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Samsung System LSI Business

NS (Stephen) Woo, Ph.D. President & GM of System LSI

Samsung Electronics

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Disclaimer

The materials in this report include forward-looking statements which can generally be identified by phrases such as Samsung

Electronics (SEC) or its management "believes," "expects," "anticipates," "foresees," "forecasts," "estimates" or other words or

phrases of similar implications. Similarly, such statements that describe the company's business strategy, outlook, objectives,

plans, intentions or goals are also forward-looking statements. All such statements are subject to certain risks and uncertainties

that could cause actual results to differ materially from those in the presentation files above.

For us, particular uncertainties which could adversely or positively affect our future results include:

· The behavior of financial markets including fluctuations in exchange rates, interest rates and commodity prices

· Strategic actions including dispositions and acquisitions

· Unanticipated dramatic developments in our major businesses including CE (Consumer Electronics),

IM (IT & Mobile communications), DS (Device Solutions)

· Numerous other matters at the national and international levels which could affect our future results

These uncertainties may cause our actual results to be materially different from those expressed in this report.

System Semiconductor Industry

Samsung System LSI : Now

Looking Forward

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Market of Mobile Device

2012 2013 2014(E) 2015(E)

0.3

0.5

0.5

0.5

0.6

0.6

0.7

0.7

* Source : Gartner, Strategy Analytics, 2013 3Q

Premium Mid + Low

(billion units)

0.8

1.0

1.2 1.3

Smartphone

9%

22%

* Source : Gartner, 2013 3Q

(billion units)

2012 2013 2014(E) 2015(E)

0.1

0.2

0.3

0.4

0.07

0.05

0.06

0.12

0.07

0.19

0.09

0.26

Premium Mid + Low

Tablet

25%

58%

4/32

Computing Power

Com

putin

g/Ba

ndw

idth

• New applications require higher computing/bandwidth

Resolution

Single Camcording

1080p Video

Dual Camcording

Web browsing

Location Based Service

Voice Command

5/32

Display Trend

• Higher resolution

HD-class Display

FHD-class Display

WQHD (2,560x1,440)

HD (1,280x720)

UHD (3,840x2,160)

Res

olu

tio

n

2011 2013 2015(E)

FHD (1,920x1,080)

Display

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Camera Sensor Trend

• Image quality enhancement is also improving

Face Detection

2009 2011 2013 2007 2015(E)

3Mp

8Mp

13Mp

Res

olu

tio

n

5Mp

16Mp

20Mp

Face Detection

Wide Dynamic Range

Image Stabilization

Camera Sensor

Wide Dynamic Range

Image stabilization

System Semiconductor Industry

Samsung System LSI : Now

Looking Forward

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Three business areas

AP Connectivity

SOC

Image Sensor Display Driver IC Smart Card IC Power Management IC

LSI

Foundry

Foundry

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vt

Product Portfolio

WiFi/BT GPS

• Smartphone

• IoT

• Powerful CPU/GPU

• Low Power Camera Sensor

• Pixel Leadership

• Slim Solution

• World’s Best Performance

• Low Power Consumption

• High Density e-SE Module NFC

SIM

• Full line up for next FHD

• Lower Power solution

• Fast Speed (New Architecture) T-con

eDRAM

Backlight control

Display Driver IC

T-Con

PMIC Power

Sequence Control

& I2C Interface

• PMIC line: AP & OLED

• High Efficiency

• High Accuracy

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1. AP (Application Processor)

• Focusing on high performance with low power consumption

Game changing technology :

big.LITTLE octa core

big LITTLE

CPU Leadership

Richer 3D graphics with

Energy efficiency

Powerful GPU

Advanced mobile process &

design methodologies

Low Power

Low High

Low High

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Computing Power

*DMIPS : Dhrystone Million Instructions Per Second

2009 2010 2011 2008

10,000

20,000

30,000

(DMIPS)

2012 2013

* Source : Samsung Electronics Co., Ltd., ARM

Cortex-A8 1.0GHz

ARM11 800MHz

Cortex-A9 Dual 1.2GHz

Cortex-A9 Quad 1.4GHz

Cortex-A15 2.xGHz

Cortex-A15 Octa 1.6GHz

• Has been leading AP industry since 2009

Innovation in both Architecture & Silicon Technology

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Heterogeneous architecture for energy efficiency

big.LITTLE Architecture

• Best of both worlds: high performance and low energy

1 2

3 4

1 2

3 4

big C-A15

LITTLE C-A7

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big.LITTLE Architecture

• 20% gain at performance and energy, respectively

+ 20%

Higher is Better

big.LITTLE Conventional

*Source : Samsung Electronics Co., LTD, 2013 2Q

*Conventional : big CPU only

Performance

-15 ~ 20%

Lower is Better

big.LITTLE Conventional

*Source : Samsung Electronics Co., LTD, 2013 2Q

Energy

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Advanced Silicon Process

Process Node

Vdd 90/65nm

Strained Si

45nm

ULK

32nm

1st Gen HK/MG

20nmm

1st Gate Last HK/MG

1.2V

1.1V

1.0V

0.9V 0.8V

0.7V

10nm

2nd Gen FinFET

14nm

1st Gen FinFET

*Vdd : Supplying voltage of drain

28nm

2nd Gen HK/MG

1.0V

2014(E) 2013 2012 2010 2006,

2009

• Leadership in low-power, advanced silicon process

* Source : Samsung Electronics Co., Ltd.

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• Higher resolution & smaller pixel have driven sensor industry

* Source : Samsung Electronics Co., Ltd.

Wide Dynamic Range

5Mp

8Mp

1.3Mp

12Mp

VGA

Standard Mobile Imaging Architecture (SMIA)

Back-side Illumination Pixel

ISOCELL

2Mp

13Mp

5.6

2.25

1.4

1.1

Sub 1um

2.8

2007 2006 2008 2009 2010 2011 2005 2012 2013 2004

3Mp

1.8

Pixel Pitch (um)

Resolution

2. Image Sensor

16/32

• To increase sensitivity and decrease light loss & crosstalk

Pixel Architecture

Increase sensitivity

Gap-less u-lens

Reduce loss in Si

Deep PD

Reduce metal layer reflection

Light-guide Conventional

C/F

Photo-diode

u-lens

Metal

Light-guide

Remove metal layer reflection

Front-side illumination

Back-side illumination

Back-side illumination

No light loss

Photo Diode

Photo Diode

G R

Photo Diode

Photo Diode

G R

Back-side illumination

ISOCELL

With color interference

Without color interference

ISOCELL

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New Products for 2014-15

• 16Mp ISOCELL Sensor with 1.12um pixels

- Main sensor for smartphones

- Wide dynamic range & Auto focus

• Next APS-C sensor

- Sensor for mirror-less cameras

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Partnership with customers

Customers

One stop IP shopping and design support

IP & Design Support

Best service for development and mass production

Service

Advanced technology and continuous capacity growth

Technology & Capacity

3. Foundry

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14nm Achievement

ARM , Cadence, Synopsys & Mentor

FinFET Design Enablement Platform

First Cortex-A7 implementation

Samsung : 14nm FinFET test sample & Design Infrastructure ready

• World’s leading 14nm FinFET solution via collaboration

20/32

Technology & Capacity

IBM STMicro.

Samsung

GlobalFoundries

ISDA Giheung, KR

Austin, Texas, USA Hwaseong, KR

* ISDA : International Semiconductor Development Alliance

System Semiconductor : Introduction

Samsung System LSI : Now

Looking Forward

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“Widcon” & TSV (Through Silicon Via) 1

64-bit CPU 2

FinFET Process 3

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• Wide connection between logic and memory

Higher bandwidth, lower power consumption

Memory Stacking with TSV

“Widcon” with TSV

Package PCB

DRAM

AP

u-bump

Micro Bump Short Connection with TSV

24/32

Higher is Better

Widcon1 LPDDR3 Widcon2 LPDDR4

Lower is Better

Widcon1 LPDDR3 Widcon2 LPDDR4

14%

33%

60% 43%

*Source : Samsung Electronics Co., Ltd., JEDEC, 2013 1Q

• World’s 1st AP using Widcon & TSV

Performance Power

Widcon in reality

25/32

• 2-step approach:

AP with ARM’s 64-bit core

AP with Samsung’s own 64-bit core

64-bit CPU core for Smart Devices

Samsung

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• FinFET technology leadership

Lower Vdd and delay than a planar process

Vdd

Del

ay

FinFET 20nm Planar

Less Delay

Lower Vdd

Source Drain

Gate

Advantage Structure

14nm FinFET Technology

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ModAP (Cellular Modem + AP) 1

IoT 2

Foundry 2.0 3

New Business

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• Dual tracks for modem collaboration

High-end : 2-chip strategy with Tier-1 modem suppliers

Mid/low-end : ModAP using system company’s modem

AP Modem

Memory Memory

Existing Products

1. ModAP (Modem + AP)

Memory

Additional Products

AP Modem

ModAP

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ModAP

• System LSI’s 1st ModAP was shipped in 3Q’13

Exynos 4 Quad +

System Company’s Modem

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• Smart building, Smart community, . . .

• Total connectivity solutions

2. IoT (Internet of Things)

Lighting Control

Air conditioning and Temperature

control

Energy Generation

Energy Storage

Control of Elevators and

Escalators

Security Control

Monitoring Cameras

Disaster Prevention

Total Solutions

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3. Foundry 2.0

• Technical leadership … 14FF and beyond

Follower Technology Leadership

Tier 1 only Tier 1 + Tier 2/3

Silicon Silicon + IP Provider

1

2

3

Foundry 2.0

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Foundry 2.0

• Early EUV Adoption

• 10nm FinFET Leadership

Schedule

Performance, power and area *SRD: Semiconductor Research & Development

SRD

ISDA

33/32

• Samsung S.LSI provides total solution for connected world

• Samsung S.LSI offers attractive foundry solution

Mobile AP (Application Processor)

Image Sensor

ModAP

IoT

Leading-edge technology: 14FF

Capacity

Concluding Remarks