Recent Developments in Active Implants · Implantable leadless cardiac pacing device for treatment...
Transcript of Recent Developments in Active Implants · Implantable leadless cardiac pacing device for treatment...
Recent Developments in Active Implants
Innovation of interconnections for Active Implant Applications
Valtronic’s Overview
1) Introduction of Valtronic:
from Micro-technology to Medtech
2) Active Implants:
application of miniaturized assembly technologies
3) From industry to Medtech:
adaptation to specific constrains
30 Years in Micro Technology
1990 Electronic Module for Discovery Space Shuttle
1995 Chip for Formula One race
2000 World's smallest hearing aid
2006 World's smallest implantable pulse generator
2006 Retinal Implant for the Blind
2009 "Smart Pill" Wireless Motility Capsule
What Do We Mean By Smart?
An implant that is able to provide in-vivo diagnostic biofeedback
and/or treat a patient according to specific conditions
Smart Implants
Microsystem measuring and transmitting
diagnostic data during or after implantation
Needs to function in an autonomous way
during the lifespan of a product which
varies from six months to over fifty years
Monitoring Diabetics
Minimal Power Consumption – no battery
Tiny antenna and extreme miniaturization (COC, COB and 01005 SMD)
Assembled in a RF transparent, bio-compatible material housing
Measures 4mm thick x 17 mm diameter
Acquires, processes and analyzes brain activity
Implantable EEG Recorder
Allows ophthalmologists to observe the behavior of intraocular
pressure continuously, particularly during while sleeping
Treating Glaucoma
Built-in flexible electronics, silicone,
ultrasonic flip-chip process and clean
manufacturing
Preventing Heart Failure
Implantable leadless cardiac pacing
device for treatment of heart rhythm
management
Six-layer flex board, 2mil lines and
spaces, ENEPIG process.
Stimulate/pace the heart through wireless transmission of energy
Smart Implant Challenges
Reliable Processes
& Technology
Powering & Autonomy
Detection & Sensing
Interaction Communication Memory
&
Packaging / enclosure
Design Constraint Trends in Stimulation Field
More specific stimulation features:
More electrodes & leads
Innovative electrode design
Channel modulation
Device as minimally invasive as possible:
Smaller Implant size
Smaller and reliable interconnections
Application of micro-technology assembly
to Active implant device
• Long term reliability of assembly
• Extreme miniaturization
• High computation power at low power
Wire-bonding with over molding
Ultrasonic Flip-Chip
Miniaturization of micro-elecronics
Chip on Board
1.- Glue on substrate (FR4, Flex, G10 etc.)
2.- Die attach
3.- Wire bonding & testing
4.- Coating & testing
Miniaturization - Wire-Bonding with Over Molding
Internal electronic of a
cochlear implant
Chip-on-board assembly with 0201
components
Product lifetime 75 years!
.
Miniaturization - Ultrasonic Flip Chip Bonding
Assembly of flexible electronics in a silicone rubber lens
Clean manufacturing
10x faster than glued flip-chip
Lowest total cost of ownership
Allows ophthalmologists to observe the
behavior of intraocular pressure during
sleep.
PCB
PCB
DIE
DIE
PCB
PCB track
Ultrasonic Flip Chip
Underfill of non-conductive adhesive
PCB
Temperature + Pressure + Ultrasonic Power
DIE
High Density Ultra-Sonic Flip-Chip Process
Gold Bumping Ultrasonic Flip-Chip Dispensing
Applied to active Implant interconnection lead
High density Ultra-Sonic Flip-Chip Process Process Characteristics:
High Density Ultra-Sonic Flip-Chip Process
High Density Ultra-Sonic Flip-Chip
process
Reducing the required volume for the implants
Allowing innovative electrodes design
Ensuring the liability for long term implantation
Innovative Interconnection Technology means:
• Apply and adapt known technologies to “new” fields
• Adaptation to constrains :
• QA structure (ISO13485)
• EU/US regulation and norms application
• Clean Manufacturing
• Verified and validated processes
• Culture change
• Organization and business model adaptation
• Develop bridging technologies
How to get from Industry to Medtech?
Valtronic Core Competencies Contract Manufacturing & Engineering service for Medtechs’
SMT Fine pitch to 01005
3D chip-scale Wire bonding to 55µ density
Flip-chip <100µ pitch, HDI flex circuitry
5 axis CNC Machining, thread cutting, HSM
PEEK, Titanium, Pe-Hd, Chrome Cobalt, POM…
World-wide Supply Chain
DFM & DOE
Final packaging, sterilization & labeling
Project management
Valtronic at a Glance Today
Valtronic is a full-service provider of Engineering, Design and Contract
Manufacturing services.
We provide solutions ranging from micro-electronic and mechanical
parts to the design for manufacturing of complete devices.
Engineering Staff 70
Production Staff 480
Manufacturing Area 13’000 m2 of which 540 m2 clean room
(Class ISO 7 & 10K)
Served Markets Medical Devices (70%) and Select Industrial
No. of Class 3 Projects
(active implant) 22 projects in development, clinical trials or production
Dr. Peter Ruppersberg, CEO
The initial core competences in “Ultra-miniaturized”
assembly technologies are adapted to be the driver
bringing a high added-value to the Medtec world.
In conclusion
Route de Bonport 2 ~ 1343 Les Charbonnières ~ Switzerland ~ www.valtronic.com ~ +41 21 841 01 11
Thank you for your attention