Stage VII : March 1 st 2004 COMPONENT LAYOUT

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Team W1 Team W1 Design Manager: Rebecca Miller Design Manager: Rebecca Miller 1. Bobby Colyer (W11) 1. Bobby Colyer (W11) 2. Jeffrey Kuo (W12) 2. Jeffrey Kuo (W12) 3. Myron Kwai (W13) 3. Myron Kwai (W13) 4. Shirlene Lim (W14) 4. Shirlene Lim (W14) Stage VII Stage VII : : March 1 March 1 st st 2004 2004 COMPONENT LAYOUT COMPONENT LAYOUT Presentation #7: Rijndael Presentation #7: Rijndael Encryption Encryption Overall Project Objective: Implement the new AES Rijndael algorithm on chip 18-525 Integrated Circuit Design Project

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Presentation #7: Rijndael Encryption. Team W1 Design Manager: Rebecca Miller 1. Bobby Colyer (W11) 2. Jeffrey Kuo (W12) 3. Myron Kwai (W13) 4. Shirlene Lim (W14). Stage VII : March 1 st 2004 COMPONENT LAYOUT. Overall Project Objective: Implement the new AES Rijndael algorithm on chip. - PowerPoint PPT Presentation

Transcript of Stage VII : March 1 st 2004 COMPONENT LAYOUT

Page 1: Stage VII :  March 1 st  2004 COMPONENT LAYOUT

Team W1Team W1Design Manager: Rebecca MillerDesign Manager: Rebecca Miller

1. Bobby Colyer (W11)1. Bobby Colyer (W11)2. Jeffrey Kuo (W12)2. Jeffrey Kuo (W12)3. Myron Kwai (W13)3. Myron Kwai (W13)4. Shirlene Lim (W14)4. Shirlene Lim (W14)

Stage VIIStage VII: : March 1March 1stst 2004 2004

COMPONENT LAYOUTCOMPONENT LAYOUT

Presentation #7: Rijndael Presentation #7: Rijndael EncryptionEncryption

Overall Project Objective:Implement the new AES Rijndael algorithm on

chip

18-525 Integrated Circuit Design Project

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StatusStatus

Design Proposal Architecture Proposal Size Estimates/Floorplan Gate Level Design Layout

Component Layout Simulations

To be Done Top Level Routing Optimizations Everything else…

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Design Decisions & Design Decisions & ProblemsProblems

DECISIONSSplit ROM

Added logic because of split romSplit into 4 sub-ROMs

PROBLEMSTiming problems Routing Problems – Global LevelSizing of DFF to get equal rise and fall times

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Implementing Rijndael Encryption on Chip with Implementing Rijndael Encryption on Chip with this in mind:this in mind:

– Throughput– Speed

• At least 350 Mhz

–Size•As dense as possible while maintaining a ratio of 1:1

Project Goals & ObjectivesProject Goals & Objectives

18-525 Integrated Circuit Design Project

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On-Chip Encryption to be used in:On-Chip Encryption to be used in:– Web servers

•High through put for passing through information•Hardware encryption generally 10-100x faster than software•Security of a private key greater if stored in hardware

–Software keys can be hacked, stolen and used elsewhere

Project Goals & ObjectivesProject Goals & Objectives

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TOP

LEVEL

SCHEMATIC

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Updated Floorplan325 um x 330 um

Metal 3

Metal 2

Metal 1

Metal 4

SBOX and Control Logic

Text DFFs and Add RoundKey

5th Round Key Expand

Input to SBOX Logic & SelectOutput and Input Logic

4 Rounds of Key Expand

4 Rounds of Round Permutation

Input/Output Logic

CLKDivider

Select & Input Logic

SBOX and Control LogicFinal Text Out

Key DFFs and Input Logic

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METAL 1

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METAL 2

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METAL 3

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METAL 4

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POLY

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LAYOUT – NO METAL

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LAYOUT – Buses

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Clock Divider

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Add Round Key

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DFF Input

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S-box Mux Tree In

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Demux 20

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S-box Mux Tree Out

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Final Text Output

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Round Permutation

&

DFF

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Key Expand & DFF

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S-box Mux Tree Out

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DFF Input Key

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Demux 10

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S-BOX - ROM

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D-FLIP FLOP LAYOUT

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Waves D-FlipFlop Fall Time

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624.832 ps

531.818p

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Waves D-FlipFlop Rise Time

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1.08073 ns

502.778p

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Waves D-FlipFlop Propagation Time

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1.15726 ns

416.542p

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DFF Setup Time

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174.371 ps

408.723p

100.237p

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ROM Propogation Time

408.723p

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Critical Path

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245.367 ps

1.03n

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More on Critical PathMore on Critical Path

• Must include the setup time for DFF • Actual Critical Path is about 1.2n• Must double it as this logic only occurs on negative edge of clock• Speed Estimation: 417MHz

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Questions?Questions?

18-525 Integrated Circuit Design Project