Self-Assembly for Nano and Micro Manufacturingsequin/CS298/PAPERS/Parviz_Oct… · Nano-scale...
Transcript of Self-Assembly for Nano and Micro Manufacturingsequin/CS298/PAPERS/Parviz_Oct… · Nano-scale...
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Self-Assembly for Nano and Micro Manufacturing
Babak A. Parviz
UC Berkeley, October 24th 2005
ParallelNanofabrication
3-D CircuitArchitectures
Low-costFabrication
Integration OfIncompatible
Processes
Nano-scaleElectronicDevices Complex
Systems WithMany
Elements
Self-Assembly
DNA~2-1/2 nm diameter
Things NaturalThings Natural Things ManmadeThings Manmade
Fly ash~ 10-20 µm
Atoms of siliconspacing ~tenths of nm
Head of a pin1-2 mm
Quantum corral of 48 iron atoms on copper surfacepositioned one at a time with an STM tip
Corral diameter 14 nm
Human hair~ 60-120 µm wide
Red blood cellswith white cell
~ 2-5 µm
Ant~ 5 mm
Dust mite
200 µm
ATP synthase
~10 nm diameterNanotube electrode
Carbon nanotube~1.3 nm diameter
O O
O
OO
O OO O OO OO
O
S
O
S
O
S
O
S
O
S
O
S
O
S
O
S
PO
O
The Challenge
Fabricate and combine nanoscale building blocks to make useful devices, e.g., a photosynthetic reaction center with integral semiconductor storage.
Mic
row
orl
d
0.1 nm
1 nanometer (nm)
0.01 µm10 nm
0.1 µm100 nm
1 micrometer (µm)
0.01 mm10 µm
0.1 mm100 µm
1 millimeter (mm)
1 cm10 mm
10-2 m
10-3 m
10-4 m
10-5 m
10-6 m
10-7 m
10-8 m
10-9 m
10-10 m
Visib
le
Nan
owor
ld
1,000 nanometers =
Infra
red
Ultra
violet
Micr
owav
eSo
ft x-
ray
1,000,000 nanometers =
Zone plate x-ray “lens”Outer ring spacing ~35 nm
Office of Basic Energy SciencesOffice of Science, U.S. DOE
Version 10-07-03, pmd
The Scale of Things The Scale of Things –– Nanometers and MoreNanometers and More
MicroElectroMechanical(MEMS) devices10 -100 µm wide
Red blood cellsPollen grain
Carbon buckyball
~1 nm diameter
Self-assembled,Nature-inspired structureMany 10s of nm
Self-Assembly
The complete “system”
Single cell
Complex (many elements)Three dimensionalNano-scale precisionCan span many orders of magnitude (interfacing with micro and macro)Self-reorganization and self-healing
A fundamentally different approach to making things.
Evolution of manufacturing
0-D
1-D2-D
Time
3-DBlacksmith
Assembly Line
SemiconductorMicrofabrication
SelfAssembly
Basic dilemmas• How do we make the parts?
– Chemical synthesis– Solid-state microfabrication
• How do we direct their self-assembly processes?– Specific covalent bonds– DNA programming– Genetically engineered polypeptides– Shape recognition– Directed surface tension forces
2
1 nm
10 nm
100 nm
1 µm
10 µm
100 µm
Self-assembled molecular electronics
Engineered DNA networks as templates for nanoelectronic circuits
Using genetically engineered polypeptidesto guide self-assembly
Self-assembling Si circuits on plastic
Self-assembled silicon networks1 mm
1 cm Hybrid silicon-organic systems
100 nm – 200 nm
9 Å
Easy integration with CMOSSub-nm control on potential landscape
What is a Self-Assembled Monolayer?What is a Self-Assembled Monolayer (SAM)?
head group
carbon chain
sulfur2-3
nm
head group
carbon chain
sulfur2-3
nm
STM courtesy of IBM
Molecules Forming SAM on Silicon Dioxide Surface
PO OHHO
PO OHHO
SiCl CH3
CH3 SiCl CH3
CH3
Anthryl dimethylchlorosilane Pyryl dimethylchlorosilane
Anthryl phosphonic acid Pyryl phosphonic acid
PYPA Self-Assembly•Can form mono or multilayer structures
•Form interesting crystal structure (important for crystalline monolayer)
• Competition between π-π stacking, hydrogen bonding and solvent interactions
Hin-Lap Yip, Hong Ma, Alex K.-Y. Jen, Jianchun Dong, Babak A. Parviz, “Two-Dimensional Self-Assembly of 1-Pyrylphosphonic Acid: Transfer of Stacks on Structured Surface”, submitted to the Journal of American Chemical Society
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Fabrication Process of Electrodes
Si
Si
Oxidation
Si
Spincoating withPMMA
Si
Electron BeamLithography
Si
Liftoff
Si
Self-Assembly
Si
400 nm SiO2
70 nm PMMA
Cr/Au Evaporation
5/50 nm Cr/Au
1.5 nm ANPA
SEM Picture of the Fabricated Electrodes
Jianchun Dong, Babak A. Parviz, Hin L. Yip, Hong Ma, and Alex K-Y. Jen, “Construction and Electrical Characaterization of 0.9 nm Tall Channels Made via Pyryl Phosphonic Acid (PYPA) Self-assembly”, Proceedings of NSTI Nanotechnology Conference, v3, pp. 188-191, Anaheim CA May 8-12 2005
200 300 400 500 600 700 800 900 10000.2
0.4
0.6
0.8
1
1.2
1.4
1.6
1.8
2
2.2
Channel Length (nm)
I DS (n
A)
VGS = 0V VDS = 4V T = 300oK
1.5 2 2.5 3 3.5 410-14
10-13
10-12
10-11
10-10
10-9
10-8
VDS (V)
I DS (A
)
T = 300oKVGS = 0VL = 600 nm
Channel length dependence of current for PYPA devices
Parviz 2005
Temp. dependence of current for PYPA devices
AFM Picture
STM Picture
150 200 250 300 35010-18
10-16
10-14
10-12
10-10
10-8
Temperature (oK)
I DS (A
)
VGS
=0V VDS=4V (A)L = 400 nm
Fitting curve using Poole -Frenkel emission equation
Experimental data
-15 -10 -5 0 5 10 1510
-13
10-12
10-11
10-10
10-9
10-8
10-7
VG (V)
I DS a
t VD
S =
4V
(A)
330K320K310K300K290K280K270K260K250K240K230K
Gating the transport through the molecular system
220 240 260 280 300 320 340100
101
102
103
Temperature (oK)
On/
Off
Rat
io
Jianchun Dong, Hin L. Yip, Hong Ma, Alex K.Y. Jen, Babak A. Parviz, “Gated lateral charge transport in a self-assembled pyryl phosphonic acid molecular multi-layer with defined 2.5 nm step heights”, submitted to Journal of Applied Physics
-15 -10 -5 0 5 10 1510
-10
10-9
10-8
10-7
VGS (V)
µ h (cm
2 /Vs)
T = 230oKVDS = 4V L = 400 nm
10010-15
10-14
10-13
10-12
10-11
10-10
VDS (V)
I DS (A
)
VGS = 15VVGS = 10VVGS = 5VVGS = 0VVGS = -5VVGS = -10VVGS = -15V
T = 230oKL = 400 nm
VGS = -15V
VGS = -10V VGS = -5V
Gate voltage dependence of mobility
Parviz 2005
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1 nm
10 nm
100 nm
1 µm
10 µm
100 µm
Self-assembled molecular electronics
Engineered DNA networks as templates for nanoelectronic circuits
Using genetically engineered polypeptidesto guide self-assembly
Self-assembling Si circuits on plastic
Self-assembled silicon networks1 mm
1 cm Self-assembling electronic components on DNA templates
C. Mao/B. A. Parviz (2005) 8 nm Palladium nanowire on DNA template
Platform for the Bottom-up self-assembly ofintegrated circuits
DNA Nanowire morphology study with AFM
John Lund, Jianchun Dong, Zhaoxiang Deng, Chengde Mao, and Babak Parviz, “DNA Networks as Templates for Bottom-up Assembly of MetalNanowires”, 5th IEEE Conference on Nanotechnology, Paper # TH-P2-5, Nagoya, Japan July 11-15, 2005
Electrical transport in DNA nanowires
Gold Pads (27 wires)
0
50
100
150
200
250
0 5 10
Voltage (V)
Cur
rent
(pA
)
120150180210240270300
T (K)_
DNA-directed self-assembly of nano photonic waveguides
Gain, G, through each QD Inter-dot coupling η
Pump light
SignalLinking chemistry
Quantum dots
substrateGain, G, through
each QD Inter-dot coupling η
Pump light
SignalLinking chemistry
Quantum dots
substrate
Hydroxyl groups on exposed surfaces of
PMMA trench
PMMASiO2/Si
OHOHOHOH
MPTMS
OOSi
SH
OSi
SH
OSi
SH
O OO
5’acrydite-DNA
SS S=O
H-N=O
H-N=O
H-N
OOSi
OSi
OSi
O OO
Hydroxyl groups on exposed surfaces of
PMMA trench
PMMASiO2/Si
OHOHOHOHOHOHOHOH
MPTMS
OOSi
SH
OSi
SH
OSi
SH
O OO
5’acrydite-DNA
SS S=O
H-N=O
H-N=O
H-N
OOSi
OSi
OSi
O OO
Biotin-cDNA
SS S=O
H-N=O
H-N=O
H-N
OOSi
OSi
OSi
O OO
Streptavidin-QD
SS S=O
H-N=O
H-N=O
H-N
OOSi
OSi
OSi
O OO
PMMASiO2/Si
Biotin-cDNA
SS S=O
H-N=O
H-N=O
H-N
OOSi
OSi
OSi
O OO
Streptavidin-QD
SS S=O
H-N=O
H-N=O
H-N
OOSi
OSi
OSi
O OO
PMMASiO2/Si
Chia-Jean Wang, Lih Y. Lin, and Babak A. Parviz, “Modeling and Simulation for a Nano-Photonic Quantum Dot Waveguide Fabricated by DNA-Directed Self-Assembly”, IEEE Journal on Selected Topics in Quantum Electronics, v 11, n 2, March/April 2005, p 500-509
1 nm
10 nm
100 nm
1 µm
10 µm
100 µm
Self-assembled molecular electronics
Engineered DNA networks as templates for nanoelectronic circuits
Using genetically engineered polypeptidesto guide self-assembly
Self-assembling Si circuits on plastic
Self-assembled silicon networks1 mm
1 cm
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Organic tools – Inorganic goals
Why me?
5 µm
200 nm
b
Proteins control hard tissue formation through nucleation, growth, compartmentalization, …… scaffolding, etc., leading to controlled architectures with hierarchical structures
Magnetic nanoparticles in bacteria
Hierarchically structured Dental tissues
Sponge spicules:natural optical fibers
Mammalian Enamel
Sarikaya et al. , PNAS, 1999
Xiaorong Xiang, Mary Lidstrom, Babak A. Parviz, “Microorganisms as Microelectromechanical Systems”, submitted to the ASME/IEEE Journal of Microelectromechanical Systems
A Look at Biology …
Weiner, et al., Science 2005
Phage display
P3
Constrained peptide
P6
M13Phage-Display
System
Principle: display at the N-terminus of phage M13 P3 protein
P3 copies per virion: 5Random segment size:
7 or 12 aa Primary clones:
1.9 x 109 (PhD12)Sequence space:
207 = 1.28 x 109
2012 = 4.1 x 1015
Cell surface display
Principle: cell surface display Within the active site loop of TrxA which is itself inserted within FliC
Flagella copies per cell: 10-15
Random segment size: 12 aa
Primary clones: 1.77 x 108
Sequence space: 2012 = 4.1 x 1015
FliTrx Cell-Surface
(Flagellar)Display System
GEPIGEPI – Genetically-Engineered Polypeptides for Inorganics
The Molecular Tool KitThe Molecular Tool Kit
Au Binders:GBP1:mhgktqatsgtiqs (14 AA)GBP2:ALVPTAHRLDGNM(14 AA)GBP3:LGQSGASLQGSEKLTNG(17 AA)GBP4:SEKLVRGMEGASLHPA(16 AA)GBP5:glndifeaqkiewh(14 AA)Ag-Binders:AgBP1:AYSSGAPPMPPF (16 AA)AgBP2NPSSLFRYLPSD (16 AA)AgBP3:SLATQPPRTPPV(16 AA)Pt-Binders:PtBP1:SVTQNKY(7 AA)PtBP2:HKVTLHN(7 AA)PtBP3:HGPDTRN(7 AA)Pd-Binders:PdBP1:SAGRLSA(7 AA)PdBP2:TLPNHTV(7 AA)PdBP3:INLSNRM(7 AA)ZnO Binders:CN122:LGSWGELLWQRQ(12 AA)CN173:YRDLLRSYRKRW(12 AA)CN177:HYANSIWALASQ(12 AA)Cu2O Binders:CN225: RHTDGLRRIAAR(12 AA)CN85: RTRRQGGDVSRD(12 AA)CN44:NTVWRLNSSCGM(12 AA)
Table – I:
AU
AG
Pt
pd
zno
cuxo
Materials of Interest:•Biocompatible MaterialsAl2O3, Stainless Steel., Ti-Alloys, HA
•Semiconductors:ZnO/ZnS, CdO/CdS, Si/SiGe ..
•Functional Substrates:Silica, Mica, Graphite, Calcite, ..
•Dielectrics/Ferroelectrics: ABO3•Magnetics: Metals, ferrites• ….
ALVPT
AHRLDGNM
AYSS
GAPP
MPP
F
HGPDTRN
YR
DLL
RS Y
RK
RW
RTRR
QG
GD
VSR
D
CSD
CSD
CSD
PD
PD
PD
Quartz Binders: (80)DS153 Q S P L L Q L I V G T PDS152 K T L N W L S Y A Q L ADS86 S P L S I A A S S P W PDS30 L T P H Q T T M A H F LDS150 Y H S G L H P M P P F PDS91 Q P F T T S L T P P A RDS143 M W P T T`` T H S S P Y HDS84 L I A H S M P P R T R IDS36 M I P N T W E M R L P FDS146 A T G T M K I T T H W FDS125 A I L R P Q L M P G S SDS34 G S T Q A W M S P P L ADS35 H F T F P Q Q Q P P R PDS69 T M G F T A P R F P H TDS38 Y V H N P Y H L P N P PDS123 V P H M P S T L D V K RDS91 Q P F T T S L T P P A RDS189 Q T W P P P L W F S T SDS78 M L T P R Y M A L T V NDS88 Q S F T T L T G P D N RDS144 S T P A H E P M P R C CDS80 S N F T T Q M T F Y T GDS142 A P P G N W R N Y L M PDS191 V A P R V Q N L H F G ADS200 S P Q H M F L P T N S VDS73 D N A N S S I R S Q T YDS75 E I Q P R Y P S T L T GDS193 G S T Q A W M S P P L ADS190 L L A D T T H H R P W TDS148 N V A S Y L S S V P D TDS71 A I A E T M S L F T K LDS145 D H Q R M N D A M K V LDS202 R L N P P S Q M D P P FDS147 D S P S Y K A I P G A SDS199 A M V L E G E S T V W PDS194 D A F T Q M P W V W T HDS201 M E G Q Y K S N L L F TDS198 I P V P K F D H P W R GDS127 G S T Q A W M S P P L ADS82 H I T L R M T D T E S RDS76 T L P A F G P R A H V LDS72 Y E S I R I G V A P S ````
Sapphire Binders: (40)
AAO1 S Y Q F S H HAAO2 S Q S G R L QAAO3 T P L N P G TAAO4 V P T R L D PAAO5 E L R P T V AAAO6 S P T G I T SAAO7 M L M P W T GAAO8 T L P N H T PAAO9 E T Q N R P MAAO10 P N M R A I SAAO11 R T T H Q A YAAO12 Q M S N A L VAAO13 L S N N S T NAAO14 H A P F P M LAAO15 D S K L D R IAAO16 Q Y N H S A NAAO17 S V T Q N K YAAO18 P P S P S L PAAO19 E A K P R F HAAO20 M N H I N S LAAO21 Q P Y N K L TAAO22 S P H G L H F
CN61 ESSRCRLVLGVRCN48 VVAGCWLQVIRRCN64 PEVRCERVALAECN80 QERKCVPILTMCCN41 FIGRRFCGAGRICN68 RIASCRKGEIRQCN83 VAWRRDVCCRLQCN92 TMEPRWWCNPISCN93 TMEPRWWCNPIN
Sarikaya et al., Ann. Rev. Mater. Res., 34, 2004
10µm
(b)(a)
(c)
Au
Selective binding ofGBP to Au.
SiO2
(b)
GBP binding to Au squares
(a)
Pt squares
Au squares
MHGKTQATSGTIQS differentiates between Au, Pt, and SiO2
SiO2
Xiaorong Xiong, Mustafa Gungormus , Candan Tamerler, Mehmet Sarikaya, and Babak A. Parviz,” Nanoscale Self-Assembly Mediated by Genetically Engineered Gold-Binding Polypeptide”, 5th IEEE Conference on Nanotechnology, paper # TU-PS8-3, Nagoya, Japan July 11-15, 2005
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Control (no polypeptide on the pads)
With gold-binding polypeptide on the pads
20µm
Peptide-mediated self-assembly of micron-scale particles
Mustafa Gungormus, Xiaorong Xiong, Candan Tamerler, Babak A. Parviz, and Mehmet Sarikaya, “Using genetically engineered gold binding polypeptide for micron-scale self-assembly”, proceedings of the Foundations of Nanoscience Conference (Self-assembled architectures and devices), pp. 85-88, Snowbird, Utah April 24-28, 2005
Electronic control of the polypeptide assembly
+ 0.5 V bias
- 0.5 V bias
Xiaorong Xiong, Mustafa Gungormus, Candan Tamerler, Mehmet Sarikaya, and Babak Parviz, “Electronic Control of Binding of Genetically Engineered Polypeptides to Microfabricated Structures”, to be presented at the 19th IEEE International Conference on MicroElectroMechanicalSystems (MEMS), Istanbul, Turkey, January 22-26, 2006
1 nm
10 nm
100 nm
1 µm
10 µm
100 µm
Self-assembled molecular electronics
Engineered DNA networks as templates for nanoelectronic circuits
Using genetically engineered polypeptidesto guide self-assembly
Self-assembling Si circuits on plastic
Self-assembled silicon networks1 mm
1 cm Shape recognition for self-assembly
Putting CMOS on plastic, easily re-configurable circuits
Cheap, “device” integration, macroelectronics
300 µm 120 µm
Element could be a transistor or a LED, or …
Solder only ‘wets’ the gold on the element during assembly.
Surface Tension forces of the molten Solder help to drive the assembly.Si Substrate
Element
Molten Solder Dots
Binding Site
Shape Recognition for
part to template Self-Assembly
SU-8 forms the sidewalls.
Microfabricatedparts Template with
Complementary shapes
SA is performed with submerged parts and template
Fabrication ProcessElements
400 µm Si Handle
20 µm Si Device Layer
2 µm Oxide
1) Evaporate Au on top of Device Layer
2) Deep Reactive Ion Etch (DRIE) through Device layer to Oxide
Photoresist Mask
3) Etch Oxide in HF to release elements
Template
1) EvaporateAuon Si or PET Substrate
2) Pattern 10 µm to 20 µm thick SU-8 to form shapes
3) Dip-coat Au with low melting point alloy
100µm - 300µm
140µm - 340µm
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Shape recognition for self-assembly Self-assembly
Sean A. Stauth, and Babak A. Parviz,” Self-assembled silicon networks on plastic”, proceedings of the 13th International Conference on Solid-State Sensors, Actuators, and Microsystems (Transducers’ 2005) ,pp. 964-967, Seoul, Korea June 5-9, 2005
Active and passive self-assembly results
Single crystal silicon Field Effect Transistors
I-V Curve through Assembled Elements
-10
0
10
-2 -1 0 1 2
Voltage Across Elements (V)
Cur
ren
t (m
A)
Self-assembly results
Assembling 10000 silicon components with 95% yield on plastic
100 µm Silicon parts
1 nm
10 nm
100 nm
1 µm
10 µm
100 µm
Self-assembled molecular electronics
Engineered DNA networks as templates for nanoelectronic circuits
Using genetically engineered polypeptidesto guide self-assembly
Self-assembling Si circuits on plastic
Self-assembled silicon networks1 mm
1 cmSelf-Assembling Silicon Networks
• Goal: to make micron-sized silicon elements that can self-assemble into an electrical network (electronic powder)
• Making a 2-D network structure that can be expandedto 3-D
• Incompatible process integration• First cut: CMOS compatible• Driving force: low Tmelt alloy• 100 micron size scale• Use available solid-state
Fabrication technologies
Towards 3-D self-assembled Si circuits
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Fabrication Process Fabrication Process
Elements on the surfaceof the wafer
200 µm
Jianchun Dong, Babak A. Parviz, Hong Ma, Alex Jen, “Using self-assembly for the construction of nano-scale lateral transport molecular electronic devices and micro-scale silicon-based networks”, Invited paper, Proceeding of Optics East (Nanosensing: Materials and Devices), pp. 112-122, Philadelphia, October 25th – 28th 2004
Fabrication Process The Assembly Process
The Assembled Network
Elements before assembly Elements after assembly
Towards 3D silicon circuits
Programming the self-assembly process at an interface
• How to fabricate, experiment1) Photoresist pattern on SOI wafer
2) Plasma etch
3) Release parts with HF acid
140 µm
140 µm
Investigating the use of magnetic (Ni) strips on parts to aid in agitation
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Towards 3D Self-assembly
Binding mechanism: capillaryAgitation: gravity / impact / fluidic
2. Self-assembly of macromolecule (polymer) on SAM surface
3. Self-assembly into mm-scale structures
Binding mechanism: covalent bondsAgitation: thermal
Binding mechanism: hydrophobic / hydrophilicAgitation: fluidic
10 nm
1. Self-assembly of molecules on surface.
10 µm 0.5 mm
Christopher J. Morris, Sean A. Stauth, and Babak A. Parviz, “Using Capillary Forces for Self-Assembly of Functional Microstructures”, proceedings of the Foundations of Nanoscience Conference (Self-assembled architectures and devices), pp. 52-56, Snowbird, Utah April 24-28, 2005
Hierarchical self-assembly scheme across the size-scale
Towards 3D Self-assembly
Self-assembled microparts
A and Bare soluble
Chemically-patterned surfaces
A + B B + C
A + BDecant excess A, B, C
C
A
C
a) b)
c)
Christopher J. Morris, Harvey Ho, and Babak A. Parviz, “Insoluble Liquid Energy Minimization for Polymer Deposition on Free-StandingMicrofabricated Parts”, submitted to the ASME/IEEE Journal of Microelectromechanical Systems
Self-assembly in Solution
Christopher J. Morris, Harvey Ho, and Babak A. Parviz, “Using Insolubility Wave-front for Polymer Deposition on Self-AssemblingMicrofabricated Parts”, Proceedings of The 2005 International Conference on MEMS, Nano, and Smart Systems, pp. 223-227, Banff, Alberta, Canada July 24-29, 2005
Acknowledgements• Postdoctoral Research Fellows
– Ranjana Mehta– Xiaorong Xiang (now at Intel)
• Grad Students– Jianchun Dong– Harvey Ho– Sam Kim (with D. Meldrum)– John Lund– Chris Morris– Ehsan Saeedi– Angela Shum– Sean Stauth– Jean Wang (with Lih Lin)
• Undergrad Student– Walt Wyman
Washington Technology CenterCenter for Nanotechnology at the University of WashingtonFunding for this work was provided by NIH, DARPA, NSF, and University Initiative Fund (UIF) at UW
Collaborators:Alex Jen (Mat. Sci)Mehmet Sarikaya (Mat. Sci)Mary Lidstrom (Microbiology)Lih Lin (Electrical Eng.)Chengde Mao (Chem, Purdue)Deirdre Meldrum (Electrical Eng.)
Questions?
a
b
efg
hc
d
Self-Assembly contributes
here…
Serial assembly?
Opel
HLX 8100
MEMSPI.com
Eigler (IBM)
Christopher J. Morris, Sean S. Stauth, and Babak A. Parviz, “Self-assembly for micro and nano scale packaging: steps towards self-packaging”, to appear in the November 2005 issues of IEEE Transactions on Advanced Packaging