REVERSE COSTING® STRUCTURAL, PROCESS & COST REPORT · Cost Analysis 106 o Cost Analysis NIR CIS o...

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22 bd Benoni Goulin 44200 NANTES - FRANCE +33 2 40 18 09 16 [email protected] www.systemplus.fr Smartphone 3D Sensing Modules Comparison 2020 Technical choices and cost comparison of 3D sensing modules with a focus on VCSELs and NIR CIS SP20531 - IMAGING report by Taha AYARI Laboratory analysis by Nicolas RADUFFE June 2020 – Sample REVERSE COSTING® – STRUCTURAL, PROCESS & COST REPORT

Transcript of REVERSE COSTING® STRUCTURAL, PROCESS & COST REPORT · Cost Analysis 106 o Cost Analysis NIR CIS o...

Page 1: REVERSE COSTING® STRUCTURAL, PROCESS & COST REPORT · Cost Analysis 106 o Cost Analysis NIR CIS o Sony o 1st gen o Total Wafer and Die Cost o 2nd gen o Omnivision o STMicroelectronics

©2020 by System Plus Consulting | Smartphone 3D Sensing Module Comparison 2020 | Sample 1

22 bd Benoni Goulin44200 NANTES - FRANCE +33 2 40 18 09 16 [email protected] www.systemplus.fr

Smartphone 3D Sensing Modules Comparison 2020Technical choices and cost comparison of 3D sensing modules with a focus on VCSELs and NIR CIS

SP20531 - IMAGING report by Taha AYARILaboratory analysis by Nicolas RADUFFE

June 2020 – Sample

REVERSE COSTING® – STRUCTURAL, PROCESS & COST REPORT

Page 2: REVERSE COSTING® STRUCTURAL, PROCESS & COST REPORT · Cost Analysis 106 o Cost Analysis NIR CIS o Sony o 1st gen o Total Wafer and Die Cost o 2nd gen o Omnivision o STMicroelectronics

©2020 by System Plus Consulting | Smartphone 3D Sensing Module Comparison 2020 | Sample 2

Table of ContentsOverview / Introduction 4

o Executive Summary

o Glossary

Company Profile 7

Market Analysis 17

3D sensing in smartphone 21

o Technology Overviewo Module Integration

o Structured Lighto Time-of-Flighto Release Timelineo Apple: iPhone x, iPhone 11o Xiaomi: Mi8 Explorero Oppo: FindX, Rx17 proo Huawei: Mate 20 pro, P30 proo Vivo: Nex Dual Displayo LG: G8 ThinQo Samsung: Galaxy note 10+, Galaxy S10

Physical Analysis 106

o Physical Analysis NIR CISo Sony

o 1st geno Die Overview & Dimensionso Die Processo Die Cross-Sectiono Die Process Characteristic

o 2nd geno Omnivisiono STMicroelectronicso Infineon/PMDo Panasonic

o Physical Analysis NIR VCSELo Lumentum

o Die Overview & Dimensionso Die Processo Die Cross-Sectiono Die Process Characteristic

o ams

o Trumpf

Cost Analysis 106

o Cost Analysis NIR CISo Sony

o 1st geno Total Wafer and Die Cost

o 2nd geno Omnivisiono STMicroelectronicso Infineon/PMDo Panasonic

o Physical Analysis NIR VCSELo Lumentum

o Total Wafer and Die Costo amso Trumpf

Technical & Cost Comparison 216

o Dot Projector

o NIR Camera module

o Time of Flight Camera module

o NIR CIS die Comparison

o VCSEL Die Comparison

Customer Feedbacks 222

Company services 224

Page 3: REVERSE COSTING® STRUCTURAL, PROCESS & COST REPORT · Cost Analysis 106 o Cost Analysis NIR CIS o Sony o 1st gen o Total Wafer and Die Cost o 2nd gen o Omnivision o STMicroelectronics

©2020 by System Plus Consulting | Smartphone 3D Sensing Module Comparison 2020 | Sample 3

Overview / Introductiono Executive Summaryo Glossary

Company Profile

Market Analysis

3D sensing in smartphones

Physical Analysis

Cost Analysis

Technical & Cost Comparison

Feedbacks

Related Reports

About System Plus

3D sensing modules in smartphones – Report scope

o In this report, we focus on 11 3D sensing modules found in smartphones from major OEMs.

o There is three key players of NIR VCSELs: Lumentum, ams and Trumpf. Sony’s NIR sensors are dominating the ToF market while

Omnivision is the main provider of NIR sensors for structured light.

Page 4: REVERSE COSTING® STRUCTURAL, PROCESS & COST REPORT · Cost Analysis 106 o Cost Analysis NIR CIS o Sony o 1st gen o Total Wafer and Die Cost o 2nd gen o Omnivision o STMicroelectronics

©2020 by System Plus Consulting | Smartphone 3D Sensing Module Comparison 2020 | Sample 4

Overview / Introduction

Company Profile

Market Analysis

3D sensing in smartphoneso Technology overviewo Module integration

o Structured Lighto Time-of-Flighto Release Timelineo Appleo Xiaomio Oppoo Huaweio Vivoo LGo Samsung

Physical Analysis

Cost Analysis

Technical & Cost Comparison

Feedbacks

Related Reports

About System Plus

Apple iPhone X , iPhone 11 - Dot Projector

Dot Projector – Opened View©2020 by System Plus Consulting

VCSEL

Bottom Lenses Substrate

Light Guide

The optical block is glued on top of the ceramic substrate.

Page 5: REVERSE COSTING® STRUCTURAL, PROCESS & COST REPORT · Cost Analysis 106 o Cost Analysis NIR CIS o Sony o 1st gen o Total Wafer and Die Cost o 2nd gen o Omnivision o STMicroelectronics

©2020 by System Plus Consulting | Smartphone 3D Sensing Module Comparison 2020 | Sample 5

Overview / Introduction

Company Profile

Market Analysis

3D sensing in smartphoneso Technology overviewo Module integration

o Structured Lighto Time-of-Flighto Release Timelineo Appleo Xiaomio Oppoo Huaweio Vivoo LGo Samsung

Physical Analysis

Cost Analysis

Technical & Cost Comparison

Feedbacks

Related Reports

About System Plus

Apple iPhone X , iPhone 11 – NIR Camera

Page 6: REVERSE COSTING® STRUCTURAL, PROCESS & COST REPORT · Cost Analysis 106 o Cost Analysis NIR CIS o Sony o 1st gen o Total Wafer and Die Cost o 2nd gen o Omnivision o STMicroelectronics

©2020 by System Plus Consulting | Smartphone 3D Sensing Module Comparison 2020 | Sample 6

Overview / Introduction

Company Profile

Market Analysis

3D sensing in smartphoneso Technology overviewo Module integration

o Structured Lighto Time-of-Flighto Release Timelineo Appleo Xiaomio Oppoo Huaweio Vivoo LGo Samsung

Physical Analysis

Cost Analysis

Technical & Cost Comparison

Feedbacks

Related Reports

About System Plus

Xiaomi Mi8 Explorer – Front Sensing Module

Page 7: REVERSE COSTING® STRUCTURAL, PROCESS & COST REPORT · Cost Analysis 106 o Cost Analysis NIR CIS o Sony o 1st gen o Total Wafer and Die Cost o 2nd gen o Omnivision o STMicroelectronics

©2020 by System Plus Consulting | Smartphone 3D Sensing Module Comparison 2020 | Sample 7

Overview / Introduction

Company Profile

Market Analysis

3D sensing in smartphoneso Technology overviewo Module integration

o Structured Lighto Time-of-Flighto Release Timelineo Appleo Xiaomio Oppoo Huaweio Vivoo LGo Samsung

Physical Analysis

Cost Analysis

Technical & Cost Comparison

Feedbacks

Related Reports

About System Plus

LG G8 ThinQ – ToF Module

Page 8: REVERSE COSTING® STRUCTURAL, PROCESS & COST REPORT · Cost Analysis 106 o Cost Analysis NIR CIS o Sony o 1st gen o Total Wafer and Die Cost o 2nd gen o Omnivision o STMicroelectronics

©2020 by System Plus Consulting | Smartphone 3D Sensing Module Comparison 2020 | Sample 8

Overview / Introduction

Company Profile

Market Analysis

3D sensing in smartphoneso Technology overviewo Module integration

o Structured Lighto Time-of-Flighto Release Timelineo Appleo Xiaomio Oppoo Huaweio Vivoo LGo Samsung

Physical Analysis

Cost Analysis

Technical & Cost Comparison

Feedbacks

Related Reports

About System Plus

Galaxy S10 & Galaxy Note 10+ – ToF

Samsung Galaxy Note10+ Overview ©2020 by System Plus ConsultingSamsung Galaxy S10 Overview ©2020 by System Plus Consulting

• The Galaxy S10 uses two ToF modules for 3D sensing; one in the front and one in the rear.

• For the Galaxy Note 10+, only one ToF is used in the rear for 3D sensing.

Front ToF module

Rear ToF moduleRear ToF module

Page 9: REVERSE COSTING® STRUCTURAL, PROCESS & COST REPORT · Cost Analysis 106 o Cost Analysis NIR CIS o Sony o 1st gen o Total Wafer and Die Cost o 2nd gen o Omnivision o STMicroelectronics

©2020 by System Plus Consulting | Smartphone 3D Sensing Module Comparison 2020 | Sample 9

Overview / Introduction

Company Profile

Market Analysis

3D sensing in smartphones

Physical Analysiso Physical Analysis NIR CIS

o Sonyo 1st Geno 2nd Gen

o Omnivisiono STMicroelectronicso Infineon/PMDo Panasonic

o Physical Analysis NIR VCSELo Lumentumo Amso Trumpf

Cost Analysis

Technical & Cost Comparison

Feedbacks

Related Reports

About System Plus

Sony

Sony’s 1st generation NIR CIS - Overview©2020 by System Plus Consulting

Sony’s 2nd generation NIR CIS - Overview©2020 by System Plus Consulting

Pictures at scale

Page 10: REVERSE COSTING® STRUCTURAL, PROCESS & COST REPORT · Cost Analysis 106 o Cost Analysis NIR CIS o Sony o 1st gen o Total Wafer and Die Cost o 2nd gen o Omnivision o STMicroelectronics

©2020 by System Plus Consulting | Smartphone 3D Sensing Module Comparison 2020 | Sample 10

Overview / Introduction

Company Profile

Market Analysis

3D sensing in smartphones

Physical Analysiso Physical Analysis NIR CIS

o Sonyo 1st Geno 2nd Gen

o Omnivisiono STMicroelectronicso Infineon/PMDo Panasonic

o Physical Analysis NIR VCSELo Lumentumo Amso Trumpf

Cost Analysis

Technical & Cost Comparison

Feedbacks

Related Reports

About System Plus

Sony’s 1st generation NIR CIS in OPPO Rx17 pro – Sensor Die Overview

Die Sensor - Overview©2020 by System Plus Consulting

Page 11: REVERSE COSTING® STRUCTURAL, PROCESS & COST REPORT · Cost Analysis 106 o Cost Analysis NIR CIS o Sony o 1st gen o Total Wafer and Die Cost o 2nd gen o Omnivision o STMicroelectronics

©2020 by System Plus Consulting | Smartphone 3D Sensing Module Comparison 2020 | Sample 11

Overview / Introduction

Company Profile

Market Analysis

3D sensing in smartphones

Physical Analysiso Physical Analysis NIR CIS

o Sonyo 1st Geno 2nd Gen

o Omnivisiono STMicroelectronicso Infineon/PMDo Panasonic

o Physical Analysis NIR VCSELo Lumentumo Amso Trumpf

Cost Analysis

Technical & Cost Comparison

Feedbacks

Related Reports

About System Plus

Sony’s 2nd generation NIR CIS in Galaxy Note 10+ Image Sensor Process Characteristics

Page 12: REVERSE COSTING® STRUCTURAL, PROCESS & COST REPORT · Cost Analysis 106 o Cost Analysis NIR CIS o Sony o 1st gen o Total Wafer and Die Cost o 2nd gen o Omnivision o STMicroelectronics

©2020 by System Plus Consulting | Smartphone 3D Sensing Module Comparison 2020 | Sample 12

Overview / Introduction

Company Profile

Market Analysis

3D sensing in smartphones

Physical Analysiso Physical Analysis NIR CIS

o Sonyo 1st Geno 2nd Gen

o Omnivisiono STMicroelectronicso Infineon/PMDo Panasonic

o Physical Analysis NIR VCSELo Lumentumo Amso Trumpf

Cost Analysis

Technical & Cost Comparison

Feedbacks

Related Reports

About System Plus

Omnivision NIR CIS in Huawei Mate 20 pro – Pixels

Page 13: REVERSE COSTING® STRUCTURAL, PROCESS & COST REPORT · Cost Analysis 106 o Cost Analysis NIR CIS o Sony o 1st gen o Total Wafer and Die Cost o 2nd gen o Omnivision o STMicroelectronics

©2020 by System Plus Consulting | Smartphone 3D Sensing Module Comparison 2020 | Sample 13

Overview / Introduction

Company Profile

Market Analysis

3D sensing in smartphones

Physical Analysiso Physical Analysis NIR CIS

o Sonyo 1st Geno 2nd Gen

o Omnivisiono STMicroelectronicso Infineon/PMDo Panasonic

o Physical Analysis NIR VCSELo Lumentumo Amso Trumpf

Cost Analysis

Technical & Cost Comparison

Feedbacks

Related Reports

About System Plus

LumentumVCSEL Dies

VCSEL flood illuminator in OPPO Rx 17 pro

VCSEL flood illuminator in Huawei P30 proPictures at scale

Huawei Mate 30 pro

Page 14: REVERSE COSTING® STRUCTURAL, PROCESS & COST REPORT · Cost Analysis 106 o Cost Analysis NIR CIS o Sony o 1st gen o Total Wafer and Die Cost o 2nd gen o Omnivision o STMicroelectronics

©2020 by System Plus Consulting | Smartphone 3D Sensing Module Comparison 2020 | Sample 14

Overview / Introduction

Company Profile

Market Analysis

3D sensing in smartphones

Physical Analysiso Physical Analysis NIR CIS

o Sonyo 1st Geno 2nd Gen

o Omnivisiono STMicroelectronicso Infineon/PMDo Panasonic

o Physical Analysis NIR VCSELo Lumentumo Amso Trumpf

Cost Analysis

Technical & Cost Comparison

Feedbacks

Related Reports

About System Plus

Lumentum – OPPO Rx17 pro flood illuminator - NIR VCSEL Die View and Dimensions

OPPO Rx17 pro flood illuminator - VCSEL Die - Overview©2020 by System Plus Consulting

Page 15: REVERSE COSTING® STRUCTURAL, PROCESS & COST REPORT · Cost Analysis 106 o Cost Analysis NIR CIS o Sony o 1st gen o Total Wafer and Die Cost o 2nd gen o Omnivision o STMicroelectronics

©2020 by System Plus Consulting | Smartphone 3D Sensing Module Comparison 2020 | Sample 15

Overview / Introduction

Company Profile

Market Analysis

3D sensing in smartphones

Physical Analysiso Physical Analysis NIR CIS

o Sonyo 1st Geno 2nd Gen

o Omnivisiono STMicroelectronicso Infineon/PMDo Panasonic

o Physical Analysis NIR VCSELo Lumentumo Amso Trumpf

Cost Analysis

Technical & Cost Comparison

Feedbacks

Related Reports

About System Plus

ams – VCSEL Die Cross-Section

VCSEL Die Cross-Section – SEM View©2020 by System Plus Consulting

Page 16: REVERSE COSTING® STRUCTURAL, PROCESS & COST REPORT · Cost Analysis 106 o Cost Analysis NIR CIS o Sony o 1st gen o Total Wafer and Die Cost o 2nd gen o Omnivision o STMicroelectronics

©2020 by System Plus Consulting | Smartphone 3D Sensing Module Comparison 2020 | Sample 16

Overview / Introduction

Company Profile

Market Analysis

3D sensing in smartphones

Physical Analysiso Physical Analysis NIR CIS

o Sonyo 1st Geno 2nd Gen

o Omnivisiono STMicroelectronicso Infineon/PMDo Panasonic

o Physical Analysis NIR VCSELo Lumentumo Amso Trumpf

Cost Analysis

Technical & Cost Comparison

Feedbacks

Related Reports

About System Plus

Trumpf – VCSEL die Cross-Section

Page 17: REVERSE COSTING® STRUCTURAL, PROCESS & COST REPORT · Cost Analysis 106 o Cost Analysis NIR CIS o Sony o 1st gen o Total Wafer and Die Cost o 2nd gen o Omnivision o STMicroelectronics

©2020 by System Plus Consulting | Smartphone 3D Sensing Module Comparison 2020 | Sample 17

Overview / Introduction

Company Profile

Market Analysis

3D sensing in smartphones

Physical Analysis

Cost Analysis o Cost Analysis NIR CIS

o Sonyo 1st geno 2nd gen

o Omnivisiono STMicroelectronicso Infineon/PMDo Panasonic

o Cost Analysis NIR VCSELo Lumentumo amso Trumpf

Technical and Cost Comparison

Feedbacks

Related Reports

About System Plus

Sony’s 1st generation NIR CIS in OPPO Rx17 pro –Wafer & Die Cost

Page 18: REVERSE COSTING® STRUCTURAL, PROCESS & COST REPORT · Cost Analysis 106 o Cost Analysis NIR CIS o Sony o 1st gen o Total Wafer and Die Cost o 2nd gen o Omnivision o STMicroelectronics

©2020 by System Plus Consulting | Smartphone 3D Sensing Module Comparison 2020 | Sample 18

Overview / Introduction

Company Profile

Market Analysis

3D sensing in smartphones

Physical Analysis

Cost Analysis o Cost Analysis NIR CIS

o Sonyo 1st geno 2nd gen

o Omnivisiono STMicroelectronicso Infineon/PMDo Panasonic

o Cost Analysis NIR VCSELo Lumentumo amso Trumpf

Technical and Cost Comparison

Feedbacks

Related Reports

About System Plus

Lumentum – OPPO Rx17 pro flood illuminator - Wafer & Die Cost

Page 19: REVERSE COSTING® STRUCTURAL, PROCESS & COST REPORT · Cost Analysis 106 o Cost Analysis NIR CIS o Sony o 1st gen o Total Wafer and Die Cost o 2nd gen o Omnivision o STMicroelectronics

©2020 by System Plus Consulting | Smartphone 3D Sensing Module Comparison 2020 | Sample 19

Overview / Introduction

Company Profile

Market Analysis

3D sensing in smartphones

Physical Analysis

Cost Analysis

Technical & Cost Comparisono Dot Projector o NIR Camera moduleo Time of Flight Camera

moduleo NIR CIS die Comparisono VCSEL Die Comparison

Feedbacks

Related Reports

About System Plus

DOT Projector Comparison

Page 20: REVERSE COSTING® STRUCTURAL, PROCESS & COST REPORT · Cost Analysis 106 o Cost Analysis NIR CIS o Sony o 1st gen o Total Wafer and Die Cost o 2nd gen o Omnivision o STMicroelectronics

©2020 by System Plus Consulting | Smartphone 3D Sensing Module Comparison 2020 | Sample 20

Overview / Introduction

Company Profile

Market Analysis

3D sensing in smartphones

Physical Analysis

Cost Analysis

Technical & Cost Comparisono Dot Projector o NIR Camera moduleo Time of Flight Camera

moduleo NIR CIS die Comparisono VCSEL Die Comparison

Feedbacks

Related Reports

About System Plus

NIR CIS Comparison

Page 21: REVERSE COSTING® STRUCTURAL, PROCESS & COST REPORT · Cost Analysis 106 o Cost Analysis NIR CIS o Sony o 1st gen o Total Wafer and Die Cost o 2nd gen o Omnivision o STMicroelectronics

©2020 by System Plus Consulting | Smartphone 3D Sensing Module Comparison 2020 | Sample 21

Overview / Introduction

Company Profile

Market Analysis

3D sensing in smartphones

Physical Analysis

Technical & Cost Comparison

Feedbacks

Related Reports

About System Plus

Related Reports

MARKET AND TECHNOLOGY REPORTS - YOLE DÉVELOPPEMENT

IMAGING• 3D Imaging & Sensing 2020• Status of the Camera Module Industry 2019 – Focus on Wafer

Level Optics• CMOS Image Sensor Quarterly Market Monitor• Status of the CMOS Image Sensor Industry 2019• VCSELs - Technology, Industry and Market Trends 2019

REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING

IMAGING• Samsung Galaxy Note 10+ 3D Time of Flight Depth

Sensing Camera Module• VCSEL in Smartphone Comparison 2019• iPad Pro Lidar Module• Huawei’s 3D Depth Sensing System, 3D Camera, Flood

Illuminator and DOT projector in the Mate 20 Pro• STMicroelectronics’ Near Infrared Camera Sensor in the

Apple iPhone X• Apple iPhone X – Infrared Dot Projector• Orbbec’s Front 3D Depth Sensing System in the Oppo

Find X

Page 22: REVERSE COSTING® STRUCTURAL, PROCESS & COST REPORT · Cost Analysis 106 o Cost Analysis NIR CIS o Sony o 1st gen o Total Wafer and Die Cost o 2nd gen o Omnivision o STMicroelectronics

©2020 by System Plus Consulting | Smartphone 3D Sensing Module Comparison 2020 | Sample 22

COMPANYSERVICES

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©2020 by System Plus Consulting | Smartphone 3D Sensing Module Comparison 2020 | Sample 23

Overview / Introduction

Company Profile

Market Analysis

3D sensing in smartphones

Physical Analysis

Technical & Cost Comparison

Feedbacks

Related Reports

About System Pluso Company serviceso Contact

Business Model - Fields of Expertise

Custom Analyses(>130 analyses per year)

Reports(>60 reports per year)

Costing Tools

Trainings

Page 24: REVERSE COSTING® STRUCTURAL, PROCESS & COST REPORT · Cost Analysis 106 o Cost Analysis NIR CIS o Sony o 1st gen o Total Wafer and Die Cost o 2nd gen o Omnivision o STMicroelectronics

©2020 by System Plus Consulting | Smartphone 3D Sensing Module Comparison 2020 | Sample 24

Overview / Introduction

Company Profile

Market Analysis

3D sensing in smartphones

Physical Analysis

Technical & Cost Comparison

Feedbacks

Related Reports

About System Pluso Company serviceso Contact

Contact

Headquarters22 bd Benoni Goullin44200 NantesFRANCE+33 2 40 18 09 [email protected]

Europe Sales OfficeLizzie LEVENEZFrankfurt am MainGERMANY+49 151 23 54 41 [email protected]

www.systemplus.fr

NANTESHeadquarters

FRANKFURT/MAINEurope Sales Office

LYONYOLE HQ

TOKYOYOLE KK

GREATER CHINAYOLE

KOREAYOLE

America Sales OfficeSteve LAFERRIEREWESTERN UST : +1 310 600 [email protected]

Chris YOUMANEASTERN US & CANADAT : +1 919 607 9839 [email protected]

Asia Sales OfficeTakashi ONOZAWATokyoJAPANT : +81 804 371 [email protected]

Mavis WANGTAIWANT :+886 979 336 809CN: [email protected]

CORNELIUSYOLE Inc.