S YSTEM I N P ACKAGE - Insight SIP - the System-in · PDF file · 2016-06-30Patent...

COMPANY CONFIDENTIALPAGE 1 – March 2016

SSYSTEMYSTEM IINN PPACKAGEACKAGE…. 2006 …. 2006 –– 20162016

NNEWEW TTECHNOLOGYECHNOLOGY ISIS HHEREERE

SSYSTEMYSTEM IINN PPACKAGEACKAGE…. 2006 …. 2006 –– 20162016

NNEWEW TTECHNOLOGYECHNOLOGY ISIS HHEREERE


A system in package (SiP) or system-in-a-package is a number of integrated circuits enclosed in a single module (package). The SiPperforms all or most of the functions of an electronic system, and is typically used inside a mobile phone, digital music player, etc. Diescontaining integrated circuits may be stacked vertically on a substrate. They are internally connected by fine wires that are bonded to the package. Alternatively, with a flip chip technology, solder bumps are used to join stacked chips together.

SYSTEM IN PACKAGE : DEFINITION

https://en.wikipedia.org/wiki/System_in_package

Promise of system in package– More Function in Less Space– Optimized Cost and Reduced

Design Cycles


“The complexity for minimum component costs has increased at a rate of roughly a factor of two per year”

April 19, 1965Gordon Moore – INTEL co-founder

MOORE’S LAW


MOORE’S LAW

1st Moore Empirical Law

“integrated circuits would double in performance every 18 months”


“the cost for producers to fulfill Moore's law follows an opposite trend: R&D, manufacturing, and test costs have increased steadily with each new generation of chips.”

MOORE’S LAW

2nd Moore Empirical Law


WHY SYSTEM IN PACKAGE


WHY SYSTEM IN PACKAGE

SEMATECH 2009 - Darvin Edwards, Masood Murtuza, Texas Instruments, Dallas, TX USA


Multichip Modules (MCM) & Hybrid Integrated Circuits (HIC)

• 60’s & 70’s - Original Developments– IBM System/360 - IBM Bubble memory - IBM 3081 thermal modules

• 80’s & 90’s – Deployment to HiRel industry– Aerospace– Military aircraft electronic– Radars– Super-computers

SYSTEM IN PACKAGE : BEFORE 2000


Multichip Modules (MCM) and Hybrid Integrated Circuits (HIC)Examples of Products developed by Chris Barratt’s Team during 90’s


YiG filter with integrated balanced mixer

Patent EP0157682 YIG Filter Mixer Barratt, Marcoux 1985Frequency range 2 to 26 GHz3 ball YIG preselection filter (< 2dB loss over band)Doubly Balanced wideband diode mixerApplication Military Aeronautics

Variable attenuator

Balanced structure Center frequency 12 GHzOctave BandwidthAttenuation 0 to 40 dBApplication Radars

Dielectric Resonator Oscillator

Output power 5 dBmFrequency ca 30 GHzVaricap tuned to allow phase lockFrequency stability +/- 200ppm over temp -20 + 80 CApplication Military Helicopters


• End 90’s – System in Package came to Consumer Mass Market– Pentium Pro Intel (November 1995) : processor and “cache” on 2 separate dies– Memory Sticks by Sony (1998) : 2x128 MB memories squeezed into 1 component



• Early 00’s SIP growth is driven by Cell Phone industry for Handsets & Infrastructure

• 2003 World Wide Package Volume (Source : INEMI 2004 annual report)

– Total 120 Billion Units electronic packages

– Including 3 Billion Units SIP– 1.75 Billions RF Cellular SiP– 0.25 Billions WLAN & Bluetooth SiP

SYSTEM IN PACKAGE : EARLY 00’S


• Early Stage SIP Design from Insight SiP Original Team

– National Semiconductor GSM Base Station VCO/PLL for Ericsson

– National Semiconductor Bluetooth Modules LMX98xx family http://www.ti.com/product/LMX98xx



INEMI Recommendations (Source : INEMI 2004 annual report)

A number of recommendations have been made for SiP technology in the roadmap including:

• ……• Improved design tools for emerging technologies like embedded

passives and optoelectronic • Tools and methodologies to address chip and package co-design

– Mixed signal co-design and simulation (SI, Power, EMI)– For transient and localized hot spots – simulation of thermal mechanical stress and

thermal performances

• …….



INSIGHT SIP METHODOLOGIES

Unique Flexible Design Methodologies• From system definition down to fully tested layout• Standardization of the SiP design• Automated design • Portability• Greater Integration• Ability to embed functions within the package

irrespective of the manufacturing technology• Aggressive design schedules



Circuit DesignL, C, Balun…

Buried Function Design

Layout Design

S ParametersActive Circuits

Circuit Simulation,ADS, Designer, …

EM/Circuit Simulation,ADS, Designer, HFSS…

Layout/EMADS, Cadence, Designer,…

Parametrical/MechanicalObjects

S ParametersFor Each Object

Substrate ManufacturingMulti-layers / Thin Film

Test of Buried FunctionsSiP Final Test



350 400 450 500 550300 600

-40

-30

-20

-10

-50

0

freq, MHz

dB(S

(13,

13))

dB(S

(15,

15))

dB(S

(17,

17))

350 400 450 500 550300 600

30

35

40

45

25

50

freq, MHz

dB(S

(14,

13))

m13

dB(S

(16,

15))

m14

dB(S

(18,

17))

m15

m13freq=dB(S(14,13))=43.305

434.0MHzm 14freq=dB(S(16,15))=37.734

434.0MHzm15freq=dB(S(18,17))=30.848

434.0MHz

350 400 450 500 550300 600

-30

-20

-10

-40

0

freq, MHz

dB(S

(14,

14))

dB(S

(16,

16))

dB(S

(18,

18))

-70 dBm

-50 dBm

-40 dBm

freq (309.0MHz to 559.0MHz)

S(15

,15)

S(16

,16)

mS11LSSP_Freq=dB(S(1,1))=-8.167

4. 350E8mS22LSSP_Freq=dB(S(2,2))=-8.622

4.350E8

300.M 400.M 500.M 600.M 700. M200.M 800.M

-35

-30

-25

-20

-15

-10

-5

-40

0

LSSP_Freq

dB(S

(1,1

))

mS11

dB(S

(2,2

))

mS22

LimFreq

Lim

S11

Adaptation


4. 350E8mS22LSSP_Freq=dB(S(2,2))=-8.622

4.350E8

Acces antenne

Sortie ampli

m2LSSP_Freq=dB(S(2,1))=44. 681

4.350E8

300.M 400.M 500.M 600.M 700.M200.M 800. M

30

35

40

45

25

50

LSSP_F req

dB(S

(2,1

))

m2

Gain Antenne -> RX


4.350E8

m3LSSP_Freq=S(1,1)=0.403 / 93.673impedance = Z0 * (0.690 + j0.662)

4.300E8

m6LSSP_Freq=S(2,2)=0.416 / -63.282impedance = Z0 * (1.035 - j0.931)

4.100E8

LSSP_Freq (200000000.000 to 800000000.000)

S(1,

1)

m3

S(2,

2)

m6


4.300E8


4.100E8


4. 300E8mS22LSSP_Freq=dB(S(2,2))=-15.057

4.300E8

350. M 400.M 450.M 500.M300.M 550.M

-35

-30

-25

-20

-15

-10

-5

-40

0

LSSP_Freq

dB(S

(1,1

))

mS11

dB(S

(2,2

))

mS22

LimFreq

Lim

S11

Adaptation


4. 300E8mS22LSSP_Freq=dB(S(2,2))=-15.057

4.300E8

Acces antenne

Sortie ampli


4.300E8

350.M 400.M 450.M 500.M300.M 550. M

30

35

40

45

25

50

LSSP_Freq

dB(S

(2,1

))

m2Gain Antenne -> RX


4.300E8


4.300E8


4.100E8

LSSP_Freq (300000000.000 to 550000000.000)

S(1,

1)

m3

S(2,

2)

m6


4.300E8


4.100E8

Schematic OnlyTest Results

EM PCB layout + schematic+Models

Schematic only Simulation Results

EM PCB layout + schematic + models Results

Adjust model complexity for fit


INSIGHT SIP DESIGNS EXAMPLES

LTCC WiFi Integrated Filter/Baluns

7 x 7 x 1.5 mm

5 x 5 x 0.8 mm

2 die SiP, Secure NFC Contact-less

GPS Module, Baseband, Radio, SMD

6 x 4 x 1 mm

4 die SiP, BT ASIC Memories

12 x 12 x 1 mm


• June 29, 2007 – Launch of Iphone Gen 1– iPhone development began in 2004 with a team of 1000 employees

inside Apple Labs “Purple Project” – Successful market starts with iPhone 3G launched on July 11, 2008

• First Insight SiP design embedded in Apple Products– Iphone 3GS launched on June 19, 2009– Smart antenna tuning module.– Design done with Peregrine Semiconductor (now Murata Subsidiary)

• Today Insight SiP Designs are embedded in leading smart phones.

SMART PHONE REVOLUTION


M2M device Miniaturization

• First step during Years 00’s : - Modules on small PCB – no embedded antenna

• Second step :– Antenna integration within the module

• Third step :– Antenna in package within OBD Connector

3G/4G + GPS + Glonass

MACHINE TO MACHINE


• 2010 - Bluetooth Smart is Launched– January 2010 : Bluetooth V4.0 standard approval by Bluetooth SIG

• Insight SiP BLE Modules– 2010 : First generation – ISP091201– 2013 : Second generation – ISP130301– 2016 : Third Generation – ISP1302 and ISP1507

• 2013 – iBeacon– June 2013 : Apple introduces iBeacon protocol– 2014 : Insight SiP Beacon First Generation

CONNECTED DEVICES


CONNECTED DEVICES

Chipwork Report – 05/15/2015

• April 24th, 2015 – Apple Watch is available in Stores


INSIGHT SIP PRODUCTION BY MARKET

Manufacturing with multiple established partners Amkor ASE AT&S Barry Ind Kyocera Tong Hsing

Break by Application Volumes

2014 2015 2016

2017Low Energy Connectivity

Connectivity4G/5G Front End & Radio

Secure Connectivity(Internal and licensed production)

BLE Modules ShipmentQuality standards in production ISO9000 standards and several

other equivalent certifications OHSAS18001 – Health and Safety

management ISO13485 – Medical requirements AS9100 – Aerospace requirements QS9000 – Automotive requirements


• Highly integrated microcomputers– Linux Microcomputer in SiP

• Indoor positioning– Pulse UWB – ISP1510

• Super High Speed Data transfer– Transfer Jet– 60GHz

INSIGHT SIP PREPARES THE FUTURE

SubstrateFlip chip Si

Mother Board

Digital BB, control, power and ground

March 2016

THANK YOU !

S YSTEM I N P ACKAGE - Insight SIP - the System-in · PDF file · 2016-06-30Patent...

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