Reflections on COTS in Avionics/Vetronics
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050420_reflections.pptBOEING is a trademark of Boeing Management Company.Copyright © 2005 Boeing. All rights reserved.
Reflections on COTS in Avionics/Vetronics The Use of COTS Assemblies in Harsh Environment Two-Level Maintenance Systems – May 12th, 2005
James A. Robles, Senior Technical FellowThe Boeing CompanyPhn: (206) 655-9062Email: [email protected]
BOE 042105-077
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Boeing Technology | Phantom Works
Copyright © 2005 Boeing. All rights reserved.BOE 042105-077
Context – The Environment Changed
We Won the Cold War Control of the Electronics Industry
Acquisition Reform New Generation of Users
0
10
20
30
40
1980 1990 2000 2010
Piece parts -mil-spec % of
total
Equipment -military % oftotal avionics
Source: AvionicsMagazine, 01/01
Source:TACTech,’95
Per
cen
t
Defense Outlays As a Share of Gross Domestic Product
2
4
6
8
10
12
50 60 70 80 90 003.0
GDP (%)
4.4 4.7
11.9%9.1%
6.3%
Year
1994 Perry Memo• Streamline procurement of reduce cycle
time and cost• Strengthen technology/industrial base• Increased access to advanced
technologies• Move away from the military
specification system
Not My Generation• Better educated and more aware of
technology• Not willing to tackle a difficult job with
obsolete hardware• Useful life reduced to correspond to
desired technology refresh cycle
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What My Customers Require on Advanced Fighters, Helicopters, and Ground Vehicles
• Minimize Total Ownership Cost (TOC)• Development Cost• Unit Recurring Flyaway (URF) Cost• Operation and Support (O&S) Cost
• High functional density to minimize weight and volume• Thermal density (watts/cm)
• Perform reliably in harsh environment ↑ Reduce thermal strains to improve inherent reliability↑ Uniformity of temperature distribution across module↓ Exposure to coolant↓ Complexity
• Compatibility with two-level maintenance• Facilitate insertion of new technology and mitigation of
component obsolescence• Thermal margin
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Obstacles to Wider Usage of Available COTS
Low Functional Density
Current standards do not meet the need
IEEE 1101.1 Air Cooled
IEEE 1101.2 Conduction Cooled
Not Compatible with Two-Level Maintenance Requires an ESD protected connector and covers for handling protection
Two to three times O&S cost penalty
F/A-22 example
Lack of a Standard for Environments
A Gaping hole in our “open architectures’
Exposes programs to risk with each DMS fix or upgrade cycle
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Enablers for Wider Usage of Tomorrow’s COTS
Higher Functional Density
Standards under development will meet the need
VITA 46
VITA 48
Compatible with Two-Level Maintenance
VITA 46 and VITA 48 will have an ESD protected connector
VITA 48 will provide optional covers for ESD and handling
We Have a Standard for Environments
Fills the gaping hole in our “open architectures’
ANSI VITA 47 is released
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The Thermal Management Challenge and Answer
• Thermal management challenge• More heat to remove• Less “potential” to drive it out
• Consequences• Unit Recurring Flyaway cost• Functional density – fuel cost
(O&S cost), lethality, survivability.• Reliability (O&S cost)• Margin for DMS fixes• Margin for technology insertion
• The answer --- VITA 48• Enhanced conduction cooling• Liquid Flow Through Cooling• Spray Cooling
Functional
Densit
y
Power per Function
Thermal Density
Allowable Component Temperature
Functional
Densit
y
Power per Function
Thermal Density
Allowable Component Temperature
Functional
Densit
y
Power per Function
Functional
Densit
y
Power per Function
Thermal Density
Allowable Component Temperature
Thermal Density
Allowable Component Temperature
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Outlook for the Future
• We are addressing the obstacles to wider usage of COTS assemblies in avionics/vetronics
• The environment will continue to change in ways that encourage the use of COTS
• We are at a tipping point – much wider use of COTS assemblies in harsh environment two-level maintenance systems
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