Applied Materials Confidential

SILICON SYSTEMS GROUP

Time Title Presenter

9:30 – 9:35 AM Welcome Mike Splinter, Applied Materials

9:35 – 9:40 AM Opening Toru Watanabe, Applied Materials

9:40 – 10:10 AM Sony Image Sensor Business and its Latest Technologies

Hideo Nomura, Sony

10:10 – 10:40 AM Light Control & Packaging Challenges and Solutions

Russ Perry, Applied Materials

10:40 – 11:10 AM CMOS Image Sensors and 3D Integration

Derek Hinkle, Aptina Imaging

11:10 – 11:20 AM Break

11:20 – 11:50 AM New Solutions of Ion Implantation for Advanced Image Sensor Devices

Hiro Ito, Applied Materials

11:50 – 12:20 PM The Flip Side of Front End Applications

John Boland, Applied Materials

12:20 – 12:50 PM Ultra-Smooth Deep Silicon Etching Brad Eaton, Applied Materials

12:50 – 1:00 PM Closing Toru Watanabe, Applied Materials

1:00 – 2:00 PM Lunch

Applied Materials Confidential

Image Sensors Inside Smartphone Revolution

4

300mm wafer size migration to meet growing demandb

Backside illuminated sensors to be inside ~ 75% of smartphones by 2014a

1080p high definition video capture at 30 frames/secondc

a. From 33.4 million units at 14% share (2010) to over 300 million units at 75% share (2014) in smartphones - iSuppli Corp., Sept. 2010 b. “… nearly all of the small pixel leaders have moved to advanced technology generation production using 300 mm wafers” - Ray Fontaine, Chipworks c. Apple iPhone 4s product performance spec sheet

Applied Materials Confidential

CMOS Image Sensor End Market

5

Mobility Total: 1,951M units

Notebooks 227M

Medical Systems 1.2M

Mobile Audio TV & Gaming

177M

DSC & SLR Cameras 46M

Security & Surveillance 19M

Video & Camcorders 78M

Automotive & Transport 14M

Machine Vision, Science & Space Sensors Defense <1M

Cell Phones 1,822M

Tablets 129M 2 BSI sensors per device

*2012 Unit Shipments, does not include Computer Mice. Yole Developpment, Oct 2012

Mobility Accounts ~ 70% of Total CMOS Image Sensor Shipments in 2012*

Applied Materials Confidential

Compelling Opportunity Shift to BSI

6

0%

10%

20%

30%

40%

50%

60%

70%

80%

90%

100%

2011 '12e '13f '14f '15f '16f '17f

ACCELERATED BSI ADOPTION

'11 '12e '13f '14f '15f '16f '17f

94 107

120 134

151

168 188

SMARTPHONES

TABLETS

DIGITAL STILL CAMERAS

OTHERS

(300MM KWSPM PRODUCTION)

DEMAND DRIVING PRODUCTION GROWTH

CAGR ≈ 12%

Growing demand driven by mobility and DSCs; BSI to become the de-facto architecture in production

BSI

FSI

Source: Yole Developpment (Oct’12)

Applied Materials Confidential

CMOS Image Technology Roadmap

7

FRONT SIDE ILLUMINATED

MONOLITHIC BACKSIDE ILLUMINATED

HYBRID BACKSIDE ILLUMINATED

3D INTEGRATED

PERIPHERAL 3D INTEGRATED

Com

plex

ity/p

erfo

rman

ce

2000 2009 2012 2016

Source: IMEC, Yole Developpment (Oct’12)

BSI CIS

DSP

BSI CIS

DSP

MEMORY

Applied Materials Confidential

Applied Materials Tool Box for BSI

8

Front End Optical Back End

Packaging

Wafer

Pixel & photo-diode process

Bond to Final Carrier

Flip Wafer

Grinding/Thinning

AR Coating(s)

Light Shielding and Reflecting

Microlens ARC

Glass Wafer Bonding Grinding/Thinning

3D TSV / WLP

Reflexion LK™ CMP InVia™ CVD Raider S™ ECD Avila™ CVD Silvia™ Etch

Optiva™ CVD

Endura™ PVD

VIISta™ 900XPT

Centura® Gate Stack

Astra™ DSA

Oxidation Anneal Implant

Endura™ PVD

Shields/Reflectors