Rnc Mgw Unit Hdsc Descr

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WCDMA RAN, Rel. RU30, Operating Documentation, Issue 12 HDS-C DN0959197 Issue 01A Approval Date 2011-11-30 Confidential

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Transcript of Rnc Mgw Unit Hdsc Descr

  • WCDMA RAN, Rel. RU30, Operating Documentation, Issue 12

    HDS-C

    DN0959197

    Issue 01AApproval Date 2011-11-30

    Confidential

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    HDS-C

    Id:0900d805808df858Confidential

    The information in this document is subject to change without notice and describes only the product defined in the introduction of this documentation. This documentation is intended for the use of Nokia Siemens Networks customers only for the purposes of the agreement under which the document is submitted, and no part of it may be used, reproduced, modified or transmitted in any form or means without the prior written permission of Nokia Siemens Networks. The documentation has been prepared to be used by professional and properly trained personnel, and the customer assumes full responsibility when using it. Nokia Siemens Networks welcomes customer comments as part of the process of continuous development and improvement of the documentation.

    The information or statements given in this documentation concerning the suitability, capacity, or performance of the mentioned hardware or software products are given "as is" and all liability arising in connection with such hardware or software products shall be defined conclusively and finally in a separate agreement between Nokia Siemens Networks and the customer. However, Nokia Siemens Networks has made all reasonable efforts to ensure that the instructions contained in the document are adequate and free of material errors and omissions. Nokia Siemens Networks will, if deemed necessary by Nokia Siemens Networks, explain issues which may not be covered by the document.

    Nokia Siemens Networks will correct errors in this documentation as soon as possible. IN NO EVENT WILL Nokia Siemens Networks BE LIABLE FOR ERRORS IN THIS DOCUMENTA-TION OR FOR ANY DAMAGES, INCLUDING BUT NOT LIMITED TO SPECIAL, DIRECT, INDI-RECT, INCIDENTAL OR CONSEQUENTIAL OR ANY LOSSES, SUCH AS BUT NOT LIMITED TO LOSS OF PROFIT, REVENUE, BUSINESS INTERRUPTION, BUSINESS OPPORTUNITY OR DATA,THAT MAY ARISE FROM THE USE OF THIS DOCUMENT OR THE INFORMATION IN IT.

    This documentation and the product it describes are considered protected by copyrights and other intellectual property rights according to the applicable laws.

    The wave logo is a trademark of Nokia Siemens Networks Oy. Nokia is a registered trademark of Nokia Corporation. Siemens is a registered trademark of Siemens AG.

    Other product names mentioned in this document may be trademarks of their respective owners, and they are mentioned for identification purposes only.

    Copyright Nokia Siemens Networks 2011. All rights reserved

    f Important Notice on Product SafetyThis product may present safety risks due to laser, electricity, heat, and other sources of danger.

    Only trained and qualified personnel may install, operate, maintain or otherwise handle this product and only after having carefully read the safety information applicable to this product.

    The safety information is provided in the Safety Information section in the Legal, Safety and Environmental Information part of this document or documentation set.

    The same text in German:

    f Wichtiger Hinweis zur Produktsicherheit Von diesem Produkt knnen Gefahren durch Laser, Elektrizitt, Hitzeentwicklung oder andere Gefahrenquellen ausgehen.

    Installation, Betrieb, Wartung und sonstige Handhabung des Produktes darf nur durch geschultes und qualifiziertes Personal unter Beachtung der anwendbaren Sicherheits-anforderungen erfolgen.

    Die Sicherheitsanforderungen finden Sie unter Sicherheitshinweise im Teil Legal, Safety and Environmental Information dieses Dokuments oder dieses Dokumentations-satzes.

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    Table of contentsThis document has 20 pages.

    Summary of changes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

    1 HDS-C overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

    2 HDS-C capacity and performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

    3 HDS-C structure. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 103.1 Mechanical structure of HDS-C and HDD tray. . . . . . . . . . . . . . . . . . . . 103.1.1 Mechanical structure of HDS-C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 103.1.2 Mechanical structure of HDD tray . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113.2 Logical structure of the HDS-C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 123.3 External interfaces of HDS-C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

    4 HDS-C operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

    5 HDS-C power consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

    6 Jumper settings of HDS-C C111977 . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

    7 HDS-C connector maps. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

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    List of figuresFigure 1 Operational environment of the HDS-C . . . . . . . . . . . . . . . . . . . . . . . . . . 8Figure 2 HDS-C layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11Figure 3 HDD tray layout. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12Figure 4 Block diagram of HDS-C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13Figure 5 Front panel of the HDS-C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

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    List of tablesTable 1 Power consumption of HDS-C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16Table 2 Pin map of backplane connector 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18Table 3 Pin map of backplane connector 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18Table 4 Pin map of mini-SAS connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19Table 5 Pin map of PCI-E connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

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    HDS-C Summary of changes

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    Summary of changesChanges between document issues are cumulative. Therefore, the latest document issue contains all changes made to previous issues.

    Please note that the issue numbering system, safety information, and product naming practice are changing. For more information, see Guide to WCDMA RAN and I-HSPA Operating Documentation.

    Changes between Issues 01 (2010-05-25, WCDMA RAN RU30) and 01A (2011-11-30, WCDMA RAN RU30)HDS-C capacity and performance (2) The capacity 300 GB is added.HDS-C power consumption (5) Table 1 is updated.Issue 01First issue.

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    HDS-C overview

    1 HDS-C overviewMain functions of HDS-CHard Disk SAS Variant C (HDS-C) is a mass memory plug-in unit which is used to imple-ment a non-volatile memory for program code and data in RNC. HDS-C connects to the OMU via the PCI-E link.

    Operating environment of HDS-CThe HDS-C plug-in unit works with the OMU units. The computer unit serves one PCI-E link which connects to the HDS-C through the external cable. The HDS-C has two SAS ports, one connects to the Hard Disk Drive (HDD) on the HDS-C unit, and the other to the HDD on the redundant HDS-C unit.

    The HDS-C plug-in unit is connected to the hardware management bus via the bus inter-face of the HMSS. HDS-C has a service terminal interface via the back connector.

    The HMSS has a separate power feed in 2N redundancy.

    The HDS-C gets -48 V DC supply and 5.35 V HMSS power from the back connectors. The operational environment of HDS-C is shown in Figure 1 Operational environment of the HDS-C.

    Figure 1 Operational environment of the HDS-C

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    OMU

    WDU

    SAS

    PCI-E

    PCI-E

    PCI-E

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    HDS-C HDS-C capacity and performance

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    2 HDS-C capacity and performanceHard disks

    One 2.5-inch SAS disk (HDS14-A) is used 147 GB or 300 GB formatted storage capacity for each disk Average seek time: 3.8 ms for reading and 4.3 ms for writing HDD data transfer rate: maximum 600 MB/s HDS-C data transfer rate: maximum 300 MB/sSAS interfaces

    Two SAS ports with data transfer rate 1.5 Gb/s or 3 Gb/sPCI-E link

    x4 PCI-E link

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    HDS-C structure

    3 HDS-C structure

    3.1 Mechanical structure of HDS-C and HDD tray

    3.1.1 Mechanical structure of HDS-CThe HDS-C plug-in unit is implemented with a single standard IPA2800 full size printed wiring board (PWB). The size of the PWB is 265 mm by 287.3 mm (height x length). The nominal thickness of the board is 2.0 mm.

    The front panel is connected to the PWB using 6 screws (M2.5X6). There are two holes for the LED-PIPEs, one mini-SAS connector, one QSFP connector and one HDD tray on the front panel.

    There are two HDD tray guides at the PWB for HDD tray installation. The HDD tray guides are connected to the PWB with screws. A stiffener is connected with screws to the PWB to strengthen the HDD tray guides. The HDD is installed to the HDD tray, which is then installed to the HDD tray guides.

    There are three different power voltages in HDS-C:

    HDD: +12 V and +5 V HMSS: +5.35 VFigure 2 HDS-C layout shows the HDS-C layout with the HDD tray uninstalled:

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    HDS-C HDS-C structure

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    Figure 2 HDS-C layout

    3.1.2 Mechanical structure of HDD trayThe size of the HDD tray is 98 mm x 142.7 mm (height x length).The size of the HDD tray front panel is 114 mm by 25 mm (height x width). The front panel includes two PF11 screws and two EMC gaskets. There are two holes for the LEDs on the front panel, and the LEDs connect with the HDD tray PWB through LED cables.

    The HDD tray is connected to the HDS-C PWB with two connectors: one is Tinman con-nector for high speed data transfer, and the other is for power supply. The HDD is con-nected to the HDD tray using the SAS connector and fastened to the HDD tray with screws.

    The layout of the HDD tray with the installed HDD is shown in Figure 3 HDD tray layout.

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    Stiffener

    HDD tray guides

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    HDS-C structure

    Figure 3 HDD tray layout

    3.2 Logical structure of the HDS-CThe HDS-C plug-in unit consists of the following hardware blocks:

    A Hard Disk Drives (HDD) HMS Slave Node (HMSS) Power SAS controller HDD hot swap controllerThe block diagram of the HDS-C unit is shown in Figure 4 Block diagram of HDS-C.

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    HDD

    HDD tray

    SAS connector

    Power connectorTinman connector

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    HDS-C HDS-C structure

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    Figure 4 Block diagram of HDS-C

    HDD blockHDD provides an interface to the SAS controller, which then serves as the interfaces to OMU and the other HDD on the redundant HDS-C unit.

    HMSS node blockThe Hardware Management System Slave node provides an interface to the Hardware Management System. HMS slave node collects alarm information and the node is also used for diagnosis.

    The Hardware Management System has its own bus so it is not dependent on the ATM-based messaging. It has its own power supply, which is separate from the plug-in unit's power supply. This is because the Hardware Management System has to remain oper-ational even if normal messaging and/or power distribution fails.

    Power blockThere is a power unit (DC/ DC converter) integrated in the HDS-C unit. It receives -48 V voltage from the backplane connector and generates the voltages in 5 V and 12 V for the hard drive.

    The HMSS node has its own power supply which is independent to the power supply of the plug-in unit. The power supply of the plug-in unit can be turned off via the HMSS. If the voltage level of the unit power supply is too low or too high, an alarm (A0) is gener-ated to the HMSS.

    HDD

    HDDhot plugcontroller

    SAScontroller

    HMSS-B

    Power

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    HDS-C structure

    SAS controllerThe SAS controller is a four-port, 3.0 Gbit/s SAS/ SATA controller that is compliant with the Fusion-MPT (Message Passing Technology) architecture. It provides a four-lane PCI Express interface, and supports the Integrated RAID technology.

    The SAS controller supports the PCI Express Base Specification (Revision 1.0a), and the ANSI Serial Attached SCSI Standard (Revision 1.1).

    The SAS/ SATA link rates for each SAS PHYs on the SAS controller can reach to 3.0 Gb/s or 1.5 Gb/s. Each port supports the SSP, SMP, STP, and SATA protocols.

    The SAS controller provides two 3.0 Gbit/s interfaces to the on-board HDD and the SAS controller on the redundant HDS-C unit, and one PCI-E interface to the OMU.

    HDD hot swap controllerThe hot swappable controller controls the power supply of the HDD and makes it possible to change the HDD without turnning off the plug-in unit.

    3.3 External interfaces of HDS-CFront panel interfacesThe following external interfaces of the HDS-C unit pass through the front panel:

    Mini-SAS interfaceThere is one min-SAS connector on the front panel, which connects to the redundant HDD on the redundant HDS-C unit.

    PCI-E x4 interfaceOne x4 PCI-E interface is provided through the shielded QSFP connector at the HDS-C front panel and it connects to the OMU. The x4 PCI-E interface operates at 10 GT/s and provides maximum data rate of 8 Gbit/s.

    Backplane interfacesThe HDS-C connects to the backplane with two 2.0 Hard Metric connectors. The con-nector modules are numbered from 1 to 2 from the top to the bottom. The upper-most connector in module 1 is an unshielded type-A connector with 110 positions. This con-nector is for multipurpose. The connector in module 2 is upper shielded type-B connec-tor. The numbering of the connector rows is from 1 to 50 from the top to the bottom.

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    HDS-C HDS-C operation

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    4 HDS-C operationFront panelThe size of the front panel is 285 mm by 25 mm (height x width). Figure 5 Front panel of the HDS-C shows the front panel of HDS-C.

    Figure 5 Front panel of the HDS-C

    The front panel has two levers and an EMC spring. The front panel is connected to the PWB with screws. There are two LEDs, one mini-SAS connector and one QSFP con-nector on the front panel. The HDD tray is connected to the front panel with screws.

    LED indicatorsThe front panel of the HDS-C plug-in unit contains two LEDs.

    Backplane connectorsThe HDS-C connects to the backplane with two 2.0 Hard Metric connectors. The con-nector modules are numbered as 1 to 2 from the top to the bottom. The upper-most con-nector in module 1 is unshielded type-A connector with 110 positions.This connector is for multi-purpose. The connector in module 2 is upper shielded type-B connector. The numbering of the connector rows is from 1 to 50 from the top to the bottom.

    For more information. see connector maps in the chapter HDS-C connector maps.

    HDS-C

    QSFP connector (PCI-E)

    Mini-SAS connector

    LED

    HDD tray

    LED

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    HDS-C power consumption

    5 HDS-C power consumptionThe operating voltage of HDS-C is -48 V from the backplane. Only the hard disk drives consume power from the DC/DC block on HDS-C.

    Table 1 Power consumption of HDS-C shows the the power consumption of HDS-C.

    Status Power consumption

    Typical load 8 - 12 W

    Maximum load 15 W

    Table 1 Power consumption of HDS-C

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    HDS-C Jumper settings of HDS-C C111977

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    6 Jumper settings of HDS-C C111977No jumpers should be set during normal operation.

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    HDS-C connector maps

    7 HDS-C connector mapsBackplane connectors

    E D C B A

    1 UB1 UB1 UB1 UB1 UB1

    2 - - - - -

    3 B0V1 B0V1 B0V1 B0V1 B0V1

    4 - - - - -

    5 UB2 UB2 UB2 UB2 UB2

    6 - - - - -

    7 B0V2 B0V2 B0V2 B0V2 B0V2

    8 - - - - -

    9 SLOT (4) SLOT (3) SLOT (2) SLOT (1) SLOT (0)

    10 GND HMS1_+5V SLOT (5) HMS0_+5V HMS_+5V

    11 HMSS_CAN1L HMSS_CAN1H GND HMSS_CAN0L HMSS_CAN0H

    12

    Coding area13

    14

    15 GND GND GND GND GND

    16 SYS_CLK_B- SYS_CLK_B+ GND SYS_CLK_A- SYS_CLK_A+

    17 GND GND GND GND GND

    18 TCK1 TMS1 TDI1 TDO1 -

    19 GND GND GND GND _JTAG1_EN

    20 TCK2 TMS2 TDI2 TDO2 _TRST2

    21 GND GND GND GND -

    22 - - - - -

    23 GND GND GND GND -

    24 - - - - -

    25 GND GND GND GND -

    Table 2 Pin map of backplane connector 1

    F E D C B A

    26 GND_C _HMSS_BSEN

    HMSS_RXD GND_C HMSS_TXD _HMSS_RESET

    27 GND_C - - GND_C - -

    28 GND_C - - GND_C - -

    Table 3 Pin map of backplane connector 2

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    HDS-C HDS-C connector maps

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    Front panel connectors

    29 GND_C - - GND_C - -

    30 GND_C - - GND_C - -

    31 GND_C - - GND_C - -

    32 GND_C - - GND_C - -

    33 GND_C - - GND_C - -

    34 GND_C - - GND_C - -

    35 GND_C - - GND_C - -

    36 GND_C - - GND_C - -

    37 GND_C - - GND_C - -

    38 GND_C - - GND_C - -

    39 GND_C - - GND_C - -

    40 GND_C - - GND_C - -

    41 GND_C - - GND_C - -

    42 GND_C - - GND_C - -

    43 GND_C - - GND_C - -

    44 GND_C - - GND_C - -

    45 GND_C - - GND_C - -

    46 GND_C - - GND_C - -

    47 GND_C - - GND_C - -

    48 GND_C - - GND_C - -

    49 GND_C - - GND_C - -

    50 GND_C - - GND_C - -

    Pin# Definition In/out Pin# Definition In/out

    A1 GND - B1 GND -

    A2 SAS_0_TX1+ Out B2 OMU_HDD_RX1+ In

    A3 SAS_0_TX1- Out B3 OMU_HDD_RX1- In

    A4 GND - B4 GND -

    A5 SAS_0_RX1+ In B5 OMU_HDD_TX1+ Out

    A6 SAS_0_RX1- In B6 OMU_HDD_TX1- Out

    A7 GND - B7 GND -

    A8 - - B8 - -

    A9 - - B9 - -

    Table 4 Pin map of mini-SAS connector

    F E D C B A

    Table 3 Pin map of backplane connector 2 (Cont.)

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    HDS-C connector maps

    A10 GND - B10 GND -

    A11 - - B11 - -

    A12 - - B12 - -

    A13 GND - B13 GND -

    Pin# Definition In/out Pin# Definition In/out

    A1 Signal Ground (GND) - B19 Signal Ground (GND) -

    A2 PCI-E_TX2- Out B18 PCI-E_RX2- In

    A3 PCI-E_TX2+ Out B17 PCI-E_RX2+ In

    A4 Signal Ground (GND) - B16 Signal Ground (GND) -

    A5 PCI-E_TX4- Out B15 PCI-E_RX4- In

    A6 PCI-E_TX4+ Out B14 PCI-E_RX4+ In

    A7 Signal Ground (GND) - B13 Signal Ground (GND) -

    A8 GND - B12 - -

    A9 GND - B11 Reset_in In

    A10 Signal Ground (GND) - B10 Signal Ground (GND) -

    A11 PCI-E_CLK+ In B9 GND

    A12 PCI-E_CLK- In B8 GND -

    A13 Signal Ground (GND) - B7 Signal Ground (GND) -

    A14 PCI-E_RX3+ In B6 PCI-E_TX3+ Out

    A15 PCI-E_RX3- In B5 PCI-E_TX3- Out

    A16 Signal Ground (GND) - B4 Signal Ground (GND) -

    A17 PCI-E_RX1+ In B3 PCI-E_TX1+ Out

    A18 PCI-E_RX1- In B2 PCI-E_TX1- Out

    A19 Signal Ground (GND) - B1 Signal Ground (GND) -

    Table 5 Pin map of PCI-E connector

    Pin# Definition In/out Pin# Definition In/out

    Table 4 Pin map of mini-SAS connector (Cont.)

    HDS-CTable of contentsList of figuresList of tablesSummary of changes1HDS-C overview2HDS-C capacity and performance3HDS-C structure3.1Mechanical structure of HDS-C and HDD tray3.1.1Mechanical structure of HDS-C3.1.2Mechanical structure of HDD tray

    3.2Logical structure of the HDS-C3.3External interfaces of HDS-C

    4HDS-C operation5HDS-C power consumption6Jumper settings of HDS-C C1119777HDS-C connector maps