Recap (so far) - Stanford University
Transcript of Recap (so far) - Stanford University
© 2008 Eric Pop, UIUC ECE 598EP: Hot Chips 1
Recap (so far)
• Ohm’s & Fourier’s Laws
• Mobility & Thermal Conductivity
• Heat Capacity
• Wiedemann-Franz Relationship
• Size Effects and Breakdown of Classical Laws
© 2008 Eric Pop, UIUC ECE 598EP: Hot Chips 2
Low-Dimensional &
Boundary Effects
• Energy Transport in Thin Films, Nanowires, Nanotubes
• Landauer Transport
− Quantum of Electrical and Thermal Conductance
• Electrical and Thermal Contacts
• Materials Thermometry
• Guest Lecture: Prof. David Cahill (MSE)
© 2008 Eric Pop, UIUC ECE 598EP: Hot Chips
L ~ 200 nm
Si
D
Si
Ox
• Size and Non-Equilibrium Effects
− optical-acoustic
− small heat source
− impurity scattering
− boundary scattering
− boundary resistance
• Macroscale (D >> L)
• Nanoscale (D < L)
QTkt
TC ss
Qee
evt
e
phon
eq
“Sub-Continuum” Energy Transport
Ox Me
tsi
© 2008 Eric Pop, UIUC ECE 598EP: Hot Chips
Thermal Simulation Hierarchy
4
defect
lattice wave
phononE
L
D
D ~ L
Waves & Atoms
Continuum
Fourier’s Law, FE
Phonon Transport
BTE & Monte Carlo
Waves & Atoms
MD & QMD
D ~
MFP ~ 200 nm at 300 K in Si
q
q nnnv
t
n
.
Tkq
"
Wavelength
© 2008 Eric Pop, UIUC ECE 598EP: Hot Chips
Thermal and Electrical Simulation
5
AtomisticP
ho
no
ns
Diffusion
BTE or
Monte Carlo
BTE with
Wave models
Dri
ft D
iffu
sio
n
BT
E
Mo
men
ts
Mo
nte
Carl
o
& B
TE
Mo
nte
Carl
o
wit
h Q
uan
tum
Mo
dels
Electrons
Fu
ll Q
uan
tum
Isothermal
~1 nm~5 nm
~100 nm~5 nmMFP
phononselectrons
© 2008 Eric Pop, UIUC ECE 598EP: Hot Chips
Nanowire Formation: “Bottom-Up”
• Vapor-Liquid-Solid (VLS) growth
• Need gas reactant as Si source
(e.g. silane, SiH4)
• Generated through
– Chemical vapor deposition (CVD)
– Laser ablation or MBE (solid target)
6
Lu & Lieber, J. Phys. D (2006)
© 2008 Eric Pop, UIUC ECE 598EP: Hot Chips
• “Top-down” = through
conventional lithography
• “Guided” growth = through porous
templates (anodic Al2O3)
– Vapor or electrochemical
deposition
7
Suspended nanowire (Tilke „03)
“Top-Down” and Templated Nanowires
© 2008 Eric Pop, UIUC ECE 598EP: Hot Chips
Semimetal-Semiconductor Transition
• Bi (bismuth) has
semimetal-semiconductor
transition at wire D ~ 50 nm
due to quantum
confinement effects
8
Source: M. Dresselhaus (MIT)
© 2008 Eric Pop, UIUC ECE 598EP: Hot Chips
When to Worry About Confinement
9
d
2-D Electrons 2-D Phonons
2
2 2
n n y z
nvk v k k
d
22
*2n
nE
m d
d
© 2008 Eric Pop, UIUC ECE 598EP: Hot Chips
Nanowire Applications
• Transistors
• Interconnects
• Thermoelectrics
• Heterostructures
• Single-electron devices
10
© 2008 Eric Pop, UIUC ECE 598EP: Hot Chips
Nanowire Thermal Conductivity
11
Li, Appl. Phys. Lett. 83, 3187 (2003)
Nanowire diameter
© 2008 Eric Pop, UIUC ECE 598EP: Hot Chips
Interconnects = Top-Down Nanowires
12
SEM of AMD‟s “Hammer” microprocessor in 130 nm CMOS with 9 copper layers
Intel 65 nm
Cross-section8 metal levels + ILD
TransistorM1 pitch
© 2008 Eric Pop, UIUC ECE 598EP: Hot Chips
Cu Resistivity Increase <100 nm Lines
• Size Matters
• Why?
• Remember
Matthiessen’s Rule
13
© 2008 Eric Pop, UIUC ECE 598EP: Hot Chips
Cu Interconnect Delays Increase Too
Source: ITRS http://www.itrs.net
14
© 2008 Eric Pop, UIUC ECE 598EP: Hot Chips
Industry Acknowledged Challenges
15
Source: ITRS http://www.itrs.net
© 2008 Eric Pop, UIUC ECE 598EP: Hot Chips
Cu Resistivity and Line Width
16
Steinhögl et al., Phys. Rev. B66 (2002)
© 2008 Eric Pop, UIUC ECE 598EP: Hot Chips
Modeling Cu Line Resistivity
17
Steinhögl et al., Phys. Rev. B66 (2002)
© 2008 Eric Pop, UIUC ECE 598EP: Hot Chips
Model Applications
18
Steinhögl et al., Phys. Rev. B66 (2002)
Plombon et al., Appl. Phys. Lett 89 (2006)
© 2008 Eric Pop, UIUC ECE 598EP: Hot Chips
Resistivity Temperature Dependence
19
© 2008 Eric Pop, UIUC ECE 598EP: Hot Chips
Other Material Resistivity and MFP
• Greater MFP (λ) means greater impact of “size effects”
• Will Aluminum get a second chance?!
20
© 2008 Eric Pop, UIUC ECE 598EP: Hot Chips
Same Effect for Thermal Conductivity!
• Material with longer (bulk, phonon-limited) MFP λ
suffers a stronger % decrease in conductivity in thin films
or nanowires (when d ≤ λ)
• Nanowire (NW) data by Li (2003), model Pop (2004)
21
0
10
20
30
40
50
60
70
80
0 50 100 150d (nm)
k (
W/m
/K) Thin Si
SiGe NW
Si NW
Thin Ge
Recall:
• bulk Si kth ~ 150 W/m/K
• bulk Ge kth ~ 60 W/m/K
Approximate bulk MFP‟s:
• λSi ~ 100 nm
• λGe ~ 60 nm
(at room temperature)
© 2008 Eric Pop, UIUC ECE 598EP: Hot Chips
Back-of-Envelope Estimates
22
0
10
20
30
40
50
60
70
80
0 50 100 150d (nm)
k (
W/m
/K) Thin Si
SiGe NW
Si NW
Thin Ge
1( )
3k d Cv
C
(MJm-3K-1)
λb
(nm)
vL
(m/s)
vT
(m/s)kb
(Wm-1K-1)
Si 1.66 ~100 9000 5330 150
Ge 1.73 ~60 5000 3550 60
1 1 1 1
b Gd D
(at room temperature)
© 2008 Eric Pop, UIUC ECE 598EP: Hot Chips
More Sophisticated Analytic Models
23
δ = d/λ < 1 S = (1 – δ2)1/2
Flik and Tien, J. Heat Transfer (1990) Goodson, Annu. Rev. Mater. Sci. (1999)
© 2008 Eric Pop, UIUC ECE 598EP: Hot Chips
A Few Other Scenarios
24
Goodson, Annu. Rev. Mater. Sci. (1999)
anisotropy
© 2008 Eric Pop, UIUC ECE 598EP: Hot Chips
Onto Nanotubes…
• Nanowires:
– “Shrunk-down” 3D cylinders of a larger solid (large surface area
to volume ratio)
– Diameter d typically < {electron, phonon} bulk MFP Λ: surface
roughness and grain boundary scattering important
– Quantum confinement does not play a role unless d < {electron,
phonon} wavelength λ ~ 1-5 nm (rarely!)
• Nanotubes:
– “Rolled-up” sheets of a 2D atomic plane
– There is “no” volume, everything is a surface*
– Diameter 1-3 nm (single-wall) comparable to wavelength λ so
nanotubes do have 1D characteristics
25
* people usually define “thickness” b ~ 0.34 nm
b
© 2008 Eric Pop, UIUC ECE 598EP: Hot Chips
Single-Wall Carbon Nanotubes
26
• Carbon nanotube = rolled up graphene sheet
• Great electrical properties
– Semiconducting Transistors
– Metallic Interconnects
– Electrical Conductivity σ ≈ 100 x σCu
– Thermal Conductivity k ≈ kdiamond ≈ 5 x kCu
HfO2
S (Pd) D (Pd)
SiO2
top gate (Al) CNT
d ~ 1-3 nm
• Nanotube challenges:
– Reproducible growth
– Control of electrical and thermal properties
– Going “from one to a billion”
© 2008 Eric Pop, UIUC ECE 598EP: Hot Chips
CVD Growth at ~900 oC
27
© 2008 Eric Pop, UIUC ECE 598EP: Hot Chips
Fe Nanoparticle-Assisted Nanotube Growth
• Particle size corresponds to nanotube diameter
• Catalytic particles (“active end”) remain stuck to substrate
• The other end is dome-closed
• Base growth
28
© 2008 Eric Pop, UIUC ECE 598EP: Hot Chips
Water-Assisted CVD and Breakdown
• People can also grow
“macroscopic” nanotube-
based structures
• Nanotubes break down at
~600 oC in O2, 1000 oC in N2
29
Hata et al., Science (2004)
in N2
in O2
© 2008 Eric Pop, UIUC ECE 598EP: Hot Chips
Graphite Electronic Structure
30
b ~ 3.4 Å
aCC ~ 1.42 Å
|a1| = |a2| = √3aCC
http://www.photon.t.u-tokyo.ac.jp/~maruyama/kataura/discussions.html
© 2008 Eric Pop, UIUC ECE 598EP: Hot Chips
Nanotube Electronic Structure
31
EG > 0
EG = 0
EG > 0
EG = 0
Collin
s a
nd A
vouris,
Scie
ntific A
merican
(2000)
© 2008 Eric Pop, UIUC ECE 598EP: Hot Chips
Band Gap Variation with Diameter
32
• Red: metallic
• Black: semiconducting
http://www.photon.t.u-tokyo.ac.jp/~maruyama/kataura/kataura.html
E11,M
E11,M
E22,M
E22,S
E11,S = EG
≈ 0.8/d
Charlier, Rev. Mod. Phys. (2007)
“Kataura plot”
© 2008 Eric Pop, UIUC ECE 598EP: Hot Chips
Nanotube Current Density ~ 109 A/cm2
• Nanotubes are nearly
ballistic conductors up to
room temperature
• Electron mean free path ~
100-1000 nm
33
S (Pd) D (Pd)
SiO2
CNT
G (Si)
Javey et al., Phys. Rev. Lett. (2004)
L = 60 nmVDS = 1 mV
© 2008 Eric Pop, UIUC ECE 598EP: Hot Chips 34
Transport in Suspended NanotubesE. Pop et al., Phys. Rev. Lett. 95, 155505 (2005)
SiO2
Si3N4
nanotube Pt
Pt gate
2 μmnanotube on
substrate suspended
over trench
• Observation: significant current degradation and negative
differential conductance at high bias in suspended tubes
• Question: Why? Answer: Tube gets HOT (how?)
© 2008 Eric Pop, UIUC ECE 598EP: Hot Chips 35
1
, ,
1 1 1eff
AC OP ems OP abs
Include OP absorption:
Transport Model Including Hot Phonons
),(
),(
4),(
2 TV
TVL
q
hRTVR
eff
eff
C
0( )OP AC ACT T T T
Non-equilibrium OP:
T0
TAC = TL
TOP
RTH
ROP
I2(R-Rc)
0 0.2 0.4 0.6 0.8 1 1.2
300
400
500
600
700
800
900
1000
V (V)
Ph
on
on
Te
mp
era
ture
(K
)
oxidation T
Optical TOP
Acoustic TAC
I2(R-RC)
TOP
TAC = TL
2( ) ( ) / 0CA k T I R R L
Heat transfer via AC:
Landauer electrical resistance
E. Pop et al., Phys. Rev. Lett. 95, 155505 (2005)
© 2008 Eric Pop, UIUC ECE 598EP: Hot Chips 36
Extracting SWNT Thermal Conductivity
• Ask the “inverse” question: Can I extract thermal properties from electrical data?
• Numerical extraction of k from the high bias (V > 0.3 V) tail of I-V data
• Compare to data from 100-300 K of UT Austin group (C. Yu, NL Sep’05)
• Result: first “complete” picture of SWNT thermal conductivity from 100 – 800 K
E. Pop et al., Nano Letters 6, 96 (2006)
Yu et al. (NL‟05)This work
~T
~1/T