Rf Id Bioengineering 2

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    Neuromuscular

    Stimulator,

    G. Loeb, USC

    Power

    M2A Endoscopy

    Capsule, Given Imaging

    Neural Recording Probe,

    R. Bashirullah, UFSize

    Multichannel Microsystem

    for Neural Recording,

    A. Sodagar, U. Michigan

    Functionality and

    Performance

    Cochlear Chip Scale Packaging,

    P. Seligman, Cochlear, Ltd.

    Figure 1.Parameterization of various biomedical hardware approaches in terms of size, power and functionality.

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    0 0 0 0

    InductiveLink

    ReverseData In

    VDropout

    VReg

    VReg

    ForwardData Out

    ReverseData Out

    EnvelopeDetector

    EnvelopeDetector

    ReflectedImpedance

    Class-EControl

    Regulator

    Back

    Telemetry

    110 0 0 011

    CurrentSense

    Figure 2.Basic inductive link components and architecture for wireless power anddata transfer.

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    Carrier

    Sync Bits

    Carrier

    Sync Bits

    Sideband

    Sync Bits

    Data Data

    Data

    Buffer

    Buffer

    PA

    Antenna Antenna

    Antenna

    LO

    (900 MHz,

    2.4 GHz)

    LO

    (900 MHz,

    2.4 GHz)

    Backscatter900 MHz,

    2.4 GHzLO

    (110 MHz)

    (b)

    (c)

    (a)

    Figure 3.Simplified block diagrams of data transmissionstrategies for biomedical devices.

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    Memory

    TelemetryCircuit

    Physiologic

    Sensor

    Battery PowerManagement

    System

    ProgrammableLogic, Timing

    Cotrol,and TherapyAlgorithms

    A/DConverters

    andDetectors

    Sensingand

    FilteringAmplifiers

    ElectrodeConfig

    Switches

    High-VoltageOutput Pulse

    GeneratorHigh VoltageMultiplier

    Monitoring,MeasuringSystem and

    ADC

    Voltageand CurrentReferanceGenerators

    Pulse Generator

    Pacing Leads

    Left Atrium

    Right Atrium

    Left Ventricle

    Right Ventricle

    ulse

    Paci

    Left

    Left

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    Interconnect Cable

    Subcutaneous Cable

    Power Receiver,Data Receiver,Microstimulator

    External Transmitter

    Camera in theEye Glass

    Power

    Transmitter

    Power Recovery

    VoltageRegulators

    ElectrodeStatus

    ReverseTelemetry

    Clock Recovery

    SignalProcessing

    and

    Computation

    Data Receiver

    Electrodes

    Power Control

    Reverse TelemetryDetection

    External ControlUnit and

    Startup Circuitry

    Data Transmitter

    Data Link

    Power Link

    Output

    Drivers

    Power

    ransm er

    Power Recovery

    VoltageRegulators

    ElectrodeStatus

    ReversTelemetry

    Clock Recovery

    SignalProcessing

    and

    Computation

    Data Receiver

    Electrode

    Power Control

    everse e emetryDetection

    External ControlUnit and

    Startup Circuitry

    Data Transmitter

    a a n

    Power Link

    utput

    Drivers

    (a)

    (b)

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    Power Receiving Coil(Au)on Polyimide with CeramicFerrite Backing

    Integrated CircuitwithNeural Amplifiers, SignalProcessing, and RFTelemetry Electronics

    SMD Capacitor(0402 Package)1.2 mm

    400-m Pitch

    Utah Microelectrode Array

    Bulk Micromachined Siliconwith Platinum Tips and GlassIsolation Between Shanks 2 mm

    (a) (b)

    Figure 8.Conceptual diagrams of neural microsystems for brain computer interfaces: (a) two-dimensional and three-dimensional arrays of cortically implanted electrodes with ribbon cables connecting them to a subcutaneous electronics [41]and (b) neural interface (INI) assembly concept with Utah Microelectrode Array [42].

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    (a) (b)

    Figure 9.Ingestible capsules: (a) an electronic pill for medication

    adherence monitoring [48] (reprinted with permission), and(b) Given Ima in M2A endoscopic capsule [53].

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    TABLE IV

    SENSITIVITY TOINSULATORTHICKNESS FOR I MPLANTATIONS AT

    LOCATIONS(1 ) AN D (3 )

    Location (1): Sub-dermal Chest Implant

    # layers 6 m Maximum distance (cm)plastic insulator skin to scanner

    M C Q O1 3.5 4.5 3 22 4.5 7.5 5 3.53 5.5 8 6 5

    Location (3): Cerebral Implant

    # layers 6 m Maximum distance (cm)plastic insulator skin to scanner

    M C Q O

    1 3 6 5 42 4 6.5 6 4.53 5.5 7.5 6 7

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    Fig. 2. Block diagram of the FSK demodulator.

    TABLE II

    MEASUREDRESULTS ANDSPECIFICATIONS OFFSK DEMODULATORCIRCUITS

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    Fig. 1. Schematic diagram of the reader system under consideration for passive chipless RFID sensor tags.

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    TABLE ITYPICALSGTIN-96 EPC DATASTRUCTURE

    TABLE IIPARTITIONING OF THESERIALNUMBERFIELD

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    Fig. 4. Microstrip triangular antenna with an ethylene sensor fabricated as loadto the antenna [22].

    Fig. 5. Output from theanalog reader section when thepassive RFID sensortagis exposed to different concentrations of ethylene gas. The solid line representsthe linear fit to the displayed measured data points. At each concentration, thedisplayed data points are for measurements conducted on different days.

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    Fig. 7. (a) Prototype of microstrip triangular antenna and meandered transmis-sion lines ID circuit for 3- bit code (110) generation. (b) (Sensor) capacitor in-tegrated at the end of the transmission line.

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    Fig. 6. Schematic illustration of code generation using reflected pulses, in PPMrepresentation.

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