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2.5’’ SSD Low Profile

Preliminary Evaluation

PDR

Maxim Birger

Nov 2011

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Capacity and Mechanical evaluation

Performance evaluation

Input Power Path and Fault Condition Supply

Agenda

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2.5’’ Form Factor, Low Profile 7mm thickness

400GB/800GB SKUs

Chipset

Boss MSP6001

MCP (MSP2025 + Hynix F20B ODP/QDP)

DDR3 SDRAM (Gen2)

Power

Operation from 5V/12V supply

BUCK regulators with integrated inductors

Fault condition power source

Features (preliminary)

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800GB Configuration

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400GB – Configuration 1

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400GB – Configuration 2

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Connectivity – SSD mode (SHC like)

/8/ToggleFlash

MSP2025

/8/

Master Channel

Slave Channel

/8/ Flash

Flash

Flash

Internal

I/F

Internal

I/F

100MHz,

200MBPs

One Channel Connectivity

/8/ToggleFlash

MSP2025

/8/

Master Channel

Slave Channel

/8/ Flash

Flash

Flash

Internal

I/F

Internal

I/F

100MHz,

200MBPs

Two Channels Connectivity

Toggle/8/

100MHz,

200MBPs

Boss

Boss

Channel 1

Channel 1

Channel 2

8 x CE

1 x RnB

8 x CE

1 x RnB

8 x CE

1 x RnB

8 x CE

1 x RnB

SSD mode (SHC like)

Single host channel

operation

Reduced layout

complexity – single

MCP connection

Boss and MSP2020

support mixed-mode

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SHC vs. BHC

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Performance

Boss IO external limitations based on throughput calculations

Board layout and load capacitance not taken into consideration

800GB 400GB 400GB

MCPPackage MSP2025 + F20 ODP MSP2025 + F20 ODP MSP2025 + F20 QDP

MCP # 16 8 16

FlashDie size 8GB 8GB 8GB

Die # (per 2 ch) 8 8 4

SSD configuration 16x (8x8GB) MCP = 1024GB 8x (8x8GB) MCP = 512GB 16x (4x8GB) MCP = 512GB

Internal channel clock/data rate

ASYNC SDR 80MHz/ 80MBps

SYNC DDR SE 166MHz/ 333MBps

SYNC DDR2 DIFF 200MHz/ 400MBps

External channel configuration 2x (8x8GB) MCP = 128GB 1x (8x8GB) MCP = 64GB 2x (4x8GB) MCP = 64GB

PPN1.5/MSP channel limitationDDR Diff + Vref 166MHz/333MBps

DDR SE, no Vref 100MHz/200MBps

MSP external limitations -Single channel

Seq. read 200MBps 200MBps 200MBps

Seq. program 152MBps ? 152MBps ? 160MBps ?

CC 84MBps ? 84MBps ? 112MBps ?

SSD overall througputon external

Seq. read 1.6GBps 1.6GBps 1.6GBps

Seq. program 1.2GBps 1.2GBps 1.28GBps

SSD overall througput on SATA

Seq. read

Gen2 performanceSeq. program

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Mechanics – 800GB/ 400GB-2

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Mechanics – 400GB-1

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Main and Fault Condition Power

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Fuse – Short circuit protection

Sense resistor – OVC protection

Charge voltage/current meter – OV/UV detection

Regulators control

Discharge circuit

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Cap module features

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Constant Power Load Discharge

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Drive power consumption = 6W (0.12 - 0.18 joule)

Time to shutdown = 20ms < t < 30ms

14

Energy vs. Capacitance

Time to

shutdown

Energy Charge voltage Capacitance

20ms 0.14 joule 40V 189µF

20ms 0.14 joule 50V 118µF

30ms 0.21 joule 40V 284µF

30ms 0.21 joule 50V 177µF

Calculation based on ESR value of 0.68Ω, and Buck efficiency 85%

Calculation doesn’t take spare energy into consideration

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Aluminum Electrolytic Caps

Tantalum Fused Caps – Availability issues in low profiles

Ceramic Caps – Area consuming (Not a good option!)

ASMLC – Custom Lead and Packaging ceramic Caps

Various dielectrics – Expensive, min. q-ty and long L/T

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Form Factor Energy sources

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Available Caps

Manuf. P/N CAP [μF] TOL [%] VDC [V] ESR [ohm] DielectricøD [mm]

L xW [mm] H [mm]

Panasonic EEEFT1H470AP 47 ±20% 50 0.68 Electrolytic 6.3 5.8±0.3

CDE CornellAVES226M50D16T-F 22 ±20% 50

9(1 total) Electrolytic 6.3±0.5 5.3±0.2

Surge 47 ±20% 50V Electrolytic 8±0.5 5±1

XICON L50V33 33 ±20% 50V Electrolytic 8 ±1 5 ±0.5

http://www.cde.com/catalog/alum/#radial_leaded

www.xicon-passive.com

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Expected Lifetime:

~2 years @ 75°C

~3.5 years @ 65°C

~5 years @ 60°C

Capacitance vs. Size efficiency

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Aluminum Electrolytic - Panasonic

47uF/50V

6.3x5.8

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TBD

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Aluminum Electrolytic - CDE

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Capacitor physical size and life time

Performance

Capacitor module – open circuit detection

Cost

19

Open Issues

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Thank you!