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    Novel Low-Cost On-Chip CPW Slow-Wave Structure

    for Compact RF Components and mm-Wave Applications

    Guoan Wang, Wayne Woods, Hanyi Ding, and Essam Mina

    IBM Semiconductor Research and Development Center

    1000 River Street, Essex Junction VT 05452

    [email protected]

    Abstract

    In this paper, an ideal slow wave coplanar waveguide

    (CPW) structures with low losses, moderate impedance and

    CMOS fabrication technology have been developed. The slow

    wave CPW transmission line structures were achieved

    through IBM 0.13 m technology with multi-layer metals.

    The CPW were implemented with narrower signal line or

    wider separation between signal and ground plane to increase

    the inductance per unit length, while metal strips on another

    metal layers cross under/above the CPW lines, which are

    orthogonal to signal propagation direction. Losses reduction

    using via bars to increase the thickness of the signal metal

    layer, structures with metal strip options (above, under andboth CPW) to increase the capacitance per unit length of the

    CPW and provide more flexibility for the proposed structure,

    effect of the metal strips pitch are also discussed. The slow

    wave structure discussed in this paper can shrink the side

    dimension of the mmwave passive components by up to 35%.

    Introduction

    Future hand-held and ground communications systems as

    well as communications satellites will require very low

    weight, volume and power consumption in addition to higher

    data rates and increased functionality. Improvements in the

    size and component count have been achieved by increasing

    the level of integration. Despite many years of research, there

    is a technological barrier for the IC industry to furtherintegration. Components, such as high-Q inductors,

    capacitors, varactors and ceramic filters, play a limiting role

    in further reducing the size. Passive components are

    indispensable in RF systems and are used for matching

    networks, LC tank circuits (in VCOs), attenuators, power

    dividers, and filtering, switching, decoupling purposes and as

    reference resonators. Right now, large percentage of the board

    area is taken up by the off-chip passives. For instance, 90-

    95% of components in a cell phone are passive components,

    taking up 80% of the total transceiver board area, and

    accounting for 70% of the cost. To reduce the space taken up

    by the passives, very small discrete passive components and

    the integration of the passive components are needed. Slowwave transmission lines are promising candidates for size

    reduction of microstrip circuit components, and it is very

    attractive to develop a complementary CPW slow wave

    structure for the miniaturization of MICs and MMICs.

    Metal-insulator-semiconductor (MIS) CPW lines can

    achieve very high slow wave factors, but suffer form low

    impedance values and high insertion loss, making MIS CPW

    impractical at higher frequencies. Research have been done to

    improve the loss by introducing cross-tie periodic structures

    or by inhomogeneously doping the semiconductor, but these

    methods need additional fabrication processes [1][2]. Slow

    wave CPW periodic structure with arms was also developed

    for filter applications [3], in the scheme, each unit cell

    consists of a narrow signal line that enhances the inductance

    per unit length while two branched arms located in the slots of

    the CPW enlarge the capacitance to ground. Slow wave

    structure with discontinuous microstrip lines were also

    developed [4], the discontinuous line is made by placing a

    wide and short line and a narrow and short line in turn since

    the step discontinuity provides the line with additional

    inductance and capacitance. Other method developing slow

    wave structures includes using inductive loaded line and

    capacitive loaded line by changing either the shape of theground plane or the signal plane [5]. However, none of them

    was fabricated using standard CMOS fabrication process.

    John Long etc. [6] developed on-chip slow wave CPW

    structure with specific design.

    This paper spent efforts on developing an ideal slow wave

    CPW structures with low losses, moderate impedance and

    CMOS fabrication technology, and provided thoroughly study

    on the factors affecting slow wave effect. From the

    transmission line theory, the wavelength, phase velocity and

    characteristics impedance are given respectively as Equation

    [1-3]:

    f

    v= (1)

    LCv

    1= (2)

    C

    LZ =0 (3)

    From the above equations, the wavelength can be made

    smaller while the characteristic impedance is kept unchanged

    by increasing L and C with the same ratio. Both inductance

    and capacitance of microstrip are related to line width:

    inductance increases with decreasing line width, whereas

    capacitance increases with increasing line width. In this

    paper, the slow wave CPW transmission line structures were

    achieved through IBM 0.13 m technology with multi-layermetals. As shown in Fig. 1. the CPW were implemented with

    narrower signal line or wider separation between signal and

    ground plane to increase the inductance per unit length, while

    metal strips on another metal layers cross under/above the

    CPW lines, which are orthogonal to signal propagation

    direction so there will be no induced current in the metal

    strips along signal propagation direction and avoid

    electromagnetic interference, meanwhile, the capacitance per

    unit length of the CPW is increased due to capacitive

    coupling between the CPW and cross above/under metal

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    strips. The proposed method offers several advantages. First,

    the ground planes of the CPW lines remain unperturbed so

    there will have little effect on CPW wave propagation. And

    second, the proposed structure can be matched with different

    impedance over a wide range of frequencies up to 120 GHz

    by using different metal layer options. Third, the proposed

    structure is a low-cost on-chip slow wave solution with

    standard CMOS fabrication process. And finally, current

    transmission line model has included metal fill effects, so itcan be used to design such kind of slow wave structure with

    provided Pcell which has already passed the DRC and LVS

    check. Different structures with different dimensions and

    metal layers have been developed, simulation results have

    shown that the capacitance and inductance per unit length of

    the proposed lines can be increased up to 2 times of the

    conventional structures. The developed structures can be used

    to develop mm-wave passive components with twice of the

    size reduction.

    Fig. 1 Schematics of slow wave coplanar waveguide

    Structures and Principle

    As shown in Figure 1, the slow wave CPW structure

    including floating metal strips cross over and cross under the

    CPW, each section of the slow wave CPW can be described

    by an L-C lumped element model, where L and C are the line

    inductance and capacitance of the section, respectively.

    Ideally, the high impedance section is designed to have line

    inductance nL and line capacitance C/n, so that its

    characteristic impedance is higher by a factor of n2 than the

    low impedance section with line inductance L/n, and line

    capacitance nC. The higher inductance requires aproportionally smaller line capacitance because the velocity is

    fixed by the dielectric constant. In the physical layout of the

    transmission line, higher inductance requires more distance

    between the signal and ground paths which reduce line

    capacitance. When the two sections are cascaded together, the

    series inductance is dominated by the high impedance section,

    while the capacitance is dominated by the low impedance

    section. This causes a simultaneous increase of the both L and

    C, resulting in an increased delay of the signal [6]. In the

    section without the floating metal strips crossing over or

    crossing under the CPW, the inductance and capacitance per

    unit length of the CPW is mainly decided by the gap between

    the ground and signal plane of the CPW; in the section with

    crossover and cross under metal strips, the capacitance per

    unit length is increased tremendously due to the small

    distance between the metal strips and CPW, while the

    inductance will also reduced simultaneously if the metal strips

    is connected with the ground plane of the CPW.

    Fig. 2 shows the equivalent circuit of the slow wavestructure. As shown in the figure, when there is metal strips

    crossing over or crossing under CPW, the capacitance will

    increase, and this will cause velocity of signal propagation

    reduce, so will the wavelength. With slow wave structure, the

    compact mmwave passive components can be designed. For

    example, it can be used to design compact branch line coupler

    as shown in Fig. 3, branch line coupler have four arms each

    has a electrical length of quarter wavelength, the dimension of

    the coupler is highly dependent on the wavelength.

    Fig. 2 Equivalent circuit of slow wave CPW

    Fig. 3 Schematics of a branch line coupler

    Fig. 4 shows the cross section of the back end of line in a

    0.13 m IBM process technology. In this paper, CPW is

    implemented with MQ layer, while the cross under layer is

    M2 and crossover layer is LY to get high coupling

    capacitance between the metal strips and CPW due to the

    relative smaller distance between MQ and M2 layer and MQ

    layer has reasonable thickness to reduce the metal loss. The

    distance between M2 and MQ is less than 1 m while thedistance between MQ and LY is about 4 m. EM simulations

    for different slow wave CPW structures have been done using

    Ansoft HFSS full wave 3D simulator, and the results are

    discussed in the next section. Five different cases are

    discussed, first, slow wave CPW and traditional CPW are

    simulated and compared; second, the effect of the floating

    metal strips pitch is studied; third, as shown in Fig. 5, metal

    strips are connected with ground plane of the CPW, the effect

    is studied; Fourth, metal strips cross options are discussed, the

    effect of cross under metal only and both crossover and

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    crossover metals are simulated and compared; and the final

    case is that using combined MQ and top via metal as CPW to

    improve the insertion loss of the CPW.

    Fig. 4 Cross section of metal layers in a BiCMOS

    technology

    Fig. 5 Revised slow wave CPW structure

    Results and Discussions

    In this section, simulation results for slow wave CPW

    structures are shown. All the CPW structures are implemented

    in the back end of line using 0.6 m thick copper.

    1. Slow wave CPW vs. traditional CPW

    To demonstrate the slow wave effect of the structure as

    shown in Fig. 1, simulations are firstly done for single CPW

    with and without the cross under layer. Fig. 6 shows the

    results comparison for the both cases, the cross line shows the

    calculated capacitance per unit length for traditional CPW

    with signal layer width of 6 m and the spacing between thesignal and ground plane of 4 m, the circle line shows the

    slow wave CPW with floating metal strips crossing under the

    CPW, the width of the metal strips is 2 m and the spacing is

    2 m. As shown in the Fig. 6, at 100 GHz, the capacitance per

    unit length increased 121% from 0.1619nF/m to 0.3591nF/m.

    2. Pitch effect

    To check the effect of the metal strips pitch (metal strip

    width plus spacing between strips), simulation have been

    done for slow wave CPW with cross under layer with 4 m

    and 10 m pitch. The CPW has signal width of 6 m and the

    distance between the signal plane and ground plane is 4 m.

    The result for capacitance per unit length comparison is

    shown in Fig. 7. For the structure with smaller pitch, the slow

    wave effect is better. At 100 GHz, the capacitance per unit

    length increased 11% from 0.3235nF/m to 0.3591nF/m. To

    further increase the slow wave effect, the pitch can be shrunk

    to the minimum width and space for the MQ layer in the

    practical applications.

    Fig. 6 Capacitance per unit length comparison between

    slow wave CPW and traditional CPW

    Fig. 7 Capacitance per unit length comparison between slow

    wave CPWs with different pitch

    3. Floating strips or connect with CPWIn order to increase the capacitance per unit length of the

    slow wave CPW structure, the floating metal strips are

    connected with ground plane of the CPW as shown in Fig. 5.

    The result comparison between the traditional slow wave

    structure and the novel structure is compared in Fig. 8. At 100

    GHz, the capacitance per unit length increased 28% from

    0.3591nF/m to 0.4593nF/m. Hence, the new structure with

    metal strips connected with CPW ground plane instead of

    floating has better slow wave effect.

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    Fig. 8 Capacitance per unit length comparison between slow

    wave CPWs

    4. Crossunder, Crossover or Both

    To check the further effect of metal strips with both

    crossover and cross under options, simulations and analysisare done in this section. First, the slow wave CPW is built

    with 6 m wide MQ layer and 4 m spacing between ground

    and signal plane, while the metal strips crossing under the

    CPW and connected with ground plane of the CPW; and then

    another metal layer crossing over the CPW is added to the

    structure and simulated. The pitches for both the crossover

    and cross under metal strips are 4 m. The capacitance per

    unit length comparison is shown in Fig. 9, At 100 GHz, the

    capacitance per unit length increased 3% from 0.4593nF/m to

    0.4702nF/m. Hence, the new structure with crossover and

    cross under metal strips has better slow wave effect, the

    improvement is slight in this simulation is mainly because that

    the crossover layer is further away from CPW (~4 m)

    compared with the distance between the cross under layer andCPW (~0.6 m). In the practical design, metal layer can be

    selected purposely to get equal distance between the

    crossover layer and CPW and CPW and cross under layer.

    Fig. 9 Capacitance per unit length comparison between slow

    wave CPWs

    5. Metal loss improvement

    Since the MQ layer is less than 1 m thick, the metal loss

    for the CPW built on MQ layer is relative high. In order to

    reduce the metal loss for the CPW, slow wave CPW structure

    built with MQ layer combined with M2 layer connected with

    metal via bars as shown in Fig. 10. In this structure, the

    thickness of the CPW metal layers is doubled, thus reduces

    the metal loss. The width of the signal layer is still 6 m and

    the spacing between the signal and ground plane is 4 m. Themetal strips crossing under the CPW are M1 layer with the

    pitch of 4 m. The capacitance comparison between the new

    structures and the slow wave structure built with MQ layer

    only is shown in Fig. 11. And Fig. 12 shows the insertion loss

    comparison for the two structures.

    Fig. 10 Structure of slow wave CPW with improved insertion

    loss

    Fig. 11 Capacitance per unit length comparison between slowwave CPWs with different thickness

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    S-parameters vs. Frequency

    -1.6

    -1.4

    -1.2

    -1.0

    -0.8

    -0.6

    -0.4

    -0.2

    0.0

    0.2

    0 20 40 60 80 100 120

    Frequency (GHz)

    S12(dB)

    Slow wave CPW

    Slow wave CPW with improved loss

    Fig. 12 Insertion loss comparison between thin slow wave

    CPW (MQ) and thick slow wave CPW (M2 and MQ

    combined with metal via bars)

    At 100 GHz, the capacitance per unit length is increased

    20% from 0.36nF/m to 0.4303nF/m; this capacitance

    changing is mainly due to the larger thickness of the CPW. As

    shown in the Fig. 12, the metal loss is greatly improved

    especially at higher frequency for slow wave CPW built with

    thick metal option. At 100 GHz, the insertion loss reduced

    from 1.22 dB to 1.03 dB.

    Conclusions

    A novel on-chip slow wave CPW structure which has

    metal strips crossing over and crossing under is provided in

    this paper. The factors affecting the slow wave effect are

    discussed: pitch of the floating metal strips, metal strips

    crossing options (over, under and both), metal strips

    connected with ground plane of the CPW, and solution to

    improve the insertions loss of the slow wave structure.

    Results show that the smaller the metal strips, the better the

    slow wave effect. Detail results are shown in the paper, and a

    CPW structure with better slow wave effect is proposed, thestructure has both crossover and cross under metal strips

    which are connected with the ground plane of the CPW. The

    proposed slow wave structure can be used for compact

    mmwave passive components design.

    Acknowledgments

    This work is supported by IBM semiconductor research

    and development center.

    References

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    3. James Sor, Yongxi Qian and Tatsuo Itoh, " A novel low-

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    4. Kae-Oh Sun, Sung-Jin Ho, Chih-Chuan Yen, and Daniel

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