Sample Test Reports for efficient registration error analysis and PCB manufacturing process control.

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Sample Test Reports for efficient registration error analysis and PCB manufacturing process control

Transcript of Sample Test Reports for efficient registration error analysis and PCB manufacturing process control.

Page 1: Sample Test Reports for efficient registration error analysis and PCB manufacturing process control.

Sample Test Reports for efficient registration error analysis and PCB manufacturing process

control

Page 2: Sample Test Reports for efficient registration error analysis and PCB manufacturing process control.

Quantifying different causes of registration errors is the key to effective registration process control.

Separating Causes

Page 3: Sample Test Reports for efficient registration error analysis and PCB manufacturing process control.

Tracking PCB construction variables

Page 4: Sample Test Reports for efficient registration error analysis and PCB manufacturing process control.

Enhanced PerfecTest coupon

measurementsThe basis to identify and quantify registration errors and their causes

Largest registration error on this panel.

Automatically calculated after test data was collected from PerfecTest coupons

Test results from one panel

Page 5: Sample Test Reports for efficient registration error analysis and PCB manufacturing process control.

Fluctuation of Errors on different panels indicate

RANDOM SHIFT ERROR

MAXIMUM TRUE POSITION ERRORS

Largest registration error per panel

Biggest registration error by panel

Page 6: Sample Test Reports for efficient registration error analysis and PCB manufacturing process control.

Identify, separate & correct

EXPANSION ERRORS occur when inadequate scaling factors are applied to theartwork. Expansion registration errors are job specific. They describe the sizeof layers of a specific job. Depending on materials, panel constructions, andfabrication processes, necessary scaling factors will differ with each job.

• SHIFT ERRORS describe the location of inner layers, cores, or panels during thefabrication process. Shift errors are caused by tooling inaccuracies or operatorerrors. Shift error patterns are typically repeated on different jobs.

• Expansion errors are corrected with better scaling factors.

• Shift errors are corrected with tooling adjustments andimproved operating procedures.

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Page 7: Sample Test Reports for efficient registration error analysis and PCB manufacturing process control.

Nominal size

Actual size

Illustration 2Illustration 1

Actual size

Nominal size

- .005”-.005” - .007” - ,003”

Shift targets

Total registration error: - .005” + - .005” = -.010”

negative expansion error onlycorrected with scaling.

Maximum error is 0.005”.

Total registration error:- .007” + - .003” = - .010”

combination of shrinkage & shift errorcorrected with scaling & process

adjustments. Maximum error is 0.007”.

Nominal Location

.002 shift in +X axis

SIZE and SHIFT illustration

Page 8: Sample Test Reports for efficient registration error analysis and PCB manufacturing process control.

Expansion error by layer,Averages of 6 panels

Average Expansion errors

Page 9: Sample Test Reports for efficient registration error analysis and PCB manufacturing process control.

Corrected scaling factors -automatically calculated- adjust for irregular expansion.

NOTE: Scaling artwork will ONLY correct for expansion & shrinkage errors.Repetitive and random shift errors require tooling, process, or operator adjustments.

Corrected scaling

Page 10: Sample Test Reports for efficient registration error analysis and PCB manufacturing process control.

Shift errors averaged over the production lot indicate layer, core, and panel repetitive offset errors

To determine random shift errors refer to individual panel data

Average shift errors

Page 11: Sample Test Reports for efficient registration error analysis and PCB manufacturing process control.

Expansion errors and maximum true position errors are calculated from coupon measurements in Sites 1, 2, 3, 4.

Shift errors are determined by the cross points of the diagonals from Site 1 to Site 3 & Site 2 to Site 4

Site 4 Site 3

Site 1 Site 2

Shift targetMaximum True Position

Error by layer

Calculating expansion & shift errors

Page 12: Sample Test Reports for efficient registration error analysis and PCB manufacturing process control.

Red dots illustrate the average of layers in panel 1

Green dots illustrate the average of layers in panel 2

Blue dots illustrate the average of layers in panel 3

Grey dots illustrate the average of layers in panel 4

Dark green dots illustrate the average of layers in panel 5

Purple dots illustrate the average of layers in panel 6

Average registration errors by panel

Page 13: Sample Test Reports for efficient registration error analysis and PCB manufacturing process control.

Different locations of average shift targets, indicate shift of panels during drilling.

• scattered dots indicate random drilling process errors

• overlapping dots indicate drill offsets

• a combination of random and offset drill errors occurs frequently

Shift targets

Random & repetitive drilling shift errors

Page 14: Sample Test Reports for efficient registration error analysis and PCB manufacturing process control.

Inner layer averages from 11 panels in a production lot

Average inner layer registration

Page 15: Sample Test Reports for efficient registration error analysis and PCB manufacturing process control.

Averages from 11 panels of a production lot with multiple lamination cycles

Comparison of inner layer cores

All inner layers 3

4

5

6

2

9

7

8

Layers 2 & 9 added in second lamination cycle.

Lamination shift registration errors

Page 16: Sample Test Reports for efficient registration error analysis and PCB manufacturing process control.

Random shift on panels from the same production lot. Compare lamination and drilling shifts.

Page 17: Sample Test Reports for efficient registration error analysis and PCB manufacturing process control.

Random rotation of the same inner layer cores on different panels. Random shift of inner

layers and inner layer cores on different panels of the same production lot.

Rotation & shift in - X

Rotation & shift in –x & +y

Inner layer 3

Inner layer 4

Lamination random shift errors

Page 18: Sample Test Reports for efficient registration error analysis and PCB manufacturing process control.

A fully integrated solution to match registration challenges

Predict scaling for new jobs

Page 19: Sample Test Reports for efficient registration error analysis and PCB manufacturing process control.

Factory IntegrationAvailability of precise registration data

when it is needed & where it is needed.

Easy importation of precise or best-match scaling datawhen new jobs are being configured.

View & analyzeRegistration dataOn workstations

AutomaticNew job setup

On workstations

Direct or remote New job setup

on workstations

Automation Script

PerfecTest System

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