Rnd english book

An ISO 9001:2008 Company

CE Certified

Certifications

2

ISO 9001:2008 Certified

Established in 1991, R&D Engineers is India's foremost manufacturer of baking machines for Wafer Biscuits, Ice Cream Cones and Rolled Sugar Cones. We are located in Hyderabad India.

Our clientele are market leaders from food, bakery, chocolates, and confectionery to hotel and restaurant industry.

R&D Engineers team of engineers guarantee a high quality of production. The professional team works with the aim of customer satisfaction by implementing new technical developments, giving optimum solutions, which increase the competitiveness of professional manufacturers and allow them to make attractive and quality products at a reasonable price.

About us

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UK

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Iran

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Fiji IslandsPapua New Guinea

Indonesia

Burnie

Singapore

Solomon Islands

Malaysia

Cambodia

Philippines

South Korea

Japan

Vietnam

Thailand

Argentina

Chile

Peru

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Venezuela

Colombia

PanamaGuatemala

HondurasHaiti

Mexico

USA

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R & D Family World Wide

Contents

CONE

RSCM

TUBE

Scan QR Code (To View Video)DetailsPage

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24

25

Ice Cream Cone Baking Machines ZE ZAW

SWIFT WA

RS CUPRS CONE

WT

Rolled Sugar Cone Machines

Wafer Biscuit Baking Machines

TT Series

Rolled Sugar Cone Machines (RSCM)

Sheet Cooler (“SC” Series)15

Wafer Creaming Machine (“CR” Series)16

Book Cooler (“BC” Series)18

Wafer Cutting Machine (“WC” Series)19

Batter Mixers20

5

6

II. Premium Cone Designs

Z-25R10 ** Z-6378 *

Z-8200 *

Za-6073 Z-3303 ** Z-30a70 *

III. Special Cone Designs

Z-93d32 *

Z-5227*

Only possible with ‘ZE’ series plant

Only possible with ‘ZAW’ series plant***

Ze-29G73 Za-4515 Za-56d20 Z-49S10_v3

Z-5225a Za-36b00a Za-7230a Z-5200e

I. Standard Cone Designs

These designs are intended to illustrate the various die possibilitiesThis is a short representation of the vast selection possible

Ice Cream Cone Design Selection Guide - Moulded Cones

The Automatic Ice-Cream Cone Baking Machine ZAW Series are efficient ovens for the large scale production of all kinds of Ice cream cones, moulded sugar cones, cups and hollow wafers. According to the output required these machines are supplied with 18, 24, 30 or 36 baking moulds or higher. The oven can be heated by Liquified Petroleum Gas (LP Gas) or Electricity. An automatic stacking device can be supplied as an extra. The machine is driven by a powerful motor, over a gear box. The baking speed can be varied between 1.5 - 4 minutes (approx).

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The table shown below describes the specification of the LP Gas heated oven (Baking Cycle 1.5 minutes)

Approx.Hourly output at cone diameter of Cones Cones

IF GAS HEATING*

IF ELECTRIC HEATING*

ZAW 12 ZAW 18 ZAW 24 ZAW 30 ZAW 36

Length in Metres

DIMENSIONS (WITHOUT AUTOMATIC STAKING DEVICE)

WEIGHT & SHIPPING DETAILS

Cones Cones Cones

3900 7900 10500 13200 16000

3600 7200 9600 12000 14400

3240 6500 8600 10800 12900

2880 5800 7700 9600 11500

2520 5000 6700 8400 10100

2160 4300 5700 7200 8600

Type

Up to 29mm (11 cones/mould)






Up to 68mm (5 cones/mould) 1800 3600 4800 6000 7200

LP Gas consumption Kg. Per hour approx 4-8 8-12 12-15 15-18 18-21

Electrical load in KW* (for LP Gas heated plant) 3.2 4.03.2 3.2 4.0

Electrical load in KW* 45 65 87 108 130

Consumption in KW* 35 46 62 77 92

1.7 1.7 1.7 1.7Height in Metres 1.7

1.1 1.1 1.1 1.1Width in Metres 1.1

3.6 4.8 6.0 7.2 8.4

Weight Net Kgs. 3000 4000 5000 6000 7000

Weight (Gross) Kgs - Basic Essential Packing 4250 5250 6500 7500 8500

11 18 25 36 47

Output Possibility

Technical Data

Weight (Gross) - seaworthy packing in M 3

Automatic Ice Cream Cone Baking Machine - ZAW Series

ZE 50 Std. ZA-1 Lab Model

ZE Series

The ZE series of semi-automatic machines are used for baking ice cream cones, moulded sugar cone and cups. These machines are easy to use and robust. The heating is by electrical heaters designed to optimize energy use and thermal distribution. This machine is flexible for high production on nonstop basis for 24 hours.

The upper section of the machine holds the male portion of the moulds. The lower section holds the female portion of the moulds. The two side pillars are used as guides for vertical opening and closing of the baking moulds. Depending on the diameter of the product, the moulds sections consists of four to six rows of dies.Each machine is customized for clients specification for a mould fitted on the machine.

ZA-1 Lab Model Cone Baking Machine

The ZA-1 Series is an efficient test baking tong for laboratory scale production of all kinds of ice cream cones, cups and hollow wafers for product development. They are characterized by the highest standards in precision, operating ease and utmost durability. They are easy to use and robust. These machines are supplied only with electrical heating.

The temperatures for the upper and lower plates can be adjusted by means of a thermostat. Moulds need to be ordered separately.

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Special Edition: ZE 50 (plus)- Silicone coated frame work- SS Machine stand

ZE 50 Std.

Diameter(mm) Cavities

Output per hour

24

27

31

33

42

46

56

63

3,800

3,400

3,000

2,900

1,900

1,400

1,200

1,080

20 4,30025

19

17

16

13

12

10

9

21

* May vary with cone design, recipe, ingredients selection.

Technical Data

Dimensions in mm ZE 50 ZA - 1

Length

Width

Height

Weight (approx. In Kg.)

Net Weight

Packed for shipping

Electrical Connected Load

1200 1030

1300 800

1700 1200

450 150

4.0*

530 Gross Wt.250

9-12

1.02.0Shipping Volume M 3

Output Possibility

Semi Automatic Ice Cream Cone Baking Machine - ZE Series

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4

5 6 7

8 9

1 3

2

1. Wafer Oven

2. Batter Mixer

3. Wafer Sheet Cooler

˜Not included in the swift line

4. Planetary Cream Mixer ˜

5. Cream Spreading Machine

6. Book Cooler

7. Wafer Cutting Process

8. Wafer Distribute Device˜

9. Packing Process ˜

Wafer Biscuit Manufacturing - Typical Factory Layout

Cream Wafer Biscuit - Product Suggestions

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Sp

ec

ial

De

sig

ns

Round shell Design

Heart Design

Canape Design

A - Angle of ReedingB - BodyC - Depth of EngravingD - Depth of EngravingP - Pitch of reedingT - Total Thickness

Re

gu

lar

De

sig

ns

Communion Wafer Design Design Requirements

03.0 X 0.6 (90 )

03.0 X 0.6 (45 )

04.0 X 0.6 (90 )

06.0 X 1.0 (45 )

08.0 X 2.0 (90 )

08.0 X 2.0 (60 )

010 X 2.5 (60 ) 0

12 X 3.0 (60 )0

12 X 3.0 (45 )

A

P

D

BC

Imported Blower Easy AccessTriangular BurnerImported Gas Train

Common features of wafer plants (WA / SW)

Wafer Design Selection Guide

Space for Operation and Maintenance

Suggested for Client Scope

Exhaust Fan Cancan be fixed

Exhaust Fan Cancan be fixed

Vapour exhaustGas Fan


“WA” Series Plant Layout (WA 72)

“SW” Series Plant Layout

1. WA 72 Oven 5. Book Cooler 2. Mix Plant 6. Wafer Cutting Machine 3. Sheet Cooler 7. Conveyors4. Creaming Machine

1. SW 42 Oven 5. Creaming Machine 2. Mix Tub 6. Book Cooler 3. Sheet Cooler 7. Wafer Cutting Machine 4. Batter Mixer 8. Conveyors

LEGEND

LEGEND



Suggest for Client Scope

750

750

35.1

Mts

.

30856.2

mm

24331.2

mm

20992m

m

1451.2

mm

2581m

m

18378m

m

16894m

m

14244.6

mm

0.0

mm

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Wafer Line Layouts

The WA Series of Wafer Biscuit Baking Machine are designed for fully automatic production of wafer sheets with fine medium or deep-reeding, as well as wafer sheets with hollow forms for all types of shapes.

According to the out put required it may be equipped with 48, 60 and 72 baking plates. These baking machines can be heated by L.P.G. only.

Universal triangular gas burners are used for baking . This page details gas heated plants.

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Technical Details

Length

Width

Height

Weight in Kg(approx)


DIMENSIONS IN METRES

Shipping space in Cubic Meters (approx)

10

1.4

2.5

9000

32 40 46

11250 13250

2.5 2.5

1.4 1.4

12 14

Consumption in Kw(approx)


IF GAS HEATING*

Output of wafer Sheets/Hr*

L.P.Gas consumption Kgs/hr

Electrical load in Kw (for Drive & Control)

Load in Kw (for Electrical Heater)

Cream filled Wafer Biscuits in Kg/Hr*(approx)

No.of Baking Plates (tongs)

TYPE WA 48 WA 60 WA 72

48 60 72

1440

200-225

30-35

9 9 9

70

56 75 94

94 118

38-42 44-48

250-275 300-325

1800 2160

* Based on 120 Sec baking cycle.

** The capacities indicated above are suggested values. The exact capacity depends on baking time, recipe and wafer thickness.

Automatic Wafer Biscuit Baking Machine - WA SeriesPlate Size : 350 x 470 mmCapacity : 200-325 Kgs/ hr

The SW wafer oven is finding increasing interest as a cost-efficient and convenient ‘Entrance Ticket’ to the wafer business.

The reason for this interest is that the oven is part of a whole package of machinery that meets the needs of

small producers who want to extend their business as well as those who may be new to industrial production

of wafers.

The fully automatic SW lines feature the baking oven, a batter mixer, a wafer sheet cooler, a cream spreader

that also builds the wafer books and cutter. SW lines are available in capacities, producing 75 to 200 kgs of

cream filled wafer per hour. The oven is equipped with 18, 24, 30, 36, & 42 supported baking plates made of

cast iron.

Automatic Wafer Biscuit Baking Machine - SW Series

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Output & Technical Details

* The capacities indicated above are suggested values. The exact capacity depends on baking time, recipe and wafers.** Shorter oven required longer baking cycles.

Consumption in Kw(approx)

Length

Width

Height

Net Weight in Kg(approx)


DIMENSIONS IN MM


IF GAS HEATING*

Including export packing Kg (approx)

Shipping space in Cubic Meters (approx)

Output of wafer Sheets/Hr*

L.P.Gas consumption Kgs/hr

Electrical load in Kw (for Drive & Control)

Load in Kw (for Electrical Heater)

Cream filled Wafer Biscuits in Kg/Hr(apx.)

No.of Baking Plates (tongs)

TYPE SW 18 SW 24 SW 30 SW 36

18 24 30 36

640

10-12

3.5 3.5 3.5 3.5 5.0

70

56

5,750

1500

2000

5,500

6,750

25 30 36 42 49

7,000

8,500

8,500

10,000

10,000

12,500

12,000

14,600

2000 2000 2000 2000

1500 1500 1500 1500

7,250 8,750 10,250 11,700

75 94 115100

94 118 141 165

14-16 18-20 20-23 25-28

96-10072-75 120-125 145-150 175-180

860 1080 1300 1500

42

SW 42

Note:The SW-18/24 has mechanical batter pump and SW - 30/36/42 has an motorized pumping.

The table shown below describes the specification of the oven (Baking Cycle 1.5 minutes)

Plate Size : 460 x 290 mmCapacity : 72-180 Kgs/ hr

WT Series wafer plant is used for the production of small capacity cream wafer biscuits for product development and testing also.They are characterized by a simple mechanism that is sturdy and flexible These machines are low cost and economical in operation. Depending on the out put required, they can be supplied single, 3, 6,9 or 12 Wafer tongs.

Batter PreparationWheat flour, maize starch, vegetable fat, preservatives, colors etc is churned into a paste in the batter mixer.

OperationThe batter is fed to pre-heated wafer tongs by a special dosing device. Baking takes1.5-3 minutes. The baked sheets are cooled.

Subsequent Operations area) Creaming - Manual application of cream on a wafer sheets by a spatula

b) Sandwiching - Doubling up the layers to prepare books.

c) Cutting - WCM Machine, a screw operated device complete the wire cutting of wafer book

to the desired cut sizes.

d) Packing - The cut wafers can be flow wraped as required.

WT-1 Lab ModelFor Product Testing

Technical Details :

Weight incl. sea worthy packing (appx.)

WT 1 WT 6WT 3 WCM

4

1 Station x 31 Tong x 1 3 Station x 2 –

–

–

30* 90*

270x370 270x370 270x370 270x370

2.5 7.5

2.0

750 mm

440 mm

300 mm

80

150

1.0 1.0

240* Stack Height (mm)10 to 70

Cutting Wire Spring

Steel in mm 0.5

Min. Cutting Width16

1420 x 21420 1450

1130

675

110

440 x 2440 x 1

750 x 2750 x 1

640320

900500

2.01.5

20-25

126

10

15

Dimensions (approx.in mm)

Out put of wafer sheets/hr

Plate Size in mm

Electric Heating: Connected load in KW

Current Consumption in KW/Hr

Cream filled wafers/Hour**(Kgs appx.)

Shipping Data

Shipping space in M3

Length

Width

Height

Net weight

14

WCM - Manual Cutting Machine

Manual Wafer Biscuit Baking Machine - WT SeriesPlate Size : 270 x 370 mmCapacity : 4-25 Kgs/ hr

Sheet Coolers are used to cool the baked wafer sheets in ambient air. The baked wafer sheets enter the arch sheet cooler where uniform cooling & stress relieving takes place. They are then fed to the creaming machine for further process.

Wafer Sheets up to a size of 470 x 350 mm can be handled by these type of arch coolers and can be custom designed as per client’s requirement. The wafer sheet cooler is designed in the form of an arch so that operator can supervise several machines and move from one to other with out hindrance.

The wafer sheets are fed into pairs of metallic wire brackets which are positioned next to each other. The wire brackets are fastened to a pair of endless roller chains forming an endless chain of holders. Sensors device notes when a sheet has been placed in a bracket and signals the motor to advance the chain one step so that an empty bracket awaits the next wafer sheet.

The carrier brackets, guide plates, and all other components of the unit coming into contact with the

product are fabricated from stainless steel. Wear-resistant plastic rails are used to guide the carrier chain. The cooler is fabricated from modular components thus allowing the length, width and carrying capacity to be varied easily and as required.

Model SC-6

Model SC-2

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**Capacity/minute Directly depending on the capacity of the Automatic baking Machine

Effective number of bows

0.5 Kw 0.5 Kw

3 Ph, 415V, 50 Hz, + std. 3 Ph, 415V, 50 Hz, + std.

100+

4 m+

Dimensions:

2700 mm

Width (changes with the sheet sizes)

Height up to the upper edge of the Wafer Sheet

Net Weight

1900 mm

820 - 1020 mm

Time for cooling and stress relieving 2 ½ (min)

35 - 40 (approx.) for the wafer sheets

Different Sizes of wafer sheet in mm

Technical Details

SC 3 - 350 x 470SC 6 - 470 x 350

SC 2 - 290 x 460

Connected load

Voltage* & Frequency*

Length

5.5 CBM

210 Kg

(300 Kgs)

Shipping Volume

4000 mm

1100 mm

2800 mm

700 Kgs

900 Kgs

12 CBM

Gross Weight

*Other voltage and frequency by the client at the time of ordering the equipment.

Wafer Sheet Cooler - SC Series

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The CR 5 DH (Double Head) Machine is a high-efficiency machine. This machine spreads cream automatically on wafer sheets and subsequently forms them into wafer blocks.

The double head machine can hold two different cream in the process. It is possible to make combination of different layers using the programing on the PLC.

This machine spreads cream automatically on wafer sheets and subsequently forms them into wafer blocks.

The CR 5 Machine can spread cream and put together to make wafer blocks. The desired quantity of the cream layers can be adjusted by means of a counting device. A stacking device puts the spread sheets together to make a wafer block.

The machine has a spreading unit which operates using a contact system.

The spreading rollers are heated by electricity and the heating is accurately adjustable. The number of revolutions made by the spreading rollers as well as the speed of conveyor belt are infinitely variable an independent of each other.

Creaming Machine - CR 5 SH (Single Head)

Creaming Machine - CR5 DH (Double Head)

Wafer Creaming Machine - CR Series

Twin Cream

PLC Control

Book Making

Cream Spreading machines spread an exact amount of cream onto the wafer sheets and automatically stacks the requested number of spread sheets together with the un creamed top sheet into a wafer block. A thermostat allows to heat the cream spreading roller as well as the counter-roller up to an exact temperature. The speed of the two rollers and of the spreading belt can be steplessly adjusted independently of each other.

The desired thickness of the individual cream layers is obtained by regulating the speed and the distance between the rollers. A paddle in the cream hopper provides for uniform distribution of the cream on the spreading roller. Flexible sealing lips in the cream hopper prevent leakage of liquid cream when the machines is out of operation.

The un creamed top sheet passes the spreading roller without contact due to cam-controlled lowering of the spreading table. After spreading wafer blocks are formed out of two to seven wafer sheets with the spiral stacker. There the wafer sheets get maximum support and are stacked. Even delicate wafer sheets with heavy cream can be processed. Exact block formation guarantees a minimum of cutting residue in the following cutting process. The requested number of cream layers is set by a selector switch and electronically controlled by light barriers.

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Creaming Machine CR - 6

*Pneumatic connection required.

Technical Data

Wafer Sheets per minute (max)

Width of spreading roller

18 (Max)

Size of the Wafer Sheet

285mm

290x460

360mm455mm

Type CR5 - SH CR5 - DH

Electrical Load (Kw) 2.5

Size of the machine (approx)

Net weight (appr.kg)

Net export packing (kg) (Bare essential)

15

270x370290x460

CR4

1.5

2135

615

1370

450

550

4.25

2900

650

1400

650

3.0

900

5

18 (Max)

285mm

290x460

3

4600

1150

3.0

1300

800

1600

CR6

36-40 (Max)

350x470

462mm

2700

1250

1550

700

1200

4.0Shipping space (Approx M )3

Length

Width

Height

Wafer Creaming Machine - CR Series

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Cooling UnitThe cooling unit is a refrigeration system, designed for continuous duty cycle working. The system consists of air-cooled single stage hermitically sealed compressor based cooling unit. The compressor is mounted on vibration isolators.

Cooling ProcessBook Cooler is a machine used for cooling the cream between the books before they enter the cutting machine. The cooling capacity can be changed according to the wafer product and capacity required.

The wafer book cooler "BC-Series" machine is of a compact design and are fabricated from modular sections. This unit developed by a combination of number of modules will provide required cooling time and also fits in the space available. The bracket, guide plates, and all other parts coming into contact with the product are fabricated from stainless steel.

After spreading the cream on the wafers and completing the pre-preparation of wafer book, it must be cooled in order to harden and set the cream prior to cutting. Partially set cream is required for clean cutting & in turn clean cutting is required for clean packing.

The movement of wafer books can be watched through the windows provided on the inlet and outlet of the tunnel. The wafers are passed to either a cutting device or an intermediate container. The BC Machine is electrically operated and is controlled by the sensors placed at the inlet of the feeding conveyor.

Technical Details

Wafer Book Sizes (mm) 290x460

Electrical Load (Kw) 10Kw

Refregiration (kcal/hr) 5000

Length

Height

Width

Net Weight Kgs.

Gross Weight Kgs.

6000

780

2050

1450

1050 1050

1450

Shipping Space in CBM 10

Machine Variables BC5 BC10

290X460470X350

18.5Kw

10000

7000

850

2050

10

Dimensions (mm)

Book Cooler Machine - BC Series

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We manufacture a series of wafer cutting machines, that machine can handle different sizes of wafer sheets. These are fully automatic machines for cutting flat and hollow wafers filled with cream. These machine take over the cooled-down wafer blocks coming from the cooling device or creaming machine and cut them into required number of blocks. In the cutting operation the wafer book are first pushed through one set of cutters and then at a right angle (perpendicular) through a second set of cutters. Fixed and tensioned cutting wires in removable frames are used. Changeover to other cutting sizes is facilitated by quickly and easily changing the cutting frames and pushers. These machines are designed for high-capacity plants.

*Wafer DistributorFor chocolate enrobed products we could also offer as an option of Wafer Distributor for our wafer cutting machines.

WC 5 Machine

**Pneumatic connection required

Machine Variables

Size of the Wafer (Possible)

Stack Height (mm)

Minimum Cutting Width (mm)

Cutting Wire (spring steel in mm)

Connected load (Kw)

Dimensions (mm)

Length

Width

Height

Net weight (appx. Kgs)

Shipping volume (CBM)

70

16

0.5

1.5

1700

1600

1200

310

4.5

70

18

0.5

1.5

2400

1700

1200

480

4.5

290x460350x470

290x460350x470

WC4* WC5*

Technical Details

This is a compact version of wafer cutting and mini distribution.

The cut wafer biscuit move directly and immediately from the cutting machine on to a conveyor with limited distribution.

Optional Attachement - WFD II

Wafer Cutting Machine - WC Series

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TM2(standard)

TM3(standard)

TM3 Sp(with control panel)

Batter Mixer

Tank Capacity

Connected load in Kw (3 phase)

Length

Width

Height

Net Weight (apprx)

Technical Details

65lts

1.2

780

780

1600

70 Kgs

95lts

2.2

900

600

1400

90 Kgs

MP100TM 3TM 2

100lts

4.5

1625

740

1690

200 Kgs

MP200

150lts

6.0

2000

1100

1800

250 Kgs

MP-200

Features Of MP 100 / 200

“MP” Series is a sophisticated mixing plant in which an extra intermediate holding tank is provided along with the mixer. The selector switch is provided for a variable mixing time. When mixing is complete the mixer shuts itself off automatically and the batter is pumped into an intermediate holding tank.

A stirring device is supplied in the holding tank also. From this holding tank the batter can be continuously pumped to the batter depositing station. Batter Pump is easily accessible, easy to clean.

We have a series of mixing plant depending on the capacity of the batter required to be made. Primary requirement for the production of quality batter is that all ingredients must be fully mixed together so that the batter will be homogeneous.

The particularly careful mixing procedure is achieved by the strong vertical currents induced in the batter. In the mixer center, the batter is induced to flow in the downward direction; on the periphery, the batter then flows in the upward direction..The Batter Mixer is used for the fully automatic production of batter for feeding one or more baking plants. Consistent batter is required for quality products (cones/wafers). The age of the batter or the time between mixing and use has also a marked and effect on the sheet quality. To ensure that the automatic wafer baking machines are being supplied with batter that is always fresh. It is important to prepare smaller batches at a time.

Wafer Batter Mixers

21

Rolled Sugar Cone - Suggestions

We supply automatic machines for best quality and precise rolled sugar cups. The 'RS-Series' of machines are designed with latest technical standards for economical results. These machines are clearly laid out and easily accessible.

Cup Making AttachmentThe wafer is taken off the lower plate & moves over to cup punching station that results in the cup formation.

22

Automatic Rolled Sugar Cup Baking Machine - RS Series

We supply automatic machines for a best quality and precise rolled sugar cones. The ‘RS-Series’ of machines are designed with latest technical standards for an economical results. These machines are clearly laid out and easily accessible. The bearings and lubricants used are of long life and the links between the baking plate are also maintenance free.

23

* The capacities indicated above are maximum values. The exact capacity depends on baking time, recipe and cone size

Technical Data

Size of Plate(apprx)

<mm’mm>Types of Ovens

RS 36

250*250

250*250

250*250

all types of gas

all types of gas

all types of gas

RS 48

RS 60

36 5 7-10 1440-1450 Rolled SugarCones

Waffle Cones,Waffle Bowls,Waffel Sheets

1920-1950

2400-2500

10-14

15-18

48 5

60 5

Types of heating(all types of gas;Propane, Butane,

Natural gas)+

Numberof tongs/multipleusage

Gasconsumption

per hour(apprx)

Electricalload in

KW

Productioncapacity<pcs/h>

PossibleProducts

90 Sec Cycle Time*

Automatic Rolled Sugar Cone Baking Machine - RS Series

24

TT-Series semi automatic machines produces rolled cones, cups or rolls. It is equipped with 9,12 & 18 baking stations. These machines are designed with latest technical standards for an economical results.

These machines are clearly laid out and easily accessible. The bearings and lubricants used are of long life and the links between the baking plate are also maintenance free.

Baking PlatesThe plates are made of special alloy. The selection of alloy and casting procedure ensures dimensional stability, a homogenous and dense surface, thermal stability, good heat accumulation characteristics and excellent thermal conductivity. Special finishing is done to ensure trouble free release of wafer sheets.

Types of OvenType of heating

(Electric)

Number of tongs/

multiple usage

Electrical load in

KW

Productioncapacity <pcs/h>

TT- 9 230 x 230 Elec

Elec

Elec

9 14.0+ 360

480

720

19.0+

28.0+

12

18

230 x 230

230 x 230

TT-12

TT-18

90 sec Cycle Time*

Size of Plate(apprx)

<mm’mm>

Technical Data

Punching Device - For Disc / For Bowl’s (Semi-Automatic)

This device is pneumatically operated; feeding of sheet is manually done. The punched items discharge onto a tray below. It can be used for punching different shapes on “malleable” wafer sheets. It is customized to suit various requirements for clients.

Semi Automatic Rolled Sugar Cone Baking Machine - TT Series

Punch Disc Punch Bowl

25

Waffle cones are the hottest selling item in the retail ice cream industry today. To maximise sales of ice cream at outlet level we need a great tasting cone with a good aroma.The aroma of a freshly baked cone attracts customers attention immediately.

We provide RSCM machine as single plate (101) & double plate (201) with customizable variants.

Rolled Sugar Cone Machine (RSCM)

Std. Design Logo Customization

Belgian Waffle Baker

Belgian Waffle probably the hottest item in the hospitality business today.Waffle increases desserts sales by 25% to 50%.

The Belgian Waffle plates are designed with round or heart shape.We do customize as per clients required designs.

Design 102(Heart)

CustomisedDesign 101(Round)

YourDesign

Manual Rolled Sugar Cone & Belgian Waffle Machine

RSCM 101 Model

BW 101 Model

26

CAD Development

3 D Model

Actual Product

Exchange Baking Moulds - Cone Plants

Exchange baking plate for Wafer Plants*

Customization: It can be suited for other plants too. Ask for details.

Baking PlatesThe plates are made of special alloy. The selection of alloy and the casting procedure ensures dimensional stability, a homogeneous and dense surface, thermal stability, good heat accumulation characteristics and excellent thermal conductivity.

Exchange Baking Moulds - Wafer Plants

An ISO 9001:2008 Company

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All rights reserved. No part of this brochure may be reproduced or transmitted in any form or by any means, electrical or mechanical including photocopying, recording or by any other form of information storage or retrieval system without permission in writing from the publisher. R&D Engineers adopts a policy of continues improvement and whilst every effort has been made to provide accurate and up to date information, the information contained in this brochure should be used for guidance purpose only and does not form part of any contract. The technical data and illustrations are subject to change without notice

R & D EngineersA-41, IDA Kukatpally, Phase II, Road No. 4,Via I.E. Gandhi Nagar, Hyderabad - 500037. INDIAPhone : +91-40-2340 2682, 2307 9121Fax : +91-40-2307 8668 E-mail : [email protected]

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