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Transcript of SDCSAD
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Novel Low-Cost On-Chip CPW Slow-Wave Structure
for Compact RF Components and mm-Wave Applications
Guoan Wang, Wayne Woods, Hanyi Ding, and Essam Mina
IBM Semiconductor Research and Development Center
1000 River Street, Essex Junction VT 05452
Abstract
In this paper, an ideal slow wave coplanar waveguide
(CPW) structures with low losses, moderate impedance and
CMOS fabrication technology have been developed. The slow
wave CPW transmission line structures were achieved
through IBM 0.13 m technology with multi-layer metals.
The CPW were implemented with narrower signal line or
wider separation between signal and ground plane to increase
the inductance per unit length, while metal strips on another
metal layers cross under/above the CPW lines, which are
orthogonal to signal propagation direction. Losses reduction
using via bars to increase the thickness of the signal metal
layer, structures with metal strip options (above, under andboth CPW) to increase the capacitance per unit length of the
CPW and provide more flexibility for the proposed structure,
effect of the metal strips pitch are also discussed. The slow
wave structure discussed in this paper can shrink the side
dimension of the mmwave passive components by up to 35%.
Introduction
Future hand-held and ground communications systems as
well as communications satellites will require very low
weight, volume and power consumption in addition to higher
data rates and increased functionality. Improvements in the
size and component count have been achieved by increasing
the level of integration. Despite many years of research, there
is a technological barrier for the IC industry to furtherintegration. Components, such as high-Q inductors,
capacitors, varactors and ceramic filters, play a limiting role
in further reducing the size. Passive components are
indispensable in RF systems and are used for matching
networks, LC tank circuits (in VCOs), attenuators, power
dividers, and filtering, switching, decoupling purposes and as
reference resonators. Right now, large percentage of the board
area is taken up by the off-chip passives. For instance, 90-
95% of components in a cell phone are passive components,
taking up 80% of the total transceiver board area, and
accounting for 70% of the cost. To reduce the space taken up
by the passives, very small discrete passive components and
the integration of the passive components are needed. Slowwave transmission lines are promising candidates for size
reduction of microstrip circuit components, and it is very
attractive to develop a complementary CPW slow wave
structure for the miniaturization of MICs and MMICs.
Metal-insulator-semiconductor (MIS) CPW lines can
achieve very high slow wave factors, but suffer form low
impedance values and high insertion loss, making MIS CPW
impractical at higher frequencies. Research have been done to
improve the loss by introducing cross-tie periodic structures
or by inhomogeneously doping the semiconductor, but these
methods need additional fabrication processes [1][2]. Slow
wave CPW periodic structure with arms was also developed
for filter applications [3], in the scheme, each unit cell
consists of a narrow signal line that enhances the inductance
per unit length while two branched arms located in the slots of
the CPW enlarge the capacitance to ground. Slow wave
structure with discontinuous microstrip lines were also
developed [4], the discontinuous line is made by placing a
wide and short line and a narrow and short line in turn since
the step discontinuity provides the line with additional
inductance and capacitance. Other method developing slow
wave structures includes using inductive loaded line and
capacitive loaded line by changing either the shape of theground plane or the signal plane [5]. However, none of them
was fabricated using standard CMOS fabrication process.
John Long etc. [6] developed on-chip slow wave CPW
structure with specific design.
This paper spent efforts on developing an ideal slow wave
CPW structures with low losses, moderate impedance and
CMOS fabrication technology, and provided thoroughly study
on the factors affecting slow wave effect. From the
transmission line theory, the wavelength, phase velocity and
characteristics impedance are given respectively as Equation
[1-3]:
f
v= (1)
LCv
1= (2)
C
LZ =0 (3)
From the above equations, the wavelength can be made
smaller while the characteristic impedance is kept unchanged
by increasing L and C with the same ratio. Both inductance
and capacitance of microstrip are related to line width:
inductance increases with decreasing line width, whereas
capacitance increases with increasing line width. In this
paper, the slow wave CPW transmission line structures were
achieved through IBM 0.13 m technology with multi-layermetals. As shown in Fig. 1. the CPW were implemented with
narrower signal line or wider separation between signal and
ground plane to increase the inductance per unit length, while
metal strips on another metal layers cross under/above the
CPW lines, which are orthogonal to signal propagation
direction so there will be no induced current in the metal
strips along signal propagation direction and avoid
electromagnetic interference, meanwhile, the capacitance per
unit length of the CPW is increased due to capacitive
coupling between the CPW and cross above/under metal
978-1-4244-2231-9/08/$25.00 2008 IEEE 186 2008 Electronic Components and Technology Conference
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strips. The proposed method offers several advantages. First,
the ground planes of the CPW lines remain unperturbed so
there will have little effect on CPW wave propagation. And
second, the proposed structure can be matched with different
impedance over a wide range of frequencies up to 120 GHz
by using different metal layer options. Third, the proposed
structure is a low-cost on-chip slow wave solution with
standard CMOS fabrication process. And finally, current
transmission line model has included metal fill effects, so itcan be used to design such kind of slow wave structure with
provided Pcell which has already passed the DRC and LVS
check. Different structures with different dimensions and
metal layers have been developed, simulation results have
shown that the capacitance and inductance per unit length of
the proposed lines can be increased up to 2 times of the
conventional structures. The developed structures can be used
to develop mm-wave passive components with twice of the
size reduction.
Fig. 1 Schematics of slow wave coplanar waveguide
Structures and Principle
As shown in Figure 1, the slow wave CPW structure
including floating metal strips cross over and cross under the
CPW, each section of the slow wave CPW can be described
by an L-C lumped element model, where L and C are the line
inductance and capacitance of the section, respectively.
Ideally, the high impedance section is designed to have line
inductance nL and line capacitance C/n, so that its
characteristic impedance is higher by a factor of n2 than the
low impedance section with line inductance L/n, and line
capacitance nC. The higher inductance requires aproportionally smaller line capacitance because the velocity is
fixed by the dielectric constant. In the physical layout of the
transmission line, higher inductance requires more distance
between the signal and ground paths which reduce line
capacitance. When the two sections are cascaded together, the
series inductance is dominated by the high impedance section,
while the capacitance is dominated by the low impedance
section. This causes a simultaneous increase of the both L and
C, resulting in an increased delay of the signal [6]. In the
section without the floating metal strips crossing over or
crossing under the CPW, the inductance and capacitance per
unit length of the CPW is mainly decided by the gap between
the ground and signal plane of the CPW; in the section with
crossover and cross under metal strips, the capacitance per
unit length is increased tremendously due to the small
distance between the metal strips and CPW, while the
inductance will also reduced simultaneously if the metal strips
is connected with the ground plane of the CPW.
Fig. 2 shows the equivalent circuit of the slow wavestructure. As shown in the figure, when there is metal strips
crossing over or crossing under CPW, the capacitance will
increase, and this will cause velocity of signal propagation
reduce, so will the wavelength. With slow wave structure, the
compact mmwave passive components can be designed. For
example, it can be used to design compact branch line coupler
as shown in Fig. 3, branch line coupler have four arms each
has a electrical length of quarter wavelength, the dimension of
the coupler is highly dependent on the wavelength.
Fig. 2 Equivalent circuit of slow wave CPW
Fig. 3 Schematics of a branch line coupler
Fig. 4 shows the cross section of the back end of line in a
0.13 m IBM process technology. In this paper, CPW is
implemented with MQ layer, while the cross under layer is
M2 and crossover layer is LY to get high coupling
capacitance between the metal strips and CPW due to the
relative smaller distance between MQ and M2 layer and MQ
layer has reasonable thickness to reduce the metal loss. The
distance between M2 and MQ is less than 1 m while thedistance between MQ and LY is about 4 m. EM simulations
for different slow wave CPW structures have been done using
Ansoft HFSS full wave 3D simulator, and the results are
discussed in the next section. Five different cases are
discussed, first, slow wave CPW and traditional CPW are
simulated and compared; second, the effect of the floating
metal strips pitch is studied; third, as shown in Fig. 5, metal
strips are connected with ground plane of the CPW, the effect
is studied; Fourth, metal strips cross options are discussed, the
effect of cross under metal only and both crossover and
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crossover metals are simulated and compared; and the final
case is that using combined MQ and top via metal as CPW to
improve the insertion loss of the CPW.
Fig. 4 Cross section of metal layers in a BiCMOS
technology
Fig. 5 Revised slow wave CPW structure
Results and Discussions
In this section, simulation results for slow wave CPW
structures are shown. All the CPW structures are implemented
in the back end of line using 0.6 m thick copper.
1. Slow wave CPW vs. traditional CPW
To demonstrate the slow wave effect of the structure as
shown in Fig. 1, simulations are firstly done for single CPW
with and without the cross under layer. Fig. 6 shows the
results comparison for the both cases, the cross line shows the
calculated capacitance per unit length for traditional CPW
with signal layer width of 6 m and the spacing between thesignal and ground plane of 4 m, the circle line shows the
slow wave CPW with floating metal strips crossing under the
CPW, the width of the metal strips is 2 m and the spacing is
2 m. As shown in the Fig. 6, at 100 GHz, the capacitance per
unit length increased 121% from 0.1619nF/m to 0.3591nF/m.
2. Pitch effect
To check the effect of the metal strips pitch (metal strip
width plus spacing between strips), simulation have been
done for slow wave CPW with cross under layer with 4 m
and 10 m pitch. The CPW has signal width of 6 m and the
distance between the signal plane and ground plane is 4 m.
The result for capacitance per unit length comparison is
shown in Fig. 7. For the structure with smaller pitch, the slow
wave effect is better. At 100 GHz, the capacitance per unit
length increased 11% from 0.3235nF/m to 0.3591nF/m. To
further increase the slow wave effect, the pitch can be shrunk
to the minimum width and space for the MQ layer in the
practical applications.
Fig. 6 Capacitance per unit length comparison between
slow wave CPW and traditional CPW
Fig. 7 Capacitance per unit length comparison between slow
wave CPWs with different pitch
3. Floating strips or connect with CPWIn order to increase the capacitance per unit length of the
slow wave CPW structure, the floating metal strips are
connected with ground plane of the CPW as shown in Fig. 5.
The result comparison between the traditional slow wave
structure and the novel structure is compared in Fig. 8. At 100
GHz, the capacitance per unit length increased 28% from
0.3591nF/m to 0.4593nF/m. Hence, the new structure with
metal strips connected with CPW ground plane instead of
floating has better slow wave effect.
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Fig. 8 Capacitance per unit length comparison between slow
wave CPWs
4. Crossunder, Crossover or Both
To check the further effect of metal strips with both
crossover and cross under options, simulations and analysisare done in this section. First, the slow wave CPW is built
with 6 m wide MQ layer and 4 m spacing between ground
and signal plane, while the metal strips crossing under the
CPW and connected with ground plane of the CPW; and then
another metal layer crossing over the CPW is added to the
structure and simulated. The pitches for both the crossover
and cross under metal strips are 4 m. The capacitance per
unit length comparison is shown in Fig. 9, At 100 GHz, the
capacitance per unit length increased 3% from 0.4593nF/m to
0.4702nF/m. Hence, the new structure with crossover and
cross under metal strips has better slow wave effect, the
improvement is slight in this simulation is mainly because that
the crossover layer is further away from CPW (~4 m)
compared with the distance between the cross under layer andCPW (~0.6 m). In the practical design, metal layer can be
selected purposely to get equal distance between the
crossover layer and CPW and CPW and cross under layer.
Fig. 9 Capacitance per unit length comparison between slow
wave CPWs
5. Metal loss improvement
Since the MQ layer is less than 1 m thick, the metal loss
for the CPW built on MQ layer is relative high. In order to
reduce the metal loss for the CPW, slow wave CPW structure
built with MQ layer combined with M2 layer connected with
metal via bars as shown in Fig. 10. In this structure, the
thickness of the CPW metal layers is doubled, thus reduces
the metal loss. The width of the signal layer is still 6 m and
the spacing between the signal and ground plane is 4 m. Themetal strips crossing under the CPW are M1 layer with the
pitch of 4 m. The capacitance comparison between the new
structures and the slow wave structure built with MQ layer
only is shown in Fig. 11. And Fig. 12 shows the insertion loss
comparison for the two structures.
Fig. 10 Structure of slow wave CPW with improved insertion
loss
Fig. 11 Capacitance per unit length comparison between slowwave CPWs with different thickness
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S-parameters vs. Frequency
-1.6
-1.4
-1.2
-1.0
-0.8
-0.6
-0.4
-0.2
0.0
0.2
0 20 40 60 80 100 120
Frequency (GHz)
S12(dB)
Slow wave CPW
Slow wave CPW with improved loss
Fig. 12 Insertion loss comparison between thin slow wave
CPW (MQ) and thick slow wave CPW (M2 and MQ
combined with metal via bars)
At 100 GHz, the capacitance per unit length is increased
20% from 0.36nF/m to 0.4303nF/m; this capacitance
changing is mainly due to the larger thickness of the CPW. As
shown in the Fig. 12, the metal loss is greatly improved
especially at higher frequency for slow wave CPW built with
thick metal option. At 100 GHz, the insertion loss reduced
from 1.22 dB to 1.03 dB.
Conclusions
A novel on-chip slow wave CPW structure which has
metal strips crossing over and crossing under is provided in
this paper. The factors affecting the slow wave effect are
discussed: pitch of the floating metal strips, metal strips
crossing options (over, under and both), metal strips
connected with ground plane of the CPW, and solution to
improve the insertions loss of the slow wave structure.
Results show that the smaller the metal strips, the better the
slow wave effect. Detail results are shown in the paper, and a
CPW structure with better slow wave effect is proposed, thestructure has both crossover and cross under metal strips
which are connected with the ground plane of the CPW. The
proposed slow wave structure can be used for compact
mmwave passive components design.
Acknowledgments
This work is supported by IBM semiconductor research
and development center.
References
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waveguide on semi-insulating GaAs substrate," Electronic
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3. James Sor, Yongxi Qian and Tatsuo Itoh, " A novel low-
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4. Kae-Oh Sun, Sung-Jin Ho, Chih-Chuan Yen, and Daniel
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190 2008 Electronic Components and Technology Conference