SPD general meeting

Pixel bus and Pilot MCMIntegration

CERN October 8, 2002

8/10/2002 Michel Morel EP/ED 2

1. PIXEL BUS AND PILOT MCM CONNECTIONS

2. PIXEL BUS, PILOT MCM and EXTENDERS CONNECTIONS

3. PIXEL BUS PROTOTYPE PRODUCTION

4. BONDING WIRE TESTS

5. STATUS OF PCB

6. CONCLUSION

8/10/2002 Michel Morel EP/ED 3

400µ

240µ

500µ

DETECTOR

PIXEL CHIP

SMDCOMPONENTS

0402

MCM

SMDCOMPONENTS

0402 Digital pilot

LASERDIODE

PIXEL CARRIER

PIXEL CARRIER

EXTENDER 1

EXTENDER 2

GLOB TOP

COOLING TUBE 100µ

1.2mm

350µ

LASER DIODE 500

PIXEL BUS AND PILOT MCM CONNECTIONS

8/10/2002 Michel Morel EP/ED 4

400µ

240µ

500µ

DETECTOR

PIXEL CHIP

SMDCOMPONENTS

0402

MCM

SMDCOMPONENTS

0402 Digital pilot

LASERDIODE

PIXEL CARRIER

PIXEL CARRIER

EXTENDER 1

EXTENDER 2

GLOB TOP

COOLING TUBE 100µ

1.2mm

350µ

LASER DIODE 500

PIXEL BUS AND PILOT MCM CONNECTIONS

8/10/2002 Michel Morel EP/ED 5

Glob top

400µ

240µ

500µ

DETECTOR

PIXEL CHIPMCM

Analog PilotPIXEL CARRIER

COOLING TUBE

PIXEL BUS AND PILOT MCM CONNECTIONS

500µ

SDM comp

LASER DIODE 500

8/10/2002 Michel Morel EP/ED 6

15.0013.00

0.30

PIXEL_BUS

0.30

ANALOGPILOT

PIXEL BUS AND PILOT MCM CONNECTIONS

Top view

LASER DIODE 500

8/10/2002 Michel Morel EP/ED 7

PIXEL BUS, PILOT MCM and EXTENDERS CONNECTIONS

Pixel Bus

Pixel chipLadder Pilot MCM

15.00 50.00 50.00

ladders HVTemperature monitoring

Sense +

Sense -

MCM 2.5VSense +

Sense -

Pixel chips 1.8V

Laser diode

Laser diode

Laser diode

8/10/2002 Michel Morel EP/ED 8

VDD

Copper

Kapton1(top)

PIXEL__EXTENDERS if VDD=VDDA=VTT=VTTA=1.8V

Cross section

Cover-lay

50µm

100µm

~50µm

Top view

Kapton2 (bottom)

GND

Pixel_carrier

Sense+VDD

12

mm

Sense-GND

I=7A DDP=102mVP(half stave) = 715mWP(half detector) = 42.9W

GND VDD=1.8V

8/10/2002 Michel Morel EP/ED 9

EXTENDERS WITH CABLES

1m

Cable AWG 10:• diameter 2.79mm• area 4.6mm²• weight 41.49 g/m• Rmax 0.4/100m

Ddp at 7A = 56mVP(half stave) = 392mWP(half detector) = 24W

8/10/2002 Michel Morel EP/ED 10

Pixel_bus prototype production

EpoxyAl

Cu (base)

LASER DIODE 500

8/10/2002 Michel Morel EP/ED 11

EpoxyAl

Cu (base)

300µm

Pixel_bus prototype production

8/10/2002 Michel Morel EP/ED 12

Epoxy (5)Al

Cu (base)

!

Pixel_bus prototype production

8/10/2002 Michel Morel EP/ED 13

Epoxy

Al

Cu (base)

Kapton

Pixel_bus prototype production

8/10/2002 Michel Morel EP/ED 14

Epoxy

Al

Cu (base)

300µm

Kapton

300µm

Pixel_bus prototype production

8/10/2002 Michel Morel EP/ED 15

Epoxy

Al

Cu (base)

300µm

Kapton

!

Cu xCu y

Pixel_bus prototype production

8/10/2002 Michel Morel EP/ED 16

PIXEL BUS CROSS SECTION

Glue 5µ

Kapton 8µ

Liquid Polyimide 8µm

280µm

Cu 5µ +Ni/Au (1µm)

Cu 10µ + Ni/Au (1µm)1) AGND 50µm

2) VDDA 30µm

3) Horizontal lines

4) vertical lines

5) VDD 15µm

6) GND 50µm

7) Resistors + capacitors pads+ Fastor

Aluminium

8/10/2002 Michel Morel EP/ED 17

Cu (base)

BONDING WIRE TESTS

8/10/2002 Michel Morel EP/ED 18

Cu (base)

9~10g

BONDING WIRE TESTS

8/10/2002 Michel Morel EP/ED 19

Cu (base)

Al

BONDING WIRE TESTS

Al (99%) + Si (1%)

1g!

8/10/2002 Michel Morel EP/ED 20

Status of PCB

• Pixel_carrier_B.

• Pixel carrier interface.

• Pilot MCM.

• Pilot MCM daughter card.

8/10/2002 Michel Morel EP/ED 21

Pilot MCM daughter card

8/10/2002 Michel Morel EP/ED 22

CONCLUSION

• Power supplies modifications should be finalized ASAP.• PIXEL BUS in production: 10 normal, 10 mirror.• First mirror bus mounted on PIXEL interface end of October• PILOT MCM will be assembled this month (October 2002) and mounted on the daughter card interface.