SOP-ADT-15 ADT OPERATING PROCEDURE 01/28/2020 DOCUMENT NUMBER SOP-ADT

Rev

Modified By ECN# DMR# CAR# Description of Changes Date

1 DB NEW PROCEDURE 2/02/2009

2 DN General update 2/15/2011

3 DB Added Recipe Field Definitions 4/28/2011

4 DB ECN-011212-A Add procedure to record blade exposure and cut length on container 2.9.1

1/12/12

4 DB ECN-011212-A Add multi-panel recipe programming procedure 1/12/12

5 DB ECN-100912-A 279 Added YouTube video links. Updated 2.12.3 to tighten nozzle locking screw.

10/9/12

6 DB ECN-040713-A C13-02-A2JA Added Best Practices section for best practices while dicing. 4/8/2013

7 DB ECN–090613-A C13-08-A3KE

Added line to Best Practices to instruct operator to never leave the saw without a blade on spindle.

9/6/2013

8 DB ECN–093013-A Added Surfactant Mixing, Blade Marking and Sponge Care to Best Practices.

9/30/2013

9 KG ECN-141007-A C14-09-A8JA-348

Added Specific language when to use dicing checklist and added angle 90 to dicing checklist

10/7/2014

10 JY ECN-150120-E Updated Best Practices “C.” with info to create APC or GPC recipe

01/26/2015

11 JY ECN-150616-A Removed Dicing Checklist 6/16/2015

SOP-ADT-15 ADT OPERATING PROCEDURE 01/28/2020

12 KG ECN-170329-A C17-03-A8KE-408

Add language to define when a cassette should be used 3/29/17

13 KG ECN-181016-B C18-10-A1KE-481

Add language to limit the amount of customer programs that can be imported at a single time

10/16/2018

14 KG ECN-190516-A C19-04-A9KE-499

Updated spec to help identify when the standard dicing nozzle is not being used.

5/16/2019

15 KG ECN-200128-A C19-11-A1KE-511

Add language for naming engineering programs 1/28/2020

SOP-ADT-15 ADT OPERATING PROCEDURE 01/28/2020 Best Practices for Saw Operation

A. The traveler should be reviewed to determine if a recipe has been defined for the job being loaded and if surfactant will be used.

B. If the recipe is not loaded into the system you will need to import it and select “replace” for the existing program to load. If creating an engineering program, the recipe name must indicate that it is an engineering program so it will not be used for production parts

C. If there is no recipe name on the traveler then one must be created. Duplicate and rename either APC or GPC recipe from SS Templates section. Please see section 4 for creating multipanel programs.

D. Use the dicing checklist from Appendix B to verify the saw and recipe setup. a. Verify Die Dimensions - Check the P&P section of the traveler for the die dimensions. If the data does

not exist measure the die on the saw and record the dimensions either in the P&P table or on the drawing attached to the traveler. While the dicer is cutting the material you can input the dimensions into the wafer details tab on the Intranet.

E. Never leave the saw without a dicing blade secured to the spindle. F. Always verify the blade centering and cut quality of the first cut into the substrate on all angles. Set y-offset and

cut verification as needed. This cut should be inspected for quality of cut, centering of the cut and whether the cut went into the tape or not. After making any y-offset or cut verification change, the operator must inspect the next cut.

G. Inspection of cuts should be made at least 3 times for each angle when cutting a full substrate. If cutting reticles inspection should be done on the first reticle and at least every 12 after that for every frame.

H. After creating a new recipe inspection must be done on for the first 5 cuts on a single index wafer, the first 2 full sets of sub-indexes on a multi-index wafer, or the first 2 full reticles if dicing tiles.

I. Make sure the resistivity is set to 0.045-0.055 for GaAs wafers, 0.055-0.065 for all others and turn the CO2 off it surfactant is being used.

J. Refer to the in-process inspection for Dicing in SOP-INSP for inspection details after the wafer has completed dicing.

K. There shall be no more than 10 customer programs imported at a single time. This will help insure there is no software issues during dicing.

Blade Marking

i. After dressing a blade, write a “D” on the container. ii. Before cutting material write the material type that will be cut on the blade container (i.e. SiGe). iii. When removing a blade from the saw write the current exposure (i.e. exp 0.441) and cut length (i.e. 3.5m). If

there was a previous cut length on the container, add that to the current cut length and record the new number on the container.

iv. If the blade is deemed not to be good, then throw the blade in the trash. v. Keep blades in the appropriately marked containers on the wire rack next to the saw. vi. If processing Inneos, reference SOP-INNE for additional blade marking.

Sponge Care i. Cut off 1inch sections from the sponge and then cut this in half for use at the saw. ii. The sponge should always be moist. If a sponge is allowed to dry out then it should be discarded. iii. Store the sponge in a closed ziplock ESD bag when not in use. iv. If the sponge appears excessively dirty then replace it. v. Never soak the sponge with alcohol.

Mixing Surfactant i. Obtain a clean empty squirt bottle. ii. Fill with DI water to the line. iii. Add one capful (marked “surf”) of surfactant to the water. iv. Gently mix by tipping the bottle upside down several times.

Changing Water Nozzles i. If a standard water nozzle is not being used (1.5” long, 3mm diameter), the operator must tag the tool with a red indicator.

SOP-ADT-15 ADT OPERATING PROCEDURE 01/28/2020

When creating new programs, either reference a program for similar material or reference the dicing info on the intranet (see pic below) for a starting point.

1. RUNNING A MANUAL PROGRAM

1.1. Ensure that the DI Water, N2, CDA and City Water valves are all open behind the saw. 1.2. Press the ON button. 1.3. Select “Administrator” from the dropdown, enter the password “a” and check the Init System box. Click “OK”. 1.4. Right click the Spindle KRPM gauge and select “Operate”. This will activate the saw spindle. Allow the spindle to

run for 30 minutes before proceeding. 1.5. Click the button the looks like a wrench (red box below). 1.6. Click the “+” symbol next to Dicer to expand the tree. Select “Height”. 1.7. Click the “Chuck to Non-Chuck Data Measurement” button in the Height Box (yellow box below).

1.8. This process will take approximately 5 minutes and it will give the chuck surface and infrared beam the same zero reference point.

SOP-ADT-15 ADT OPERATING PROCEDURE 01/28/2020 1.9. Load a wafer or cassette into the machine by first clicking the Cassette button (red box below). If using a

cassette to dice strips, an operator must be assigned to insure proper dicing.

1.10. Load the wafer on frame in either the cassette or single wafers into the drawer with the frame notched facing

away from you and the wafer active side up. Close the door and Click “Yes”.

1.11. Select the “Leave Stopped” radial button and Click “OK”.

1.12. You must now define the program you are going to run. Refer to the traveler and locate the recipe number for the wafers you are going to process.

1.13. Click “Auto” from the title bar and select “Define Job…”.

SOP-ADT-15 ADT OPERATING PROCEDURE 01/28/2020

1.14. Click the “Single” radial button. 1.15. Click the corresponding location where the wafer/s were loaded. 1.16. Locate the Recipe number from the traveler and select it from the recipe tree. Click “Apply” and then click

“OK”.

1.17. Move the wafer from the Cassette or Inspection station to the Dicer by clicking the robot arm button (red box). 1.18. Select the current location of the wafer you want to cut (“From”) and the Dicer. Click “OK”.

SOP-ADT-15 ADT OPERATING PROCEDURE 01/28/2020

1.19. The robot will now move the wafer to the dicer. Verify that the correct program has been selected for this wafer after it has made its way to the dicing chuck. The recipe that will be applied to the wafer on the chuck will be located in the bottom right of the screen (red box).

1.20. From the image above select the manual alignment button (yellow box). The button will become grayed out

and instructions will be displayed in the Wizard box on the left (green box). Complete the coarse align by setting the angle adjust speed (red arrow) to S and the magnification to M and 1 (blue box). Use the two arrow buttons (orange arrows) to get the street in alignment with the cross hair.

1.21. Increase the magnification and set the crosshair horizontally on a straight line in or near the cutting lane. Click

“Next” in the wizard box. 1.22. The camera will now move to the left for the second alignment point. This point must be place in exactly the

same vertical location as the first to achieve proper alignment. To do this, select the P (red box) on the position control buttons and move the crosshair to the proper position. Click “Next”.

SOP-ADT-15 ADT OPERATING PROCEDURE 01/28/2020

1.23. Increase the magnification to the highest level and center the crosshair in the middle of the saw street. Click “Finish”.

1.24. The manual alignment in the first channel is now complete. You can verify that this channel is ready to cut by viewing the wafer diagram in the upper left hand corner (orange box). If it has the cut lines drawn then the system is ready to cut this channel.

1.25. Select the angle adjust speed to “A” by clicking the button (red box) until “A” appears. 1.26. Click the arrow button on the right once (yellow box).

1.27. Repeat steps 20 through 24 to align the second channel. It should not be necessary to use the coarse rotation to get the alignment close since the tool should rotate almost exactly 90 degrees from the first channel that was just aligned.

1.28. The manual alignment in the first & second channel is now complete. You can verify that these channels are ready to cut by viewing the wafer diagram in the upper left hand corner. If it has the cut lines drawn in both directions then the system is ready to cut these channels.

SOP-ADT-15 ADT OPERATING PROCEDURE 01/28/2020 2. BLADE CHANGE - If the blade breaks, is damaged, the recipe calls for a different blade or chipout has increased to an

unacceptable level the blade must be changed. To see how to mount a new hubless blade on a flange see this video. 2.1. Right click in the red boxed area.

2.2. Click “Blade Change”. See Initialize Blade Change Video 2.3. The spindle will stop, the access door will unlock and the blade assembly will come forward for easy access. 2.4. Input the last 5 digits of the blade serial number in the “Set lot number” field. 2.5. Choose the blade that you are installing. 2.6. Click “OK”. 2.7. Unlatch the spindle cover and open it. See Blade Change Video 2.8. Use the wrench tool to loosen the blade on the saw. 2.8.1. Hold the hex piece firmly but do not turn it. 2.8.2. Push the loose piece of the assembly into the guide pins and turn counter clockwise. Remove

the nut completely.

2.9. Remove the blade by grabbing the ledge on the hub and gently pull the blade out. Place the blade back in its original container.

2.9.1 Label the blade container with the current exposure and cut length unless the blade is being discarded.

2.10. Clean the spindle, spindle housing, spindle cover, nut, blade breakage detector and the noncontact sensor with IPA. See Saw Cleaning Video

2.11. Take a new blade from its container by the ledge on the hub and place it on the spindle. See Blade Replacement Video

SOP-ADT-15 ADT OPERATING PROCEDURE 01/28/2020 2.12. Use the wrench tool to secure the nut back on the spindle. 2.12.1. Hold the hex piece firmly but do not turn it. 2.12.2. Make absolutely sure that the nut is not cross threaded. This can be verified by observing that

the nut turns without any resistance for the first 2 rotations or more. Push the loose piece of the assembly into the guide pins and turn clockwise. Turn until nut is snug but do not apply too much force.

2.12.3. Adjust the water nozzle so that it is hitting the lowest point of the blade but is not lower than the blade itself. DO NOT FORGET TO TIGHTEN THE LOCKING SCREW AFTER ADJUSTMENT. See Water Nozzle Adjust Video

2.13. Close the spindle cover and latch it. 2.14. Loosen the Blade Breakage Detector locking screw. See BBD Adjust Video 2.15. Adjust the Blade Breakage Detector so that the display (red box) reads 8.0 +/- 0.2. 2.16. Tighten the BBD locking screw while maintaining the setting as indicated above. 2.17. Click “Finish”.

3.0 RUNNING AN AUTO PROGRAM

3.1 Follow steps 1.1 – 1.16, but in step 1.14 select the “Per Cassette” radial button. 3.2 To start the program, press the Run button. 3.3 If the program fails contact engineering.

4.0 Programming Multi-panel Recipes: This procedure is for operators that are already proficient in APC programing.

4.1 Pre-APC setup – Selecting a frame. Pick a frame (if you have a choice) that the tiles are as straight as possible. If the tiles are misaligned, the misaligned tile may cause trouble with consecutive frames. (Note: One tile is skewed in yellow box)

SOP-ADT-15 ADT OPERATING PROCEDURE 01/28/2020 4.2 Pre- Multi-panel programming setup- Make a template for alignment. The dicer works best by aligning in a circular pattern. Pick a starting point and spiral out. 4.3 Use tile #1 to align and teach too. Multi-panel will use this point to start. 4.4 To prepare the saw for building a multi-panel program it is suggested all unnecessary programs be exported. Multi-panel programs are large and can cause problems with the dicers memory. 4.4.1. Export programs and delete. 4.4.2. Exit to windows and restart ADT program to clear memory. Once an APC program has been created there are 3 items to update.

• Change dimensions on main page. • Change alignment type. • Add Multi-panel and # of panels.

4.5 Enter dimensions of the die. X being the horizontal length and Y being vertical as measured on angle 0.(Yellow Box)

SOP-ADT-15 ADT OPERATING PROCEDURE 01/28/2020 4.6 Under 'Align' on angle 0 and 90, change the alignment type to '2-Points'. (Yellow box) 4.7 Multi-panel is a new category added to the General tab. Under Parameter-Category- Select Multi Panel. (Sub) Parameter select No. of Panels. 4.8 Teaching the Multi-panel Program, on index 0, press the Teach Align button (Yellow box). Select New teach. (Some images will not be given) 4.9 Follow instruction in Wizard. 4.10 Pre-head (lighting and focus) select NEXT. Adjust lighting and focus on any piece and Finish. 4.11 Define Cut Position. Use position it shows. It should be correct if the APC program is. Click Finish.

SOP-ADT-15 ADT OPERATING PROCEDURE 01/28/2020 4.12 Teach low models. Click NEXT. Choose an image at Medium mag, leaving lots of space, and press TEACH. Follow Wizard. 4.13 Teach Main models. Same process as low models but Zoom to 2x. Select model near name corner as low models. Image should be 99% or better. Do not choose the corner again as street width may not be accurate. 4.14 SKIP both Sub AND Verification Models. 4.15 Define Cut Position and Finish. 4.16 New Workpiece Center select NEXT. Follow Wizard instructions to align Left and Top edges of retical. 4.17 REPEAT all teaching steps (per wizard) for angle 90. 4.18 Final stage—Dicer will align both sides once again and start the Tile placement portion of the program. Get spiral drawing ready. Follow Wizard, but more importantly, keep track of tile number and your location. You will be teaching the dicer the location of each tile. Dicer will always return to Tile 1 for reference 4.19 Reference- Note (in blue box) position of tile 1 and location of tile (panel) 6 in picture. Dicer will return to tile 1 prior to tile 7 and so on.

SOP-ADT-15 ADT OPERATING PROCEDURE 01/28/2020

ADT Program Field Definitions and Standards

A. This button takes you back to the camera view to see the wafer. B. This is the current view on screen and shows the major

components status and location of wafer/s across the tool. C. Click here to view, add and edit recipes. D. This button will take you to the height check execution and is a

good place to troubleshoot tool operation errors. E. The blade button allows you to see the BBD setting which should

be 8 +/- 1. F. The pause button allows you to stop the tool and inspect the

substrate. G. The cassette button will load/unload a cassette or frame. Be sure

to select the dropdown and “inspection” if you wish to load/unload the inspection tray.

H. This button allows you to manually move wafers In the system. When you use this button pay close attention to which wafer you are moving and to where you wish to move it.

I. This is the manual y-offset button. This button is used to center the blade at the center of the cut.

J. This button is used to perform a manual kerf check. It is used to center the cut in the dicing street.

K. This is used to activate the partial wafer cut process. It is generally used to cut a portion of a full wafer that is programmed as a GPC recipe. If a portion of the wafer is missing, it is better to create an APC program.

L. This dial indicates the current spindle RPM. If you right click here you can turn the spindle off.

M. This button will turn the cutting water on and is usually used to remove air from the water line before cutting and center the water stream on a blade.

N. These indicators show the current flow rate of the different water streams. They are typically set to 1.2 or greater.

O. This area shows the current status of the major saw components and whether of not they are experiencing issues. You can reinitialize just one component at a time by right clicking the icons.

P. This meter shows the exposure of the blade and the relative life left based on the recipe setting that accounts for the minimum exposure, substrate thickness and tape thickness. Right clicking this meter will allow you to initialize a blade change.

Q. This button will stop the tool operation instantly but will not kill the power.

R. This button will activate an auto program and/or the dicing process. The current feed speed is indicated just below this button.

SOP-ADT-15 ADT OPERATING PROCEDURE 01/28/2020

A B C D E F G H I J K

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SOP-ADT-15 ADT OPERATING PROCEDURE 01/28/2020

A. Recipes should be created under the appropriate customer name. There is an Engineering folder for experimental recipes. All recipes in this section change often and should not be used to cut customer products. When creating an engineering program, the recipe name must indicate that it is an engineering program so it will not be used for production parts. There is a SS Templates folder which contains some standard recipes for material that is commonly cut. These are good to use as starting points for new recipes.

B. This filed contains the blade part number that will be used to cut this product. If the wrong blade is on the tool when truing to start the program the tool will error.

C. The “circular” should be used as the shape as long as you are cutting a full wafer. Rectangular should be used for partial wafers as well as cutting tiles.

D. The diameter field is used when defining the shape as circular.

E. The width and length dimensions will be used if the shape is defined as rectangular.

F. This is the total tape thickness and may vary by type and part number. This number can be verified on the tape datasheets.

G. A GPC program should be used for full wafers that are centered on the dicing frame. APC programs are for particle wafers, rectangles and substrates that are not centered on the frame.

H. The full auto alignment feature should be selected. It does not necessarily indicate that the recipe alignment is using pattern recognition. This will be determined by the program tabs and may still indicate a Manual alignment operation.

I. The cleaning algorithm should always be selected or the tool will completely skip the clean step.

J. The full teach alignment must be selected if you plan to use pattern recognition to automatically align wafers. If this is not selected, the program will not allow you to select TEACH ALIGNMNET in the programming area.

K. The kerf check teach must be selected if you plan to use pattern recognition to automatically teach the kerf check. If this is not a common feature to use at SawStreet.

SOP-ADT-15 ADT OPERATING PROCEDURE 01/28/2020

SOP-ADT-15 ADT OPERATING PROCEDURE 01/28/2020