! Survoy!M.ue.1 q * Thermal Surey'/Muuler" M Thermal Survey'!Musere

ch- 61 71.9 detL ch- ill 72.5 degC ch- e1 72.5 degCch- 62 66.9 degC ch , 57.1 ds_ ch' e2 E7.! degCch- 63 7e.7 degC ch- e3 79.i de2C ch- 933 79.5 dog -ch- 84 75.4 dagC ch- 84 75.-0 de2-C ch- 94 7S.2 de2-Cch- OS 79.9 deL.C h-~ 65 77.7 dog..C ch- LAS 77.9 deg-Coh- 65 74.5 dgC ch- is 75.1 de~jC oh- 95 75.3 degCch- 67 94.7 de2_C ch 7 9. e.. h- 67 95.7 de2_Coh- 69 overload de%_C ch 89 oeElo dogC ch- 69 overl~ad da2_Cch. 99 92.5 d922. h- 169 93.4ea dt2...C ch 89 93.6 de;,_Cch* 16 61.9 ds2_C ch 16 92.E do2-C ch- Is 92.7 de2gSch- 11 22.7 d*2_C ch 11 22.5 dogC ch- 11 22.5 deugCch 12 23.3 d2a.C ch- 12 23.2 deQC ch' 12 23.1 degCch- 13 24.S degC ch' 13 24.4 de;SC ch- 13 24.1 de; -

oh- 14 24.! d a g_ ch- 14 25.1 des-.. ch 14 M4. dO2.-C

ch- 1S 24.3 degC c h- 15 23.5 dtgC c h' 15 . 23.4 dea..Cch- 15 2S.2 dog_.C ch 1 9.9. der_.C oh'6'S- 97A6 d9L_

ch- 17 99.4 de...C ch' 17 90.1 deag.C ch- 17 99.3 deg.r-h.I 19 9e.9 dug.C ch, 19 91.5 dt;_.C c h- 19 91.7 de- '~

i"s1 73.3 d eg._C o.h. 1! 79.1 deg..C ch- 19 70 3 de.-C

'. - - :. 1' i94~ DAY, CPAG?1O 3 -.-04.. . . .. . . . .

EXP @1--SCAN 239--i1N'12693945 EMP 01..-CCAN 2S-1 250-91Therme! Surey!Muoler'EXP el--SCAN 24E--1126 254ff-46AA:Thra uva!ui

ch- el 72.S deg-ChLA1 6. eCch- LA1 E2.3 deQC

ch- 92 E7.1 de;_C ch- S2 4S.3 deg h 0 15 e_

* h -~ 93 79.5 dagC ch- LA Z3 53.5 deg C

;h e4 75.2 deQC C... ~ 4 511~~ch- es 77.9 e_ h0 29 do;C ~h - 5 E2.3 d-;_

ch- OE 75.3 derC ch- 05 .73 .7 de- ch r5. e_

ch. e7 96.2 de-gC ch- es 71.2 ds;_C ch,-. V7 71.7 de;_C

ch- @9 overload do2-C ch- e7 93.7 de2_C ch- 9_9a overl1oad dez-C

Ch. es 93.S degC ch- e9 ov.erload de;C ch-0 CO se9de-

ch- 19 92.7 deQC ch- 99 91.9 dn-Cch * rb E2.1 de_

ch 1 ~ 1 9.3 -Ch'-* 1.1 23.e de-oil 12 22.9 de;C Ch- 10 203. de_ -h1C2.

ch - 13 24.e do- ch- 12 23.4 degC ch- 13 24.1 de

ch- 14 24.3 dCch- 134 24.9 de;_C ch- 14 24.2 degC

ch- 1S 23.5 da- ch- 14 21.S dez-C ch- 16 23.9 de-

ch- 16 de- c h 15i 23.E degC ch- 1E 73. de_

ch- 17 99 3 dq- h- i5 94.7 de;_C ch -17 75.e degCc-1 18d5-C Ch. 17 97.1 deg-C C 19 59.5 de;C

ch- 19 791.9 deQC ch 9 7. degC ch- 1.9 54.7 degCch 1 7.4deCch- 19 75.9 de2-C

END DATA AVG. ______________

03:10 END PLOT

EX l-CM2S-I2 21-SEMP e1--SCAN 5-1 59549-CA.~~ue -~~~~ Thermal Survey!Mueler'Tg~i1S'r~.¶~e

ch- 9 1 71.3 deQC .ch. 91 53.0 de:-Cch- 92 S9.8 dc-C Ch- 92 45.2 degS I ch* 91 1E.4 de_Che 9 ( !". Ch- 93 73.7 de_ ch- 92 39.7 de- C

=,I oi 7t.Q9 ce_ ch- 04 79.1 deC C Ch 13 4.3 de;-C

Ch- e5 79.9 ds;C ch- OS 71.9 de- ch- LA4 4E.5 ~eeQCch- 95 75.4 ds;_ 9 6.5 C6 5 4.5~;

ch. e7 95.3 de- (A9 9. dag-C ch- - C5 9.7 I)~

ch- 99 overload deg-C ch ee overload deg;C h9? 54.0 de I

ch- 99 93.9 deg-C ch- 99 79.3 deg.C ch- OS 4.5 dezCC h 19 9 A 3.2 de;.C --h -19 77.7 d2_C ch- 09 55.9 dez;C

ch-I! 22.5 de-c ch- 11 22. 9 deC ch- 19 52.S degC

* ch- 12 2332dgC h z 2.5Ede ch-. 1! 22.9 deg Cch- 13 24.1 degS .o 13. 21 Zcgrch 12 2.ch- 14 25.0 deC C. 14- I 24.A2 de2_C ch -13; 24.1 de-C

6h 15- is' 23. de- I ch -14 24.S de;_C

h ?ch -15S 92.1 de2_C C i 15 73.? deg-C

ch 9 9.3d- ~Ch 17 94.4 deg-C 'k. 15 ,.7 .c A.-

ch- 19 79.93 deC ?. .E deg;S 1 17 S1.1 da;_Cch- 9 798 e.--ch- 19 53.9 deg

Is 1 74.2. dog..C -

02:45 TURN UUT PWR OFF . 03:00 DOOR COMPLETELY OPENED ch- 9 51.6 de;_C

CHAMBER TURNED OFF & .. UNIT COOLING TO ROOMDOOR AJAR

EMP 91-SCA 2 -115 44 eiP9--SCAN 2ss--i 1-2s63904 45W Therma uyy!w1r 4w herma! Survey!Mueler' EMP el1SCAN 270--ii s93l-77AC

ch @1 59.5deg..C £* ~ ~ .Thermal Sur~vey!?4 usler~

ch- 92 S3.1 de2_C oil- 02 3j.5 desgC ch- 21 !3.9 deg -Cch- 93 79.9 deg-Cc-e 7edQC ch- 92 29.2 doe-C

ch- e! 75.2 'd- ch. e4 S3.9 dqQ-C ch. e3 35.3 de2-ch- e5 73.2 deh_ 0-LA 65.1 do2_C ch- @4 43.7 de_

c-9 37dea.C Ch. es 63.9 de;gC ch- e5 43.9 degCch- @7 96.9 deg-C c h -@7 75.2 deg-C ch- 96 49.7 doeLch- @9 overload deOL. ch- @9 overload degC ch. e7 51.9 d~ch@9 93.1 de--r ch- @9 74.2 de;-C c es 54.5 d2-c

ch- 19 92.5 deg-C ch- 19 72.9 doogp

ch- 11 22.9 dasC ch- 11 23.9 dogC- Ch- 19 49.9 deugCch- 12 23.4 de~ a. ch1 23.4 dec-C ch- 11 22.9 de2_Cch 13 24.1 do;-C ch- 13 24.1 dtgCp ch- 12 23.2 de;_C

ch- 14 24.S de_ h 14 245d Cch- 14 24.1 degCch~ 15 23.4 doo-C ch- IS 23.9 dea.r h-1C4. 6-ch 16 95.9 de:_.C .ch- 16 77.2 d92_C ch- 16 23.4 de2_C

* ch 17 299.3 8.-r ch- 17694dg-c-I 51A 9ds2_Cch- 19 91.3 de_ th- 17 71.2 dogL c'h 17 E-9. do

is 1 7S.9 deg_.C 2h-7. dg."hICjW c- ch- 19 99.2 dog-.C Ch 409 d.1 As4 ..

DA c1h-4~ IS 19.9 13g

... F

EXP e1--SCAN 27S--1125-W-32AS

40Thermsal Sur~vey/Musere"

ch, 91 42.7 dsgCch- e2 29.3 decCch. 03 37.9 dog-Cch. 94 43.3 degC

Iih -es 4. e _~i~*S19 49. de;-c

ch. es1. degCch es S23.3 degC-ch 13 24e.9 deg-cch. 14 24.2 degCch. 15 23.7 de;gC

ch- 15 53.2 degC

ch. 17 57.1 degCch- i19 4.9 de2gcch 19I 47.5 degC

SXP 01--SCAN 2ee--11'2S93-37-!S

Wr Therm~al Survey'/Mus1er"

ch- e1 42.9 da2_Cch, 02 32.5 deg-cChý 93 39.4 dsQ~cch- e! 43.2 dsgCch. LA5 43.1 degCch' LA5 49.1 deg-cch- V7 49.7 deg-cch- 09 59.2 de_

es 9 52.7 doegCch, 19E 49.9 de;.C

* h, 11 22.7 degCch- 12 50.4 d gS-C ','. Voch. 13 22.4 de2_C 41A~ch". 14 23.5 de- P~

c 15 23. 1 - USED TC12 TO MEASURE VR1 TEMPch. 15 54.0 de;...C WITH UUT PWR ON MOMENTARILY.ch- 17 55.7 de;_C DEETR WOKN PRSECCIT. 19 49.5 deg...c DEETR WOKN PRSECch'. 19 47.2 dsgC

ENDS DAY 1 DATA PRINTOUTSTEP-STRESS TRIAL TEST

~'j Goe (Qc, ca- QA A

~L h INDAY:1: PAGE 13 OF '13

05 0

081

- -- 066

- EE

z

z - ---- OL2< ~dW3i WO0J ±ub.0OCW

II- F_

3d OT2ta-

08

LL GU s

021'

No 4

.LU. .LLL loll .L.... ...L ''I' H~ CLh~.LL.i LL0

03 a 0 03 0 0 03 0 03 03 03 0Il m C3~ -z 0 0)_ (0 N C m C\i -

1:1 JBaP) 38nifY3dW31 I

0- TRIAL TEST RUN

051

~-DAY 2; 11-26-91 to 11-27-91 STEP-STRESS TRIAL TEST_____ ~EXP 01--SCAN el2--11-2-2-'.436 EXP el--SCAN 04-15153'D A -ý -Z do ~~~~~Thermial Survey/Mutler" 0 TemlSro!--lr

ch- el 19.2 de;..C ch* @I S7.4 degC

ch- 02 56.3 dz_ ch- e2 55.O de;Cch-~ V '3 41.3 de;c ch- e3 55.3 dog-C

ch- 04 44.! dec-C ch- ' A4 5".3 de;-C

ch S 43.9 de2-C ch- 05% 55.5 deg-C* 19:34 BEGIN PLOT -2'S 4.2d-r-

PLTN.11 HNE h- 07 41.4 degC ch- e7 55.4 de;_ r

PLOT No. 2 1S CHANNEL 2 ch, 09 43.3 dsgC ch5I 7.0 deZ..C

PLTNo. 2 IS CHNE h- es 40.4 de;.C 0h 9 Ss.! de;_C

PLOT No. 4 IS CHANNEL 3h I. e 42.7 de-C ch- 10 55.9 de;_C4 h- 11 23'1 daz r

PLOT No. 4 IS CHANNEL 4 ch, !1 22.5 degC ch- 12 225IPTN.5ISCAELSck' 12 22.3 de-_ c 13 22. derC

PLOT No. 6 IS CHANNEL 7 C... 13 22cd~ h- 14 2.! degCPLOT Nc. 7 IS CHANNEL 9 h 14 23.9 decgC

PLOT No. B IS CHANNEL 1e ch- 15 23.2 -it; -C ch 14 23.2 de;_C

PLOT No. 9 IS rmA~Mmc* 117c-I 2. e ch- 15 23.2 der;C

19:38 RAMP TO"+61 C;' UUT OFF ch* 1-5 43.7 de;C h s E. e_4M 1-CNc-1 4.2 dagC ch 17 55.9 de;_C

a r . d1- S A 0 0 - i ? 1 9h -3 I s 1 9. 0 d2. 9 C

40 Thermal Survoy!muu~er ch 19 42.3 -._L c 61 19 55.7 do;C

ch* 01 25.9 de;C-h 02 27.7 ds;_Czh e3 27.1 dez-Cch, e4 27.S de2CEP81-CN0 -- 2E~ 0

ch-OS 7. de rEXP 81--SCAN EXP--11S1950-3

ch- -57.3 2 ..CP~Tes uv- 4 z±-

ch 07 9.3 . e;_ -- S3.4 degC - h 0! 59.4 de;-C

ch- 09 29.3e 9.4 de; 01 ch- 02 ME5 de;_h09 27.5 de;_C ;h- oz. 50. A e -d0 c.ede

Z' '' "7. A deh_ 03 ;t'd~P07.8 deg rch'11 22.4 coC h- 05 49 eg h05 S.Sd

ch, !5 59.0 de~ch- 12 22.2 Ae; C -ch- 05S 51.4 de C ch- 07 57.2 de;-;

ch- 13 ch- OE C14e;Cc-L Z S. e

ch- 14 ~727 deh 07 ch~ V S.2de

ch- 1S " -C ch 09 49.9 degC ch- 08 559. dt-

ch- 15 27.3 degC , 09s 47.S do-C rh- es 57.S de;C

ch- 17 ,c .oh 18 49.2 de I ch' 11 22.9 d5Q;C

ch- Is c h 11 C A.-*..rch 1 2. de

c.19 27.9 da;-C ch 12 22.7 de;..C h12 2. dCc h- 13 22. de_ c h- 13 22.1 de;_C

ch 1 2.7de -C h- 14 23.? de;_Cch- 14 2.4. A.-S r h- 15 23.0 de;_C

ch- 15 is.3 Ae c-i lteC

EV C*-SA h 7 St!o5_ h- 17 57.9 deqC

___Thermal Su~vay/?f4ggc oh 19 49.1 dogCch 9 7S a_owoor h 19 49.9 de- ch- 19 57.4 degC

ch- el 41.9 d2c-Cch-. 02 S3.5 e::-c

ch- 03 35.5 d6e-Cch- 0?4 35.5 de;-C EP1-CA 2-1'6953 EXP 01--SCAN 02-15003ch- es 34.! dtQ~c m i-CNe0-l2lS4'c Thermal Survay!Muolor'ch. 06 39.2 de2_C Thermal Sturvey.m~ueier' Wch. 07 32.5 de;_C c h- 01 59.1 dsgCch- 09 3i.4 deQC ch- 01 S.e de...C ~0 99d

ch- 0! 31.4 dog ch* 02 59.5 deC ch- 03 59.7 dugSC

ch- 10 32.9 de.-C ch- 04 64.1 de;_ o h- 04 59.7 do;_C

ch- 11 22.3 deo; ch- 94 S3.1 derS eh40 59.5 doe;S

ch - 12 22.3 de-C ch 06 54.5 de- r ch- 015 59.9 dog-C

ch- 13 c21d.. h* 97 52.5 dtoC ch- 97 S9.9 de;gC

ch' 14 22.9 deQC ch- E19 54.2 dusr_ oh- e9 S9.1 doQC

oh' 15 23.9 d9s-C ch- es S2.1 ds_ ch- 10 S9.9 dqoC_

ch- 17 34.3 do- ch- le 53.3 deogS C h- le 22.7 dosQ_

ch- l7 34.0 degS ch* 11 23.2 dogSC h 12 22.5 deZC

ch 34. ch-C 12 22.6 dogS. ch. 13 22.1 deg-Coh 9 33.1 deg-C ch 13 22.2 dtgSC Ch. 14 23.1 d92_C

ch 14 24.3 d92..C ~ 5 2. o.ch S 23.4 degC 23 1 9.7 dag..C

oh- 19 63.9 d92_C o 7 5 ~ch- 17 64.0 dtC ch- 17 5 S2. de-C

ch* 19 93.2 de2_Cch 19 c36de. h 1! 9 S9. d*2.C

20:10 LEVEL 0; TURN UUT PWR ON

EMP 91--SCAN 93-122 96EXP e1--SCAN el49l-125-0-922 36fa Thermal Survey!Mue1!r" Thra Su,-vey!Mueisa' EXP 91--SCAN O969-11-2652e3135

M ft Thermal Surey!Mujeler'

ch- 6 1 69.5 8eg.S ch- el MEde_ch. 9? S9.6 do2_C ch- e2 se e de:- c ch-6 51dg

ch, . L3 S9.3 de C ch- 03 SS93 de2 ch- 02 se.1 deQgC

ch- e4 593.3 dea..C ch 9 Eg doC ch- 23,3 7e.7 d- r

c h- 05 59.1 dsgSý ch- 95 57.9 deg.5 ch- 94 59S.2 de2_Cch- es 69.4 de-C ch 96e 65.2 dg h 95 7Sle.2 1 4-

ch- e7 59.! du;.C ch- e7 69.5 degC ch- M7 72.4 d gCch- 89 ME. degC ch- 09 71.4 dogC ch- 97 72.1 de;_C

ch- 99 59.9 doog5 ch- e9 72.9 de;_C hes 7. de_

ch- 19 59.2 deQC ch- 19 71.2 degC ell 19 7S.9 degC

ch- 11 22.9 deg-C ell- 11 22.7 degC c 0 7. e

ch- 12 22.7 degC ch- 1) 224 de C h- 11 22.4 dsg_3

ch- 13 22.3 de2gC ch- 13 c-! 22.! deC h'1 2 -_ _

ch- 14 23.6 deg5C ch- 1 2.3 degCh 3 229d~ch- 15 23.5 dog-C ch- is 22;.S deL.-C ch- 11 23.3 de;5

ch- IS 69.3 de2-C ch. 16 75.9 deg5 Ch 15i 22.9 degC

ch- 17 S9.4 de;_C ch- 17 79.4 deg C ch *16 79.3 dsgC

ch- 19 59.2 dsg_5 ell- 19 574Me5~17 9. deQC

h 9 92 .c h- 19 67.9 de2_.Cch' 1 79.7 deg C

EMP 91--SCAN e49--11*26'?9I4'-361 EXP 91--SCAN 052--11-26-20-2S-36 ETherm.al Eurvey,/Muoler' . vMMeo'P 91--SCMN 064-11-ZE-2e-3B6

w M herml Suvey!uelz" OFTheral Survey!Mueier"

ch e1 69.3 doQC ch LA1 64.4 deQCch- 92 59.9 degC ch- 02 69.1 deaC oh- 91 ES.2 degCch- 03 S2_2 f~C ch- 03 ES.5 degC .. ' 92 -92?A

59 4 E.9 OogCých V. 94. ee . ch- 93 7..9 degSch- es 61.9 dec..C ch- OS 59.9 degC ch- 96 795 deg-S

ch- LAS 50.9 degC c h- 96 55.3 degSC ch- 9- 570.6 deQC

ch- e7 54.4 deQC ch- 07 71.9 deQ.C ch- LA7 72.9 degCch- 69 55.7 degC ch- 09 72.9 deg c-Ot 7. e_

ch LA9 63.9 dezC ch- E9 744 dg h 9 74.4 degC

ch' 19l 54.2 dvcC ch- 19 72.6 deg5 h 9 5' -

c h- 11 22.7 de2_C ch- 11 22.6 de;C Ah 1 74 .2 eegC

ch- !2 22.5 dosQ_ ch- 12 22.1 de;gS- oh-11 '. 22.6 deg C

ch- 13 22.! dogS ch- 13 22.9 degC ch- *12 22.3 depgCch- 14 23.4 jeC ch. 14 23.3 dtg;C ch- 13 21.9 leg-Ceh' 16 23.2 do-.C ch- IS 23. dtgC ch- 14 234.2 da2_C

oh 6 72de2% ch- is 77.1 deg5 h 5cl; i7 71.1 jw-'- ch- 17 7S.7 deg5 Ch' is 79.5 deg-

ch- !3 S1.7 degg r 19 69 .7 de;5C ch' 17 91.1 deg Cch- 19 62.6 do...C c-1 93dg h- 1-8 793de;

ch- 19 71.9 deogS

START DATA AVG.EMP 81--SCAM 941--11-2S'2e-19'35 EMP 91--SCA.N 955--11-25'29'1039'5E' 1-CN 8-12 9

Thermal Survey!Muuler' Thermal1 Survoy/1Iue1sr*_EM e-. CA GG- 1 TS2. T

ch- 61 62.3 do;._C ch 61 54.9 dq;_Cch- 92 59.9 doo-C ch 92 69.9 degC 92. 6-0. 'C,

ch- e3 66.1 derC oh. 93 79.2 dogS2 OZ 671.1 J6-

ch 94 64.7 degS 6h- 94 5.0oS~4 59.5 JUWCoh- ~ ~ _ 9c6. d h* es 59.9 degS I 9 07 !-

ch- 06 63.6 dos22 ch o- es 65.9 dogSC uh979.6 Ju'ugelh e7 67.4 dogSr Vs' 67? 71. dL5 7 - ýduj

oh- 99 59.2 dogSch- 99 73.S 'de2_C- .,~...

ch- 9! 69.2 .Co-9 5 ddo;C Ulf %';" 7.0 Jewch 8 6.7dg h- 1s 73.4 -de;_ C~ 74.!

oh 1. 2.7 9 So-u tdi 09 '764 i22.4 Isg ch. es 22.6 dogC Ul Z1 227 u

ch- 12 22.7 dt-C 22 1 7.4 de2C 12 22 7.4 Jew-Cch- !13 227deh- 13 22.9 do-, r2. Ul 1 , -tjic

ch- 14 23.4 d*Qg5 ch- 14 23.3 deogS U I, 14 2. d. c

ch' 15 23.9 dogC ch- 13 23.0 dsc_ Uti 16 22.9 Jeu'_5

ch- 14 73.3 degC oh- 16 77.9 d92g5 ;If 16 79.9 dow-C

ch- 17 79.2 degg5 ch- 17 77.4 dog..CUl ISZ A u -

c h- 19 95.2 dogC ch- 19 69.5 dogSC ;If 17 91.2 iJOu-

ch- 19 15.1 deg2C ch- 19 76.2 deg..C uls 1s WA. ijw...C

wit Is 7.2 fuw_

%.

"'S.OF

EXP 01--SCAN 07-1 26T 61 EXP 01--SCAN 024--11 29 20 S:: 36 EXP 01--SCAN 0M--I1 25 2e 1!!Sd o That-mal Suv.':I:UU -- ft T Survuy/Mul 1 ft Tlii-uril Suv-l.3

Uia ;1 95.4 JimC - ul 01 55.5 duwc %;If 0 1 ME. ju6-fUll 02, 91%ZI..G: 0.3 uuC l u : 02, ~

0l 3 71.2 juu2.C. ¶ 5-74 -

Ul5a 70. 8 duwC ul ocS 71.0 t~6C .4, 05 71.2 J=6-Uf LIE 67.7 duwC ul. as 67.2 dJa6_C S- 8 6.Ulf 07 7Z.1 dUwC -i 07 ?! 73. duCd 7 34L

vii as 74.7 UZC Ull 08 7.1.9 t~Cv:0. 50~Ulf 0 9 75.5 ;;wC Ulf as! *if -?G :UII 10 74.S tJuW.C Ulf 1 -1 . Jv;;U Ulf 3i WA.ý

v ! 222. 7 Jr- .4. .. C dii 1 .7w- u~i: 2 2.4 jou-C ~ I.23dC i12 2. uC

ull 1. a 2Z1.9 a J 7T: r32. wCv.1

di ~ ~ ~ ~ ~ ý 14 UULv: 4-.h~v 4 -:, J~

i,15 78.0 LuC v: 15S _739. Ja3oC .4: 1S 79:.1 uco;C

-.if 17 B81.3 j . :5v 7 815 c

Ulf9 05~ h1 701.77 &!'WC u4 19 7n. a u.63.!i1 13 71..3 J5ý h 13 7.5 C~ 19 7.3 Jaw_

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23:15 LEVEL 1;. CYCLE UUT PWRTO REGAIN SYNTH LOCK

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DAY 2: PAGE 7 OF 14

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TRIAL TEST RUN

TEST EQUIPMENT & CALIBRATION LOGMaintain Logfortesting conducted l1-2 S-4 1 through I )Z?lci):

TOW- . i-e

~, DESCRIP71ON Manuf. & Part No. ID NUMBER CAL ALU Item Notes

01 T/RTestStation HAC; SPECIAL GA215 ____ oiC.R F-A15?Z3021 Control Panel HAC;SPECIAL G- 1*5ZZ'l 9 __0 NC~R

0 3 S i g n a l G e n e r a t o r H P ; 8 6 6 0 0 & -1 2 8 0 6 1 t Z239 0 1Z 9 c t9 )04 Auxiliary Section HP;8-6-6-318 G-lZ6062 ImIcjiR ?/orte'.ao0

05 RF Section HP; 86603A G- 178o6? (0 2-v3-i0!2-I'I-qtt ?IcpT~e'r 0S06S Sprum Analyzer HP; 8568A wIOpt El6 --____ ________SbI~zli

0 PFETProbe HP; 1120A G1152055 12-14-90 10+*30-42 ____

08 Power Meter HP;436A B&-l~ ______

09 PowerSensor HP; 8482A &-izsocý~ c9-09 -9 1! j-aI -iz10 Oscilloscope HP; 1980B G-1-620q9 0qz-10-jq.11 DigitaliMultimeter SystronDonner: 7344A G-l2'l9cl e o6-of0-qJ C8-i8-12121 DigitalMultimeter -HP; 3478A HI552L o9-D6- Ob 6Z5-'9213 PowerSplitter MiniCkts; ZFSC-2-5 _____ I___P-__14 PowerSplitter MiniCkts; ZFSC-2-5 ROMS___ ________

15 Reg. PowerSupply Lambda; LP-531 -FM G-1,62zel ___ NCR. + Is vsn;16 Reg. Power Supply Lambda; LP-531 -FM ?ý, N___ r-P u17 Req. Power Supply Lambda; LP-530-FM C7-1,52291 _____ +2~ !V±ý18 Reg. Power Supply Lambda; LP-520-FM PoX x V7 11 __

19 Computer HP;9845B G-121R030 __

20 Flex. Disk Memory HP;9895A &-33o ___

21 Signal Generator ________ ____ _______Iocts4

22 Oscilloscope Tektronix; 2465 tiot______ ____Meae.A

23 DigitalMultimeter F Lkt Bo~o A F-. il 1115 a~9 aa -2____24 Digital Muftimeter _________ _ _ _ _ _ ____I____ toU e25 Digital Muttimeter K_______ _____ _________26 ThermalChamber Thermotron; S-4 w/CntI -ol ~ f ieq !01-021i271 Data Acqtn Cntl Unit HP;3497A H-&42aLq49 l-)4-i91o-'- ____

28 Cornputer HP; ModelB ____ G-C __M_____

29 S ech-ga An~ 14?i 5W- 3'74- & 84ko -oa-91 0Q5 -2 u ~ 130 prve,- ~ ?T~X ~ I-Ai5' _____q N ev31 Tt~j~ ~ _______ -512'UB ____

321 AtV~vu..a.i-ew- ; as ZBE _____ t~k -33 MeauaA% O 4r M4*1 *o8 ;1 1 ____s gaa E "

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TRIAL TEST RUN

STEP-STRESS TEST DATA SHEET (CONTINUED)Sheet 4A of 4

UUT Serial Number (el-eMS): -/To/34 • Test Date: U -27-9/

STEP-STRESS Level (entero- 10): ~ 92 4E66

UUT PERFORMANCE TEST DATA CONTINUED

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I Frequency should be at 921 MHz with power levcl > +9 dBm (cable loss is I dB) I

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TRIAL TEST RUN

TEST EQUIPMENT & CALIBRATION LOGMainai Logfortesting conducted f/9through1 /? /17 - /:

E DESCRIPTION Manuf. atN. ID NUMBER LS CAL * DE Item Notes

101 TiRTestStation HAC; SPECIAL &-i32p43 _ __NOL F-AIS223021 ControlPaiiel HAC; SPECIAL -2q~___t..

SignalGenerator HP; 86600 G-IS2001 io/26/9/ ip ZAwdliarySection HP; 86631 B &-1S2piC) N__ Va~ ?/oNeiw3

0RFSection HP; 86603A &-i'3,2.O ) Io/Zb)9) 61c1Z0112- -POX.j5

SpetuAnalyzer HP; 8568A w/ Opt El 6 &-ISZDSZ si.J14¶l 10/I36/z.I07 FETProbe HP; 1120A - ______ eacr 5E

Power Meter HP, 436A -4MOT alLC~.bPowerSensor HP; 8482A - a .sel'

1 Oscillosop HP; 1980B &-1o~ 6 ____

11Digital Multimeter SystronDonner; 7344A - NOT__ _____ lr

1 DigitaliMultimeter HP; 3478A H-ASU2Z4 ejop4lq I 6(o/2q-I9 ____

13 PowerSplitter MiniCkts; ZFSC-2-5 _______ I___ ______

1 PowerSplitter ~MiniCkts; ZFSC-2-5 #.a4 1tm1 Reg. PowerSupply Lambda; LP-531 -FM & ____ 11 z -z

1 egPowerSupply ~Lambda;L.P-S31 -FM pl _____ -97 ~ -)S'l R1 $17 Reg. Power Supply ILambda; LP-530-FM &-i32z~cl ____ wax~ +7.. S~e1

18Reg. Power Supply ,Lambda; L.P-520)-FM 0 lemi~. I I C______V_,pp

iComputer JHP; 9845B &_1760_6 d___2 Fle Disk Memory IHP; 9895A &l33A ___ ____

21Signal Generator 1 ____6T "E

Isi2P Tektronix; 2465 - __ I__ NOT~ LLMET

2D gitalMultimneter MOT_____

-s Dqtl___rnte 96T CAS"b

ThermalChamber Thefrmctron; S-4w/Cnti H-to*756' o9)o)q) -aJzAVt_ Vs -72-Data Acqtn Cntl Unit HP; 3497A 14 .q4ZR~q 1,]R*JI q?fz '31

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Data ReductionTables and Plots

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SECTION 6

Unit Modification& Equipment Setup

prepared by S. D. Muellerand B. J. Armstrong

and W. T. Clark

1

141

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FIGURE D-2: A4 DETECTOR CIRCUIT CARD MODIFICATIONFOR AUXILLIARY -5 Vdc CONSTANT SUPPLY

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SUPPLEMENTAL (APPENDIX D)

STEP-STRESS TEST DATA SHEET

UUT Serial Number (~ua &swc ___ Test Date: __________

Tester- (Nam a ~mp beiaw)

STEP-STRESS Level (=w o 0-0: wy ____ _______________________

UUT PERFORMANCE TEST DATA PERFORLMANMEM0NMPORNG)

REITRZNRDID OIIAI At Dwelt. For the modified resistor! zener diode subcircuit, record thevoltage amros the LOAD RESISTOR at this STEP-STRESS Level.

Start TEST:_______CrTWhE HR:h4DQ

Voltage across LOAD RESISTOR: _____(Vdc) (rvefevtoAppmdixD "aatnainly .SVdc)

End TEST:-_____

DETAILS: A4 DETECTOR CIRCUIT CARD MODIFICATIONFOR AUX. CONSTANT -SVdc SUPPLY

AND R4NR1 MONITORINGL10

PlO U7 y --- TO DETECTOR 2C14 RFAMPLIFIERS

SCEMTIC C1~ -15 Wde

__ TO DETECTOR 1

2 G P/0 TOOFSERI

4 L2 POTENTIOMETERS

'C4 -1 e5TO VIDEO AMPSS+

giid LOAD RESISTOR

-vAUX.Vr~_reg SUPPLY- 5 Y

FROMAUX. SUPPLY

D-20

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TO PROGRAM CHAkMBER: Pressakey. (CDElIdisplayed). PressWkey.

EnterPROGRAM NMBR. Pressý keyfollowing each value entered.

PROGRAM NMBR 1 2 3 f 4

INITVAI-l (0 C) 25 61 133 61

INTERVAL 1 1 1 1FINALVAL (0C 61 61 61 25INTVITIME (HR.N) 0.18 1.0 0.36 0.18AUX - - - -

NEXTINT 2 2 2 2

INTERVAL 2 2 2 2FINAL VAL (c"C) 61 69 61 25INTVLT1ME (HR.MN) 2.0 0.01 3.0 1.0AUX - - - -

NEXTINT 3 3 3 3

INTERVAL 3 3 3 3FINAL VAL (OC) 25 69 25 =IINTVLT1ME (HR.MN) 0.18 1.29 0.18 PreSST~pikey.AUX -- --NEXTINT 4 4 4

INTERVAL 4 4 4FINAL VAL (C)C) Pre = I T 7 Pres=aTpkeINTVLTlME(HR.MN Prs gkey. 0.01 ___s~pie

AUXNEXTINT 5INTERVAL 5FINAL VAL (OC) 77INTV~L1ME (HR.MN) 1.29AUXNEXTINT 6

Crotiue PROGRAM 2: Repeat INTER VALs4 and 5 above using VARIABLEs below.INTERVAL 6&7 B&9 10&11 12&13 14&15 16&17 18&19 20&21FINALVAL (00) 85 94 102 1l1 119 127 135 143

INTERVAL 22FINALVAL (00) 61INTVLTIME (HR.M1N) 0.40AUXNNEXTINT 23

NIINTERVAL 23FFINAL VAL (OCII) 61NIINTVLTIME (HiRMN &oAUXINEXTINT 24

INTrERVAL 24FINAL VAL ( P sskeAUX TESTTp NEX ke NTlf &hiolds INTERVAL r--lkey cortiusproram INTERVAL

tknswidtemperatiure. .

D-22

150

p

APPENDIX C

Conformal Coating Analysis

p

p

HUGHES AIRCRAFT COMPANY

INTERDEPARTMENTAL CORRESPONDENCE

TO: D. Huch cc: Distribution DATE: 13 February 1992ORG: IA-62.XX REF: 92/ A7230/002

SUBJECT: Step-Stress Test Units FRO . S.FD . e• rDiscoloinig of Conformal Coating BLDG: 675 MAIL STA: Z314

and Reliability, Post Stress Test EXT: 1-8360 ORG.CODE: IA-72-30

BACKGROUND: Two (2) out of the seven (7) production R/T modules have been Accelerated Step-

Stress tested per the Test & Acceptance Plan. The first unit, MSN 1030, was taken to Level 10 and thenLevel 11 to reach catastrophic failure. The second unit, MSN 1023, completed Level 10 without failure. Bothunits tested showed visible discoloring of the conformal coating. The polyurethane coating appears scorched,having a orange-brown color, over the entire unit surface. The appearance is smilr to a hot coffee cup beingplaced upon a coated table and leaving a ring on the furniture's finish. A scrapped circuit board was placed inthe thermal chamber with MSN 1023. The board's polyurethane coating began to yellow at the exposure airtemperature of Level 9 & Level 10 (+ 140 0C). The discoloring of the test units is unacceptable to D. Ragle(who is responsible for this hardware), and makes these units depreciate significantly in value.

TASK ASSIGNMENT: Under direction from D. Ragle and D. Huch, engineering was tasks todetermine the temperature level where this discoloring would be, at most, minimized to localized areas(allowing spot rework on few component surfaces) or yellowing throughout (also typical of units whosecoatings have aged).

ANALYSIS:

R. Patterson (component/material engineer) has tested MSN 1023 and another unit MSN 815 (for compar-ison) for dielectric strength and coating thickness. The discolored coating of MSN 1023 was found to beacceptable per MIL-SPEC requirements. The unit's polyurethane coating had not carbonized (no burning)and showed no sign of breakdown when subjected to 6000 Volts through its 6 mil thickness. The MIL-SPECindicates that usage is specified for indefinite operation to + 130 OC. Color is not a criteria. D. Hahn (productoperations) inspected MSN 1023 and found no defects or imperfections as judged to Hughes workmanship

criteria. Again, no requirement for color exists. The exposure of the conformal coating, although in excess of

its + 130 0C spec, shows no degradation in performance or to its workmanship requirements.

S. Muller (design & test plan engineer), using the MIL-SPEC + 130 OC requirement for operation and the

scrapped board's exposure of + 140 OC for yellowing, determined that testing of the remaining units wouldhave to be educed to Step-Stress Level 6 or Level 7 to minimize the discoloring of the polyurethane coating.The attached figures and graphs illustrate these Levels as they apply to the Test & Acceptance Plan forAccelerated Step-Stress Testing.

Component cae temperatures will exceed + 130 OC at Level 6 (see excerpt F•gure 23.1). Coating not indirect contact with components will have uniform air temperature exposure of"): OC by Level 7. At

A ^r

--- -- ---

DATE: 13 February 1992

IDC REF: 92/1A72.30/002PAGE .2 OF6

Level 7, yellowing will have occurred on components due to case temperatures exceeding + 140 °C and

browning may occur in some locations. The component case temperature information cited was taken from

thermocouple data obtained from the Trial Test Runs of 25 November through 27 November 1991 and

17 December 1991. The Trial Test Run of the Step-Stress Test was conducted on a similar unit and provided

the basis for the thermal criteria of the Test & Acceptance Plan. This similar unit, MSN -100/349, was not

conformally coated and compartment air temperatures will be slightly increased on the -103 configuration

units (ie., MSN 1023, 1030, 815, and four others) due to their coating. Above Level 7, browning will continue

and be more widespread.

LIMITATIONS ON R & D: Reducing the unit exposure to Level 6 or Level 7 should ilm

discoloring of the polyurethane conformal coating on future test units, and alleviate the concerns of D. Ragle

and D. Huch. Reduction of the temperature stress will require a change to the Test & Acceptance Plan for

future test. Using Level 6 as the maximum stress would only stress 8% of the components to their maximum

survival temperature extremes (see excerpt of Figure 2.2-1). With Level 7 used as the extreme, this would

increase to include 38% of the components. The original scope of the Test & Acceptance Plan, and the

approach guided by the Process Action Team members, was to provide testing up to the units Design Limit

which at present includes Level 10 and imposes accelerated stress upon 90% of the components. With the

reduction of stress to Level 6 or Level 7, we will be repeating the approaches utilized by the prior two test

participants (testing only to maximum operating specifications rather than survival extremes) and contribute

little to the research and development of Accelerated Step-Stress Testing.

REMARKS: The browning of the conformal coating of MSN 1023, and likely MSN 1030 (not analyzed),

does not indicate a degradation in the ability of the conformal coating to provide its intended function. The

question remning, however, is what the Level 10 stress environment exposure has had upon the component

life of these units. By plan, these units were exposed to stresses in excess of their specified operating limits

with the intent of subjecting them to extreme stresses that would accelerate failure. These units have not

been evaluated, as yet, to determine the extent of damage which may have been sustained during test which

could show up during a second pass of the Step-Stress Test or could happen if these units were fielded as

production spares in the future. It is recommended that MSN 1023 and 1030 never be used in any situation

requiring the same performance reliability as a new production unit.

adinan

Distriutia

D. I. Ragle R. F. PatenrS. I. Burnett D. T. Hahn

SL F. Jame• H. W. Hosime

DATE: 13 February 19927A@PR 33 I l n: g, : •2 IDC REF: 92/1A72.30/002"TL,,(VA mjldn st i-I+4S. . . . ... I ', , 'PAGE a OF 5

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EXEP FROM R & DTEST &ACCEPTANCE EXTEME(FIGURE-21MAIU SUVVLTMEAUEE RMS

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70~~ 7a 50 :4 10 11 11 12 344 105

MISSION

OF

ROME LABORATORY

Rome Laboratory plans and executes an interdisciplinary program in re-

search, development, test, and technology transition in support of Air

Force Command, Control, Communications and Intelligence (C 31) activities

for all Air Force platforms. It also executes selected acquisition programs

in several areas of expertise. Technical and engineering support within

areas of competence is provided to ESD Program Offices (POs) and other

ESD elements Lo perform effective acquisition of C 31 systems. In addition,

Rome Laboratory's technology supports other AFSC Product Divisions, the

Air Force user community, and other DOD and non-DOD agencies. Rome

Laboratory maintains technical competence and research programs in areas

including, but not limited to, communications, command and control, battle

management, intelligence information processing, computational sciences

and software producibility, wide area surveillance/sensors, signal proces-

sing, solid state sciences, photonics, electromagnetic technology, super-

conductivity, and electronic reliability/maintainability and testability.