ROC364 Instruction Manual.pdf

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Flow Computer Division

Website: www.EmersonProcess.com/flow

Form A4193Part Number D301060X012June 2005

ROC364 REMOTE OPERATIONS CONTROLLERInstruction Manual


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ROC364 Instruction Manual

ii Rev Jun/05

Revision Tracking Sheet

June 2005

This manual is revised periodically to incorporate new or updated information. The date revision level

of each page is indicated at the bottom of the page opposite the page number. A major change in thecontent of the manual also changes the date of the manual, which appears on the front cover. Listed below is the date revision level of each page.

Page Revision

All Pages Jun/05

All Pages May/02

FloBoss and ROCLINK are marks of one of the Emerson Process Management companies. The Emerson logo is a trademarkand service mark of Emerson Electric Co. All other marks are the property of their respective owners.

Fisher Controls International, Inc. 1992-2005. All rights reserved.

Printed in the U.S.A.

While this information is presented in good faith and believed to be accurate, Fisher Controls does not guarantee satisfactoryresults from reliance upon such information. Nothing contained herein is to be construed as a warranty or guarantee,express or implied, regarding the performance, merchantability, fitness or any other matter with respect to the products , noras a recommendation to use any product or process in conflict with any patent. Fisher Controls reserves the right, withoutnotice, to alter or improve the designs or specifications of the products described herein.


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iii Table of Contents Rev Jun/05

TABLE OF CONTENTS

Table of Contents ............................................................................................................. iii

Section 1 General Information................................................................................... 1-1 1.1 Scope of Manual ............................................................................................................................. 1-1

1.2 Manual Contents ............................................................................................................................. 1-1

1.3 Product Overview ........................................................................................................................... 1-2

1.4 Installation Guidelines .................................................................................................................... 1-3

1.5 Power Supply Requirements........................................................................................................... 1-6

1.6 Startup and Operation ................................................................................................................... 1-10

Section 2 Master Controller Unit, I/O Module Rack, and Wiring......................... 2-1 2.1 Scope............................................................................................................................................... 2-1

2.2 Product Description ........................................................................................................................ 2-1

2.3 Installation....................................................................................................................................... 2-7

2.4 Connecting the MCU to Wiring...................................................................................................... 2-9

2.5 Troubleshooting and Repair.......................................................................................................... 2-12

2.6 ROC364 Specifications................................................................................................................. 2-20

Section 3 Input and Output Modules ........................................................................ 3-1

3.1 Scope............................................................................................................................................... 3-13.2 Product Descriptions....................................................................................................................... 3-1

3.3 Initial Installation and Setup ........................................................................................................... 3-5

3.4 Connecting the I/O Modules to Wiring .......................................................................................... 3-5


3.6 Removal, Addition, and Replacement Procedures ....................................................................... 3-28

3.7 I/O Module Specifications ............................................................................................................ 3-30

Section 4 Communications Cards.............................................................................. 4-1

4.1 Scope............................................................................................................................................... 4-14.2 Product Descriptions....................................................................................................................... 4-1

4.3 Installing Communications Cards................................................................................................... 4-8

4.4 Connecting Communications Cards to Wiring............................................................................. 4-12


4.6 Communication Card Specifications ............................................................................................ 4-21


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iv Table of Contents Rev Jun/05

Section 5 I/O Converter Card .................................................................................... 5-1 5.1 Scope............................................................................................................................................... 5-1

5.2 Product Description ........................................................................................................................ 5-1

5.3 Initial Installation and Setup ........................................................................................................... 5-2

5.4 Troubleshooting and Repair............................................................................................................ 5-3

5.5 I/O Converter Card Specification ................................................................................................... 5-4

Appendix A Lightning Protection Module ............................................................... A-1 A.1 Product Description ....................................................................................................................... A-1

A.2 Connecting the LPM to Wiring...................................................................................................... A-2

A.3 Troubleshooting and Repair........................................................................................................... A-2

A.4 Lightning Protection Module Specifications ................................................................................. A-3

Appendix B Local Display Panel ............................................................................... B-1 B.1 Product Description ........................................................................................................................B-1

B.2 Installation.......................................................................................................................................B-2

B.3 Operation.........................................................................................................................................B-4

B.4 Troubleshooting and Repair..........................................................................................................B-22

B.5 Local Display Panel Specifications ..............................................................................................B-23

Appendix C I/O Simulation........................................................................................ C-1 C.1 Analog Outputs to Analog Inputs ...................................................................................................C-1

C.2 Analog Outputs to Ammeter or Voltmeter .....................................................................................C-2

C.3 Discrete Outputs to Discrete Inputs ................................................................................................C-3

C.4 Discrete Outputs to Pulse Inputs.....................................................................................................C-3

C.5 Potentiometer to Analog Inputs ......................................................................................................C-4

C.6 Switch to Discrete Inputs ................................................................................................................C-5

C.7 Switch to Pulse Inputs.....................................................................................................................C-5

Glossary.......................................................................................................................... G-1

Index ................................................................................................................................. I-1


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1-1 General Information Rev Jun/05

SECTION 1 GENERAL INFORMATION

1.1 Scope of Manual

This manual focuses on the hardware aspects of the ROC364 Remote Operations Controller (ROC)manufactured by Flow Computer Division of Emerson Process Management. For software aspects, suchas configuration, refer to the respective ROCLINK configuration user manual.

NOTE: Certain hardware versions and functionality may require higher revisions of ROCLINKconfiguration software. Verify the version of ROCLINK configuration software.

This section contains the following information:

Section Page1.1 Scope of Manual 1-1 1.2 Manual Contents 1-1 1.3 Product Overview 1-2 1.4 Installation Guidelines 1-3 1.5 Power Supply Requirements 1-6 1.6 Startup and Operation 1-9

1.2 Manual Contents

This manual contains the following sections:

Section 2 details the Master Controller Unit (MCU), I/O Module Rack, wiring, troubleshooting, and

specifications.Section 3 provides information and specifications for the I/O modules.

Section 4 provides details and specifications for the communications cards.

Appendix A describes the optional Lightning Protection Module (LPM) and specifications.

Appendix B describes specifications and how to use the optional Local Display Panel (LDP) to accessoperational data and change configuration.

Appendix C shows various ways to set up I/O simulation for troubleshooting components andconfigurations.

For more information on software or accessories, please refer to the following manuals. ROCLINK for Windows Configuration Software User Manual (Form A6091). ROCLINK 800 Configuration Software User Manual (Form A6121). ROC/ROC Accessories Instruction Manual (Form A4637).


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1.1.1 FCC InformationThis equipment complies with Part 68 of the Federal Communications Commission (FCC) rules. On themodem assembly is a label that contains, among other information, the FCC certification number andRinger Equivalence Number (REN) for this equipment. If requested, this information must be providedto the telephone company.

A FCC compliant telephone modular plug is provided with this equipment. This equipment is designedto be connected to the telephone network or premises wiring, using a compatible modular jack that isPart 68 compliant. See Installation Instructions for details.

The REN is used to determine the quantity of devices that may be connected to the telephone line.Excessive RENs on the telephone line may result in the devices not ringing in response to an incomingcall. Typically, the sum of the RENs should not exceed five (5.0). To be certain of the number ofdevices that may be connected to a line (as determined by the total RENs), contact the local telephonecompany.

If this equipment, dial-up modem, causes harm to the telephone network, the telephone company willnotify you in advance that temporary discontinuance of service may be required. But if advance notice isnot practical, the telephone company will notify the customer as soon as possible. Also, you will beadvised of your right to file a complaint with the FCC if you believe it necessary.

The telephone company may make changes to its facilities, equipment, operations, or procedures thatcould affect the operation of the equipment. If this happens the telephone company will provide advancenotice so you can make the necessary modifications to maintain uninterrupted service.

If trouble is experienced with this equipment, dial-up modem, for repair or warranty information, pleasecontact Emerson Process Management, Flow Computer Division (641) 754-2578. If the equipment iscausing harm to the telephone network, the telephone company may request that you disconnect theequipment until the problem is resolved.

1.3 Product OverviewThe ROC364 is a microprocessor-based controller that provides the functions required for a variety offield automation applications. The ROC364 is used primarily where there is a need for remotemonitoring, measurement, data archival, and control. You can configure the ROC364 for specificapplications including those requiring calculations, PID (Proportional, Integral, and Derivative) LoopControl, and Function Sequence Tables (FSTs) logic/sequencing control.

The ROC364 features modularized field inputs and outputs (I/O), which provide the flexibility to meetthe requirements of a specific application. Up to 64 I/O modules can be used in any combination ofDiscrete Inputs, Discrete Outputs, Analog Inputs, Analog Outputs, and Pulse Inputs.

The modular design of the ROC364 makes it cost-effective for both small and large applications. Youcan select from a variety of communications and operator interface options to customize the installationfor a given system. The ROC is approved for use in Class I Division 2 hazardous area locations.

The FlashPAC includes additional features contained in the firmware, such as 1992 American GasAssociation (AGA) flow calculations, Spontaneous-Report-by-Exception (SRBX or RBX) alarmmessaging, Local Display Panel configuring, and radio power control.

Figure 1-1 shows the major components that make up the ROC Master Controller Unit (MCU). Figure2-6 shows the outline and mounting dimensions for the ROC364 controller. Refer to Section 2, MasterController Unit, I/O Module Rack, and Wiring, for further hardware and firmware details.


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1.4 Installation Guidelines

The design of the ROC makes it highly adaptable to a wide variety of installations; therefore, not all possibilities can be covered in this manual. If additional information is required concerning a specificinstallation, contact your local sales representative.

Planning is essential to a good installation. Because installation requirements depend on many factorssuch as the application, location, ground conditions, climate, and accessibility, only generalizedguidelines can be provided in this document.

ROC364

SYSTEMSTATUS

GND

AUX PWR

OUT 1

DC PWRIN

+

--+

AUX PWR

OUT 2

AUX OUT 2 AUX OUT 1

--

++

POWER

OPERATORINTERFACE

COM2 COM1 DISPLAY

ROCREMOTE OPERATIONSCONTROLLER

RAMMEMORY EXPANSION321

F3

F2

F1

AUX OUT 25A, 32 VDC

5A, 32 VDC AUX OUT 1

POWER2A S.B., 32 VDC

F L A S H P A C

1 2 3 4 8765 9 14 15 1613121110

A B C CB A CB A CB A CB A CB A CB A CB A A B C A B C A B C A B C CB A CB A CB A CB A

GNDGND

Figure 1-1. ROC364 Controller Components Mounted on Backplate

MCU

I/O Modules

I/O Module Wiring /Termination

I/O Rack

Backplate


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1.4.1 Environmental RequirementsThe ROC364 requires protection from direct exposure to rain, snow, ice, blowing dust or debris,and corrosive atmospheres. If the ROC is installed outside of a building, it must be placed in a

NEMA 3 or higher rated enclosure to ensure the necessary level of protection.

NOTE: In salt spray environments, it is especially important to ensure that the enclosure is sealed properly, including all entry and exit points. If salt is allowed to enter, it can shorten the life ofthe lithium battery in the ROC and cause the battery to leak corrosive chemicals.

The ROC units are designed to operate over a wide range of temperatures. However, in extreme climatesit may be necessary to provide temperature-controlling devices to maintain stable operating conditions.In extremely hot climates, a filtered ventilation system or air conditioning may be required. In extremelycold climates, it may be necessary to provide a thermostatically controlled heater in the same enclosureas the ROC364. To maintain a non-condensing atmosphere inside the ROC enclosure in areas of highhumidity, it may be necessary to add heat or dehumidification.

1.4.2 Site RequirementsCareful consideration when locating the ROC on the site can help reduce future operational problems.The following items should be considered when choosing a location:

Local, state, and federal codes often place restrictions on ROC locations and dictate siterequirements. Examples of these restrictions are fall distance from a meter run, distance from

pipe flanges, and hazardous area classifications. Ensure that all code requirements are met. Locate the ROC to minimize the length of signal and power wiring. By code, line power wiring

must not cross meter runs. Solar panels must face due South (not magnetic South) in the northern hemisphere and due North

(not magnetic North) in the southern hemisphere. Make sure nothing blocks the sunlight duringany part of the day.

ROC units equipped for radio communications should be located so the antenna has anunobstructed signal path. Antennas should not be aimed into storage tanks, buildings, or othertall structures. If possible, ROC units should be located at the highest point on the site. Overheadclearance should be sufficient to allow the antenna to be raised to a height of at least twenty feet.

To minimize interference with radio communications, locate the ROC away from electrical noisesources, such as engines, large electric motors, and utility line transformers.

Locate ROC units away from heavy traffic areas to reduce the risk of being damaged byvehicles. However, provide adequate vehicle access to aid monitoring and maintenance.

1.4.3 Compliance with Hazardous Area StandardsThe ROC364 hazardous location approval is for Class I, Division 2, Groups A, B, C, and D. The class,division, and group terms are defined as follows:

1. Class defines the general nature of the hazardous material in the surrounding atmosphere. Class Iis for locations where flammable gases or vapors may be present in the air in quantities sufficientto produce explosive or ignitable mixtures.

2. Division defines the probability of hazardous material being present in an ignitable concentrationin the surrounding atmosphere. Division 2 locations are locations that are presumed to behazardous only in an abnormal situation.


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3. Group defines the hazardous material in the surrounding atmosphere and include: Group A Atmosphere containing acetylene. Group B Atmosphere containing hydrogen, gases, or vapors of equivalent nature. Group C Atmosphere containing ethylene, gases, or vapors of equivalent nature.

Group D Atmosphere containing propane, gases, or vapors of equivalent nature.For the ROC to be approved for hazardous locations, it must be installed in accordance with the NationalElectrical Code (NEC) guidelines or other applicable codes.

When working on units located in a hazardous area (where explosive gases may be present), makesure the area is in a non-hazardous state before performing procedures. Performing procedures ina hazardous area could result in personal injury or property damage.

1.4.4 Power Installation Requirements

Typical sources of primary power for ROC installations are line power and solar power. Be sure to routeline power away from hazardous areas, as well as sensitive monitoring and radio equipment. Local andcompany codes generally provide guidelines for line power installations. Adhere rigorously to all localand National Electrical Code (NEC) requirements for line power installations.

Solar power allows installation of the ROC in locations where line power is not available. The solar panels and batteries must be properly sized for the application and geographic location to ensurecontinuous reliable operation. Information contained in the ROC/ROC Accessories Instruction Manual(Form 4637) can assist in determining the solar panel and battery requirements.

A site may have additional power requirements for radios, repeaters, and other monitoring devices.Power supply and converter accessories can minimize the number of separate power sources required for

an installation.The ROC364 can operate from either a 12-volt or a 24-volt nominal power source. If 24-volt transmitter

power is required when operating on 12-volt power, the ROC364 requires an I/O Converter Card to beinstalled. Refer to Section 5. The ROC364 has a low-voltage cut-off circuit built in to guard againstdraining down power supply batteries.

1.4.5 Grounding Installation RequirementsGround wiring requirements for line-powered equipment are governed by the National Electrical Code(NEC). When the equipment uses line power, the grounding system must terminate at the servicedisconnect. All equipment grounding conductors must provide an uninterrupted electrical path to the

service disconnect. This includes wire or conduit carrying the power supply conductors.The National Electrical Code Article 250-83 (1993), paragraph c, defines the material andinstallation requirements for grounding electrodes.

The National Electrical Code Article 250-91 (1993), paragraph a, defines the material requirementsfor grounding electrode conductors.

The National Electrical Code Article 250-92 (1993), paragraph a, provides installation requirementsfor grounding electrode conductors.

The National Electrical Code Article 250-95 (1993) defines the size requirements for equipmentgrounding conductors.


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Proper grounding of the ROC helps to reduce the effects of electrical noise on unit operation and helps protect against lightning. Lightning Protection Modules are available to provide additional lightning protection for field wiring inputs and outputs. Refer to Appendix A for information about lightning protection. A surge protection device installed at the service disconnect on line-powered systems alsooffers lightning and power surge protection for the installed equipment.

Telephone surge protectors should be installed for ROC units using modem communications cards.All earth grounds must have an earth-to-ground rod or grid impedance of 25 ohms or less as measuredwith a ground system tester. The grounding conductor should have a resistance of 1 ohm or less betweenthe ROC enclosure ground lug and the earth ground rod or grid.

1.4.6 I/O Wiring RequirementsI/O wiring requirements are site and application dependent. Local, state, and NEC requirementsdetermine the I/O wiring installation methods. Direct buried cable, conduit and cable, or overheadcable are options for I/O wiring installations. Refer to Section 2, Master Controller Unit, I/O ModuleRack, and Wiring, and Section 3, Input/Output Modules.

1.5 Power Supply Requirements

The power consumption of a ROC and related devices determines the requirements for either lineor solar power supplies. Table 1-1 and Table 1-2 provide information to assist in determining powersupply requirements.

Table 1-1 lists the power consumption of the ROC364 and the optional devices available for it. Includein the power consumption calculations of all device relays, meters, solenoids, radios, and other devicesthat receive DC power from the ROC (excluding those connected to the I/O modules). Table 1-2 lists the

power consumption of the various I/O modules available.

A ROC systems power consumption determines power supply and battery size for both line and solar power supplies. Use the information in Table 1-1 and Table 1-2 to determine power requirements.

For non-analog I/O, size the I/O module scaling resistors for optimal current to minimize current drainon the power supply. Refer to Section 3.

1.5.1 Determining I/O Channel Power ConsumptionTo determine the I/O Channel Power:

1. Calculate the Duty Cycle of each I/O channel and enter the values in Table 1-1.

In estimating total I/O power requirements, the Duty Cycle of each I/O channel (built-in I/O ormodular I/O) must be estimated.

For a non-analog I/O channel , the Duty Cycle is the percentage of time that the I/O channel isactive (maximum power consumption). For example, if a Discrete Output is active for 15seconds out of every 60 seconds, the Duty Cycle is:

Duty Cycle = Active time (Active time + Inactive time) = 15 sec 60 sec = 0.25

NOTE: For non-analog I/O, size the I/O module scaling resistors for optimal current tominimize current drain on the power supply.


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For an analog I/O channel , the Duty Cycle is approximated by estimating the percentage oftime the channel spends in the upper half of its range (span) of operation. For example, if anAnalog Input wired as a current loop (4 to 20 milliamps) device operates in the upper half of itsrange 75% of the time, then 0.75 would be used as the Duty Cycle. If the analog channelgenerally operates around the midpoint of its span, use 0.5 as the Duty Cycle.

2. To calculate the total power consumed by an I/O channel, first select either the 12 Volt or 24Volt column in Table 1-1 or Table 1-2 and read the minimum ( P min ) and maximum ( P max ) powerconsumption value from the table for the desired I/O channel.

3. Calculate the power consumption for a channel with the Duty Cycle using the following equationtaken into account:

Power = (P max x Duty Cycle) + [P min (1 Duty Cycle)]

4. Multiply this value by the quantity ( QTY ) of I/O channels with the same Duty Cycle and enterthe calculated value in the Sub-Total column.

5. Repeat the procedure for all other I/O channels used.

6. Total the values in the I/O Modules Sub-Total column in Table 1-2.

7. Enter the I/O Modules Total value in Table 1-1.

8. Calculate the Radio Power Consumption total. Refer to Section 1.5.2, Determining RadioPower Consumption, on page 1-8.

9. Enter the Radio Power Consumption Total value in Table 1-1.

10. Calculate Total power consumption in Table 1-1.

11. Add the power consumption (in mW) of any other devices used with the ROC in the same power system, but not accounted for in the tables to the Total power consumption value in Table1-1. Refer to Section 1.5.3, Totaling Power Requirements, on page 1-9.

Table 1-1. Power Consumption of the ROC364 and Powered Devices

Power Consumption (mW)

12 Volt 24 VoltDevice

P min P max P min P max

QTY DutyCycle

Sub-Total(mW)

MCU and I/O Module Rack 915 1705 1 N/AI/O Converter Card 1 230 N/A N/ALocal Display Panel 25 25 N/ASerial Communications Card 135 135 N/A

Dial-up Modem Card 395 395 N/ALeased Line Modem Card 110 110 N/ARadio Modem Card 110 110 N/AI/O Modules Total from Table 1-2 N/A N/A N/ARadio (Section 1.5.2) N/A N/A N/A

TOTAL

NOTE: 1. The power drawn by field devices connected to I/O modules is included in the P max figures in Table1-2.


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Table 1-2. Power Consumption of the I/O Modules

Power Consumption (mW)12 Volt 24 VoltI/O Module

P min P max2 P min P max

2

QTY DutyCycle 1

Sub-Total(mW)

AI Loop 170 495 170 495 AI Differential 75 75 75 75 AI Source 110 305 130 470 AO Source 145 585 145 585RTD Input: P min is at 50 C(58 F); P max is at 100 C (212 F)

240 475 475 930

DI Isolated 1 10 1 10DI Source 1 55 1 205PI Isolated 1 30 1 30PI Source 1 70 1 230Low Level PI 1 45 1 45

SPI Isolated 1 10 1 10SPI Source 1 55 1 205DO Isolated 1 25 1 25DO Source (P max is at 57 mA) 30 815 30 1585DO Relay 12 Volts 20 420 N/A N/ADO Relay 24 Volts N/A N/A 20 470HART Interface Module 85 685 85 1285

I/O MODULES TOTALNOTES: 1. For analog I/O channels, the Duty Cycle is the percent of time spent in the upper half of the

operating range.2. The P max amount includes any power drawn by a ROC-powered field device such as a

transmitter.

1.5.2 Determining Radio Power ConsumptionIn determining power requirements for radios:

1. Estimate the Duty Cycle for the radio.

The Duty Cycle is the percentage of time the radio is transmitting (TX). For example, if a radiois transmitting 1 second out of every 60 seconds, and for the remaining 59 seconds the radio isdrawing receive (RX) power, the Duty Cycle is:

Duty Cycle = TX time (TX time + RX time) = 1 sec 60 sec = 0.01672. Calculate the total power consumed by a radio, obtain the power (P) consumption values for

transmit and receive from the radio manufacturers literature, then use the following equation tocalculate the power consumption for a particular Duty Cycle:

Power = (P TX x Duty Cycle) + [P RX (1 Duty Cycle)]

3. Determine the power consumption for all radios that use power from the ROC, and enter the totalcalculated value in the Sub-Total column in Table 1-1.


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1.5.3 Totaling Power RequirementsTo adequately meet the needs of the ROC system, it is important to determine the total powerconsumption to size the solar panel and battery backup requirements accordingly. For total powerconsumption, add the device values in Table 1-1.

Although Table 1-1 and Table 1-2 take into account the power supplied by the ROC to its connecteddevices, be sure to add the power consumption (in mW) of any other devices used with the ROC in thesame power system, but not accounted for in the tables.

Convert the total value (in mW) to Watts by dividing it by 1000.

mW 1000 = Watts

For selecting an adequate power supply, use a safety factor (SF) of 1.25 to account for losses and othervariables not factored into the power consumption calculations. To incorporate the safety factor,multiply the total power consumption (P) by 1.25.

PSF = P x 1.25 = _____ Watts

To convert P SF to current consumption in amps (I SF), divide P SF by the system voltage (V), either 12volts or 24 volts.

ISF = P SF / V = _____ Amps

1.6 Startup and Operation

Before starting up the ROC, perform the following checks to ensure the unit is properly installed. Make sure the enclosure has a good earth ground. Make sure the MCU is grounded at the power input connector.

Make sure all I/O module racks are grounded at the GND screw. Make sure the MCU and I/O module racks are secured to the factory backplate. Ensure FlashPAC modules are seated in their connectors. Seat and secure all I/O modules in their sockets. Check the field wiring for proper installation. Make sure the input power has the correct polarity. Make sure the input power is fused at the power source.

Check the input power polarity before turning on the power switch. Incorrect polarity candamage the ROC.

When installing units in a hazardous area, ensure that the components selected are labeled for usein such areas. Change components only in an area known to be non-hazardous. Performing theseprocedures in a hazardous area could result in personal injury or property damage.


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NOTE: For proper startup, the minimum input voltage level must be 12.5 volts or more for a 12-volt unit, and 25 volts or more for a 24-volt unit. Once the ROC364 has been successfullystarted, the ROC continues to operate normally over the specified input voltage range. If you areunsure of the input voltage setting for your ROC, refer to the paragraphs on setting the inputvoltage jumpers in Section 2.

1.6.1 StartupApply power to the ROC364 by plugging in the power terminal block. The Power indicator should lightto indicate that the applied voltage is correct. Then, the System Status indicator should light, and staylit, to indicate a valid reset sequence has been completed. After internal checks have been completed,

both AUX PWR indicators should light. The startup sequence may take up to 5 seconds. If any of theindicators do not light, refer to the Troubleshooting details in Section 2 for possible causes.

1.6.2 OperationOnce startup is successful, configure the ROC to meet the requirements of the application. Theappropriate ROCLINK configuration software user manual describes in detail the procedure forconfiguring the ROC. Once the ROC is configured and I/O is calibrated, it can be placed into operation.

Local configuration or monitoring of the ROC through its Operator Interface must be performedonly in an area known to be non-hazardous. Performance of these procedures in a hazardous areacould result in personal injury or property damage.

The ROC can be operated from a host system using ROCLINK configuration software. Consult withyour local sales representative for more information on host system compatibility.

1.6.2.1 Lo cal Display PanelThe Local Display Panel (LDP) is an ASCII terminal with a 4-line by 20-character Liquid CrystalDisplay (LCD) and a 4-key keypad. Refer to Appendix B, Liquid Crystal Display (LCD).


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2-1 Master Controller Unit, I/O Module Rack, and Wiring Rev Jun/05

SECTION 2 MASTER CONTROLLER UNIT, I/O MODULERACK, AND WIRING

2.1 Scope

This section describes the core of the ROC364 components, including the Master Controller Unit(MCU), the FlashPAC module, wiring, the I/O Module rack, the backplate, and the front panel. Topicscovered include:

Section Page2.2 Product Description 2-1 2.3 Installation 2-7 2.4 Connecting the MCU to Wiring 2-9 2.5 Troubleshooting and Repair 2-12 2.6 ROC364 Specifications 2-20

2.2 Product Description

The following subsections describe components of the ROC364 including the Master Controller Unit,FlashPACs, Diagnostic Analog Inputs, Auxiliary Discrete Outputs, I/O Module Rack, and Backplate.

2.2.1 Master Controller UnitThe Master Controller Unit (MCU) is the brain of the ROC. Figure 2-1 displays MCU. The MCUconsists of:

NEC V25+ microprocessor. I/O converter card connector.

On-board memory. I/O module rack connector.

FlashPAC module sockets. Diagnostic Analog Inputs.

Operator Interface port. Auxiliary Discrete Outputs.

Local Display port. Status indicators.

Communications ports. Metal housing.

Power fusing and terminations.


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DOC0119A

F L A S H P A C

SYSTEMSTATUS

GND

AUX PWROUT 1

DC PWRIN

+--+

AUX PWROUT 2

AUX OUT 2 AUX OUT 1

--++

POWER

OPERATORINTERFACE

COM2 COM1 DISPLAY

ROCREMOTE OPERATIONSCONTROLLER

RAMMEMORY EXPANSION321

F3

F2

F1

AUX OUT 25A, 32 VDC

5A, 32 VDC AUX OUT 1

POWER2A S.B., 32 VDC

F L A S H P A C

Figure 2-1. Master Controller Unit

The NEC V25+ is a 16-bit Complementary Metal Oxide Semiconductor (CMOS) microprocessorfeaturing dual 16-bit internal data buses and a single 8-bit external data bus. The ROC364 can addressup to one megabyte of memory and features high-speed direct memory access.

The on-board memory on the MCU includes 128 kilobytes of battery-backed, random access memory(RAM) for storing data and 32 kilobytes of electrically erasable programmable read only memory

(EEPROM) for storing configuration parameters. Plug-in sockets are provided for the FlashPACmodule. The ROC requires a FlashPAC to operate.

The Operator Interface connector provides direct communications between the ROC and the serial portof an operator interface, such as a laptop, to provide access to the functionality of the ROC.

The Display connector links the MCU to an optional Local Display Panel (LDP), also called a LiquidCrystal Display (LCD) panel. The LDP provides local monitoring of I/O and database parameters usingROCLINK configuration software. Limited editing of parameter values can be performed with the LDP,including a reset of the ROC. Refer to Appendix B, Resetting the ROC Using the LDP.

The communications connectors labeled COM1 and COM2 allow access to two optionalcommunications cards installed on the MCU board. The cards can provide serial data communications,modem, radio modem, or leased-line modem communications.The I/O Converter Card connector accommodates the optional I/O Converter Card, which provides 24-volt transmitter power in 12-volt systems. The connector uses a jumper when the converter card is notinstalled. Refer to Section 5.

The I/O module rack connector provides the connection point for the first I/O module rack. Up to threeadditional I/O module racks are installed by plugging into a connector on the previous I/O rack.


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Power fusing is accessible from the front of the MCU. Fuses are used for the input power and auxiliary power outputs. Terminal blocks provide terminations for the input and auxiliary output power. Thesource of auxiliary power is the input power, which can be a nominal 12 or 24 volts, depending on thesetting of jumpers located on the MCU. Refer to Section 2.3.3, Setting Voltage Jumpers in the MCU, on

page 2-8.

Indicators are provided for System Status, ROC Power, and auxiliary power (AUX OUT 1 and AUXOUT 2). Refer to Section 2.5.1, LED Indicators, on page 2-12.

The MCU is housed in a metal case that protects the electronics from physical damage. For protectionfrom outdoor environments, the unit must be housed in an approved enclosure.

2.2.2 FlashPAC ModuleThe FlashPAC module contains the operating system, the applications firmware, and communications

protocol, as well as memory storage for history logs and user programs. A FlashPAC module contains512 kilobytes of flash read-only memory (ROM) and 512 kilobytes of battery-backed Static RandomAccess Memory (SRAM). A FlashPAC module is required for the ROC to operate. Back-up power forthe RAM is provided by a self-contained lithium battery. Figure 2-2 shows a FlashPAC module.

The applications firmware consists of functions contained in flash ROM such as: AGA3 (1985 and 1992 algorithms) and AGA7 Flow Calculations, with metric conversion. PID (Proportional, Integral, and Derivative) Loop Control. Support for Function Sequence Tables (FSTs). Communications Enhancement (dial-up Spontaneous-Report-by-Exception (SRBX) alarming). Local Display Panel Enhancement (database point monitoring along with configuration access). Radio Power Control (FlashPAC Version 2.1 or greater).

ROC300 SERIES

VER: 2.10PATENT 5339425

FLASHPAC

DOC0292A

-------------

W20217X0012

Figure 2-2. Typical FlashPAC Module


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The firmware is programmed into flash memory at the factory, but can be reprogrammed in the field.The application programs are configured by using ROCLINK configuration software including user

programs, such as the Modbus communications protocol.

When used with ROCLINK configuration software, a FlashPAC module can save a configuration todisk as an .FCF file and later restore these configuration files into a ROC.

The RAM in a FlashPAC can store 87 history points, each holding 35 days of hourly values. Besidesstoring history data, the RAM in a FlashPAC stores user program data. The flash ROM portion of theFlashPAC is programmed with firmware at the factory and can store user programs downloaded througha communications port.

Table 2-1, ROC Memory Map, on page 2-4 shows how the ROC memory is allocated. Each memorylocation range (for example, 00000 to 1FFFF) represents 128 kilobytes of memory.

Determin ing FlashPAC Vers ion

To determine the version of a FlashPAC, use ROCLINK configuration software. Select ROC >

Information > Other Information > Version Name, which contains the part and version numbers.NOTE: The version may have been updated by a download of upgrade firmware into the module,so the label on the actual FlashPAC module might not be accurate.

Table 2-1. ROC Memory Map

Memory Location FlashPAC Usage00000 to 1FFFF Base RAM Alarm Log, Event Log, and such.20000 to 3FFFF RAM in FlashPAC History Data Area, part is for scratch-pad memory in FlashPAC40000 to 5FFFF RAM in FlashPAC History Data Area60000 to 7FFFF RAM in FlashPAC History Data in FlashPAC

80000 to 81FFF EEPROM (on-board) User Configuration Data88000 to 9FFFF Flash ROM Operating System and Applications

A0000 to BFFFF RAM in FlashPAC User Program Data in FlashPACC0000 to DFFFF Flash ROM User Program Code in FlashPACE0000 to FFFFF Flash ROM Operating System Firmware

2.2.3 Diagnostic Inputs and Auxiliary OutputsThe ROC364 MCU monitors the power input voltages, transmitter output voltage, and the board temperaturewith diagnostic Analog Inputs designated as E points by the configuration software. The inputs can becalibrated by using ROCLINK configuration software. Two auxiliary Discrete Outputs are also available.

The diagnostic Analog Inputs and auxiliary Discrete Outputs are: Transmitter supply output voltage Point Number E1. Power input voltage Point Number E2. Auxiliary Discrete Output #1 Point Number E3. Auxiliary Discrete Output #2 Point Number E4. MCU board temperature Point Number E5.


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2.2.4 I/O Module RackThe I/O module rack provides sockets for up to 16 I/O modules. Refer to Figure 2-3. Up to 64 I/Omodules can be used in any combination of Discrete Inputs, Discrete Outputs, Analog Inputs, AnalogOutputs, and Pulse Inputs. A minimum of one rack is required for any ROC connected to field I/O, and amaximum of four racks can be accommodated. The first rack plugs directly into the I/O module rackconnector on the bottom edge of the MCU. Additional racks plug into each other.

1 2 3 4 8765 9 14 15 1613121110

A B C CB A CB A CB A CB A CB A CB A CB A A B C A B C A B C A B C CB A CB A CB A CB A

MODULE RACK

GNDGND

A

DOC0030C

Figure 2-3. I/O Module Rack


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2.2.5 BackplateThe ROC364 backplate is a mounting panel for an MCU and one or more I/O module racks. Backplatesare available in three sizes to accommodate the indicated number of I/O racks: one rack, two racks, andthree or four racks. Refer to Figure 2-4 for dimensions of the various backplates.

DIM A

DIM C

D I M

B

D I M

D

DIM G

MOUNTING STUD SIZE

DIM F

DIM E

DOC0243A

Figure 2-4. Backplate and Mounting Dimensions

Maximum I/O PointsDIM

16 32 64

A 12.40 11.60 11.25B 11.34 21.46 28.58C 13.34 13.00 12.25D 13.12 22.26 29.38E 3.94 3.94 4.06F .38 .38 .50G NO.10 5/16 5/16

DIM = Dimensions in inches


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2.3 Installation

Component installation is normally performed at the factory when the ROC is ordered. However, themodular design of the ROC makes it easy to install and to change hardware configurations in the field asrequired. The following procedures describe installation of a ROC.

If you are installing the ROC364 into a ROC enclosure, fasten the backplate to the mounting studs ortapped mounting holes provided in the enclosure. If you installing the ROC364 on a wall panel or insome other enclosure, refer to Figure 2-4 for the recommended size and location of mounting studs.

For ROC364 units that are currently in service, you must take certain precautions to ensure data is notlost, equipment is not damaged, and personnel are not exposed to electrical hazards. Refer to Section2.5, Troubleshooting and Repair, on page 2-12.

When installing units in a hazardous area, ensure that the components selected are labeled for usein such areas. Change components only in an area known to be non-hazardous. Performing theseprocedures in a hazardous area could result in personal injury or property damage.

To add I/O modules, refer to Section 3. To add a communications card, refer to Section 4. To installaccessories for use with the ROC, refer to the ROC/ROC Accessories Instruction Manual (Form A4637).

2.3.1 Mounting the Master Controller Unit to a BackplateThe Master Controller Unit (MCU) and I/O module rack(s) mount to a factory-supplied backplate,which can be mounted inside an enclosure. The backplates are pre-drilled and tapped to accept the MCUand one to four I/O module racks. Refer to Figure 2-4.

Equipment and Tools Required: Flat-blade (1/8-inch wide) screwdriver

To mount the MCU to a backplate:

1. Make sure the proper size backplate is being used for the number of I/O module racksto be installed.

2. Locate the alignment screws on the backplate and place the keyhole slots, located on the base ofthe MCU, over the screw heads.

3. Slide the MCU over the alignment screws and secure in place with two 8-32 1 inch andtwo 8-32 2.25 inch screws.


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2.3.2 Mounting an I/O Module Rack to a BackplateEach I/O module rack has a male and female connector on opposite sides of the rack. The first I/O modulerack plugs directly into the MCU I/O module rack connector. Additional racks plug into each other.

Equipment and Tools Required: Flat-blade (1/8-inch wide) screwdriverTo mount one or more I/O module racks to a backplate:

1. Insert the connector located on the edge of the first rack into the mating connector of the MCU.

2. Align the rack with the mounting holes in the backplate and secure in place with five 6-32 0.75inch machine screws. Refer to Figure 2-4.

3. If a second rack is required, insert the edge connector of the second rack into the edge connectorof the first rack.

4. Align the rack with the mounting holes in the backplate and secure in place with five 6-32 0.75inch machine screws.

2.3.3 Setting Voltage Jumpers in the MCUThe MCU board contains a set of three jumpers to select the nominal input voltage of either 12 or 24volts. The factory default setting is for 12-volt operation.

Equipment and Tools Required: None

To access the jumpers, proceed as follows:

1. Remove the screws holding the upper MCU cover in place, and lift off the cover.

2. Unplug any terminal blocks, connectors, and FlashPACs.

3. Remove the two screws securing the lower MCU cover, and lift off this cover as well.4. Position ALL jumpers P1, P2, and P3 in either the 12-volt or 24-volt position, depending on the

nominal value of the ROC input voltage. The jumpers are located just to the right of the PowerStatus indicators.

NOTE: The 12 and 24 volt designations indicate nominal voltage values only. Whenconnected for 12-volt operation, the actual input voltage required for the ROC to start up is12.5 volts dc. Once powered up, the minimum voltage required to sustain operation (low-voltage cut-off) is 10.8 volts dc. Likewise, when connected for 24-volt operation, the start-upvoltage required is 25 volts dc, and the low-voltage cut-off is 21.4 volts dc.

5. Replace the covers, screws, connectors, and FlashPAC.


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2.3.4 Installing a FlashPAC ModuleUse the following procedure to add a FlashPAC module. This procedure assumes the first-timeinstallation of a FlashPAC module in an out-of-service ROC. For an in-service ROC, refer to the Section2.5.10, Replacing a FlashPAC, on page 2-16.

Equipment and Tools Required: None

When working on units located in a hazardous area (where explosive gases may be present), makesure the area is in a non-hazardous state before performing these procedures. Performing theseprocedures in a hazardous area could result in personal injury or property damage.

1. Remove the FlashPAC module retainer by unscrewing the two thumbscrews and sliding theretainer straight out.

2. Remove and discard the foam insert that blocks the unused slot in the retainer.

Before installing a FlashPAC module, make sure the module connector pins are not bent. Bentpins can damage the mating connector. Do not attempt to straighten bent pins; instead, replacethe module.

3. Align the key on the module socket with the key of the MCU socket; in this position, the F ofFlashPAC on the label should be closest to the I/O terminals.

4. Carefully insert the module in the socket and press it in firmly, but gently to seat the module. Themodule should move inward slightly. Verify that the module is seated in the connector by gentlylifting up on the module. If it comes out easily, repeat the process.

5. Carefully position the retainer over the FlashPAC, and tighten the thumbscrews. Make sure thatthe sloped surface of the retainer is down.

2.4 Connecting the MCU to Wiring

The following paragraphs describe how to connect the ROC to power, ground, and communicationswiring. For connections to I/O modules, refer to Section 3. To wire a communications card, refer toSection 4.

The power and I/O wiring terminal blocks accept up to 12-gauge AWG solid or stranded copper wire.

NOTE: Use a standard screwdriver with a slotted (flat bladed) 1/8-inch width tip when wiring allterminal blocks.

2.4.1 Connecting Ground WiringEquipment Required: Flat-blade (1/8-inch wide) screwdriver

The ROC and related components must be connected to earth ground. These include the MCU,I/O module racks, system I/O devices, and the system power source. Each component connects toearth ground (typically an enclosure ground bar) using the grounding screw provided. The componentsshould be linked using an 18 AWG or greater conductor. The earth ground wire from the ROC enclosureground bar to ground should be at least 12 AWG.


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Ground wiring requirements are governed by the National Electrical Code (NEC) code or otherapplicable codes. Excerpts from the NEC code are contained in Section 1, General Information.

For the ROC, connect the GND terminal on the power connector (Figure 2-5) to the enclosure groundwith 12 AWG wire . The enclosure ground must be connected to an appropriate ground rod or grid.

2.4.2 Connecting Main Power WiringEquipment Required: Flat-blade (1/8-inch wide) screwdriver

Power connections to the ROC are made at the Master Controller Unit (MCU) through plug-in terminal blocks. Refer to Figure 2-5. It is important good wiring practice be used when sizing, routing, andconnecting power wiring. All wiring must conform to state, local, and NEC codes.

The power terminal blocks can accommodate a wide range of wire gauges up to 12 AWG. Use 18 AWGwire or larger for all power wiring.

Use the DC PWR IN +/ terminals to connect the ROC to a DC power source. Before makingconnections, make sure the voltage selection jumpers are in the proper position for the voltagebeing used, and the hook-up polarity is correct. Refer to Section 2.3.3, Setting Voltage Jumpers in theMCU, on page 2-8.

The input power (DC PWR IN +/) is fused at 2 amps by slow-blow fuse (F1), which is accessiblethrough the front panel and by a 3-amp fuse located on the MCU board. Refer to Section 2.5.3, Replacing Fuses, on page 2-14.

DOC0123A

-

AUX PWROUT 2

+--+

DC PWRIN

AUX PWROUT 1

GND

Figure 2-5. Power Wiring Connections

2.4.3 Connecting Auxiliary Power WiringThe AUX PWR OUT 1 and AUX PWR OUT 2 terminals provide switched power from the DC PWR INterminals to an external device, such as a radio. The AUX PWR OUT 1 and 2 terminals are switchedindependently of each other under software control. Both sets of terminals are disabled if the watchdogtimer times out. The watchdog timer resets the system when power voltage is not met or exceeds thelimitations of the ROC. The two sets of AUX PWR OUT 2 terminals are internally connected in

parallel. The output voltage and current supplied by these terminals is specified in Section 2.6, ROC364Specifications, on page 2-20.


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The switches employed in the auxiliary outputs are solid-state relays and exhibit a voltage drop proportional to the current load, typically in the range of 0 to 2 volts dc. The relays can be controlledautomatically using an FST that has been set up to determine the switching conditions. If a FlashPAC isinstalled, the auxiliary outputs are switched by using the Status parameter of Discrete Output Point

Number E3 or E4. An LED indicator for each output is activated when the respective output is

energized.The AUX PWR OUT 1 and AUX PWR OUT 2 terminals are fused at 5 amps by fuses F2 and F3, whichare accessible on the front panel. Refer to Section 2.5.3, Replacing Fuses, on page 2-14.

2.4.4 Connecting Communications WiringThe ROC has the flexibility to communicate to external devices using several different formats and

protocols. Connectors located on the front panel of the ROC provide both Operator Interfaceand data communications.

The Local Operator Interface (LOI) connector is a serial EIA-232 (RS-232) port for communications toa configuration and monitoring device. This device is typically a personal computer. A null modemcable (wires to pins 2, 3, and 5, with the wires between pins 2 and 3 cross-connected) is normally used

between the Operator Interface connector and the PC. Figure 2-6 shows the wiring for this port.

Figure 2-6. Operator Interface Connector Wiring Schematic

The Display connector is a parallel port for dedicated communications to an optional Local DisplayPanel. The cable supplied with the Local Display Panel plugs into this connector. Refer to Appendix B.

Two data communications ports, labeled COM1 and COM2 on the front of the MCU, are activatedthrough optional plug-in communications cards. Section 4 details the types of communications cardsavailable and has information on connecting wiring to the COM1 and COM2 connectors.


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2.5 Troubleshooting and Repair

The troubleshooting and repair procedures help identify and replace faulty boards, fuses, andFlashPACs. Refer to Section 3 for troubleshooting I/O modules or Section 4 for troubleshooting andreplacing a communications card. Return faulty boards and FlashPACs to your local sales representativefor repair or replacement.

The following tools are required for troubleshooting: IBM-compatible personal computer. ROCLINK configuration software. Digital multimeter, Fluke 8060A or equivalent.

2.5.1 LED IndicatorsThe Light-emitting diode (LED) indicators, located on the front panel of the MCU, give a first-levelindication of the operation of the ROC. Figure 2-7 shows the location of the indicators and Table 2-2 describes them.

The primary indicator that the MCU is operating normally is the System Status indicator. This indicatorshould light within a few seconds after power is applied, and then remain lit. If the System Statusindicator does not remain lit, refer to Table 2-2 for possible causes.

POWER AUX OUT 1 AUX OUT 2

SYSTEMSTATUS

DOC0122A

Figure 2-7. MCU Status Indicators


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Table 2-2. MCU LED Indicators

Indicator LED Meaning

On Power is applied to the MCU.

POWEROff

MCU does not have power. Possible causes are: Power not present at power terminals. Power switch is off if so equipped (older units only). Defective power switch (older units only). Fuse F1 is open. Fuse F4 is open. Polarity reversed.

On Successful startup and the processor is running.

Blinking Processor is not running and the controller is attempting to restart. Possible low battery or bad FlashPAC.

SYSTEMSTATUS

Off If the POWER indicator is on, indicates insufficient voltage is available to power upthe MCU.

On System voltage is present at the AUX PWR OUT 1 terminals. AUX OUT 1Off Fuse F2 is open or the output has been disabled by the software.On System voltage is present at the AUX PWR OUT 2 terminals.

AUX OUT 2Off Fuse F3 is open or the output has been disabled by the software.

2.5.2 RAM Backup Procedure using ROCLINK Configuration SoftwareBefore removing power to the ROC, perform the following procedure to avoid losing the ROCconfiguration and other data stored in RAM.

User programs cannot be saved out of the ROC. Reload user programs from their original disk files as

instructed in the ROCLINK for Windows Configuration Software User Manual (Form A6091) or the ROCLINK 800 Configuration Software User Manual (Form A6121).

When installing devices in a hazardous area, make sure each device is labeled for use in suchareas. Procedures involving switching power on or off, or procedures for installing or removingany wiring or components, must be performed only when the area is known to be non-hazardous.Performance of these procedures in a hazardous area could result in personal injury or propertydamage.

To avoid circuit damage when working with the ROC, use appropriate electrostatic dischargeprecautions, such as wearing a grounded wrist strap.

1. Save the current configuration data by selecting ROC > Flags > Write to EEPROM or FlashMemory Save Configuration . This action saves most of the ROC configuration (but not logs orFST programs) into the permanent memory accessed when a Cold Start is performed.

2. Save the current configuration data to disk by using the Download > Save ROC ConfigurationTo Disk function. When replacing or upgrading a FlashPAC, the only way to preserveconfiguration data is to save the data to disk and then retrieve the information after the FlashPACis installed.


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3. Save all historical database logs (Minute, Hourly, and Daily), Event Log, and Alarm Log to diskusing ROC > Collect Data All function as explained in the applicable ROCLINKconfiguration software user manual.

4. Save the FSTs to disk using Utilities > FST Editor > FST > Write function in the FST Editor.Refer to the FST Editor in the applicable configuration software user manual.

2.5.3 Replacing FusesThe types of fuses used for the ROC364 and their rating values are listed in Table 2-3.

Table 2-3. ROC Fuses

Fuse Rating UseF1 2 A, 32 Volt Slow Blow Main Power InputF2 5 A, 32 Volt Fast Acting Auxiliary Power Output 1F3 5 A, 32 Volt Fast Acting Auxiliary Power Output 2

F4 3 A, Bussman GFA 3 Main Power Input (Safety)

Fuses F1, F2, and F3 are accessible from the MCU front panel. Fuse F4 is located on the MCU board and isaccessible only by removing the upper MCU cover. In most cases, a visual inspection of the fuses indicate ifthey are open (blown). If in doubt, use a digital multimeter to check for continuity.

To remove fuses F1, F2, or F3 for inspection or replacement, proceed as follows:

1. Disconnect the ROC from its power source.

2. Insert a screwdriver into the slot in the fuse holder cap and rotate counterclockwise 1/4 turn.

3. Remove the screwdriver. The cap and fuse will spring out. Remove the fuse from the cap.

Reverse steps 1, 2, and 3 to install the fuse.

Fuse F4 is soldered to the MCU board. Removal and replacement of fuse F4 is normally performed atthe factory, since it requires removal of the MCU board from its housing. Refer to Section 2.5.12, Removing and Replacing the MCU Assembly, on page 2-19.

2.5.4 Verifying Battery VoltageEquipment Required: Voltmeter

The on-board RAM and the real-time clock receive backup power from Battery B1. Battery B1 is a 3.6-volts lithium battery, with an expected life of 5 to 10 years. If the ROC is powered down for extended

periods, this may shorten the life of the battery. In older ROC units, Battery B1 is soldered onto the maincircuit board.

A blinking Status LED may be an indication of a bad battery.

To check the battery voltage:

1. Remove power from the ROC.

2. Remove the FlashPAC module as described in Section 2.5.10 on page 2-16.

3. Remove the cover .

4. Remove the communications cards if necessary.


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5. Remove the battery located at B1 on the top right of the MCU.

6. Measure the voltage of the terminals of the removed battery.

7. If the voltage reading is less than 3.6 volts, the battery must be replaced. Refer to Section 2.5.11, Replacing the Battery, on page 2-18.

If the battery in soldered-in, replacement requires the removal of the MCU board from the housing, andthen the MCU assembly should be returned to your local sales representative for this action. Refer toSection 2.5.12, Removing and Replacing the MCU Assembly, on page 2-19.

2.5.5 Verifying the ROC can Communicate with the PCEquipment Required: Personal computer with ROCLINK configuration software installed

To verify that the ROC is communicating with the PC running ROCLINK configuration software:

1. Connect the ROC to the PC and launch ROCLINK configuration software.

2. If the ROC is communicating with ROCLINK configuration software, COM1 , COM2 , COM3 ,or COM4 displays in the lower right corner of the screen.

2.5.6 Verifying RAMEquipment Required: Personal computer with ROCLINK configuration software installed.

To detect bad RAM:

1. Connect the ROC to ROCLINK configuration software.

2. Select ROC > Information > Other Information tab and verify that RAM Installed is labeledPRESENT .

The problem could be a bad backup battery or a bad solder joint of the RAM chip.

2.5.7 Performing a Warm StartA Warm Start temporarily suspends all input/output (I/O) scanning. I/O processes are restarted fromtheir last calculated values. A Warm Start clears and restarts all user-enabled flags. A Warm Start alsostarts all FSTs to the first instruction.

NOTE: If your ROC is semi-functional, refer to Section 2.5.2, RAM Backup Procedure, on page2-13 before removing power from your ROC.

To perform a Warm Start using the configuration software:

1. Connect the ROC to the PC running ROCLINK configuration software.

2. Click ROC > Flags > Warm Start and click Apply.

To perform a Warm Start using the power option:

1. Remove power from your ROC.

2. Reapply power to the ROC.


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2.5.8 Performing a Cold StartA Cold Start allows you to reset your ROC based on the selected option.


To perform a Cold Start:1. Connect the ROC to ROCLINK configuration software.

2. Select ROC > Flags .

3. Select the Cold Start checkbox.

4. Click the Cold Start Options button.

5. Select the appropriate option and click OK .

2.5.9 Performing a Reset

When you have tried the previous methods for convincing your ROC to cooperate and all othertroubleshooting procedures have failed, perform a reset before returning your ROC to the factory.A reset returns the ROCs configuration of I/O points, PID, AGA points, communicationparameters, system variables, Opcode tables, ROC Displays, and LCD displays to their defaultvalues. This reset sets the FST run flags to zero, clears all Alarm and Event Logs, and clears allUser Programs.


1. Connect your ROC to a computer running ROCLINK configuration software.

2. Select Utilities > Download User Programs or User Program Administrator .

3. Clear all user programs ( Clear All) and click OK or Update .

4. Select ROC > Flags .

5. Select the Clear EEPROM checkbox or click Flash Memory Clear and click Apply .

6. Select the Cold Start checkbox.

7. Click the Cold Start Options button.

8. Select the Restore Config & Clear All of the Above (Cold Start & Clear All) radio button andclick OK .

NOTE: Refer to Appendix B, Resetting the ROC Using the LDP.

2.5.10 Replacing a FlashPACEquipment Required: Personal computer with ROCLINK configuration software installed

A faulty FlashPAC module can be suspected if the: Status LED is blinking. Data is being corrupted.

ROC is not communicating. RAM fails to show up in ROCLINK configuration software as

being installed.


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To replace a FlashPAC module:

When repairing units in a hazardous area, change components only in an area known to be non-hazardous.

There is a possibility of losing the ROC configuration and historical data held in RAM whileperforming the following procedure. As a precaution, save the current configuration andhistorical data to permanent memory as instructed in Section 2.5.2, RAM Backup Procedure, onpage 2-13.

During this procedure, all power is removed from the ROC and devices powered by the ROC.Ensure all connected input devices, output devices, and processes remain in a safe state whenpower is removed from the ROC and when power is restored to the ROC.

1. Back up your RAM to avoid losing data. Refer to Section 2.5.2, RAM Backup Procedure, on page 2-13.

2. Remove power by unplugging the block on the power terminal block.

3. Lift up on the FlashPAC to be replaced and remove it from the socket.

Before installing a new FlashPAC module, make sure the FlashPAC connector pins are straight.Bent pins can damage the mating connector. Do not attempt to straighten bent pins; instead,replace the FlashPAC.

4. Align the key on the FlashPAC socket with the key of the MCU socket. Carefully insert theFlashPAC module in the socket and press it in firmly, but gently to seat the FlashPAC. TheFlashPAC should move inward slightly. Verify that the FlashPAC is seated into the connector bygently lifting up on the FlashPAC. If it comes out easily, repeat the process.

5. Slide the retainer over the FlashPAC module and tighten the thumbscrews. Make sure that thesloped surface of the retainer is down.

6. Plug in the five-terminal connector to restore power. A Cold Start using EEPROM, InternalConfig Memory, or Flash Memory values automatically occurs and may take a few seconds.

7. Using ROCLINK configuration software, check the configuration data including ROC Displaysand FSTs, and load or modify them as required. In addition, load and start any user programs asneeded.

8. Verify that the ROC performs as required.

9. If you changed the configuration, save the current configuration data to memory by selectingROC > Flags > Write to EEPROM or Flash Memory Save Configuration as instructed in theapplicable ROCLINK configuration software user manual.

10. If you changed the configuration including the history database, ROC Displays, or FSTs, savethem to disk.


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2.5.11 Replacing the BatteryThis section details how to replace the ROC battery.




1. Back up your RAM to avoid losing data. Refer to Section 2.5.2, RAM Backup Procedure, on page 2-13.

2. Remove power from the ROC at the power terminal plug in.

3. Remove the screws from the front cover of the ROC.

4. Remove the screw from the communications cards if necessary.

5. Remove the communications cards.

6. Remove the old battery from the other battery socket (B1) by sliding the hold-down clip to one

side and lifting the battery from the MCU board. If the clip does not readily rotate, you may needto loosen the screw that secures the hold-down clip.

7. Install the new battery and tighten the clip.

8. Replace the communications card.

9. Replace the communications cards screw.

10. Replace the second communications card if necessary.

11. Replace the front cover and screws.

12. Reconnect power to the ROC by plugging in the power terminal connector.

13. Using ROCLINK configuration software, check the configuration data including ROC Displaysand FSTs, and load or modify them as required. In addition, load and start any user programs asneeded.


15. If you changed the configuration, save the current configuration data to memory by selectingROC > Flags > Write to EEPROM or Flash Memory Save Configuration as instructed in theapplicable ROCLINK configuration software user manual.


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2.5.12 Removing and Replacing the MCU AssemblyRemove and replace the MCU assembly as instructed in the following procedure.




1. Unplug the power connector from the ROC.

2. Unplug all connectors and terminal blocks from the MCU.

3. Loosen the screws that secure the MCU case to the ROC backplate.

4. Move the MCU up to disengage it from the I/O module rack and to slide two keyhole slots in thecase backplate into position to fit over the heads of concealed alignment screws. Then lift theMCU away from the ROC backplate.

5. If you are reasonably sure the FlashPAC modules are functioning (keep in mind all RAM isnormally cleared during factory servicing), you can remove them by unscrewing the twothumbscrews of their retainer and gently pulling each one from its socket.

6. The MCU must be returned as an assembly (the MCU board must remain in the metal case) toyour local sales representative for repair. If the ROC is equipped with one or twocommunications cards, the cards can be removed if desired before returning the MCU assembly.Follow the applicable procedure in Section 4 for removing these cards.

7. To install a new or repaired MCU assembly, reverse the procedure used for removal in the previous steps.

8. Reconnect power to the ROC by plugging in the power terminal block.

9. Using ROCLINK configuration software, check the configuration data including ROC Displays

and FSTs, and load or modify them as required. In addition, load and start any user programs asneeded.


11. If you changed the configuration, save the current configuration data to memory by selectingROC > Flags > Write to EEPROM or Flash Memory Save Configuration as instructed in theapplicable ROCLINK configuration software user manual. Also, if you changed theconfiguration including the history database, ROC Displays, or FSTs, save them to disk.


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2.6 ROC364 Specifications

ROC364 Specifications

PROCESSOR MEMORYNEC V25+ running at 8 MHz.On-Board: 128 KB battery-backed SRAM for data.32 KB EEPROM for configuration.FlashPAC: Plug-in module with 512 KB Flash read-only memory (ROM) and 512 KB of battery-backedstatic RAM (SRAM).Memory Reset: Optional LDP permits a cold startinitialization when used during power-up.

I/O CAPACITYUp to 16 I/O channels per Module Rack. Up to 4Module Racks (64 I/O channels) per MCU.

OPERATOR INTERFACE PORT

EIA-232D (RS-232D) serial format for use withportable operator interface. Baud is selectable from300 to 19,200 bps. Asynchronous format, 7 or 8-bit(software selectable). Parity can be odd, even, ornone (software selectable). 9-pin, female D-shellconnector provided.

TIME FUNCTIONSClock Type: 32 kHz crystal oscillator with regulatedsupply, battery-backed. Year/Month/Day andHour/Minute/Second.Clock Accuracy: 0.01%.Watchdog Timer: Hardware monitor expires after1.2 seconds and resets the processor. Processorrestart is automatic.

DIAGNOSTICSThese values are monitored: real-time clock/systemclock compare, AI module mid-scale voltage, DImodule default status, AO module D/A voltage, DOmodule latch value, I/O transmitter voltage, powerinput voltage, MCU board temperature.

POWER REQUIREMENTS11 to 16 V dc (12.5 V to start up) or 22 to 30 V dc(25 V to start up), jumper selectable. 1 Watt typical,excluding I/O power.

AUXILIARY OUTPUT POWERInput power is software switched to two sets ofauxiliary output power terminals. Each output fusedfor 5 A maximum. Output voltage is 0 to 2 V dc lessthan input voltage, depending on load.

I/O POWER CONVERTER (OPTIONAL)Input: 11 to 16 V dc, 15 mA with no load or shortedoutput.Output: 22 to 24 V dc, up to 0.6 A for transmitterpower.

ENVIRONMENTALOperating Temperature: 40 to 70C (40 to158F).Storage Temperature: 50 to 85C (58 to185F). Operating Humidity: To 95%, non-condensing.Transient Protection: Meets IEEE C37.90.1-1989.EMI Immunity: Meets EN61000-4-5 PerformanceCriterion B for Industrial Locations.

EMI Emissions: Meets FCC 47 CFR, Part 15,Subpart J, Class A verified.

DIMENSIONSMCU: 51 mm D by 203 mm H by 305 mm W (2 in.D by 8 in. H by 12 in. W). Add 38 mm (1.5 in.) todepth dimension for memory modules.Module Rack: 13 mm D by 127 mm H by 305 mmD (0.5 in. D by 5 in. H by 12 in. W).MCU w/one Module Rack: 311 mm W by 356 mmH (12.25 in. W by 14 in. H).MCU w/two Module Racks: 311 mm W by 565mm H (12.25 in. W by 22.25 in. H).MCU w/three or four Module Racks: 311 mm Wby 743 mm H (12.25 in. W by 29.25 in. H).

WEIGHTMCU: 2.3 kg (5 lbs) nominal.Module Rack: 0.5 kg (1 lb) nominal.Backplate: 1.4 to 3 kg (3 to 6.5 lbs).

ENCLOSUREMCU metal chassis with 2-piece cover and ModuleRack case meet NEMA 1 rating.

BACKPLATE16 gauge steel.

APPROVALS Approved by CSA for hazardous locations Class I,Division 2, Groups A, B, C, and D.


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3-1 Input and Output Modules Rev Jun/05

SECTION 3 INPUT AND OUTPUT MODULES

3.1 Scope

This section describes the Input/Output (I/O) Modules used with the ROC364 Remote OperationsController (ROC).

This section contains the following information:

Section Page3.1 Scope 3-1 3.2 Product Descriptions 3-1 3.3 Initial Installation and Setup 3-5 3.4 Connecting the I/O Modules to Wiring 3-5 3.5 Troubleshooting and Repair 3-21 3.6 Removal, Addition, and Replacement Procedures 3-28 3.7 I/O Module Specifications 3-30

3.2 Product Descriptions

The I/O modules plug into the ROC364 I/O module rack sockets and accommodate a wide range of process inputs and outputs. The I/O module rack provides sockets for up to 16 I/O modules. Up to 64I/O modules can be used in any combination of Discrete Inputs, Discrete Outputs, Analog Inputs,Analog Outputs, and Pulse Inputs. A minimum of one rack is required for any ROC connected to fieldI/O, and a maximum of four racks can be accommodated. The first rack plugs directly into the I/Omodule rack connector on the bottom edge of the MCU. Additional racks plug into each other.

The following modules are available: Analog Input (AI) Loop Discrete Output (DO) Relay Analog Input (AI) Differential Pulse Input (PI) Source Analog Input (AI) Source Pulse Input (PI) Isolated Analog Output (AO) Source Slow Pulse Input (SPI) Source Discrete Input (DI) Source Slow Pulse Input (SPI) Isolated Discrete Input (DI) Isolated Low-Level Pulse Input (LLPI) Discrete Output (DO) Source Resistance Temperature Detector (RTD) Input Discrete Output (DO) Isolated Highway Addressable Remote Transducer (HART )

Interface

Below each I/O module socket is a plug-in terminal block for field wiring connections. The plug-interminal blocks permit removal and replacement of the modules without the need to disconnect fieldwiring. I/O wiring terminal blocks accept up to 12-gauge American Wire Gauge (AWG) solid orstranded copper wire. Figure 3-1 shows a typical I/O module.

NOTE: Use a standard screwdriver with a slotted (flat bladed) 1/8-inch width tip when wiring allterminal blocks.


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SENSITIVE

STATIC

DOC0034C

Figure 3-1. Typical I/O Module

3.2.1 Analog Input Loop and Differential ModulesThe Analog Input Loop (AI Loop) and Analog Input Differential (AI Differential) modules are used formonitoring current loop and voltage output devices. Each AI module uses a scaling resistor for scalingloop current to achieve the proper input voltage.

The AI Loop module provides a source voltage for powering current loop devices and can be used as asingle-ended voltage output. The AI Differential module monitors loop current or voltage input fromexternally-powered devices and provides electrical isolation from the ROC power supplies.

3.2.2 Analog Input Source ModuleThe Analog Input Source (AI Source) module monitors current loop or voltage output devices. TheAnalog Input Source module provides a regulated 10-volts source for powering a device, usually a low

power transmitter, and uses a scaling resistor for converting loop current to input voltage.

3.2.3 Analog Output Source ModuleThe Analog Output Source (AO Source) module provides both a current and a voltage output for

powering analog devices. These outputs are isolated from each other and can be used simultaneously. Ascaling resistor provides a way to set the minimum loop resistance of the current loop to 0 ohms(installed) or 220 ohms (removed).


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3.2.4 Discrete Input Source and Isolated ModulesThe Discrete Input Source (DI Source) and Discrete Input Isolated (DI Isolated) modules monitor thestatus of relays, solid-state switches, or other two-state devices. Each module can accommodate one DI.

Both types of modules provide an LED that lights when the input is active. Both types of modules use a

scaling resistor for scaling the input range. Functions supported by both modules are: Latched DiscreteInput, Standard Discrete Input, and Time-Duration Input (TDI).

The DI Source module provides a source voltage for dry relay contacts or for an open-collector solid-state switch. The DI Isolated module accepts an external voltage from a powered two-state device and

provides electrical isolation from the ROC power supplies.

3.2.5 Discrete Output Source and Isolated ModulesThe Discrete Output Source (DO Source) and Discrete Output Isolated (DO Isolated) modules providetwo-state outputs to energize relays and power small electrical loads. Each module provides one DO.

Both types of modules provide an LED that lights when the input is active. Both modules are fused for protection against excessive current. Functions supported by both modules are: Latched Discrete Output,Toggle Discrete Output, Timed Duration Output (TDO), and TDO Toggle.

The DO Source module supplies switched current-limited power to small loads. The DO Isolatedmodule acts as a solid-state normally-open switch for activating externally powered devices. The solid-state switch is optically isolated from the power supplies in the ROC.

3.2.6 Discrete Output Relay ModuleThe Discrete Output Relay (DO Relay) module provides two sets of dry relay contacts to switchvoltages of up to 250 volts ac. One set of contacts is normally open and the other set is normally closed.Two types of relay modules are available, one with a 12 volts dc energizing coil and the other with a 24volts dc energizing coil.

The DO Relay provides an LED that lights when the input is active and functions supported by themodule include: Latched Discrete Output, Toggle Discrete Output, Timed Duration Output (TDO), andTDO Toggle.

3.2.7 Pulse Input Source and Isolated ModulesThe Pulse Input Source (PI Source) and Pulse Input Isolated (PI Isolated) modules count pulses from

pulse-generating devices. Each module can accommodate one Pulse Input.

Both types of modules provide an LED that lights when the input is active. Both types of modules use ascaling resistor for scaling the input range. Input pulses are counted by a 16-bit counter capable ofstoring up to 6.5 seconds of pulse counts for a 10 kilohertz input signal. Functions supported by bothmodules include slow-counter input, slow rate input, fast counter input, and fast rate input.

NOTE: At the maximum input frequency of 10 kilohertz, the input pulses must not exceed 6.5seconds of pulse counts. The PI module limit is 20 seconds of pulse counts at 3 kilohertzmaximum input frequency.

The PI Source module provides a source voltage for dry relay contacts or for an open-collector solid-state switch. The PI Isolated module accepts an external voltage from a powered device and provideselectrical isolation from the ROC power supplies.


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3.2.8 Slow Pulse Input Source and Isolated ModulesThe Slow Pulse Input Source (SPI Source) and Slow Pulse Input Isolated (SPI Isolated) modules countthe changes in the status of relays, solid-state switches, or other two-state devices. Each module canaccommodate one Pulse Input.

The modules provide an LED that lights when the input is active. Both types of modules use a scalingresistor for scaling the input range. Functions supported are controlled by the ROC firmware. Forexample: Raw Pulse Accumulation, Running Total (Entered Rollover) in engineering units (EUs), Rate(Max Rollover) in EUs, Todays Total (Max Rollover) in EUs, or Rate Alarm.

The SPI Source module provides a source voltage for dry relay contacts or for an open-collector solid-state switch. The SPI Isolated module accepts an external voltage from a powered two-state device and

provides electrical isolation from the ROC power supplies.

3.2.9 Low-Level Pulse Input ModuleThe Low-Level Pulse Input module counts pulses from pulse-generating devices having a voltage range

of 30 millivolts to 3 volts peak-to-peak. T

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