RRL025P03 : Transistors -...

Datasheet

www.rohm.com© 2013 ROHM Co., Ltd. All rights reserved.

RRL025P03 Pch -30V -2.5A Power MOSFET

Junction temperature Tj 150 °C

Range of storage temperature Tstg -55 to +150 °C

Power dissipation

Gate - Source voltage VGSS 20 V

PD *3 1.0 W

PD *4 0.32 W

Continuous drain current ID *1

2.5 A

Pulsed drain current ID,pulse *2

10 A

Drain - Source voltage VDSS -30 V

Taping code TR

Marking UA

lAbsolute maximum ratings(Ta = 25°C)

Parameter Symbol Value Unit

lPackaging specifications

Type

Packaging Taping

lApplication Reel size (mm) 180

DC/DC converters Tape width (mm) 8

Basic ordering unit (pcs) 3,000

lFeatures lInner circuit

1) Low on - resistance.

2) Built-in G-S Protection Diode.

3) Small Surface Mount Package (TUMT6).

4) Pb-free lead plating ; RoHS compliant

lOutline

VDSS -30VTUMT6

RDS(on) (Max.) 75mW

ID -2.5APD 1.0W

(1) (2)

(3)

(4) (5)

(6)

*1 ESD PROTECTION DIODE *2 BODY DIODE

(1) Drain (2) Drain (3) Gate (4) Source (5) Drain (6) Drain

1/11 2013.02 - Rev.B

112518

テキストボックス

SOT-363T


Data SheetRRL025P03

*1 Limited only by maximum temperature allowed.

*2 Pw 10ms, Duty cycle 1%

*3 Mounted on a seramic board (30×30×0.8mm)

*4 Mounted on a FR4 (15×20×0.8mm)

*5 Pulsed

W

Transconductance gfs *5 VDS= -10V, ID= -2.5A 2.0 4.4 - S

Gate input resistannce RG f = 1MHz, open drain - 24 -

mWVGS= -4.5V, ID= -1.2A - 85 115

VGS= -4.0V, ID= -1.2A - 95 125

VGS= -10V, ID= -2.5A, Tj=125°C

Static drain - sourceon - state resistance RDS(on)

*5

VGS= -10V, ID= -2.5A - 55 75

- 95 135

V

Gate threshold voltagetemperature coefficient

ΔV(GS)th

ΔTj

ID= -1mAreferenced to 25°C

- 3.9 - mV/°C

Gate threshold voltage VGS (th) VDS = -10V, ID = -1mA -1 - -2.5

mA

Gate - Source leakage current IGSS VGS = 20V, VDS = 0V - - 10 mA

Zero gate voltage drain current IDSS VDS = -30V, VGS = 0V - - -1

V

Breakdown voltagetemperature coefficient

ΔV(BR)DSS

ΔTj

ID= -1mAreferenced to 25°C

- -25 - mV/°C

Drain - Source breakdownvoltage

V(BR)DSS VGS = 0V, ID = -1mA -30 - -

lElectrical characteristics(Ta = 25°C)

Parameter Symbol ConditionsValues

UnitMin. Typ. Max.

lThermal resistance

Parameter SymbolValues

UnitMin. Typ. Max.

RthJA *4 - - 391 °C/W

RthJA *3 - - 125 °C/W

Thermal resistance, junction - ambient

2/11 2013.02 - Rev.B


Data SheetRRL025P03

- -1.2 V

AInverse diode continuous,forward current IS *1 Ta = 25°C - - -0.8

Forward voltage VSD *5 VGS = 0V, Is = -2.5A -

Min. Typ. Max.

- 1.6 -

Gate - Drain charge Qgd *5 - 1.6 -

lBody diode electrical characteristics (Source-Drain)(Ta = 25°C)


Unit

nC

Gate - Source charge Qgs *5

VDD ⋍ -15V, ID= -2.5AVGS = -5V

Total gate charge Qg *5

VDD ⋍ -15V, ID= -2.5AVGS = -5V

VDD ⋍ -15V, ID= -2.5AVGS = -10V

- 5.2 -

- 12 -

-

lGate Charge characteristics(Ta = 25°C)


UnitMin. Typ. Max.

Turn - on delay time td(on) *5 VDD ⋍ -15V, VGS = -10V - 7 -

nsRise time tr

*5 ID = -1.2A - 16 -

Turn - off delay time td(off) *5 RL = 12.5W - 50 -

Fall time tf *5 RG = 10W - 33

pFOutput capacitance Coss VDS = -10V - 70 -

Reverse transfer capacitance Crss f = 1MHz

Input capacitance Ciss VGS = 0V - 480 -

- 70 -

lElectrical characteristics(Ta = 25°C)


UnitMin. Typ. Max.

3/11 2013.02 - Rev.B


Data SheetRRL025P03

lElectrical characteristic curves

1

10

100

1000

0.0001 0.01 1 100

Ta=25ºC Single Pulse

0.01

0.1

1

10

100

0.1 1 10 100

Operation in this area is limited by RDS(on)

( VGS = 10V ) PW = 100ms

PW = 1ms

PW = 10ms

DC Operation

Ta=25ºC Single Pulse Mounted on a ceramic board. (30mm × 30mm × 0.8mm)

0

20

40

60

80

100

120

0 50 100 150 200

0.001

0.01

0.1

1

10

0.0001 0.01 1 100

Rth(ch-a)=125ºC/W Rth(ch-a)(t)=r(t)×Rth(ch-a) Mounted on ceramic board (30mm × 30mm × 0.8mm)

top D=1 D=0.5 D=0.1 D=0.05 D=0.01 bottom Signle

Ta=25ºC Single Pulse

Fig.1 Power Dissipation Derating Curve Fig.2 Maximum Safe Operating Area

Pow

er D

issi

patio

n :

P D/P

D m

ax. [

%]

Dra

in C

urre

nt :

-I D [A

]

Fig.3 Normalized Transient Thermal Resistance vs. Pulse Width

Fig.4 Single Pulse Maxmum Power dissipation

Nor

mal

ized

Tra

nsie

nt T

herm

al R

esis

tanc

e : r

(t)

Pulse Width : PW [s] Pulse Width : PW [s]

Peak

Tra

nsie

nt P

ower

: P

(W)

Junction Temperature : Tj [°C] Drain - Source Voltage : -VDS [V]

4/11 2013.02 - Rev.B


Data SheetRRL025P03


0

0.5

1

1.5

2

2.5

3

0 0.2 0.4 0.6 0.8 1

VGS= -3.2V

VGS= -2.8V

VGS= -10V VGS= -4.5V

VGS= -3.0V

VGS= -3.8V

VGS= -2.5V

Ta=25ºC Pulsed

0

0.5

1

1.5

2

2.5

3

0 2 4 6 8 10

VGS= -3.2V

VGS= -10V VGS= -4.5V VGS= -3.6V

VGS= -3.0V

VGS= -2.8V

Ta=25ºC Pulsed

0.001

0.01

0.1

1

10

0 1 2 3 4

Ta= 125ºC Ta= 75ºC Ta= 25ºC Ta= -25ºC

VDS= -10V Pulsed

0

20

40

60

-50 0 50 100 150

VGS = 0V ID = -1mA pulsed

Fig.5 Typical Output Characteristics(I)

Dra

in C

urre

nt :

-I D [A

]

Drain - Source Voltage : -VDS [V]

Fig.6 Typical Output Characteristics(II)

Dra

in C

urre

nt :

-I D [A

]


Fig.7 Breakdown Voltage vs. Junction Temperature

Dra

in -

Sour

ce B

reak

dow

n Vo

ltage

: -V

(BR

)DSS

[V]

Junction Temperature : Tj [°C]

Fig.8 Typical Transfer Characteristics

Gate - Source Voltage : -VGS [V]

Dra

in C

urre

nt :

-I D [A

]

5/11 2013.02 - Rev.B


Data SheetRRL025P03


0.1

1

10

0.1 1 10

VDS= -10V Pulsed

Ta= -25ºC Ta=25ºC Ta=75ºC Ta=125ºC

0

100

200

300

0 2 4 6 8 10

ID= -3.0A

Ta=25ºC Pulsed

ID= -1.5A

0

1

2

3

-50 0 50 100 150

VDS = 10V ID = -1mA pulsed

0

0.2

0.4

0.6

0.8

1

1.2

-25 0 25 50 75 100 125 150

Fig.9 Gate Threshold Voltage vs. Junction Temperature

Gat

e Th

resh

old

Volta

ge :

-VG

S(th

) [V]

Junction Temperature : Tj [°C]

Fig.10 Transconductance vs. Drain Current

Tran

scon

duct

ance

: g f

s [S]

Drain Current : -ID [A]

Fig.11 Drain CurrentDerating Curve

Dra

in C

urre

nt D

issi

patio

n

: ID/I D

max

. (%

)

Junction Temperature : Tj [ºC]

Fig.12 Static Drain - Source On - State Resistance vs. Gate Source Voltage

Stat

ic D

rain

- So

urce

On-

Stat

e R

esis

tanc

e

: RD

S(on

) [m

W]

Gate - Source Voltage : -VGS [V]

6/11 2013.02 - Rev.B


Data SheetRRL025P03


10

100

1000

0.1 1 10

Ta=125ºC Ta=75ºC Ta=25ºC Ta= -25ºC

VGS= -4.5V Pulsed

10

100

1000

0.1 1 10


VGS= -10V Pulsed

10

100

1000

0.1 1 10

Ta=25ºC Pulsed

VGS= -4.0V VGS= -4.5V VGS= -10V

0

20

40

60

80

100

120

-50 -25 0 25 50 75 100 125 150

VGS = -10V ID = -2.5A pulsed

Fig.13 Static Drain - Source On - State Resistance vs. Drain Current(I)

Stat

ic D

rain

- So

urce

On-

Stat

e R

esis

tanc

e

: RD

S(on

) [m

W]

Junction Temperature : Tj [ºC]

Fig.14 Static Drain - Source On - State Resistance vs. Junction Temperature

Stat

ic D

rain

- So

urce

On-

Stat

e R

esis

tanc

e

: RD

S(on

) [m

W]


Fig.16 Static Drain-Source On-State Resistance vs. Drain Current(III)

Stat

ic D

rain

- So

urce

On-

Stat

e R

esis

tanc

e

: RD

S(on

) [m

W]


Fig.15 Static Drain - Source On - State Resistance vs. Drain Current(II)

Stat

ic D

rain

- So

urce

On-

Stat

e R

esis

tanc

e

: RD

S(on

) [m

W]


7/11 2013.02 - Rev.B


Data SheetRRL025P03


Switc

hing

Tim

e : t

[ns]

1

10

100

1000

0.01 0.1 1 10

tr

tf

td(on)

Ta=25ºC VDD= -15V VGS= -10V RG=10W Pulsed

td(off)

Fig.19 Switching Characteristics

10

100

1000

0.1 1 10


VGS= -4.0V Pulsed

10

100

1000

0.01 0.1 1 10 100

Coss

Crss

Ciss

Ta=25ºC f=1MHz VGS=0V

0

2

4

6

8

10

0 2 4 6 8 10

Ta=25ºC VDD= -15V ID= -2.5A RG=10W Pulsed

Fig.17 Static Drain - Source On - State Resistance vs. Drain Current(IV)

Stat

ic D

rain

- So

urce

On-

Stat

e R

esis

tanc

e

: RD

S(on

) [m

W]


Fig.18 Typical Capacitance vs. Drain - Source Voltage

Cap

acita

nce

: C [p

F]



Fig.20 Dynamic Input Characteristics

Gat

e - S

ourc

e Vo

ltage

: -V

GS

[V]

Total Gate Charge : Qg [nC]

8/11 2013.02 - Rev.B


Data SheetRRL025P03


0.01

0.1

1

10

0 0.2 0.4 0.6 0.8 1 1.2

VGS=0V Pulsed

Ta=125ºC Ta=75ºC Ta=25ºC

Ta= -25ºC

Fig.21 Source Current vs. Source Drain Voltage

Sour

ce C

urre

nt :

-I S [A

]

Source-Drain Voltage : -VSD [V]

9/11 2013.02 - Rev.B


Data SheetRRL025P03

lMeasurement circuits

Fig.1-1 Switching Time Measurement Circuit Fig.1-2　Switching Waveforms

Fig.2-1 Gate Charge Measurement Circuit Fig.2-2 Gate Charge Waveform

10/11 2013.02 - Rev.B


Data SheetRRL025P03

lDimensions (Unit : mm)

Dimension in mm/inches

TUMT6

Patterm of terminal position areas

E H

D

e

bx S A

L

c

Lp

y S

A1

A2 A

S

e1

b2

l1

e

A

E

MIN MAX MIN MAXA - 0.85 - 0.033A1 0.00 0.10 0 0.004A2 0.72 0.82 0.028 0.032b 0.25 0.40 0.01 0.016c 0.12 0.22 0.005 0.009D 1.90 2.10 0.075 0.083E 1.60 1.80 0.063 0.071eHE 2.00 2.20 0.079 0.087LLp - 0.40 - 0.016x - 0.10 - 0.004y - 0.10 - 0.004

MIN MAX MIN MAXe1b2 - 0.50 - 0.02l1 - 0.50 - 0.02

INCHES

0.65 0.03

DIMMILIMETERS

0.20 0.01

DIMMILIMETERS INCHES

1.70 0.067

11/11 2013.02 - Rev.B

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