SEMICONDUCTOR TECHNOLOGY -CMOS-wada/system12/60-SYSARC2012(CMOS).pdf · 2012-12-03 · Wafer Test...
Transcript of SEMICONDUCTOR TECHNOLOGY -CMOS-wada/system12/60-SYSARC2012(CMOS).pdf · 2012-12-03 · Wafer Test...
2012/12/3
SEMICONDUCTOR TECHNOLOGY-CMOS-
Fire Tom Wada
2012/12/3
What is semiconductor and LSIs
Huge number of transistors can be integrated in a small Si chip.The size of the chip is roughly the size of nails.Currently, 1000M transistors can be integrated.1000 times integration comparing to 20 yrs ago.The cost of the chip is roughly same.All electronic equipments are powered by LSIs.PCs, Cellular phones, 3D graphics, Internet.
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PC mother board
Large Scale Integration
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SONY PLAYSTATION 2 MAINBOARD
Rendering LSI
High Speed Memory
Graphics LSI
Direct RDRAM
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Mobile Phone MainboardMemory, Logic, Analog
iPhone5
BodyLCD Display
Battery
Electronic Board
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Electronic Board (front side)Wireless
CommunicationLSI
1 LSIComputer
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Electronic Board (back side)
FlashMemory
Sound Codec LSI
WLANLSI
Analog LSI
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Key device is LSI
INTEL Pentium III module
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This is a packaged LSI-Pentium III 300MHz Cache LSI-
15 mm
20 mm
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Si chip is molded in the package.
2 million transistor Chip is connected to the pins thru
wires.
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6 inches Si wafer
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8 inches Si wafer
Hundreds of Chips
on a Si Wafer
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Several hundreds of chips are fabricated on a wafer simultaneously.
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Chip photo- Motion Estimation Chip for HDTV camera -
9.1 mm
8.6 mm
Your small finger’s nail size.
200M transistors.
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Scanning Electron Microscope photo- Cross-section of the LSI -
0.5 micron
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Structure Of CMOS LSI
IsolationPN-Isolation, Local oxidation
Si SubstrateBulk, epitaxial , SOI
Well StructureN-type well in P-type Substrate
Latch UpPNP Bipolar Transistor and NPN Bipolar Transistor
Fabrication Process Technology
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Cross-section of the LSI
P-type Si substrateN-type well
N+ N+ P+ P+
Metal wiring
Poly-silicon Poly-silicon
N-type MOS transistor P-type MOS transistor
Si wafer
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Transistor module (FEP)
65nm
Lithography(VUV, EPL)Mask
CMPplanarization
Low Resistance Contact withHigh Aspect ratio
High κGate insulator
Fine Cu interconnect
Low κinterdielectric
SiGe/Metal gate
Multi-level Metalization Module(BEP)
Low Resistance Ultra shallow junction
Low stress Shallow Trench Isolation
Advanced Process Development
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LSI integration trend- Moore’s law -
Wide-TV, PHS phone
DVD player
DVD-ROM
DVD-RAM
DVD recorder
Source: SEMATEC
81
10B
1B
100M
10M
1M
100K
10K
1K
83 85 87 89 91 93 95 97 99 01 03 05 07 09
0.8 0.5 0.3 0.18CHANNEL LENGTH (MICRON)
0.13
Digital HDTV receiver
Num
ber
of t
rans
isto
rs o
n a
chip
The number of transistors are increasing
by 58% per year.
- Moore’s Law -
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Communications and Consumer Products Drive Semiconductor
Sources: Applied Materials Corporate Marketing estimates, Dataquest
35%
30%
25%
20%
15%
10%
5%
0%0% 5% 10% 15% 20% 25% 30% 35%
CAGR % (1997-2002)
SemiconductorIndustry
Ap
plic
atio
n M
arke
tG
row
th
SC Content (As % of Equipment Cost)
3rd Generation
2nd Generation
1st Generation
ColorTV
ColorTV
CarRadioCar
Radio
VideoCameraVideo
Camera
PortableComputingPortable
ComputingSwitching& LAN
Switching& LAN
HDTVHDTV
MultimediaPC
MultimediaPC
Advanced DesktopPC and WorkstationAdvanced Desktop
PC and Workstation
AutomotiveApplications/GPS
AutomotiveApplications/GPS
DVDPlayerDVD
Player
Set-TopBox
Set-TopBox
Internet Game Consoles
Internet Game ConsolesSmart
Cards/KiosksSmart
Cards/Kiosks SmartAppliance-Phone
SmartAppliance-Phone
Digital CameraDigital Camera
40% 45% 50% 55%
40%
45% Cellular PhonesCellular Phones
FABRICATION PROCESS ISSUES
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Ultra Clean Room
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Basic LSI process
Layer Deposition
lithography
etching
cleaning
M1
M2
M3
M4
M5
M6
M7
SEM photo of Logic LSIs
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Projection
AA A A A A A A A A A A A A A
A A A A A A A A A A A A A AA A A A A A A A A A A
Lens
Si Wafer
Mask
Lens
Light Source
X
Y
Stage
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Wafer Test
scribing
Chips
Mounting
Bonding
Enclosing
marking
Final Test I
Burn-In
Ex.)Vcc:7V,Temp.:125℃, 24~42hrs
Remove Process defect Chips
Functional Test,DC TestA
ssem
bly
Flow
Shipping TestFinal Test II
Packaging & Test
Sample
Wafer
Functional Test,DC/AC Test
Functional Test(at Speed),DC/AC Test
Pre Test
Testing
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Large Scale Integration
NMOS , PMOS and WiringAll Logic Function can be madeMemory Element Can be made
Billions of Transistors and wiring make LSI!
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CMOS NOT (Inverter)
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CMOS NAND と NORA B f
0 0 1
0 1 1
1 0 1
1 1 0
A B f
0 0 1
0 1 0
1 0 0
1 1 0
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Classification Of LSI1. Logic LSI: Micro Processor, Digital Signal Processor (DSP), FPGA2. Memory LSI: RAM (DRAM, SRAM), ROM (Flash Memory)3. Analog LSI: ADC, DAC, Filter, Amplifier
Micro Processor (PC’s central processing Unit)Perform Digital computation according to the program in MemoryIntegration in 7000 times in 25 years, (Moor’s Law) Clock Speed : 700 times in 25 years
Memory LSI:Dynamic Random Access Memory: Main memory for Computer, 4-times density in 4 yearsStatic Random Access Memory : work memory for mobile equipmentsFlash Memory : Nonvolatile memory , Digital Camera Storage
Analog LSI: Used for interface, high speed RF interface, Analog to Digital Conversion, Digital to Analog Conversion
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Analog to Digital Conversion
ADC LSI
Analog to Digital
Sample the analog wave
Convert to Digital format in Binary
Same as f(t) to An
Continuous time
Discrete time
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SoC Flash Memory
Chip photo 1
Chip photo 2
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Mobile Digital TV receiver