STATUS IN THE CLEAN ROOM Device production Until 29-06-12
description
Transcript of STATUS IN THE CLEAN ROOM Device production Until 29-06-12
STATUS IN THE CLEAN ROOMDevice production
Until 29-06-12
CMP Litho+Etching #1(marks+crosses)
Litho+Etching #2 (channels)
Bonding Litho+Etching #3 (holes)
Dicing @ CERN
3961 14.05.12 23.05.12
3772 14.05.12 15.05.12
3850 14.05.12 15.05.12 23.05.12 29.05.12 29.05.12 30.05.12
3917 14.05.12 15.05.12 23.05.12 29.05.12 29.05.12 30.05.12
3776 14.05.12 15.05.12 15.05.12 16.05.12 23.05.12 23.05.12
20478 7.06.12 7.06.12 8.06.12 Problems after the piranha…
20476 No (BS not polished) 8.06.12 22.06.12 28.06.12(mask 1+ mask 3)
28.06.12 29.06.12
LHCb – Snake design
525 um thick! SS polished
NA62 – Frame 2Litho+Etching #1(marks+crosses)
Litho+Etching #2 (channels)
Bonding Litho+Etching #3 (holes)
Dicing @ CERN
3448 24.04.12 29.05.12 29.05.12 30.05.12 01.06.12 05.06.12
3625 24.04.12 29.05.12 01.06.12 04.06.12 Ready for dicing
3645 23.05.12
3446 23.05.12
3627 23.05.12
3624 23.05.12
20473 No 12.06.12 12.06.12 12.06.12(mask 1+ mask 3)
12.06.12 13.06.12
20474 No 12.06.12 26.06.12 28.06.12(mask 1+ mask 3)
28.06.12Ready for dicing
Oxide +Nitride....
525 um thick! SS polished
20475 and 20477 broken!
2 devices glued from Jerome
Channels too deep
NA62 – Frame 3 – new masks
Channels: 300 x 100um + 50um walls
Litho+Etching #1(marks+crosses)
Litho+Etching #2 (channels)
Bonding Litho+Etching #3 (holes)
Dicing @ CERN
20471 26.06.12Ready for etching
20470 28.06.12 28.06.12 28.06.12(mask 1+ mask 3)Ready for etching
NA62 – Frame 3
525 um thick! SS polished
NA62 – Pillars test
Litho+Etching #1 Bonding @ CERN
20472 22.06.12(70 µm of etching)
26.06.12 27.06.12
Filling with Araldite 2020
STRANGE BEHAVIOURTime (s) Temperature (°C) Voltage (V) Current (mA)
0 350 0 0 350 1163 2.0
23 min 350 1163 1.3 (stable) 350 997 0.7 (stable) 350 0 0
27 min 0
New one to be made!
NA62 – Dual Pyrex
New masks:- Add alignment objects- Position of the flats ?