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School of Electrical and Computer EngineeringMicrosensors and Microactuators Group
WIRELESS MICROMACHINED CERAMIC PRESSURE SENSORS
Jennifer M. English and Mark G. Allen
School of Electrical and Computer Engineering
Georgia Institute of Technology
Atlanta, Georgia 30332-0250
School of Electrical and Computer EngineeringMicrosensors and Microactuators Group
Background and Motivation MURI project - Intelligent turbine engines.
• Goal: extend the operational range of turbine engines using sensing and active feedback control techniques
• Push operating curve of engine by active measures to eliminate surge and stall
• Monitoring of compressor output pressure (static and dynamic) required to provide input data for active control scheme.
CompressorCombustor
Sensor placed here
Pratt and Whitney
School of Electrical and Computer EngineeringMicrosensors and Microactuators Group
Pressure Sensor Requirements
• Environment inside the turbine compressor:– Temperature range 400 - 500°C.
– Pressure range (1-50 atm).
– Pressure fluctuations 2 kHz.
• Pressure sensor issues:– Materials with high temperature stability.
– Pressure sensitivity at both low and high pressures.
– Temperature sensitivity.
– Data retrieval compatible with high temperature and hostile environments.
• MEMS technologies offer: potential for multiple sensors, spatial resolution, reduction or elimination of wiring harnesses of conventional sensors.
School of Electrical and Computer EngineeringMicrosensors and Microactuators Group
Ceramic Pressure Sensor
• Our approach - Utilize key design and fabrication techniques from the silicon sensor and microelectronics packaging infrastructures to develop a ceramic pressure sensor.
• Silicon sensor infrastructure:– Flexible membrane, capacitive sensing.
• Microelectronics packaging infrastructure:– Ceramic tape and complex package processing techniques.
• Benefits - Batch fabrication capabilities, self-packaged devices, possible high temperature stability.
School of Electrical and Computer EngineeringMicrosensors and Microactuators Group
Ceramic Pressure Sensor - Design
• Three layer design using Dupont 951-AT LTCC ceramic tape.
– Layer A: 1 sheet, Layer B: > 1 sheet with a punched hole,
Layer C: > 1 sheet.
• Integrate metal capacitor electrodes and planar, spiral inductor (DC sputtering, E-beam evaporation, screen printing).
External pressure
evacuatedcavity
CB
ACapacitorelectrodes
Inductor coil
evacuatedcavity
C(P)L
School of Electrical and Computer EngineeringMicrosensors and Microactuators Group
Ceramic Pressure Sensor - Fabrication
• Four sheets are aligned and laminated in a hot press at 3000 psi and 70°C for 10 min under ambient vacuum.
• Inductor and bottom capacitor electrode are electroplated with copper.
• Top electrode is DC sputtered copper.
• High temperature conductive paste connects inductor to top electrode.
Bottom view of a typical ceramic pressure sensor.
ElectroplatedCu Coil
ElectroplatedCu electrode
ConductivePaste
3.8mmDC sputteredCu electrode
161µm
Cross-sectional diagram
3.8mm
School of Electrical and Computer EngineeringMicrosensors and Microactuators Group
Wireless Ceramic Pressure Sensor Operation
• No physical connections to the sensor are necessary. Sensor can be placed on moving parts.
• Impedance analyzer records the phase of the antenna coil over a frequency range that includes the sensor center frequency while the ambient pressure and temperature are varied.
• Phase of the antenna is +90°except at the fo of the sensor. At fo, the sensor couples to the antenna and causes a dip in the phase.
• As the ambient pressure increases, the ceramic membrane deflects. The capacitance increases and the fo decreases.
AntennaCoil
Feedthroughs
To Impedance Analyzer
Pressure vessel or Vacuum oven
d(P)
School of Electrical and Computer EngineeringMicrosensors and Microactuators Group
Experimental ResultsWireless Ceramic Pressure Sensor
.
363534333231302984
85
86
87
88
89
90
91
92
Frequency (MHz)
Phase versus frequency for zero and full-scale applied pressure (0-1 bar)
electrode radius = 5mmmembrane thickness = 96µmgap spacing = 161µm
Sensitivity = 2.6 MHz/bar
Full Scale Pressure Zero PressureP
has
e (D
egre
es)
School of Electrical and Computer EngineeringMicrosensors and Microactuators Group
Experimental ResultsWireless Ceramic Pressure Sensor
.
1.21.00.80.60.40.20.031.0
31.5
32.0
32.5
33.0
33.5
34.0
T=25 deg C
T=200 deg C
Pressure (Bar)
Frequency versus pressure for 25°C and 200°C (0-1 bar)
electrode radius = 5mmmembrane thickness = 96µmgap spacing = 161µm
Fre
qu
ency
(M
Hz)
School of Electrical and Computer EngineeringMicrosensors and Microactuators Group
Experimental ResultsWireless Ceramic Pressure Sensor
.
10080604020026.00
26.05
26.10
26.15
26.20
26.25
26.30
26.35
26.40
Pressure (Bar)
Frequency versus pressure for high pressure (0-100 bar)
electrode radius = 3.8mmmembrane thickness = 96µmgap spacing = 161µm
Sensitivity = 6.4 kHz/bar
Fre
qu
ency
(M
Hz)
School of Electrical and Computer EngineeringMicrosensors and Microactuators Group
Comparison of Theoretical and Experimental Results
.
1.21.00.80.60.40.20.0
31.00
31.25
31.50
31.75
32.00
32.25
32.50
32.75
33.00
33.25
33.50
33.75
34.00
Measured
Theoretical
Pressure (Bar)
• Exp. sensitivity = 2.6MHz.
• Theor. sensitivity = 2.2MHz.
• Theoretical model allows for only one membrane (electrode) to deflect.
• Actual sensor allows deflection of the top membrane and some deflection of the bottom membrane.
Fre
qu
ency
(M
Hz)
School of Electrical and Computer EngineeringMicrosensors and Microactuators Group
Experimental ResultsPressure Sensor Array
.
4035302520151050
60
70
80
90
100
Frequency (MHz)
• Three pressure sensors designed with distinct resonant frequencies monitored by the same antenna simultaneously.
• Magnitude of the dip depends on the proximity of the sensor to the antenna coil.
• The number of sensors monitored by a single antenna is limited only by bandwidth.
Sensor 1Sensor 3
Sensor 2
Ph
ase
(Deg
rees
)
School of Electrical and Computer EngineeringMicrosensors and Microactuators Group
Conclusions
• Design, modeling, fabrication and testing of a passive wireless ceramic pressure sensor has been performed.
• Sensor is fabricated from ceramic tape layers to create a sealed cavity structure with a flexible ceramic membrane.
• The ceramic structure is integrated with a fixed L/ varying C resonant circuit.
• A passive, wireless scheme is used to retrieve the pressure data.
• Pressure and temperature tests were performed and shows the concept is valid. Theoretical modeling compares well with the experimental results.
• Pressure sensor array concept was demonstrated.
School of Electrical and Computer EngineeringMicrosensors and Microactuators Group
Acknowledgments
• Work is supported by Army Research Office Intelligent Turbine Engines MURI Program (contract DAAH049610008), under the direction of Dr. David Mann.
• Microfabrication carried out in the Georgia Tech Microelectronics Research Center
• Professors D. Hertling and R. Feeney of Georgia Tech.