Semiconductor Nanowire Heteroepitaxy on Arbitraryyp ......Semiconductor Nanowire Heteroepitaxy on...
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Semiconductor Nanowire Heteroepitaxy on Semiconductor Nanowire Heteroepitaxy on Arbitrary Substrates for Optoelectronic Devices Arbitrary Substrates for Optoelectronic Devices y py p
and Massively Parallel Interconnectsand Massively Parallel Interconnects
M. Saif Islam Logeeswaran VJ, LinjieZhou & S. J. Ben Yoo
University of California – Davis
Sonia Grego and Kristin Gilchrist RTI International
N. P. KobayashiUniversity of California Santa Cruz
1M. Saif Islam Integrated Nanodevices and Systems Research, University of California Davis 1
S. Y. Wang and R. Stanley WilliamsHP Labs
Outline
• Semiconductor nanowires to overcome issues of heteroepitaxy I Pheteroepitaxy– Constraints of substrates– Enabling Devices for Si Photonics Si
InP
• Nanowires as Interconnects SiO2cladding
Aucatalyst Si
nanowirescladding
Poly-Si
2M. Saif Islam Integrated Nanodevices and Systems Research, University of California Davis 2
One-D NanowiresWang et. al.Lieber et. al.
Fukui et. al.
Yang et. al.
2
Kamins et. al.Busbee et. al.Gundiah et. al.
2 m Islam et. al.
Samuelson et. al.
Cao et. al.
33Integrated Nanodevices and Systems Research, University of California Davis
Martin et. al. Zhou, Meyyappan, Kim, Ng, Samuelson …..Ag, Au, Zn, InP, ZnO, Si, Ge, Si-Ge, ZnS, GaN, InGaAs, In2O3
The Challenge: Interconnecting Nanowire Devices
Research based approach
• Alignment by fluid flow & electric field• Contact formed by e-beam lithography
One device at a time• One device at a time• Helps characterize & explore novel nanostructure
device applications
Mayer, Penn State
pp
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Lieber et. al., Harvard Heath et. al., UCLA/CaltechLieber et. al. Science 2001 26, 291, 630-633
Manipulation of NWs
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Lieber et. al., Harvard
Growth Direction and “Epitaxy”
500 nm
(111)-4 substrate
[111]
Si(111)
[111]
T I K i t l
Borgstrom et. al., 2007
610/5/2009 M. Saif Islam Integrated Nanodevices and Systems Research, University of California Davis 6
Good electrical and mechanical connection to the substrateT I Kamins et. al.
Simultaneous Growth of Nanowires and Connecting Electrodes
Metal on Si surfaceEvaporation at 45o angleEvaporation at 45o angle
Si SiO2[111]
1. Metal deposition, metal-silicide formation
SiO2Si
silicide formation
2. Growth of Nanowire 3. Nanowire Bridge
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Saif Islam et. al., Nanotechnology 15 (2004) L5–L8
Connecting Nanostructures:Bridging Nanowires
Form trench anddeposit catalyst
M Saif Islam S Sharma T I Kamins and R Stanley
2 µm
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M. Saif Islam, S. Sharma, T. I. Kamins, and R. StanleyWilliams, Nanotechnology 15, L5-L8 (May 2004)
Connecting Nanostructures:Bridging Nanowires
Form trench anddeposit catalyst
Nanowire grows perpendicularto (111)-oriented sidewall
2 µm
M Saif Islam S Sharma T I Kamins and R Stanley
2 µmµ
910/5/2009 M. Saif Islam Integrated Nanodevices and Systems Research, University of California Davis 9
M. Saif Islam, S. Sharma, T. I. Kamins, and R. StanleyWilliams, Nanotechnology 15, L5-L8 (May 2004)
Connecting Nanostructures:Bridging Nanowires
Form trench anddeposit catalyst
Nanowire grows perpendicularto (111)-oriented sidewall
Nanowire connectsto opposite sidewall
2 µm
M Saif Islam S Sharma T I Kamins and R Stanley 2 µm
2 µmµ
1010/5/2009 M. Saif Islam Integrated Nanodevices and Systems Research, University of California Davis 10
M. Saif Islam, S. Sharma, T. I. Kamins, and R. StanleyWilliams, Nanotechnology 15, L5-L8 (May 2004)
2 µm
Easier Interfacing, Linear and OhmicSingle Nano-bridge Current vs number of Nano-bridgesSingle Nano-bridge Current vs number of Nano-bridgesg g Current vs number of Nano bridges
0
1
2
3
t (A
)0
100
200
300
3 NWs
12 NWs
20 NWs
t (A
)
g g Current vs number of Nano bridges
0
1
2
3
t (A
)0
100
200
300
3 NWs
12 NWs
20 NWs
t (A
)
-5 -4 -3 -2 -1 0 1 2 3 4 5
-3
-2
-1C
urre
nt
V lt (V)-5 -4 -3 -2 -1 0 1 2 3 4 5
-300
-200
-100
Cur
rent
V lt (V)-5 -4 -3 -2 -1 0 1 2 3 4 5
-3
-2
-1C
urre
nt
V lt (V)-5 -4 -3 -2 -1 0 1 2 3 4 5
-300
-200
-100
Cur
rent
V lt (V)Voltage (V) Voltage (V)Voltage (V) Voltage (V)
1110/5/2009 M. Saif Islam Integrated Nanodevices and Systems Research, University of California Davis 11
Bridging Si Nanowires
3.E-04
3.E-04
2.E-04
2.E-04
ent (
I) •Average current density at failure 3.8106 A/cm2
5E 05
1.E-04Cur
re •Suspended bridges help in faster thermal dissipation
0.E+00
5.E-05
0 5 10 15
Bias (V)Nano-lollipops
Bias (V)
2µm
12M. Saif Islam Integrated Nanodevices and Systems Research, University of California Davis 12
Length vs Resistance
Si electrode
Si nanowireSi-Si contactat the interface
2Rcontact2µm
Nano Letters, vol. 7, pp. 1536-1541, 2007
electrode
1310/5/2009 Saif Islam 13Integrated Nanodevices and Systems Research, University of California Davis
RNW Rcontact
nanowire
contact
nanowire
Noise in Si Nanowires
•Carrier mobility fluctuation
Noise measurement shows
1 E 10
Carrier mobility fluctuation
•Carrier trapping–detrapping etc.
•Yield information about manufacturing & i ki f d i
A is relative amplitude of 1/f noise and R is the resistance
1.E-11
1.E-10 process & inner workings of a device.
•Low voltage operation requires low noise as the signal to noise ratio is
iti l
Nanotube Hooge parameter 10-3
1.E-13
1.E-12
A/R
Si Nanowire
Carbon NanotubeSi nano-bridge
critical.
> Two orders of it d l i
1.E-15
1.E-14 magnitude lower noise than CNT
Nano-bridge
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1.E-16
IEEE Trans. Nanotechnology, 5, No. 5, p523 2006ZnO, InP etc. on Si are likely have higher
noise due to interface resistance
Heteroepitaxial Growth of IIIHeteroepitaxial Growth of III--V V Nanowires on Silicon surfacesNanowires on Silicon surfaces
Agilent TechnologiesMolecular Technology Laboratory15
Issues with planar, epitaxial growth of III-V on Si
• Large lattice mismatch (~8.06%) causing high-density of misfit dislocations
~nm
Phigh density of misfit dislocations• Large difference in thermal expansion
coefficients leading to stress• Difference in crystal structures (polar vs.
InP
~µmy (p
non-polar) leading to antiphase domains and boundaries
III V
Si (111) substrate
Si substrate
III-VOPPORTUNITIES
Si Photonics (Lasers, LED, PD, displays
Si
InP
( , , , p yetc.)
Ultra-fast III-V devices integrated with Si CMOS (HEMTs, FETs, mixers etc >100GHz
Agilent TechnologiesMolecular Technology LaboratoryIntegrated Nanodevices and Systems Research, UC Davis
Si(
speed)
16
Dr. Mario Paniccia, Intel Corporation
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GaAs & InP nanowires grown on Silicon-(111)
(A) GaAs and and (B) InP nanowires
Agilent TechnologiesMolecular Technology LaboratoryIntegrated Nanodevices and Systems Research, UC Davis
Samuelson et. al. NANO LETTERS 2004 Vol. 4, No. 10 p1987
18
SEM images of vertically aligned InP nanowires grown on Si (111)
1 µm
6 µmYoo et al
~30-50°
Yoo et al.
Si (111)
[111]
11>
0.338 nmSi (111)Yi, Girolami, Amano, Sharma, Kamins, Kimukin, Islam, IEEE Nano 2005 <1
Non-epitaxial nanowires are entangled despite
Agilent TechnologiesMolecular Technology LaboratoryIntegrated Nanodevices and Systems Research, UC Davis
perfect crystal quality & uniform diameter
19
InP Nano-Bridges Between Si Electrodes
Goals:•Si Photonics (Laser, LED, PD, displays etc)•Ultra fast III V devices integrated with Si CMOS•Ultra-fast III-V devices integrated with Si CMOS (HEMTs, FETs, mixers etc >100GHz speed)
Si SiInP
IBridge + light
InPSi Si 0
1
IBridge ( li ht)
g
(A x
10-6
)InPSi Si
SiO2 -1
(no light)C
urre
nt
Si
SiInP
Challenges::
SiYi, Girolami, Amano, Sharma, Kamins,
-10 -5 0 5 10
Voltage (V)
Si
Agilent TechnologiesMolecular Technology LaboratoryIntegrated Nanodevices and Systems Research, UC Davis
g•Interface barrier due to bandgap and workfunction mismatch•Growth of ternary and quaternary •Orientation and position of III-V on Si
Kimukin, Islam, APL, 89, 133121, 2006.
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Growth of IIIGrowth of III--V Nanowires on V Nanowires on Amorphous SurfacesAmorphous Surfacespp
21
Ultra-fast NW photoconductor on Quartz
Active device
Coplanar waveguide
SiOSiO2
Ti/Pt 200µmActive device
Active device
Coplanar waveguide
SiOSiO2
Ti/Pt 200µmActive device
i HG
SG
O2SiO2
Ti/PtTi/Pt
Coplanar waveguide
O2
i HG
SG
O2SiO2
Ti/PtTi/Pt
Coplanar waveguide
O2
baµc-Si:HIntersecting
InP Nanowires
200nm
SiO
c1µm
baµc-Si:HIntersecting
InP Nanowires
200nm
SiO
c1µm
µc-Si:H
Intersecting Nanowires
1Intersecting
InP Nanowires
µc-Si:H
Intersecting Nanowires
1Intersecting
InP Nanowires
5µm ed
Nanowires
f
2 3
35µm ed
Nanowires
f
2 3
3
Integrated Nanodevices and Systems Research, UC Davis
Applied Phys. Lett. 91 113116 (2007).
22
Ultra-fast NW photoconductor on Quartz
Active device
Coplanar waveguide
SiO2
Ti/PtActive device
Coplanar waveguide
SiO2
Ti/PtActive device
Coplanar waveguide
SiO2
Ti/PtActive device
Coplanar waveguide
SiO2
Ti/PtApplied Phys. A, 2008
GS
G
GS
G
GS
G
GS
G
•The measured FWHM from the oscilloscope was 18 psThe measured FWHM from the oscilloscope was 18 ps•11.2 ps FWHM response for the 40-GHz oscilloscope and the laser pulse width of 1 ps•The device temporal response is estimated to be 14 ps at 780nm
222
Integrated Nanodevices and Systems Research, UC Davis
opticalscopeactualmeas K. Rush, S. Draving, and J. Kerley, IEEE Spectrum 27, 38 (1990).
23
WaveguideWaveguide--Integrated Nanowire Photoconductors Integrated Nanowire Photoconductors on a Nonon a Non--Single Crystal SurfaceSingle Crystal Surfaceg yg y
SiO2cladding
Aucatalyst Si
nanowires
Vertical walls provide
Mechanical support for bridging NW
Poly-Si
Electrical contact through Poly-Si film
Optical pathways
Poly-Si film performs as:
Seed layer for crystalline growthSeed layer for crystalline growth
Electrical contact
24
Growth on angle-deposited Au catalystWaveguide-integrated devices
WG core
SiO2
Poly-Si
WG core
Si (100)
(10 um)Different Au
Cross-section of thermal oxide trench device
patterns:A trade-off between growth requirement andrequirement and electrical signal background.
25
Photoresponse of edge-illuminated nanowires (I)
400600
dark
1.4
ratio
V=3V=-1V=-3
-2000
200
curre
nt (p
A) 2mW
1.0
1.2
0 1 2 3Input Laser power (mW)
On/
Off
-600-400
-5 -4 -3 -2 -1 0 1 2 3 4 5V bias (V)
p p ( )
On/Off Ratio ~ 1.35 Sample had poor optical
transmission due to scattering
V bias (V)
V
transmission due to scattering
26
V
Opportunities for Novel Devices
I
Bridged
Mirror at 45o II
Bridged
Mirror at 45o I
Bridged
Mirror at 45o II
Bridged
Mirror at 45o
QD
High Qit
DBR
CMOSBridged
Nanowire
QD
High Qit
DBR
CMOSBridged
Nanowire
QD
High Qit
DBR
CMOSBridged
Nanowire
QD
High Qit
DBR
CMOSBridged
Nanowire
DBR
cavity
DBR
cavity
DBR
cavity
DBR
cavity
QDElectrode NanowiresQDElectrode NanowiresQDElectrode NanowiresQDElectrode Nanowires
27
Mirrors
Lateral QD laser on Si and III-V wafer
OutputMirrors
Lateral QD laser on Si and III-V wafer
OutputMirrors
Lateral QD laser on Si and III-V wafer
Mirrors
Lateral QD laser on Si and III-V wafer
Output
27
Nanowires for MassivelyNanowires for MassivelyNanowires for Massively Nanowires for Massively Parallel InterconnectsParallel InterconnectsParallel InterconnectsParallel Interconnects
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SiliconSilicon
Nanowire
Silicon
Nanowire
Silicon
(a-b) Schematics of vertically oriented nanowires grown and bridged between two
(a) (c)(b) Silicon(a) (c)(b) Silicon
g glateral surfaces. (c) Experimental demonstration with Si nanowires.
Si b t t
Integrated Nanodevices and Systems Research, UC Davis
Si substrate
29
Nanowires for Multi-Layer Chip Stackingg
Borgstrom et. al., 2007
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Processed Chips Bonded Using Nanaowires
MemoryNanowires
Solder bumps
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Logic
31
Vertical Interconnects in Vias
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Paul C. McIntyre, Stanford UniversityIBM
32
Summary•Semiconductor nanowires can overcome issues of heteroepitaxy Enabling Devices for Si Photonicsp y g
•Nanowires can be used as short range electrical interconnects
Si electrode
Si Si contactSiO2
Aucatalyst Si
nanowires
Si SiInP
2µm
Si nanowireSi-Si contactat the interface
S O2cladding
Poly-Si
2µm
Thank You10/5/2009 Saif Islam Integrated Nanodevices and Systems Research, UC Davis 33
Thank You