SAMTEC OPTICAL SOLUTIONJUNE 15th, 2016

• Acquisition of AlpenIO by Samtec in 2011

• Core Technical and Management teams mostly from LightLogic (acquired by Intel in 2004) , Intel, Sumitomo, AlpenIO (Acquired by Samtec in 2011)

• Additional talents from Sumitomo, JDSU, Santur, Kaiam, Nortel and NeoPhotonics.

• 25+ Engineers in Santa Clara focus on product definition, development and qualification.

• Additional technical staff in Colorado, Indiana, Pennsylvania and Oregon focusing on manufacturing, tooling, SI and process and qualification

SAMTEC OPTICAL GROUP

SAMTEC OPTICAL GROUP

• FireFly technology overview

• Example of FPGA application deployment.

• PCI over FireFly overview

• An introduction to COBO (Consortium for On Board Optics)

OUTLINE

• The key advantages of FireFly are: Smallest pluggable transceiver in the industry Support up to 28Gb/s line rate Pluggable, ease of system assembly No mounting screws. Easy routing / Break out region Copper and Optical cable options on the same connector set. Forced air and conduction cooling options Flexible end 2 options Data, data rate and protocol agnostic

Ethernet, Infiniband, Fiber channel, etc.

Interoperable with QSFP, CXP, Ethernet, Fiber channel, etc.

WHY FIREFLY™ ?

FIREFLY™ - DENSITY LEADER

265Gb/sq inch168 Gbps in < .75 in2 PCB

Copper Flyover Cables Optical Micro-EnginesFireFly™ 14/28 G connectors

Optical Electrical

HIGH-SPEED INTERCONNECT SYSTEM

Flat Heatsink Grooved Heatsink Pin Fin Heatsink

Full AOC Half Cable Bidirectional Cable (Y Cable)

Tx

Rx

Tx Rx

(Cold Plate) (Cold Plate) (Air Cooled)

Tx or Rx

OPTICAL FIREFLY™ CONFIGURATIONS

End 2 Options

Transmitter Receiver

FIREFLY™ X12 BLOCK DIAGRAM

FIREFLY™ X4 BLOCK DIAGRAM

Transmitter / Receiver

FIREFLY OPTICAL ENGINE, ROADMAP

PART Alphasample

Pre-release

Full-Release

ECUO x12 14Gb/s (transmit, receive, Y cable) 2014

ECUO x12 28Gb/s (transmit, receive, Y cable), no CDR Now Q4’16 2017

ECUO x4 14Gb/s (14G x4 duplex) Now Q3’16

ECUO x4 28Gb/s (28Gb/s x4 duplex), no CDR Now N/A* N/A*

ECUO x4 28Gb/s (28Gb/s x4 duplex), with CDR Q3’16** Q4’16** 2017

ETUO x12 10Gb/s (transmit, receive, Y cable, extended temperature) Now Q3’16

ETUO x4 10Gb/s (10Gb/s x4 duplex, extended temperature) Now Q3’16

ECUO x12 16Gb/s (transmit, receive, Y cable) Now TBD TBD

ECUO x4 16Gb/s (16Gb/s x4, duplex) TBD TBD TBD

* Transition to CDR version** Form factor planned

LONG TERM ROADMAP

28G x4 Bidi(sample only)

28G x12 Bidi

28G x4 Bidiw/CDR

“COBO“28G x8 Bidi

w/CDR

28G x12 Bidiw/CDR

?

SiPho28G x4 Demo

“COBO“28G x8 Bidi

w/CDR

VCSEL56G x8 PAM4

SiPho56G x8 PAM4

100GWDM

Many Chan

?

• Xilinx Virtex UltraScale FPGA VCU1287 Characterization Kit• Samtec FireFly evaluation boards, 100m of fiber• Successful demonstration at 25Gb/s and 28Gb/s• Four channel running simultaneously.

TEST AT 25Gb/s WITH XILINX EVALUATION BOARD

• Altera, ARRIA 10 FPGA evaluation board• Successful demonstration at 25Gb/s

TEST AT 25Gb/s WITH ALTERA EVALUATION BOARD

• Connects multiple FPGAs and a PC host using one PCIe connections• Altera StratixV GS FPGA (5SGS)• 168 Gb/s sustained optical I/O • 32G on-board DDR3 memory for data intensive processing

Courtesy Guzik T&M.

GUZIK PCIE BRIDGE CARD

• Connects multiple FPGAs and a PC host using one PCIe connections• 168 Gb/s sustained optical I/O • Two Altera ARRIA 10 FPGAs, with up to 2.8TeraFlops

GUZIK 2ND GENERATION PCI BRIDGE CARD

PENTEK• Xilinx Virtex 7 processing board• VITA 66.4 backplane optical

interface• VITA 57.1 FMC connection

Hitech Global• Xilinx Virtex 7 processing board• 157.6 Gb/s data transfer

SOME OTHER EXAMPLE:

• x10 10G Bidirectional Firefly on FMC

In collaboration with CrossfieldIn collaboration with Techway

OPTICAL FMC ADAPTER

ALPHA-DATA : 28Gb/s SOLUTION

• ADM-PCIE-8V3 board, general FPGA board• With Xilinx Virtex Ultrascale FPGA• Two x4 28Gb/s FireFly• 8 lanes PCIe• Two QSFP 28

Motivation

• PCIEO (using Ipass connector) cannot do PCIE x16

• The Ipass connector is very large and cannot be used in dense application

PCIe OVER FIREFLY

ADAPTER CARD RECONFIGURABILITY

• Reconfigurable via Switches and face plate:• x4• Dual x4• Quad x4• x8• Dual x8• X16

• PCIe specific FW to support• In-band sideband support

• RSET and PRST• Optical idle

ADAPTER CARD

32 Port PLX Switch

Four x4 Data Connectors with inband sidebands

Connector for Optional Sideband Implementation

SMALL FORM FACTOR COPPER PCIE

Takes advantage of Samtec’s large range of connectors and cables• Passive Copper

• Inside box / chassis ≤ 1 m

• Active Copper• Inside box / chassis ≤ 2 m

• Flyover Cable to Front Panel Connector• External connectivity through front panel

Consortium for On-Board Optics [COBO]

• Started at OFC2015 [March 2015]

• Goal is to standardize on-board optic solution. - Not the optical module but the solution (Connector, Mechanical, envelope, monitoring interface, Thermal)

• Mainly led by Microsoft and their supplier (Juniper, Cisco, Arista, Mellanox,…

• Samtec has been participating in COBO since June 2015.

• COBO preliminary spec target end of 2016

COBO: AIMED AT A 1 RU SWITCH

SwitchChip

Illustration for example only

Heatsink

On-board modules

Faceplate optical connectors

Fibers

Air intake

FANS

COMPARISON OF TECHNOLOGY

SFP x1 lane

QSFP x4 lanes

Micro-QSFP x4 lanes

QSFP-DD x8 lanes

DRIVER FORCE BEHIND COBO: FACEPLATE DENSITYEVOLUTION OF SWITCH I/O BANDWIDTH CAPABILITY

I/O bandwidth (Tb/s) Lane Speed (Gb/s) Modulation type Optics type Height

3.2 25 NRZQSFP28 1RU

On board 1RU

4.8 25 NRZ

QSFP28 2RU

µQSFP 1RU

On board 1RU

6.4 25 or 50 NRZ/PAM4

QSFP28 2RU

µQSFP (25G), 3 row 1RU

µQSFP (50G), 2 row 1RU

QSFP-DD (25G) 1RU

On board 1RU

12.8 50/100 PAM4µQSFP (50G) 3 row 1RU

On board 1RU

25.6 100 PAM4TBD

On board 1RU

2015

2017

Increase in IO bandwidth Increase in line rate Increase in front panel density

COBO BOUNDARIES

• COBO wants to address: INTERFACE WITH HOST SYSTEM- Electrical connectivity- Mechanical dimension- Thermal / cooling capability- Fiber management and connectivity- Signal integrity requirement

• COBO is not going to address:- Optical specification

- System level architecture of the board

SAMTEC is proposing the FireFly concept as a solution for COBO

SAMTEC INTEREST IN COBO

Two connectors solution: Edge connector for high speed signalsLower speed connector for power and controlEasy plug in solution

Samtec technology competes with other connector supplier solution (based on LGA or vertical connector) within COBO to become COBO’s solution.

Decision on connectors to be made in Q2-Q3 2016

SAMTEC’S SOLUTION ADVANTAGES SUMMARY

• No compression Hardware needed• Ease of installation• More board space• Easier trace routing• High density• Simple Heatsink Installation

• Edge card connector• Easy routing and breakout region.• Possibility to add components on the bottom of the boards.• Flexibility to adjust heatsinking via the board (using thermal pad below the board)

• Footprint Flexibility• Increase separation between two connectors• Increase width with same optical engine design

• Robust mechanical design• SMT Anchor posts/weld tabs for a rugged design• Integrated latching feature in connector

BACKUPS

• Hyperscale data center growth

DRIVER FORCE BEHIND COBO

Source: Microsoft

DRIVERS BEHIND COBO

• Current Pluggable optic cannot support next generation switch capability for faceplate density.

1 RU, 32 QSFP28 3.2Tb/s

1 RU, 48 µQSFP28 4.8Tb/s

1 RU, 16MPO connectors 4.8Tb/sEasily expendable to 32 or more

Other factors: New QSFP Double Density (work started) release dateCooling capability (advantage to mid board optic)

• Propose a modified FireFly concept with:- Wider UEC5 connector to support x8 and x16 lanes

(probable choices of COBO transceiver width)- Improved SI performance on the UEC5 to support 50Gb/s NRZ and 50Gb/s PAM4 signaling- Modified UCC8 connector to support the added lanes for powering and status monitoring.

SAMTEC PROPOSED SOLUTION FOR COBO

Miniature 2 Piece Edge Card connector• UEC5 Series - 0.5 mm pitch• High speed data only• 12 Differential Pairs (GSSG)• Designed for 28 Gb/s• Rugged weld tabs• Easy Breakout Region layout

• UCC8 Series - 0.8 mm pitch • Power supply pins• Low speed control signals• Latch locking mechanism• Rugged weld tabs

PCB Footprint: 18.6 mm x 11.5 mm x 4 mm

FIREFLY™ BOARD CONNECTOR