SMBG Plastic-Encapsulate Diodesjscj-elec.com/gallery/file/MURS420-MURS460-SMBG.pdf · 2019. 7....
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MURS420 THRU MURS460 Super Fast Recovery Rectifier Diodes MURS4 Item Symbol Unit Test Conditions Repetitive Peak Reverse Voltage V RRM V Average Forward Current I F(AV) A 4.0 Surge(Non-repetitive)Forward Current I FSM A 125 Junction Temperature TJ -55~+175 Storage Temperature T STG -55 ~ 175 Electrical Characteristics (T=25 Unless otherwise specified MURS4 Item Symbol Unit Test Condition V F I F =4.0A 0.89 1.28 Reverse recovery time Irr=0.25A 50 I RRM1 5 Peak Reverse Current 100 R J-A Between junction and ambient Thermal Resistance(Typical) R J-L /W Between junction and terminal Notes: ) Thermal resistance from junction to ambient and from junction to lead mounted on P.C.B. with 0.2" x 0.2" (5.0 mm x 5.0 mm) copper pad areas t rr IF=0.5A,IR=1.0A V RM=V RRM Ta =25 Ta =125 Maximum RMS Voltage V RMS V ●I F(AV) 4A ● 200V-600V ●High surge current capability Applications ● Rectifier ● MURS4X0 X : From 2 to 6 Marking Polarity: Color band denotes cathode ● Features VRRM 1 Rev. - 1.0 www.jscj-elec.com 60Hz Half-sine wave， Resistance load，T L =110℃ 60Hz Half-sine wave， 1 cycle，Ta=25℃ SMBG Plastic-Encapsulate Diodes JIANGSU CHANGJING ELECTRONICS TECHNOLOGY CO., LTD JIANGSU CHANGJING ELECTRONICS TECHNOLOGY CO., LTD ℃ I RRM2 Peak Forward Voltage 20 30 60 200 300 600 140 210 420 20 30 60 25 40 400 280 40 V ns μ A 47 1) 12 1) SMBG
Transcript of SMBG Plastic-Encapsulate Diodesjscj-elec.com/gallery/file/MURS420-MURS460-SMBG.pdf · 2019. 7....
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MURS420 THRU MURS460 Super Fast Re c overy Rectifier Diodes
MURS4 Item Symbol Unit Test Conditions
Repetitive Peak Reverse Voltage VRRM V
Average Forward Current IF(AV) A 4.0
Surge(Non-repetitive)Forward Current
IFSM A 125
Junction Temperature TJ -55~+175
Storage Temperature TSTG -55 ~ 175
Electrical Characteristics (T=25 Unless otherwise specifiedMURS4
Item Symbol Unit Test Condition
VF IF=4.0A 0.89 1.28
Reverse recovery time Irr=0.25A 50
IRRM1 5 Peak Reverse Current 100
R J-A Between junction and ambientThermal Resistance(Typical)
R J-L /W Between junction and terminal
Notes:)Thermal resistance from junction to ambient and from junction to lead mounted on P.C.B. with 0.2" x 0.2" (5.0 mm x 5.0 mm) copper
pad areas
trr IF=0.5A,IR=1.0A
VRM=VRRM Ta =25
Ta =125
Maximum RMS Voltage VRMS V
●IF(AV) 4A
● 200V-600V
●High surge current capability
Applications● Rectifier
●MURS4X0
X : From 2 to 6
Marking
Polarity: Color band denotes cathode●
Features
VRRM
1 Rev. - 1.0www.jscj-elec.com
60Hz Half-sine wave， Resistance load，T L=110℃
60Hz Half-sine wave，1 cycle，Ta=25℃
SMBG Plastic-Encapsulate Diodes
JIANGSU CHANGJING ELECTRONICS TECHNOLOGY CO., LTD JIANGSU CHANGJING ELECTRONICS TECHNOLOGY CO., LTD
℃
IRRM2
Peak Forward Voltage
20 30 60
200 300 600
140 210 420
20 30 60
25
40
400
280
40
V
ns
μA
471)
121)
SMBG
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FIG.5: Diagram of circuit and Testing wave form of reverse recovery time
2 Rev. - 1.0www.jscj-elec.com
�0 Resistive or Inductive LoadP.C.B. Mounted on 0.3"×0.3"(8.0mm×8.0mm)Copper Pad Areas01.02.03.0
4.0
5.0
6.0
7.0
30 60 90 120 150 180
FIG2：Surge Forward Current Capability
8.3ms Single Half Sine Wave
1 10 1000
25
50
75
00
125
150
TJ=25℃Pulse width=300us1% Duty Cycle
0.010 0.3 0.6 0.9 1.2
0.1
100
1
10
2.21.5 1.8
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MURS430-MURS460MURS420
FIG4：Typical Reverse Characteristics
Tj=125℃
Tj=25℃
0.001
0.01
0 20 40 60 80 100
0.1
1.0
10
100
VR
D
RLIF0
IF
IR
IRR
t
trr
I
I O(A
)
FIG.1: FORWARD CURRENT DERATING CURVE
FIG.3: TYPICAL FORWARD CHARACTERISTICS
®Ôî½µ¾
��~ �\fqtdsTL( ) Number of CyclesVoltage(%)VF(V)
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SMBG
3www.jscj-elec.com Rev. - 1.0
NOTICE JSCJ reserves the right to make modifications,enhancements,improvements,corrections or other changes without further notice to any product herein.JSCJ does not assume any liability arising out of the application or use of any product described herein.
SMBG
4.26
1.8
Dimensions in inches and (millimeters)
0.087 (2.20)0.071 (1.80)
0.180(4.57)0.160(4.06)
0.155(3.94)0.130(3.30)
0.060(1.52)0.030(0.76)
0.220(5.59)0.205(5.21)
0.012(0.305)0.006(0.152)
0.008(0.203)MAX.
0.096(2.44)0.084(2.13)
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Reel Taping Specifications For Surface Mount Devices- SMBG
FIG:CONFIGURATION OF SURFACE MOUNTED DEVICES TAPING
SMBG
75 1.0 2.95 0.039
