Status of the MEMS Industry 2018 - Yole Développement...o A view of future mega trends and impact...

© 2018

From Technologies to Markets

Status of the MEMS Industry

2018

-Get high for MEMS

SAMPLE

2

Biography & contact

ABOUT THE AUTHORS

Dr. Eric Mounier, Senior Analyst, MEMS & Photonics

Dr. Eric Mounier has a PhD in Microelectronics from the INPG in Grenoble. He previously worked in the Marketing department at CEA LETI R&D lab in Grenoble, France. In1998 Eric cofounded Yole Développement, a market research company based in France. At Yole Développement Dr. Mounier oversees market analysis for MEMS & sensors,uncooled IR imagers (microbolometers), and photonics (i.e. silicon photonics). He has contributed to more than 250 marketing and technological analyses, and 100 reports. Eric isalso an expert at the OMNT ("Observatoire des Micro & Nanotechnologies") for Optics.

Contact: [email protected]

Claire Troadec, Division Manager, Power & Wireless

Claire leads RF activity at Yole Développement and has been a member of the Microelectromechanical Sensor (MEMS) Manufacturing team since 2013. She graduated from INSARennes (France) with an Engineering degree in Microelectronics and Material Sciences. She then joined NXP Semiconductors, and also worked for seven years as a CMOS ProcessIntegration Engineer at the IMEC R&D facility. During this time she oversaw the isolation and performance-boosting of CMOS technology node devices from 90nm - 45nm. Beforejoining Yole Développement she also managed her own distribution company.


Dr. Guillaume Girardin, Division Manager, Photonics, Sensing & Display

Dr. Guillaume Girardin works as a Market & Technology Analyst for MEMS devices and technologies at Yole Développement. Guillaume holds a Ph.D. In Physics and

Nanotechnology from Claude Bernard University Lyon I and an M.Sc. in Technology and Innovation Management from EM Lyon - School of Business.


Jérôme Mouly, Analyst, Life Sciences & Healthcare

Since 2001, Jérôme has worked at Yole Développement as a Technology & Market Analyst. His fields of expertise include MEMS printhead devices and inkjet printing.


Sébastien Clerc, Analyst, Life Sciences & Healthcare

Sébastien Clerc is a Medical Technologies Analyst at Yole Développement, the "More than Moore" market research and strategy consulting company. After graduating from

Grenoble INP with a degree in Biomedical Technologies, he completed his training with a master’s of Innovation and Technology Management, during which he oversaw strategy

and marketing.

Email: [email protected]©2018 | www.yole.fr | Status of the MEMS Industry 2018

http://www.yole.fr/http://www.yole.fr/

3

REPORT OBJECTIVES

The objectives of this report are to provide:o A view of future mega trends and impact on sensors

o A global view about future for MEMS, sensors and actuators

o An understanding of the MEMS, sensors, and actuators markets and applications

o MEMS and sensor players’ dynamics and ranking

o MEMS market data in $M, units, and wafers for 2017 - 2023

o Information on future MEMS devices

o A presentation of MEMS game-changers and industry trends

o A MEMS applications overview: automotive, consumer, defense & aeronautics, medical, industrial, andtelecommunications

o A MEMS financial analysis

©2018 | www.yole.fr | Status of the MEMS Industry 2018


4

WHO SHOULD BE INTERESTED IN THIS REPORT?

oMEMS and sensors companies:For a broad overview of all MEMSapplications & markets

o To identify new markets

o To monitor and benchmark potentialcompetitors

o To compare MEMS technologies with othersensors technologies

o Financial & strategic investors:o To understand MEMS devices’ potential

o To know the latest A&M

o For a list of MEMS players and theiractivities

oR&D players:o To understand new MEMS technical

challenges

oEquipment & materials suppliers:o To learn about MEMS devices’ technical

evolution

o To identify business opportunities andprospects

oOEMs & integrators:o To evaluate the benefits of using MEMS

in your systems



5

COMPANIES CITED IN THIS REPORT

AAC, AKM, ALPS ELECTRIC, AMPHENOL, AMS, ANALOG DEVICES, APPLE, ASIA PACIFIC MICROSYSTEMS, BOEHRINGER INGELHEIM MICROPARTS, BOSCH, BROADCOM, CANON, COLIBRYS, CIRRUS LOGIC, DENSO, DRS, EPCOS, EPSON, FIRST SENSOR TECHNOLOGY, FLIR SYSTEMS, FORMFACTOR, FUJIFILM

DIMATIX, GLOBALFOUNDRIES, GOERTEK, HEWLETT PACKARD, HITACHI AUTOMOTIVE, HONEYWELL, IMT, INFINEON TECHNOLOGIES, KISTLER, KNOWLES ELECTRONICS, KULITE, MCUBE, MEGGITT SENSING SYSTEMS, MELEXIS, MEMJET, MEMSCAP, MEMSIC, MICRALYNE, MICROVISION, MURATA, NXP, OMRON, ON

SEMI, PANASONIC, PHILIPS INNOVATION SERVICES, QORVO, QUALCOMM, RAYTHEON, ROHM, SAMSUNG, SCD, SDI, SEMEFAB, SENSATA, SENSIRION, SENSONOR, SI TIME, SILEX MICROSYSTEMS, SILICON SENSING

SYSTEMS, SMIC, SONY, STMICROELECTRONICS, TDK, TE, TELEDYNE DALSA, TEXAS INSTRUMENTS, TOWER

JAZZ, TSMC, ULIS, UMC, UTC AEROSPACE SYSTEM, X FAB, YAMAHA…and many more



6

METHODOLOGIES & DEFINITIONS (1/3)

Methodology:o Our market & technical information was gathered directly from:

• System manufacturers: car equipment manufacturers, IT equipment and medical devicemanufacturers, and others

• Device manufacturers: key global MEMS inertial sensor manufacturers

• Equipment & material suppliers for the MEMS industry

o This 2018 edition is also made possible by the daily work of Yole’s analysts, who updatethe forecasts immediately after the information is obtained. Yole analysts contact more

than 3,500 companies annually (50 - 70 industrial interviews per week) tounderstand market trends, technical developments, and strategy changes. All of theseinterviews provide the primary data used in our subsequent analyses and forecasts.

MEMS (Micro Electro-Mechanical Systems)o Definition for this report: we consider MEMS as devices that include moving parts (or

fluids) in the µm - mm range, and which use a photolithography process formanufacturing



7


We have calculated the projected MEMS device market based on systemmanufacturers’ needs and forecasts, along with input from MEMS device users, andhave double-checked this data with MEMS device manufacturers

By doing so, we are able to verify the growth of a specific application, the marketschedule of a new product and the competition among the main players in eachapplication area.

Yole Développement is uniquely positioned to analyze MEMS markets from thesystem down to the device (as well as equipment and materials), enabling extensiveinformation cross-checking

What’s included (and what’s not):o Only die-level components (first-level packaged device) are considered - not the full system

around a MEMS deviceo Volume and prices pertain to a packaged MEMS (inclusion of electronics/ASIC is according to

the component technology)



8


Yole’s analysis



9

ELECTRONIC MEGATRENDS : IMPACT ON THE 2023 SENSOR & ACTUATOR MARKETS PER APPLICATION

Smart Automotive Mobile 5GHyperscale

Data Centers

AR/VR AI/ML Voice Processing Healthcare Industry 4.0

$2.3B $4.6B$50M

$53B$20.5B

$1.4B



10

$5,200M

$12,400MCAGR +16%

$2,200MCAGR +15%

Radar/ultra sonic

3D & LiDAR sensors

Chemical sensors

Magnetic

Pressure sensors

Imaging sensors

Inertial

Audio

SENSORS FOR THE SMART AUTOMOTIVE INDUSTRY - ECOSYSTEM

2017 - 2023 forecast

The two main growth areas are imaging and radar,

lidar, driven by automation

$20.4BCAGR +12.7%

$10B

2017 2023

$190MCAGR -2%

$1, 000MCAGR +4%

Total sensor market value for automotive

$1,660MCAGR +8%

$2,060MCAGR +3%

$900MCAGR +44%

$210M

$800M

$1,100M$1,700M

$100M

$9M

$16MCAGR +10%

$920M



11

ACTUATORSSENSORS

THE DIFFERENT MEMS, SENSORS, AND ACTUATORS, AND WHERE THEY CAN COMBINE

Pre

ssu

re

So

un

d a

nd

ult

ra

son

ic

Environment Optical sensors

Dru

g d

elivery

Microfluidics

Ink j

et

head

s

Au

to-F

ocu

s

Mic

rom

irro

rs

RF

µsp

eakers

Optical MEMS Micro structures

Part

icle

s

Hu

mid

ity

Movement

Gas

Magn

eto

mete

rs

IMUs (6 to 9 DOF)

Accele

rom

ete

rs

Gyro

sco

pes

Tem

pera

ture

Op

tical b

en

ch

es

Mic

ro t

ips

Pro

bes

Watc

hes

co

mp

on

en

ts

PIR

& t

herm

op

iles

Sw

itch

Filte

r

Bosch BME680

FLIR Lepton One

Infineon microphone

ST pressure sensorInvenSense

MPU9250

Debiotech micro

pump

Texas Instruments DLP

Avago-Broadcom

FBAR Filter

Spiromax Patek

Philippe

Audio Pixels M

EM

S-b

ased

spea

ker

Reso

nato

r

Bio

ch

ips

poLight AF

SiTime oscillator

AL

S, R

GB

Fin

gerp

rin

t

Optical combos“open” package

environmental combos

“closed” package

6 to 9+ DOF

combos

Possible integration with environment

combos

Possible

integration with

opto combos

Hyp

ers

pectr

al

3D

sen

sin

g

FT

IR

Vis

ion

Mic

ro b

olo

mete

rs

Ult

ra s

on

ic

fin

gerp

rin

t

Apple dot projector

Qualcom

m fin

gerprin

t sensor



12

A NEW INNOVATION WAVE FOR MEMS: ANOTHER 10 YEARS OF R&D

From mechanical waves sensing to acoustic/sound sensing and to electromagnetic waves sensing:

the unavoidable mutation of MEMS (and sensors)

80-90s years: only mechanical

movement / pressure / shock can

be sense by MEMS.

90-2000s: rotation sensing and

visible light management (DLP) are

now accessible to MEMS

technologies.

2000-15s: sound and IR wavelength

are accessible to MEMS

technologies.

2015-future: MEMS will sense and

manage a wide range of waves:

ultrasonic / directive sounds / ultra

sonic / RF / hyperspectral …

Pressure

Acceleration Yaw

Infra redVisible

Sound

Radio frequency

IR, Visible

Hyperspectral Ultra sound

Sound Multi-parameters

DETECTING AREAMEASURING AREA

GLOBAL ENVIRONMENT PERCEPTION AREA

Sensor fusion

A.I.

Para

met

ers

Are

as

Gas Odors Multi spectral

IMUs Environment

sensors

New integration and packaging

approaches

New detection principles

New materials and processes

Si as a new sensor material

Improved electronics

New user cases

etc .. (empathy)

New sensor design

Tim

e sc

ale



13

2017 2018e 2019e 2020e 2021e 2022e 2023e CAGR

Série1 $45,99 $53,73 $62,19 $70,97 $79,31 $88,88 $101,72 15%

Série2 70,8 85,5 102,7 120,5 139,8 159,7 185,3 17%

ASP ($) $0,65 $0,63 $0,61 $0,59 $0,57 $0,56 $0,55

$0,40

$0,50

$0,60

$0,70

$0,80

$0,90

$1,00

0

20

40

60

80

100

120

140

160

180

200

ASP

Bill

ion

s o

f D

olla

rs a

nd

Un

its

Total Sensors & Actuators Market

GLOBAL SENSORS AND ACTUATORS FORECAST (MEMS AND OTHER SEMICONDUCTOR-BASED SENSOR TYPES)

ASP for sensors and actuators is

clearly below$1. Targeting$0.5 in 2023.

In 2017 the total IC market was $420B, with MEMS, sensors, and actuators representing 11%.

BUS$

BUnits

-3%



14

2017 2018e 2019e 2020e 2021e 2022e 2023e CAGR

OTHERS $2 299 $2 687 $3 110 $3 548 $3 965 $4 444 $5 086 14%

RF $7 191 $9 231 $11 932 $14 678 $16 669 $20 190 $22 537 21%

RADARS $5 137 $6 671 $8 023 $8 801 $9 830 $10 753 $12 465 16%

3D SENSORS $1 873 $2 911 $4 045 $5 446 $7 215 $9 034 $14 034 40%

SPECTRAL SENSORS $399 $446 $490 $538 $587 $640 $698 10%

FINGERPRINT SENSORS $3 867 $3 977 $4 075 $4 431 $4 847 $5 204 $5 587 6%

GAS SENSORS $698 $751 $809 $863 $932 $1 017 $1 113 8%

MAGNETIC SENSORS $1 756 $1 880 $2 016 $2 167 $2 335 $2 522 $2 724 8%

CIS $13 362 $15 285 $17 033 $18 705 $19 978 $20 737 $21 524 8%

MEMS (excl. BAW) $9 407 $9 893 $10 660 $11 787 $12 948 $14 336 $15 952 9%

$0

$20 000

$40 000

$60 000

$80 000

$100 000

$120 000

US$

M

MEMS & Sensors forecast 2017-2023

SEMICONDUCTOR-BASED SENSORS AND ACTUATORS FORECAST, BY DEVICE IN US$M

“Others” includes fiber-optic sensors, particle sensors, new sensor developments (such as NEMS)

From $50+B in 2018 to $100+B in 2023!

The MEMS

and sensors

market will

reach $100B

in 2023



15

MEMS MARKET SIZE VS. CAGR

Market Size (US$M)

CA

GR

2017-2

32017 Market

value

2023 Market

value

5%

10%

15%

30%

50%

$1B$10M $100M $10B

Pressure $1.6B $2B

$1B $1.4BMicrophonesInertial MEMS $3.5B $4B

$730M $990MOptical MEMS

$660M $1BInfra red

$190M $440MMicrofluidics

$2.4BRF MEMS

$140MOscillators $2.2B

$15B

$70MEnvironmental MEMS $140M

RF MEMS and Oscillators are both

boosting the MEMS market in CAGR

and value.



16

2018 PLANE, CAR, SMARTPHONE SENSORS CONTENT


1 year for manufacturing

1-2 days for manufacturing

Few hours for manufacturing

5k sensors 50-100 sensors 10-20 sensors

Sensors value/system: 5%

Sensors value: $5M

Sensors

value/system: 2.5%Sensors value:

17

MEMS IS STILL AN INNOVATIVE TECHNOLOGY – STARTUPS TO FOLLOW

R&D center, Finland

MEMS hyperspectral

Israel, 2015

ADAS-based FIR camera

Austria, 2014

MEMS speakerUS, 2017

MEMS gas

chromatography/e-nose

Finland, 2016

MEMS resonator

US, 2013 – now TDK

MEMS ultra sound transducer

US, 2016

MEMS micro switch

US, 2014

MEMS OIS

US, 2009

Piezo microphone

US

MEMS FTIR

China, 2014

MEMS LidarFrance, 2014

IR MEMS emitter for gas

sensingUS, 2014

Ingestible sensor

NL, 2010 – now

Infineon

MEMS mirrors

US, 2013

MOEMS lidar

Israel, 2016

MEMS lidar

These MEMS startups are today paving the way to new type of MEMS

sensors and actuators: piezo MEMS, titaniumMEMS, FTIR, e-nose, ultra-

sounds and acoustic, FIR and hyperspectral, micro mirrors, switches,

resonators.

France, 2016

Ti MEMS for medical



18

2017 RANKINGS - TOP 30 MEMS PLAYERS

Broadcomclimbed from#2 in 2016 to #1 in 2017!

Important note: the repositioning of Amphenol, Denso, Sensata and Melexis is not because of the decrease ofbusiness but due to an updated estimation of their MEMS revenues at first level packaging only.

$910

$1

160

$630

$787

$585

$464

$420

$368

$343

$333

$202

$182 $244

$240

$229

$402

$215

$215 $

293

$112

$62 $

115

$80

$100

$211

$63

$72

$78

$53

$70

$1

411

$1

275

$757

$673

$626

$478

$415

$363

$349

$328

$320

$286

$262

$251

$246

$238

$215

$213

$148

$129

$128

$121

$109

$109

$90

$86

$81

$80

$76

$71

$0

$200

$400

$600

$800

$1 000

$1 200

$1 400

$1 600

2016 MEMS sales 2017 MEMS sales

Broadcom is now MEMS IDM number 1.



19

THE WHOLE STORY

$0,0

$200,0

$400,0

$600,0

$800,0

$1 000,0

$1 200,0

$1 400,0

$1 600,0

2009 2010 2011 2012 2013 2014 2015 2016 2017

US$

M

Different MEMS companies, different stories

ROBERT BOSCH

STMICROELECTRONICS

TEXAS INSTRUMENTS

BROADCOM

HEWLETT PACKARD

QORVO

KNOWLES ELECTRONICS



20

MEMS FOUNDRY RANKINGS

$174

$60

$50 $47$42 $40

$21 $21 $19 $19 $18 $18$14 $14

$10$6 $6 $6

$17

$160

$50

$41

$63

$38$42

$21 $20 $19 $18 $18 $15 $15 $12 $9 $10 $6 $6

$16

$0

$20

$40

$60

$80

$100

$120

$140

$160

$180

$200

2017 Sales 2016 Sales

Yole Developpement © May 2018

Only the MEMS foundry business is taken into account - *Players can also perform ASIC foundry which is not counted here



21

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Yole Développement

From Technologies to Market

Source: Wikimedia Commons


2©2018 | www.yole.fr | About Yole Développement

FIELDS OF EXPERTISE COVERED BY OUR 40+ ANALYSTS

MEMS & Sensors

Solid State Lighting(LED, OLED, …)

Compound Semi.

Imaging

Photonics

MedTech

Manufacturing

Advanced

Packaging

Batteries &

Energy Management

Power Electronics

Displays

RF

Devices &

Techno.

Advanced

Substrates

Software

Memory



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marketing analysis

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M&A with our partner)

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o Syndicated reports

• Market & technology reports

• Patent investigation and patent

infringement risk analysis

• Teardowns & reverse costing

analysis

• Cost simulation tool

www.i-Micronews.com/reports

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• i-Micronews.com website

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services

• Events: TechDays, forums,…

www.i-Micronews.com

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6 COMPANIES TO SERVE YOUR BUSINESS

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Cost simulation tools

www.systemplus.fr

Market, technology and strategy

consulting

www.yole.fr

IP analysis

Patent assessment

www.knowmade.fr

Innovation and business maker

www.bmorpho.com

Design and characterization of

innovative optical systems

www.piseo.fr

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o Yole Développement, System Plus Consulting, KnowMade and PISEO, all part of Yole Group of Companies, keep on increasing their collaboration to offer, in 2018, a

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REPORTS COLLECTION

www.i-Micronews.com

• MEMS & Sensors

• RF devices & technologies

• Imaging

• Medical technologies (MedTech)

• Photonics

• Advanced packaging

• Manufacturing

• Advanced substrates

• Power electronics

• Batteries and energy management

• Compound semiconductors

• Solid state lighting

• Displays

• Software

• Memory

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OUR 2018 REPORTS COLLECTION (1/3)

MEMS & SENSORS

o MARKET AND TECHNOLOGY REPORT – by Yole Développement

− Status of the MEMS Industry 2018 - Update

− Silicon Photonics 2018 - Update

− Consumer Biometrics: Sensors & Software 2018 - Update

− MEMS Pressure Sensors 2018

− Air Quality Sensors 2018

o REVERSE ENGINEERING & COSTING REVIEW – by System Plus Consulting

− Gas & Particles Sensors

− MEMS Pressure Sensors

− Piezo MEMS 2018 *

o PATENT ANALYSES – by KnowMade

− MEMS Microphone – Patent Landscape Analysis

RF DEVICES AND TECHNOLOGIES


− 5G impact on RF Front End Modules and Connectivity for Cellphones 2018 – Update

− RF GaN Market: Applications, Players, Technology, and Substrates 2018-2023 –Update

− Advanced RF System-in-Package for Cellphones 2018 – Update *

− Wireless technologies (Radar, V2X) for Automotive 2018

− RF Standards and Technologies for Connected Objects 2018

− RF & Photonic Components & Technologies for 5G Infrastructure 2018


− RF Front-End Modules in Smartphones

− RF GaN*


− RF Front End Module – Patent Landscape Analysis

− RF GaN – Patent Landscape Analysis

IMAGING & OPTOELECTRONICS


− Status of the CMOS Image Sensor Industry 2018 – Update

− Status of the Compact Camera Module and Wafer Level Optics Industry 2018 -Update

− 3D Imaging and Sensing 2018 - Update

− Machine Vision for Industry and Automation 2018

− Sensors for Robotic Vehicles 2018

− Imagers and Detectors for Security and Smart Buildings 2018

− LiDAR 2018: Market and technologies

o QUARTERLY UPDATE – by Yole Développement

− CMOS Image Sensors 2018 *


− CMOS Image Sensors

− Compact Camera Modules


− LiDAR – Patent Landscape Analysis

SOFTWARE


− Consumer Biometrics: Sensors & Software 2018 - Update− Processing Hardware and Software for AI 2018 – Vol. 1 & 2

Update : 2017 version still available / *To be confirmed



OUR 2018 REPORTS COLLECTION (2/3)ADVANCED PACKAGING


− Status of Advanced Packaging Industry 2018 - Update

− Status of Advanced Substrates 2018: Embedded Die and Interconnects, Substrate Like PCB Trends

− Fan-Out Packaging 2018 – Update*

− 3D TSV and Monolithic Business Update 2018 – Update

− Advanced RF System-in-Package for Cellphones 2018 – Update*

− Power Modules Packaging 2018 – Update

− Discrete Power Packaging 2018 – Update*

− Memory Packaging Market and Technology Report 2018 – Update*

− Status of Panel Level Packaging 2018

− Trends in Automotive for Advanced Packaging 2018

− Processing Hardware and Software for AI 2018 – Vol. 1 & 2

− Integrated Passive Devices (IPD) 2018


− RF Front-End SiP

− Fan-Out Packaging *


− Hybrid Bonding for 3D Stack – Patent Landscape Analysis

MANUFACTURING


− Wafer Starts for More Than Moore Applications

− Equipment for More than Moore: Technology & Market Trends for Lithography & Bonding/Debonding 2018

− Equipment for More than Moore: Technology & Market Trends for Thin Film Deposition & Etching 2018

− Polymeric Materials for wafer-level Advanced Packaging 2018


− Wafer Bonding Technology Overview 2018

MEMORY


− Emerging Non Volatile Memory 2018 – Update

− Memory Packaging Market and Technology Report 2018 – Update*

o QUARTERLY UPDATE – by Yole Développement**

− Memory Market 2018 (NAND & DRAM)

o MONTHLY UPDATE – by Yole Développement**

− Memory Pricing 2018 (NAND & DRAM)


− DRAM Technology & Cost Review 2018

− NAND Memory Technology & Cost Review 2018


− 3D Non-Volatile Memories – Patent Landscape Analysis

COMPOUND SEMICONDUCTORS

MARKET AND TECHNOLOGY REPORT – by Yole Développement

− Status of Compound Semiconductor Industry 2018*

− Power SiC 2018: Materials, Devices, and Applications - Update

− Power GaN 2018: Materials, Devices, and Applications – Update

− RF GaN Market: Applications, Players, Technology, and Substrates 2018-2023 –Update

− GaAs Materials, Devices and Applications 2018

− InP Materials, Devices and Applications 2018


− Power SiC Devices

− Power GaN Devices


− Power SiC – Patent Landscape Analysis

− Status of the GaN IP – Patent Watch 2018 & Patent Activity 2017

Update : 2017 version still available / *To be confirmed / ** Can not be selected within an Annual Subscription offer



OUR 2018 REPORTS COLLECTION (3/3)

POWER ELECTRONICS

MARKET AND TECHNOLOGY REPORT – by Yole Développement

− Status of Power Electronics Industry 2018 - Update

− Power Modules Packaging 2018 - Update

− Discrete Power Packaging 2018 – Update*

− Power Electronics for EV/HEV 2018 - Update

− Wireless Charging Market Expectations and Technology Trends 2018

− Integrated Passive Devices (IPD) 2018


− Power ICs Market 2018 – Update


− Power ICs Market 2018*

− Power Modules*

BATTERY AND ENERGY MANAGEMENT


− Solid State Electrolyte Battery 2018

− Li-ion Battery Packs for Automotive and Stationary Storage Applications 2018 -Update


− Solid-State Batteries – Patent Landscape Analysis

− Status of the Battery IP – Patent Watch 2018 & Patent Activity 2017

SOLID STATE LIGHTING


− IR LEDs and Lasers 2018: Technology, Industry and Market Trends - Update

− Automotive Lighting 2018: Technology, Industry and Market Trends - Update

− UV LEDs 2018: Technology, Industry and Market Trends - Update

− VCSELs 2018: Technology, Industry and Market Trends

− LiFi 2018: Technology, Industry and Market Trends


− VCSELs 2018

− UV LEDs 2018 *

DISPLAYS


− MicroLED Displays 2018 – Update

− Quantum Dots and Wide Color Gamut Display Technologies 2018 - Update

− Displays and Optical Vision Systems for AR / VR / MR 2018


− MicroLED Display – Patent Landscape Analysis

MEDTECH


− BioMEMS & Non Invasive Emerging Biosensors: Microsystems for Medical Applications 2018 - Update

− Point-of-Need Testing: Application of Microfluidic Technologies - Update

− Neurotechnologies and Brain Computer Interface 2018

− CRISPR-Cas9 Technology: From Lab to Industries 2018

− Ultrasound technologies for Medical, Industrial and Consumer 2018

− Inkjet Functional and Additive Manufacturing for Electronics 2018

− Liquid Biopsy 2018: From Isolation to Downstream Applications

− Chinese Microfluidics Industry 2018

− Scientific Cameras for the Life Sciences & Analytical Instrumentation Laboratory Markets 2018*


− Microfluidic IC Cooling – Patent Landscape Analysis

− Circulating Tumor Cell Isolation – Patent Landscape Analysis

− Organ-on-a-Chip – Patent Landscape Analysis

− OCT Medical Imaging – Patent Landscape Analysis

Update : 2017 version still available / *To be confirmed



OUR 2017 PUBLISHED REPORTS (1/3)MEMS & SENSORS


− Status of the MEMS Industry 2017

− High End Inertial Systems Market and Technology 2017

− Magnetic Sensors Market and Technologies 2017

− MEMS and Sensors for Automotive - Market and Technology Trends 2017

− Acoustic MEMS and Audio Solutions 2017

− Sensors and Sensing Modules for Smart Homes and Buildings 2017

− Fingerprint Sensor Applications and Technologies – Consumer Market Focus 2017

o REVERSE COSTING REPORT – by System Plus Consulting

− Continental SRL1: State-of-the-art LiDAR for Advanced Driver Assistance Systems –Reverse Costing Report

− Bosch Mobility Ultrasonic Sensor – Reverse Costing Report

− MEMS Packaging 2017 - Reverse Costing Review

− Bosch BMP380 Pressure Sensor – Reverse Costing Report

IMAGING & PHOTONICS


− Status of the CMOS Image Sensor Industry 2017

− 3D Imaging and Sensing 2017

− Uncooled Infrared Imaging Technology & Market Trends 2017

− Camera Module Industry Market and Technology Trends 2017


− FLIR Boson – a small, innovative, low power, smart thermal camera core – Reverse Costing Report

− Camera Module Physical Analyses Overview 2017

RF DEVICES AND TECHNOLOGIES


− RF Front End Modules and Components for Cellphones 2017

− Advanced RF System-in-Package for Cell Phones 2017

− 5G Impact on RF Front-End Industry 2017

ADVANCED PACKAGING


− Status of the Advanced Packaging Industry 2017

− Embedded Die Packaging: Technology and Market Trends 2017

− Fan-Out: Technologies and Market trends 2017

− Advanced Substrates Overview: From IC Package to Board 2017

− 3D TSV and 2.5D Business Update - Market and Technology Trends 2017

− Advanced RF System-in-Package for Cellphones 2017

− Memory Packaging Market and Technology Report 2017

− MEMS Packaging 2017

− Emerging Non-Volatile Memory 2017


− NVIDIA Tesla P100 - Reverse Costing Report

− MEMS Packaging - Reverse Technology Review

− Advanced RF SiP for Cellphones 2017 - Reverse Costing Review

SOFTWARE


− Embedded Software in Vision Systems

MEDTECH


− Status of the Microfluidics Industry 2017

− Solid-State Medical Imaging 2017

− Organs-On-Chips 2017

− Connected Medical Devices Market and Business Models 2017

− Artificial Organ Technology and Market analysis 2017

− Medical Robotics Technology & Market Analysis 2017



OUR 2017 PUBLISHED REPORTS (2/3)

MANUFACTURING


− Laser Technologies for Semiconductor Manufacturing 2017

− Equipment and Materials for 3D TSV Applications 2017

− Equipment and Materials for Fan-Out Packaging 2017

− Glass Substrate Manufacturing in the Semiconductor Field 2017

BATTERIES & ENERGY MANAGEMENT


− Status of the Rechargeable Li-ion Battery Industry

− Market Opportunities for Thermal Management Components in Smartphones

DISPLAYS


− MicroLED Displays

− Quantum Dots and Wide Color Gamut Display Technologies

− Phosphors & Quantum Dots 2017 - LED Downconverters for Lighting & Displays

SOLID STATE LIGHTING


− LED Packaging 2017: Market, Technology and Industry Landscape

− CSP LED Lighting Modules

− IR LEDS and VCSELs - Technology, Applications and Industry Trends

− LED Lighting Module Technology, Industry and Market Trends 2017

− Automotive Lighting: Technology, Industry and Market Trends 2017

− Horticultural LED Lighting: Market, Industry, and Technology Trends

POWER ELECTRONICS


− Status of the Power Electronics Industry 2017

− Thermal Management Technology and Market Perspectives in Power Electronics and LEDs 2017

− Gate Driver Market and Technology Trends 2017

− Power MOSFET 2017: Market and Technology Trends

− Power Module Packaging: Material Market and Technology Trends 2017

− IGBT Market and Technology Trends 2017


− Power Management ICs Market 2017


− EPC2045 100V GaN-on-Silicon Transistor – Reverse Costing Report

− Silicon Capacitor - Technology and Cost Review

− Industrial 100V MOSFET - Technology and Cost Review

− InvenSense ICM-20789: High Performance 6-Axis Motion Sensor and Pressure Sensor Combo – Reverse Costing Report

COMPOUND SEMICONDUCTORS


− Bulk GaN Substrate Market 2017

− RF Power Market and Technologies 2017: GaN, GaAs and LDMOS

− Power SiC 2017: Materials, Devices, Modules, and Applications

− Power GaN 2017: Epitaxy, Devices, Applications, and Technology Trends



OUR 2017 PUBLISHED REPORTS LIST (3/3)

OUR PARTNERS’ REPORTS

PATENT ANALYSES – by KnowMade

− Wireless Charging Patent Landscape Analysis

− RF Acoustic Wave Filters Patent Landscape Analysis

− NMC Lithium-Ion Batteries Patent Landscape Analysis

− Pumps for Microfluidic Devices Patent Landscape

− III-N Patent Watch

− FLUIDIGM Patent Portfolio Analysis

− Knowles MEMS Microphones in Apple iPhone 7 Plus Patent-to-Product Mapping 2017

− Consumer Physics SCiO Molecular Sensor Patent-to-Product Mapping

− Patent Licensing Companies in the Semiconductor Market - Patent Litigation Risk and Potential Targets

− Microfluidic Technologies for Diagnostic Applications Patent Landscape

TEARDOWN & REVERSE COSTING – by System Plus Consulting

More than 60 teardowns and reverse costing analysis and cost simulation tools published in 2017

MORE INFORMATION

o All the published reports from theYole Group of Companies are available on our website www.i-Micronews.com.

o Ask for our Bundle Subscription offers: With our bundle offer, you choose the number of reports you are interested in and select the related offer. You then haveup

to 12 months to select the required reports from the Yole Développement, System Plus Consulting and KnowMade offering. Pay once and receive the reports

automatically (multi-user format). Contact your sales team according to your location (see the last slide).

http://www.yole.fr/http://www.yole.fr/http://www.i-micronews.com/


MICRONEWS MEDIA

o About Micronews Media

To meet the growing demand for market,

technological and business information,

Micronews Media integrates several tools able

to reach each individual contact within its

network.We will ensure you benefit from this.

ON L I N E ON S I T E I N PE R S ON

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to reach global audiences.

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campaigns are great strategies

for improving your

product/brand visibility. They

are also an efficient way to

adapt with the demands of the

times and to evolve an effective

marketing plan and strategy.

Brand visibility, networking

opportunities

Today's technology makes it

easy for us to communicate

regularly, quickly, and

inexpensively – but when

understanding each other is

critical, there is no substitute

for meeting in-person.Events

are the best way to exchange

ideas with your customers,

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increasing your brand/product

visibility.

Targeted audience

involvement equals clear,

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Webcasts are a smart,

innovative way of

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Benefit from the i-Micronews.com

traffic generated by the 11,200+

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2018 on different topics to

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from an average of 340

registrants per webcast

Contact: Camille Veyrier ([email protected]), Marketing & Communication Project Manager

http://www.yole.fr/http://www.yole.fr/mailto:[email protected]


CONTACT INFORMATION

o CONSULTING AND SPECIFIC ANALYSIS, REPORT

BUSINESS

• North America:

• Steve LaFerriere, Senior Sales Director for Western US &

Canada

Email: [email protected] – + 1 310 600-8267

• Troy Blanchette, Senior Sales Director for Eastern US &

Canada

Email: [email protected] – +1 704 859-0453

• Japan & Rest of Asia:

• Takashi Onozawa, General Manager, Asia Business

Development (Korea, Singapore, India & ROA)

Email: [email protected] - +81 34405-9204

• Miho Othake, Account Manager (Japan)

Email: [email protected] - +81 3 4405 9204

• Itsuyo Oshiba, Account Manager (Japan)

Email: [email protected] - +81-80-3577-3042

• Greater China: Mavis Wang, Director of Greater China Business

Development


• Europe: Lizzie Levenez, EMEA Business Development Manager

Email: [email protected] - +49 15 123 544 182

• RoW: Jean-Christophe Eloy, CEO & President, Yole Développement

Email [email protected] - +33 4 72 83 01 80

o FINANCIAL SERVICES (in partnershipwith Woodside

Capital Partners)

• Jean-Christophe Eloy, CEO & President

Email: [email protected] - +33 4 72 83 01 80

• Ivan Donaldson, VP of Financial Market Development


o GENERAL

• Public Relations: [email protected] - +33 4 72 83 01 89

• Email: [email protected] - +33 4 72 83 01 80

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Status of the MEMS Industry 2018 - Yole Développement...o A view of future mega trends and impact...

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