scan test by sanjay d dhandare

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SANJAY . D . DHNDARE 19/02/22 1 ME(E&TC engg.),DYPSOE,Lohegaon,Pune

Transcript of scan test by sanjay d dhandare

SANJAY . D . DHNDARE

03/05/23 1ME(E&TC engg.),DYPSOE,Lohegaon,Pune

CONTENT :

Introduction Brief history Need Boundary Scan Test Terminology used Working What is four wire test ?

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Cont....

BST cell and its VHDL code

BST register

TAP controller

Signal specification

Timing diagram

Conclusion

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INTRODUCTION

What is scan test ? The method in which testing of boards , separate

components and ASIC is carried out in a efficient way is called as scan test.

It is also known as Boundary Scan Test (BST).

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BRIEF HISTORY

1985 : JETAG studied a board testing 1986 : JETAG became JTEG 1990 : ANSI provide 2.0 standard 1994 : JTAG formed 2.0 standard with

1149.1 IEEE standard 1994 : New standard for test port and BST

i.e.1149.1b From 1994 IEEE standard still referred as a

JTAG standard

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NEED Existing technology i.e. Bed-of-nail had limited

specification . Difficult to test the IC with closer pin spacing. Testing speed is generally low . Only one component testing is carried out at

one time . Separation below 0.1mm or 100 mm with 200

or more pins is not possible in bed-of-nail testing .

Need standard System Test Port and Bus.03/05/23 6ME(E&TC engg.),DYPSOE,Lohegaon,Pune

BOUNDARY SCAN TEST

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WHAT IS FOUR WIRE TEST ?

The method include four basic signal to test the device.

TDI : Test Data Input TDO :Test Data Output TCK :Test Clock TMS :Test Mode Select RST (OPTIONAL) : Reset signal

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TERMINOLOGY USED

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BST CELL AND ITS VHDL CODE

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BST REGISTER

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TAP CONTROLLER STATE DIAGRAM

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TIMING DIAGRAM

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POWER ON RESET FOR TAP

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BST INSTRUCTION

SAMPLE /PRELOAD : To get snapshot of chip output signal i.e. put data on a chip to be test .

EXTEST : To test off-chip circuits INTEST : To test on-chip circuits CLAMP : Forces component output to be

driven by BSR INCODE :To get the ID of device to be

check

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Cont... USER CODE :To get the ID of user programmable

device under test

HIGH Z: To bring the output all components at

high impedance state

It will avoid damage of components

Need to reset the controller or board when goes into

high impedance state

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CONCLUSION

From a given discussion we can conclude that it is not possible to test printed circuit boards with bed-of-nails tester to test multi-chip modules at all without BST hence it is an important tool to test the circuitry .

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REFERENCES

Digital system testing and testable design by

M.Abramovici .

Agrawal.V. K. Multiple fault testing of large circuits

IEEE trans.vol c-30,no.11 pp 855 865.

Introduction to testing and BIST by Breuer .M .A. And

A. D. Friedman.

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Thank you ...

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