SPECIFICATION OF ELECTRET CONDENSER MICROPHONE ( … · 1. INTRODUCTION This specification shall be...

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BEST SOUND ELECTRONICS Approved Version 1.1 1 Analog SMD Microphone Specification Version 1.1 BSE CO., LTD 58B-4L, 626-3, GOZAN-DONG, NAMDONG-KU INCHON-SI. KOREA TEL :(8232) 550-1780 FAX :(8232) 554-6206 4 0 5 8 1 7 - MODEL NO. : (S)SOB-413S42-VRC DIRECTIVITY : OMNI-DIRECTIONAL CONFIDENTIAL SPECIFICATION OF ELECTRET CONDENSER MICROPHONE ( Ramone ) Prepared Checked Approved Name Sign. Prepared Checked Approved Name J.M.Kim C.W.Kim C.D.Song Sign. BSE NOKIA

Transcript of SPECIFICATION OF ELECTRET CONDENSER MICROPHONE ( … · 1. INTRODUCTION This specification shall be...

Page 1: SPECIFICATION OF ELECTRET CONDENSER MICROPHONE ( … · 1. INTRODUCTION This specification shall be applied to SMD (Surface Mounting Device) ECM (Electret Condenser Microphone) which

BEST SOUND ELECTRONICSApprovedVersion 1.1

1Analog SMD Microphone Specification Version 1.1

BSE CO., LTD

58B-4L, 626-3, GOZAN-DONG, NAMDONG-KUINCHON-SI. KOREATEL :(8232) 550-1780FAX :(8232) 554-6206

4 0 5 8 1 7-

MODEL NO. : (S)SOB-413S42-VRCDIRECTIVITY : OMNI-DIRECTIONAL

CONFIDENTIA

L

SPECIFICATION OF ELECTRET CONDENSER MICROPHONE

( Ramone )

Prepared Checked Approved

Name

Sign.

Prepared Checked Approved

Name J.M.Kim C.W.Kim C.D.SongSign.

BSE

NOKIA

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SPECIFICATION HISTORY

Version Date Status Handled by Comments

0.1 April, 23,08 draftQ.A. : B.W.SeoM.E.: C.W.KIMA.E.: J.M.KIM

0.2 June,19,08 draftQ.A. : B.W.SeoM.E.: C.W.KIMA.E.: J.M.KIM

Add the packing spec.

0.3 Jan,09,09 draftQ.A. : B.W.SeoM.E.: C.W.KIMA.E.: J.M.KIM

Packing spec. form changed

0.4 Jan,12,09 draftQ.A. : B.W.SeoM.E.: C.W.KIMA.E.: J.M.KIM

Spacer material changed

0.5 Jan,22,09 ApprovedQ.A. : B.W.SeoM.E.: C.W.KIMA.E.: J.M.KIM

Frequency Mask spec.Changed.

1.0 April, 30,09 ApprovedQ.A. : B.W.SeoM.E.: C.W.KIMA.E.: J.M.KIM

Packing spec changed.(Pocket size : Φ4.10⇒Φ4.15)

1.1 Jan.08,10 ApprovedQ.A. : B.W.SeoM.E.: C.W.KIMA.E.: J.M.KIM

Packing spec added.(vacuum sealing)

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3. Electro-Acoustic CharacteristicsTemp. = 23 ± 2 Room Humidity = 65 ± 5 %

1. INTRODUCTION This specification shall be applied to SMD (Surface Mounting Device) ECM (Electret Condenser Microphone) which has endurablereflow temperature.

2. MODEL NO.(S)SOB-413S42-VRC

4. STRUCTURE OF OMNI-DIRECTIONAL MICROPHONE

LimitsNO. Parameter Symbol Condition

Min. Center Max.

5 Noise Floor ( IRN Max.)No electro-magnetic interference,No acoustic stimulation 36 SPL

7 Operating Voltage 1.1 V

8 Maximum input S.P.L.THD<10%

(microphone including bias resistor) 120

Unit

1 Sensitivity ( after 2×reflow) S f=1, S.P.L =1Pa, 0=1V/Pa -45 -42 -39

2 Output impedance ZOUT f= 1 1.4 1.8 2.2

3 Current Consumption IDSS VCC=2.0V , RL = 2.2 500

4 Signal to Noise Ratio S/N f=1, S.P.L =1Pa (A-Weighted ) 58

6 Decreasing Voltage ΔS-VS VCC=2.0V to 1.5V -46 -43 -40

Diaphragm (Ni or Au coating)

Case (Au coating)

PCB (IC)

BASE2

Spacer

Back Electret

BASE1

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6. TYPICAL FREQUENCY RESPONSE CURVE

- Far Field Measurement Condition (microphone unit only)

Temperature : 23 ± 2 Bias Voltage : 2.0V ( with 2.2 series resistor )Acoustic stimulus : 1Pa ( 94 SPL at 1 ) at 50 from the loud-speaker.

The loud-speaker must be calibrated to make a flat frequency response input signal Position : The frequency response of microphone unit measured at 50 from the loud-speaker

1 0 0 1 0 0 0 1 0 0 0 0- 1 0

- 8

- 6

- 4

- 2

0

2

4

6

8

1 0

]

5. MEASUREMENT CIRCUIT

IC 1

2

ECM Unit

MIC.CASE

Terminal 2

Terminal 1

RL

C

1

Output

Power Supply Vs

Earth

RL:2.2 (external resistance)

C1

R

Varistor

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7. MECHANICAL CHARACTERISTICS

7.1 MICROPHONE

7.2 MATERIAL LIST FOR MICROPHONE

1.3±0.1

4.0±

0.1

# Parts Sub-parts Substances or Grade

FRP R1566W, Panasonic

FET TF252C, Sanyo

MLCC 3.3nF, size0603

Varistor 15pF, size0603

Resistor 330Ω , size 0603,

3 BASE2 Metal Brass + Ni & Au plating

Film PTFE film

Membrane PPS film + Au sputtered layer

PWB

BASE1

Back-Electrets

Spacer

1

Diaphragm

Case

SAC305

2

Solder

Insulator

Metal

Film

PA6T

Metal

German Silver + Ni plating 4

Phosphor Bronze(C5210-SH) + Ni plating6

7 Metal Brass(C2680 1/4H) + Ni & Au plating

5 PI

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8. RELIABILITY TEST

Item Test Method andconditions

Duration EvaluationStandard

8.1 Low storage Temperature

-40Temp.change 1/min

168h The sensitivity difference shall be within ± 3 from initial sensitivity. Measurements to be taken after 2h recovery time at ambient condition

8.2 Dry heatstorage

+85 Dry Heat.Temp. change 1/min

168h The sensitivity difference shall be within ± 3 from initial sensitivity. Measurements to be taken after 2h recovery time at ambient condition

8.3 Cold Operation

Sen. Measurement at-30 Temp. change 1/min

168h The sensitivity difference shall be within ± 3 from initial sensitivity.Measurement must be done when the temperature is –30or measured within 60 seconds of removal fromLow temperature

8.4 Dry HeatOperation

Sen. Measurement at+70 Temp. change 1/min

168h The sensitivity difference shall be within ± 3 from initial sensitivity.Measurement must be done when the temperature is +70or measured within 60 seconds of removal fromhigh temperature.

8.5 Chang of Temperature

-40/+85 change time<3minBut long enough so thatthe change can not be considered as a temperature shock.

100cycles,1cycle 30+30min

The sensitivity difference shall be within ± 3 from initial sensitivity.Measurements to be taken after 2h recovery time at ambient condition

8.6 Damp Heat Cyclic

+25/+55 90 to 95RH 6cycles, 1cycle: 24hr The sensitivity difference shall be within ± 3 from initial sensitivity. Measurements to be taken after 2h recovery time at ambient condition

8.7 Free fall Durability The part in its test box is dropped onto concrete from 1.5m height:1. Two times on each side (2×6).2. One drop from each edge (1×12)3. Two drops from each corner(2×8)

1.5m (12+12+16) dropsOnto concrete Total of 40 drops on each unit

The sensitivity difference shall be within ± 3 from initial sensitivity.

8.8 Impact Durability( Free fall repeated)

The part in its test box is dropped 300 times onto the steel base from 1m height , with checks initially and after Every 50 drops.:

300 drops, 1m height,Checks initial and afterEvery 50 drops

The sensitivity difference shall be within ± 3 from initial sensitivity.

8.9 Durability tocombinedEnvironment

Combined environment conditions1. Temp.cycling –30/70, 1h

dwell times, 2h cycle time 2. Random free fall ( 50drops)3.Damp heat cycle, 20/50%RH to

75/75%RH, 1h dwell and constanttimes, 4h cycle time

4. Random free fall ( 50drops)

1. Free fall1m

2. Temp. cycling120 cycles ( 240h)

3. Damp heat cycle50 cycles (200h)

- Recovery time 2h

The sensitivity difference shall be within ± 3 from initial sensitivity.Measurements to be taken after 2h recovery time at ambient condition

8.10 ElectrostaticDischarge

The microphone under test must be discharged between each ESD exposure with ground. ( contact : ± 8,air : ± 15)

10 exposure toEach pole whileThe other pole isgrounded

Normal operation after test.

8.12 DC Voltage · 6 VDC is applied to the Vs and ground pins of the microphone for 5 hours· Power supply output impedance should be 500 mΩ, current limited to 5 A

For 5 hoursOnce

No smoke or fire must occur

8.11 EMC RF immunity level is below 35relative to the reference level in the frequency range 10-2.1

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9. Environmental Characteristics for Acoustic Specification

Item Min Typ Max Unit

Operating temperature range -30 +70

Storage temperature range -40 +85

Relative humidity 25 85 %

Air Pressure 860 1060 mBar

10. Reflow Soldering Profile

Parameter Specification Parameter Specification

Average temp. gradientin preheating

2.5/s Time above 250

Peak temp. in reflow

Temp. gradient in cooling

Soak time 2-3 minutes

Max. 10 s

255(-0/+5)

Max. –5/ sTime above 217 Max. 60 s

Time above 230 Max. 50 s

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11. MEASUREMENT SYSTEM

4231 Sound Calibrator

K8127System Program

GPIB

Desk-jetColor Printer

2012 Audio Analyzer

Power Amplifier

Controller

Turn-table

Loud-speaker

(Input S.P.L : 94dB 1V/Pa)

Basic circuit

50

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11 MECHANICAL DIMENSION

11.1 Microphone Capsule

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12 . Packaging

12.1 Structure Ⅰ

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12.1 Structure Ⅱ

Page 12: SPECIFICATION OF ELECTRET CONDENSER MICROPHONE ( … · 1. INTRODUCTION This specification shall be applied to SMD (Surface Mounting Device) ECM (Electret Condenser Microphone) which

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12.1 Structure III