sac.eprocure.isro.gov.in · Web viewREQUEST FOR PROPOSAL. FOR. DEVELOPMENT. AND FABRICATIO. N. OF....

RFP for TRM EPC development

REQUEST FOR PROPOSAL FOR DEVELOPMENT AND FABRICATION OF HIGH POWER MINIATURIZED PULSED ELECTRONICS POWER CONDITIONER (EPC) FOR TRANSMIT-RECEIVE MODULE (TRM) OF DUAL FREQUENCY SWEEP SAR (NI-SAR)

(SAC/TRM EPC/RFP-06/2015)

SPACE APPLICATIONS CENTREAhmedabad 380 015

October 2015


Background:

Space Applications Centre (SAC), Indian Space Research Organization (ISRO) solicits Indian Industries, having their own design and fabrication facilities in India, to submit bids against this Request for Proposal (RFP) for development and supply of High Power Miniaturized Pulsed Electronic Power Conditioner (EPC) using HMCs and planar magnetic components for Transmit-Receive integrated Module (TRM) subsystem. Electronics Power Conditioner (EPC) provides various high voltage- high current pulsed DC and low voltages-low current continuous DC supplies to cater the powering requirements for Transmit-Receive (TRM) subsystem.

The EPC development is divided in two phases:

Phase-1: Development of Prototype and DVM EPCs Phase-2: Development, Qualification and production of Flight model EPCs.

The present scope of RFP is limited to Phase-1 development only.

This RFP provides baseline EPC design configuration, electrical and mechanical specifications, tests requirements along with important developmental milestones and expected delivery schedule that should be maintained by the vendor at various stages.

The details are provided as under:

Exhibit ‘A’ : General information and scope of RFP Exhibit ‘B’ : Electrical and Mechanical Specifications Exhibit ‘C’ : Quantity, Delivery schedule and payment milestones


EXHIBIT - A

1.0 Scope

Vendor is required to fabricate, test and deliver the proto EPCs for design verification usage based on specifications and design provided by SAC. Vendor is required to carry out the miniaturization of circuit provided by SAC using Hybrid Micro Circuits (HMCs) to the extent possible. Vendor is also required to convert the conventional magnetic components used in SAC design to planar magnetic, for better packaging and repeatable performance over large quantity. The development work include following major activities.

Development and testing of Proto EPC and DVM EPCs using Hybrid Micro- circuits (HMCs), planar magnetic components and other discrete components.

Feasibility study to realize the EPC in given weight and volume. Identifying the circuit elements for hybridization. PCB and HMC layout designs as per ISRO guidelines. Procurement of components and materials for fabrication of EPC. Fabrication and testing of HMCs and test jigs. Design & development of planar magnetic components. Design and fabrication of mechanical package for EPC. Development of One Prototype EPC to demonstrate the performance compliance. Fabrication and testing of Development Model EPCs as per table given in Exhibit-C.

Vendor should have capability in terms of fabrication facility, storage facility and test facility as well as necessary technical expertise to build, optimize, test and deliver EPCs.

1.1 Responsibilities of Vendor and SAC

Sr. No. Development Stages SAC

ResponsibilitiesVendor

Responsibilities

1Provide circuit schematic and bill of material once contract is finalized. √

2

Provide the electrical performance results of the circuit proposed for miniaturization under this RFP on printed circuit board using packaged components.

√

3Carry out the feasibility analysis to accommodate the EPC circuit within the weight and volume specified in Exhibit-B of this RFP.

√

4Generate the procurement specifications and procure components as per quality mentioned in Exhibit-B and submit for SAC approval.

√

5Review the procurement specifications generated by vendor and give clearance for the procurement of components.

√

6 Design of PCB, HMCs and planar transformer/inductor layouts as per ISRO guidelines and submit for SAC approval.

√

7 Review and approve the layout design of PCB, HMCs and planar transformer/inductor. √


8 Carry out the Package design for EPC and HMCs and submit for SAC approval. √

9Review the package design for EPC and HMCs submitted by vendor and give clearance for usage.

√

10Carry out thermal analysis to ensure reliable operation of EPC over specified temperature range and submit for SAC approval.

√

11 Review the thermal analysis carried out by vendor and give clearance for fabrication. √

12Development and fabrication of test jigs and test setups for the testing of EPCs. Test jigs and test setups and submit for SAC approval.

√

13Review and approve the test jig circuits and test setups prepared by vendor for the testing of the EPCs.

√

14 Fabrication of HMCs. √

15 Fabrication of PCBs and planar transformer/inductors. √

16 Wiring and assembly of Proto EPCs. √

17

Testing of Prototype EPC as per given test plan. It will be the responsibility of the vendor to demonstrate the full compliance to the specifications.

√

18 Review the test results of Prototype EPC and give clearance for development of DVM EPCs. √

19

Complete the actions arising out of non-conformances at various stages to the satisfaction of SAC. It will be vendor’s responsibility to obtain the necessary approvals/clearances from SAC at every stage.

√

20 Fabrication and testing of DVM EPCs as per given test plan. √

21 Review the test results of DVM EPCs and give clearance for shipment. √

2.0 Deliverables

a) HardwareFollowing hardware shall be delivered by the Vendor to SAC stores after the review and acceptance of the test results by SAC.

Sr. No. Item Quantity1 Proto-type EPCs 1

2 DVM EPCs As per table inExhibit C

3 Test jigs developed for the functional testing of HMCs and EPCs

All test jigs developed for this contract


b) Documents

One hard copy and soft copy of the following documents shall be supplied by the vendor.

Sr. No. Document to be supplied along with bid

1Vendor has to provide the feasibility analysis report to accommodate the EPC circuit within the weight and volume specified in Exhibit-B of this RFP.

2

Documents supporting the vendor’s prior experience for the design and development and qualification of Power Electronics Hybrids and Electronic Power Conditioners have to be submitted at the time of quotation.

3

Certificate for HMC and PCB fabrication line certified by ISRO shall be produced by the vendor. If any of the processes to be used require any Incremental Process Qualification, it shall be clearly identified in the bid.

Sr. No. Documents to be provided during stages of realization of Proto/DVM EPCs

1 Procurement specifications of components, materials, package etc.

2 SAC approved layout of PCBs, HMCs, Planar magnetic/Inductor in CAD format.

3 Final schematic diagram of EPC circuit.4 SAC approved package drawing of HMCs and EPC in CAD format.5 Report on thermal analysis.6 Test jig drawings in CAD format.7 Final test plan document.

Sr. No. Documents to be provided along with deliverables

1 Detailed test report of all deliverable EPCs.2 Certificate of compliance for all deliverable EPCs.3 Copy of failure/deviation analysis reports, if any.4 Circuit drawing and interface details of test jig for HMCs and EPC.

3.0 Other terms and conditions

1. Prior experience of design and development and qualification of Power Electronics Hybrids and Electronic Power Conditioners is mandatory and relevant supporting documents regarding experience has to be submitted at the time of quotation.

2. The present RFP is for the development and fabrication of DVM hybridized EPCs. This will be followed by fabrication and testing of flight model units. Hence vendors which are qualified for the fabrication and testing of space grade HMCs, PCBs and packages shall only be considered.

3. Vendor should provide point-by-point compliance to all the requirements as mentioned in Annexure-II, without which their offer shall not be considered.

4. SAC/ISRO reserves the right to review the progress of work at any time.5. SAC reserves the right to modify any part of the design as per project requirements.


6. In case of any modification to be incorporated during development it should be mutually discussed and agreed upon before implementation.

7. Vendor has to provide the feasibility analysis report to accommodate the EPC circuit within the weight and volume specified in Exhibit-B of this RFP at the time of quotation.

8. Vendor shall submit their offer in two parts, i.e. Part-1: Technical proposal including all the details given in commercial proposal without prices (Prices should be masked). and Part-2: Commercial proposal.

Note: Both the proposals should be submitted in separate sealed covers. 9. On receiving the proper quotations and details from the vendor, SAC may

hold detailed technical discussions with vendor if required. 10. SAC reserves the right to parallely enter into PO contract with more than one

technically qualified vendor.11. The vendor shall provide warranty of minimum one year from the date of acceptance of

EPC towards the supply of hardware, which is free from any faults in material, workmanship etc. and is in accordance to the applicable specifications and drawings etc.

12. Intellectual property right for EPC developed by vendor shall rest with SAC, ISRO.13. Vendor shall furnish undertaking that the design shall not be used / disclosed in part or

full for any other purpose.14. As a part of evaluation of offers SAC team may visit and assess the facilities in order to

execute the work as detailed in RFP.

4.0 Additional Requirement from Vendors:

(1) In Phase-2 of EPC development at a later stage, SAC may decide for qualification and Flight Model (FM) production. It is mandatory that the vendor have their HMC and PCB fabrication lines certified by ISRO.(2) Certificate for HMC and PCB fabrication line certified by ISRO shall be produced by the

vendor along with the bid. If any of the processes to be used require any Incremental Process Qualification, it shall be clearly identified in the proposal.

(3) EPC circuit consists of high power DC-DC converter with currents ranging upto 12A, hence it is desirable for the vendor to have qualification for following HMC processes also for Phase-2 development:

a. Aluminum wire bonding and/or Gold ribbon bondingb. Double side hybrid with printed through holes for increased packaging density.

1N6642

3.3K0.1uF

4N24AU

TRM EPC

HCTS373MS

330E

VPULSE = 4.1V min., Isource = 4mA max.

Driver Circuit

330E


EXHIBIT – B

Electrical and Mechanical Specifications of EPC

1.0 Introduction

TRM EPC consists of two multi-output DC-DC converters namely low power DC-DC converter and high power DC-DC converter generating total five pulse and three continuous outputs. The raw bus input to EPC is 60V to 75V DC. Low power DC-DC converter consists of four basic outputs (+5V, +5.7V, +9V, -5.7V). +5.7V and -5.7V basic outputs are followed by low dropout regulators. +5V and +9V outputs of low power converter are followed pulse modulators to generate pulse outputs (+5V Tx/Rx, +5V Rx and +8V Tx). High Power DC-DC converter consists of two basic outputs (+52V, +29V) followed by pulse modulators to generate pulse outputs (+50V Tx, +28V Tx).

The block schematic of EPC and part list is given in Figure-1 and Annexure-1 respectively. The electrical and mechanical specifications are placed as under.

2.0 Electrical and Mechanical Specifications of EPC

2.0.1 Electrical Specifications of EPC

(1) Input Voltage : 60V to 75 V DC, nominal 70VDC

(2) Total Overall Efficiency : Better than 80 % @ Full load and 70V Input voltage(3) Bus protection : Appropriate Fuse is to be provided at the input line. (4) Over Power/ Over Current : EPC will turn OFF whenever total output power exceeds

Protection the rated power by more than 25%. (5) Operating Temperature Range : -15C to +65C Note: (The design should be such that the EPC can Turn-on even in extreme cold conditions of ~ -30°C, though may not meet specifications) (6) Tele-commands : Interface through opto-isolators with dedicated i/p lines for EPC ON and EPC OFF commands. Pulse signal with 100±10 msec duration shall activate the respective command line. EPC should not turn ON/OFF with voltage pulses of duration less than 5msec on tele-

command lines. Following telecommand interface circuit should be used in EPC.

(7) Telemetry : 4.5 ± 0.5V output for ON status and 0V for OFF status

HCTS373MS

VPULSE = 4.1V min., ISOURCE = 4mA max.

680E

Driver Circuit TRM EPC

Control Signal

Common O/P GND


is provided to indicate the ON/OFF status of EPC.

(8) Control signals for pulsed outputs : Following figure shows the electrical interface for the control signals for pulsed outputs. Returns of these

signals must be connected with the common output ground.

(9) Input Inrush Current : Input inrush current should be approximately 1.25 times the nominal input current at full load while issuing of ON Command as well as during the output control pulse signals are activated.

(10) Ext. Freq. Synchronization port : Interface through isolation transformer. EPC should be able to synchronize with a 4.5V0.5V (Isource = 2mA) external sync. Signal with 10% duty at 195±5 kHz frequency. In the absence of an external synchronization signal the converter should operate at its own internally set frequency. When external synchronization is not desired the sync. input port can be left open.

(11) Thermal Consideration : EPC package should be able to handle its own power dissipation without external heat sink at 65C base plate temperature.(12) Input current at 70V DC I/P

Before ON command is issued : < 4 mAWithout any load : TBDWith average but w/o pulse load : TBD With average and pulse load : TBD :

(13) Output Voltage/Current requirement and detail specifications : As per table-1

(14) Isolation : 100Megohms (min.) at 500V DC [Isolation between input (i.e. Raw bus and on/off command line) and output.] Chassis should be isolated from raw bus return.


2.0.2 Mechanical requirements of the EPC

Parameter SpecificationTentative Package Size

(max.) +1 ≤ 155mm X 132mm X 55mm

Tentative Weight (max.) +1 800gms

Interface +2 Number of connectors and its locations are to be

finalized through mutual discussion and agreements.

Material Alluminium alloy 6061T651Surface treatment Black Anodization on all surfaces

Note: +1 Vendor should try to minimize the size and weight of EPC.

+2 Chassis GND (an electrical connection to the EPC mechanical housing) is required to be brought out on a pin of D-sub connector


Table-1 Tentative Output Voltage and Current requirements of EPC

Parameter O/P-1 O/P-2 O/P-3 O/P-4 O/P-5 O/P-6 O/P-7 O/P-8Input

Voltage 60 to 75VDC (nominal 70VDC)

O/P Voltage +50V +28V +8V +5V +5V +5V -5V +5V

O/P Condition

TxPulsed

(0 to +50V)

TxPulsed

(0 to +28V)

TxPulsed

(0 to +8V)

Tx/RxPulsed

(0 to +5V)

Rx Pulsed

(0 to +5V)CW CW CW

O/P Current (A)

6 to12(nominal 10)

1.25 to 2.5(nominal1.75)

0.1 to 0.2(nominal 0.15)

0.15 to 0.3(nominal 0.225)

0.075 to0.15(nominal 0.112)

0.15 to 0.3(nomi

nal 0.22)

0.075 to0.15(nomi

nal 0.112)

0.05 to 0.1(nomi

nal0.075

)Configuration 1

Min. Pulse width(µsec) 12 12 12 12/526 526 -- -- --

Min. Duty cycle(%)

2.22 2.22 2.22 2.22/ 97.4 97.4 -- -- --

Min. PRF (Hz) 1850 1850 1850 1850 1850 -- -- --

Configuration 2Max. Pulse width(µsec) 42 42 42 42/356 356 -- -- --

Max. Duty cycle(%)

10.5 10.5 10.5 10.5/89 89 -- -- --

Max. PRF (Hz) 2500 2500 2500 2500 2500 -- -- --

Line Regulation(60 to 75V

DC)±1%

Load Regulation** ±2% ±1.5% ±1% ±1% ±1% ±1% ±1% ±1%

Temp.Regulation ±1% (-15°C to +65°C)

O/P VoltageAccuracy ±100mV

O/P droop including transient #

1V 500mV 200mV 200mV 200mV -- -- --

Ripple (max.) # 100mV

O/P voltage rise time (max.) #

1µsec 1µsec 1µsec 1µsec 1µsec -- -- --

O/P voltage fall time(max.) #

1µsec 1µsec 1µsec 1µsec 1µsec -- -- --

** Load regulation is specified for 50% to 100% variation in pulsed output current for all pulsed outputs. All Measurements will be carried out at load end with load kept ~20cm away from EPC output connector.

# Definition of pulsed output parameters is given in Figure-3.

PS_CONTROL_Tx :PRF – 1850 to 2500Hz

Duty- 2.22% to 10.5% max.

PS_CONTROL_Rx :PRF – 1850 to 2500Hz Duty- 89% to 97.4%

0.5µs

12µs to 42µs

356µs to 526 µs

3.5µs

400µs to 540µs

400µs to 540µs

0.5µs 3.5µs


Fig.-1 Block Schematic of EPC

Fig.-2 PRF timing Diagram of Tx and Rx Control Pulse of EPC

Fig-3. Definition of Pulsed Output Parameters

Control Pulse

Pulsed Output

Turn-On response time Fall time

10% Vp

90% Vp

Output Voltage (Vp)

Droop including Transient

Ripple


3.0 Component Quality:

Device Family Quality LevelActive devices MIL Temperature grade

Passive devices MIL Temperature grade

Multi-pin connectors MIL Temperature grade

4.0 Testing of EPC

1. Vendor shall first develop Prototype EPCs to demonstrate the electrical performance compliance. The parameters to be measured during EPC testing are given in Table-2, Table-3 and Table-4 followed by measurement mentioned in note. These parameters are to be measured at -15°C, +25°C and +65°C ambient temperatures on all Proto and all DVM EPCs. Non-compliance to any specifications in Prototype EPC can be finalized through mutual discussions and agreement.

2. Vendor shall prepare a comprehensive test plan document detailing the test methods, test equipments, electrical test setups, result sheets etc. SAC and vendor will finalize this document after discussion and mutual agreement.

3. SAC reserves the right to review, add or update any test at any stage during the


development phase in consultation with vendor.

Table-2: Test Matrix of High Power DC-DC Converter @ -15°C, 25°C, 65°C

Table-3: Test Matrix of Low Power DC-DC Converter @-15°C,25°C,65°C

Output

Vin(V)

Iin(A)

Load ConditionParameters for Pulsed and Continuous

Outputs +Main O/P (5V Tx/Rx, 5V Rx, 5V RF CW)

Rest O/Ps(8V Tx, 5V Digital CW, -5V RF CW

Amplitude*

(V)Droop(mV)

Rise time(ns)

Fall time(ns)

Ripple(mVp

p)

5V Tx/Rx

70√ ML

NL√ √ √ √ √

√ NL √ √ √ √ √√ FL √ √ √ √ √

5VRx

70√ ML

NL√ √ √ √ √

√ NL √ √ √ √ √√ FL √ √ √ √ √

8V Tx

70√

NLML √ √ √ √ √

√ NL √ √ √ √ √√ FL √ √ √ √ √

5V RF CW

70√ ML

NL√ x x x √

√ NL √ x x x √√ FL √ x x x √

-5VRF CW

70√

NLML √ x x x √

√ NL √ x x x √√ FL √ x x x √

5V Digital

CW70

√NL

ML √ x x x √√ NL √ x x x √√ FL √ x x x √

Output

Vin(V)

Iin(A)

Load condition

Parameters for Pulsed Output

+50V O/P

+28V O/P

Amplitude*

(V)Droop(mV)

Rise time(ns)

Fall time

(ns)

Ripple(mVpp)

50V 70√ ML

NL√ √ √ √ √

√ NL √ √ √ √ √√ FL √ √ √ √ √

28V 70√

NLML √ √ √ √ √

√ NL √ √ √ √ √√ FL √ √ √ √ √


Table-4: Test Matrix for Worst Case Conditions @-15°C,25°C,65°C

I/PVoltage

(V)

Iin

(A)Load

ConditionParameters

+50VTx

+28VTx

+8VTx

+5VTx/Rx

+5VRx

+5VRFCW

-5VRF

CW

+5VDigital

CW

70 √

CW at F.L, Pulsed

Load (Tx & Rx) off

Amplitude(V)* x x x x x √ √ √

Ripple(mV) x x x x x √ √ √

70 √

CW at F.L,Pulsed

Load (Tx OFF, Rx ON FL)

Amplitude(V)* x x x √ √ √ √ √Droop(mV) x x x √ √ x x x

Rise time(ns) x x x √ √ x x xFall time(ns) x x x √ √ x x x

Ripple(mV) x x x √ √ √ √ √

70 √

CW at F.L,Pulsed

Load (Tx ON FL, Rx

OFF)

Amplitude(V)* √ √ √ √ x √ √ √Droop(mV) √ √ √ √ x x x x

Rise time(ns) √ √ √ √ x x x xFall time(ns) √ √ √ √ x x x xRipple(mV) √ √ √ √ x √ √ √

Notes: F.L. = Full Load conditionN.L. = Nominal Load conditionM.L. = Minimum load condition

(1) * indicates measurement to be carried out at 60V and 75V I/P DC voltage only.(2) Input inrush current measurement is to be carried for below two conditions & at 70VDC I/P:

(a) On application of ON command with full load on continuous outputs only.(b) On application of Pulsed load and pulsed load to be kept at full load.

(3) Input current measurement is to be carried for below three conditions & at 60V,70V and 75VDC I/P:(a) Before ON command is issued.(b) On application of ON command and without any load connected.(c) On application of ON command with full load on continuous outputs only.(d) On application of ON command with full load on continuous and pulsed outputs.

(4) Synchronisation operation, telecommand function and telemetry status is to be checked at 70V DC I/P with Pulsed load ON. Both continuous and pulsed load to be kept at full load condition.

(5) Over load protection is to be tested at 70V DC I/P only. For overload protection, EPC will switch off under overload condition causing input power to increase by 25% of full load.

(6) Load regulation to be measured at 70V DC Input only.(7) Line regulation to be measured at full load condition of both continuous and pulsed outputs.


EXHIBIT-C

Quantity, Delivery Schedule and Payment Milestones

1.0 Quantity and Delivery Schedule

Vendor has to provide quotation in slabs of 10-25, 26-40, and 41-60 in their commercial proposal. Vendor should provide the delivery schedule in bar chart showing sequence and time of all important activities and submit to SAC along with their offer. Tentative schedule for the delivery of EPCs is given below.

Model Quantity Delivery Schedule

Proto EPC 1 T0 + 9 months

DVM EPC

Slab 1: 10-25

Slab 2: 26-40

Slab 2: 41-60

Slab 1: TP1 + 3 months



Where,T0 = Placement of order by SAC.TP1 = Clearance by SAC for DVM development

2.0 Payment Milestones

Following are the tentative payment milestones. However, this will be finalized as per ISRO purchase guidelines through mutual agreement.

Development Milestone Payment (%)

M1 : Placement of order 30

M2 : Completion of Phase-1 development

3.0 Warranty

The vendor shall provide one year warranty towards supply of hardware, which is free from any defects in material, workmanship etc. and is in accordance to the applicable specifications and drawing etc


Annexure – I

Component Type Style Range of Values Rating Total Count

ResistorsRWR81

0.1E to 50E (Tolerance -

±1%)1W 5

Printed/Chip15E to 680K (Tolerance -

±1%)100mW 151

Capacitors

HVC1825 0.1uF 500V 4HVC1515 TBD 500V 3CLR81T2 82uF 75V 9CLR81T3 68uF 100V 6CDR35 0.1uF 100V 25

CWR29G 4.7uF to 6.8uF 35V 10CDR33 2.2nF 100V 1CDR32 100pF to 10nF 100V 18CDR31 100pF to 470pF 100V 9

CWR15_R 6.8uF 10V 3T541 33uF to 330uF 16V to 50V 16

Diodes

1N6642 - 75V/0.2A 121N5806 - 150V/2.5A 91N6492 - 45V/4A 11N5822 - 40V/3A 3Schottky

SHD125246P - 200V/30A 2

Transistors

2N5667A - 300V/5A 22N2222A - 50V/0.8A 62N7389 - 100V/6.5A 2

2N2907A - 60V/0.6A 22N3019 - 80V/1A 4

MOSFETIRF250 - 250V/12A 32N7261 - 100V/8A 4IRFP540 - 100V/33A 2

Zener Diodes

1N6326 - 12V/0.5W 41N6317 - 5.1V/0.5W 11N6327 - 13V/0.5W 11N6330 - 18V/0.5W 1

Tranzorb 1N5639A - 17.1V/1.5KW 31N5665A - 171V/171KW 3

Band gapReference LM236-2.5V - 2.5V/10mA 7

Opto Isolator 4N24AU - - 4

PWM IC UC2806 - 18V 2Dual OPAMP LM258 - - 4

Pulse Driver IC MIC4427 - 18V 2Pulse Driver IC HIP2100 - 125V 390° PCB mount

Connector D-sub 15 pin - - 1

90° PCB mount D-sub 25 pin - - 1


Component Type Style Range of Values Rating Total CountConnector

Inductors

B64290L44X38 (L1) N-8 turns L – 10-18mH ,

I – 1.45A (avg.) 1

55047 (L2) N – 105 turns L – 1mH , I – 0.14A (avg.) 1

55047 (L3) N – 44 turns L – 0.17mH , I – 0.417A (avg)

1

55127 (L5) N-12 turns L –12uH, I – 0.1A 1

55127 (L6) N-12 turns L – 12uH , I – 0.15A (avg)

1

55291 (L7) N – 7 turns L –1.58 H , I – 1.31(avg)

1

55381 (L8) N – 42 turns L –158 H , I –1.31 A (avg)

1

55117 (L9) N – 40 turns L – 372uH , I – 1.2A (avg)

1

55047 (L10) N – 83 turns L – 617uH , I – 0.25A (avg)

1

55047 (L11) N – 92 turns L – 0.767mH , I – 0.02A (avg)

1

Transformers

55121

Np1 – 47 turns Lp1 – uH , Ip1- 0.11A (avg)

1

Ns1 – 9 turns Lp1 – 2.83uH, Ip1 – 0.758A (avg)

Ns2 – 16 turns Lp2 – 8.96uH , Ip2

– 0.03A (avg)

Ns3 – 10 turns Lp3 – 3.5uH , Ip3 – 0.105A(avg)

Ns4 – 10 turns Lp4 – 3.5uH, Ip4 – 0.155A(avg)

Ns5 – 23 turns Lp5 – 18.5uH , Ip5 – 0.045A(avg)

Ns6 – 22 turns Lp6 – 17uH , Ip6 – 0.045A(avg)

55848

Np1 – 47 turns Lp1 – 70.68uH , Ip1- 1.12A (avg)

2Ns1 – 41 turns Lp1 – 53.8uH, Ip1 – 0.610A (avg)

Ns2 – 23 turns Lp2 – 17uH , Ip2 – 0.130A (avg)

B64290L44X38 N-30 turns L – 10-18mH , I – 2mA (avg.) 1


Annexure-II Compliance Table

Para/ Sub-para

SAC requirement description Compliance Remarks

(s) by VendorExhibit-A

-1.0 Scope of work. Vendor to confirm about the understanding of the work involved1.1 Responsibilities of Vendor and SAC -(1) Provide circuit schematic once and bill of material contract is finalized.

(2)Provide the electrical performance results of the circuit proposed for miniaturization under this RFP on printed circuit board using packaged components.

(3) Carry out the feasibility analysis to accommodate the EPC circuit within the weight and volume specified in Exhibit-B of this RFP.

(4) Generate the procurement specifications and procure components as per quality mentioned in Exhibit-B and obtain approval from SAC

(5) Review the procurement specifications generated by vendor and give clearance for the procurement of components.

(6) Design of PCB, HMCs and planar transformer/inductor layouts as per ISRO guidelines and submit for SAC approval.

(7) Review and approve the layout design of PCB, HMCs and planar transformer/inductor.

(8) Carry out the Package design for EPC and HMCs and submit for SAC approval.

(9) Review the package design for EPC and HMCs submitted by vendor and give clearance for usage.

(10) Carry out thermal analysis to ensure reliable operation of EPC over specified temperature range and obtain approval from SAC.

(11) Review the thermal analysis carried out by vendor and give clearance for fabrication.

(12) Development and fabrication of test jigs and test setups for the testing of EPCs. Test jigs and test setups are to be submitted for SAC approval.

(13) Review and approve the test jig circuits and test setups prepared by vendor for the functional testing of the EPCs.

(14) Fabrication of HMCs.(15) Fabrication of PCBs and planar transformer/inductors.(16) Wiring and assembly of Proto EPCs.

(17) Testing of Prototype EPC as per given test plan. It will be the responsibility of the vendor to demonstrate the full compliance to the specifications.

(18) Review the test results of Prototype EPC and give clearance for development of DVM EPCs.

(19)Complete the actions arising out of non-conformances at various stages to the satisfaction of SAC. It will be vendor’s responsibility to obtain the necessary approvals/clearances from SAC at every stage.

(20) Fabrication and testing of DVM EPCs as per given test plan.(21) Review the test results of DVM EPCs and give clearance for shipment.

2.0 Deliverables -

(a) Delivery of hardware as mentioned Exhibit-A, Para 3.0 (a), after review and


Para/ Sub-para


(s) by Vendoracceptance of test results by SAC

(b) Delivery of documents as mentioned Exhibit-A, Para 3.0 (b), one hard copy and soft copy of all documents shall be supplied by vendor in the mentioned format

3.0 Other terms and conditions -

(1)

Prior experience of design and development and qualification of Power Electronics Hybrids and Electronic Power Conditioners is mandatory and relevant supporting documents regarding experience has to be submitted at the time of quotation.

(2)

The present RFP is for the development and fabrication of DVM hybridized EPCs. This will be followed by fabrication and testing of flight model units. Hence vendors which are qualified for the fabrication and testing of space grade HMCs, PCBs and packages shall only be considered.

(3) Vendor should provide point-by-point compliance to all the requirements as mentioned in Annexure-II, without which their offer shall not be considered.

(4) SAC/ISRO reserves the right to review the progress of work at any time

(5) SAC reserves the right to modify any part of the design as per project requirements.

(6) In case of any modification to be incorporated during development it should be mutually discussed and agreed upon before implementation

(7)Vendor has to provide the feasibility analysis report to accommodate the EPC circuit within the weight and volume specified in Exhibit-B of this RFP at the time of quotation.

(8)

Vendor shall submit their offer in two parts, i.e. Part-1: Technical proposal including all the details given in commercial proposal without prices (Prices should be masked). and Part-2: Commercial proposal. Note: Both the proposals should be submitted in separate sealed covers.

(9) On receiving the proper quotations & details from the vendor SAC may hold detailed technical discussions with vendor if required.

(10) SAC reserves the right to parallely enter into PO contract with more than one technically qualified vendor.

(11) The vendor shall provide warranty of one year from the date of acceptance of EPC towards the supply of hardware which is free from any faults in material, workmanship etc. and is in accordance to the applicable specifications and drawings etc.

(12) Intellectual property right for EPC developed by vendor shall rest with SAC, ISRO.

(13) Vendor shall furnish undertaking that the design shall not be disclosed in part or full for any other purpose

(14) As a part of evaluation of offers SAC team may visit and assess the facilities in order to execute the work as detailed in RFP.

4.0 Additional Requirement from Vendors

(1)In Phase-2 of EPC development at a later stage, SAC may decide for qualification and Flight Model (FM) production. It is mandatory that the vendor have their HMC and PCB fabrication line certified by ISRO.

(2)Certificate for HMC and PCB fabrication line certified by ISRO shall be produced by the vendor along with the bid. If any of the processes to be used require any Incremental Process Qualification, it shall be clearly identified in the proposal.

(3) EPC circuit consists of high power DC-DC converter with currents ranging upto 12A, hence it is desirable for the vendor to have qualification for following HMC processes also for Phase-2 development:a. Aluminum wire bonding and/or Gold ribbon bonding


Para/ Sub-para


(s) by Vendorb. Double side hybrid with printed through holes for increased packaging

density.

Exhibit-B

1.0 Introduction. Vendor to confirm about their understanding about circuit functional requirement.

2.0 Electrical and Mechanical specifications -

2.0.1Electrical requirements of EPCVendor to state their compliance to meet all the electrical requirements in hybrid version

2.0.2 Mechanical requirements of EPCVendor to state their compliance to meet all the requirements

3.0 Component Quality -

Active devices: MIL Temperature Grade

Passive devices: MIL Temperature Grade

Multi-pin Connectors: MIL Temperature Grade4.0 Testing of EPC -

(1)

Vendor shall first develop Prototype EPCs to demonstrate the electrical performance compliance. The parameters to be measured during EPC testing are given in Table-2, Table-3 and Table-4 followed by measurement mentioned in note. These parameters are to be measured at -15°C, +25°C and +65°C ambient temperatures on all Proto and all DVM EPCs. Non-compliance to any specifications in Prototype EPC can be finalized through mutual discussions and agreement.

(2)Vendor shall prepare a comprehensive test plan document detailing the test methods, test equipments, electrical test setups, result sheets etc. SAC and vendor will finalize this document after discussion and mutual agreement.

(3) SAC reserves the right to review, add or update any test at any stage during the development phase in consultation with vendor

EXHIBIT C1.0 Delivery Schedule as mentioned Exhibit C Para 1.0

Vendor has to provide quotation in slabs of 25-40, 26-40, 41-60 in their commercial proposal. Vendor should provide the delivery schedule in bar chart showing sequence and time of all important activities and submit to SAC along with their offer.

2.0Payment milestones Vendor may indicate payment milestones. However, it will be finalized as per ISRO purchase guidelines.

3.0Warranty The vendor shall provide one year warranty towards supply of hardware, which is free from any defects in material, workmanship etc. and is in accordance to the applicable specifications and drawing etc.

Abbreviations used in RFP:1) EPC: Electronic power Conditioner.2) DVM: Development Verification Model.3) CTQ: Circuit Type Qualification.


4) FM: Flight Model5) HMC: Hybrid Micro Circuit.

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