SOP8 Plastic-Encapsulate MOSFETS sop-8 A-2.pdf · SOP8 SOP8 Plastic-Encapsulate MOSFETS CJQ6601...

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SOP8 SOP8 Plastic-Encapsulate MOSFETS CJQ6601 P-channel and N-channel Complementary MOSFETS DESCRIPTIONS The Device uses advanced trench technology to provide excellent R DS(ON) and low gate charge. The complementary MOSFETs form a high-speed power inverter, suitable for a multitude of applications. FEATURES Including a N-ch CJ3400 MOS and a P-ch CJ3401 MOS (independently) in a package Surface mount package Low R DS(on) APPLICATIONS Suitable for a multitude of applications. High-speed power inverter MARKING: EQUIVALENT CIRCUIT Q6601= Device code Solid dot=Pin1 indicator Solid dot = Green molding compound device, if none, the normal device Front side YY=Date Code MAXIMUM RATINGS (T a =25unless otherwise noted) Value Symbol Parameter N-ch MOS P-ch MOS Unit VDS Drain-Source Voltage 30 -30 V VGS Gate-Source Voltage ±12 ±12 V ID Drain Current -Continuous(Note1) 5.8 -4.2 A IDM Drain Current - Pulse(Note3) 23.2 -16.8 A Power Dissipation, Temperature and Thermal Resistance PD Power Dissipation 1.4 W RθJA Thermal Resistance from Junction to Ambient 89 /W Tj Junction Temperature 150 Tstg Storage Temperature -55~+150 TL Lead Temperature 260 S1 G1 S2 G2 D2 D2 D1 D1 1 2 3 4 5 6 7 8 1 Rev. - 1.0 www.jscj-elec.com JIANGSU CHANGJING ELECTRONICS TECHNOLOGY CO., LTD

Transcript of SOP8 Plastic-Encapsulate MOSFETS sop-8 A-2.pdf · SOP8 SOP8 Plastic-Encapsulate MOSFETS CJQ6601...

SOP8

SOP8 Plastic-Encapsulate MOSFETS

CJQ6601 P-channel and N-channel Complementary MOSFETS

DESCRIPTIONS The Device uses advanced trench technology to provide excellent

RDS(ON) and low gate charge. The complementary MOSFETs form a high-speed power inverter, suitable for a multitude of applications.

FEATURES Including a N-ch CJ3400 MOS and a P-ch

CJ3401 MOS (independently) in a package Surface mount package Low RDS(on)

APPLICATIONS Suitable for a multitude of applications. High-speed power inverter

MARKING: EQUIVALENT CIRCUIT

Q6601= Device code

Solid dot=Pin1 indicator

Solid dot = Green molding compound device,

if none, the normal device

Front side YY=Date Code

MAXIMUM RATINGS (Ta=25 unless otherwise noted)

Value Symbol Parameter

N-ch MOS P-ch MOS Unit

VDS Drain-Source Voltage 30 -30 V

VGS Gate-Source Voltage ±12 ±12 V

ID Drain Current -Continuous(Note1) 5.8 -4.2 A

IDM Drain Current - Pulse(Note3) 23.2 -16.8 A

Power Dissipation, Temperature and Thermal Resistance

PD Power Dissipation 1.4 W

RθJA Thermal Resistance from Junction to Ambient 89 /W

Tj Junction Temperature 150

Tstg Storage Temperature -55~+150

TL Lead Temperature 260

S1 G1 S2 G2

D2D2D1D1

1 2 3 4

5678

1 Rev. - 1.0www.jscj-elec.com

JIANGSU CHANGJING ELECTRONICS TECHNOLOGY CO., LTD

N-channel MOSFET ELECTRICAL CHARACTERISTICS (Ta=25 unless otherwise specified) Parameter Symbol Test conditions Min Typ Max Unit

STATIC PARAMETERS

Drain-source breakdown voltage V (BR)DSS VGS =0V, ID=250µA 30 V

Zero gate voltage drain current IDSS VDS =24V,VGS = 0V 1 µA

Gate-body leakage current IGSS VGS =±12V, VDS = 0V ±100 nA

Gate threshold voltage (note 1) VGS(th) VDS =VGS, ID =250µA 0.7 1.4 V

VGS =10V, ID =5.8A 35 mΩ

VGS =4.5V, ID =5A 40 mΩ Drain-source on-resistance(note 1) RDS(on)

VGS =2.5V, ID =4A 52 mΩ

Forward transconductance(note 1) gFS VDS =5V, ID =5A 8 S

Diode forward voltage(note 1) VSD IS=1A, VGS = 0V 1 V

DYNAMIC PARAMETERS (note 2)

Input Capacitance Ciss 1050 pF

Output Capacitance Coss 99 pF

Reverse Transfer Capacitance Crss

VDS =15V,VGS =0V,f =1MHz

77 pF

SWITCHING PARAMETERS (note 2)

Turn-on delay time td(on) 5 ns

Turn-on rise time tr 7 ns

Turn-off delay time td(off) 40 ns

Turn-off fall time tf

VGS=10V,VDS=15V,

RL=2.7Ω,RGEN=3Ω, ID=0.5A

6 ns

P-channel MOSFET ELECTRICAL CHARACTERISTICS (Ta=25 unless otherwise specified)

STATIC PARAMETERS

Drain-source breakdown voltage V (BR)DSS VGS =0V, ID=-250µA -30 V

Zero gate voltage drain current IDSS VDS =-24V,VGS = 0V -1 µA

Gate-body leakage current IGSS VGS =±12V, VDS = 0V ±100 nA

Gate threshold voltage (note 1) VGS(th) VDS =VGS, ID =-250µA -0.7 -1.3 V

VGS =-10V, ID =-4.2A 65 mΩ

VGS =-4.5V, ID =-4A 75 mΩ Drain-source on-resistance (note 1) RDS(on)

VGS =-2.5V, ID =-1A 90 mΩ

Forward transconductance (note 1) gFS VDS =-5V, ID =-5A 7 S

Diode forward voltage(note 1) VSD IS=-1A, VGS = 0V -1 V

DYNAMIC PARAMETERS (note 2)

Input Capacitance Ciss 954 pF

Output Capacitance Coss 115 pF

Reverse Transfer Capacitance Crss

VDS =-15V,VGS =0V,f =1MHz

77 pF

SWITCHING PARAMETERS (note 2)

Turn-on delay time td(on) 6.3 ns

Turn-on rise time tr 3.2 ns

Turn-off delay time td(off) 38.2 ns

Turn-off fall time tf

VGS=-10V,VDS=-15V,

RL=3.6Ω,RGEN=6Ω, ID=0.5A

12 ns Note: 1、 Pulse test: pulse width =300μs, duty cycle≤ 2%

2、 These parameters have no way to verify.

2 Rev. - 1.0www.jscj-elec.com

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21 26

N-channel MOSFET ELECTRICAL CHARACTERISTICS

0 1 2 3 4 50

5

10

15

20

25

3 4 5 6 7 8 9 100

5

10

15

20

25

30

35

40

45

50

0.0 0.5 1.0 1.5 2.0 2.50

2

4

6

8

10

200 300 400 500 600 700 800 900 1000 1100 12000.1

1

10

25 50 75 100 1250.5

0.6

0.7

0.8

0.9

1.0

4 8 12 16 2010

15

20

25

30

35

40

VGS =10.0V、4.5V、3.0V

VGS=2.5V

DR

AIN

CU

RR

ENT

I D

(A

)

DRAIN TO SOURCE VOLTAGE VDS (V)

Pulsed

VGS=2.0V

Ta=100

Ta=25

GATE TO SOURCE VOLTAGE VGS (V)

ON

-RES

ISTA

NC

E

RD

S(O

N)

(mΩ

)

ID=5ATa=25Pulsed

VGS

——RDS(ON)

DR

AIN

CU

RR

ENT

I D

(A

)

GATE TO SOURCE VOLTAGE VGS (V)

VDS=5.0VPulsed

Ta=100

Ta=25

Transfer Characteristics

20

SOU

RC

E C

UR

REN

T

I S (A

)

SOURCE TO DRAIN VOLTAGE VSD (mV)

Ta=25Pulsed

VSDI

S ——

Output Characteristics

THR

ESH

OLD

VO

LTAG

E

V TH

(V)

JUNCTION TEMPERATURE TJ ( )

ID=250uA

Threshold Voltage

VGS=10V

DRAIN CURRENT ID (A)

ON

-RES

ISTA

NC

E

RD

S(O

N)

(mΩ

)

ID——R

DS(ON)

Ta=25Pulsed

VGS=4.5V

VGS=2.5V

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3 Rev. - 1.0www.jscj-elec.com

P-channel MOSFET ELECTRICAL CHARACTERISTICS

-0 -1 -2 -3 -4 -5-0

-5

-10

-15

-20

-25

-2 -3 -4 -5 -6 -7 -8 -9 -100

20

40

60

80

100

120

140

160

180

-0 -200 -400 -600 -800 -1000 -1200 -1400-1E-3

-0.01

-0.1

-1

-10

-1 -2 -3 -4 -5 -6 -7 -8 -9 -100

20

40

60

80

100

120

25 50 75 100 125-0.4

-0.5

-0.6

-0.7

-0.8

-0.9

-1.0

-1.1

-1.2

-0.0 -0.5 -1.0 -1.5 -2.0 -2.5 -3.0-0

-2

-4

-6

-8

-10

VGS=-10V

VGS=-4.5V

VGS=-3V

VGS=-2.5V

VGS=-2V

Output Characteristics

DR

AIN

CU

RR

ENT

I D

(A

)

DDAIN TO SOURCE VOLTAGE VDS (V)

Ta=100

Ta=25

Ta=25Pulsed

ID=-4A

—— VGS

RDS(ON)

ON

-RES

IST A

NC

E

RD

S(O

N)

(m

)

GATE TO SOURCE VOLTAGE VGS (V)

VSD——I

S

SOU

RC

E C

UR

REN

T

I S (A

)

SOURCE TO DRAIN VOLTAGE VSD (V)

-20

ID

——RDS(ON)

VGS=-10V

VGS=-2.5V

VGS=-4.5V

Ta=25Pulsed

DRAIN CURRENT ID (A)

ON

-RES

IST A

NC

E

RD

S(O

N)

(m

)

ID=-250uA

Threshold Voltage

THR

ESH

OLD

VO

LTAG

E

V TH

(V)

JUNCTION TEMPERATURE TJ ( )

VDS=-5.0VPulsed

DR

AIN

CU

RR

ENT

I D

(A

)GATE TO SOURCE VOLTAGE VGS (V)

Ta=100

Ta=25

Transfer Characteristics

4www.jscj-elec.com Rev. - 1.0

SOP8 Suggested Pad Layout

Min Max Min MaxA --- 1.750 --- 0.069

A1 0.100 0.250 0.004 0.010A2 1.250 1.500 0.049 0.059b 0.330 0.510 0.013 0.020c 0.170 0.250 0.007 0.010D 4.800 5.000 0.189 0.197eE 5.800 6.200 0.228 0.244

E1 3.800 4.000 0.150 0.157L 0.400 1.270 0.016 0.050

θ 0° 8° 0° 8°

SymbolDimensions In Millimeters Dimensions In Inches

0.050(BSC)1.270(BSC)

SOP8 Package Outline Dimensions

5www.jscj-elec.com

NOTICE JSCJ reserves the right to make modifications,enhancements,improvements,corrections or other changes without further notice to any product herein. JSCJ does not assume any liability arising out of the application or use of any product described herein.

Rev. - 1.0

SOP8 Tape and Reel

6www.jscj-elec.com Rev. - 1.0