“Smart Things” Require Flexible Test - NMI · PDF file“Smart Things”...

“Smart Things” Require Flexible TestPeter CockburnNovember 2015

Outline

– Smart things and key features

– Test requirements for modules in smart things

– Example 1: BTLE SOC

– Example 2: MEMS sensor test

– Example 3: 76-81GHz ADAS

ConfidentialMeasured by your success 2

IoT = The Next “Big Wave?”


Source: Globalfoundries

IoT Paving the Way to Trillion(s) Sensors Mobile/Fitness/Wearables

Building/Home Automation

Smart City/Infrastructure

Healthcare

Automotive

Industrial

Inertial, Microphones,Biosensors, Touch, Optical,Pressure, Temperature, Humidity

Inertial, Pressure, Temperature,Chemical, Light

Biosensors, Temperature,Chemical, Pressure, Light, Inertial

Inertial, Microphones, Light,Chemical, Temperature

Inertial, Pressure, Temperature,Humidity, Chemical, Light, Sensors of the IoT

Inertial, Pressure,Temperature, Chemical, Gas, Humidity, Radar


End Nodes are the “smart things” consisting of three key elements

IoT volumes will be driven by End Nodes


Connected Smart Things

Microcontrollersand Flash Memory

Wireless low powerCommunication

Sensors

Sensors Trends


Improved performance, smaller size, lower cost

New

sen

sor a

pplic

atio

ns a

nd p

acka

ging

9 DOF

Accelerometer Gyroscope Magnetometer

Biosensors

Optical ImageStabilization

BarometricPressure

WLCSP

3D StackedSIP

4mm2 1mm2

10 DOF

IoT Microcontroller Trends

– Ultra low-power and lower current– Flash memory (small to medium: 10KB to 256KB)– Higher levels of mixed-signal integration

• RF integration (BTLE/Mesh, WiFi…)• More ADC/DAC and higher resolution (8 16-bit)

– Sensor fusion– Both ARM and proprietary architectures– New packaging technologies (WLP) and smaller sizes


Source: AtmelSource: Hillcrest Labs/AtmelSource: Microchip Source: Nordic

Multiple RF Standards Competing for IoT Applications

Standard Industry Frequency Range Topology Data Rate

Fitness, Medical 2.4 GHz 30m Star, Tree, Mesh 60 kb/s

Smart Home, Smart Energy

<1 GHz, 802.11ah 100m Star, Tree 100 kb/s

Smart Home, Fitness, Automotive 2.4 GHz 100m Scatternet, Mesh 1 Mb/s

Smart Home, Smart Energy, Medical

1.8 GHz EU1.9 GHz USA 70m Star 1 Mb/s

Smart Home, Smart Energy, Medical <1 GHz 300m Open System

Interconnection 125 kb/s


2.4 GHz802.15.4 30m/100m Mesh. Star, Star-Mesh 250 kb/s


2.4 GHz802.15.4 30m/100m Mesh. Star, Star-Mesh 250 kb/s

Smart Home, Smart Energy, Medical <1 GHz 30m/100m Mesh 100 kb/s


2.4 GHz802.15.4 10m/100m Star, Tree, Mesh 250 kb/s


• Dominated by low-power wireless connectivity• Multiple standard and proprietary wireless protocols vying for

adoption: flexible test solutions required

Technologies and Capabilities Required for IoT Test


Microcontrollersand Memory

WirelessCommunication

Sensors

Sensor Stimulus

Low Cost RF Covering all IoTProtocol Standards

Digital ProtocolEngines

Multi-PackageHandling

Technology

High Multi-SiteTesting Capability

Power ManagementTechnology

OptimizedFlexibleTest Cell

Robust Contacting

High Volume Production Requirements

Low Cost of Test

Flexible to meet today’s challenges

Adaptable to future needs

Key Elements for IoT Test Solutions


Example 1: RF SOC CoT Reduction: Nordic

– Nordic Semiconductor ('Nordic') is a fablesssemiconductor company specializing in ultra low power (ULP) wireless SOCs in the license-free 2.4-GHz and sub-1-GHz Industrial, Scientific and Medical (ISM) bands.

– Nordic is a Norwegian public company listed on the Oslo stock exchange (OSE: NOD).


nRF51822: Multiprotocol Bluetooth® low energy/2.4 GHz RF SOC

– Powerful, multi-protocol single chip solution for ULP wireless applications

– Best-in-class radio transceiver– Arm Cortex M0 CPU– 256/128kB Flash + 16 kB RAM– Bluetooth Smart and 2.4GHz protocol

support

Target Applications:– PC peripherals - Gaming– Sports and Fitness - Toys– Mobile phone accessories - Healthcare– Consumer Electronics - Automation


Test List for RF SOCFunctional Area Test

Pins Contact

ESD

Leakage

DC Test Mode

Quiescent currents

Power Management

Temperature Sensor

DC Converter

Voltage Regulator

AC Low Speed Osc. (32kHz)

High Speed Osc. (16MHz)

Ring Osc.

Digital Scan

BIST

RF RF Trimming

Tx Power

Tx Drift

Rx Power

Rx BER


– RF tests use Bluetooth modulation / demodulation

– Standard libraries supplied with ATE

– If required, customer can also integrate their own C / C++ IP

– Runs in same native environment as other tests, with multi-threading and background processing support

Objective: Maintain Flexibility, Reduce Cost

Site Calibration Fixture

OEM Low Jitter Clock Reference

OEM RF Signal Generators

RF Port Modules

Dual AWG for Modulation / Baseband

(2) Dual Digitizers for Demodulation


Objective: Maintain Flexibility, Reduce Cost


Fully integrated RF module with RF front end, RF sources, baseband IQ, low jitter clock, and digitizers in a single instrument

Nighthawk Connectivity RF Solution

Key Features● Full range of RF connectivity applications

- WLAN (inc 802.11a/b/g/ac), Bluetooth, Zigbee, GPS, DVB, FM, RKE, etc.

● Up to 6GHz source and measure

● Modulation/Demodulation bandwidth up to 200MHz

● True parallel Quad/Octal site source and measure

● Expandable to 32/64 RF ports

● Integrated ATE software support withSource/Measure Triggering

● Easy field installation into multiple ATE platforms

NighthawkCT

RF IQ Modulator Source Baseband I/Q and

AWG Direct

RF Synthesizer, LO & LJC

Quad RF FE Module

Quad Digitizer

Power/Control/DSP


Customer Benefits from RF SOC Test Solution

– Multisite increased from x4 to x16– 70% of ATE slots available for

future expansion– Test time reduced– “Big Iron” RF ATE replaced by

“Connectivity RF” solution with lower hourly rate

– “Plug&Yield” interfacing from single supplier for Final Test and WLCSP test

– Result: 4x reduction in CoT


DiamondXNighthawkCT

Final Test Loadboard and Contactors

WLCSP “Direct Dock” Probecard

Example 2: MEMS Sensor COT Reduction

– Low-cost, low-power 3DOF magnetometer and 3DOF accelerometer for mobility applications

– Package sizes <1.5mm x 1.5mm– Magnetometer packaged on-strip– Accelerometer implemented using WLCSP– I2C interface to microcontroller

Target Applications:– Information Appliances– Consumer Devices– Wearables– Gaming– Household Safety


Test List for Inertia MEMS

Functional Area Test

Pins Continuity

Leakage

DC IDD

Power Down current

Leakage current

Reg I/O Register Check

Trimming Initialise

Offset and Sensitivity Trim for multiple XYZ magneticfields or XYZ orientations

OTP Burn OTP Memory

Confirm Check OTP after reset

Offset and Sensitivity Confirm


– Similar test flows for magnetometer and accelerometer

– Stimulus source changes from magnetic coils to earth’s gravity

– Trimming requires precision XYZ alignment of devices under test and fast, high accuracy power source for coils

– Serial I/O, DC tests and device power can be satisfied using “general purpose” digital pin + PMU-per-pin (PMUPP)

MEMS Sensor Test Cell Summary

MEMS Test Cell• Strip / Carrier Handler• 3/6DOF MEMS Stimulus • ATE + General Purpose

Digital Pins• Loadboard, DUT Board

and Contactor• Soft Dock and cable

managementInCarrier Process: • Loader and Unloader• Bin Mapping GEM Host

SW


Validation Services to Reduce TTV and

Increase FPY

• Test Cell Check-Out• Interface HW Check-

Out• Tester-Handler

Comms Validation• Test Program

Development / Debug / Correlation

• Project management

Standardisation and Modularity

– Multiple applications use the same base handling system

– New sensor applications require only changes in the sensor test modules

faster time to market

Pressure and Barometric Sensors

Accel. / Mag. / Gyro:3/6/9DOF

Base Strip HandlerAccelerometer / Magnetometer:

3/6DOF

Audio Microphones


MEMS Test Cell Project Highlights

Full strip passing shorts/opens System at customer site

• System #1 Magnetometer and accelerometer test programs integrated and validated internally by Xcerra and customer: >99.5% PTE for >200 sites

• DUTs passing shorts/opens test on 3rd day of installation at customer site for >200 sites at 0.4mm pitch

• Process transfer to China OSAT in Q4 CY2015


Example 3: 76-81 GHz Radar Complete Test Cell Solution

– Only fully-integrated solution in the Industry• At Speed test of 77G radar signals (transmit and receive)• All components from one supplier (test solution, loadboard, contactor and handling)

– Guaranteed signal integrity, • Impedance-controlled coplanar waveguide signal path• Calibration up to the device pin

– Proprietary, unique contacting solution• Eliminates PCB interface for high speed signals• Options for WLCSP and package test• Significantly more compliance (probe travel) than alternatives

– Handler and interface design supports tri-temp testing for automotive• Insulation technique maintains temperature within +/- 2degC • Standard conversion kit compatible with hybrid contactor design

– True volume production solution• Solution developed using proven ATE, contacting, and handling instrumentation• Reconfigurable for a wide range of automotive applications

5 November 2015Confidential 23

Technologies and Capabilities Required for IoT Test


Microcontrollersand Memory

WirelessCommunication

Sensors

Sensor Stimulus

Digital ProtocolEngines

Low Cost RF with IoT RF Protocols

Power ManagementTechnology

Multi-PackageHandling System

High Multi-SiteTest Capability

Robust Contacting

OptimizedFlexible Test Cell

Low Cost of Test

Flexible to meet today’s challenges

Adaptable to future needs

Key Elements for IoT Test Solutions


Thank You!

Nordic Semiconductor Selects the Diamondx for IoT Device Testing

26 May 2015: LTX-Credence today announced that Nordic Semiconductor, a company that specializes in ultra-low power (ULP) 2.4GHz transceivers, notably for the Bluetooth Smart and wearables segments, has selected Xcerra’s LTX-Credence Diamondx for high volume production test of their Internet of Things (IoT) products. Nordic will use the Diamondx in combination with NighthawkCT, an industry leading instrument for low cost RF test of connectivity devices.The combination of Diamondx and NighthawkCT was specifically designed to offer a new level of test capability for applications driven by the IoT. This new level of capability provides RF connectivity performance testing, as well as, a significantly reduced cost of testing RF enabled devices used in IoT applications.“We are delighted to once again see LTX-Credence come out of this type of benchmarking exercise with the best overall fit for our testing needs”, notes Ole-Fredrik Morken, Supply Chain Director at Nordic Semiconductor, and adds “While our strategy in this arena is mainly driven by a requirement for highest possible throughput per test cell, we also value a long-term relationship with LTX-Credence and their consistent focus on providing best-in-class test solutions for our product segment. We are currently running high volume production on Diamondx systems at multiple OSATs in Asia.”Frank Berntsen, Chief Scientist at Nordic, commented, “After analyzing the data we determined that the Diamondx- and NighthawkCT configuration features a superior combination of instrument performance, infrastructure speed and allows for a significant increase in parallel test. This is critically important for us as the application of Bluetooth Smart and emerging technologies for all types of IoT and wearables will further fuel Nordic’s growth, driving the need for high volume, low cost test solutions.”Steve Wigley, vice president of the semiconductor tester group at Xcerra Corporation commented, “The combination of the Diamondx and NighthawkCT leverages the superior cost structure of the Diamondx for RF connectivity performance testing. The selection of Diamondx and NighthawkCT for high volume production test by a key IoT player such as Nordic validates that our test solutions are well aligned to the needs of these fast growing applications.”To learn more about the Diamondx, visit http://www.ltxc.com/xweb.nsf/published/diamondx?Open


http://www.ltxc.com/xweb.nsf/published/diamondx?Open

Bringing MEMS Testing to the Next Level

Installation of first complete Xcerra turn-key test cell for MEMS in Asia

17 September 2015: Xcerra finalized the installation of a complete test cell for 3/6DOF inertial and navigation MEMS applications at an Asian customer. The test cell leverages proven Xcerra expertise in highly parallel test of sensor devices, delivered through the LTX-Credence and Multitest semiconductor test brands. The customer benefits from the pre-validated test cell set-up, with integrated test program and optimization support, to rapidly realize outstanding test efficiency and target yield performance.The Xcerra MEMS test cell ideally combines the cost of test advantages of highly-parallel, high-throughput testing with the flexibility of the scalable base equipment.The Multitest InStrip handler with the exchangeable InFlipM MEMS stimulus and interface options and high-density Mercury contactors is combined with the Diamondx tester using DPIN96 digital pins; this combination supports the fast test and calibration of 3DOF magnetometers at 204 sites in parallel on strip, as well as 2/3DOF accelerometers at 216 sites in parallel, using the Multitest InCarrier solution for wafer level package test at about 1.5×1.5 mm device size. Changing between the applications requires less than 30 minutes to swap the test interfaces, the handler conversion kit and the test program.Peter Cockburn, Senior Product Manager Test Cell Innovation, explains: “The project was driven by an Asian fablesscustomer, who searched for a highly parallel test solution at an OSAT to support the aggressive production ramp and cost of test reduction goals for his mobility MEMS applications. With the Xcerra Test Cell Solution, the fabless customer is now able to outsource his test in a highly efficient way. In addition the OSAT can fully leverage the flexibility of the Xcerra Test Cell Solution for further business opportunities.”

To learn more about the Xcerra Test Cell Innovation, please click here


http://xcerra.com/tci

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