Simm Dimm Dram

7/28/2019 Simm Dimm Dram

1/11

Single In-line Memory Module (SIMM)

This page is maintained by Thomas Unger and part of the Amiga computers related kickstart archives.All brands, trademarks and copyrights on this page are owned by their respective owners.Last updated: 2004-01-23

1. DRAM-Chip-to-Module-Size-Correlation

Single In-line Memory Modules (SIMM) are available as 30-pin modules with 8Bit data width (with parity: 9Bit) or 72-pinmodules with 32Bit data width (with parity: 36Bit). The data capacity of a module is given in MegaByte (1 MegaByte= 1MByte= 1 MB) and 1 Byte is eqivalent to a data width from 8 Bit.

Small Outline J-Lead (SOJ) Thin Small Outline Package Type II (TSOP Type II)

Common used packages of the soldered DRAM chips are Thin Small Outline Package Type II (TSOP Type II) or SmallOutline J-Lead (SOJ)

30-pin modules are available in 256kB, 1MB, 2MB,4MB, 8MB and 16MB with or without parity and 2, 4 or8 data chips per module. Normally the chips are

placed one-sided only.

72-pin modules (also called PS/2) are available in 1MB, 2MB, 4MB,8MB, 16MB, 32MB, 64MB and 128MB with or without parity in bothEDO and FPM type and 2, 4, 8 or 16 data chips. The chips are

placed one-sided or on both sides.

Looking at the number of pins on each individual data chip on the module can give you an idea of the data capacity of thechips and thus the module. Remember the Number-of-Pins-to-Data-Capacity-per-Chip-Correlation:

A module with 8 chips in SOJ-package and each 24 pins in 4 sets of 6 pins (--> 16MBit Chip) has adata capacity from 16MByte because

16MBit x 8 Chips---------------- = 16MByte

8Bit/Byte

and a module with 4 chips in TSO-package and each 32 pins in 4 sets of 8 pins (--> 64MBit Chip) has a data capacityfrom 32MByte because

64MBit x 4 Chips---------------- = 32MByte

8Bit/Byte


2/11

This foto (found somewhere on theInternet) shows a very rare item: a 30-PinSIM- Module with a data capacity from 16MByte. It is difficult to read the partnumber (maybe xx16100), but thememory chips with 24 pins in 4 groups to6 pins allow the identification.

The charts below provide information for common Chip-to-Module-Size-Correlation. The number of pins per chip relatesto common TSOP Type II- or SOJ- package with each 4 sets of pins:

30-pin SIMM

Organization Data Capacity # Pins # Chips (# Pins per Data Chip) Parity

256kx8 256kByte 30 2 or 8 NO

256kx9 256kByte 30 3 or 9 YES

1Mx8 1MByte 30 2 (20) or 8 (20) NO

1Mx9 1MByte 30 3 or 9 YES

2Mx8 2MByte 30 4 (20) NO

2Mx9 2MByte 30 6 YES

4Mx8 4MByte 30 2 (24) or 8 (20) NO


8Mx8 8MByte 30 4 (24) NO

8Mx9 8MByte 30 6 YES

16Mx8 16MByte 30 8 (24) NO


72-pin SIMM

Organization Data Capacity # Pins # Chips (# Pins per Data Chip) Parity

256Kx32 1MByte 72 2 (20) or 8 (20) NO

256Kx36 1MByte 72 9 or 12 YES

512kx32 2MByte 72 4 (20) or 16 (20) NO

512kx36 2MByte 72 6 or 18 or 24 YES

1Mx32 4MByte 72 2 (24) or 8 (20) NO

1Mx36 4MByte 72 3 or 9 or 12 YES

2Mx32 8MByte 72 4 (24) or 16 (20) NO



3/11

4Mx32 16MByte 72 2 (32) or 8 (24) NO


8Mx32 32MByte 72 4 (32) or 16 (24) NO


16Mx32 64MByte 72 8 (32) NO

16Mx36 64MByte 72 9 or 12 YES32Mx32 128MByte 72 16 (32) NO

32Mx36 128MByte 72 18 or 24 YES

2. Some Examples

Chip name: HYB514100BJ-60, Number of chips on module: 9, Number of pins: 30

HYB51 4 1 00 BJ -60

HYB designates a Siemens device,the 51 designates a 5V device,

the 4 designates a 4MBit chip,the 1 designates 1 bit data width,the 00 designates a FPM device andleast the -60 indicates the speed of 60ns.

The chip is thus 4MBit (4Mx1) 60ns FPM. If there are 9 such chips on the 30pin SIMM module, then it is 4Mx1x9=4Mx9.

This is a 4 MByte 30pin FPM module with parity.

1st Chip name: uPD4217400-60 Number of chips on module: 2 and 2nd Chip name: uPD424100-60, Number of chips onmodule: 1, Number of Pins: 30

The uPD denotes it is a NEC device

Data chips: uPD42 17 4 00 -60

The 17 designates a 16 MBit chip with 2k refresh.The 4 designates 4 bits data width.The 00 designates a FPM device.The -60 indicates a speed of 60ns.

The data chip is thus a 16 MBit (4Mx4) FPM 60ns device.


4/11

Parity chips: uPD42 4 1 00-60

The 4 designates a 4 MBit chipThe 1 designates 1 bit data width.The 00 designates a FPM device.The -60 indicates a speed of 60ns.

The parity chip is thus a 4 MBit (4Mx1) FPM 60ns device.

If there are 2 data chips and 1 parity chips on the module, then we have 4Mx4x2 + 4Mx1x1 = 4Mx8 + 4Mx1 = 4Mx9. This is a 4 MByte 30pin FPM module with parity.

Chip name: MCM54400-70, Number of chips on module: 8, Number of pins: 72

MCM5 4 4 00 -70

The MCM designates a Motorola device.The first 4 designates a 4 MBit chip andthe second 4 designates 4 bits data width.The 00 designates a fast page device andleast the -70 indicates a speed of 70ns.

The chip is thus 4 MBit (1Mx4) 70ns FPM. If there are 8 such chips on the 72pin SIMM module, then it is 1Mx4x8=1Mx32.

This is a 4 MByte 72pin FPM module with no parity.

Chip name: MB8118165-70, Number of chips on module: 2, Number of Pins: 72

MB81 18 16 5-70

The MB designates a Fujitsu device.The 18 designates a 16 MBit chip with 1k refresh andthe 16 designates 16 bits data width.The 5 designates an EDO device.The -70 indicates a speed of 70ns.

The chip is thus 16 MBit (1Mx16) 70ns EDO. If there are 2 such chips on a 72pin simm module, then it is1Mx16x2=1Mx32.

This is a 4 MByte 72pin FPM module with no parity.

Chip name: HY514400-60, Number of chips on module: 16, Number of Pins: 72


5/11

Front view

Back view

HY51 4 4 00 -60

The H5M designates a Hyundai deviceThe first 4 designates a 4 MBit chip.The second 4 designates 4 bit data width.The 00 designates a FPM device.

Least the -6 indicates a speed of 60ns.

The chip is thus 4 MBit (1Mx4) 60ns FPM. If there are 16 such chips on a 72pin SIMM, then it is 2x1Mx4x8=2Mx32.

This is a 8 MByte 72pin FPM module without parity.


6/11

Dynamic Random Access Memory (DRAM)

This page is maintained by Thomas Unger and part of the Amiga computers related kickstart archives.All brands, trademarks and copyrights on this page are owned by their respective owners.Last updated: 2004-01-23

1. DRAM Package Information

DRAM stands for Dynamic Random Access Memory. The charts below provide information for major packages of DRAMchips.

Dual-in-line Package(DIP)

Zig-Zag-in-line Package(ZIP)

Small Outline Package(SOP)

Shrink Small Outline Package(SSOP)

Thin Small Outline Package(TSOP)

Small Outline J-Lead(SOJ)

2. How to decrypt the OnChip Code

In the late 1980s the most common DRAM types were PM (Page Mode) and FPM (Fast Page Mode). In early 1990s themost common types were FPM and FPM with EDO (Extended Data Out).

Generally each manufacturer uses his own scheme to mark memory chips. However, a simple algorithm can be used inmost cases to determine the exact type of chip.

Usually the number starts with two or three characters which are specific to the manufacturer. For an FPM, nibble, SC orEDO chip the rest of the sequence is usually up to 16 Mbit chips built up more or less the same : first an indication of the

manufacturer, total memory and refresh address range is given, then the number of bits per chip, then the mode ofoperation terminating with the memory speed (for manufacturers specific part number code decoding see the PartNumber Chart).


7/11

Format : XXX AA BB CC D -EE

XXX: Manufacturers Identification Code:

MB Fujitsu GM Goldstar/LGSHM Hitachi HY HyundaiMT Micron M5M MitsubishiMCM Motorola uPD NECMSM OKI MN Panasonic/MatsushitaKM Samsung/SEC K Samsung/SEC (new code)

LH Sharp HYB Siemens/InfineonTMS Texas Instruments TC Toshiba

AA : Total Number of Megabits:

1 : 1 MBit4 : 4 MBit16 : 16 MBit/4k Refresh17 : 16 MBit/2k Refresh18 : 16 MBit/1k Refresh

BB : Internal Organization (Data Width):

10 : 1 Bit (1 MBit Chips: 0 = 1 Bit)40 : 4 Bit80 : 8 Bit16 : 16 Bit

CC : I/O Mode: 0 : Fast Page Mode (FPM)1 : Nibble Mode (NM)2 : Static Column Mode (SCM)

3 - 9 : Fast Page Mode mit Extended Data Out (EDO)

D : Package Information:

J: SOJ- package.

T: TSOP Type-II package

EE : Access time in nano seconds. Sometimes the zero is omitted.In that case the number should be multiplied by 10 so that thespeed falls into the 30 to 150ns range.

Examples: TC51 1 0 00 -60 --> Toshiba, 1MB, 1bit (1Mx1), FPM, 60nsHYB51 4 4 00 -60 --> Siemens, 4MB, 4bit (1Mx4), FPM, 60nsHM51 18 16 0 -6 --> Hitachi, 16MB/1k refresh, 16bit (1Mx16),FPM, 60ns


8/11

DRAM Part Number Chart v1.0 (2004-02-05)

1. Notes / Hinweise

Bitte beachten: Diese unvollstndige bersicht basiert auf meinem eigenen Archiv und diversen Quellen aus demInternet. Die Fehlerfreiheit der Angaben kann grundstzlich nicht garantiert werden. Die Links beziehen sich aufherstellerspezifische Algorithmen zur Ausbildung der Teilenummern (Part Numbers) und basieren auf Informationen derChiphersteller und Chipmunk International.

Please note: This fragmentary chart is based upon my own archives and references on the Internet and may containerrors. The links are related to manufacturers specific part number code algorithms. This is based upon information fromthe Chip Manufacturers and Chipmunk International.

2. Part Number Chart: DRAM 256kBit

Organization/Manufacturer

256kx1 64kx4

Fujitsu MB81256 MB81464

Goldstar GM71C256

Hitachi HM51256 HM51464

Hyundai 53C256

Micron MT1256

Mitsubishi M5M4256

Motorola MCM6256

NEC 41256 D41464

OKI MSM41256 MSM41464

Panasonic MH41256 MN41464

Samsung KM41256

Sharp LH2464

Siemens HYB41256 HYB41464

Texas Instr. TMS4256 TMS4464

Toshiba TC41256

3. Part Number Chart: DRAM 1MBitCommon number of pins in TSOP Type II- or SOJ- package: 20 (4 groups to 5 pins)

Organization/Manufacturer 1Mx1[Mode *] 256kx4[Mode *]Fujitsu MB81C1000 [F]

MB81C1002 [S]MB81C4256 [F]

Goldstar GM71C1000 [F] GM71C4256 [F]

Hitachi HM511000 [F] HM514256 [F]HM514258 [S]

Hyundai HY531000 [F] HY534256 [F]

Micron MT4C1024 [F] MT4C4256 [F]

Mitsubishi M5M41000 [F] M5M44256 [F]

Motorola MCM511000 [F] MCM514256 [F]NEC 421000 [F] 424256 [F]

424258 [S]

OKI MSM511000 [F] MSM514256 [F]MSM514258 [S]


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Panasonic MN41C1000 [F]

Samsung KM41C1000 [F] KM44C256 [F]

Sharp LH64258 [S]

Siemens HYB511000 [F] HYB514256 [F]

Texas Instr. TMS4C1024 [F] TMS44256 [F]TMS44C256 [S]

Toshiba TC511000 [F] TC514256 [F]TC514258 [S]

* F = FPM, N = Nibble, S = Static Column, E = EDO

4. Part Number Chart: DRAM 4MBitCommon number of pins in TSOP Type II- or SOJ- package: 20 (4 groups to 5 pins up to data width of 4 Bit)


4Mx1[Mode *]

1Mx4[Mode *]

512kx8[Mode *]

256kx16[Mode *]

Fujitsu MB814100 [F] MB814400 [F] MB814800 [F] MB814260 [F]MB814265 [E]

Goldstar GM71C4100 [F] GM71C4400 [F] GM71C4800 [F] GM71C4260 [F]GM71C4263 [E]

Hitachi HM514100 [F] HM514400 [F] HM514800 [F] HM514260 [F]HM514265 [E]

Hyundai HY514100 [F] HY514400 [F] HY514800 [F] HY514260 [F]HY514264 [E]

Micron MT4C1004 [F] MT4C4001 [F] MT4C8512 [F] MT4C16257 [F]MT4C16270 [E]

Mitsubishi M5M44100 [F] M5M44400 [F] M5M44800 [F] M5M44260 [F]M5M44265 [E]

Motorola

MCM54100 [F]

MCM54400 [F]

MCM54800 [F]

MCM54260 [F]NEC 424100 [F] 424400 [F] 424800 [F] 424260 [F]

424265 [E]

OKI MSM514100 [F] MSM514400 [F]MSM514402 [S]

MSM514800 [F] MSM514260 [F]MSM514265 [E]

Panasonic MN41C4400 [F]

Samsung KM41C4000 [F] KM44C1000 [F] KM48C512 [F] KM416C256 [F]KM416C254 [E]

Sharp LH64400 [F] LH64258 [S]

Siemens HYB514100 [F] HYB514400 [F] HYB514800 [F] HYB514265 [E]

Texas Instruments TMS44100 [F] TMS44400 [F] TMS45160 [F]TMS45169 [E]

Toshiba TC514100 [F] TC514400 [F]TC514402 [S]

TC514800 [F] TC514260 [F]TC514265 [E]



10/11

5. Part Number Chart: DRAM 16MBit - 5VCommon number of pins in TSOP Type II- or SOJ- package up to data width of 8 Bits: 24 (4 groups to 6 pins). Check outmanufacturers specific part number code for the 3,3V code sequence.


16Mx1[Refr. in k, Mode *]




Fujitsu MB8116100 [4,F] MB8117400 [2,F]MB8117405 [2,E]

MB8117800 [2,F]MB8117805 [2,E]

MB8118160 [1,F]MB8118165 [1,E]

Goldstar GM71C16100 [4,F] GM71C17400 [2,F]

GM71C17403 [2,E]

GM71C17800 [2,F]

GM71C17803 [2,E]

GM71C18160 [1,F]

GM71C18163 [1,E]Hitachi HM5116100 [4,F] HM5117400 [2,F]

HM5117405 [2,E]HM5117800 [2,F]HM5117805 [2,E]

HM5118160 [1,F]HM5118165 [1,E]

Hyundai HY5116100 [4,F] HY5117400 [2,F]HY5117404 [2,E]HY5116400 [4,F]HY5116404 [4,E]

HY5117800 [2,F]HY5117804 [2,E]

HY5118160 [1,F]HY5118164 [1,E]HY5116160 [4,F]HY5116164 [4,E]

Micron MT4C4M4B1 [2,F]MT4C4M4E8 [2,E]MT4C4M4A1 [4,F]MT4C4M4E9 [4,E]

MT4C2M8B1 [2,F]MT4C2M8E7 [2,E]

MT4C1M16C3 [1,F]MT4C1M16E5 [1,E]

Mitsubishi M5M416100 [4,F] M5M417400 [2,F]M5M417405 [2,E] M5M417800 [2,F]M5M417805 [2,E] M5M418160 [1,F]M5M418165 [1,E]

Motorola MCM517400 [2,F]MCM517405 [2,E]

MCM518160 [1,F]MCM518165 [1,E]

NEC 4217100 [2,F]4217101 [2,N]4217102 [2,S]4216100 [4,F]4216101 [4,N]4216102 [4,S]

4217400 [2,F]4217405 [2,E]4216400 [4,F]4216401 [4,N]4216402 [4,S]4216405 [4,E]

4217800 [2,F]4217805 [2,E]4216800 [4,F]4216801 [4,N]4216802 [4,S]4216805 [4,E]

4218160 [1,F]4218165 [1,E]

OKI MSM5116100 [4,F] MSM5117400 [2,F]

MSM5117405 [2,E]

MSM5117800 [2,F]

MSM5117805 [2,E]

MSM5118160 [1,F]

MSM5118165 [1,E]Samsung (old code) KM41C16000 [4,F] KM44C4100 [2,F]KM44C4104 [2,E]

KM48C2100 [2,F]KM48C2104 [2,E]

KM416C1200 [1,F]KM416C1204 [1,E]

Samsung (new code) K4F170111 [4,F] K4F160411 [2,F]K4E160411 [2,E]

K4F160811 [2,F]K4E160811 [2,E]

K4F151611 [1,F]K4E151611 [1,E]

Siemens HYB5117400 [2,F]HYB5117405 [2,E]

HYB5117800 [2,F]HYB5117805 [2,E]

HYB5118160 [1,F]HYB5118165 [1,E]

Texas Instruments TMS417400 [2,F]TMS417409 [2,E]

TMS417800 [2,F]TMS417809 [2,E]

TMS418160 [1,F]TMS418165 [1,E]

Toshiba TC5116100 [4,F] TC5117400 [2,F]TC5117405 [2,E]

TC5117800 [2,F]TC5117805 [2,E]

TC5118160 [1,F]TC5118165 [1,E]



11/11

6. Part Number Chart: DRAM 64MBit - 3,3VCommon number of pins in TSOP Type II- or SOJ- package up to data width of 8 Bits: 32





Goldstar GM71V64400 [8,F]GM71V65400 [4,F]GM71V64404 [8,E]GM71V65404 [4,E]

GM71V64804 [8,E]GM71V65804 [4,E]

GM71V65160 [4,F]GM71V65163 [4,E]

Hitachi HM5164400 [8,F]HM5165400 [4,F]HM5164405 [8,E]HM5165405 [4,E]

HM5164800 [8,F]HM5165800 [4,F]HM5164805 [8,E]HM5165805 [4,E]

HM5164160 [8,F]HM5165160 [4,F]HM5164165 [8,E]HM5165165 [4,E]

Hyundai HY51V64400 [8,F]HY51V65400 [4,F]HY51V64404 [8,E]HY51V65404 [4,E]

HY51V64800 [8,F]HY51V65800 [4,F]HY51V64804 [8,E]HY51V65804 [4,E]

HY51V64160 [8,F]HY51V65160 [4,F]HY51V64164 [8,E]HY51V65164 [4,E]

Micron MT4LC16M4H9 [4,E]MT4LC16M4G3 [8,E]MT4LC16M4T8 [4,F]MT4LC16M4A7 [8,F]

MT4LC8M8C2 [4,E]MT4LC8M8P4 [8,E]MT4LC8M8B6 [4,F]MT4LC8M8E1 [8,F]

MT4LC4M16R6 [4,E]MT4LC4M16N3 [8,E]MT4LC4M16F5 [4,F]

Mitsubishi M5M467400 [8,F]M5M465400 [4,F]M5M467405 [8,E]M5M465405 [4,E]

M5M467800 [8,F]M5M465800 [4,F]M5M467805 [8,E]M5M465805 [4,E]

M5M467160 [8,F]M5M465160 [4,F]M5M467165 [8,E]M5M465165 [4,E]

NEC uPD4264400 [8,F]uPD4265400 [4,F]uPD4264405 [8,E]uPD4265405 [4,E]

uPD4264800 [8,F]uPD4265800 [4,F]uPD4264805 [8,E]uPD4265805 [4,E]

uPD4264160 [8,F]uPD4265160 [4,F]uPD4264165 [8,E]uPD4265165 [4,E]

OKI MSM51V65805 [4,E] MSM51V64405 [8,E]

Samsung (old code) KM44V16000 [8,F]KM44V16100 [4,F]KM44V16004 [8,E]

KM48V8000 [8,F]KM48V8100 [4,F]KM48V8004 [8,E]KM48V8104 [4,E]

Samsung (new code) K4F660412 [8,F]K4F640412 [4,F]K4E660412 [8,E]

K4F660812 [8,F]K4F640812 [4,F]K4E660812 [8,E]K4E640812 [4,E]

Siemens/Infineon HYB3164400 [8,F]HYB3165400 [4,F]HYB3164405 [8,E]

HYB3165800 [4,F]HYB3164805 [8,E]HYB3165805 [4,E]

HYB3166160 [?,F]HYB3166165 [?,E]

Texas Instruments TMS464400 [8,F]TMS465400 [4,F]

TMS464409 [8,E]

TMS464800 [8,F]TMS465800 [4,F]

TMS464809 [8,E]TMS465809 [4,E]

Toshiba TC5164400 [8,F]TC5165400 [4,F]TC5164405 [8,E]

TC5164800 [8,F]TC5165400 [4,F]TC5164805 [8,E]TC5165805 [4,E]

* F = FPM, E = EDO

7. Manufacturers on the Internet

"http://www.micron.com/" - Micron Technology, Inc.

"http://www.okisemi.com/" - Oki Semiconductor "http://www.samsung.com/" - Samsung

8. Download Part Number Chart V1.0PNC_V1_0.RTF - Part Number Chart V1.0 in the Rich Text Format

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