SESUB Technology- Embedded Package -

TDK CorporationThin Film Device CenterSESUB Business Unit

Content

• About TDK

• SESUB Technology- Key Features of SESUB- Benefit of Embedded Package- Design Rule- SESUB application examples

• About TDK-ASE Joint Venture Company

About TDK

TDK Products

TDK sales development

50%PassiveComponentsJPY 541.2 billion

Consolidated sales Sales by product groups

34%MagneticApplication ProductsJPY 369.2 billion

14%Film ApplicationProductsJPY 151.3 billion

2%OthersJPY 20.9 billion

2015

2011 2012 2013 2014 2015

1.000

800

600

400

200

1.200

JPYbillion 862.5 802.5 841.8 984.5 1,082.6

(Fiscals 2011 – 2015, ending March 31)

Worldwide manufacturing and R&D

TDK manufacturing and R&D sites

SESUB manufacturing and R&D sites

Number of Employees : 88,076 (As of March 2015)

SESUB Technology

Key Features of SESUBBenefit of Embedded PackageSESUB Process FlowDesign RuleSESUB application examples

SESUB

SESUB = Semiconductor Embedded in SUBstrate

Embedded IC

SESUB is TDK’s the state of the art substrate solution for SiPIC wafer is grinded to 50um and embedding in resin substrate and it enables total substrate thickness to be 300umSESUB is already proven technology by many customers and IC vendors

300um

Embedded IC

SESUB Cross Section

SESUB can be treated like typical PCB, SMT devices can mount on it.

Key Features of SESUB

PKG Surface: 52 ℃Junction 54 ℃

4Layer,Substrate thickness300um

IC ( Si thickness: < 100 µm )

Bump

BGA

SMD parts Fine pitch connection50-80 µm (min.)

Layer 2Layer 1

Layer 4Layer 3

Low Profile

System IC Memory IC

Signal line

GND

GNDPOWER

GND

GNDPOWER

Signal line

System IC Memory IC

IC242 m

m35 mm

SESUB

42 m

m

35 mm

0

5

10

15

20

25

30

35

40

45

1.477 1.977 2.477 2.977

0

5

10

15

20

25

30

35

40

45

1.477 1.977 2.477 2.977

Low Noise Emission

PKG Surface: 54 ℃Junction 63 ℃

-9℃

Better Heat Dissipating

Space Saving

-65%

Discrete Solution 350mm2

SESUB Module121mm2

TWL6030

package7ｘ

IC1

IC2

SESUB solutionDiscrete WLCSP Solution

Example of Space Saving

7.0x6.4mm= 45.0mm2

5.0x5.0mm= 25.0mm2

Embedded IC

WLCSP

Key Features of SESUB

Embedding IC saves PCB area almost half size compare to discrete solution.

Space Saving = 20mm2 (Compare with Discrete WLCSP solution)

Distance between IC surface as heat source and main board is approx. 100μm

SESUB solutionConventional SiP

PKG Surface: 54 ℃Junction 63 ℃

PKG Surface: 52 ℃Junction 54 ℃

9 ℃down

IC surface in SESUB is closer to a Main board with metal rich condition. This makes a heat resistance of this structure getting smaller and contribute for better heat dissipation.

Example of Better Heat Dissipating

Key Features of SESUB

Signal line

Conventional SiP

System IC Memory IC

GND

GND

Interconnection between buried ICs by shorter signal lines within SESUB allows to improve parasitic capacitance and resistance.

Delays due to parasitic factors in total path of signal lines no longer ignored

GND

GND

Signal line

System IC Memory IC

SESUB solution

GND

GND

Signal line

System IC Memory IC

Example of Low Noise Emission

Key Features of SESUB

Discrete Solution

Benefit of Embedded PackageSelf Shielding

3D Trace Pattern Routing in SESUB

Need long distance to connect btw IC and passivesLimits area reductionSwitcher noise on return path of PGND may couple to next signal line or emitting from this pattern itselfSometimes this cause EMC issue

Connection among IC and passives can be concluded within the modulePGND plane can be isolated from other GND planeSwitching energy can be routed in internal PGND return pathSwitcher noise may be suppressed by the effect of PGND isolation

SESUB would improve noise issue due to Power GND can be isolated within SESUB

Inductor

Cout

Cin

Optimizing of switching loop (LC loop) by SESUB contributes suppressing of noise radiation

Max 69.9dBuV

Discrete Solution

Max 68.9dBuV SESUB Solution

Max 64.2dBuV

Max 76.0dBuV

Frequency (MHz)

(dB

uV)

Frequency (MHz)

(dB

uV)

(dB

uV)

Frequency (MHz)

Frequency (MHz)

(dB

uV)

Cin = 2.2uF (1005)Cout = 4.7uF (1005)Ind = 0.82uH (2012)

Cin = 2.2uF (1005)Cout = 4.7uF (1005)Ind = 0.82uH (2012)

fundamental of fsw

fundamental of fsw

Benefit of Embedded PackageSelf Shielding Effect

Example of BLE IC WLCSP QFN40

Using same die for both WLCSP and QFN package

Number of Pin 34 40+GND

Number of GPIO pin 12 22

Benefit of Embedded PackageSmaller size and more I/O available

SESUB SolutionDiscrete WLCSP Solution

1 2 3 4 5 6 7

A P2_5 P2_6 GND RF GND VPP P2_0

B GND GND GND P0_2

C GND P1_3 P0_3

D P1_2 SW_CLK P0_0 P0_1 P0_4

E P1_1 SWDIO GND P0_5

F P1_0 P2_4 GND P0_7 GND P0_6

G P2_3 RST GND VBATX32K

PX32K

M P2_1

User pad : 0.5mm pitch 7x7 matrix36pins

(Bottom view)

18 GPIO Available

3.5x3.5mm= 12.3mm25.0x4.0mm

= 20 mm2WLCSP

Smallest possible size is 5.0 x 4.0 mmNumber of GPIO is 12 (Maximum)

Because of WLCSPʼs GPIO

SESUB Features can be used for Next Gen Package SolutionSESUB Features can be used for Next Gen Package Solution

For PowerConnections

For signal connections

Flexible IC pad designOptimizing for better heat

releasing

Free access to IC pad positions within the die makes die size

optimized

Standard multi-VIA holes consume more space on IC

pad

SESUB can combine multi-VIA holes into one big hole and

contribute saving of IC pad space

Gaps between multiple Via holes required.

For obtaining same current flow capacityMaximum number die embedded

In MP : 2diesIn Development : 3dies

SESUB Copper Layer

IC Pad

SESUB enables new function IC in time to the market

Gap between dies : <500um

SESUB Package for Time in Market before making SoC

0.4m

m

Benefit of Embedded Package Can be Utilize unique technology of SESUB

IC direct connection

GND

Diode

Capacitor

Transisto

r

GND

Diode

Capacitor

Transisto

r

Wire Bonding: Peripheral Pad Arrangement

CSP:BGA Pad Arrangement

Utilizing Redistribution Layer

GND

Diode

Capacitor

Transisto

r

Direct Connection:Formed Pad on the Elements

• No need for redistribution layer: shorter lead times, high-speed, lower-cost,• Chip area reduction: miniaturization at lower cost• Performance improvement for RF and BB and high-speed memory applications• Thinner IC leads to low warpage

Actual: Requires RDL on the die for pinout No RDL for pinout

Benefit of Embedded Package

Complete Solution Provider

Design ICPreparation Embedding Assembly Tests

ICs Other comp.

Test proced.

Design Tools Passives Test

equip.Processes

Long experience and Know how in Module Business

Sales & logistic channels WW

SESUB Development & Production Locations

R&D Center

Production Location

R&D and Production Location

TDKApplication Design, Marketing

(Tokyo, Japan)

TDKSESUB Production, Process Development

(Kofu, Japan)

TDK-EPC (EPCOS)Marketing, Application Design

(Munich, Germany)

TDK-EPCAssembly, Test

(Wuxi, China)

SESUB Design Rule Roadmap

IC DieIC Die

S2L2 S1L1EIC GICSICV1/L1

V2/L2

TICBIC

BPIC

GPE

GVI

A

B

CD

Symbol

BPIC

A

L2/S2

L2

D

Embe

dded

Pad finishing

Multi layer

Encapsulation Metal cap

Bump capture pad

or Mold & Shieldor Mold

Fine

Lin

e

IC connection Diameter Unlimited max

Heat disipation

Occupation ratio 15 ~ 60 % ~ 70 %

Line and space

Via capture/landing pad

50 um

Pad Material

Outer:110/Inner:160um150 - 250 um 150 - 200 um

Pad location

Pad Pitch

2013 2014 2015 2016Item 2017

Both sideShingle side

Cu / Au / AlCu/Au

120 um

20/ 30 um34/ 46 um

Cu-OSP

30um

2 / 4 Layer4 Layer

Direct thamal via on IC back sideThin resin

80 um

10/ 20um

SESUB Application in the Market

SESUB Module Applications

Power Management UnitPower Management Unit

11.0 x 11.0 x 1.6mm

2.9 x 2.3 x 1.0 mm

POL uDCDC Buck ConverterPOL uDCDC Buck Converter Bluetooth Smart (Low Energy)Bluetooth Smart (Low Energy)

SESUB-PAN-T25415.6 x 4.6 x 1.0 mm

WiFi ComplimentaryWiFi Complimentary

7.5 x 8.0 x 1.2mm 7.8 x 6.8 x 1.2 mm

Power Supply Solutions Complimentary Wireless Solutions

Li+ Battery ChargerLi+ Battery Charger

10.3 x 8.9 x 1.4mm

SESUB-PAN-D145803.5 x 3.5 x 1.1 mm

SESUB-CHG-T242322.8 x 2.6 x 1.0mm

SESUB-CHG-Q13505.0 x 5.0 x 1.2mm

SESUB Module Products in the Market 1/2

Power Management Unit

μDCDC Module Charge Pump Module

SESUB PMUP8009

SESUB PMUP8009

SESUB Module P8008

SESUB Module P8008

SESUB ModuleP8003/P8004SESUB ModuleP8003/P8004

MainPCB

Bluetooth Smart Module

SESUB Module Products in the Market 2/2

Japanese Customer MP：2014/6~

Highly Integrated Power Management Unit

SESUB Solution for Mobile Application

Discrete + BGA packageSESUB PMU 1st Gen

-60%User Pad : 0.5mm pitch,20x21 Array, 381pads

TWL6030 package7ｘ7mm

IC1

IC2

18.0 x 18.0mm = 320sq.mm 11.0 x 11.0mm = 121sq.mmMax height (inc. Shield) 1.63mm

SESUB PMU 2nd Gen

-24%

10.3 x 8.9mm = 91.67sq.mmMax height (inc. Shield) 1.43mm

User Pad : 0.4mm pitch,21x25 Array, 415pads

Advantage of the module solutionDialog Semiconductor DA14580, Bluetooth V4.1 Smart compliant is integratedTx power level : 0dBm, Rx Sensitivity level : -93dBmTx current consumption : 5mA, Rx current consumption : 5mAStandby current : 0.8uA

SESUB Solution for Wearable Application

Conventional Bluetooth Module

8.5

8.5

3.5

3.5

SESUB-PAN-D14580

Area Saving : 83%

Status: Sample is available, Mass Production starting from Aug 2015

SESUB-PAN-D14580 Bluetooth V4.1 Low Energy Module

Unit in mm

SESUB-CHG-T24232Li+ Battery Charger with TI BQ24232

SESUB Solution for Wearable Application

*excluding configuration resisters for battery charge conditions.Be flexible to various type of Li+ battery cells.

6.8

7.0

3.0 x 3.0IC size

Advantage of SESUB-CHG-T24232Saving PCB size (over 50%)Improving ASSY yield on application PCBPnP utilization for less PCB design work

Status: Engineering sample is available, MP start from Nov-2015

【Discrete circuit】PCB size : 47.6mm2

-79%

【TDK_Module】+ (4 x Resisters) PCB size : 9.8mm2

Unit in mm2.8

3.5

TDK-ASE Joint Venture

May 8th, 2015 Advanced Semiconductor Engineering, Inc. and TDK Corporation

announced that both companies will enter into an agreement to establish a joint venture company to manufacture IC embedded substrates using TDKʼs SESUB® technology.

Visit TDK Product Center on our web site for more detail.http://product.tdk.com/en/products/sesub/

Support Mail : SESUB_Support@tdk.co.jp