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Detailed Service Manual Detailed Test Procedures Digital Multi-Service, Data-Capable Portable 465 465cmf

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Detailed Service Manual Detailed Test Procedures

Digital Multi-Service, Data-Capable Portable

465 465cmf

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465

Digital Multi-Service, Data-Capable Portable

Detailed Service Manual

Detailed Test Procedures

MAY 2009

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Manual Revisions

Changes that occur after this manual is printed are described in the Field Manual Revisions (FMRs). The FMRs provide the most current instructions and component information.

Copyright Information

The Motorola products described in this manual may include Motorola computer programs stored in semiconductor memories or other media that are copyrighted with all rights reserved worldwide to Motorola. Laws in the United States and other countries preserve for Motorola, Inc. certain exclusive rights to the copyrighted computer programs, including the exclusive right to copy, reproduce, modify, decompile, disassemble, and reverse-engineer the Motorola computer programs in any manner or form without Motorola’s prior written consent. Furthermore, the purchase of Motorola products shall not be deemed to grant either directly or by implication, estoppels, or otherwise, any license or rights under the copyrights, patents, or patent applications of Motorola, except for a nonexclusive license to use the Motorola product and the Motorola computer programs with the Motorola product.

Trademarks

MOTOROLA, the Stylized M Logo, Message Mail, VibraCall, and iDEN are registered trademarks of Motorola, Inc. ® Reg. U.S. Pat. & Tm. Off. All other product or service names are the property of their respective owners.

© Copyright 2007, Motorola, Inc. All rights reserved.

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S AF E T Y AN D G E N E R AL I N F O R M AT I O N

SAFETY AND GENERAL INFORMATION

This section contains important information on the safe and efficient operation of your mobile device. Read this information before using your integrated multi-service portable radio.*

Exposure to Radio Frequency (RF) Energy Your phone contains a transmiter and receiver. When it is ON, it receives and transmits RF energy. When you communicate with your phone, the system handling your call controls the power level at which your phone transmits. Your Motorola phone is designed to comply with local regulatory requirements in your country concerning exposure of human beings to RF energy.

Portable Radio Product Operation and EME Exposure Your Motorola radio product is designed to comply with the following national and international standards and guidelines regarding exposure of human beings to radio frequency electromagnetic energy (EME): • United States Federal Communications Commission, Code of Federal

Regulations; 47 CFR part 2 sub-part J. • American National Standards Institute (ANSI) / Institute of Electrical

and Electronics Engineers (IEEE). C95. 1-1992. • Institute of Electrical and Electronics Engineers (IEEE). C95. 1-2005

Edition.* • International Commission on Non-Ionizing Radiation Protection (ICNIRP)

1998. • Ministry of Health (Canada). Safety Code 6. L i m i t s o f H u m a n

E x p o s u r e t o Radiofrequency Electromagnetic Fields in the Frequency Range from 3 kHz to 300 GHz, 1999.

• Australian Communications Authority Radio communications (Electromagnetic Radiation - Human Exposure) Standard 2003.

• ANATEL, Brazil Regulatory Authority, Resolution 303 (July 2, 2002) "Regulation of the limitation of exposure to electrical, magnetic, and electromagnetic fields in the

* The information provided in this document supersedes the general safety information in user’s guides published prior to May 1, 2006 radio frequency range between 9 kHz and 300 GHz." "Attachment to Resolution 303 from July 2, 2002.

Operational Precautions To assure optimal radio product performance and to be sure that human exposure to RF does not exceed the guidelines set forth in the relevant standards, always follow these instructions and precautions : Two-way radio operation Your radio product has been designed and tested to comply with national and international standards and guidelines regarding human exposure to RF electromagnetic energy, when operated in the two-way mode (at the face, or at the abdomen when using an audio accessory) at usage factors of up to 50% talk/50% listen. Transmit no more than the rated duty factor of 50% of the time. To transmit (talk), push the Walkie-Talkie (WT) button. To receive calls, release the WT button. Transmitting 50% of the time or less, is important because this radio generates measurable RF energy only when transmitting (in terms of measuring for standards compliance). When using your radio product as a traditional two-way radio, hold the radio product in a vertical position with the microphone one to two inches (2.5 to 5 cm) away from the lips.

Product Operation When placing or receiving a phone call, hold your radio product as you would a wire line telephone. Speak directly into the microphone. If you wear a radio product on your body when transmitting, always place the radio product in a Motorola approved clip, holder, holster, case or body harness. If you do not use a body-worn accessory supplied or approved by Motorola and are not using the radio product in the intended use positions along side the head in the phone mode or in front of the face in the two-way radio mode—or if you hang your device from a lanyard around your neck—keep the device at least 2.5 centimeters (1 inch) from your body when transmitting.

ALL MODELS WITH FCC ID IHDP56HS1 MEET THE G OVERN MENT’S REQUIREMENTS FOR EXPOSURE TO RADIO WAVES. Your wireless phone is a radio transmitter and receiver. It is designed and manufactured not to exceed the emission limits for exposure to radiofrequency (RF) energy set by the Federal Communications Commission of the U.S. Government. These limits are part of comprehensive guidelines and establish permitted levels of RF energy for the general population. The guidelines are based on standards that were developed by independent scientific organizations through periodic and thorough evaluation of scientific studies. The standards include a substantial safety margin designed to assure the safety of all persons, regardless of age and health. The exposure standard for wireless mobile phones employs a unit of measurement known as the Specific Absorption Rate, or SAR. The SAR limit set by the FCC is 1.6W/kg.1 Tests for SAR are conducted using standard operating positions reviewed by the FCC with the phone transmitting at its highest certified power level in all tested frequency bands. Although the SAR is determined at the highest certified power level, the actual SAR level of the phone while operating can be well below the maximum value. This is because the phone is designed to operate at multiple power levels so as to use only the power required to reach the network. In general, the closer you are to a wireless base station antenna, the lower the power output. Before a phone model is available for sale to the public, it must be tested and certified to the FCC that is does not exceed the limit established by the government-adopted requirement for safe exposure. The tests are performed in positions and locations (e.g., at the ear and worn on the body) as required by the FCC for each model. The highest SAR value for this model phone when tested for use at the ear is 1.45 mW/g and when tested on the body, as described in this user guide, is 1.35 mW/g during packet data transmission. (Body-worn measurements differ among phone models, depending upon available accessories and FCC requirements.)2 While there may be differences between the SAR levels of various phones and at various positions, they all meet the government requirement for safe exposure. The FCC has granted an Equipment Authorization for this model phone with all reported SAR levels evaluated as in compliance with the FCC RF exposure guidelines. SAR information on this model phone is on file with the FCC and can be found under the Display Grant section of http://www.fcc.gov/oet/fccid after searching on FCC ID IHDP56HS1. Additional information on Specific Absorption Rates (SAR) can be found on the Cellular Telecommunications Industry Association (CTIA) web-site at http://www.wow-com.com.

1 In the United States and Canada, the SAR limit for mobile phones used by the public is 1.6 watts/kg (W/kg) averaged over one gram of tissue. The standard incorporates a substantial margin of safety to give additional protection for the public and to account for any variations in measurements. 2 The SAR information reported to the FCC includes the FCC-accepted Motorola testing protocol, assessment procedure, and measurement uncertainty range for this product.

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S AF E T Y AN D G E N E R AL I N F O R M AT I O N

Approved Accessories For a list of approved Motorola accessories call 1 -800-453-0920, or visit our website at www.motorola.com/iden.

RF Energy Interference/Compatibility Nearly every electronic device is subject to RF energy interference from external sources if inadequately shielded, designed or otherwise configured for RF energy compatibility. In some circumstances your handset may cause interference with other devices. Follow Instructions to Avoid Interference Problems Turn OFF your radio product where posted notices instruct you to do so. In an aircraft, turn off your radio product whenever instructed to do so by airline staff. If your radio product offers an airplane mode or similar feature, consult airline staff about using it in flight.

Implantable Medical Devices If you have an implantable medical devices, such as a pacemaker or defibrillator, consult your physician before using this radio product. Persons with implantable medical devices should observe the following precautions:

• ALWAYS keep the phone more than 20 centimeters (8 inches) from the implantable medical device when the phone is turned ON.

• DO NOT carry the phone in a breast pocket; • Use the ear opposite the implantable medical device to minimize the

potential for interference. • Turn OFF the phone immediately if you have any reason to suspect that the

interference is taking place. Read and follow the directions from the manufacturer of your implantable medical device. If you have any questions about using your wireless phone with your implantable medical device, consult your health care provider Hearing Aids Some mobile devices may interfere with some hearing aids. In the event of such interference, you may want to consult your hearing aid manufacturer or physician to discuss alternatives. Other Medical Devices and Health Care Facilities If you use any other personal medical devices, consult your physician or the manufacturer or your device to determine if it is adequately shielded from RF energy. Turn off your radio product when instructed to do so in hospitals or health care facilities that may be using equipment that is sensitive to external RF energy.

Driving Precautions Check the laws and regulations on the use of radio products in the area where you drive. Always obey them. When using your radio product while driving, please: • Give full attention to driving and to the road. Using a mobile device

may be distracting. Discontinue a call if you can’t concentrate on driving. • Use hands free operation, if available. • Pull off the road and park before making or answering a call if driving

conditions so require.

• Do not place a handset in the airbag deployment area. Responsible driving practices can be found in the “Smart Practices While Driving” section at the end of this guide and/or at the Motorola Web site: www.motorola.com/callsmart. Note: The use of wireless phones while driving may cause distraction. Discontinue a call if you can’t concentrate on driving. Additionally, the use of wireless devices and their accessories may be prohibited or restricted in certain areas. Always obey the laws and regulations on the use of these products.

Operational Warnings Obey all posted signs when using mobile devices in public areas. Potentially Explosive Atmospheres Areas with potentially explosive atmospheres are often but not always posted, and can include fueling areas such as below decks on boats, fuel or chemical transfer or storage facilities, or areas where the air contains chemicals or particles, such as grain, dust or metal powders. When you are in such area, turn off your handset, and do not remove, install, or charge batteries unless it is a radio product type especially qualified for use in such areas as “Intrinsically Safe” (for example, Factory Mutual, CSA, or UL approved). In such areas, sparks can occur and cause an explosion or fire

Batteries and Chargers Caution: Improper treatment or use of batteries may present a danger of fire, explosion, leakage, or other hazard. For more information, see the “Battery Use and Battery Safety” section in this user’s guide. Your battery, charger, or portable radio may contain symbols, defined as follows:

Symbol Definition

Important safety information follows.

Do not dispose of your battery or mobile device in a fire.

Your battery or mobile device may require recycling in accordance with local laws. Contact your local regulatory authorities for more information.

Do not throw your battery or mobile device in the trash.

Your mobile device an internal lithium ion battery

Do not let your battery, charger, or mobile device get wet.

Listening at full volume to music or voice through a headset may damage your hearing

.

.

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S AF E T Y AN D G E N E R AL I N F O R M AT I O N Choking Hazards Your portable radio or its accessories may include detachable parts, which may present a choking hazard to small children. Keep your device and its accessories away from small children. Glass Parts Some parts of your mobile device may be made of glass. This glass could break if the product is dropped on a hard surface or receives a substantial impact. If glass breaks, do not touch or attempt to remove. Stop using your mobile device until the glass is replaced by a qualified service center. Seizures/Blackouts Some people may be susceptible to epileptic seizures or blackouts when exposed to flashing lights, such as when playing video games. These may occur even if a person has never had a previous seizure or blackout

If you have experienced seizures or blackouts, or if you have a family history of such occurrences, please consult with your physician before playing video games or enabling a flashing-lights feature (if available) on your mobile device. Discontinue use and consult a physician if any of the following symptoms occur: convulsion, eye or muscle twitching, loss of awareness, involuntary movements, or disorientation. It is always a good idea to hold the screen away from your eyes, leave the lights on in the room, take a 15-minute break every hour, and stop use if you are very tired.

Caution About High Volume Usage Listening at full volume to music or voice through a headset may damage your hearing.

Repetitive Motion When you repetitively perform actions such as pressing keys or entering finger-written characters, you may experience occasional discomfort in your hands, arms, shoulders, neck, or other parts of your body. If you continue to have discomfort during or after such use, stop use and see a physician. Service & Repairs If you have questions or need assistance, we’re here to help. Go to www.motorola.com/iden/support, where you can select from a number of customer care options. You can also contact the Motorola Customer Support Center at 1 -800-453-0920 (United States), 1-877-483-2840 (TTY/TDD United States for hearing impaired)

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S AF E T Y AN D G E N E R AL I N F O R M AT I O N Battery Use & Battery Safety

• Motorola recommends you always use Motorola-branded batteries and chargers. The warranty does not cover damage caused by non-Motorola batteries and/or chargers. Caution: Use of an unqualified battery or charger may present a risk of fire, explosion, leakage, or other hazard. Improper battery use, or use of a damaged battery, may result in a fire, explosion, or other hazard.

• Battery usage by children should be supervised.

• Important: Motorola mobile devices are designed to work best with qualified batteries. If you see a message on your display such as Invalid Battery or Unable to Charge, take the following steps:

• Remove the battery and inspect it to confirm that it bears a Motorola “Original Equipment” hologram;

• If there is no hologram, the battery is not a qualified battery;

• If there is a hologram, replace the battery and retry charging it;

• If the message remains, contact a Motorola Authorized Service Center.

• New batteries or batteries stored for a long time may take more time to charge.

Charging precautions: When charging your battery, keep it near room temperature. Never expose batteries to temperatures below 0°C (32°F) or above 45°C (113°F) when charging. Always take your mobile device with you when you leave your vehicle

• When storing your battery, keep it in a cool, dry place.

• It is normal over time for battery life to decrease, and for the battery to exhibit shorter runtime between charges or require more frequent or longer charging times.

• Avoid damage to battery and mobile device. Do not disassemble, open, crush, bend, deform, puncture, shred, or submerge the battery or mobile device. Avoid dropping the battery or mobile device, especially on a hard surface. If your battery or mobile device has been subjected to such damage, take it to a Motorola

Authorized Service Center before using. Do not attempt to dry it with an appliance or heat source, such as a hair dryer or microwave oven.

• Use care when handling a charged battery—particularly when placing it inside a pocket, purse, or other container with metal objects. Contact with metal objects (e.g., jewelry, keys, beaded chains) could complete an electrical circuit (short circuit), causing the battery to become very hot, which could cause damage or injury.

Promptly dispose of used batteries in accordance with local regulations.

Contact your local recycling center for proper battery disposal.

Warning: Never dispose of batteries in a fire because they may explode.

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M O D E L I N F O R M A T I O N

MODEL INFORMATION This manual applies to the following iDEN i465 Digital Portable models:

H02XAH6JR6AN 806-940 MHz, Multi-Service, Data-Capable Portable

MODEL NUMBERING SYSTEM

Typical Model Number: H 9 8 X A H 6 J R 7 A N

Position: 1 2 3 4 5 6 7 8 9 10 11 12

Position 1 - Type of Unit

Position 12 - Unique

H = Hand-Held Portable M = Mobile Product

Model Variations N = Standard Package

Positions 2 and 3 - Model Series

Position 11 - Version

Version Letter (Alpha) Major Change

Position 10 - Feature level

01 = i365 02 = i776 40 = i85s/i55sr/i50sx Products 41 = i90c Products 45 = i265 Products 48 = i80s Products 56 = i30sx/i30s Products 57 = i95cl Products 58 = i88s/i58sr Products 59 = i60c Products 62 = i205/i305 Products 63 = i530/i730/i710 Products 68 = i325pro Products 69 = i31 5plus Products 73 = i860 Products 74 = i830 Products 75 = i285 Products 72 = i930 Products 85 = i870 Products ; 83 = i580 Products ;

92 = i877 Products 94 = i880/i885 Products 98 = i465

1 = Basic 2 = Limited Pkg 3 = Limited Plus 4 = Intermediate 5 = Standard Pkg 6 = Standard Plus 7 = Expanded Pkg 8 = Expanded Plus 9 = Full Feature Programmable

Position 4 - Frequency Band Position 9 - Primary System T

U = 806 to 870 MHz X = 806 to 941 MHz *Values given represent range only; they are not absolute.

R = iDEN Shared

Position 5 - Power Level

Position 8 - Primary

A = 0 to 0.7 Watts B = 0.7 to 0.9 Watts C = 1.0 to 3.9 Watts D = 4.0 to 5.0 Watts E = 5.1 to 6.0 Watts F = 6.1 to 10.0 Watts

N = Digital Dispatch Q = Low Profile - Basic DisplayR = Digital Multi-Service J = TDMA Digital Dual Mode

Position 6 - Physical Packages

Position 7 - Channel Spacing

F = Limited Keypad - With Display H = Full Keypad - With Display N = Enhanced Controls - Enhanced Display

1 = 5 kHz 2 = 6.25 kHz 3 = 10 kHz 4 = 12.5 kHz 5 = 15 kHz 6 = 25 kHz 7 = 30 kHz 9 = Variable Programmable

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MODEL SPECIFICATIONS

MODEL SPECIFICATIONS

GENERAL RECEIVER TRANMITTER

FCC Designation: IHDT56KB1 Receiver Type Direct Conversion Transmitter Type Single Conversion

Operational Modes Phone Frequency Range 851-870 MHz Frequency Range 806-825 MHz

Private 935-940 MHz 896-901 MHz

Group Circuit Data Packet Data Temperature Range Channel Spacing: Emission Designator 18K3D7WOperating –10°C to +60°C iDEN 25kHz Storage (w/o battery) –40°C to +85°C Frequency Stability Modulation Type Quad 16QAMBattery Type Lithium Ion Referenced to base Quad 64QAM station 0.4 ppm Quad QPSK Recommended Sensitivity (10%)BER Frequency Stability: Battery (M-16 QAM) -111 dBm Referenced to base

High Performance SNN5823A Station 0.4 ppm

Max Capacity SNN5793 Spurious Emissions: Battery Voltage Spurious Response Conducted -13 dBm Nominal 3.7 Vdc Immunity: -51 dBm Radiated -13 dBm Range 3.0 to 4. 2 Vdc Dimensions (HxWxD) Spurious Radiation RF Pulse Avg Power: w/950mAh 112.8 x 54 Above 960 MHz <500μV/m iDEN (dynamically x 14.9 mm 216–960 MHz <200μV/m adjusted) -6 to +28 dBm 88–216 MHz <150μV/m 30–88 MHz <100μV/m Weight: Audio Output Power Adjacent Channel

With battery 96.0 g &Speakerphone Rating Power (Private and Group iDEN (at ±25 kHz in -55 dB

Modes only) into 18 kHz BW) 8 ohms at maximum volume (nominal battery voltage) 500mW Distortion at Rated Audio: Electrical Acoustical 5% Max

Acoustical 10% Max

All Specifications +/- 5%

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PREFACE: Conventions Used in This Manual

PREFACE

The i465 Digital Multi-Service, Data-Capable Portable Field Service Manual contains the information necessary to identify and fix problems in the Motorola i465 Digital Portable. This unit is based on digital technology and is designed to operate on iDEN systems.

Basic and field-level service for this unit as described in this manual includes troubleshooting, testing, board swapping, and maintenance.

Service for this unit is based on the substitution method: a faulty part is replaced by a working one, providing quicker service to the customer. For example, if the battery is faulty, it is replaced. If the unit requires more complete testing or service than is available at the basic level, it is sent to the field-level service facility, serviced, and returned to the iDEN Customer Care Center (ICC).

NOTE: Before operating or testing this unit, please read the Safety and General Information section in the front of this manual.

Who Should Use This Manual This manual is intended for service technicians who should be familiar with the test equipment recommended in Appendix A. To help pinpoint basic problems with the unit, first perform the mechanical checks and self tests as described in Chapter 5; then proceed to field level troubleshooting and testing.

How This Manual Is Organized This manual contains the following chapters and appendices: Chapter 1 presents the theory and technology used by the iDEN system and unit.

Chapter 2 describes how to prepare test equipment setups for the iDEN system and how to operate the test equipment. It also contains disassembly and reassembly instructions.

Chapter 3 describes the troubleshooting procedures. Chapter 4 contains the component board layouts, schematic diagrams and component lists.

Appendix A Provides information on ordering kits and replacement parts. It also contains lists of recommended test equipment.

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PREFACE: Conventions Used in This Manual

Conventions Used in This Manual The following conventions are used throughout this manual:

italics Used for emphasis and new terms b o l d Defines menu items, fields, and buttons c o d e Used for sample input and output

Related Publications The following publications are available separately:

R-2660 Digital Communications System Analyzer Operator’s Manual 68P80386B72

iDEN i465 Digital Multi-Service Data-Capable Phone User’s Guide:

Carrier User Guide Sprint Nextel NTN2514A Sprint Nextel MMI NTN2514A SOUTHERNLINC NNTN7551A TELUS NTN2516A INTL GENERIC NNTN7550A PERU NNTN7552A MEXICO NNTN7552A Israel NTN2537A Saudi NNTN7683A Asia Generic NNTN7550A Boost NTN2515A Argentina NNTN7552A

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CONTENTS SAFETY AND GENERAL INFORMATION............................................v

MODEL INFORMATION...............................................................................ix

MODEL SPECIFICATIONS ......................................................................x

PREFACE ...................................................................................................xi CONTENTS ................................................................................................xiii Chapter 1 .................................................................................................19

SYSTEM OVERVIEW ..................................................................................19 1.1 iDEN Digital Modulation Technology......................................................................................... 19 1.2 iDEN Voice Compression Technology ........................................................................................ 21

1.2.1 RF Transmission Bursts ......................................................................................................................... 21 1.2.2 Calling Area Coverage........................................................................................................................... 22 1.2.3 Service Area........................................................................................................................................... 23

1.3 Radio Architecture Overview ...................................................................................................... 24 1.4 Roadrunner Circuitry .................................................................................................................. 25 1.5 Audio Section .............................................................................................................................. 27

1.5.1 Acoustic Transducers............................................................................................................................. 27 1.5.2 Audio Amplifiers ................................................................................................................................... 27 1.5.3 Audio Modes.......................................................................................................................................... 29 1.5.4 Audio Paths............................................................................................................................................ 29 1.5.5 Transmit Paths ....................................................................................................................................... 30 1.5.6 Receive Paths......................................................................................................................................... 30

1.6 Digital Section ............................................................................................................................... 30 1.6.1 Patriot..................................................................................................................................................... 31 1.6.2 MCU Digital Phase Locked Loop (DPLL) ............................................................................................ 32 1.6.3 Host System Clock Synthesizer ............................................................................................................. 32 1.6.4 Power On/Off Circuitry ......................................................................................................................... 32 1.6.5 PATRIOT Digital Signal Processor ....................................................................................................... 33 1.6.6 DSP Phase Locked Loop (PLL)............................................................................................................. 33 1.6.7 Serial Peripheral Interface (SPI) ............................................................................................................ 33 1.6.8 Host Memories....................................................................................................................................... 34 1.6.9 Micro-USB Connector ........................................................................................................................... 34 1.6.10 Battery ID .............................................................................................................................................. 34 1.6.11 Keypad Block ........................................................................................................................................ 35 1.6.12 LCD Circuit ........................................................................................................................................... 36 1.6.13 VGA Camera ......................................................................................................................................... 36 1.6.14 Graphic Controller IC ............................................................................................................................ 36

1.7 Transmitter Path Section ............................................................................................................. 37 1.7.1 ROADRUNNER.................................................................................................................................... 38 1.7.2 Sledgehammer IC (RX Path) ................................................................................................................. 39 1.7.3 Phoenix Lite........................................................................................................................................... 39 1.7.4 Cartesian Feedback ................................................................................................................................ 41 1.7.5 Level Set and Phase Training................................................................................................................. 42

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1.8 Receiver Path Section................................................................................................................... 44 1.8.1 Rx Front End (RXPath) ..........................................................................................................................45 1.8.2 Sledgehammer IC (RXPath)...................................................................................................................45 1.8.3 Roadrunner IC (RX Path) .......................................................................................................................45

1.9 Frequency Generator (RF) Section............................................................................................. 46 1.10 Global Positioning System (GPS) Section ............................................................................... 47

1.10.1 GPS Receiver .........................................................................................................................................47 1.10.2 GPS Antenna ..........................................................................................................................................48 1.10.7 GPS Down-Mixer...................................................................................................................................48 1.10.8 GPS A/D Conversion .............................................................................................................................48 1.10.9 GPS Digital Processing ..........................................................................................................................48 1.10.10 GPS Reference Oscillator...................................................................................................................48

1.11 Bluetooth® Wireless System .................................................................................................... 49

Chapter 2 ................................................................................................ 51

PREPARING FOR FIELD LEVEL TESTING .............................................. 51 2.1 Preparing Equipment for Testing ............................................................................................... 51

2.1.1 Calibrating Equipment............................................................................................................................51 2.1.2 Checking the RF Cable...........................................................................................................................51 2.1.3 Strong-Signal Environments...................................................................................................................51 2.1.4 Protecting Static-Sensitive Devices........................................................................................................51

2.2 Using RSS ...................................................................................................................................... 52 2.3 Connecting an i465 Unit to the R-2660 ....................................................................................... 52 2.4 Operating the R-2660 ................................................................................................................... 53 2.5 Dis-Assembly and Assembly of i465 Unit ................................................................................... 54 2.6 Disassembly Procedure ................................................................................................................ 54

2.6.1 Disassembly Sequence Flowchart ..........................................................................................................54 2.6.2 Battery Cover, Battery, and SIM Card Removal ....................................................................................55 2.6.3 Opening the Unit ....................................................................................................................................56 2.6.4 LCD Removal.........................................................................................................................................57 2.6.5 Keypad and Main Board Removal .........................................................................................................58 2.6.6 Vibrator and Main Board Removal ........................................................................................................59

2.7 Assembly Procedure ..................................................................................................................... 60 2.7.1 Assembly Flow Chart .............................................................................................................................60 2.7.2 Main Board Inspection ...........................................................................................................................61 2.7.3 Main Board Assembly............................................................................................................................62 2.7.4 Back Housing Inspection and Preparation..............................................................................................63 2.7.5 Vibrator Installation................................................................................................................................64 2.7.6 Keypad Board Installation ......................................................................................................................65 2.7.7 Keypad Board Screw Installation ...........................................................................................................66 2.7.8 Adhesive Application .............................................................................................................................67 2.7.9 Lens Installation .....................................................................................................................................68 2.7.10 LCD Installation .....................................................................................................................................69 2.7.11 Closing the Unit......................................................................................................................................70 2.7.12 Keypad Board Installation ......................................................................................................................71 2.7.13 SIM Card, Battery, and Battery Cover Installation...............................................................................72

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Chapter 3 .................................................................................................73

TROUBLESHOOTING..............................................................................73 3.1 Digital Analysis Test ..................................................................................................................... 73 3.2 LO Output Test............................................................................................................................. 77 3.3 RX Main VCO Test ...................................................................................................................... 78 3.4 Keypad Failure Test. .................................................................................................................... 80 3.5 Sledgehammer Test....................................................................................................................... 81 3.6 RX Analysis Test........................................................................................................................... 83 3.7 TX Power Test............................................................................................................................... 88 3.8 TX Sledgehammer Test ................................................................................................................ 89 3.9 Reference Oscillator Test ............................................................................................................. 92 3.10 RF PA Module Test................................................................................................................... 93 3.11 Earpiece Test ............................................................................................................................. 96 3.12 High Audio Speaker Test.......................................................................................................... 97 3.13 Audio Loopback Level Test...................................................................................................... 98 3.14 DC Distribution (SW1) Test ................................................................................................... 100 3.15 DC Distribution (V2) Test ...................................................................................................... 101 3.16 DC Distribution (V3) Test ...................................................................................................... 102 3.17 DC Distribution (V4) Test ...................................................................................................... 103 3.18 DC Distribution (4.5 Pre-Reg) Test ....................................................................................... 104 3.19 DC Distribution (VMMC) Test .............................................................................................. 105 3.20 DC Distribution (VUSB) Test................................................................................................. 106 3.21 DC Distribution (VSIM) Test................................................................................................. 107 3.22 DC Distribution (V_VIB) Test ............................................................................................... 108 3.23 DC Distribution (V_HOLD) Test........................................................................................... 109 3.24 DC Distribution (VC REG) Test............................................................................................ 110 3.25 GPS Receiver Test................................................................................................................... 111 3.26 Mototalk ................................................................................................................................... 114 3.27 Camera Test............................................................................................................................. 115 3.28 Bluetooth Test.......................................................................................................................... 116 3.29 Model Assembly (MA) Test Mode Test................................................................................. 118

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Chapter 4 .............................................................................................. 121 4.1 Component Layout Main Board – Front.................................................................................. 122 4.2 Component Layout Main Board – Back................................................................................... 123 4.3 Component Layout Keypad Board Bottom.............................................................................. 124 4.4 Component Layout Keypad Board Top ................................................................................... 125 4.5 BLOCK HIERARCHY.............................................................................................................. 126 4.6 DIGITAL BLOCK - PATRIOT AND MEMORY .................................................................. 127 4.7 DIGITAL - ATI AND DISPLAY CONNECTOR ................................................................... 128 4.8 DIGITAL BLOCK - CONNECTORS, SIM, AND MISC. ..................................................... 129 4.9 ROADRUNNER - POWER SECTION .................................................................................... 130 4.10 ROADRUNNER - INTERFACE AND A/D ......................................................................... 131 4.11 ROADRUNNER - AUDIO BLOCK...................................................................................... 132 4.12 TRANSCEIVER...................................................................................................................... 133 4.13 BATTERY BLOCK................................................................................................................ 134 4.14 BLUETOOTH BLOCK.......................................................................................................... 135 4.15 USB BLOCK ........................................................................................................................... 136 4.16 QWERTY BOARD................................................................................................................. 137 4.17 i465 Component Locations..................................................................................................... 138

APPENDIX A .......................................................................................... 151 A.1 Customer Service ............................................................................................................................ 151 A.2 Replacement Parts .......................................................................................................................... 151 A.3 Domestic Orders ............................................................................................................................. 151 A.4 International Orders ...................................................................................................................... 151 A.5 Replacement Kits ............................................................................................................................ 152 A.6 Recommended Test Equipment and Tools................................................................................... 154 A.7 Recommended Programming Equipment .................................................................................... 155

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OVERVIEW: iDEN Digital Modulation Technology

Chapter 1 SYSTEM OVERVIEW

To achieve high spectrum efficiency, the i465 digital multi-service, data-capable portable unit uses a unique modulation technology and sophisticated voice-compression algorithm. The voice of the person speaking into the microphone is converted into a digital bit stream consisting of zeros (0) and ones (1). The stream then is modulated into a radio-frequency (RF) signal, which is transmitted over the air to another unit. This process is called digital modulation.

1.1 iDEN Digital Modulation Technology

The i465 digital portable is a dual band 806-870 MHz and 896-940 MHz unit. It operates in multiple modes: phone, private, data, and group; and uses three digital modulation technologies: Quad QAM, Quadrature Phase Shift Keying (QPSK), and Time Division Multiple Access (TDMA).

Quadrature Amplitude Modulation (QAM) is a modulation technique that transmits information by altering the amplitude and phase of the radio frequency (RF) signal. Data is converted into complex symbols, which alter the RF signal and transmit the information. When the signal is received, the amplitude and phase are converted back into symbols and then into the original data.

There are three different QAM modes that are used for different applications: 64QAM, 16QAM, and 4QAM. In voice applications, 16QAM is used, while in data applications, 64QAM, 16QAM, and 4QAM are used.

NOTE: The 900 MHz band operates only in 16QAM modulation.

In 64QAM, 64 possible combinations of 6 bits are converted into a unique amplitude and phase. In 16QAM, there are 16 possible combinations of 4 bits, while in 4QAM, there are 4 possible combinations of 2 bits.

The traditional 25 kHz channel used for two-way radios is split into four QAM signals (subcarriers) that are transmitted simultaneously. This technique can transmit 64 Kbps in a single 25 kHz channel

The iDEN system requires approximately 10 Kbps to transmit a compressed voice; therefore, 64 Kbps can accommodate 6 voice channels or 3 voice channels in enhanced systems.

The signal spectrum of the Quad 16QAM is shown in Figure 1-1

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Frequency from Desired Channel Center (kHz)

Figure 1-1: Spectrum of iDEN Quad 16QAM

Quadrature Phase Shift Keying (QPSK) is one of the most common modulation techniques for satellite communications. In QPSK, a digital data stream is taken two bits at a time to generate four possible phase states of the transmitted carrier. A characteristic of this technique is its resistance to noise.

Time Division Multiple Access (TDMA) is used to allocate portions of the RF signal by dividing time into 6 slots, one for each unit. Time allocation enables each unit to transmit its voice information without interference from another unit’s transmission.

Transmission from a unit or base station is accommodated in time-slot lengths of 15 milliseconds and frame lengths of 90 milliseconds (see Figure 1-2).

Note that Rx (outbound) indicates base-to subscriber transmissions; Tx (inbound) indicates subscriber-to-base transmissions. The slots are paired and have a fixed offset of 19 milliseconds; their timings are synchronized by the iDEN system. The TDMA technique requires sophisticated algorithms and one digital-signal processor (DSP) to perform voice compression/decompression and RF modulation/demodulation

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Portable Unit When turned on, scans for control station, then transmits one slot every six slots.

Figure 1 iD E N T D M A F o r m a t

1.2 iDEN Voice Compression Technology Voice is converted into a digital bit stream by sampling the voice signal at a high rate and converting the samples into numbers, which are represented by bits. A sample consists of 8 bits. Approximately 8000 samples per second (64 Kbps) are required to maintain a reasonable quality. Voice compression reduces the number of bits per second while maintaining the voice at an acceptable quality level. The iDEN system uses a coding technique called Vector Sum Excited Linear Prediction (VSELP) to compress voice to 4.2 or 8.0 Kbps. The compressed voice-data bits modulate the RF signal. The compression rate is based on the type of call (dispatch or interconnect) and the network configuration established by the local service provider. Adding error-correction bits to the coded-voice bits increases the required RF-transmission bit rate to approximately 7.4 Kbps for the 4.2 Kbps voice coder and 14.8 Kbps for the 8.0 Kbps voice coder.

1.2.1 RF Transmission Bursts RF transmissions within an iDEN system occur in 15 millisecond blocks called bursts. An iDEN base station transmits bursts continuously on each RF frequency it uses. Transmission bursts from the stations are synchronized in time by signals received from the global positioning satellite (GPS) system. Each burst is numbered; the number is referred to as the slot number. All bursts occurring at a given time carry the same slot number..

Inbound transmission bursts (sent from the unit) are offset 19 milliseconds from the outbound burst; the inbound burst begins 4 milliseconds after the end of the outbound burst (see Figure 1-2 on page 3). This offset in time allows the unit to appear capable of transmitting and receiving at the same time (it actually is switching rapidly back and forth between receiving and transmitting).

In current iDEN systems, outbound transmissions in the 800 MHz band range from 851-870 MHz; inbound transmissions are 45 MHz lower in frequency. For the 900 MHz band, outbound transmissions range from 935-940 MHz; inbound transmissions are 39 MHz lower in frequency.

.

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OVERVIEW: iDEN Digital Modulation Technology

An iDEN channel is created by grouping bursts so that their slot numbers differ by a number referred to as the repetition rate. The i465 unit uses two repetition rates for interconnect voice calls: 6:1 and 3:1. A single frequency can handle six calls using a 6:1 repetition rate with the 4.2 Kbps coder. Dispatch calls always use this rate. However, the audio quality of the 3:1 repetition rate with the 8.0 Kbps coder is superior to the 6:1 rate with the 4.2 Kbps coder. Most service providers configure the system and unit to allow only the 3:1 rate for interconnect calls. Calls are set up on a primary control channel (PCCH) in response to a request from a unit or a regular telephone connected to the Public Switch Telephone Network (PSTN). The PCCH is established by the base station equipment; typically, it is a 6:1 channel. The outbound PCCH carries system information and “pages” to specific subscriber units and asks them to respond if they are available for a call. Inbound PCCH transmissions carry responses to the “pages” and requests by subscriber units to set up calls. Inbound transmissions on the primary control channel only take 7.5 milliseconds and can be timed to occur in either half of a 15- millisecond burst. The dual band unit will power up in the 800 MHz band and will use these channels for control channels—Primary Control Channel (PCCH) and Broadcast Control Channel (BCCH). The 900 MHz mode will be used only during 3:1 interconnect calls. Every attempt will be made to assign the unit to 900 MHz carriers during new 3:1 interconnect calls, handovers into a cell, and inter-cell handovers. If no resources are available, or if available resources have insufficient channel quality (in the case of a handover), then 800 MHz carriers will be evaluated. Using the above techniques, the iDEN system can operate six voice channels simultaneously in dispatch mode or 3 voice channels simultaneously in interconnect mode on a single RF carrier at 25 kHz bandwidth

1.2.2 Calling Area Coverage Area coverage is obtained by dividing the area into a mosaic of cells. Coverage is controlled so that frequencies can be reused with less distance between sites. Each cell is covered by a base station, which is classified as Omni or Sectored. An Omni station connects base transceivers to antennas that have a circular pattern centered at the site. A Sectored station connects base transceivers to directional antennas that point in particular directions. Units that operate in a multi-site system must be able to “hand off” from one coverage area to another as the user moves about during a call. Handoff is controlled by the iDEN system.

In Figure 1-3, the area is divided into several cells, each containing a cell site (base station) operating on a given set of channels, which interfaces radio-telephone subscribers to the switching station.

Figure 1-3. Hypothetical iDEN Cell System

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OVERVIEW: iDEN Digital Modulation Technology

The units are capable of operation on any channel in the system. This enables them to operate in any cell. Due to the low power requirements for communications between radio telephones in a particular cell and cell site, operating channels may be repeated in cells that are outside the coverage area of each other.

For example, in Figure 1-3, each letter represents a given frequency. Notice that cells A1 and A2 operate on the same frequency because they are a certain distance apart. Users can simultaneously occupy the same frequency without interfering with each other. This is known as frequency re-use.

The implementation of frequency re-use increases the cell handling capability of the system without increasing the number of available channels. When re-using identical frequencies in a small area, co-channel interference can be a problem. The iDEN system can tolerate higher levels of co-channel interference than analog systems by incorporating digital modulation. This means that cells using identical frequencies can be physically closer than similar cells in analog systems. Therefore, the advantage of frequency re-use can be further enhanced in an iDEN system, enabling greater traffic handling in high-use areas.

Because of TDMA, several calls can share the same carrier. The carrier is divided into a continuous stream of TDMA frames, each of which is split into six time slots (see Figure 1-2 on page 3). When a connection is required, the system allocates the subscriber a dedicated time slot within each TDMA frame. User data (speech or data) for transmission is digitized and sectioned into blocks. The user data blocks are sent as information bursts in the allocated time slot of each TDMA frame. The data blocks are modulated onto the carrier via M16 QAM.

Each unit must be able to move from one cell to another with no detection by the user. The unit itself carries out signal-strength measurements on adjacent cells, and the quality of the traffic channel is measured by both the unit and the base station. The hand-over criteria can be much more accurately determined, and the hand-over made before the channel quality deteriorates to a level that the subscriber can notice.

When a unit is well within a cell, the signal strength measured will be high. As the unit moves toward the edge of the cell, the signal strength and quality measurement decreases.

Signal information provides an indication of the subscriber's distance from the base station. As the unit moves from cell to cell, its control is handed from one base station to another. The change is handled by the unit and the base station, and is completely transparent to the user.

1.2.3 Service Area Because this is a radio system, there are no exact boundaries that can be drawn on a map. If the unit is outside the coverage area, “No Service” illuminates on the display and calls are unable to be placed or received. If this happens during a conversation, the call will be lost. There also may be small areas within a particular service area in which communications could be lost.

The unit’s identity information is held by its local iDEN system in its Home Location Register (HLR) and Visitor Location Register (VLR). The VLR contains identity information on all local active radio telephones. Should the user roam to another area, the unit’s identity information is sent to the VLR in the new system. The new system will then check the unit's details with the home system for authenticity. If everything is in order, the user will be able to initiate and receive calls while in the new area.

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1.3 Radio Architecture Overview The digital section consists of the Patriot Baseband Processor, Host memories (FLASH and PSRAM, and the iDEN power management (See Figure 1-4 below, i465 Block Diagram).

Figure 1-4 i465 Block Diagram

The Spiffy Lite/Phoenix Lite front end module contains the TX output stage (including the power amplifier, low-pass filter, coupler and antenna switch). The RX front end (including switches, SAWs, LNA and the RX balun) and the GPS front end (including the pre-selector SAW, GPS LNA, SAW and GPS balun) are all implemented discretely. The main RX VCO module, with all the associated loop filter components, is placed on the radio board.

The SLEDGEHAMMER IC is a multi-band transceiver IC intended to support iDEN and WiDEN protocols. The Sledgehammer IC contains RF and analog baseband paths for iDEN receive and transmit, in addition to a GPS receive RF path. The SLEDGEHAMMER IC also contains two RF synthesizers required to generate local oscillator signals for the iDEN receive and transmit and for GPS receive, as well as an ESCORT loop required to prevent re-modulation of the transmit signal. The SLEDGEHAMMER IC, utilizing a higher level of integration, serves as placement to the TOMAHAWK, Half-Life, GRF2i and JAVELIN ICs. The SLEDGEHAMMER IC is used in conjunction with the Roadrunner IC which will contain the transceiver signal path data converters and digital filtering which were previously parts of TOMAHAWK.

The Roadrunner IC provides the entire radio DC distribution, audio functions, and digital portion of the iDEN transceiver/GPS receiver. The DC distribution will consist of linear and switch mode regulators.

512MbFLASH

800

900

ISM

RoadrunnerSledgehammer

GPS DN CONV

CARTESIAN LINEARIZED

UP-CONVERTER

GPS PLL & VCO

iDEN RX DN CONV

RX BB FLs RX BB

FRAC-N PLL

ESCORT PLL

TRANSMIT VCO

PATRIOT

Bravo ROM13

RX LO Loop FL

Display128 x 160

Balun

Balun

iDEN/GPS MODEM ADCs

iDEN RX DIG FL

TX DAC

CODEC

STEREO DAC

SPEAKER / MIC AMPS

BOOST REGULATOR

BUCK REGULATOR

LDOs

LED CONTROLLER

Xtal Osc

BATTERY CHARGER

VTERM

33.6 MHz33.6 MHz Buffer

Bluetooth

128Mb PSRAM

Mono Speaker

PAT/R Coupler

Balun

VGACamera

ATI

GPS SAW Filter

Spiffy Lite

512MbFLASH

800

900

ISM

RoadrunnerSledgehammer

GPS DN CONV

CARTESIAN LINEARIZED

UP-CONVERTER

GPS PLL & VCO

iDEN RX DN CONV

RX BB FLs RX BB

FRAC-N PLL

ESCORT PLL

TRANSMIT VCO

PATRIOT

Bravo ROM13

RX LO Loop FL

Display128 x 160

Balun

Balun

iDEN/GPS MODEM ADCs

iDEN RX DIG FL

TX DAC

CODEC

STEREO DAC

SPEAKER / MIC AMPS

BOOST REGULATOR

BUCK REGULATOR

LDOs

LED CONTROLLER

Xtal Osc

BATTERY CHARGER

VTERM

33.6 MHz33.6 MHz Buffer

Bluetooth

128Mb PSRAM

Mono Speaker

PAT/R Coupler

Balun

VGACamera

ATI

GPS SAW Filter

Spiffy Lite

512MbFLASH

800

900

ISM

RoadrunnerSledgehammer

GPS DN CONV

CARTESIAN LINEARIZED

UP-CONVERTER

GPS PLL & VCO

iDEN RX DN CONV

RX BB FLs RX BB

FRAC-N PLL

ESCORT PLL

TRANSMIT VCO

GPS DN CONV

CARTESIAN LINEARIZED

UP-CONVERTER

GPS PLL & VCO

iDEN RX DN CONV

RX BB FLs RX BB

FRAC-N PLL

ESCORT PLL

TRANSMIT VCO

PATRIOT

Bravo ROM13

RX LO Loop FL

Display128 x 160

Balun

Balun

iDEN/GPS MODEM ADCs

iDEN RX DIG FL

TX DAC

CODEC

STEREO DAC

SPEAKER / MIC AMPS

BOOST REGULATOR

BUCK REGULATOR

LDOs

LED CONTROLLER

Xtal Osc

BATTERY CHARGER

VTERM

iDEN/GPS MODEM ADCs

iDEN RX DIG FL

TX DAC

CODEC

STEREO DAC

SPEAKER / MIC AMPS

BOOST REGULATOR

BUCK REGULATOR

LDOs

LED CONTROLLER

Xtal Osc

BATTERY CHARGER

VTERM

iDEN/GPS MODEM ADCs

iDEN RX DIG FL

TX DAC

CODEC

STEREO DAC

SPEAKER / MIC AMPS

BOOST REGULATOR

BUCK REGULATOR

LDOs

LED CONTROLLER

Xtal Osc

BATTERY CHARGER

VTERM

33.6 MHz33.6 MHz Buffer

Bluetooth

128Mb PSRAM

Mono Speaker

PAT/R Coupler PAT/R CouplerT/R Coupler

Balun

VGACamera

VGACamera

ATI

GPS SAW Filter

Spiffy Lite

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OVERVIEW: iDEN Digital Modulation Technology

The audio section is composed of microphone amplifiers, speaker amplifiers, a voice codec and a stereo DAC. Previously such functionality was performed with the GCAP/PCAP IC. The receiver ROADRUNNER portion includes circuitry supporting AGC, receiver sequence management, signal path anti-aliasing filters, buffer amplifiers, high dynamic range sigma delta data converters, digital filtering and the RX serial data interface to the baseband processor (previously part of Tomahawk). The TX portion includes circuitry supporting Pulse Shaping FIR, TX DAC, Smoothing filters, PA Gain Control DAC, and the TX serial data interface to the baseband processor (previously part of TOMAHAWK). ROADRUNNER also includes circuitry to support additional features such as GPS AD, USB, RS232, LEDs, etc.

Finally, the baseband processor utilized by i465 is the Zeus Processor.

1.4 Roadrunner Circuitry

The Roadrunner integrated circuit (IC) provides the following:

• DC distribution • Audio CODEC and amplifiers • Control logic for power on/off • A/D converters for monitoring radio thermistors, battery level, LCD calibration, and the

Photosensor. • The Roadrunner IC used is a 223 I/O MAP BGA package.

The i465 unit has the following DC distribution:

• SW1 is a BUCK step-down switching regulator set to 1.2 Vdc at 550 mA. It supplies the Zeus core. • SW2 is a BUCK switching regulator set to 1.875 Vdc at 250 mA. It supplies the Zeus and

memory. • SW3 is a BOOST switching regulator set to 5.6 Vdc at 200 mA. It supplies the LED backlights and

Vusb. • V1 - The V1_LDO is used to power the camera and photo sensor memories in a Zeus-based

platform. • V2 - 2.775 Vdc at 350 mA - will be used to power most of the RF circuits as well as the audio codec

and all audio amps. • V3 is a TRANSCEIVER digital supply set at 1.875Vdc at 50 mA. • V4 supplies 2.775 Vdc at 50 mA to the Thermistor Bias (Battery, Board ID) TCXO. • V_VIB supplies 3.0 Vdc at 200 mA to the vibrator • VMMC supplies 2.775 Vdc 350mA BTVCC I/O , Zeus UARTS, SD Card. • VSIM supplies 3.0 Vdc at 15 mA to the SIM card • VHOLD - 1.875 Vdc • VCO Superfilter is used for the transceiver VCO’s. The SF_OUT supply is intended as the power

supply for the external VCO and the integrated Escort VCO on Sledgehammer. The input for the VCO superfilter is V2.

The battery supplies Raw_B+ and Filtered_B+. RAW_B+ supplies the RF PA. Filtered_B+ directly supplies Roadrunner and most of its regulators.

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OVERVIEW: iDEN Digital Modulation Technology The unit operates with a low-level battery voltage of 3.55 Vdc, nominal-level voltage of 3.7 Vdc, and high-level voltage of 4.2 Vdc.

The Roadrunner IC has the following features: • Analog/digital portions of a real-time clock (RTC) • Battery charger • 14-channel, 10-bit A/D converter • Control logic • Audio CODEC with serial interface • Transducer amplifier • Speaker amplifier (Hi Audio 0.5 watt into 8-ohm speaker) • Alert amplifier • Two amplifiers for (internal and external) microphone. • Auxiliary amplifier • SIM card level shifters • RS232 and USB support • Internal PMOS pass devices • Serial peripheral interface (SPI) read/write interface • Battery feedback switch • LED Controller

Figure 1-5 illustrates the DC power distribution in the i465 unit.

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OVERVIEW: iDEN Digital Modulation Technology

The Roadrunner IC is designed to support the needs of portable iDEN cellular telephone products. It provides the necessary control, audio, and regulator functions. The following functions are provided:

• Turn on control signals to properly activate the unit • Turn off control signals to turn off the unit if an error is detected • Audio amplification for the speaker • Audio amplification for the alert • Audio amplification for the external audio • Audio amplification of the microphone • 13-bit, linear audio CODEC • Band-gap reference voltage • Linear regulation of DC voltages • Two switching regulators (BUCK/BOOST) • Operational amplifiers for use in the battery charger • Internal D/A conversion for the battery charger • 14-channel, 10-bit A/D conversion • PA high-end regulation • Real-time clock

1.5 Audio Section

Audio components for the i465 consist primarily of the audio amplifiers, a coder/decoder (CODEC), and acoustic transducers such as microphones and speakers. Other components include active RC filters, digital filters, software controlled amplifiers and attenuators, an analog-to-digital converter (ADC), and two digital-to-analog converters (DACs).

1.5.1 Acoustic Transducers

The i465 uses the following acoustic input and output transducers:

• Active internal microphone requiring a DC bias

• A dynamic 32-ohm earpiece speaker

• A dynamic high audio 8-ohm speakers

1.5.2 Audio Amplifiers The i465 uses five audio amplifiers as shown and further described in the Figure 1-6, Figure 1-7 and Figure 1-1.

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OVERVIEW: iDEN Digital Modulation Technology

PGA INPUT Selector

Voice Codec

Mic Bias#2

Mic Bias#1

AUDIG ( 2 :0 )

Rbias2.2K

Rbias2.2K

MIC_BIAS2

MIC_BIAS1

MIC_INT

MIC_AUX

AUDIG(4:3)

V l

V l

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Table 1-1: Audio Amplifier Outputs and Acoustic Transducers

1.5.3 Audio Modes

The i465 audio circuitry has two basic modes of audio communication operation: interconnect and dispatch. It also has digital audio and digital video with digital audio multimedia playback modes.

In standard interconnect mode, the i465 uses Roadrunner's internal amplifiers to directly drive the dynamic earpiece speaker and drive mono high audio speakers if the speakerphone feature is enabled.

In standard dispatch mode, the i465 uses Roadrunner's internal amplifiers to directly drive the high audio speaker in mono. It can also drive the dynamic earpiece speaker.

1.5.4 Audio Paths

The i465 can accept audio from the internal microphone and the audio jack. Interconnect voice, dispatch voice, dispatch tones, and ringer tones are also generated during audio communication operation. These received audio signals can be transmitted or routed to the earpiece speaker, high audio speaker, or audio jack output depending on the audio mode of operation and state of the High/Low Speaker key and audio jack detect circuit.

The High/Low Speaker key toggles the audio output from the high audio speakers to the earpiece speaker. The functionality of the High/Low Speaker key is disabled when there is an audio jack connect detected.

The microphone input can also be muted and unmuted at any time during an interconnect call.

Outputs Acoustic Transducer

A1 (RR) Earpiece speaker output

A2 (RR) High audio speaker

A3 (RR) Internal microphone input

AL (Ext.) Left channel output to left channel headset earpiece

AR (Ext.) Right channel output to right channel headset earpiece

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OVERVIEW: Digital Section

1.5.5 Transmit Paths The average human voice signal has an audible frequency band of approximately 300 - 3400 Hz. Low pass filters are utilized to provide the optimum voice signal response on the mic signal line by filtering out unnecessary and potentially disruptive higher frequencies. The mic signal is then amplified by the Roadrunner's internal op-amp and then converted from analog to digital in the ADC. The digital mic signal is then digitally filtered, transferred to the DSP for necessary processing, and then sent to SLEDGEHAMMER. Lastly, the data is sent to the RF Power Amplifier and transmitted.

1.5.6 Receive Paths The received voice signal is first converted to digital by SLEDGEHAMMER and then sent to the DSP for necessary processing. The DSP sends the processed voice signal to the CODEC, where it is converted from digital to analog in its internal DAC. The output of the DAC is then band-pass filtered to attenuate any out-of-band noise.

Next, depending on the audio mode of operation and state of the High/Low Speaker key and audio jack detect circuit, the speaker signal is either sent to the Roadrunner amplifier to drive the earpiece speaker, the external 0.5W amplifier to drive the high audio speakers, or the audio jack output.

1.6 Digital Section This section includes the Patriot-Bravo Baseband Processor and external memories and an ATI graphics controller. The BRAVO controls the transmit, receive, and synthesizes operations of the integrated circuits located in the RF section.

The digital section contains the following (see Figure 1-8): • Patriot-Bravo Baseband Processor • Host memories (FLASH and PSRAM) • uUSB Interface • Keypad block • ATI display / camera controller

Figure 1-8: iDEN Digital Block Diagram

512MbFLASH

128Mb PSRAM

PATRIOT

Bravo ROM13

Display128 x 160

VGACamera

ATI

uUSB

Keypad Block

512MbFLASH

128Mb PSRAM

PATRIOT

Bravo ROM13

Display128 x 160

VGACamera

ATI

uUSB

Keypad Block PATRIOT

Bravo ROM13

Display128 x 160

VGACamera

VGACamera

ATI

uUSB

Keypad Block

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OVERVIEW: Digital Section

1.6.1 Patriot The Patriot Dual-Core Baseband Processor (U801) integrates a reduced instruction-set computer (RISC) microprocessor unit (MCU) and a general-purpose DSP on a single chip (see Figure 1-9). The following is a summary of the PATRIOT key features: • RISC integer processor capable of running at 52 MHz at 1.55 Vdc, a 32-bit RISC architecture, high performance and high code density • ONYX 56600 DSP core running up to 133 MHz at 1.55 Vdc • Fully-programmable PLL for system clock generation with low-output clock drivers • 16 KB x 32 on-chip MCU RAM • 4 KB x 24 DSP program RAM • Queued serial peripheral interface (QSPI) to communicate with external peripherals • Serial communications interface with baud-rate generator • On-chip Emulator (OnCE) integrated with JTAG port compliance • Interrupt, general-purpose I/O, and keypad interface pins • Very-low power CMOS design • Wait, doze, stop, and deep sleep low-power standby modes.

Figure 1-9. Patriot-Bravo Functional Block Diagram

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OVERVIEW: Digital Section

The Patriot performs the following tasks: Controls the power-up and power-down sequence of the unit Programs the flash Serially communicates with the factory Automated Test Equipment Serially communicates via RS232 Communicates with the RF ICs (ROADRUNNER and SLEDGEHAMMER) Memory maps and accesses flash ROM and PSRAM Monitors battery voltage, as well as RF power-amplifier and battery temperature Controls volume levels and enables beep tones Modifies and stores user-selectable ergonomic preferences Reads and writes radio-tuning parameters to the codeplug Sends and receives commands with the base station through DSP Re-channels the SLEDGEHAMMER synthesizer during hand off Detects accessories connected to the radio Programs the ATI display/camera controller Decodes key presses from the keypad Controls the display and keypad backlight Controls the vibrator.

1.6.2 MCU Digital Phase Locked Loop (DPLL) The MCU has a programmable, digital phase locked loop (DPLL) that uses the 16.8 MHz clock as a reference. The MCU initially runs from the external reference at power up. Software programs the MCU DPLL to 46 MHz and switches from the external reference to the MCU DPLL after it has locked

1.6.3 Host System Clock Synthesizer There are two system clocks that are generated by Roadrunner and Sledgehammer. The Roadrunner generates 32.768 kHz using the Roadrunner PLL, and the Sledgehammer generates 33.6 MHz. The MCU Programmable Interrupt Timer (PIT) is run by the 32.768 kHz oscillator. The 33.6 MHz is divided by 2 in the Roadrunner to yield a 16.8 MHz signal, which serves as reference frequency required by the MCU and DSP cores

1.6.4 Power On/Off Circuitry The power-on circuitry uses the ROADRUNNER /ON_B pin and the power On/Off button to turn on the unit. When the On/Off button is pressed to turn on the unit, the ON pin is shorted to ground, which turns on ROADRUNNER. The low-voltage detector provides the initial, active low reset to the MCU. When the ROADRUNNER voltages become stable (after a maximum of 2 ms), ROADRUNNER de-asserts Reset. At this point, the MCU sets the defaults for all the ICs. For instance, the SLEDGEHAMMER default clock is set to 8.4 MHz (16.8 MHz divided by 2). The MCU must reprogram the SLEDGEHAMMER to run off the 16.8 MHz frequency. In addition, the PATRIOT boots off of the High Clock, not the Low Clock (CKIL) like the REDCAP. At this point, the PATRIOT begins running the subscriber code. To turn off the unit, the On/Off button is pressed, causing the /ON B-pin of the ROADRUNNER to short to ground. The ROADRUNNER drives ROADRUNNER SEL_INT on the PATRIOT and tells the MCU to turn off. The MCU turns off by driving the STO (WDI input to ROADRUNNER) line low, which shuts down the voltage regulators in the ROADRUNNER.

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OVERVIEW: Digital Section

1.6.5 PATRIOT Digital Signal Processor The PATRIOT SPS 56600 digital signal processor contains the new DSP Engine S_ONYXU, which is capable of executing an instruction on every clock cycle. The DSP56600 consists of the following: • Data ALU • Address generation unit • Program controller • Program patch detector • Bus interface unit • On-chip emulator • PLL-based clock generator A standard interface between the DSP56600 core and the on-chip memory and peripherals support many memory and peripheral configurations.

1.6.6 DSP Phase Locked Loop (PLL) The DSP PLL is programmable and is used to generate a DSP internal clock that is synchronized to the 16.8 MHz reference frequency. In low power mode, the DSP PLL is disabled and the DSP operates directly from the 16.8 MHz clock. The DSP PLL runs at 110 MHz.

1.6.7 Serial Peripheral Interface (SPI) This interface communicates with RF chips using a synchronous serial bus. This bus includes the following: • Master Out Slave In (MOSI) • Master In Slave Out (MISO) • SPI clock • Specific chip-select lines

Table 1-2 shows a diagram of the Chip-Select Line States.

Table 1-2. Chip-Select Line States

IC Chip-Select Line Active State

ROADRUNNER Chip Enable SPI CS0 Low

SLEDGEHAMMER Chip Enable SPI CS6 Low

ROADRUNNER primary Chip Enable SPI CS7 Low

The MCU then sends data to the chip using MOSI and the SPI clock. The MCU also can receive data from all chips by clocking it into MISO using the SPI clock and appropriate chip select.

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OVERVIEW: Digital Section

1.6.8 Host Memories The following types of host memories are available: FLASH memory. 512Mb (or 32M x 16) chip. The flash stores unit subscriber and DSP code. To

read from the flash, the MCU asserts CS0 low and OE high, and then drives EB1 high. For a write, EB1 is driven low and OE is driven high. Host PSRAM memory. 128Mb PSRAM (or 8M x16) is used by the MCU to load codeplug

information, program the FLASH, and store working parameters. To access PSRAM memory, the MCU asserts both CS2 and OE low, and then drives EB1 high for reads. For a write, EB1 is driven low and OE is driven high.

1.6.9 Micro-USB Connector The bottom connector of the unit is a micro USB receptacle and is used to communicate to external devices. There is no external hardware for switching from one protocol to another because the Patriot handles the switching and line multiplexing functions internally. The following table shows the bottom connector pin assignments:

Table 1-3. Bottom Connector Pin Assignments

1.6.10 Battery ID The battery is equipped with a Dallas 2502 EPROM. A two-wire serial bus allows the i465 unit or the battery charger to communicate with the battery and identify whether or not the battery is compatible. If the battery is determined to be incompatible, the charger does not enter charging mode.

Besides compatibility data, the EPROM also stores such information as the battery type, capacity, fuel-gauging parameters, and voltage thresholds.

Pin Signal

1 Vbus

2 D-

3 D+

4 ID

5 GND

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OVERVIEW: Digital Section

1.6.11 Keypad Block

The MCU is responsible for decoding key presses and displaying them properly on the LCD. The keys are arranged into a matrix of five rows and seven columns, which includes the Volume buttons. PTT is an external interrupt (INT0) that goes directly to Patriot. The audio jack PTT goes to a Patriot general purpose input.

Table 1-4. Keypad Matrix

The On/Off button is not decoded by the MCU; it directly drives the ROADRUNNER, which sends a signal to the MCU through INT1. Pressing any key also generates the keypad internal interrupt. The PATRIOT de-bounces the keys by reading them 25 milliseconds later.

The keypad decoding scheme works as follows: 1. PATRIOT sets the row pins to inputs; all columns pins are set as outputs and driven to

logic low. 2. Rows are pulled logic high. When a key is pressed, one row goes low, which

indicates a key press and sends an internal interrupt. 3. PATRIOT reads rows. A low on that row indicates a key press. All others are high. 4. PATRIOT sets all columns to output logic high. 5. One column at a time is set to output logic low. PATRIOT reads the rows to see which

one is now at a logic low level. (A low seen on a row indicates the correct column and row.)

COLUMN0 COLUMN1 COLUMN2 COLUMN3 COLUMN5 COLUMN6 COLUMN7ROW0 UP DOWN TXT SPKR UNUSED UNUSED SYM POWER/ENDROW1 ENTER ALT ILINK UNUSED CENTER UNUSED UNUSED PTTROW2 O RSK T SEND SPACE Z NROW3 F K Y B CAM MSG SHIFTROW4 W C VOL_DWN VOL_UP UNUSED PERIOD AROW5 LSK E RIGHT G S DEL MROW6 H R PLUS X I U PROW7 V Q LEFT J MENU D L

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OVERVIEW: Digital Section

1.6.12 LCD Circuit The LCD is a single glass main display. The main display has a resolution of 128x160 pixels. The data lines for the display module are connected to a CPU control interface from the graphics controller IC (ATI). The data lines for the graphics controller IC are connected to the 16-bit Patriot data bus. The display module booster voltage is powered by VMMC (2.775 V), the I/O is powered by SW2 (1 .875 V). The display module connects to the Keypad PCB through a 21-pin connector and the Keypad PCB connects to the main board through an 80-pin connector.

1.6.13 VGA Camera i465 uses a VGA camera, the image sensor is a color CMOS image sensor with Bayer (Green, Red, Green, and Blue) pattern filter. The sensor has the image resolution of 640x480. The control interface configuration is based on standard mode I2C bus. Register settings can be changed via I2C bus. The device provides a finished image at 15fps for normal setting and variable frame rate of 7fps to 15 fps for low light setting.

1.6.14 Graphic Controller IC This section and the one that follows describe the interface between the graphics controller IC and Patriot, display, and VGA camera. The i465 uses a graphics controller IC that offers 2D/advanced display graphics/video acceleration, exceptional power management, MPEG/H263/JPEG decoding, video input port and JPEG encode, H263 encoding. The block diagram of the graphic controller IC for i465 is shown in Figure 1-10.

Figure 1-10. Graphics controller IC System Block Diagram

128Mbits PSRAM

512Mbits FLASH

Memory

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OVERVIEW: Transmitter Path Section

1.7 Transmitter Path Section This section includes the following lineup Roadrunner (baseband D/A conversion), SledgeHammer (Analog baseband to RF), and Phoenix Lite (TX RF back end: power amplifier, etc) for linear modulation of the iDEN portables. When the unit is transmitting, microphone audio is routed to the CODEC, where it is amplified and digitized by the A/D converter in the CODEC. Digital voice is then sent from the CODEC to the DSP for processing. (See i465 Block Diagram Figure 1-10 Below).

Figure 1-10. i465 Block Diagram

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OVERVIEW: Transmitter Path Section

The Phoenix Lite transmitter module includes the following:

• High Power Linear RFPA

• Directional coupler.

• Low pass harmonic filter.

• Low-loss Transmit/Receive antenna switch.

The DSP performs VSELP data compression and generates digital I & Q words to be transmitted to the ROADRUNNER. The signal then is sent at a rate of 48 K samples per second. The ROADRUNNER provides the serial clock to the DSP and a frame sync pulse to tell the DSP to send a sample. Each sample is sent as a 16-bit I word followed by a 16-bit Q word and then some meaningless fill bits.

The I word and the Q word are then converted to an analog differential pair by the ROADRUNNER and amplified. The ROADRUNNER also sends a 4.2 MHz reference clock signal to the SLEDGEHAMMER, together when a DMCS and TXE signal are received from the DSP. The TXE transition starts the TX sequence with SLEDGEHAMMER, which entails the training sequences as well as enabling the antenna switch and PA.

DMCS signals the start of data being sent from DSP to ROADRUNNER. Once the transmit burst is finalized, the TX shutdown is done by disabling TXE and DMCS.

1.7.1 ROADRUNNER The ROADRUNNER IC is designed as a derivative of several other ICs previously used in iDEN products. The ROADRUNNER IC includes the following blocks:

RX:

• ADC • Digital Filtering

TX:

• Digital interface (the transmitter receives inputs from the SSI. The SSI has a single data line).

• Pulse Shaping FIR (A programmable waveform generator "FIR" filter provides interpolation of the pre shaped input words).

• TX DAC (The transmit DACs have eleven bit resolution and are capable of supporting 8.4 Mbits). Fine step TX attenuation (cutback).

Smoothing filters (programmable RC smoothing filters limit the amount of far out quantization noise and images due to aliasing. The filters incorporate a dc offset correction block).

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ROADRUNNER Transmit Operation. The transmitter implemented a Direct Conversion Transmitter (DCT), where base band data is up-converted into RF with only one stage. The ICs that perform the transmit operations are ROADRUNNER and SLEDGEHAMMER. Power cutback control is shared between both ICs, the fine cutback step (1-> 4dB) is performed by ROADRUNNER and the coarse cutback step (5 dB steps up to 35 dB) is performed by SLEDGEHAMMER. To generate the RF signal, the SLEDGEHAMMER IC uses a TX_LO that is centered at the carrier frequency. This TX_LO is generated INSIDE SLEDGEHAMMER.

The digital samples are generated by the DSP and then sent to ROADRUNNER via Transmit SSI (TX_S SI). ROADRUNNER then implements the Digital-to-Analog Conversion function, which provides some power control function. The resulting I!Q analog signals are then sent to the SLEDGEHAMMER IC, which up-converts the base band signal to RF (similar to what the JAVELIN did on previous architectures).

The I/Q path circuits will be similar to the lineup used in the Tomahawk IC. The "main" reconstruction filter for the I!Q paths will be located in the SLEDGEHAMMER IC, and will have programmable BW options of 25, 50, and 100 KHz.

These functions of the IQ modulator consist of the interface to the digital baseband, the digital baseband sub-block, the analog baseband sub-block, and the TX DAC bridging the digital and analog sub-blocks. The ROADRUNNER IC will produce the baseband I and Q signals needed for IQ modulation on the SLEDGEHAMMER IC.

1.7.2 Sledgehammer IC (RX Path) The SLEDGEHAMMER is the heart of the transmitter; it incorporates all of the circuitry necessary to implement a Cartesian feedback closed-loop system.

The differential baseband signals from the ROADRUNNER are input into the SLEDGEHAMMER. They go through a variable attenuator and are then summed with the down-converted I & Q feedback. The baseband signal is then amplified and sent to the up mixers.

1.7.3 Phoenix Lite Phoenix Lite is a cost-reduced RF front end module (FEM) intended to support iDEN and WiDEN protocols. Many of the features of JANUS were removed, including the Rx front-end and integrated Tx balun.

The Phoenix Lite transmitter module comprises a single lineup that support iDEN 800MHz, iDEN 900MHz and Mototalk. The TX balun presents a differential impedance to the modulator on the RFIC, and it also feeds RAW _B+ to the modulator via the TX_IN and TX_INB pins. The nominal differential impedance to the TX balun is 200ohms.

The RFPA also features a 2.5dB load line select line as well as reduced quiescent current mode for low output power operation.

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OVERVIEW: Transmitter Path Section

1.7.3.1 TX BALUN The TX BALUN transforms the RFPA 50ohms single ended input impedance into 200ohms differential (SLEDGEHAMMER's output impedance is 200 ohms differential). The BALUN also feeds RAW_B+ to the TX modulator portion of the RFIC that drives the RF PA through the TX_IN and TX_INB pins.

Figure 1-11.TX Balun

1.7.3.2 POWER AMPLIFIER The signal is then routed to the RF PA. All control signals will be asserted before TX_ENB is asserted, and such control signals will be de-asserted after TX_ENB is de-asserted.

1.7.3.3 DIRECTIONAL COUPLER The directional coupler samples the incident power going into the T/R switch and it feeds it back to the RFIC for linearization and power control purposes.

1.7.3.4 HARMONIC FILTER The harmonic filter is necessary to meet transmitter FCC emissions at the iDEN_ANT pin.

1.7.3.5 T/R SWITCH The T/R switch selects the path that connects to the iDEN_ANT pin. The possible paths are iDEN transmitter, iDEN receiver 800MHz, iDEN receiver 900MHz and Mototalk.

The switch should be able to maintain very high linearity under high VSWR conditions in order to meet the stringent iDEN adjacent channel specifications as well as the harmonic emissions. The lines SEL_1 and SEL_2 control the switch selection. The Figure 1-14 shows the diagram of the switch.

Figure 1-12. T/R Switch

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OVERVIEW: Transmitter Path Section

1.7.4 Cartesian Feedback The iDEN transmitters use MQAM modulation, which requires a highly linear PA with wide dynamic range. Linear PAs are highly inefficient, so a class AB PA is used for better efficiency and longer battery life. The class AB PA is fairly linear, but not totally, and this causes splatter in the RF spectrum around the transmitted frequency band. To reduce splattering into the adjacent channels and to meet system specifications, the transmitter uses Cartesian feedback to linearize the PA and reduce splatter. Negative feedback is a commonly used method to linearize circuits.

Cartesian feedback is the process of down converting the feedback signal to baseband and summing it with the input signal in the I & Q paths separately. One can control the 180º phase shift at baseband more precisely than at RF frequencies. The SLEDGEHAMMER is the heart of the Cartesian feedback system, and as such, is the heart of the transmitter. There is a forward path and a feedback path in the transmitter. This is a closed loop system and the loop cannot be opened without drastic consequences

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OVERVIEW: Transmitter Path Section

The forward path includes the following:

• SLEDGEHAMMER • Balun • Power amplifier • Coupler

The feedback path includes the following:

• Coupler • Feedback attenuation network. • SLEDGEHAMMER

1.7.5 Level Set and Phase Training Level set training is performed to ensure that the RF PA is not driven into clip, which would result in excess splatter and out-of-band spurious emissions. During training, the DSP signal is disconnected from the forward path and an internal analog ramp generator is connected. The feedback is monitored and compared to the analog ramp. As the ramp amplitude increases and the RF PA begins to clip, the error voltage increases. See Figure 1-16 on page 33.

The Javelin levelset circuit topology is modified slightly for Sledgehammer. The major difference is that switches are not provided to select the I-channel training waveform to the Q-channel V-I input. Instead, a programmable gain V-I is specified below on the Ichannel for boosting the reference signal level during level training. The "cnrmp" control signal is output from the levelset circuit to the I-channel V-I to control when the gain is changed.

V_TERM is a new signal input that will be OR'ed with the clip comparator output. This signal causes a controlled signal ramp down when the battery current exceeds 3A during level training. V_TERM OR'ed with the clip comparator output is sent back to the digital core to terminate the counter used for the LEVEL _TRAIN read back value

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Negative feedback is required to maintain system stability. Phase training is done to ensure that the feedback is negative (180º). The phase shift of the loop consists of the sum of the delays of several modules and components.

Operation of the Sledgehammer in a closed loop system requires the phase of the feedback path to be adjusted with respect to the forward path such that the demodulated feedback signal is the correct phase at the summing junction. This adjustment needs to take place before the loop is closed and data is transmitted, and is referred to as the 'phase training period'.

The maximum peak input signal to Sledgehammer is also scaled via the Roadrunner/DSP to insure that the maximum input signal in the data will not cause clipping to occur in the power amplifier output as a result of temperature/voltage gain variation in the forward path (primarily the power amplifier). The scaling of the input signal is a result of 'level training' which is performed in the transmit slot prior to data transmission. When level set training was implemented on the Tranlin and ODCT IC, training was done autonomously on the IC. Most of the level set circuitry was removed on the JANUS for cost savings. SLEDGEHAMMER training methods will be based on the JANUS design. The scaling of the input signal and the ramping is now performed by the DSP.The ramp signal will be applied from the DSP, and will go through the signal path of the Roadrunner IC with the gain set to maximum. The loop will be closed, but the slew rate limiter will be in a low gain (low slew) mode. A counter on the Sledgehammer will begin counting from the beginning of the timing event associated signal 'LAGC' and its' associated timing parameter "D". The loop will perform an AGC function in the beginning portion of the ramp in order to set the loop gain and then hold this gain value.

When the clip detect comparator determines that the loop can no longer compensate for the PA, it will disconnect the Roadrunner input and allow the slew rate limiter to ramp the signal down in a controlled manner to prevent splatter. After clip has been detected, and before the beginning of data, a SPI read is necessary for the DSP to find out at what point in time the clip occurred. Based on this information, a reference level will be set in the Roadrunner. Providing level set in this manner will require at least two SPI activities. The first activity is to read back the timing value "D" from the Sledgehammer IC. The second is to write the gain setting for the Roadrunner.

Both phase and level training are required at least once before transmission of the data in the first slot, but not necessarily performed in every transmit slot. DC training will be performed at the start of every SLOT. All timer values associated with SLOT rising edge will be increased with respect to JANUS program values to account for the DC training time.

Unlike JANUS, Sledgehammer provides the ability to terminate the level training ramp by either the internal Sledgehammer clip detector or an external control digital signal V_TERM. V_TERM indicates when the battery current exceeds 3 Amps, which is used to terminate the training ramp to avoid an early radio shutdown during level training.

Shutdown is avoided by lowering the transmit power when V_TERM is detected. This signal goes directly to the levelset circuitry.

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OVERVIEW: Receiver Path Section

1.8 Receiver Path Section The receiver is a direct conversion receiver. It operates in the commercial portion of the land-mobile receiver band (851-870MHz and 935-940). The receiver takes an incoming RF signal, down-converts it to baseband where it is then amplified, filtered, digitized and then provided to the DSP MODEM. The receiver has, automatic gain control (AGC) to maintain good linearity over a wide range of incoming signals. The AGC circuitry also prevents clipping of high-level signals.

Figure 1-14. i465 Block Diagram

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OVERVIEW: Receiver Path Section

1.8.1 Rx Front End (RXPath) The Phoenix Lite module (U501) contains the antenna switch. The antenna switch routes the received signal from the antenna pin input to the receiver block. During transmit mode, this switch disconnects the receiver path and connects the antenna to the transmit path. The passive SAW filters and the associated switches, along with the active LNA and the balun circuit, are all implemented as discrete components. The triple preselector SAW filters protect the RF LNA from strong, out-of band signals. There are three filters (800MHz, 900MHz, and ISM) that are appropriately selected by the RF switches, for the appropriate band of operation. The low-noise amplifier (U200) provides the gain to achieve the necessary receiver system take over gain and the AGC stage provides continuous attenuation to avoid overload of the receiver backend. Finally, the balun facilitates the conversion of the single ended LNA output to a differential signal that is necessary to feed the input block of the Sledgehammer IC.

1.8.2 Sledgehammer IC (RXPath) The Sledgehammer IC (U2051) contains the frequency synthesizer, down-conversion mixers, baseband amplification and filtering stages. The main function of the Sledgehammer IC is to translate the RF input signal in to the two I and Q baseband differential signals. The signal path has a fixed amount of gain and also contains the DC offset correction circuitry. The IC contains basic analog anti-aliasing filtering. The IC also supplies a digital control line to the Janus module that enables the LNA.

1.8.3 Roadrunner IC (RX Path) The Roadrunner IC (U701) performs the digital conversion, digital filtering, and the AGC control of the radio. The main function of the IC, from an RX perspective is the Analog to Digital conversion performed by the Sigma Delta converter. This digitized output signal is processed by FIR and IIR filtering and then the final output is framed and sent to the Baseband Processor via the Receive Synchronous Serial Interface Bus. The IC also controls both the RF step attenuator and the continuous AGC control lines. The RF step attenuator is enabled via SW and the Roadrunner logic line signals the iDEN LNA to enable the attenuator when the unit receives a desired signal stronger than -50dBm. The continuous AGC functionality is controlled by an analog voltage line which feeds the LNA. This voltage ranges from approximately 1.3875 V to 2.5 V and increases linearly for signals greater than ~-60dBm at the antenna input.

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OVERVIEW: Frequency Generator (RF) Section

1.9 Frequency Generator (RF) Section

This section contains the following main components of the RF board:

• TCXO based Reference Oscillator Circuit. • Host system clock synthesizer. • (SLEDGEHAMMER) Phase Locked Loop synthesizers (Main & Escort). • Main/RX Voltage Controlled Oscillator (VCO - U300). Note Main/RX VCO output

used as source to Main Prescaler input of SLEDGEHAMMER main synthesizer PLL.

All frequencies in the i465 originate from the 33.6 MHz reference frequency provided by SLEDGEHAMMER synthesizer and the TCXO based reference oscillator circuit. The Y600 TCXO generates the 33.6 MHz signal, which is temperature compensated.

Figure 1-18 illustrates the frequency generator circuitry path:

Figure 1-18. Frequency Generator

Reference Oscillator

The 33.6 MHz reference is generated by temperature compensated crystal oscillator (TCXO) and fed to SLEDGEHAMMER IC (CLKOUT) output provides a stable and accurate 33.6 MHz reference frequency for the synthesizers. This 33.6 MHz signal is sent to Bluetooth, SLEDGEHAMMER and ROADRUNNER as a reference. This reference is divided down to a 4.2 MHz reference for the transmitter (TCLK).

U300

U2051Multi-Band Transceiver

Y600 TCXO

U1000 Bluetooth

U701

Power Management IC /Digital / Audio IC

U801

DSP AFC

1702 - 1740 MHz 1870 - 1882 MHz 1804 - 1856

Loop Filter

÷ R PFD

Loop

÷

÷ N

PFD

U300 RX

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OVERVIEW: Global Positioning System (GPS) Section

1.10 Global Positioning System (GPS) Section The U.S. Department of Defense (DoD) operates a constellation of 24-satellites, employed for location and/or navigational purposes, on earth. These satellite vehicles (SV) operate in circular orbits, round the earth every 12 hours, at an altitude of 20,200 km. The SVs transmit earth-bound radio signals at a 1575.42 MHz fixed carrier frequency—an L1 band for non-military applications. Since the SVs utilize one carrier frequency, by employing a Spread Spectrum modulation technique, each SV can be uniquely identified from an assigned Pseudo-random Noise (PN) Code.

To determine a location on earth, a receiver must be built that can receive the simultaneous signals from the satellites that are in view of the receiver and use that information to calculate the location of the receiver. The receiver must pick up the signals from 4 satellites. Once the 4 satellites are located, the receiver measures the time it took for the satellite signals to arrive. From this timing information, the distance between the receiver and each satellite can be calculated. The four satellites’ ephemeris data provide the satellite’s X, Y, and Z positions. The range, R, is the receiver measurement made by calculating the time it took for the signal to reach the receiver. The user’s position, (Ux, Uy, Uz), and the clock bias, Cb, is then calculated.

To use the GPS, a receiver that can receive the spread-spectrum signals must be built. The detected signals are then converted from RF signals into appropriate digital input formats. These digital inputs are processed and converted into position information.

1.10.1 GPS Receiver A block diagram of the receiver for the i465 is shown in Figure 1-19. The GPS receiver is based on the SiRF SiRFStarIII GPS chipset.

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OVERVIEW: Global Positioning System (GPS) Section

1.10.2 GPS Antenna The GPS antenna is a unique part, tuned to the center of the GPS band at 1575.42MHz.

1.10.3 GPS Pre-selector This pre-selector is used to isolate the GPS signal from the iDEN signal, as well as other RF signals collected by the GPS antenna.

1.10.4 GPS LNA The GPS LNA provides gain while introducing minimal noise, thus improving the sensitivity of the GPS receiver. Expect about 20 dB of gain through this LNA.

1.10.5 SAW FILTER This SAW filter enhances the iDEN to GPS isolation and attenuates all signals outside of the GPS band.

1.10.6 BALUN This Balun converts the single-ended signal to a differential signal.

1.10.7 GPS Down-Mixer SLEDGEHAMMER IC is a multi-purpose IC that hosts a number of components in the GPS lineup. For GPS, the SLEDGEHAMMER IC mainly mixes down the differential RF signal to differential IF signal and provides the GPS clock to the next stage.

1.10.8 GPS A/D Conversion The ROADRUNNER IC is mainly a DC management IC but also converts the analog GPS IF signal to digital signal ready to be processed by the ZEUS IC.

1.10.9 GPS Digital Processing

The ZEUS IC is the main processor for the radio. The ZEUS IC also processes the GPS signal to calculate the GPS locations and provides the GPS AGC control to the Sledgehammer IC. The baseband digital signals are input to the SiRF processor circuit (integrated in ZEUS) which in turn computes the position information. Once the position is determined, it is communicated to the handset microprocessor and displayed on the screen for personal use or transmitted to the base station for E911 as required.

1.10.10 GPS Reference Oscillator

A 33.6 MHz clock signal is used by the Sledgehammer RF circuit as the frequency reference for its internal local oscillator. This clock is a temperature compensated crystal oscillator whose frequency accuracy is held to within 0.5 ppm. The high accuracy of the clock frequency plays a critical role in determining the time it takes to calculate the position coordinates.

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OVERVIEW: Bluetooth® Wireless System

1.11 Bluetooth® Wireless System Bluetooth technology is used for short range wireless communications that do not require high data rates. The original usage models included telephone, headsets, low-data rate access point, file transfer, and automatic synchronization. The newer usage models have added human interface devices, remote control, print capability, cable replacements and personal area networks.

Bluetooth devices use GFSK modulation in the 2.4 to 2.4835 GHz band. The channels have a bandwidth of 1 MHz. Frequency hopping is used to provide immunity to interference. The master unit in a pico-net dictates the hopping sequence at a rate of 1600 hops per second. This translates to a 625 uS transmission. The maximum data rate through a Bluetooth device is 3 Mb per second.

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PREPARING FOR FIELD LEVEL TESTING: Preparing Equipment for Testing

Chapter 2

PREPARING FOR FIELD LEVEL TESTING Field level testing requires external equipment and support. To conduct field level trouble-shooting and testing of an i465 unit, you must become familiar with the screen readouts of the recommended test equipment.

Display screens provide information that is useful for troubleshooting purposes. Refer to Chapter 3 for information on the displays, errors, alert tones, and messages associated with this unit.

2.1 Preparing Equipment for Testing To ensure accurate testing of an i465 unit, it is important that the test equipment function properly.

2.1.1 Calibrating Equipment Test equipment should be internally calibrated before being used for testing. Note that the internal calibration does not substitute for a factory calibration. For more information, refer to R-2660 Digital Communications System Analyzer Operator’s Manual.

2.1.2 Checking the RF Cable Check the cable connection and quality to ensure that the test results are true. Cable length is criti cal to consistent Rx sensitivity and Tx power measurements. Use a high-quality, shielded, 50-ohm, coaxial cable that is approximately 1.5 feet in length. Place the unit to be tested at least 6 inches from the call box. The cable loss should be less than 2 dB.

2.1.3 Strong-Signal Environments

When using the R-2660 Communications System Analyzer to test a unit in a strong-signal environment (–75 dBm or stronger), change the bandmap of the unit.

For Registration/Call testing: Power up the unit. Immediately after hearing the beep, press Start on the R-2660. The unit will lock onto the first strong signal.

2.1.4 Protecting Static-Sensitive Devices

This unit contains static-sensitive devices that must be protected when opening the unit, or storing and transporting any printed-circuit board. Consider the following information to create a proper ground:

• Ground the working surface of your service bench. If possible, use the Motorola Static Protection Assembly (P/N 01803 86A82) to ground your service bench. This assembly contains a wrist strap, two ground cords, a table mat, and a floor mat

• Wear a conductive wrist strap in series with a 100 kΩ resistor to ground.

• Do not wear nylon clothing when handling any printed-circuit board.

• Prior to touching any printed-circuit board, touch an electrical ground to remove any static charge that might have accumulated.

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PREPARING FOR FIELD LEVEL TESTING: Preparing Equipment for Testing

Refer to Service and Repair Note SRN-F 1052 for more information. This note is available through: Motorola Literature Distribution Center 2290 Hammond Drive Schaumburg, IL 60173 847-576-2826

The following should be considered when storing or transporting a circuit board: • Place the printed-circuit board in conductive, anti-static material. • Do not insert the printed-circuit board into conventional plastic “snow” trays used for

transporting other devices.

2.2 Using RSS Use Radio Service Software (RSS) to program a new software version or to update user information in the codeplug. Refer to “Connecting the Unit to the RSS Workstation” and the Radio Service Software Read-Me’s for information on the setup and use of RSS.

NOTE: You can use the RSS online Help for locating specific information about RSS dialog boxes and fields. To access online Help, press F1 while you are viewing an RSS screen.

If you are using the R-2660A Communications System Analyzer in the iDEN mode, which is 6:1 capable, use RSS to program an i465 unit for Full Rate operation. Use the 6:1 Interconnect softkey for all interconnect testing.

If you are using the R-2660B or later, which is 3:1 capable, use RSS to program an i465 unit for Half Rate operation. Use the 3:1 Interconnect softkey for all interconnect testing.

In the carrier version of RSS (but not the agent version), you can change interleave values. To access the fields where you can change these interleave values, go to the User Ergonomics dialog box, and then click on the Interleave tab.

NOTE: After servicing an i465 unit, use RSS to reprogram the unit back to its original operating state.

Refer to the R-2660 Digital Communications System Analyzer Operator’s Manual for more information on how to set up this equipment for iDEN mode testing.

2.3 Connecting an i465 Unit to the R-2660 The R-2660 Communications System Analyzer enables you to monitor and perform tests on an i465 unit. Figure 7-1 shows the i465/R-2660 test setup.

Equipment Required: R-2660, reference SIM card, SMA to N-type RF coaxial cable, battery eliminator, 5.0-12.0 Vdc power supply.

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PREPARING FOR FIELD LEVEL TESTING: Preparing Equipment for Testing

Figure: 7-1. Typical R-2660 Setup

To connect the unit to the R-2660: 1. Ensure the unit is powered off, and then turn on the R-2660.

2. Remove the battery cover and battery from the unit, and insert the reference SIM card.

3. Attach the battery eliminator to the back of the unit.

4. Engage RF.

5. Connect the SMA connector of the RF cable to the RF connector on the battery eliminator.

6. Connect the N-type connector of the RF cable to the R-2660 RF In/Out connector.

7. Attach the power leads on the battery eliminator to the DC power supply.

8. Turn on the power supply, and adjust output between 5.0 and 12.0 Vdc. With the correct

setting, the regulated battery eliminator will provide 4.0 Vdc to the subject unit.

9. If power supply is capable, set current limit = 4.0 A.

10. Power up the subject unit.

2.4 Operating the R-2660 Refer to the R-2660 Digital Communications System Analyzer Operator’s Manual for more information on how to use and operate this equipment.

CAUTION: Be very careful to observe polarity when connecting power to the battery eliminator.

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PREPARING FOR FIELD LEVEL TESTING: Dis-Assembly and Assembly of i465

2.5 Dis-Assembly and Assembly of i465 Unit

Motorola recommends the service technician follow a prescribed disassembly sequence to access specific items or components of the unit. This product is an efficiently designed package that incorporates the physical overlap and integration of some modular components. Refer to the Disassembly Sequence Flowchart for a suggested path to reach specific components.

NOTE: In some cases, the technician may not need to remove certain components to reach others.

2.6 Disassembly Procedure NOTE: Screws used to assemble the i465 main housing are: 6 housing assembly screws, T-6 drive.

2.6.1 Disassembly Sequence Flowchart Note: i465 flip components include a Flex Connector ribbon which can be easily torn or damaged if not handled properly. Handle the Flex Ribbon with care especially when working it through the front housing slot.

Main Board

LCDFront Housing

Back Housing

Battery Cover

SIM Card

Battery

Keypad

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PREPARING FOR FIELD LEVEL TESTING: Battery Cover, Battery, and SIM Card Removal

2.6.2 Battery Cover, Battery, and SIM Card Removal

1. Place Unit face down, open Audio Jack Seal, and slide Battery Door towards the bottom of the unit.

2. Lift and remove Battery Door. 3. Lift the back of the battery with fingernail. 4. Lift the battery from the back and remove from the unit. 5. Depress the SIM card lock and push the SIM card from the back, through the opening using a

black stick. 6. Slide the SIM Card outward. Being careful not to touch the contacts.

1 2

3

6 5

4

SIM card lock

BK70

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PREPARING FOR FIELD LEVEL TESTING: Opening the Unit

2.6.3 Opening the Unit

Tools Required: Torx Driver & #6 Torx Bit

1. Remove all six screws from the back of the unit 2. Separate the front housing from the back housing. 3. Remove the Kapton Tape from the Ziff connector. 4. Remove the Ziff flex from the Ziff board connector.

1 2

3 4

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PREPARING FOR FIELD LEVEL TESTING: LCD Removal

2.6.4 LCD Removal

Tools Required: None required

1. Remove the LCD from the front housing. [Avoid touching the display glass with fingers]. 2. Place a protective liner on the LCD to minimize debris collection on the display.

1

2

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PREPARING FOR FIELD LEVEL TESTING: Keypad and Main Board Removal

2.6.5 Keypad and Main Board Removal

Tools Required: Torx Driver & #5 Torx Bit

1. Remove the two screws holding the Keypad Board to the Back Housing 2. Lift the Keypad Board from the right side. 3. Remove the Camera Flex from the back housing carefully to avoid damage to the flex.

3

1

2

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PREPARING FOR FIELD LEVEL TESTING: Vibrator and Main Board Removal

2.6.6 Vibrator and Main Board Removal

Torx Driver & #5 Torx Bit

1. Remove the Vibrator and transducer from the keypad board. 2. Disconnect the 30pin BTB connector from the keypad board. 3. Remove the two main board screws and two micro USB Clip screws from the unit. 4. Remove the main board from the Back Housing (Ensure not to damage the battery contacts

or the FJA antenna contact).

1 2

3 4

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PREPARING FOR FIELD LEVEL TESTING: Assembly Flow Chart

2.7 Assembly Procedure

2.7.1 Assembly Flow Chart

Lens

Main Board

Keypad Board

Front Housing

Back Housing

Battery CoverSIM Card Battery

LCD

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PREPARING FOR FIELD LEVEL TESTING: Main Board Inspection

2.7.2 Main Board Inspection Inspect the main board to verify that the following parts are not damaged, bent, or defective

SSIIMM CCOONNNNEECCTTOORR AAUUDDIIOO JJAACCKK

UUSSBB CCOONNNNEECCTTOORR

WWAATTEERR IINNDDIICCAATTOORRSS RRFF CCOONNNNEECCTTOORR

MMAAIINN BBOOAARRDD LLAABBEELL

MMIICCRROO UUSSBB CCLLIIPP

SSPPAACCEERR AADDHHEESSIIVVEE

CCOONNNNEECCTTOORR

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PREPARING FOR FIELD LEVEL TESTING: Main Board Assembly

2.7.3 Main Board Assembly

Tools Required: Main board screw driving fixture: D309-22

1. Place the main board into Back Housing (Ensure not to damage the battery contacts or the FJA antenna contact). 2. Open the top cover of the fixture and place the assembly into fixture and close the fixture cover. 3. Drive two main board screws and two micro USB Clip screws in the order shown.

3 1

3 4

2

1

2

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PREPARING FOR FIELD LEVEL TESTING: Back Housing Inspection and Preparation

2.7.4 Back Housing Inspection and Preparation Inspect the Back Housing to verify that the parts are not damaged, bent, or defective. Ensure

The printing on the label clear and straight.

1. Assemble the transducer into transducer seal. 2. Apply the poron backer on camera flex. 3. Remove the adhesive liner of the main board and rear housing. 4. Assemble side key into back housing.

1 2

3 4

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PREPARING FOR FIELD LEVEL TESTING: Vibrator Installation

2.7.5 Vibrator Installation

Tools Required: None Required

1. Assemble seal, vibrator to the reciprocal location of the keypad board assemble transducer assembly to keypad board slot.

2. Connect 30pin BTB connector to keypad board. 3. Remove the liner on camera and back housing and Apply the flex to back housing

1

2

3

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PREPARING FOR FIELD LEVEL TESTING: Keypad Board Installation

2.7.6 Keypad Board Installation

Tools Required: Keypad Connector Press Fixture:D309-23

1. Locate the keypad board to main board, push the transducer subassembly to keypad board. Press the keypad over the location of connector and adhesive manually.

2. Place the assembly into the nest, push nest under the press, then press.

1

2

(Pressure:0.65+/-0.05Mpa, Press time:5S)

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PREPARING FOR FIELD LEVEL TESTING: Keypad Board Screw Installation

2.7.7 Keypad Board Screw Installation

Tools Required: Keypad Screw Driving Fixture:D309-24

1. Open the top cover of the fixture, place the assembly into fixture 2. Close the fixture cover. 3. Drive two keypad board screws.

1

2 3

2

1

Torque: 0.63-0.77Ibf *in (0.72-0.88Kgf *cm)

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PREPARING FOR FIELD LEVEL TESTING: Adhesive Application

2.7.8 Adhesive Application

Tools Required: Front Hsg. Alignment Adhesive Fixture:D309-42

Lens Adhesive Alignment Fixture:D309-39

1. Position the adhesive on fixture with sticky side upward. 2. Align the front housing onto fixture. 3. Position the Lens adhesive on fixture with sticky side upward. 4. Align front housing onto the lens fixture.

1 2

3 4

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PREPARING FOR FIELD LEVEL TESTING: Lens Installation

2.7.9 Lens Installation

Tools Required: Lens Press Fixture:D309-40 Felt to Lens Fixture:D309-44

1. Stick the felt port transducer on lens in the recess area, and press it in the fixture. 2. Place the lens onto the front housing. 3. Apply the protective liner to the inside of the lens. 4. Put front housing into the nest, then press the button of nest two side at the same time, press lens to activate the adhesive, take front housing out of nest after press complete.

(Pressure:0.35+/-0.05Mpa, press time: 5S)

1 2

3 4

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PREPARING FOR FIELD LEVEL TESTING: LCD Installation

2.7.10 LCD Installation

1. Remove the inside liner of the lens 2. Remove the liner of the LCD. 3. Place LCD into front housing. [Keep the top edge of the LCD close to the top edge of the front

housing assembly]. 4. Remove the liner of the front housing adhesive.

1 2

3 4

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PREPARING FOR FIELD LEVEL TESTING: Closing the Unit

2.7.11 Closing the Unit

Tools Required: Front housing to keypad press fixture:D309-26

1. Connect ZIF connector. 2. Place the Kapton tape on the connector. 3. Alignment the front & back housing and press it together. 4. Place the unit into the nest. 5. Slide nest under the press. 6. Apply pressure using Fixture: D309-26. Pressure:0.2+/- 0.05Mpa Press time:5S

1 2

3 4

5 6

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PREPARING FOR FIELD LEVEL TESTING: Keypad Board Installation

2.7.12 Keypad Board Installation

Tools Required: Main screw driving fixture:D309-27

1. Open the top cover of the fixture and place the unit into fixture. 2. Close the fixture cover. 3. Torque the 6 screws in the order shown

1

2 3

Torque: 1.2-1.4Ibf *in (1.38-1.61Kgf *cm)

2

1

3

4

5

6

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PREPARING FOR FIELD LEVEL TESTING: Keypad Board Screw Installation

2.7.13 SIM Card, Battery, and Battery Cover Installation

1. Follow the diagram on the back housing to ensure proper alignment 2. Push the SIM card in toward the middle of the unit 3. Angle the Battery (Approx. 45 degrees) into the back housing with the battery contacts toward

the bottom of the unit. 4. Slide the battery in and push the back of the battery down 5. Align the Battery Door on the Unit 6. Slide toward the top of the unit. 7. Close the Micro-USB/Audio Jack Cover.

1 2

3

6 5

4

BK70

7

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TROUBLESHOOTING: Digital Analysis Test

Chapter 3

TROUBLESHOOTING 3.1 Digital Analysis Test Use this test for troubleshooting the digital section.

Didthe unit pass the

Initialize RCEtest?

Check the testpoints, TP-RX and TP-TX,for proper communication

between theROADRUNNER and

PATRIOT.

Apply 7.8V at J7pin 4 (EMU_ID)

Assert MOD,and then power on

the unit.

Check EMU connectorcontinuity, and visually

inspect for excess plasticblocking contacts.

Initialize RCE.

Check the voltages on the ROADRUNNER.Check 32 kHz (CKIL).

Check 16.8 MHz (CKIH)ROADRUNNER generates 32 kHz. and

SLEDGEHAMMER generates 16.8 MHz.

DefectiveROADRUNNER.

Is the unit drawing10-250 mA?

DefectivePATRIOT.

No TX, with RXNo RXPass

Fail

Pass

Fail

Continuedon next page

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TROUBLESHOOTING: Digital Analysis Test

Digital Analysis Test (Continued)

Didthe unit pass the

Initialize DSPtest?

Initializethe DSP.

Load Setfiles to configure thechip selects.

Test theexternal SRAM.

Check for adefective PATRIOT.

Check for adefective PATRIOT.

Pass

FailDidthe unit pass the

Load Setfilestest?

Pass

Fail

Continuedon next page

Continued from previous

Page

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TROUBLESHOOTING: Digital Analysis Test

Digital Analysis Test (Continued)

Test the DSP memory, internal SRAM, and ROM-all cells.

The DSPinside the PATRIOT

is defective.

Check for adefective PATRIOT.

Pass

Fail Didthe unit pass the

Initialize DSPtest?

Did theunit pass the 8M

x16 SRAM test allcells?

Didthe unit pass the

DSP Memorytest?

The Flash or the PATRIOT isdefective. Also, check for

opens and shorts on the MainBoard and PATRIOT.

Check the PATRIOTand Main Board for

opens or shorts.

Pass

Fail

Continuedon next page

Continued from previous

Page

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TROUBLESHOOTING: Digital Analysis Test

Digital Analysis Test (Continued)

Did the vibratorTurn on?

Replace or repair,as needed.

The Digital sectionsuccessfully passed

all tests.

Test thevibrator.

Pass

Fail

Pass

FailDidthe backlight

turn on?

Replace or repair,as needed.

Test the backlight byturning it on.

Continued from previous

Page

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TROUBLESHOOTING: LO Output Test

3.2 LO Output Test

Is there asignal at MAIN VCOIN

port?

Check for opens, shorts, or wrong parts in the main VCO loop filter

C301, C303, C305, C306, C307, C308, C309, C310,

R601, R602 ,R603

RX Main VCO injection toSLEDGEHAMMER. Using a high

impedance probe on the spectrum analyzer,check the LO output at junction of C312 andthe SLEDGEHAMMER MAIN VCOIN port.

The RX Main VCO FGUis working properly.

Probe for the LO signal at U300 pin 1.

Check U300 pin 5,C690, C300, L300for shorts to ground.Repair as necessary

and retest. CheckU701 for proper

supplies and modeprogramming. If all is

correct, replace U701.

Check VCO band select linesfor 800 band U300 pin 7 ishigh, pin 8 is low. For 900

band U300 pin 8 is high, pin 7is low. (Sel1-8;Sel2-7

Replace U300and retest.

Check for opens, shorts, or missing

components on R600, L301, L304, C312.

Check for a bad connection from the

U300 to the radio board.

Check for a bad connection fromthe U300 to the radio board.

Pass

Fail

Is thecorrect band

select line high(2.775 Vdc)?

Is the LO signal atU300 pin 1?

Is SFout Voltage (2.5 Vdc) at U300 pin 5 or

C690.

Isthe signal level

at least -10 dBm or70mV Rms?

Isthe signal at

1702.025 MHz(851.0125) or 1870.0375

MHz (935.01875)?

Iscontrol V @

U300 pin 8 between0.5 and 2.1

Vdc?

B

CB

C

Check for opens, shorts,at C302 or

L302,C304 or L303(pins 8 or 7). Verify

proper programmingcommands. If all is

correct replace U300.

Pass

Fail

Pass

Fail

Note: Run the RX BER 851.0125 Test before

beginning this test. (Run the RX BER 935.01875 Test before beginning to test the 900 MHz band.)

Use this test on a unit with the following symptom: no RX.

LO Frequency Range:1699.535 MHz to 1740 MHz (800 band)

1869.9 to 1882.4 MHz (900 band).

Fail

FailFail

Fail

Pass

Pass

Pass

Pass

Pass

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TROUBLESHOOTING: RX Main VCO Test

3.3 RX Main VCO Test

Is therea signal at the

SLEDGEHAMMERVCO_IN port

?

Using a high impedance probe onthe spectrum analyzer, check the LOoutput at the junction of C312 on the

SLEDGEHAMMER VCO_IN port.

Probe for the LO signal by placing the probe on the VCO module pin 1.

The level will be low. Adjust the spectrum analyzer accordingly.

Check for opens,shorts, or missing components

on the Sfout line.

Check band select lines. For 800band, voltage at C302 is low andvoltage at C304 is high. For 900

band, voltage at C302 is highand voltage at C304 is low.

Check for opens, shorts, or missingcomponents on the RX VCO outpath. Check for a bad connectionfrom the VCO module to the radio

board or a bad VCO module.

The FGU is working properly. Further investigation in the

FGU requires noise performance or locktime

testing, such asH&N or SBN.

Check for opens, shorts, or missingcomponents on R600, L301, and L304.

Check for a bad connection from the VCO module to the radio board.

Pass

Fail

IsLevel >2.5 V

?

Isthe LO signal at

VCO output?

IsSFout voltage

(2.55 Vdc) at U300pin 5

Isthe signal level atleast 70mV Rms

?

Isthe signal at

1702.250 MHz(800 band) or

1870.0375 MHz(900 band)

?

Check for opens, shorts,or missing components

On C302, C304, L302, L304, U300, and U701.

If OK, see Digital Analysis Tests.

Pass

Fail

Pass

Fail

Note: Run the RX BER 851.0125 Test before

beginning this test. (Run the RX BER 935.01875 Test before beginning to test the 900 MHz band.)

Use this test on a unit with the following symptom: no RX.

LO Frequency Range: 2x RX Freq. 851.0125 MHz = 1702.025 MHz (800 band) 935.01875 = 1870.0375 MHz (900 band).

Fail

FailFail

Fail

Pass

Pass

PassIf no opens/shorts or

missing components arefound, on SFout line,

Replace theROADRUNNER.

Continuedon next page

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TROUBLESHOOTING: RX Main VCO Test

RX Main VCO Test (Continued)

Is thevoltage between0.5 and 2.1 Vdc

?

Check that the voltageat R603 is between

0.5 and 2.1 Vdc.

Check that the TCXO oscillatorfrequency is 33.6 MHz +84 Hz.

There is no issue withthe control voltage.

Ensure the correct band select is chosen. For 800 band, U300 pin 8/C302 is low and pin 7/C304 is high. For 900 band U300 pin

7/C304 is low and pin 8/C302 is high.

Check for a problem inthe TCXO oscillatorcircuit. Refer to the

TCXO Oscillatorflowchart.

Check for a problem in theVCO module. Replace the

module and test again.

Correct band isselected.

Pass

FailIs

the voltage railed low(<0.5 Vdc)

?

Is theTCXO frequency

within range?

Isthe voltage railedhigh (>2.1 Vdc)

?

Fail

Pass

Fail

Fail

Pass

Check for opens, shorts, or missingcomponents in the loop filter. Ensure SEL1 and SEL2 voltage levels are programmed

properly.Ensure SLEDGEHAMMER commands are proper.

Continued from previous

Page

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TROUBLESHOOTING: Keypad Failure Test

3.4 Keypad Failure Test.

Onlyone keyfailed?

Replace thePatriot-U801.Ohm out the

keypad row/column.

Check for opensor shorts under FL1 and FL2 or

FL401 and FL402.

No keys arefunctioning. Checkfor opens or shorts

under FL1 and FL2 orFL401 or FL402.

Press each keyon the keypad

one key at a time.

Check keypad switch.Ohm out key to otherkeys in the same row

and columns.

Check if holding downthree buttons in a row

puts the unit in MATest Mode.

Pass

Fail Otherkeys in same row/

column failed?

Use this test on a unit with the following symptom: keypad failure.

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TROUBLESHOOTING: SLEDGEHAMMER Test

3.5 Sledgehammer Test

Is thevoltage at R6000

2.775 Vdc(V2_GPS)

Go to thetest flowcharts forvoltage regulator

verification.

CheckL204 for

2.775 Vdc (V2-RX).

Go to thetest flowcharts forvoltage regulator

verification.

Pass

Fail

Isthe voltage

at L204correct 10%?

Is thevoltage at C620

and L605 at 1.875Vdc10%?

Pass

Fail

Is thevoltage at E600

(SF_OUT) at 2.56 Vdc10%?

The problem is in theSLEDGEHAMMER.Repair or replace, as

necessary.

Go to thetest flowcharts forvoltage regulator

verification.

Use this test to check the SLEDGEHAMMER circuitry.

Pass

Fail

Pass

Fail

Continuedon next page

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TROUBLESHOOTING: SLEDGEHAMMER Test

Sledgehammer (Continued)

Isthe voltage

at C302~ 0 Vdc and voltage at

C304 ~ 2.775 Vdc?

Remove U300, and check

the voltage again.

1. In BERBUG, type thefollowing: >rx static>mode rx (Ignore themessage returned).2. Check the voltageon C302 and C304.

The SLEDGEHAMMERis functional.

Pass

Fail

Is thevoltage at C302

~ 0 Vdc and voltage atC304 ~ 2.775 Vdc?

ReplaceROADRUNNER IC.

The problem is in theVCO module. Replacethe module and run the

test again.

Pass

Fail

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TROUBLESHOOTING: RX Analysis Test

3.6 RX Analysis Test

Use this test on a unit to perform a RX analysis in iDEN mode.1. Set up the R-2660 as follows: Mode: iDEN Test, Meter: RF DISPLAY, RF Control: GENERATE, FREQ: (SeeTable) MHz, Gen: OUT6/6, Gen: -60 dBm, RF I/O.2. Set the spectrum analyzer to Center Freq: 851.000 MHz (935.01875 MHz for 900), Span: 100 kHz, Amplitude:-30 dBm reference level. Set marker to test frequency, and use Trace and Max. Hold to obtain readings. Use Clearbefore taking each reading.3. Except as noted, use a 50-ohm probe for all RF measurements. The probe ground must make contact with theboard ground during the measurements.4. Check that signal measurement levels are 3dB at each test point, unless otherwise stated. A low RSSI level willresult in higher BER as the signal becomes weaker.5. The RF cable from the R-2660 to the unit under test (UUT) should be <18 inches for these measurements in thisflowchart.6. Be sure to check for any defects, such as unsoldered connections, shorts, broken or defective components.7. Remove the antenna from the UUT before beginning these tests.

Do voltagesagree with

table +- 5%?

Inject a -50 dBm CW tone into the RF jack at the selected frequency from the table with a frequency offset (+ 2KHz).

Place Radio into BERBUG, and send the following commands:RX STATICRX FREQ XXX ( XXX is one of the frequencies from the table)MODE RX

For the programmed frequency, measure voltages on the capacitors in

the table.

Check U3003, U3004, C203, C60054 and C252 for S,US, MP and DFP then if no faulty remove U3003 and U3004

Pass

Fail

Were allfrequencies from

table tested?

Pass

Fail

Abbreviations:S - check for ShortsUS - check for unsoldered parts / open connections MP - check for missing partsDFP - check for defective parts

Do voltagesagree with

table +- 5%?

Measure voltages on the Roadrunner side.

Replace U3003 and U3004

Check C203, C60054 and C252.Check DC section, then if no fault

found replace the Roadrunner IC (U701).

Frequency GP03 GP04 GP05(MHz) C252 C60054 C203

806 0 0 2.775915.525 2.775 0 0937.49375 0 2.775 0

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TROUBLESHOOTING: RX Analysis Test

RX Analysis Test (Continued)

Test851.0125 MHz

(935.01875 MHz for 900)for -61.5 dBm at C204

(C60057)

If within +/-4 dBm, use thisas an offset factor for all

subsequent readings.Otherwise, recalibrate the

R-2660.

At the antenna connectorM500, test for a -60 dBm(+/-1 dBm) 851.0125 MHz,935.01875 MHz for 900Quad 16QAM signal.

Isthe Quad 16QAM

signal correct?

Check U3003 forUS, MP, DFP, etc.

Check antenna inputswitch or connector for

US, MP, DFP, etc.

Test851.0125 MHz

(935.01875 MHz for 900)for -61 dBm at

C201.

Pass

Fail

Abbreviations:US = Unsoldered components or connectionsMP = Missing partsDFP = Defective parts

Continuedon next page

Pass

Fail

Pass

Fail

Test851.0125 MHz

(935.01875 MHz for900) for -63.5 dBm at C60059

(C60058)

Check componentsfrom FL201 for US,

MP, DFP, etc.Fail

Pass

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TROUBLESHOOTING: RX Analysis Test

RX Analysis Test (Continued)

Check on U200, C60060, C202, L200, C205,

R201, L201, C60056, C206, R200, L202, C207, C60055 and R204 for

US, MP, DFP, etc.

Check U3004US, MP, DFP, etc.

Test851.0125 MHz

(935.01875 MHz for900) for -64 dBm at U3004 at

Pin1 or C60060

Check on the DC section, then if not

faulty, replace Sledgehammer IC

(U2051).

Measure voltage onpin 3 of LNA Life.

Test851.0125 MHz

(935.01875 MHz for 900)for -50 dBm at L202

output.

Pass

Fail

Abbreviations:US = Unsoldered components or connectionsMP = Missing partsDFP = Defective parts

Continuedon next page

Pass

Fail

Pass

Fail

Continued from previous

Page

Replace the part

FailIsthe voltage

2.775.

Pass

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TROUBLESHOOTING: RX Analysis Test

RX Analysis Test (Continued)

Check C621, C622, R204, L204, C222 , C223, C623, C624, C221, R609 E602, C629, C630, C212, C213,

for S, US, MP, DFP. Check DC section, then if no faultfound replace the Sledgehammer IC (U2051).

Are voltages

1.4V +/-10%?

Check C621, C622, R204, L204, C222 C223, C623, C624, C221, R609, E602, C629, C630,

C212, C213, for S, US, MP, DFP. Check DC section, then if no fault found

Replace the Sledgehammer IC (U2051).

Check the voltage onTP_LNA_EN.

Is a tone at the

injectedfrequency offset

~ 500 mVpp +-10%?

Pass

Fail

Abbreviations:US = Unsoldered components or connectionsMP = Missing partsDFP = Defective parts

Continuedon next page

Pass

Fail

Pass

Fail

Continued from previous

Page

Measure AC voltages on TP_RXI,TP_RXIX, TP_RXQ, TP_RXQX.

Fail

Is voltage2.775V +- 5%?

Pass

Check R6011, C6012, C6011, R660, C501, C229, C228,C224, L653,C222, C303, R325, C677, E601, C676,

R655, R656, C219, C217, C216 for S, US, MP, DFP.Check DC sections, then if no fault found Replace the Sledgehammer IC (U2051).

Check FGU (VCO) section for proper operation.

With Hi impedance RF probe (Hi-Z) check RF level on either pad of C207.

Is RF level -53 dBm +-

Check R204, C60055, C60056, C205, R202, C210 C211 for S, US, MP, DFP.Check DC section, then if no fault found

Replace the LNA Module (U200)

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TROUBLESHOOTING: RX Analysis Test

RX Analysis Test (Continued)

DoesTP_RXFS

have a squarewaveform at~ 1.875Vpp

+-20%?

Check DC and Bravo section,then if no fault found replace the

Bravo IC (U801).

Is voltage onTP_RX_ACQ ~ 1.875V

+-10%?

DoesBBP_RXCLK

have a square waveform at3.36MHz at ~ 1.875Vpp +-

20%?

Pass

Fail

Abbreviations:US = Unsoldered components or connectionsMP = Missing partsDFP = Defective parts

Pass

Fail

Pass

Fail

DoesTP_SRDB

have a squarewaveform at~ 1.875Vpp

+-20%?

Fail

Pass

Continued from previous

Page

Check R627, R608, C626, C610, C217,C218, C216 and C215 for S, US, MP, DFP.

Check DC section, then if no fault foundreplace the Roadrunner IC (U701).

Check R627, R608, C626, C610, C217,C218, C216 and C215 for S, US, MP, DFP.

Check DC section, then if no fault foundreplace the Roadrunner IC (U701).

Check C627, R608, C626, R610, C217,C218, C216 and C215 for S, US, MP, DFP.

Check DC section, then if no fault foundreplace the Roadrunner IC (U701).

Problem can not be determined withoutfurther extensive analysis.

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TROUBLESHOOTING: TX Power Test

3.7 TX Power Test

With the unit in the Open Loop Power Test,measure the RF level at the PA input (C520)

Do the following:1.Set the unit to the TX Power Tune Test.2.Measure the RF level at the antenna port.

Transmit poweris OK.

Is thepower level

between 11 and24 dBm

?

Pass

Pass

Fail

Pass

Fail

Perform theSLEDGEHAMMER Test.

FailIs

power> -26 dBm

?

Perform RF PAModule Test.

Set the unit to the OpenLoopPower Test at813.5125 MHz or898.51875 MHz.

Ispower

between 27and 28.5 dBm

?

Use this test to check the transmit power circuitry.

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TROUBLESHOOTING: RF PA Module Test

3.8 TX Sledgehammer Test

Do the following: Measure the DC voltage at L503.It should be equal to the supply voltage.

The SLEDGEHAMMER ICis functioning properly.

Isthe power level

> - 26 dBm?

Pass

Pass

Fail

Pass

Fail

Fail

Run theTX Power Test again.

Fail

Pass

Perform the PAModule Test.

Do the following:1. Set the unit to the Open Loop Power Test at 813.5125 MHz.2. Measure the RF level at the PA input

Re-measure the RF level at the PA input.Is

the power level> 27 dBm?

Do the following:1. Set the unit to the TX Power Tune Test.2. Set the Power Tune softpot to Max power3. Measure the RF level at the antenna port.

Is the DC voltageequal to the supply

voltage?

Isthe power level

> - 26 dBm?

Continuedon next

page

Do the following:1. Monitor the RF waveformat the antenna port.2. Check for the correct phaseand amplitude train waveform.3. Check that the modulationpeaks are lower than theAmplitude training ramp peak.

Are thetraining waveformand modulation

OK?

Set the unit to theOpen Loop Power Test.

Pass

Fail

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TROUBLESHOOTING: RF PA Module Test

TX Sledgehammer Test (Continued)

Is the RFLevel > -19 dBm at1735.4933 MHz?

Pass

Fail

Do the following:1. Remove the SLEDGEHAMMER shield.2. Visually check all components and solder connections.3. Check R506 for 2.795V dc.

Perform theMain VCO Test.

Continuedon next

page

Continued from previous

Page

Measure the RF level at C312(Main VCO Injection toSLEDGEHAMMER).

With the oscilloscope measure theROADRUNNER baseband Modulation

output at the TP_TXI and TP_TXQ testpoints.

Note: Baseband modulation output is approx. 11 Hz

at 1.77V dc offset during the TX slot

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TROUBLESHOOTING: SLEDGEHAMMER TX Test

TX Sledgehammer Test (Continued)

Continued from previous

Page

IsDMCS highduring theTX slot?

Pass

Fail

Using theOscilloscope, verify DMCS

(TP_DMCS) is highduring the TX slot.

Verify INDYoperation

and replace asnecessary.

Verify theTX_SSI lines for activity.

ReplaceROADRUNNER.

Is ASW lowDuring theTX slot?

Pass

Fail

With the oscilloscope measure REFCLK_IN to SLEDGEHAMMER at C614 (33.6 MHz clock to

SLEDGEHAMMER).

Perform theSLEDGEHAMMER

test again.

With the oscilloscopemeasure

test point TP_ASW

Check all associated circuitsand SLEDGEHAMMER and

repair and replaceas necessary.

Is the Signal 770 mVp-p

during theTX slot?

Isthere anyactivity?

ReplaceSLEDGEHAMMER.

Perform the 33.6 MHzTCXO Test.

Is theSignal 33.6 MHz at > 200 mVp-p

during theTX slot?

Pass

Fail

Pass

Fail

Pass

Fail

Note: Baseband modulation output is approx. 11 Hz

at 1.77V dc offset during the TX slot

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TROUBLESHOOTING: Reference Oscillator Test

3.9 Reference Oscillator Test

Fail

Check 33.6 MHz atthe TCXO output

at C614 (highimpedance probe).

The TCXOis functioning

correctly.

Isthe voltage

P-P 0.6 < Vp-p< 1Vpp?

Pass

Checkvoltage at

R605.

Replace Y600

Isthe voltage

2.775V +10%?

Go to DC distributionflow charts for V4.

Fail

Pass

Use this test to check the reference oscillator circuitry.

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TRUBLESHOOTING: RF PA Module Test

3.10 RF PA Module Test

Note: Perform the Transmit Power Test before beginning the RF PA Module Test.

Use this test to check the RF PA (Radio-Frequency Power Amplifier) circuitry.

Measure the RFpower level at C520

(RF PA input).

Do the following:1. Set the unit to the TX Power Tune Test.2. Set the Power Tune softpot to max auto power.3. Measure the RF level at J500 (RF PA output).

The RF PA Moduleis OK.

Isthe power levelbetween 11 and

24 dBm?

Pass

Pass

Fail

Pass

Fail

Perform the SledgeHammer Test.

Fail

Isthe

power level> -26 dBm

?

Replace the PA (U501), Then perform the RF PA Test again.

Set the unit to the PA GainTest at 813.5125 MHz or

898.51875 MHz.

Isthe power level

between 25 and 30dBm?

Measure theRF power level

at J500 (RF PA output).

Continuedon next page

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TROUBLESHOOTING: RF PA Module Test

RF PA Module Test (Continued)

Check U501 (RF PAModule)

pin 1, 5, and 15 for(RAW B+).

Do the following:1. Set the unit to the TX Power Tune Test.2. Set the Power Tune to auto power.3. Measure the RF level at J500.

The RF PA Moduleis OK.

Isthe

power level> 11 dBm

?

Pass

Pass

Fail

Pass

Fail

Fail

IsVCONpresent

?

Replace the RF PA (U501), and then perform the RF PA Test again.

Perform ROADRUNNER

test

Isthe power level

between 25 and 30dBm?

Check U501 VCON pin 2for voltage between 0.5 and

2.2 Vdc in the TX slot.

Continuedon next

page

Continued from previous

Page

Do the following:1. Check U501 for bad solder connections.2. Check for open traces.3. Check C509, C510, C511, C512, C513, C514, and C517 for Defective components.

IsRAW B+

present at U501 pins1, 5, and 15?

Fail

Pass

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TRUBLESHOOTING: RF PA Module Test

RF PA Module Test (Continued)

Check Q500 pin 2 for a voltage of 5 V during a TX slot.

Replace the RF PA (U501).

Isthe correct

voltage present atU501 pin 16

?

Pass

Fail

Fail

Pass Pass

Fail

Perform the SLEDGEHAMMER test.

Check Q500 pin 4 for2.775 Vdc (V2_TX).

Continued from previous

Page

IsQ500 pin

at 5 V 0.2Vdc?

Fail

Pass

Repair or replace Q500and associated circuitry

(U500) then performthe RF PA test again.

Check Q500 pin 5(ASW) for low during TX slot.

Check U501 pin 16 with a scope for > 5.0 V during a TX slot.

Check for open traces. Repair or replace E519 and associated circuitry.

Check for open tracesand perform DC tests.

Isthe correct V2_TX

voltage present?

Isthe correct signal

present?

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TROUBLESHOOTING: Earpiece Speaker Test

3.11 Earpiece Test

Is the correctvoltage and

signal present?

Remove the front housing and Keypad PCB. Check J779 pins 79 and 80 for 1.38VDC and the 1KHz audio signal.

Reconnect Keypad PCB and check J3 pins 27 and 28 for 1.38VDC and

the 1KHz audio signal.

Is The Correct voltage

and signal present at E781 andE782?

Check flex traces foropens. Replace flex

assembly if necessary.

Check E781 and E782 for 1.38 Vdcand an audio signal of 1 kHz at

approx. 1Vp-p (loaded).

Isthe correctvoltage and

signal present?

In the Model AssemblyTest Mode, set the unit for

Earpiece Tone Test.

Check R470,R471, C470, C471 for US, MP,

OPP, DFP, etc.

Abbreviations:US = Unsoldered components or connectionsMP = Missing partsDFP = Defective parts

Use this test on a unit with the following symptom: no earpiece speaker audio.

Check the earpiece contacts for 1.38VDC and the 1KHz audio

signal. IF OK, replace earpiece.

Pass

Fail

Fail

Pass

Fail

Pass

Check continuity from E781 to R471 and from E782 to R470.

Replace PCB if Open.

Fail AreRX and clock

test signals correct?

Pass

ReplaceROADRUNNER(U701) and retest.

Check RX and clocktest points for a Digital signal.

CheckPATRIOT.

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TROUBLESHOOTING: High Audio Speaker Test

3.12 High Audio Speaker Test

Is there continuity?

Remove the front housing and Keypad PCB. Disconnect the speaker flex and

measure the speaker impedance through the flex. Impedance should be approx. 8

ohms.

Check continuity from J3 pin 1 to J1 pin 2, and from J3 pin 2 to J1 P3. Are the paths OK?

Check C30, C31, C32, R67, R68 for US, MP, DFP. If OK, Replace

Keypad PCB

Replace speaker and flex assembly Is

the impedance correct?t?

Check C765,C763,E751,E752

for US, MP,OPP, DFP, etc.

Abbreviations:US = Unsoldered components or connectionsMP = Missing partsDFP = Defective parts

Use this test on a unit with the following symptom: No High Audio Speaker .

Check continuity from J779 pin 1 to E751 and from J779 pin 2 to E752.

Pass

Fail

Fail

Pass

Fail

Pass

Replace PCB

AreRX and clock

test signals correct?

Pass

ReplaceROADRUNNER(U701) and retest.

Check RX and clocktest points for a Digital signal.

CheckPATRIOT.

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TROUBLESHOOTING: Audio Loopback Level Test

3.13 Audio Loopback Level Test

Is there continuity?

Ensure that the microphone isproperly soldered.

Place the unit in MATest Mode, andproceed to the

Earpiece Tone test.

Remove front housing and Keypad PCB. Check for

continuity fromP1 pin 74 to E8, and from P1 pin 76

toL17.

Check E30, C29, E8, C27, C28, VR2, L17, R21 for US, MP, etc. If OK,

replace Keypad PCB

Isthere aTone?

Go to theEarpiece SpeakerTest flowchart.

Continuedon next

page

Use this test to check the audio path on a unit with the following symptom: no audio loopback.

A

Pass

Fail

Pass

Fail

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TROUBLESHOOTING: Audio Loopback Level Test

Audio Loopback Level Test (Continued)

Is therecontinuity?

Check continuity from J779 pin 76 to C780.

Check L752, C751, C754, and VR701 for US, MP, DFP, etc. Also, check the

trace from L752 to MIC_+.

Continued from previous

Page

Replace mic cartridge.

Mic audio OK?

Repair complete.

ReplaceROADRUNNER(U701) and retest.

A

Pass

Fail

Pass

Fail

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TROUBLESHOOTING: DC Distribution (SW1) Test

3.14 DC Distribution (SW1) Test

Is1.55 Vdcpresent?

Check the components

for US, DFP, etc.Repair, as necessary.

Check E8910,repair as necessary.

Refer to other DC testflow charts.

Check E8910 for1.55 Vdc.

Replace ROADRUNNER

U701.

Is3.60 Vdcpresent

?

Is1.55 Vdc

present at the specifiedComponent?

Go toFilter B+

flow chart.

Check theFilt_B+

(3.60 Vdc) @ E8911.

Check C2053 for 1.55 Vdc.

Use this test on a unit with the following symptom: no SW1 (1.2 Vdc). Check for SW1 after L702 from U701.

Pass

Fail

Pass

Fail

Pass

Fail

Check C2054, R8122,Q1411, VR802, L1500

for US, DFP, etc.Repair, as necessary.

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TROUBLESHOOTING: DC Distribution (V2) Test

3.15 DC Distribution (V2) Test

Check C782 and C716 for 2.775 Vdc.

Go to FILT_B+flow chart.

Is2.775 Vdc

at the parts?

Check FILT_B+(3.6Vdc) at C724 or

E702

Is3.6 Vdcpresent

?

Check for US, DFP,etc. Repair as

necessary. Replace U701ROADRUNNER

Use this test on a unit with the following symptom: no V2 (2.775 Vdc).

Pass

Fail

Pass

Fail

Check C741 and Q704 for US, DFP,etc. Repair as

necessary.

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TROUBLESHOOTING: DC Distribution (V3) Test

3.16 DC Distribution (V3) Test

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TROUBLESHOOTING: DC Distribution (V4) Test

3.17 DC Distribution (V4) Test

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TROUBLESHOOTING: DC Distribution (4.5 Pre-Reg) Test

3.18 DC Distribution (4.5 Pre-Reg) Test

Check R719 for

3.1v to 5.0v

Insert charger andbattery into phone.

Pass

Fail

Use this test on a unit with the following symptom: no charger.

Check Q701 andROADRUNNER.

CheckR715 and Q703

Check bottomconnector, and E971

Check R789 for

4.5v to 4.7v

Pass

Fail

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TROUBLESHOOTING: DC Distribution (VMMC) Test

3.19 DC Distribution (VMMC) Test

Check C790 for 2.775 Vdc

Check R787 for US, DFP, etc.

Repair, as necessary.

Is2.775 Vdcpresent atthe parts?

Check FILT_B+(3.6 Vdc) at C724

or E702.

Go toFILT_B+flowchart.

Is3.6 Vdcpresent

?

Replace U701ROADRUNNER

Fail

Pass

Pass

Fail

Use this test on a unit with the following symptom: no VMMC (2.775 Vdc).

Check C742, Q705, C718, C790 for US, DFP, etc.

Repair, as necessary.

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TROUBLESHOOTING: DC Distribution (VUSB) Test

3.20 DC Distribution (VUSB) Test

Check C713 tor 3.3 Vdc.

Check for US, DFP, etc.Repair, as necessary.

Go toFILT_B+flowchart.

Is3.3 Vdc

present atthe parts?

Check FILT_B+(3.6 Vdc) at C724

or E702.

Is3.6 Vdcpresent?

Use this test on a unit with the following symptom: no VUSB (3.3 Vdc).

Replace U701ROADRUNNER

Pass

Fail

Pass

Fail

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TROUBLESHOOTING: DC Distribution (VSIM) Test

3.21 DC Distribution (VSIM) Test

Check C714 for 3.0 Vdc.

Check for US, DFP, etc.Repair, as necessary.

Is3.0 Vdc

present atthe parts?

Check FILT_B+(3.6 Vdc) at C724

orE702.

Go toFILT_B+flowchart.

Is3.6 Vdcpresent?

Replace U701ROADRUNNER

Use this test on a unit with the following symptom: no VSIM (3.0 Vdc).

Pass

Fail

Pass

Fail

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TROUBLESHOOTING: DC Distribution (V_VIB) Test

3.22 DC Distribution (V_VIB) Test

Check L405and C497 for 3.0 VDC.

Go toFILT_B+flowchart.

Is3.0 Vdc

present atthe parts

Check FILT_B+(3.6 Vdc) at R724.

Is3.6 Vdcpresent

?

Check for US, DFP, etc.Repair, as necessary.

Replace U701ROADRUNNER

Use this test on a unit with the following symptom: no V_VIB (3.0 Vdc).

Pass

Fail

Pass

Fail

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TROUBLESHOOTING: DC Distribution (V_HOLD) Test

3.23 DC Distribution (V_HOLD) Test

Check C704 for 1.88 Vdc

Check for US, DFP, etc.Repair, as necessary.

Is1.88 Vdcpresent atthis part?

Check FILT_B+(3.6 Vdc) at C724

or E702.

Go toFILT_B+flowchart.

Is3.6 Vdcpresent

?

Replace U701ROADRUNNER

Fail

Pass

Fail

Use this test on a unit with the following symptom: no VHOLD (1.88 Vdc).

Pass

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TROUBLESHOOTING: DC Distribution (VC REG) Test

3.24 DC Distribution (VC REG) Test

Check C704 for 1.88 Vdc

Check for US, DFP, etc.Repair, as necessary.

Is1.88 Vdcpresent atthis part?

Check FILT_B+(3.6 Vdc) at C724

or E702.

Go toFILT_B+flowchart.

Is3.6 Vdcpresent

?

Replace U701ROADRUNNER

Fail

Pass

Fail

Use this test on a unit with the following symptom: no VHOLD (1.88 Vdc).

Pass

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TROUBLESHOOTING: GPS Receiver Test

3.25 GPS Receiver Test

The Conducted signal testing described below can be performed to analyze or root cause an issue along the GPS RF subsystem, using a CW signal. The following tests are implemented in Factory Test Mode (BERBUG Mode). Test Setup

1. Set up the CW generator as follows: Frequency = 1575.42 MHz, Amplitude level = -80 dBm. Amplitude levels above -76 dBm will compress the back end GRF2M RFIC.

2. Power up the Unit Under Test (UUT), and connect the CW generator to the UUT.

3. Using Hyper Terminal, GPS is turned on as follows:

BERBUG > gps on

4. Set the Spectrum Analyzer to Center Frequency = 1575.42 MHz, Span = 1 MHz, Amplitude Reference Level = -50 dBm.

5. Use a High Impedance Probe to follow the signal flow along the GPS RF subsystem, block by block.

Block Level Testing of Critical Stages Below is a list of Critical Stages/Blocks, and their respective RF test points:

1. GPS (FL2050): GPS port.

2. GPS SAW filter (FL2050): Output port .

3. GPS external LNA (U2000): Input and output port.

4. GPS SAW filter (FL2000): Input and output port.

5. GPF2M RF IC (U2003): IF frequency test pad. DC Power Supply

When testing, it is advisable to utilize an external DC Power supply set at 4 Volts and a current level of 2 Amps. In BERBUG Mode, the UUT is expected to draw 165 mA to 170 mA at power up. By entering “gps on” the UUT should draw 215 mA to 220mA

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TROUBLESHOOTING: GPS Receiver Test (Continued)

GPS Receiver Test (Continued)

IsUUT Drawing

~165 mA?

While inBERBUG Mode,

type “gps on”

Pass

Continuedon next page

Pass

Fail

Pass

Fail

CheckBaud Rate

of Unit.

Fail

Is RF Signal~40 dBm

(+2 dBm)?

TP_GPS_IFoutTP_GPS_IFoutX

Probe iDEN/GPSR1401 Diplexer Common Port.

Place UUT in BERBUGMODE and Power up.Connect UUT to CW

Generator (M1401 @ -90dBm).

Is RF Signal~-95 dBm(+2 dBm)?

Is UUTresponding

?

IsData CableConnected?

Check Antenna CoaxConnecting, grounding, US, MP.

Problemin DC Block

of Unit.

Check FL200for US, DFP.

ConnectData Cableand Retest.

Notes:1. US = Unsoldered component/connection.2. MP = Missing part(s).3. DFP = Defective part(s).

PassPass

FailFail

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TROUBLESHOOTING: GPS Receiver Test (Continued)

GPS Receiver Test (Continued)

Probe TP_ANA_CLK

Check U2051-1 Sledgehammer.

Is clock signal49.107mHz 1.875 vpp?

Fail

Continued from previous

Page

End GPS testing

Pass

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TROUBLESHOOTING: Mototalk Test

3.26 Mototalk

Since the iDEN Receiver and Transmitter Hardware are used for Dispatch (PTT), Phone Call, and MOTOtalk modes of operation; Hardware failures that occur during MOTOtalk will also occur in Dispatch (PTT) and Phone Call modes. Therefore, the electrical troubleshooting guide for MOTOtalk, Dispatch (PTT), and Phone Call are the same.

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TROUBLESHOOTING: Camera Test

3.27 Camera Test

Verifythat the viewfinder

shows the capturedimage correctly.

Power upthe unit.

Pass

Fail

Use this test to check camera module. Symptoms: Bad view finder (noise, poor color,synchronization error).

Unit passed test. Look forsystem, coverage,

accessory,or software problems.

Enter theModel Assembly(MA) Test Mode.

Replacethe camera module

and repeat thetest.

Fail

Pass

Replacethe Keypad board

and repeat the test.

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TROUBLESHOOTING: Bluetooth Test

3.28 Bluetooth Test

Continuedon next page

Using instructions supplied with the headset, put the headset

into discoverable mode.

Pass

FailIs

SuccessfulBluetooth audio in phone call?

Extend handset antenna And power up handset.

Pass

Fail

Headset foundunder scan

results?

Obtain Motorola HS820 or similarMotorola Bluetooth headset.

Pass

Fail

Use this test on a unit to check the functionality of the Bluetooth headset.

On the handset under Bluetooth; Hands Free; Find Devices;

scan for the headset.

SuccessfulBluetooth

Link?

Make a phone call withBluetooth headset.

Bluetooth notworking

Bluetooth is working

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TROUBLESHOOTING: GPS Receiver Test

Bluetooth Test (Continued)

Continued from previous

Page

Open radio andcheck antennaand antennacontacts for

proper fit andcontact with

antenna launchon main PCB.

IsAntenna present

and contact adequate?

Using Berbugtype: BT TX ON.

The Bluetooth device is good. Close radioand try to bond withBluetooth headset.

Using a 50 ohm probe, measure

Output Power at BT antenna launch

Is signal level

Between -6 dBm to +4 dBm?

Replace antenna,

close radio and retest.

Is 2441 MHz

signal present?

Check 33.6MHz TCXO

signal atR1001.

Check R1001 foropen, or damaged

part.. Do ReferenceOscillator Test.

Is 33.6MHzsignal present?

Check voltageat R1023.

Check voltageat R1020

Check voltageat L1000.

Check VMMCvoltage at

L1005.

Replace BluetoothIC and retest.

Check L1000, L1002, R1030,C1025, C1026, C1006, C1031, C1032 for open,

shorts, or damaged parts. Repair if necessary and

retest

Check L1005 foropen, or damagedpart. Do DC Dist.

test for VMMCvoltage supply.

Check R1020 foropen, or damagedpart. Do DC Dist.

test for V2.775 filtervoltage supply.

Check R1023 foropen, or damagedpart. Do DC Dist.test for SW2 filtervoltage supply.

Is voltageapprox. 1.77

volts?

Is voltageapprox. 2.8

volts?

Is voltageapprox. 2.775

volts?

Is voltageapprox. 1.8

volts?

Pass

Pass

Fail

Pass

Fail

Pass

Fail

Pass

Fail

Pass

Fail

Pass

Fail

Pass

Fail

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TROUBLESHOOTING: Model Assembly (MA) Test Mode Test

3.29 Model Assembly (MA) Test Mode Test

• Model Assembly Test Mode is an embedded series of operational tests of the unit's user interface and functional features.

• Motorola iDEN recommends MA Test Mode be performed after any servicing of the unit. • An Audio Test Cable is required to complete test mode correctly. See the Required Tools

section or contact Motorola’s Aftermarket Accessories Division. MA Test mode is achieved by starting from a power-down condition: 1. Press and hold three keys in a row such as 1-2-3, 4-5-6, 7-8-9, ÷-O-#. Simultaneously, press

the Power key 2. Release all keys once the opening screen appears in the main display. 3. Follow instructions as they appear pressing the indicated keys. 4. No instruction? Press any key or Scroll right. 5. No reaction? Power down the unit, check battery condition, and start MA Test again. Screen displays are depicted as follows:

The LCD manufacturer and size are displayed on the Main LCD. Press OK key

Here we test the LCD display with Color Bars. Press any key to advance

Ellipses are displayed on the main screen for Crosstalk test. Press any key to advance

The gray scale test image is from total black to white indicates that the display has no issues. Press any key to advance

Flicker test screen to check for flicker. Press any key to advance.

Test the LCD with Checkerboard test. Press any key to advance.

Check for camera I2C address, camera device ID, and camera vendor ID. Press any key to advance.

Viewfinder test screen to verify image. Press any key to advance.

Then, the camera data lines will be analyzed.

When the data lines test passed, press OK to advance.

116 6880401P39-O

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TROUBLESHOOTING:: Model Assembly (MA) Test Mode Test

Model Assembly (MA) Test Mode Test (cont.)

Bluetooth LED onBlink MSG LEDBlink VM LEDSC Button LED onSOL LED on

Blink PTT LED Backlight On

Vol Up Key

Vibrator On

The 4 internal borders are one-pixel wide and white. The rest (except text) are black. Press Speaker to advance.

Check for LED functionality. Press any key to advance.

Verify backlight and vibration. Press volume up key to advance.

Phone generates a 1004Hz audio tone to the audio speaker. Press the Volume down key to advance.

Phone generates a 1004Hz audio tone to the earpiece. Press PTT key to advance.

KEYPAD TEST:<MMNU ^SND < > v

1 2 3 WEB 4 5 6 MSG 7 8 9 TXT * 0 #

Speak into the internal microphone and listen to the earpiece.

If microphone has been detected, press any key to advance.

If microphone not detected, press any key to retest.

If SIM card is absent, power off the phone.

When a key is pressed, the corresponding key symbol will disappear. Press all the keys to advance.

QWERTY KEY TEST:Q W Y UI O P A S H J K L N M PRDSPC CR DEL ALTCAPS SYM

Key Verify Power Off

When a key is pressed, the corresponding key symbol will disappear. Press all the keys to advance.

Insert audio jack test cable

Test audio cable button and audio jack channels. If the audio jack channel test succeeds and the audio cable button is detected

If the audio not detected or audio jack malfunctions, this screen will appear for retest.

Test completed, press power off to exit the MA mode.

Insert Audio Jack

Audio JackNot Detected

Generating Tone AUD LV = 026E Test Passed Press audio Jack BUTTON

6880401P39-O 117

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Schematic Diagrams and COMPONENT LOCATION

Chapter 4 SCHEMATIC DIAGRAMS AND COMPONENT LOCATION When ordering component parts, the part number and reference designator should be included. If the correct numbers cannot be located, call Motorola Parts Identification at 1-847-538-0021.

6880401P39-O 119

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SCHEMATIC DIAGRAMS AND COMPONENT LOCATION

4.1 Component Layout Main Board – Front

U3003

Q500

SH800FL3011

BRK1

U403

FL1420

U3004

FL3010

C201 C290

C203

C250

U502

R598

T1400

C535

R8079

C2045

R8108

C2046

E8888

E8890

R8070

R8078

C2051

BRK4

SH600L1405

R8080

FL3012

C2050

R8102

R8109

E8889

R8071

C476

R8125

C769

E755

R8107

R8124

C518

FL201

C60054

C461

C60062

R8106

R8116

R8117

C2044

E8884

C2029

R8126

C204

C60057

TP_AGC_DAC

TP_RF_ATTN

TP_LNA_EN

C252

L200

C1450

L1420

E519 C519

R453

U200

C60058

U1420

C1425

L1412 C1423

C1422

C1452

C460

C60063

C2059

C60059

C202

C60060

R1414

C1453

R8123

FL200

R204

C1451

Q1410C2049

C478

VR405

C291

C210

R202 T200

C211

C60055

C205

R200

C288

C200

R8128

FL3006

C207

U2051C60056

C206

SPIB_MISO

FL3007J779

C405

L201

L202

R201

C251

C526

R507

C289 C1499

C1498

TP_CS0

R8083

TP_BCLK

TP_CS2

C480

R401

TP_EB0

TP_RWN

C481

C482

R8077

R8076

TP_OEN

C463

R8110

R8111

C464

C479

R104

FL3008

C60053

C525

R506

L1499

L1498

R604

C522

C523

R505

C524

TP_LBAN

TP_GPIO6

TP_GPIO10

C483

C484

C462

C872

R8112

R8113

C475

R878

R8127

C101

R101

C470

C516

L503

C590

C529

C527

U803

U802

C2058

TP_WAITB

R877

L752

R731 C751

C754

R470

R471

C212

C213

TP_RXI

C624

R500

R501 TP_RXIX

GPSIFOUTX

C873

C877

R869

C471

C223

C623

TEST2_SLTP_RXQ

C506

R518 RXEN_STROBTPRXQX

GPSIFOUT

R882 C871

C2057

C404

C209

TEST1_SL

R895

SPIB_MOSI

R6000

D871

C521

TP_EB1TP_TXI

TP_TXIX TP_TXQ

TP_TXQX

U801

USB_VPIN

C870 TP_EOL

R870

FL401C2048

E8893

C221

L304

TP_ANA_CLK

D872

R894

R739

RS232_TXTP_A1

TP_D0

U805

R8082

R8094

R8099

C403

C312

C313

R881

R811

TP_32kHz

R8093

E405

R8100

L301

C620

C622

R600

C626

C627

R608

C630

C625

C2005

C629

C528

C2006

R609

R8120

TP_CKO

TP_USB_EOP

R806

R880

R810

C807

L803

R824

C2039

E8887

J780

C2055

C2037

C621

C628

L605

C801

L801

TP_RTS

C805

C806

C824

C2040

C2038

E8886

C2056

E8885

SH1000

R610

E602

L204

C689

USB_TXENB

C802

TP_CS4

TP_CKOH

TP_WDOG

C812

R827

R829

C430

R8091

FL402R8087

R8086R8119

U1000

TP_24

C783

C222

BT_UART_RX

BT_UART_TX

RS232_RX

R828

R8090

BRK3

R8085

C1001

C1003

BT_SPIMISO

U1001

BT_BYPRX

R1099

C738 T

P_ACQ_CLK

TP_GPS_CLK

iCRNE_CS

R8084

BRK2

C60052

R1020

BT_SPI_CLK

BT_SPI_CSB

C818

R853 G

PSMAGBIT

GPSSIGNBIT

GPSTIMESYN

TP_16_8MHz

R8089

SPIB_CLK

R1001

L1005

R1011

C1031C1021

L1002

BT_BECLK

BT_SPIMOSI

L1003

L1001

C1026

C1008

R1023

R897

D802

TP_23

TP_SRDB

SPIA_MISO

TP_SH_CS

C810

R8088

C1032

C1004

R1012

C1007

R1005

R1010

C1025

R855

R1024

TP_RXFS

TP_TXE

C808

R850

SPIA_CLK

FL1000

R1030

R1022

TP_RRA_CS

R1009

C1010

L1000

C814

C813

C811

C816

TP_ADTRIG

C809

C803 R772

L802

C1011

C1006

R835

BBP_RXCLK

TP_RX_ACQ

TP_STD

TP_TXCLK

TP_TXFS

TP_DMCS

R820

SPIA_MOSI

R856

R896

C804

C820

120 6880401P39-O

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SCHEMATIC DIAGRAMS AND COMPONENT LOCATION

4.2 Component Layout Main Board – Back

E745

E756 E744

E754

E942

E943

E944

J752

J500

BRK1

J7

U501

D752

D753

M501

FL751

E740

E750

L1501

VR703

L500

SH500

SH700R503

R764

BRK4

E500

C500

C501

T500

R721

E742

VR801

VR750

R765

VR106

M104

C502

C508

E758

C102 VR109

M500

E941

C530

E971

D876

R715

Q701

C733

R714

R766

E712

L750

L751Q700

Q702

C531

E743

E753

E741

E757

C2023

Q708E713

R103

TP_ASW

C507

Q709

C752

C753

R791

R792

VR107

M513

D701

E711

E101

TP_VIB

D711

C2021

Q703

R750

R726

C103

USB_VBUS

C105

C104

C509

C512

C515

R599

C511

C517

C514

C2022

R728

E973

C2024

C797R902

E972

R704

R735

C758

J492L405

C520

C510

E703

R729

R723

R901

VR702

R724

U700

R732

R709

R719

C729

D705

C759

L753

VR432

VR430

C406

L502

D712

R773

C777

C60061

C746

Q706

D700

E710

Q707

C433

E8881

E8882

C434

C438

SH300C308

C309

C310

C513

D702

R796

R730

E720

R746

D704

R789

R711

C734

R710

R749

C728

C730

R748

E702

E8883

Q704

C706

C217

R778

U701R768

R769

R770

VR704

R751

C727

R712

R788

R752

R700

U703

R1441

C724

L303

L302

C306

R601

C782

C216

R713

Y1

C214

C215

R727

C725

BAT_DET_IN

C307

R602

C303

C305

R603

C716 C615

R203

C741

C616

C735

E732

C726

L754

U300

C304

C302

C301

C617

E600

C705

C219

C784

C785

C731

E731

C764

C736

Y600

C732

R708

C739

TP_EAR_M

TP_EAR_P

R760

R754

R707

R720

R734

VR802

C300

C794

C780

C781

R755

R753

C760

C2047

C799

VR434

M1400

C690

L300

E782

C765

C771

E752

D866E751

E717

E718

C779

R782

R777

R783

C432

R8122

E8880

SH301

C766

C710

C763 C770

E781

C708

C787

BRK3

Q1408

D855

E709 E706

Q705E719

E716

E715

R781

C798

C789

R701

R1443

VR433

R780

R793

E8911

C2054

BRK2

R606

C614

C707

C702

C709

C714

C719

C786

C711

C788

C704

C715

Q1411

R725

R784

C796

L1500

C436

R431

C311

R775

C218

C723

R785

R716

R771

R745

L755

C722

C713

L1004C1023

C1024

R605

Q855

E714

C778

R722

R786

R741

R706

C720

C721

R702

R762

C742

R757

C757

C717

U3005

C437

C492

C2053

R432

L501

R1440

SPKR_R_M

SPKR_R_P

C703

R776

C790

C756

C755

C435 R430

R492

M1011

M1401

C1441

L1410

R787

TP_MIC

C718C701

R759

E474

R758

C2052

R8121

VR755

E8910

6880401P39-O 121

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SCHEMATIC DIAGRAMS AND COMPONENT LOCATION

4.3 Component Layout Keypad Board Bottom

122 6880401P39-O

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SCHEMATIC DIAGRAMS AND COMPONENT LOCATION

4.4 Component Layout Keypad Board Top

6880401P39-O 123

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SCHEMATIC DIAGRAMS AND COMPONENT LOCATION

4.5 BLOCK HIERARCHY

A/D

CLK OUT

USB

SUPPLIES

(AUDIO/DC/CLK)

SPI

AUDIO

SAP

ROADRUNNER

BLUETOOTH

BLOCKMODULE

TRANSCEIVERBLOCK

BATTERY BLOCK

ACCESSORY CONNECTOR BLOCK

AUDIO

BLUETOOTH

AUDIO

USB

Digital/Keypad/LCD Block

I/O

I/O

RF CONTROL

RR

MISC I/O

SPI A

BBP

CE BOTTOM CONNECTOR

RS232

I/O

GPS I/O

MOTOROLA INTERNAL USE ONLYArchitecture is Bravo, ATI, Roadrunner, Sledgehammer, Janus and Bluetooth.

DC Supply

Other

RF

Sensitive

Digital

SDTX

SPI_CLK

SPI_DRSPI_DW

TCXO_33_6MHz

TCXO_V4

TXCLK

TXE

TXFS

VCONXCVR_DIG_1_875_lin

XCVR_DIG_1_875_pwm

XCVR_V2

BG_BYP

CE_SH

DMCS

GPS_ACQ_CLK

GPS_AGC

GPS_CLK

GPS_MAGBIT

GPS_SIGNBIT

PA_ID

PA_TEMP

RSTB

RXACQ

RXFSSCLK_OUT

SDR

NC

BT

BT_OSC_EN

BT_UART_CTSBT_UART_RTSBT_UART_RXBT_UART_TX

PSKEY_UART_HOST_WAKE

RESET_BT

RR_PCM_CLKRR_PCM_SYNC

RR_RXRR_TX

STANDBYTCXO_33_6MHz

TRANSCEIVER

USB_IDUSB_SE0INUSB_TXENB

USB_VM

USB_VP

USB_XRXD

USEROFF

V2V3

V4

VCC_OUTVHOLD_EXT_EN

VPP_OUTVSIM_EN

WDI

RR_BATTI

RX0 RX1

SECONDARY_INT

SEC_CESEC_SPI_CLK

SEC_SPI_MISOSEC_SPI_MOSI

SINGLE_PATH_CHARGE

SOL_LED2_PWM

SPKR_R_MINUSSPKR_R_PLUS

STANDBY

TX

USB_D+USB_D-USB_DIN

MICROPHONE

MOD_OUTMUX_OUT

ON

PA_IDPA_TEMP

POWER_FAIL

PRIMARY_INT

PRI_CEPRI_SPI_CLK

PRI_SPI_MISOPRI_SPI_MOSI

RAW_B_PLUS

RESETMCU_B

RMT_CONTROL

BITCLK0 BITCLK1

CI_BLUE

CI_GREENCI_RED

CS_OUT

DISP_LED_PWM

EARPHONE_MINUSEARPHONE_PLUS

EOL_INTERRUPT

EXT_B+

FSYNC0 FSYNC1

LI_CELL

LVS

LV_DETECT

NC

NC

NC

V4

ROADRUNNER

16.8MHZ32KHZ

ACT_CURR_EN

ADTRIG

AUDIO_INAUDIO_OUT

BATTERY_TEMP

BG_BYP

SPKR_R_PLUS

SRDBSTDB

SW_B+_EN

TXCLK

TXE

TXFS

UART2_CTSUART2_RTS

USB_EOPUSB_TXENBUSB_VPINVCON

VPP_OUTVSIM_EN

WDI

RS232_TX_USB_DIN

RXCLKRXFS

RX_ACQ

SINGLE_PATH_CHARGE

SOL_LED2_PWM

SPIA_CLK

SPIA_CS6_SH_CE

SPIA_CS7_RR

SPIA_MISOSPIA_MOSI

SPIB_CLKSPIB_CS0_RR

SPIB_MISOSPIB_MOSI

SPKR_R_MINUSMODE_SELECT

MUX_CTRL

ON_OFF_SWITCH

OSC_EN_STBY

RESET_OUT

RMT_CONTROL

RR_AD_TRIGGER

RR_BATTI

RR_DCLKRR_FSYNC

RR_PRM_INT

RR_RX

RR_SEC_INT

RR_TX

RS232_RTS_USB_XRXDRS232_RX_USB_VM

CI_RED

CLKGPS

DISP_LED_PWM

DMCS

EARPHONE_MINUSEARPHONE_PLUS

EOL_INT_B

GPS_AGC_DAT

GPS_CLKACQGPS_MAG

GPS_PECLREF

GPS_SIGN

LV_DETECT

MICROPHONE

MOD

D-

EXTB+

USB_ID

NC

DIGITAL

16.8MHz_CLK32KHz_CLK

ACT_CURR_EN

BATT_ID

BT_RESET_B

BT_UART_RXBT_UART_TX

BT_UART_WAKE

CI_BLUE

CI_GREEN

TP_RX_ACQ

1V2

ACC_CONN

D+

1

SW2

NC NC

V4

BATTERY_BLOCK

BATT_ID_FLTR

BATT_THERMISTOR_FLTR

RAW_B_PLUS

SPIA_MISO

1

TP_SRDB

1

V2

TP_SH_CS

NCTP_RXFS

1

1

NC

V3

NC

NC

V3

1

SPIA_MOSI

1

NC

NC

SPIA_CLK

1

NC

TP_TXE

VCON

TP_TXFS

SPIA_CLK

SPIA_CLK

SPIA_CLK

SPIA_MISO

SPIA_MISO

SPIA_MISO

SPIA_MOSI

SPIA_MOSI

SPIA_MOSI

BBP_TXCLK

TXE

BBP_TXFS

SIGN_BIT

PA_ID

PA_ID

PA_TEMP

PA_TEMP

DIG_RESET_OUT

SLEDGEHAMMER_RX_ACQ

BBP_RXFS

BBP_RXCLK

BBP_SRDB

BBP_STDB

USB_D_PLUS

USB_D_MINUS

USB_D_MINUS

BG_BYP

BG_BYP

SPIA_CS6_TOMAHAWK_CE

SLEDGEHAMMER_DMCS

ACQ_CLK

AGC_DAT

CLK_GPS

MAG_BIT

NC_EXT_MIC

PCAP_AD_TRIGGER

ACT_CURR_EN

32KHZ_CLK

16_8MHZ

NC_LI__CELL

EXT_BPLUS

EXT_BPLUS

MUX_CTRL

USB_D_PLUS

EARPHONE_MINUS

RR_CS_OUT

CI_RED

CI_GREEN

CI_BLUE

RR_BITCLK1

RR_DCLK

RR_DCLK

RR_DCLK

BATTERY_TEMP

EXT_SPEAKER

MICROPHONE

MICROPHONE

LV_DETECT

NC_RR_LVS

SOL_LED2_PWM

RR_FSYNC1

RR_FSYNC0

RR_FSYNC0

RR_FSYNC0

EOL_INT_B

EARPHONE_PLUS

RR_RX

RR_RX

RR_BATTI

RR_BATTI

RMT_CONTROL

RMT_CONTROL

RR_RESETMCU_B

RAW_B_PLUS

RAW_B_PLUS

DISP_LED_PWM

SPIA_CS7_RR

RR_PRM_INT

RR_POWER_FAIL

ON_OFF

MOD_OUT

SPKR_R_PLUS

SPKR_R_MINUS

SPKR_R_MINUS

SINGLE_PATH_CHARGE

SPIB_MOSI

SPIB_MISO

SPIB_CLK

SPIB_CS0_RR

RR_SEC_INT

RR_RX1

RR_RX

USB_VP

USB_VM

USB_TXENB

USB_SE0IN

USB_ID

USB_ID

USB_DIN

RR_TX

RR_TX

RR_TX

STANDBY

STANDBY

STANDBY

SPKR_R_PLUS

BT_RESET_B

BATTERY_ID

SOFT_TURN_OFF_WDI

VSIM_EN

VPP_OUT

RR_VHOLD_EXT_EN

VCC_OUT

VCC_OUT

USB_XRXD

TCXO_33_6MHZ

BT_OSC_EN

BT_OSC_EN

NC_SW_B+_EN

PSKEY_UART_HOST_WAKE

BT_UART_CTS

BT_UART_RTS

NC_MODE_SELECT

GPS_PECLREF

BT_UART_RX

BT_UART_RX

BT_UART_TX

124 6880401P39-O

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SCHEMATIC DIAGRAMS AND COMPONENT LOCATION

4.6 DIGITAL BLOCK - PATRIOT AND MEMORY

MMC GPS

JTAG

REAL TIME TRACE

MISCELLANEOUS

GPIO

CCM/WDOG/EGPT/CLK

MEMORY_BLOCK

PRIMARY UART

SECONDARY UART

BBP

SAP

MQSPI

SIM

DSC AND ONE_WIRE

INTERRUPTS LAYER 1 TIMERS

KEY PAD I/O

RR Audio Serial Port Tx

I/O

INT4 - Option_Select_1

BBP (1.875V)

iCRANE_SPIB_CLK

TRST

RTSDNP

RX

INPUTS

For 32MB - place R811, unplace R810

BRAVO POWER BLOCKSC2A

RTS

SYMBOL

L1 Timer,QSPI (1.875V)

ESSI

iCRANE_SPIB_MISO

Bravo ROM13

MOTOROLA INTERNAL USE ONLY

MMC (2.775V)

SH Serial Port STD

GPCR = xxxxxxxx x11xxx11

BUSY_OUT

iCRANE_SPIB_MOSI

INTERRUPT

TCK

To Test Connector

MUX_CTRL =1 AND THE 8-WIRE INTERFACE IS THUS SET TO JTAG MODE

INT6

Patriot Core (1.55V)

VCC TRUTH TABLE

MCU_DE

ROW6

SB9600

GPCR (Bit7)=1

RI

MQSPI

AND LED

DNP

RR Audio Serial Port Rx

SRDA

SW2 = 1.875V GPIO (RR Switcher)

SIM2,SAP, Bot Conn (1.875V)

FROM RR

SC2A

TDO

ATI I/O

DNP

TX

KEYPAD

BUSY_IN (IC2)

RR @ 1.8V, Indy @ 2.7V

U802

4-Wire RS232

SH Serial Port RXFS

L1 Timer,QSPI (1.875V)

LAYER1 TIMER

CTS

Gen Port Ctrl Reg (GPCR)

PC5 - Used on DualMode - USB Detect

TMS

RR Audio Serial Port Clock

MUX_CTRL=1

PIN NAME

For 16MB - place R881, unplace R880

TO RR

INT5 - Option_Select_2

GPCR = xxxxxxxx x00xxx00

VMMC = 2.800V GPIO (RR linear)

SCKA

RX

V1 = 1.55V Core (RR linear)

5175772B32

DNP

RTS

CTS

Unplace R853 for CS1 as CS

GPCR (Bit7)=0

RR Audio Serial Port FS

INT1 - Pwr_ON/OFF / RTC

TDI

Internal Pulldown

DSP_DE

SCKA

For 32MB - place R880, unplace R881

DNP

RESET_IN

RX

RESERVED IRQB, DO NOT CONNECT

NOTE: RESETS FROM THE BOTTOM CONNECTOR WILL ONLY BE POSSIBLE IF

Clock Amp (1.55V)

JTAG

EIM (1.875V)

DCD

Low_Voltage_Detect (RR RESETB Pin)

U801

TX

RX

UART,SIM1 (2.775V)

DNP

8-Wire RS232

To Test Connector

SLEDGEHAMMER

INT0 - PTT

ESSI

CTS

5185594F15

TX

Requires level shift

DSR

DTR

Keypad (2.775V)

STDA

For Stack Flash

Place R853 for CS1 as ADDR

INT2 - EOL INTERRUPT

SRDA

TX

UART,GPIO (2.775V)

JTAG

32.768 kHz Input

For 64MB - place R810, unplace R811

16.8 MHz Input

Gen Port Ctrl Reg (GPCR)

INT3 - FLIP SENSE

SH Serial Port RXCLK

INT7

BATTERY

ROW7

MUX_CTRL=0

STDA

K20WDOG_N

22

4 1 3 A

K17STBY_PD14

TCKD15

TDIB17

TDOB16

TESTD14

TIME_MARKE20

TMSC15

TRSTD16

L21PC9_URXD1_URXD2

D21PECLREF

W3PWM_PE13_DMAC_CS

Y2PWM_PE14_DMAC_D4

D19PWRCTL

Y3RESET_IN

L17RESET_OUT

SIGNC21

J20

W4OC3_PC13_FRAME_TICK

AA2PA2_USB_VPIN

R16PC0_USB_VMOUT

L20PC11_OC1_USBCLK_DMAC_D3

B3PC12_STO_DMAC_D5

U22PC1_USB_TXENB

L22PC8_UTXD1_UTXD2

G14

C22MAG

C14MCU_DE

L4MMC_CLK

MMC_CMDL3

MMC_DATL2

MMC_OD_ENK4

U7MOD

MUX_CTL

C20AGCDAT

D3CKIH

V3CKIL

K21CKOH_SCC_CLK

CKO_PA3Y22

CLKACQE21

CLKGPSD22

B11CLKSEL_PD15

DSP_DE

MISC_BLOCK*U801-3*

NC

5

TP_LBAN

0

R869

11

SW2_FLTR

11

iCRNE_CS

D871

NC

SPIB_MISO

USB_VPIN

6

8

TP_RWN

R870

TP_BCLK

NC

0

8

10

TP_EOL

NC

SPIB_CLK

10

NC

NC

NC

L7

VSS7

VSS8

L8

G7WAIT

WE_F5

WP_E4

17

VCCQ_2

L3

VCCQ_3

D4

VPP

VSS1

B4

VSS2

C4

L1

VSS3

VSS4

L2

L5

VSS5

L6

VSS6

S_CS2C5

S_VCCK4

B5

VCC1_1

L4

VCC1_2

VCC2_1

B6

VCC2_2

K6

VCCQ_1

J8

K7

K2RFU1

K3RFU2

RST_F4

R_LB_C2

R_OE_H1

F3R_UB_

D5R_WE_

J1S_CS1_

DU6M7

DU7M8

DU8

F_DPD

OE_1J2

H8OE_2

D6P_CS_

K8P_MODE

K5P_VCC

H7D7

G2D8

J3D9

DU1A1

DU2A2

A7DU3

DU4A8

M1DU5

M2

G6D13

H6D14

J7D15

D2G3

H4D3

J5D4

G5D5

J6D6

CE_1K1

G8CE_2

CLKC6

D0H2

H3D1

G4D10

J4D11

H5D12

D1A3

B1A4

C1A5

A6F2

E2A7

F6A8

D7A9

E5ADV_

A19B3

E1A2

A20E6

A21B7

C7A22

C3A23

D3A24

E3A25

B8A11

C8A12

D8A13

F7A14

E8A15

F8A16

D2A17

A18B2

25

NC

MEMORY

A0G1

F1A1

E7A10

23

47K

TP_CKO

NC

R878

10K

NC

16

13R856

R8280

R895

33pFC809

4

20

10

SW1_FLTR

4

21

5.6KR820

NC

11

SW2_FLTR

13

18

8

2

NC

NC

C8710.10uF

0.10uFC810

TP_CKOH

NC

11

NC

62pF

C820

15

NC

TP_CS2

20 33pF

1.0uFC806

C807

R8060

C80533pF

1

SW2_FLTR

19

NC

NC

R894

D866

NC

22KR855

11

14

NC

7

13

NC

C8734.7uF

7

TP_EB0

0 R810

6

12

15

13

17

SW2_FLTR

TP_OEN

C8080.10uF

BT_UART_TX

C81833pF

URXD1_PA15_USB_VMIN_TDIU20

URXD2_PB1F21

UTXD1_PA14_USB_VPOUT_ITXD_TDOT16

UTXD2_PB0F20

SRDBB13

SRDB2_PC4_OC2C11

STDAR21

STDBG12

UCTS1_PA12_USB_FSEN_MCU_DEJ21

UCTS2_PB2B21

T21URTS1_PA13_USBXRXD_IPWR_RESET_IN_IC2A

URTS2_PB3B20

SPICS3_PE6K3

SPICS4_PE7K7

C7SPICS5_PE11

C6SPICS6_PE0_DMAC_D3

C5SPICS7_PE1_DMAC_D4

B4SPICS8_PE2_DMAC_D6

SPICS9_PE3_DMAC_D7D5

SRDAT22

SC2AT20

SC2B_PC3C12

SCKAP21

SCKBB12

SCKB2_PC5D11

SDI_D_C_PE5_SPICS1J4

J3SPICS0_PE10

SPICS2_PE4K8

MOSIBH4

QSCKAC8

QSCKBH3

RIA_PA9_USBSUSP_TCK_SCKA_UTXD1G20

SC0A_PC7_DMAC_D1_DMAC_SCKM21

SC0B_PC2D13

M22SC1A_PC6_DMAC_D0_DMAC_MOSI

SC1BC13

*U801-2*

DCDA_PA8_DSP_DE_SC2AH21

DSRA_PA10_TRST_STDA_URXD1_INT6H20

DTRA_PA11_TMS_SRDA_INT7H22

MISOAD7

H2MISOB

MOSIAD6

2

SERIAL_PORTS_BLOCK

GPSTIMESYN

NC

TP_D0

1

4

3

6

7

4

R897

33pF

NC

R85310K

C801

13

NC

R8110

TP_ADTRIG

5

24

NC

8

NC

0

R882

C8700.33uF

1.0uF

L801FHB1M1005JT

14

C804

R8350

D802

Q855

47K

47K

C8770.10uF

6

9

5

2

D872

R8800

R8270

R82410K

NC

3

5

NC

24

1

3

23

NC

D855

TP_EB1

D9

TOUT3C9

TOUT4_PD0E3

TOUT5_PD1E4

TOUT6_PD2F3

TOUT7_PD3F4

TOUT8_PD4H7

TOUT9_PD12G3

TOUT0C10

TOUT1D10

TOUT10_PD13G2

TOUT11_PD7G4

TOUT12_PD8_DMAC_D5B8

TOUT13_PD9G8

TOUT14_PD10_DMAC_RSD8

TOUT15_PD11_DMAC_D2B7

TOUT2

C18SIM_D1RX_PB11 SIM_D1TX_PB10

C19

SIM_PD0_PB9R20

SIM_PD1_PB15_DSP_DBG_PAWC16

SIM_RST0_PB6P20

SIM_RST1_PB12_TIN0D18

SIM_SVEN0_PB8P17

SIM_SVEN1_PB14_DSP_DBG_XDWD17

ROW4_PG12T4

ROW5_PG13T2

ROW6_PG14T3

ROW7_PG15U4

SIM_CLK0_PB7N21

SIM_CLK1_PB13_DSPYDWC17

SIM_D0RX_PB5N22

SIM_D0TX_PB4N20

INT5_PA7_OPTION_SELECT_2_IC1BG22

OWIRE_DAT_PA10M2 C4

PD5_DMAC_D0

PD6_DMAC_D1C3

ROW0_PG8R4

ROW1_PG9R3

ROW2_PG10R7

ROW3_PG11T8

N3

COLUMN6_PG6_QSCKA_SPICS8P4

COLUMN7_PG7_SPICS9_URTS1P7

INT0_PE8U2

INT1_PE9U3

INT2_PC14T7

INT3_PC15V4

INT4_PA6_OPTION_SELECT_1_IC1AG21

SIM_INT_TOUT_BLOCK

*U801-4*

COLUMN0_PG0M3

COLUMN1_PG1N4

COLUMN2_PG2N2

COLUMN3_PG3N7

COLUMN4_PG4_IC2B_SPICS6P3

COLUMN5_PG5_MOSIA_SPICS7

NC

NC

TP_USB_EOP

0

15

TP_CS0

NC

12

2

RS232_RX

3GND

2IN_A

1NC1

4OUT_Y

5VCC

14

R881

U805NL17SZ07

19

0

0.10uFC816

TP_WDOG

TP_A1

NC

TP_16_8MHz

6

21

10

3

15

9

0

5

9

TP_CS4C8021.0uF

7

V1

3

NC

TP_WAITB

47KR877

1

TP_32kHz

2

NC

NC

C8140.10uF

1

SW1

NC

BT_UART_RX

C80333pF

23

W20

ECB_N_PA4

AA22

LBA_N

OE_N

U21

R_W_NY18

SEB_N_PA5

V20

W21

SOE_N_PE15

D4AB8

AB7D5

AA7D6

D7Y7

Y6D8

AA6D9

AA18

EB0_N

V21

EB1_N

AA5D10

D11Y5

AA4D12

D13AB4

AA3D14

AB3D15

D2Y8

AA8D3

CS0_NAA21

CS1_NAA16

CS2_NAB20

CS3_NAA20

Y19CS4_N

CS5U14

AA9D0

D1Y9

A3AB16

A4AB21

A5Y16

AA15A6

A7AA19

A8Y15

A9Y14

Y21

BURSTCLK

A17AB11

A18AA11

A19Y11

A2AB17

A20Y10

A21AA10

A22_PA1_DSP_DBG_XDWU11

U10A23_PA0_DSP_DBG_YDW

A1AA17

A10T13

A11AA14

A12AB13

A13AA13

A14Y13

A15AB12

A16AA12

EIM_BLOCK

*U801-1*

Y17A0

C81133pF

C8720.1uF

9

NC

12

R896

FHB1M1005JTL803

RS232_TX

0

16

4

18

NC

1

NC

NC

157

0

10

0

NC

C82433pF

14

SW2_FLTR

14

SW2

R8290

FHB1M1005JTL802

NC

V2_775_FLTR

25

V2_775_FLTR

V2_775_FLTR

SPIB_MOSI

0.10uF

NC

TP_RRA_CS

NC

12

C812

47KR850

TP_RTS

NC

H9

L16

VSS2

NC

9

8

22

Q3_Q1VDD

U12

Q4VDD

T12

Q4VSS

G11

Q6VDD

H11

Q6VSS

G16

Q7VDD

H14

Q7VSS

C2

VCCA

VSS1

L7

K_QVSS

M8

H17

LVDD

LVSS

H16

G17

PVDD

H15

PVSS

Q2_Q8VDD

N17

M16

Q2_Q8VSS

M7

G7

J8

I1VSS

J7

I2VDD

L8

I2VSS

J1VDD

N8

J1VSS

P8

R8

J2VDD

J2VSS

T9

KVDD

DVSS

G13

EVDD

H12

EVSS

GNDA

D2

H1VDD

G10

H10

H1VSS

G9

H2VDD

H2VSS

H8

I1VDD

N16

M17

B2VDD

K16

B2VSS

C1VDD

J17

C1VSS

J16

G15

C2VDD

C2VSS

H13

DVDD

T17

P16

A2VSS

U13

A3VDD

T14

A3VSS

U15

A4VDD

U16

A4VSS

U17

A5VDD

T15

A5VSS

R17

B1VDD

B1VSS

IC_PWR_GND

*U801-5*

U8

A1VDD

T10

A1VSS

A2VDD

U9

T11

33pF

12

NC

NC

C813

KP_LED_ZONE1_PB7

KP_LED_ZONE2_PB8

USB_TXENB

Data_2

Data_1

Data_0

Data(0:15) Data(0:15)

BT_UART_RXBT_UART_RX

BT_UART_RX

SHORTCUT_BUTTONS_LED_PB5

BT_OR_PTT_LED_PB6

KEYPAD_ROW5

KEYPAD_ROW6

KEYPAD_ROW7

KEYPAD_COLUMN6

Data_8

Data_7

Data_6

Data_5

Data_4

Data_3

SIM_DATA_PAT

SIM_RST_PAT

SIM_RST_PATSIM_RST_PAT

VPP_OUT_OR

FLASH_CE2

PAT_LBA_N

PAT_LBA_N

OLD_MOD OLD_MOD

PAT_MOD

32KHZ_CLK

32KHZ_CLK

32KHZ_CLK

PAT_CS5

PAT_CS5

PAT_CS4_N

PAT_CS3_N

PAT_CS3_NRESET_OUT

RESET_OUT

RESET_OUT

RESET_OUT

JTAG_TRST

JTAG_TRST

RESET_OUT_2_7

SIM_CLK_PAT

SIM_DATA_PAT

SIM_DATA_PAT

DISPLAY_ID

JTAG_TDO

JTAG_TCK

JTAG_TDI

JTAG_TMS

PAT_MUX_CTL

OPT_SEL_1

MUX_CTRL

MOD

DSP_DE

DSP_DE

MCU_DE

MCU_DE

VDD_PAT_2_775

VDD_PAT_2_775

$P

VDD_PAT_1_55

VDD_PAT_1_55

VDD_PAT_1_875

VDD_PAT_1_875

EOL_INT_B2

DISPLAY_ID

SPIB_MOSI

SPIB_CLK

SPIB_CLK

RR_FSYNC

RR_FSYNC

RR_DCLK

RR_DCLK

RR_TX

RR_TX

SPIB_MISO

SPIB_MISO

SPIA_MISO

SPIA_MISO

SPIB_CS0_RR

SPIB_CS0_RR

SPIB_CS0_RR

ACT_CURR_EN

DISPLAY_INTERRUPT

DISPLAY_INTERRUPT

DISPLAY_INTERRUPT

Address_23

OPT_SEL_1

SPIA_CLK

SPIA_CLK

SPIA_MOSI

SPIA_MOSI

SPIB_MOSI

Data_13

Data_12

Data_11

Data_10

Data_9

Address(0:25) Address(0:25)

RR_INT

RR_INT

RS232_RX_USB_VM

RS232_RX_USB_VM

SPIA_CS6_SH_CE

SPIA_CS6_SH_CE

SPIA_CS6_SH_CE

PAT_EB1_N

PAT_OE_N

PAT_OE_N

PAT_OE_N

PAT_OE_N

PAT_OE_N

PAT_RW_N

PAT_RW_N

PAT_RW_N

PAT_RW_N

Address_0

Data_15

Data_14

RR_RX

RR_RX

FLIP_SENSE_1

KPLED_ZONE2_GPIO_PE13

PAT_EB0_N

PAT_EB0_N

PAT_EB0_N

PAT_EB1_N

PAT_EB1_N

VPP_OUT

OSC_EN_STBY_1

OSC_EN_STBY_1

VSIM_ENVSIM_EN

XIP_FLASH_VCC

BT_UART_WAKE

PAT_SEB_PA5

PAT_SOE_PE15

SINGLE_PATH_CHARGE

A25_SIBLEY

A25_SIBLEY

A25_SIBLEY

PC8_UTXD1_UTXD2

ZZ

SRAM_VCC

UART2_RTS

RR_PRM_INT

SPIA_CS7_RR

SPIA_CS7_RR

RR_SEC_INT

RR_SEC_INT

VCONVCON

BT_RESET_B

VDD_PAT_GPS

ZZ

PAT_WAITB

PAT_WAITB

PAT_BCLK

PAT_BCLK

PAT_CS0_N

PAT_CS0_N

PAT_CS0_N

PAT_CS1_N

PAT_CS1_N

PAT_CS2_N

PAT_CS2_N

RXCLK

RXFS

GPS_AGC_DATGPS_AGC_DAT

GPS_CLKACQGPS_CLKACQ

CLKGPSCLKGPS

GPS_MAGGPS_MAG

GPS_PECLREFGPS_PECLREF

GPS_SIGNGPS_SIGN

KEYPAD_COLUMN7

RS232_RTS_USB_XRXD

RS232_TX_USB_DIN

UART2_CTS

BT_UART_TX

BT_UART_TX

STDB

USB_TXENBUSB_TXENB

PAT_WDOG_N

USB_EOPUSB_EOP

SW_B+_EN

KEYPAD_COLUMN3

KEYPAD_ROW4

RS232_RX_USB_VM

KEYPAD_COLUMN5

BATT_IDBATT_ID

RR_SEC_INT_b

GPS_TIME_SYNC

TXFS

iCRNE_CS

UART2_RTS_PAT

TXCLK

SRDB

RX_ACQ

DMCS

RR_AD_TRIGGER

PTT

KEYPAD_ROW0

KEYPAD_COLUMN0

KEYPAD_ROW1

KEYPAD_COLUMN1

KEYPAD_ROW2

KEYPAD_COLUMN2

KEYPAD_ROW3

CKO

MODE_SELECTMODE_SELECT

USB_VPINWDIWDI

OSC_EN_STBYOSC_EN_STBY

CKOH_SCC_CLK16.8MHz_CLK16.8MHz_CLK

LV_DETECTLV_DETECT

LV_DETECT

EOL_INT_B TXE

6880401P39-O 125

Page 126: $R2YULPH

SCHEMATIC DIAGRAMS AND COMPONENT LOCATION

4.7 DIGITAL - ATI AND DISPLAY CONNECTOR

RED

GREEN

BLUE

ATI W2282

MAIN_CS

RESETB

DNP

R/W

D/C

PINS FOR 8-BIT LCD

LCDD8 - LCDD15

17

NC

NC8

NC

NC

15

9

15FLTR2

12FLTR3

11FLTR4

FLTR510

FLTR614

9FLTR7

13FLTR8

G1

GND

2FLTR2

5FLTR3

6FLTR4

7FLTR5

3FLTR6

FLTR78

FLTR84

16FLTR1

NUF8001MU

FL3012

1FLTR1

0

R8126

NC

17

R8127

0

NC

R8128

0

8

12

13FLTR2

15FLTR3

14FLTR4

FLTR511

FLTR612

10FLTR7

9FLTR8

G1

GND

4FLTR2

2FLTR3

3FLTR4

6FLTR5

5FLTR6

FLTR77

FLTR88

16FLTR1

NC

NUF8001MU

FL3011

1FLTR1

LCDD7L1

LCDD8K5

LCDD9L5

LSR1

SSR2

LCDD15P2

LCDD16N4

LCDD17P4

LCDD2K4

LCDD3H4

LCDD4N2

J5LCDD5

L4LCDD6

GST1

LCDD0J4

LCDD1M2

LCDD10M1

LCDD11M5

LCDD12M4

N1LCDD13

N5LCDD14

*U403-3*

DCLKP1

DINVH5

FRAMEG5

K1GCLK

G4GOE

LCD_INTERFACE

1610

NC

12

16

8

13

NC

NC

NC

13

13

NC

NC

11NC

NC

12

14

9

NC

16NC

NC

10

10

14

11

11

NC

14

NC

15 15

17

NC

NC 9

FLTR316

FLTR411

12FLTR5

13FLTR6

FLTR714

FLTR815

GND

G1

FLTR31

FLTR46

FLTR55

FLTR64

3FLTR7

2FLTR8

FLTR110

FLTR29

FL3010

NUF8001MU

FLTR17

FLTR28

LCD_SPI_DATA

LCD_SPI_CS

LCD_DC

LCD_SPI_CLK

LCD_DATA(0:17)

SD_CD_F

LCD_18D17_CS_F

LCD_18D16_RESETB LCD_18D16_RESETB_F

LCD_18D15_8D7 LCD_18D15_8D7_F

LCD_18D9_8D1 LCD_18D9_8D1_F

LCD_DATA_F(0:17)

SD_D2_F

SD_D3_F

SD_CMD_F

SD_WP_F

SD_CLK_F

LCD_DC_F

LCD_RW_FLCD_RW

LCD_DC

LCD_18D8_8D0_FLCD_18D8_8D0

SD_CD

SD_CMD

SD_D2

SD_D3

SD_WP

LCD_18D17_CS

LCD_18D10_8D2

LCD_18D11_8D3

LCD_18D12_8D4

LCD_18D14_8D6

LCD_18D10_8D2_F

LCD_18D11_8D3_F

LCD_18D12_8D4_F

LCD_18D14_8D6_F

SD_D1

SD_D0

LCD_18D13_8D5_FSD_CLK

LCD_18D13_8D5

SD_D1_F

SD_D0_F

LCD_RW

ATI W2282

ATI W2282

CORE CPU LCD RAM VIP0 GPIOC GPIO GPIOD EXT RAM IO EXT RAM CORE

SDIO JTAG

ATI W2282

ATI W2282

1.8V

DNP

DNP

NC

0:WAITb ACTIVE LOW, 1:WAITb ACTIVE HI

1.8V

NC

NC

NA

DNP

2.8V

NC

NC

NC

QSPI_SSb

1.8V

NC

NC

NA

NC

NC

LCD SPI CS (CS)

NC

CPU DATA BUS

0:MLINK DISABLED, 1:MLINK ENABLED

NC

NC

1.8V

DNP DNP

Indirect Addressing

2.8V1.8V

NC

FLASH ENABLE

NC

DNP

NA

0:16-BIT DATA BUS, 1:8-BIT DATA BUS

NC

1.8V

NC

LCD P/S

LCD SPI DATA (D0)

NC

NC

NC

2.8V

NC

DNP

NC

1.8V

NC

NC

NC

NC

DNP

NC

NA

FLASH T_F

NC

NANA

DNP

NC

QSPI_MISO

Disable test mode

DNP

2.8V

NA

NC

NC

NC

QSPI_MOSI

MOTOROLA INTERNAL USE ONLY

NC

NC

NC

0:MR PIN LOW, 1:MR PIN RD/WRb

NC

DNP

NC

NC

NC

LCD SPI CLK (D/C)

NC

NC

NC

ESD POWER:

PLL/XTAL POWER:

NC

NC

NA

NC

NC

NC

NC

0:ATI WAITb, 1:PAT WAITb

NC

NC

NC

NC

NC

NC

DNP

DNP

NA

1.8V1.55V

NC

NC

NC

DNP

NC

NC

NA

QSPI_SCK

NA

NC

0:32kHz SRCCLK, 1:5-20MHz SRCCLK

NC

DNP

NC

DNP DNPDNP DNP

DNP

DNP

DNP

NCNC

NC

NC

DNPDNP

1.55V

NC

NC

3

7

8

NC

R453 0

R80780

NC

NC

C2051

5

R80760

12pF

C 8

L2

MEA1608

FL3008-2

0R8113

3

2.2K

R8071

FL3007-3

MEA1608

7C

L

FL3008-4

C 6

L4

12

MEA1608

R810910K

C

3 L

11

NC

VMMC

13

FL3006-3

MEA1608

7

SW2_FLTR

NC

NC

FHB1M1005JT

E8884

R81170

15

NC

1

NC

NC

0

13

0

NC

NC

R401

NC

3

NC

11

B19SDC0DQ3

A18SDC0WP

NC

V3GPIOD5

V4GPIOD6

SDC0CDB18

E19SDC0CLK

SDC0CMDD14

SDC0DQ0D19

D15SDC0DQ1

C19SDC0DQ2

E16GPIOC5

B15GPIOC6

GPIOC7A15

W2GPIOD0

V1GPIOD1

V2GPIOD2

GPIOD3W3

W4GPIOD4

E5GPIO7

E2GPIO8

E1GPIO9

F15GPIOC0

GPIOC1F16

E18GPIOC2

D18GPIOC3

E15GPIOC4

J2GPIO17

K2GPIO18

L2GPIO19

B3GPIO2

B1GPIO3

D5GPIO4

D1GPIO5

D4GPIO6

C1GPIO1

E4GPIO10

F2GPIO11

F1GPIO12

G2GPIO13

G1GPIO14

H2GPIO15

H1GPIO16

GPIO_SD_INTERFACE

*U403-2*

B2GPIO0

NC

NC

ATI_1_55

NC

5

1

5

NC

0R8080

7

5GND1

10

GND2

GND

FL3006-5

2

NC

NC

1.0uF

SW2_FLTR

NC

SW2_FLTR

C2058

5

7

SW2_FLTR

C480

0.1uF

NC

10KR8107

MEA1608

FL3006-2

C 8

L2

NC

NC

C 9

L1

1

NC

NC

NC

MEA1608

FL3006-1

C479

0.1uF

NC

NC

SW2_FLTR

C463

0.1uF

4

R8112

VIP0DATA8R5

VIP0DATA9W5

VIP0HREFW8

VIP0VSYNCV8

0

VIP0DATA0R6

VIP0DATA1T6

VIP0DATA2T7

VIP0DATA3V6

VIP0DATA4R7

VIP0DATA5T8

VIP0DATA6R8

VIP0DATA7R9

I2C_SCLW7

I2C_SDAV7

VIP0CLKW9

VIP0CLKOW6

C

L4

*U403-4*

CAMERA_INTERFACE

FL3006-4

MEA1608

6

1

6

9

0.1uF

0

2

ATI_1_55

NC

4

C481

0R8079

GND

FL3008-5

5GND1

10

GND2

C60062

1.0uF

NC

6

VMMC

4

3

0.1uF

C460 C464

NC

0.1uF

C475

9

NC

0.1uF

0R8110

SW2_FLTR

C462

0.1uF

R8123

ATI_1_55

NC

NC

NC

0

VMMC

0

C2049

E12

3

33pF

T10

VSS_34

T15

VSS_35

T16

VSS_4

E7

VSS_5

E8

VSS_6

E9

VSS_7

E10

VSS_8

E11

VSS_9

L7

VSS_27

L8

VSS_28

L9

VSS_29

L13

VSS_3

D16

VSS_30

N10

VSS_31

N13

VSS_32

P5

VSS_33

H12

VSS_2

D10

VSS_20

J8

VSS_21

J9

VSS_22

J12

VSS_23

K8

VSS_24

K9

VSS_25

K13

VSS_26

F10

VSS_12

F11

VSS_13

G8

VSS_14

G9

VSS_15

G10

VSS_16

G11

VSS_17

H8

VSS_18

H9

VSS_19

F13

VDDR6_1

F7

VDDR6_2

F8

VDDR6_3

G7

VDDR7_1

M7

VDDR7_2

N7

VSS_1

C18

VSS_10

F9

VSS_11

D9

VDDR3_5

D11

VDDR3_6

D12

VDDR3_7

D13

VDDR4_1

M8

VDDR4_2

M9

VDDR4_3

N8

VDDR5_1

E13

VDDR5_2

M11

VDDR1_8

M12

VDDR2_1

H7

VDDR2_2

J7

VDDR2_3

K7

VDDR3_1

D6

VDDR3_2

D7

VDDR3_3

D8

VDDR3_4

L10

VDDC_8

L11

VDDR1_1

F12

VDDR1_2

G12

VDDR1_3

G13

VDDR1_4

K12

VDDR1_5

L12

VDDR1_6

M10

VDDR1_7

R19

PVSS

T19

VDDC_1

H10

VDDC_2

H11

VDDC_3

J10

VDDC_4

J11

VDDC_5

K10

VDDC_6

K11

VDDC_7

A6

NC4A7

NC5A8

NC6A9

NC7A10

NC8A11

NC9A12

PESD

V19

PVDD

B13

NC22B14

NC23F4

NC24R4

NC25T4

NC26T5

NC27U1

NC28V5

NC3

B6

NC15B7

NC16B8

NC17B9

NC18B10

NC19B11

NC2A5

NC20B12

NC21

T11

I_VDD_7

V18

I_VTST

R13

NC1A4

NC10A13

NC11A14

NC12B4

NC13B5

NC14

N11

I_VDDQ_5

N12

I_VDDQ_6

T9

I_VDD_1

A3

I_VDD_2

A16

I_VDD_3

B16

I_VDD_4

M13

I_VDD_5

N9

I_VDD_6

V9

I_TEST

R11

I_VBB

R10

I_VCCP

W17

I_VDDA

V17

I_VDDQ_1

A2

I_VDDQ_2

A17

I_VDDQ_3

B17

I_VDDQ_4

POWER_GROUND

*U403-5*

I_DVC2

R8111

NC

GND1

5

GND2

10

0

8C

2 L

FL3007-5

GND

VMMC

0

FL3007-2

MEA1608

R8125

NCNC

V3

SW1_FLTR

10K

10K

C2059

R8124

6

NC

1.0uF

0R8077

R81160

12

NC

NC

2

4

L1

1

MEA1608

FL3007-1

C 9

C478

1.0uF

C461

NC

7

delete,.

0.1uF

14

NC

5

4

TP_GPIO61

6

P19WEB

10

0

SW2_FLTR

NC

N16MR

N19OEB

H16RESETB

SLEEPW18

J1SPKG

U19SRCCLK

F5TESTEN

G16WAITB

DQ4J15

J16DQ5

K16DQ6

DQ7K15

J13DQ8

L15DQ9

E14INT0B

INT1BG15

DQ1

DQ10K19

DQ11L16

L19DQ12

M15DQ13

DQ14M16

DQ15N15

DQ2H13

DQ3J19

AD7V13

AD8T14

W14AD9

F19BE0

BE1G19

M19CSB

DQ0H19

H15

AD2V16

AD20R15

R14AD21

AD22P16

W15AD3

AD4V15

AD5V14

AD6R12

T13

AD12W13

W12AD13

AD14T12

AD15V11

W11AD16

V10AD17

AD18W10

AD19R16

*U403-1*

P15AD0

W16AD1

AD10V12

AD11

2

NC

CPU_INTERFACE

10K

14

6C

4 L

NC

R8106

NC

NC

FL3007-4

MEA1608

C484

0.1uF

NC

2.2K

NC

NC

2

3

NC

R8070

C476

0.1uF

NC

NC

NC

C2029

12pF

NC

MEA1608

FL3008-3

C 7

L3

10

6

C60063

0.1uF

SW2_FLTR

NC

R810810K

7

NC

NC

NC

TP_GPIO10

1

0.1uF

C482

R8083

100K

Q1410

0.1uF

C483

8

10K

MEA1608

FL3008-1

C 9

L1

R8102

ATI_VDD_CORE_1_5

LCD_SPI_CLK

LCD_SPI_CS

15

ATI_VDDR4_CAMERA

CAM_MCLK

RESET_OUTRESET_OUT

I2C_DAT

I2C_DAT

CAM_STBY

CAM_STBY

CAM_RESET

CAM_RESET

I2C_CLK

I2C_CLK

CAM_RESET

CAM_STBY

CAM_DATA(0:7)CAM_DATA(0:7)

SD_D1

SD_D0

SD_D2

SD_D3

SD_CD

SD_WP

SD_CMD

CAM_VSYNC_F

CAM_HSYNC_F

I2C_CLKI2C_CLK

SD_CLK

I2C_DATI2C_DAT

ATI_VDDR3_RAM

ATI_VDDR7_GPIOD

Data_12

Data_13

Data_14

Data(0:15)Data_15

PAT_CS3_NPAT_CS3_N

PAT_RW_NPAT_RW_N

PAT_OE_NPAT_OE_N

LCD_P_SMR_PIN_SEL

LCD_SPI_DATAWAIT_PIN_SEL

DISPLAY_INTERRUPTDISPLAY_INTERRUPT

Data_0Address_23Address_23

Data_1

Data_2

Data_3

Data_4

Data_5

Data_6

Data_7

Data_8

Data_9

Data_10

Data_11

CAM_DATA6_F

CAM_DATA6_F

CAM_DATA2_F

CAM_DATA2_F

CAM_DATA7_F

CAM_DATA7_F

CAM_DATA3_F

CAM_DATA3_F

32KHZ_CLK_132KHZ_CLK

CAM_DATA_F(0:7)

ATI_VDDR2_CAMERA

ATI_VDDR2_CAMERA

ATI_VDDR2_CAMERA

ATI_VDDR1_1_8

CAM_PCLK_FCAM_DATA5_F

CAM_DATA5_F

CAM_DATA1_F

CAM_DATA1_F

CAM_MCLK_F

CAM_DATA4_F

CAM_DATA4_F

CAM_DATA0_F

CAM_DATA0_F

ATI_VDD_EXT_RAM_CORE

ATI_VDDQ_EXT_RAM

126 6880401P39-O

Page 127: $R2YULPH

SCHEMATIC DIAGRAMS AND COMPONENT LOCATION

4.8 DIGITAL BLOCK - CONNECTORS, SIM, AND MISC.

80-pin BTB 9009261001

DNP

DNP DNP

DNP

CHANGE BACK TO CAM_RESET_F AFTER TESTING FL3008

CHANGE BACK TO I2C_CLK_F AFTER TESTING FL3008

CHANGE BACK TO CAM_STBY_F AFTER TESTING FL3008

DNP

CHANGE BACK TO I2C_DAT_F AFTER TESTING FL3008

DNP

R8089

0

J779-22

C2039

0.1uF

J779-32

C2048

18pF

7

J779-33

J779-29

J779-17

C470

C204410pF

18pF

33pF

J779-72

C403

15

J779-61

V2

FHB1M1005JTE8889

SW2_FLTR

J779-80

J779-36

J779-49

C406

J779-12

J779-59

J779-14

33pF

J779-54

J779-56

J779-31

J779-63

33pF

C2040

18pFC404

J779-82

J779-2

J779-23

J779-39

10

11

J779-28

C405

33pF

J779-73

J779-1

J779-50

J779-52

J779-77

0R8119

R8099

0

J779-20

J779-25

L405

J779-35

J779-40

TP_EAR_M

1

J779-81

R8100

0

10pF

17

J779-44

C2050

J779-66

J779-42

12

9J779-30

E8886FHB1M1005JT

0R8094

1

0

J779-79

J779-69

J779-21

J779-51

4

J779-65

J779-45

2

14

J779-9

J779-47

0

0

R8093

VR405

16.2V

R8082

10pFC2045

J779-27 C20550.1uF

E8893FHB1M1005JT

E8890FHB1M1005JT

FLTR210

FLTR311

FLTR412

16FLTR5

15FLTR6

FLTR714

FLTR813

GND

G1

FLTR27

FLTR36

FLTR45

FLTR51

FLTR62

3FLTR7

4FLTR8

FLTR19

FL402

NUF8001MU

FLTR18

15.4

R470

J779-71

C2057

J779-4

0.1uF

J779-84

J779-55

R8087

0

J779-24

0

R8086

C2047

J779-26

TP_EAR_P

1

18pF

TP_VIB

1

J779-53

J779-48

J779-57

J779-67

J779-46E405

FLTR413

12FLTR5

11FLTR6

FLTR710

FLTR89

GND

G1

FLTR44

FLTR55

FLTR66

7FLTR7

8FLTR8

FLTR116

FLTR215

FLTR314

FL401

NUF8001MU

FLTR11

FLTR22

FLTR33

0J779-18

R8090

33pFC2038

R8088

J779-3

0

J779-43

J779-19

J779-75

J779-11

J779-68

J779-70

0.1uFC2056

33pFC471

J779-13

FHB1M1005JTE8887

J779-41

16

13

J779-60

8

J779-37

J779-74

J779-76

V_VIB

J779-15

J779-10

3

J779-64

SW3

V2_775_FLTR

J779-5

J779-78

J779-6

0

R8091

J779-8

J779-58

J779-7

C204610pF

14.7

R471

5

6

R8084

0

E8885FHB1M1005JT

FHB1M1005JTE8888

C203733pF

J779-34

J779-16

C43018pF

0

R8085

J779-83

J779-38

CAM_HSYNC_F CAM_VSYNC_F

LCD_P_S

SHORTCUT_BUTTONS_LED_PB5

KP_COL0_F

KP_ROW1_F

ON_OFF_F

KP_ROW3_F

KP_ROW7_F

KP_COL2_F

J779-62

KP_COL5_F

KP_LED_ZONE1_PB7

DISP_LED_PWM_FILT

CAM_DATA(0:7)

CAM_DATA(0:7)

KP_LED_PWM_FILT

LCD_18D15_8D7_F

LCD_DATA_F(0:17)

LCD_DC_F

LCD_RW_F

VIB_PLUS

EAR_PLUS_F

CAM_PCLK

KEYPAD_COLUMN5

KEYPAD_COLUMN7

CAM_HSYNC

KEYPAD_ROW6

KP_COL7_F

KP_COL3_F

KP_COL1_F

DISP_LED_PWM

EAR_MINUS_F

SD_D3_F

SD_D2_F

KP_LED_ZONE2_PB8

KP_ROW5_F

KP_COL6_F

KP_ROW6_F

CI_BLUE

MICROPHONEMICROPHONE

SPKR_R_PLUSSPKR_R_PLUS

LCD_18D8_8D0_F

SD_CD_FSD_D0_F

SD_D1_F SD_CLK_F

SD_CMD_F

KEYPAD_COLUMN1

KEYPAD_COLUMN3

CAM_PCLK_F

SPKR_R_MINUSSPKR_R_MINUS

KP_ROW0_F

KP_ROW2_F

KP_ROW4_F

LCD_18D9_8D1_F

LCD_18D10_8D2_F

LCD_18D11_8D3_F

LCD_18D12_8D4_F

LCD_18D13_8D5_F

LCD_18D14_8D6_F

LCD_18D16_RESETB_F

LCD_18D17_CS_F

I2C_CLK

I2C_DAT

CAM_STBY

CAM_RESET

CAM_MCLK_F

SOL_LED2_PWM

CI_RED

ON_OFF_SWITCH KEYPAD_ROW0

KEYPAD_ROW2

KEYPAD_ROW4

PTT

CI_GREENCI_GREEN

EARPHONE_MINUSEARPHONE_PLUS

VIB_MINUS

BT_OR_PTT_LED_PB6

KEYPAD_ROW3

KEYPAD_ROW7

KEYPAD_COLUMN2

KEYPAD_ROW1

KEYPAD_ROW5

KEYPAD_COLUMN0

KEYPAD_COLUMN6

6880401P39-O 127

Page 128: $R2YULPH

SCHEMATIC DIAGRAMS AND COMPONENT LOCATION

4.9 ROADRUNNER - POWER SECTION

P

N

47K

47K

47K

Q2Q1 47K

47K

47K

47K

Q2

Q1

47K

E

DMOTOROLA INTERNAL USE ONLY

VMMC used for BT and Digital

2.775V

1.875V

2.775V

SUPPLIES TO RF BLOCKS

then parts must

FILT_BATTI connects only to

then parts could be placed

then "Alternate SW1" parts must be placed

OVIC FET

then "Alternate VMMC" parts

Additional 1.875V - V1

be placed

If SW1 is placed and an additonal 1.875V is desired

If VMMC is DNP

1.55V

3.0V

M4 - Logic FET

If VMMC is DNP

DNP

Replace C724 to 2175181C01

R1443

"Alternate SW1"

RR_BATTI connects only to RF PA

5V

M3 - Main FETM1 & M2 - Charge & Dis-Charge FETs

1.55V

must be placed

3.0V

"Alternate VMMC"

DNP

DNP

2.775V

SW1 used for Patriot Core and ATI

DNP

DNPDNP

DNP

DNP

DNP

1.875V

If SW1 is DNP

FAKE REF DE

REAL REF DE

DNP

If SW1 is DNP

then parts must be placed

Replace C797 to 2175181C01

DNP

High Power Audio Amps and ALERT_VCC

2.8V

DNP

2.775V

1.875V

Consider Changing C786 to 10uF

Pla

ce b

y P

A

D1 - Logic Diode

DNP

1.875V

SW3

FILT_BPLUS

4 1 3 A

C7134.7uF

C7111.0uF

NZQA5V6XV5T1

VOLTAGE

4813979B24

NC

0.10uF

VR702

C727 0R716

R787

6

SW1

NC

FILT_BPLUS

0

VR7044813978M23

34

125

SHORTE716

21

SW2

1

*C797*

22uF

USB_VBUS

R768

0

C7081.0uF

C757

FILT_BPLUS

R7930

1.0uF

*C782*

22uF

R724

C1

C2

C3

A1

0

4809807C45*Q702*

replace,4813970M62

FHB1M1005JTE706

RR_BATTI

*C717*22uF

D1A

8

D1B

7 6D2A

D2B

5

G1

2

G2

4

S1

1

S2

3

6

FILT_BPLUS

Q7034813970M54

VOLTAGE

VR755

3

4

1

2

5

E714SHORT

21

R710

0613952N01

E713

21

10K

V2

SHORT

22uF

FILT_BPLUS

NC

*C716*

R775200K

15pFC2054

4.7uF

C786

7605821Z02E703

1

R1441 200K

21

BAT_DET_IN

RR_BATTI

SHORTE720

*C755*22uF

C7292.2uF

56pFC732

C7042.2uF

EN3

GND

2

NC4

VIN1

VOUT5

SW3

5114014A82U703

R778

0

2.2uF

C719

VUSB_ING18

V_VIBE7

F6V_VIB_IN

E8911FHB1M1005JT

VHOLD_EXT_ENE11

B11VHOLD_EXT_IN

C11VHOLD_OUT

C7VMMC

VMMC_DRVD7

C9VSIM

VSIM_END9

G16VUSB

V2_DRVC2

B2V2_FB

V3C8

D8V3_VSIM_IN

R5V4

V4_INR4

VCC_OUTB15

VDRV4_5R16

T18RAWEXTBPLUS

H16SW1ISNSN

SW1ISNSPH14

H17SW1NDRV

SW1PDRVH18

USB_VBUS_URTSIG17

V1B10

C10V1_IN

A18

NC4_1

A19

NC4_2

B19

NC4_3

J15PGND1

J14PGND2

PGND3L14

PSRC2J18

H15PWR_VDD

A2

NC1_2

B1

NC1_3

V1

NC2_1

W1

NC2_2

W2

NC2_3

W18

NC3_1

W19

NC3_2

NC3_3

V19

FB1J16

K15FB2

FB3K16

ISENSER17

LX2J17

LX3K18

MOBPORTBP15

A1

NC1_1

K17BST_IN

P16CHRGC

DCHARCP17

DGND1_1

T14

DGND1_2

U15

D5

DGND2

DGND3

F15

DGND_TEST

F11

AGND_ESD2_1

E8

G6

AGND_ESD2_2

P7

AGND_ESD2_3

AGND_ESD2_4

R11

BATTIV14

P18BATTP

BATT_DET_INN18

E12BPLUS

AGND2

B16

AGND3

E9

AGND4

F17

AGND5

T12

AGND6

M15

AGND7

P5

AGND8

R18

AGND_ESD1

F12

POWER*U701-5*

AGND1

E5

4805286Z07

D705

.05R8122

0

R750

V3

NC

R776

0

C734

2113945A091000pF

C779

4.7uF

FILT_BPLUS

22uF

NC

NC

*C724*

0R772

R712 9.76K

SW2_UNDELAYED

100nH

R7461K

2413954B25

R758

V4

SHORTE712

21

E732

200K

R735

22uF

C790

56pFC706

0613952N82R71369.8K

FILT_BPLUS

VOLTAGE

VR802

22uF

C718

Q1411

Q708

D

G S

4

123678

5

FILT_BPLUS

RAW_B_PLUS

4809607E17Q705

S1

S2

4.7uHL755

4813972A34

Q706 D1

D2

G1

G2

D1B

D2A

D2B

2G1

5G2

S1

S2

Q1408

4871432M01

D1A

R752

0

VMMC

C739

0R709

V_VIB

.01uF

V1

D700

4805656W95

R7191

R722

SW2_UNDELAYED

*R777*

0

0

2.2uF

*C714*

21

E8910FHB1M1005JT

21

SHORTE718

SHORT

E717

*C787*22uF

NC

FHB1M1005JTE731

1K

C746.01uF

R789

C731

SW2_FLTR

C742

SW1

56pF

0.10uF

10uH

L1500

124

4805656W85D702

1K

R726

E711

21

R751

E715SHORT

21

SHORT

NC

1000pF

C736

R748

4.42

C705

10uF

C741

0.1uF

2.2uFC725

0

R780

180K

replace,4813970M62

C1

C2

C3

A1

*R784*

NC

4809807C45

*Q701*

NC

R759.05

0R757

2.2uF

C709

V2

NC

V4

R732200K

*R783*180K

7605821Z02

Q700

E702

1K

R770

R781

200K

USB_VCC

NC

*C789*

22uF

R74930K

10K

R788

R700

1K

FILT_BPLUS

R81200

56pFC707

66.5K

0613952N80

R711

SW2_UNDELAYED

2 B2

4

C1

C2 5

3 E1

1 E2

V3

FILT_BPLUS

Q707

200K

R782

V3

C2053

NC

C205222uF

B2

C1

C2

E1

E2

22uF

Q709

C518330uF

R769

R7710

10K

10K

20m

NC

R704

NC

FILT_BPLUS

VMMC

0688044N02

R714

3

4INPOS

2VCC1

VCC2

5

1VEE

6VOUT

VSIM

SHORT21

5109817F82NCS2200U700

INNEG

7 8

5

E719

4809607E17

Q704

4

1 2 3 6

D701

4805656W85

D7040

C7300.10uF

2360567A11

C53568uF

10uH

*L754*

R727

10K

NC

0685512E01

4.7uFC726

R7150.16

1000pF

2113945A09

C735

0R790

*R701*

0.16

0685512E01

21

C7991.0uF

SHORT

E710

C728

C756

56pF

RAW_B_PLUS

RAW_B_PLUS

0.10uF

RR_FB1

V1_RR_V1OUT

RR_SW1ISNSN

RR_SW1NDRV

RR_SW1PDRV

MOBPORTB_DIODE

MOBPORTB_DIODE

MAIN_FET_SOURCE

RR_SW1ISNSP

MOB_PORTB

MOB_PORTB

LOGIC_FET_GATE

USB_RR_VBUS_URTSI

VMMC

VMMC_RR

V2

LOGIC_FET_OVER_RIDE

ACTIVATION_CURRENT_ENABLE

ACTIVATION_CURRENT_ENABLE

NC_ACTIVATION_CHARGER_PIN4

SINGLE_PATH_CHARGE

LOGIC_FET_CONTROL

LOGIC_FET_OFF

MOB_PORTB

BATTI

SW2_RR_FB2

COMP_POS

INTERNAL_MAIN_FET_COMPARATOR

INTERNAL_MAIN_FET_COMPARATOR

MAIN_FET_COMPARATOR

MAIN_FET_COMPARATOR

DIS_CHARGE_FET_GATE_DIODE

DIS_CHARGE_FET_GATE

MOB_PORTB

ACT_CURR_EN

EXT_B+

EXT_B+

CHARGE_SOURCE

CHARGE_SOURCE

ISENSE

ISENSE

MOBPORTB_SENSE_RRMOBPORTB_SENSE_RR

ACTIVATION_CURRENT_NMOS_DRAIN

CHARGE_FET_GATE

CHARGE_FET_GATE

MAIN_FET_GATE

RR_BATTI

RR_BATTI

COMPARATOR_NEG

EXT_BPLUS_SENSE

GROUND EXT_COMPARATOR_SUPPLY

SW2_ISENSE_P

SW2_ISENSE_N

USB_RR_VUSB_IN

VHOLD_EXT_IN_RR

VHOLD_EXT_EN

VCC_OUT

VSIM_EN

VHOLD_OUT

BATTP_SENSE_RR

RR_BATTP

BATTI_SENSE_RR

LOGIC_FET_CONTROL2

SW2_RR_LX2

SW2_FB2

RR_VDRV4_5

V2_IN

VMMC_IN

SW3_RR_LX3

V_RR_VIB_IN

SW3_RR_FB3

SW2_RR_PSRC2

V4

V1_RR_V1IN

BATT_DET_IN_RR

RR_PWR_VDD

V2

V3

V2_RR_DRV V2_RR_DRV

RR_VMMC_DRV

CHARGE_D

EXT_BPLUS_STABILITY_RC

V3_RR_VSIM_IN

RR_BATTI

GROUND

NC_RR_NC4_3NC_RR_NC4_2NC_RR_NC4_1NC_RR_NC3_3NC_RR_NC3_2NC_RR_NC3_1NC_RR_NC2_3NC_RR_NC2_2NC_RR_NC2_1NC_RR_NC1_3NC_RR_NC1_2NC_RR_NC1_1

RR_DGND_TEST

RR_BPLUS

ACTIVATION_REGULATOR_VIN

VR702_NC1

FILT_BATTI

CHARGE_FET_CONTROL

GROUND

SW3_L

SW3_CAPS

128 6880401P39-O

Page 129: $R2YULPH

SCHEMATIC DIAGRAMS AND COMPONENT LOCATION

4.10 ROADRUNNER - INTERFACE AND A/D

Place R734 when not using signal

DNP U3005 and R8121 PLACE R762

DNP -- 47K -- Balboa

determined by HSID document

Place R702 when powering

Place C798 and C796 when using dual path charger in RR V2.2 or after

Zeus DAT_SE0 USB mode - Connect PGM to GND

This is VICR for charge Control

DNP

DNP

Replace C798 to 2175181C01

Values on R707 and R708 are

47K -- 47K -- Tarpon

RF Board Alone

There is an internal 200K +/- 30% Pull Up resistor between USB_ID and LCELL

PLACE XTAL CIRCUIT FOR NOW

This is no longer an LED Sync pin

MOTOROLA INTERNAL USE ONLY

DNP R762 PLACE U3005 and R8121

100K -- 47K -- Blackstone

Supervisory Circuit

ON2B can tolerate 14V, USB_ID can only tolerate 4.65V.

Default Option:

Enter Factory Test Mode if 5V comes in on USB_ID. This is to be scaled and detected by AD5

47K -- 100K --

faisal- change r766 to 392k

Separate Isolated Grounds

DNP

There is a 200K internal pull up resistor between ON2B and V2 or B+.

Alternate:

DNP

R707 -- R708 -- Product

47K -- 10K --

47K -- DNP -- Cobia

INDY USB VP_VM mode - Connect PGM4 to FILT_B+

R765

75K

200K

R721

2.2uF2113956B33 C796

10KR731

R786

0

C78518pF

0.1uF

V4

C733

22uF

*C798*

0

V4

R785

0R723

22uFC788

2175034B01

R766390K

1.0uF C722

SW2

47K

4816402H01

D711

V4

SW2

R720

0.1uFC777

100uFC783

R7022.7K

4816402H01

1MEG

D712

R773

R70847K

4.7uF C715

SW2

R730

V4

V2

121K

G12VPP_OUT

WDIC16

XRXD_URTSOF16

XTAL1

U11

XTAL2

U12

D18TX_ENB

USB_DIG_VCCE18

USB_DM_URXDIG14

USB_DP_UTXDOG15

USB_IDC18

USB_VM_URXDOE17

USB_VPG13

L13USR_OFF

SEC_CEM14

SEC_DIG_VCCN14

SEC_MISOV17

SEC_MOSIU16

SEC_SPI_CLKU17

SEQ_INE16

STANDBYE14

TXD6

U18PRI_MISO

PRI_MOSIT15

PRI_SPI_CLKT17

RESETBC14

E13RESETMCU_B

RTC_GND

T11

RX0E6

RX1C5

ON2BC17

ONBB18

PGM0R2

R3PGM1

PGM4T5

POWER_FAILE15

PRI_CET16

PRI_DIG_VCCR15

B14LI_CELL

R12LVS

LVS2K14

MAIN_DIG_GNDN16

N15MAIN_DIG_VCC

MCLKF5

MODF14

D16MUX_CTRL

C15LCELL_BYP_1

LCELL_BYP_2D14

LED1_DRVL16

LED2_DRVL17

LED3_DRVL15

M16LEDB

LEDGM17

M18LEDR

CS_OUTD15

D17DIN_UTXDI

F13EOLI

FSYNC0G5

B5FSYNC1

M13INT_PRI

V18INT_SEC

KHZ32P11

INTERFACE

B17BG_BYP

B6BITCLK0

BITCLK1C6

CD_CAPC3

CLK16_8M2

SW2

FILT_BPLUS*U701-1*

R729

90.9K

V2_775_FLTR

C73875pF

R745

10K

R741

1K

0 R734

20KR764

1.0uFC764

R7960

Y1CC5V

4809995L13

32.768KHz

2 1

0613952R01

R725

10K

100K

SW2

2RESET

3VCC

V2

R8121MAX803U3005

1GND

C60061

0.1uF

0 R762

V16AD_TRIG

P12TSX1

V13TSX2

U13TSY1

T13TSY2

TS_BYPR13

P13AD4

U14AD5

N13AD6

V15AD7

R14AD8

P14AD9

*U701-4*A_D_CONVERTER

*R707*100K

392K

R728

10K R739

SW2

0.1uF C723

18pFC784

SW2_ISENSE_N

BATTERY_TEMP

RMT_CONTROL

VICR

USB_ID_AD7

USB_ID

RR_USB_ID

USB_ID_AD5RX1

RX1

CI_BLUECI_BLUE

LV_DETECT

LI_CELLLI_CELL

USEROFFUSEROFF

VPP_OUTVPP_OUT

RR_TXTXTX

RX0RX0

RMT_CONTROL_ON2B

16.8MHZ

16.8MHZ

PGM_0

SW2_ISENSE_P

SEC_SPI_CLKSEC_SPI_CLK

PRI_CEPRI_CE

PRIMARY_INTPRIMARY_INT

SEC_CESEC_CE

SEC_SPI_MISOSEC_SPI_MISO

SECONDARY_INTSECONDARY_INT

ON

ON

MOD_OUTMOD_OUT

BG_BYP_pin_B17_RR

PA_TEMP

BG_BYP

PA_ID

AUDIO_JACK_PTT_DETAUDIO_JACK_PTT_DET_SCALED

RR_RESETB

LVSLVS

POWER_FAILPOWER_FAIL

RESETMCU_BRESETMCU_B

FSYNC1FSYNC1

BITCLK1BITCLK1

FSYNC0FSYNC0

BITCLK0BITCLK0 ADTRIG

SEC_SPI_MOSISEC_SPI_MOSI

PRI_SPI_CLKPRI_SPI_CLK

PRI_SPI_MOSIPRI_SPI_MOSI

PRI_SPI_MISOPRI_SPI_MISO

USB_VM

RR_LCELL_BYP

Shielded Shielded

CS_OUTCS_OUT

SOL_LED2_PWMSOL_LED2_PWM

DISP_LED_PWMDISP_LED_PWM

EOL_INTERRUPTEOL_INTERRUPT

CI_REDCI_RED

CI_GREENCI_GREEN

CD_CAP_U701

MUX_OUTMUX_OUT

32KHZ32KHZ

STANDBYSTANDBY

WDIWDI

USB_D-USB_D-

USB_D+USB_D+

USB_VPUSB_VP

USB_SE0INUSB_SE0IN

USB_DINUSB_DIN

USB_TXENBUSB_TXENB

USB_XRXDUSB_XRXD

USB_VM

6880401P39-O 129

Page 130: $R2YULPH

SCHEMATIC DIAGRAMS AND COMPONENT LOCATION

4.11 ROADRUNNER - AUDIO BLOCK

DNP

Keypad PCB on Dig Sheet 2

Microphone connects to the

DNP COMPONENTS IN BOX FOR STEREO

DNP COMPONENTS IN BOX FOR MONO

MOTOROLA INTERNAL USE ONLY

PLACE COMPONENTS IN BOX FOR STEREO

DNP COMPONENTS IN BOX FOR MONO PLACE COMPONENTS IN BOX FOR MONO

AUDIO JACK

4 1 3 A

DNP COMPONENTS IN BOX FOR STEREO

PLACE COMPONENTS IN BOX FOR MONO

If This version does not work, place back L756, C791, C792

PLACE COMPONENTS IN BOX FOR STEREO

R760

5.6K

100nH L752

2414017P25

E745SPARK_GAP

1 2

L753

7685268E01

1 2

E742SPARK_GAP

1 2

33pFC794

E753SPARK_GAP

100nH

L751

VAGB3

56pF

C771

SPKRMF2

SPKRPF3

SPKR_GND1_1

G4

SPKR_GND1_2

H4

SPKR_GND2

E2

C4STDACBG

E10STDACREF

STDACVDGB4

MIC_INMJ2

PGA_INLK5

PGA_INRK4

PHANTOM1

E4

PHANTOM2

E3

PLL_GNDD11

D10PLL_LPF

PTT_DETG3

ALRT_GND

H6

ARIGHT_OUTD2

AUDIO_VCCF4

AUX_MICMK3

EXTOUTH5

EXT_MICJ5

MIC_BIAS1J4

MIC_BIAS2J3

A1_INTD4

ALEFT_OUTD3

H2ALERT_VCC

ALRTMH3

ALRTPG2

E752

*U701-2*AUDIO

7685268E01

V2

C75456pF

0.1uF C702

D753

C76956pF

1

TP_MIC

33pFC753

SPKR_R_M

1

56pFC751

C7030.1uF

E754

1 2

100nH

SPARK_GAP

7685268E01E782

L1501

33pF

7685268E01E709

2NC1

3NC2

6NC3

7NC4

C758

1FLTR1

4FLTR2

5FLTR3

8FLTR4

G1

GND1

GND2

G2

G3

GND3

E743SPARK_GAP

1 2

NUF2450MUFL751

56pF

C765

1 2C76610uF

E757SPARK_GAP

5.6VVR750

4.7uFC710

0.47uF C780

.01uFC720

43K R706L750

100nH

1500pFC721

E756SPARK_GAP

1 2

D752

NC

NC

NC

T11

T22

T33

T44

T55

T66

1 2

NC

J752

C778

SPARK_GAPE758

7685268E01E781

0.1uF

7685268E01R755

C701

1 2

4.7uF

33pFC752

SPARK_GAPE750

SPKR_R_P

1

C759

E7557685268E01

33pF

SPARK_GAPE741

1 2

2.7K

VR703

R754

R792

R791

30

1 2

30

56pF

SPARK_GAPE740

C763

56pF

C770

7685268E01E751

C7810.47uF

R753

10uF

0

1 2

C760

SPARK_GAPE744

AUX_MIC

AUX_MIC

ALEFT_OUT_RRALEFT_OUT_RR

ARIGHT_OUT_RRARIGHT_OUT_RR

AUDIO_JACK_PTT_DETAUDIO_JACK_PTT_DET

AUDIO_JACK_INT

RAW_PTT_DET

A1_INTA1_INT

ALERT_M

AUDIO_JACK_AUX_MIC

AUDIO_JACK_LEFTAUDIO_JACK_LEFTAUDIO_JACK_LEFT

AUDIO_JACK_RIGHT

PHANTOM_GND

SW3_CAPS

AUX_MIC

AUDIO_RIGHT_FILT

SPKR_R_MINUSSPKR_R_MINUS

SPKR_R_PLUSSPKR_R_PLUS

SPEAKER_M

FILT_BATTI

AUDIO_VCC

AUDIO_LEFT_FILT

ALERT_P

PHANTOM_VAG_PINPHANTOM_VAG_PIN

SW3_FLT

MICROPHONE

PHANTOM_VAG_PIN

AUDIO_INAUDIO_IN

MIC_BIAS_1

MIC_BIAS_1

MIC_INM

MIC_BIAS2

AUX_MICM

EARPHONE_MINUSEARPHONE_MINUS

SPEAKER_P

VAG_OUT_B3

VAG_OUT_B3

VAG_OUT_B3

EARPHONE_PLUSEARPHONE_PLUS

STDACREF

STDACBG

STDACVDC

Shielded

PLL_LPF_RCShielded

RR_PLL_LPF

AUDIO_OUTAUDIO_OUT

130 6880401P39-O

Page 131: $R2YULPH

SCHEMATIC DIAGRAMS AND COMPONENT LOCATION

4.12 TRANSCEIVER

47K

47K

4.7K

10K

MFG CTR

QA CHK:

Enginee

Drawn b

R&D CHK

DOC CTR

Changed

GPS_RFA_VCC

GPS_CP_VCC

Pla

ce b

y P

in 1

Replace C616 to 2175181C01

900MHz RF2,RF1,100-010,GPO4

RX_AVCC

GPS RX(1400s)

MIXER_VCC

5175772B65

1.875 to 2.775V level shifter

Inductor

10-dB PAD

Resistive Dividers placed on RR sheet

VCON control

GPS_VCO_VCC

RX COMPONENTS (200s)

Place by PA

Pla

ce b

y P

in 5

&7

Blackstone

5185633C78

PR2_VCC

Faisal A

for

Pla

ce b

y P

in B

atte

ry C

onta

ct

800MHz RF1,RF3,010-001,GPO5

V1=1, V2/V3=0 -> RFC-RF2

TCXO

V2=1, V1/V3=0 -> RFC-RF1

(500s)

VCO_BUF_VCC

of U501

Replace

Pla

ce b

y P

in 5

&7

iDEN 50ohm RF Jack

GPS test pad

Place by V2 regulator.

floor contact

DIGITAL

RX, TX and GPS lines are matched length Diff_Pairs

Place as close as possible to RR pin PAGAIN_DAC

Thermistor

TX COMPONENTS (500s)

BLUETOOTH

SF_REF_BYP requirement: 8uF to 12uF>22uF

ESC_CP_VCC

RX_CHP_VCC

Ground away from VCO

Place by RR

GPS_MIX_VCC

PA

ESC_VCC

Need X7R Part

TP Poh

Place R599 for no VCON control, DNP U502, R598

2nd battery

Place U502, R598 for VCON control, DNP R599Place C527/8 close to pin 15

DNP

ROADRUNNER

Printed

TP Poh

FGU COMPONENTS (300s)

GPS_AVCC

SHIELDS

Place jumper by RR pin

Anthony

Anthon

Anthon

SF_OUT Requirement 3.8uF to 12uF

RX_QGEN_VCC

DNP

Mauricio

SLEDGEHAMMER

MAIN_CP_VCC

TP Poh

TP Poh

DNP

ANTENNA MATCH

CLEAN_VCC

TX_QGEN_VCC

Battery Floor ground contact

T.C

. = 2

50 P

PM

/C

ISM RF3,RF2,001-100,GPO3

VCO

TX_DMIX_VCC

Pla

ce b

y P

in 1

Replace

MAIN_VCC

V3=1, V1/V2=0 -> RFC-RF3

4 1 3 A

0R605

C20156pF

12pF

0.10uF

C222

2113946K02

C689

56pF

C20456pF

C520

GPSSIGNBIT

1

56pF

DNP

R600

0613952Q4356

C290

L30356.05nH

0R1414

C60060

2113944A112.7pF

GPSIFOUTX

1

22nH

C310

L1499

7IN_800

5IN_900

1OUT_800

3OUT_900

0.1uF

FL201G5ED-938M00

GND1

2

GND2

4

GND3

6

GND4

8

1

V2_TX

V_1_875_D

TP_ANA_CLK

NC

27nHL202

2488090Y18

C14252.0pF

M500

3987977Y02

0.10uF2113946K02

C300

2113944E15

18pF C313

56pFC508

2113944A34

1

C530

TP_RXI

75

8.2pF

R518

0613952K85

0685660C01

R503

47K

TP_AGC_DAC1

.01uF

2113945B02

C311

C29156pF

DNP

TP_DMCS

1

0E600

2113944E15

18pF

TEST1_SL1

C312

0

56pF

R204

0613952R66

CONTACT

M1401

PIN1

1PIN2

2

C617

C149918pF 2113946D02

R50610

1

V2_GPS

1.0uFC215

*SH600*SHIELD

1

2113946C02

C2140.22uF

6800pF

TP_LNA_EN

1

V_1_875_D

C521

2113945B01

150nH

SH1000SHIELD

2415429H39

L201

L6050

.01uFC206

1 2

C142318pF

SH800SHIELD

2113945A12

C2123300pF

C517

68pF2113944A36

2488090Y10

L3015.6nH

10nHL1410

0C502

0613952R66

delete,.

3.3nH

V2_GPS

C308

R1440

1 2

SH301SHIELD

1

0.1uF

SH700SHIELD

C524

2200pF

2113945A11

V2_RX

C288

1

18pF

NC

TP_TXI

1

C213

2113945A123300pF

TP_STD

2113944A26

C2005

12pF

V2_RX

NC

GPSIFOUT

1

TP_GPS_CLK

1

7685268E01FHB1M1005JT

E602

NC

R59810K

2113946K02

C219

82

R602

0613952Q47

0.10uF

18nH

SF

E519

L503

1.2pFL1412

2115153H05

TP_RF_ATTN1

C25156pF

V2_TX

.01uF

NC

2113945B02

C202

C500

2488158Y10

C14505.6nH

.033uF

33pF

C525

2113945B05

TP_TXCLK

1

C149818pF

2488090Y10

V2_GPS

L3045.6nH

0.10uF

2113946K02

C221

10uF2113956B54

C526

15pFC1453

C3090.1uF

0613952Q52

130

R601

.047uF

2113946B02

DNP

C305

2113944A34

10uF2113956B54

C60053

NC

56pFC301

L1420100nH

56pFC519

2187893N01

1.0uF

C623

V_1_875_D

C6005956pF

SHORTR6000

21

C51156pF

2113944A34

6BIAS

2

DEG

3GND

7

PON4

VCC

5

3987977Y02

M501

*U1420*

replace,51007599001AI

1

AO

12

GND8

6

1RF_OUT

SEL18

SEL27

VCC

5

9V_TUNE5164015H68

*U300*

GND1

2

GND2

3

GND3

4

GND5

10

GND6

11

GND7

0

1804MHzUCVA5XV02

56pF

R610

F12PKG_GND7

G6PKG_GND8

G7PKG_GND9

C203

K3

PKG_GND47

PKG_GND48

M3

N3

PKG_GND49

F10PKG_GND5

P14

PKG_GND50

R13

PKG_GND51

R14

PKG_GND52

F11PKG_GND6

PKG_GND4

C6

PKG_GND40

C8

PKG_GND41

C9

PKG_GND42

D4

PKG_GND43

D15

PKG_GND44

E15

PKG_GND45

J3

PKG_GND46

PKG_GND32

L12

PKG_GND33

M6

PKG_GND34

M8

PKG_GND35

M9

PKG_GND36

M10

PKG_GND37

M11

PKG_GND38

M12

PKG_GND39

F9

K11

PKG_GND25

K12

PKG_GND26

L6

PKG_GND27

L7

PKG_GND28

L8

PKG_GND29

F8PKG_GND3

L9

PKG_GND30

L10

PKG_GND31

L11

H12

PKG_GND18

J6

PKG_GND19

F7PKG_GND2

J7

PKG_GND20

J11

PKG_GND21

J12

PKG_GND22

K6

PKG_GND23

K7

PKG_GND24

G8PKG_GND10

G9PKG_GND11

G10PKG_GND12

G11

PKG_GND13

G12

PKG_GND14

H6

PKG_GND15

H7

PKG_GND16

H11

PKG_GND17

B1NC3

A16NC4

A17NC5

B17NC6

T1NC7

U1NC8

U2NC9

F6PKG_GND1

PKG_GND

U2051-2

A1NC1

T17NC10

NC11U16

U17NC12

A2NC2

C527

0.10uF

OUT_Y5

VCC

V_1_875_D

2113946K02

U502

NL17SZ073

GND

2IN_A

1NC1

4

C25056pF

22uF2175034B01

V2_GPS

V_1_875_D

*C616*

100KR505

1

C20956pF

*SH300*SHIELD

L204

82nH

PLACE 82nH for ESD2414017P24

56.05nH

L500

1

680

R201

BBP_RXCLK

1

TP_TXQX

V2_TX

.022uF

C523

2113945B04

2113945B02

C2161.0uF

2113946D02

C514.01uF

*SH500*SHIELD

1

2113945A13

C210

4700pF

TEST2_SL1

C621

470pF

2113944E15

18pF

C1422

11

RF_VCC

RSET10

NC

R6080

GND

12

GND1

G1

LNA_E2

6LNA_I

LNA_IN1

LNA_OUT7

LNA_VCC

8RF_ATTN

4 U200MAX2373

5115443H01

AGC5

9AGC_BYP

3EN_RX

SF

V4_TCXO

SF

2113945A05

C513

470pF

12pF2113944A26

C304

2585130E03

CT 2

GND5

NC6

PORT11

PORT2 3

PORT3

4

2

GND1

4GND2

1IN

3OUT

T500SLT-087G

C217

DF75MF0

FL1420

V_1_875_D

2113946K020.10uF

C28918pF

0613952Q74

R200

1.1K

TP_RXQ

1

56pF

2113944A34

C6005456pF

C20556pF

56pF

C252

RXEN_STROB

1

C60057

C20018pF

2175035B01C629

10uF

L2006.8nH

2471237B04

C30212pF

2113944A26

C6142113944A42

V2_TX

R609

0

150pF

0.10uF

C625

2113946K02

TXCLKM5

TXIV3

TXIXV4

U4TXQ

TXQXU3

TX_DAC_GND

T4

TX_DAC_VCC

V5

V_TERMR8

SDTXM3

U9SELECT1

SELECT2V9

N6SFTX

SF_OUTT2

SF_REF_BYPU2

SF_VINV2

SIGNN2

RX_SDM_VSSA

R10

RX_SDM_VSSA1

R7

SCLK_OUTL3

V8SDM_BIAS

SDM_VAGU10

SDM_VDACV10

SDM_VDAC0T10

SDRL2

RXI_AD_INV7

RXQX_AD_INU7

RXQ_AD_INU6

R6

RXTX_AGND

RXTX_AVCC

U5

RX_EN_STROBET7

RX_SDM_VDDA

P10

RX_SDM_VDDA1

T6

PAGAIN_DACT3

PHCLKU8

RFSTEPAT9

K6

RF_SSI_GND

RF_SSI_VCC

M6

RXACQL5

RXFSL4

RXIX_AD_INV6

D13GPO3

C13GPO4

B13GPO5

P4GPS_49_IN

GPS_IFINP3

GPS_IFINXP2

INCR_DECRT8

MAGN3

N4ACQ_CLK

AGC_DACR9

CLK33_6L6

CLK_OUTGPSN5

DMCSM4

GPO0D12

GPO1B12

GPO2C12

*U701-3*TRANSCEIVER

C626

DNP

12pF

1UNBAL_PORT

NC

56pF

2113944A34

C223

LBD211G6020T1400

3BAL_PORT1

4BAL_PORT2

2GND1

5GND2

NC6

V2_TX

NC

C522

C21812pF

2113945B04

.022uF

C529

56pF

56pFC60055

2113946B04

0.1uFC303

1.5pF

V2_SF

DNP

2113743N07

C516

2175035B01

C61510uF

5185633C78

33.6MHzMTE3073C

Y600 1GND1

GND2

2

OUT3

VCC

4

2414017P08

L14053.9nH

2113944A133.3pF

2414017G18

C207

PIN12

PIN2

L50282nH

CONTACTM1400

1

7VVEN

R2022.7K

RFANT12

4RFIN

10RX

1VBAT1

5VBAT2

15

VBAT3

2VCON

16

VREG

ASW

14

CPL_RFOUT9

CTGND

173

GND1

6

GND2

8GND3

11

GND4

GND5

13

U501

5185633C54

L14984.7nH

SHORTR507

21

56pFC60056

R501

0613952L01100

R599

10K

V2_SF

GND1

2

GND2

4

GND3

6

GND4

8

GPS_IN5

GPS_OUT3

ISM_IN ISM_OUT1

C507

2113944A34

FL200G6ED-1G5754

56pF

C59012pF

R500

0613952K85

75

1

L30056.05nH

TPRXQX

V2_GPS

0.10uF2113946K02

C620

C628

2113944A34

C63056pF

V2

2187893N011.0uF

1000pF

C510

0R606

0613952R66

1.82K

L501

0.10uF

0613952Q36

2113946K02

C627

7V3

30

R603

CGND

92NC

4RF1

5RF2

8RF3

1RFC

3V1

6V2

U3003SKY13251

1pFC501

2113944A63DNP

0985502E02J500

2A

1C

3G1

4G2

3BAL_PORT1

4BAL_PORT2

2GND1

GND2

5

6NC

1UNBAL_PORT

1

2585130E05

LDB18896M05GT200

56pF

TP_ASW

C211

2113944A34

SW34813973A82

Q500

18pF

C1451

V2_TX

L30256.05nH

NC

0.10uF

2113946K02

C528

2113945A09

1000pF

C307

C531 56pF

0.10uF

2113946K02

C622

1%

C69012pF

NC

3K

0613952Z43R604

P2

V_TERMB13

M513

TX_DM_RFIIN

TX_DM_RFINBG16

TX_QGEN_VCC

B6

TX_RFOUTB3

TX_RFOUTBB4

TX_RF_GND

C4

TX_VCO_GND

C7

TX_VCO_VCC

B7

VCO_BUF_VCC

TEST1M16

TEST2L16

C14TXI

TXIXD14

TXQB15

TXQXB14

TX_DMIX_VCC

D16

F16

J2

RX_MIX_INXK2

RX_QGEN_VCC

G3

SCAN_MODEL15

R4SLT

SPI_CLKT6

SPI_DRT5

SPI_DWR6

SPI_VCC

T8

E3

RXQX_WBPB2

RXQ_NBPE2

RXQ_WBPC2

RX_AVCC

G15

RX_CHP_VCC

L2

RX_EN_OUTL3

RX_EN_STROBEK15

RX_MIX_IN

H16

RXIXH15

RXIX_NBPF3

RXIX_WBPD2

F2RXI_NBP

RXI_WBPD3

RXQJ16

RXQXJ15

RXQX_NBP

H2

MN_ADAPT_CPT3

MN_CPT2

PHCLKT7

PR1_VCC

G2

PR2_VCC

E16

REFCLK_INT9

RSTBR9

RXI

B12

LVCC

R8

MAIN_CP_GND1

P3

MAIN_CP_GND2

P4

MAIN_CP_VCC

T4

MAIN_VCC

R2

MAIN_VCO_INN2

MAIN_VCO_INXM2

MIXER_VCC

T12

GPS_VCO_VCC

T13

INCR_DECRR7

LCAPF15

LGND

M7

LP1IC12

LP1IBB11

LP1QC13

LP1QB

T11

GPS_IFOUTP16

GPS_IFOUTXN16

GPS_LNA_ENK16

GPS_MIX_VCC

R12

GPS_RFA_VCC

R16

GPS_RFINT14

T15GPS_RFINB

GPS_SYNTH_VCC

C10

ESC_CP_VCC

B10

ESC_VCC

B9

GPS_AGCM15

GPS_AVCC

T16

GPS_CLKP15

GPS_CP_GND1

R10

GPS_CP_GND2

R11

GPS_CP_VCC

B16

CAPOCC16

CEXR5

CIAP_BIASH3

CLEAN_VCC

N15

CLK_VCC

T10

CP_BIASB8

ESC_CP_GND1

C11

ESC_CP_GND2

SLEDGEHAMMER

U2051-1

ASWC5

CAPMB5

CAPO

R203100K

GPSMAGBIT

1

V2_GPS

0613952R25

TP_ACQ_CLK

1

RR_BATTI

TP_TXQ

1

NC

V2_RX

C144118pF

1RFC

3V1

6V2

7V3

V2_RX

U3004SKY13251

CGND

9 2NC

4RF1

5RF2

8RF3

2113944A34

C624

TP_RXIX

1

56pF

.01uFC1452

56pF

V2_RX

C515

2113944A34

1

C6005856pF

12

TP_TXIX

V2

SPARK_GAP

E500

2113944A238.2pF

C509

2113945A09

C306

1000pF

56pFC506

C2006

12pF

2113944A34

0.10uF

C512

2113944A26

SHIELDED

RF_50_OHM

RF_50_OHM

2113946K02

VCON

PA_TEMP

PA_ID

PA_ID

SPI_DR

TXE

GPS_AGC

RF_50_ohm

RSTB

CE_SH

SPI_CLK

SPI_DW

ASWTXFS

SDTX

BG_BYP

TCXO_33_6MHzTCXO_33_6MHz

GPS_MAGBIT

GPS_SIGNBIT

DMCS

TXCLK

SCLK_OUT

RXFS

SDR

GPS_CLK

GPS_ACQ_CLK

RXACQ

XCVR_V2

RF_50_OHM

XCVR_DIG_1_875_pwm

RF_50_OHM

XCVR_DIG_1_875_lin

TCXO_V4

6880401P39-O 131

Page 132: $R2YULPH

SCHEMATIC DIAGRAMS AND COMPONENT LOCATION

4.13 BATTERY BLOCK

SHIELD CONNECTIONS SPARK GAPS FOR AUDIO JACK

Breakaways Tabs- Do Not Delete

BATTERY CONTACTS

Batt_B+

proportional to tempanalog voltage

AND FOR ANTENNA

MOTOROLA INTERNAL USE ONLY

BRKAWY1

VR107

BRK

BRK1

5.6KR101

16.2V

BRK4

BRK

1 BRKAWY

BRK3

BRKAWY1

V4

BRK

C102

75pF

0

R104

FBM3216HS800E101

NCNCNC

RAW_B_PLUS

VR1095.73V

C10375pF

VR1065.73V

BRK2

BRK

1 BRKAWY

C104

2113944A23

C105

2113944A23

8.2pF

PIN11

PIN22

PIN33

PIN44

8.2pF

C101

M104CONTACT

75pF

RAW_B_PLUS

NC

0

R103

BATT_ID_FLTRBATT_ID_FLTR

BATT_THERMISTOR_FLTRBATT_THERMISTOR

BATTERY

BATTERY

BATTERY_ID

BATTERY_ID

RAW_B_PLUS

132 6880401P39-O

Page 133: $R2YULPH

SCHEMATIC DIAGRAMS AND COMPONENT LOCATION

4.14 BLUETOOTH BLOCK

1.875 V

MOTOROLA INTERNAL USE ONLY

DNP

DNP

1.875 V

OSC enable from host

Internal Regulator Option

Place when BT DNP

2.8 V

DNP when BT placed

DNP

DNP

1.875 V

Place components within box

DNP components from External Regulator box

External Regulator Option

Place components within box

DNP components from Internal Regulator box

R1005

BT_SPIMISO1

0

*C1008*

NC

2113944A09

2.2pF

15pFC1011

2113944A27

BT_SPI_CSB1

R1099

0

GND

2

IN03

IN11

IN26

VCC

5

Y4

U1001SN74LVC1G98

DNP

2113946B04

C10040.1uF

CONTACTM1011

PIN11

PIN22

BT_SPIMOSI1

1.0uFC1031

2113946D02NC

VMMC

BT_SPI_CLK1

NC

NC

2113946D02

C10031.0uF

SW2

0

0R1012

DNP

R1024

L1002

82nH

2113743N03

C1010

DNP

delete,.

1pF

R1023

C102168pF

47K

R10100

SW2

2.2nH

R1011

2.2uFC1026

2113956B33

2R1030

0613952Q08

TEST_POINTBT_BECLK

1

R1009

0

R1001

0

0L1003

0613952R66

BT_BYPRX1

VSS_DIG

A6

VSS_PADS

E2

VSS_PIO

D2

VSS_RADIO

B2

VSS_VCO

A1XTAL_IN

A3XTAL_OUT

NC

NC

E7

VDD_PADS

F1

VDD_PIO

C1

VDD_RADIO

B4

VDD_USB

B1

VDD_VCO

A2VREG_IN

B3

VSS_ANA

C7

D1TX_A

E1TX_B

C4UART_CTS

A7UART_RTS

B5UART_RX

D4UART_TX

A4

VDD_ANA

C6

VDD_CORE

D7PIO6

D6PIO7

E6RESETB

F5SPI_CLK

F6SPI_CSB

SPI_MISOF7

F4SPI_MOSI

F3TEST_EN

D5PCM_OUT

C5PCM_SYNC

D3PIO0

C3PIO1

E3PIO2

F2PIO3

E5PIO4

E4PIO5

U1000

C2AIO0

A5AIO2

B6PCM_CLK

B7PCM_IN

2113944A27

C1006

5103535B46

BC313143A18

15pF

R10200

5BAL1

BAL272

DC

GND1

4

GND2

6 8GND3

3NC

1UNBAL

9175824C01

DEA202450BT-7099A1

FL1000

0613952R66

L10010

2.2pF*C1007*

NC

NC

0

R1022

.01uFC1001

V2_775_FLTR

2488090Y05

L10052.2nH

delete,.

2.0pFC1023

2.0pFC1024

1nHL1004delete,.

C1032.01uF

.01uFC1025

2113945B02

.01uFC60052

2113945B02

22nH

SW2

TCXO_33_6MHz

BT_ANT_MATCH

RF_50_OHM

BT_DC_FEED

BT_RF_OUT2

RF_50_OHM

BT_RF_OUT1

RF_50_OHM

L1000

BT_CLK_AND_BUFFER_EN

RF_50_OHMBT_RF_PLUS

RF_50_OHM

BT_RF_MINUS

STANDBY

BT_OSC_EN

BT_DC_SUPPLY_OUTPUT

BT_DC_REGULATOR_2775V_IN

BT_DC_SUPPLY_INPUT

BT_VDD_PIO_PADS

BT_XTAL_IN_A1

BT_ANTENNA

BT_UART_CTS

PSKEY_UART_HOST_WAKE

NC_BT_SAW_PIN1

BT_UART_TX

BT_PI00_PIN

BT_UART_RTS

BT_VDD_CORE

RR_PCM_SYNC

BT_VDD_VCO_RADIO_ANA

RR_RX

RR_TX

RR_PCM_CLK

BT_UART_RX

BT_PIO7_PIN

RESET_BT_pin_E6_U1000RESET_BT

BT_AIO2_PIN

BT_SPI_MISO_PIN

6880401P39-O 133

Page 134: $R2YULPH

SCHEMATIC DIAGRAMS AND COMPONENT LOCATION

4.15 USB BLOCK

MOTOROLA INTERNAL USE ONLY

uUSB Connector

E944

SPARK_GAP

12

22R901

R902

22

16.2VVR801

SPARK_GAP

E941

12

7685268E01

FHB1M1005JT E973

E972FHB1M1005JT

7685268E01

C202256pF

12pFC2021

56pFC2023

7686949J14

BLM21PG221SN1E971

D876

2

C202412pF

E942

SPARK_GAP

1

SPARK_GAP

E943

12

D_POS3

GND1

5

G1

GND2

ID4

VBUS1

NC

EMU_CONN_PIN1_EXTBPLUSJ7

D_NEG2

EMU_CONN_D-

D+

D-

EMU_CONN_D+

EXTB+

USB_IDUSB_ID

EMU_CONN_PIN3_D+

EMU_CONN_PIN2_D-

134 6880401P39-O

Page 135: $R2YULPH

SCHEMATIC DIAGRAMS AND COMPONENT LOCATION

4.16 QWERTY BOARD

PLACE THESE COMPS CLOSE TO MICROPHONE

NOT USEDSW_VOL_DWN SW_VOL_UP

NOT USED

NOT USED

KEYPAD LEDS

PTT SWITCH

POWER/END SWITCH

25-PIN ZIF LCD CONNECTORBLACKSTONE QWERTY BOARD28009255001

1

SHORTCUT BUTTONS LEDS

LCD_RD_STRAP

P/S (HIGH=SPI; LOW=PARALLEL)

80-PIN BTB

VIBRATOR MOTOR

IN TRIODE MODE

MICROPHONE

SPEAKER CONNECTOR

SD_D0_F

SD_D2_F

SD_CLK_F

LCD_RESETB

KEYPAD BOARD BREAKAWAYS

SD_D1_F

30-PIN CAMERA/EARPIECE CONNECTOR0971726C05

CI_BLUE SHALL BE CONTROLLED

0988141Y01

GND

ANCHOR

GROUND CONTACTS NEAR EARPIECE

GROUND CONTACTS FOR DISPLAY FRAME

GROUND CONTACTSKEYPAD BOARD TO MAINBOARD

0971928M01

SPKR_PLUS

SPKR_MINUS

GND

12

ANCHOR

NOT USED

NOT USED

2

LCD_RESETB

VOICEMAIL

SD_CMD_F

LCD_CS

NOT USED

BLUETOOTHMESSAGING

2.775V

SD_D3_F

PTT LEDS

LCD_CS

SD_CD_F

VOL UP/DWN SWITCHES

KEYPAD LEDS

4888112M36

1

220

D29

NC

NC

NC

NC

NC

NC

NC

IN

GND2

OUT

GND1

GND3

IN

GND2

OUT

GND1

GND3

IN

GND2

OUT

GND1

GND3

FLTR1FLTR2FLTR3FLTR4FLTR5FLTR6

GND

FLTR1FLTR2FLTR3FLTR4FLTR5FLTR6

FLTR7FLTR8

FLTR7FLTR8

FLTR1FLTR2FLTR3FLTR4FLTR5FLTR6

GND

FLTR1FLTR2FLTR3FLTR4FLTR5FLTR6

FLTR7FLTR8

FLTR7FLTR8

GND3

GND2

GND1

POWER

OUTPUT

GND4

POS NEG

GND3

GND1

GND2

NC

NC

NC

L53

L50

L52

L51

6

4

1

3

52

D3

6

4

1

3

52

D2

L49

1M10

1M9

1M8

1TP_CAM_MCLK

1TP_CAM_RST

1TP_CAM_SCK

1TP_CAM_SDA

1TP_CAM_STBY

L48

L47

L46

L45

L40L39

L42L41

L44L43

21

VR13

21

VR11

21

VR12

21

VR10

21

VR9

21

VR8

21

VR7

21

VR6

21

VR5

21

VR4

1TP_LCD_D0

1TP_LCD_WR

1TP_LCD_CS

1TP_LCD_DC

1TP_LCD_RST

R74R73

R72 R71

1M7

1M6

R8

R12 R11

C10

E10

C9

E9

R14

C14

R13

C13

C23

21

E12

1 23

VR3

C22

21

E11

G2J3

2J3

6J3

4J3

10J3

8J3

12J3

14J3

16J3

18J3

20J3

22J3

26J3

24J3

28J3

30J3

G3J3

5J3

3J3

1J3

G1J3

15J3

11J3

9J3

7J3

13J3

25J3

23J3

17J3

19J3

21J3

27J3

29J3

G4J3

R68

R67

C30

C31

C32

R57

2

3

5

4

16

Q4

R56

2

3

5

4

16

Q3

C29

E30

R40 R41

21D40

21 D41

R24

21

D24

C28C27

D1

C26

L34

L33

L32

L3121

D48

21

D47

R47 R48

R44R45

21

D44

21

D45

21

E29

E8

2 1

543

M1

4

1

6 5 3 2

MK1

G1

910111213141516

87654321

FL2

G1

910111213141516

87654321

FL1

1M5

1M4

1M3

1M2

L25 L26

L22L21

L23 L24

L30L29

L27 L28

21

E28

21

E27

21

E22

21

E23

21

E24

21

E25

21

E26

21

E21

21

E20

21

E19

21

E18

21

E17

21

E16

21

E15

21

E14

2 1

5 4 3

SW_PTT

2 1

5 4 3

SW_VOL_UP

2 1

5 4 3

SW_VOL_DWN

C25

R9

C12 C11

G2J2

G1J2

2J2

3J2

4J2

5J2

6J2

7J2

8J2

9J2

10J2

11J2

12J2

13J2

14J2

15J2

16J2

17J2

18J2

19J2

20J2

21J2

22J2

23J2

24J2

25J2

1J2

21

D26

21

D25

C24

C2C6

C5

C1

R26

R38

2

3

5

4

16

Q2

21

D28

C7

E7

2

D31

21

D30

R31R30

21

R29R28

2 1

SW_PWR_END

21

SW_SYM

21

SW_N

21

SW_Z

21

SW_SPKR

21

SW_CENTER

21

SW_SPACE

21

SW_SEND

21

SW_SHIFT

21

SW_A

21

SW_M

21

SW_MSG

21

SW_PERIOD

21

SW_DEL

21

SW_P

21

SW_L

21

SW_U

21

SW_D

21

SW_CAM

21

SW_S

21

SW_B

21

SW_G

21

SW_I

21

SW_MENU

21

SW_X

21

SW_J

21

SW_TXT

21

SW_DOWN

21

SW_ILINK

21

SW_T

21

SW_ALT

21

SW_RSK

21

SW_UP

21

SW_ENTER

21

SW_O

21

SW_Y

21

SW_RIGHT

21

SW_K

21

SW_C

21

SW_E

21

SW_PLUS

21

SW_LEFT

21

SW_R

21

SW_Q

21

SW_F

21

SW_W

21

SW_LSK

21

SW_H

21

SW_V

L17

21

E13

1J1

21

VR2C20

R21

C21

2J1

3J1

4J1

G1J1

G2J1

L20C19

21

VR1C4

C3

G2P1

2P1

4P1

6P1

E2

E3

8P1

10P1

12P1

14P1

16P1

18P1

20P1

22P1

24P1

26P1

28P1

30P1

32P1

34P1

36P1

38P1

40P1

42P1

44P1

46P1

E6

48P1

50P1

52P1

54P1

56P1

58P1

62P1

60P1

64P1

66P1

68P1

70P1

72P1

74P1

76P1

80P1

78P1

G4P1

G1P1

1P1

3P1

5P1

E1

E4

9P1

7P1

11P1

13P1

15P1

17P1

19P1

21P1

23P1

25P1

27P1

29P1

31P1

35P1

33P1

39P1

37P1

41P1

43P1

45P1

47P1

49P1

51P1

53P1

55P1

57P1

59P1

61P1

63P1

65P1

71P1

69P1

67P1

73P1

75P1

77P1

G3P1

79P1

SW2_FLTR

SW2_FLTR

SW3

V_VIB

V2_775_FLTR

SW3

V2_775_FLTR

V2

V_VIB

V2

SW2_FLTR

SW3

SW3 V2_775_FLTR

V2_775_FLTR

SW3

V2_775_FLTRSW2_FLTR

SW3

MIC_AUDIO_A_F1

100K

220220

FDG6331L

DNP

DNP

GPIO_PB7

KEYPD_4DOME_5X2_9PAD

KEYPAD_ROW7

KEYPAD_COLUMN2KEYPAD_COLUMN6

100NH

KP_LED_ZONE1_SUPPLY

4888112M36

SB_LED_SUPPLY

100NH

2.775V

SWITCH

PTT

KEYPAD_COLUMN2

KEYPAD_COLUMN3

CAM_DATA<7..0>

GPIO_PB5

GPIO_PB5

.1UF

CDZT2R5_6B

DISPLAY_ID

1.875V

15

14

LCD_LED1_SUPPLY_M1

DNP

LED1_PWM

V2_775_SUPPLY

LCD_WR_F

LCD_WR_F

LCD_DC_F

1.875V

0

.1UF

0

5.6V

LCD_SUPPLY_VCI

LCD_SUPPLY_VDDIO

SPARK_GAP

DNP

EARPHONE_MINUS

33PF

SPARK_GAP

CAM_PCLK_F

EARPHONE_PLUS

EARPHONE_MINUS

SPKR_R_MINUS

FDG6331L

4888112M36

4888112M36

220220

DNP

33

33

0

.1UF

KEYPAD_ROW4

1UF

MIC_AUDIO_A_F2

CAM_MCLK_F

10PF

DNP

KEYPAD_ROW2

I2C_DAT_F

100NH

KEYPAD_COLUMN0

GPIO_PB6

CAM_MCLK_F

GPIO_PB6

9

10PF

4870370A83

CDZT2R5_6B

14

15

LED1_PWM

CAM_VSYNC_F

SW3_SUPPLY_UF

4809653F09

LCD_DATA<17..8>

5V

CDZT2R5_6B5.6V

CI_GREEN

CAM_PCLK_F

GPIO_PB7

NZL5V6AXV3T1

LCD_LED1_SUPPLY_M2

.1UF

5

6

CAM_HSYNC_F

4

100NH

KEYPAD_ROW5

DNP

3

DNP

DNP

100NH

DNPDNP

DNP

DNP DNP

DNP

DNP

KEYPAD_ROW1

DNP

DNP

DNP

DNP

KEYPAD_ROW4

100NH

DNP

KEYPAD_ROW6

3.0V

MICROPHONE2K

15PF

5

1

DNP

1

16

DNP

KEYPAD_COLUMN3

NUF8001MU

SPARK_GAP

2.775V

4

17

DNP

DNPDNP DNPDNP

DNP

SPARK_GAP

DNPDNP

SPARK_GAP

DNP

DNP

DNP

SPARK_GAP

DNP

DNP

DNP

SPARK_GAP SPARK_GAP

DNP

DNP

KEYPAD_COLUMN1

KEYPAD_ROW2

SPARK_GAP

KEYPAD_COLUMN7

DNP

DNP

KEYPAD_ROW0

5.6V

0

.1UF

DNP

DNP

0

DNP

0

7

15PF

1UF

6

2.775V

DNP

KEYPAD_ROW4

9

15

SWITCH

3

KEYPAD_ROW3

ON_OFF_SWITCH

3.0V

BAS52

0

0

22NH

SPARK_GAP

33PF

13

14

12

8

5.6V

5.6VCDZT2R5_6B

0

430

DNP

SPARK_GAP

100NH

DNP DNP

100NH

KEYPAD_ROW3

SPARK_GAP

100NH

DNP

100NH

DNP

DNP

DNP

DNP

DNP

DNP

100NH

100NH

100NH

DNP

DNP

DNP

DNP

100NH

KEYPAD_COLUMN5

KEYPD_4DOME_5X2_9PAD

100NH

.1UF

100K

200

CDZT2R5_6B

430

8

5.6V.1UF

GPIO_PB8

KEYPAD_COLUMN0

KEYPAD_COLUMN1

7

0

.1UF

KEYPAD_ROW1

2

SPKR_R_MINUS

SPKR_R_PLUS

15PF

2.775V

33PF

DNP

DNP 33PF33PF

SPKR_M_F

10 .1UF

16V

1.875V

LCD_DC_F

BT_LED_SUPPLY

V2_SUPPLY_UF

SPARK_GAP

12 5V

2.775V

CDZT2R5_6BDNP

5V

CDZT2R5_6B

5.6V

5V

CI_RED

4888112M12

430

2.775V

5.6V

180

CI_BLUE

CI_BLUE

CAM_VSYNC_F

SPARK_GAP

KEYPAD_ROW0

100NH

DNP DNP

DNP

DNP

100K

.1UF

SPARK_GAP

5V

KEYPAD_ROW6

KEYPAD_ROW7

SPARK_GAP

DNP

DNP

DNP

DNP

DNP

DNP

DNP

100NH

4888112M10

4870370A83

CDZT2R5_6B4888112M10

4888112M10

SPKR_P_F

2

.1UF 5.6V

CDZT2R5_6B5.6V.1UF

SPARK_GAP

200

5.6V

4870370A83

5.6VCDZT2R5_6B

CI_GREEN

NUF8001MU

SPKR_R_PLUS

2.775V

11

10

89

13

12

11

4809653F09

KEYPAD_ROW5

11

13

V_VIB_SUPPLY_UF

PTT

33PF

CAM_MCLK_UF

CAM_HSYNC

AVDD

CAM_RESET_F

I2C_CLK_F

I2C_DAT_F0

CAM_STBY_F

DVDD

DISPLAY_ID

CDZT2R5_6B

VIB_MINUS

ON_OFF_SWITCH

KEYPAD_COLUMN2

KEYPAD_COLUMN3

DNP

33NH

SWITCH

DNP

100NH

SPARK_GAP

1.875V

10PF

CAM_DATA<7..0>

CAM_VSYNC

.1UF

CI_RED

CAM_RESET_F

CAM_STBY_F

CAM_HSYNC_F

10 16

17

FDG6331L

EARPHONE_PLUS

SPARK_GAP

SPU0409LE5H

MIC_SUPPLY_A_F

VIB_MINUS

SW2_SUPPLY_UF

MM5Z16VT1

I2C_CLK_F

RS-3025AA

MICROPHONE

LCD_DATA<17..8>

DNP

KEYPAD_COLUMN5

KEYPAD_COLUMN6

KEYPAD_COLUMN7

DNP

100NH

DNP

100NH

DNP

220

100NH

5V

100NH

100NH

100NH100NH

V2_775_FLTR

0

0

0

0

0

4888112M36

4888112M36

NC

NC

NC

GND2

GND1

GND3

NEGPOS

GND4

OUTPUT

POWER

GND1

GND2

GND3

FLTR8FLTR7

FLTR8FLTR7

FLTR6FLTR5FLTR4FLTR3FLTR2FLTR1

GND

FLTR6FLTR5FLTR4FLTR3FLTR2FLTR1

FLTR8FLTR7

FLTR8FLTR7

FLTR6FLTR5FLTR4FLTR3FLTR2FLTR1

GND

FLTR6FLTR5FLTR4FLTR3FLTR2FLTR1

GND3

GND1

OUT

GND2

IN

GND3

GND1

OUT

GND2

IN

GND3

GND1

OUT

GND2

IN

NC

NC

NC

NC

NC

NC

NC

6880401P39-O 135

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SCHEMATIC DIAGRAMS AND COMPONENT LOCATION

4.17 i465 Component Locations

Ref. No. Part No. Description Ref. No. Part No. Description Ref. No. Part No. Description

BAT_DET_IN NOTPLACED 64AM DUMMY PART NUMBER C1023 NOTPLACED 64AM DUMMY PART NUMBER C2022 2113944A34 CAP,CHIP,56PF,+5%,-5%,50V-DC,0

BBP_RXCLK NOTPLACED 64AM DUMMY PART NUMBER C1024 NOTPLACED 64AM DUMMY PART NUMBER C2023 2113944A34 CAP,CHIP,56PF,+5%,-5%,50V-DC,0

BRK1 NOTPLACED 64AM DUMMY PART NUMBER C1025 2113945B02 CAP,CHIP,.01UF,+10%,-10%,25V-D C2024 2113944A26 CAP,CHIP,12PF,+5%,-5%,50V-DC,0

BRK2 NOTPLACED 64AM DUMMY PART NUMBER C1026 2113956B33 CAP,FXD,2.2UF,+10%,-10%,16V-DC C2029 2113944E13 CAP,CHIP,12PF,+5%,-5%,25V-DC,0

BRK3 NOTPLACED 64AM DUMMY PART NUMBER C103 2113944A37 CAP,CHIP,75PF,+5%,-5%,50V-DC,0 C203 2113944A34 CAP,CHIP,56PF,+5%,-5%,50V-DC,0

BRK4 NOTPLACED 64AM DUMMY PART NUMBER C1031 2113946D02 CAP,CHIP,1UF,+10%,-10%,6.3V-DC C2037 2113944E17 CAP,CHIP,33PF,+5%,-5%,25V-DC,0

BT_BECLK NOTPLACED 64AM DUMMY PART NUMBER C1032 2113945B02 CAP,CHIP,.01UF,+10%,-10%,25V-D C2038 2113944E17 CAP,CHIP,33PF,+5%,-5%,25V-DC,0

BT_BYPRX NOTPLACED 64AM DUMMY PART NUMBER C104 2113944A23 CAP,CHIP,8.2PF,.5PF+/-,50V-DC, C2039 2113946B04 CAP,CHIP,.1UF,+10%,-10%,10V-DC

BT_SPI_CLK NOTPLACED 64AM DUMMY PART NUMBER C105 2113944A23 CAP,CHIP,8.2PF,.5PF+/-,50V-DC, C204 2113944A34 CAP,CHIP,56PF,+5%,-5%,50V-DC,0

BT_SPI_CSB NOTPLACED 64AM DUMMY PART NUMBER C1422 2113945A05 CAP,CHIP,470PF,+10%,-10%,50V-D C2040 2113944E17 CAP,CHIP,33PF,+5%,-5%,25V-DC,0

BT_SPIMISO NOTPLACED 64AM DUMMY PART NUMBER C1423 2113944A28 CAP,CHIP,18PF,+5%,-5%,50V-DC,0 C2044 2113944E12 CAP,CHIP,10PF,.5PF+/-,25V-DC,0

BT_SPIMOSI NOTPLACED 64AM DUMMY PART NUMBER C1425 2115153H10 CAP,FXD,2PF,.1PF+/-,50V-DC,040 C2045 2113944A25 CAP,CHIP,10PF,.5PF+/-,50V-DC,0

BT_UART_RX NOTPLACED 64AM DUMMY PART NUMBER C1441 2113944A28 CAP,CHIP,18PF,+5%,-5%,50V-DC,0 C2046 2113944A25 CAP,CHIP,10PF,.5PF+/-,50V-DC,0

BT_UART_TX NOTPLACED 64AM DUMMY PART NUMBER C1450 2488158Y10 IDCTR,WW,5.6NH,340MA,.19OHM,CE C2047 2113944E15 CAP,FXD,18PF,+5%,-5%,25V-DC,02

C1001 2113945B02 CAP,CHIP,.01UF,+10%,-10%,25V-D C1451 2113944A28 CAP,CHIP,18PF,+5%,-5%,50V-DC,0 C2048 2113944E15 CAP,FXD,18PF,+5%,-5%,25V-DC,02

C1003 2113946D02 CAP,CHIP,1UF,+10%,-10%,6.3V-DC C1452 2113945F07 CAP,FXD,.01UF,+10%,-10%,6.3V-D C2049 NOTPLACED 64AM DUMMY PART NUMBER

C1004 NOTPLACED 64AM DUMMY PART NUMBER C1453 2113944E14 CAP,CHIP,15PF,+5%,-5%,25V-DC,0 C205 2113944A34 CAP,CHIP,56PF,+5%,-5%,50V-DC,0

C1006 2113944A27 CAP,CHIP,15PF,+5%,-5%,50V-DC,0 C1498 2113944A28 CAP,CHIP,18PF,+5%,-5%,50V-DC,0 C2050 2113944E12 CAP,CHIP,10PF,.5PF+/-,25V-DC,0

C1007 NOTPLACED 64AM DUMMY PART NUMBER C1499 2113944A28 CAP,CHIP,18PF,+5%,-5%,50V-DC,0 C2051 2113944E13 CAP,CHIP,12PF,+5%,-5%,25V-DC,0

C1008 NOTPLACED 64AM DUMMY PART NUMBER C200 2113944A28 CAP,CHIP,18PF,+5%,-5%,50V-DC,0 C2052 2175181C01 CAP,CER CHIP,22UF,+20%,-20%,6.

C101 2113944A37 CAP,CHIP,75PF,+5%,-5%,50V-DC,0 C2005 2113944A26 CAP,CHIP,12PF,+5%,-5%,50V-DC,0 C2053 2175181C01 CAP,CER CHIP,22UF,+20%,-20%,6.

C1010 NOTPLACED 64AM DUMMY PART NUMBER C2006 2113944A26 CAP,CHIP,12PF,+5%,-5%,50V-DC,0 C2054 2113944A27 CAP,CHIP,15PF,+5%,-5%,50V-DC,0

C1011 2113944A27 CAP,CHIP,15PF,+5%,-5%,50V-DC,0 C201 2113944A34 CAP,CHIP,56PF,+5%,-5%,50V-DC,0 C2055 2113946B04 CAP,CHIP,.1UF,+10%,-10%,10V-DC

C102 2113944A37 CAP,CHIP,75PF,+5%,-5%,50V-DC,0 C202 2113945B02 CAP,CHIP,.01UF,+10%,-10%,25V-D C2056 2113946B04 CAP,CHIP,.1UF,+10%,-10%,10V-DC

C1021 NOTPLACED 64AM DUMMY PART NUMBER C2021 2113944A26 CAP,CHIP,12PF,+5%,-5%,50V-DC,0 C2057 2113946B04 CAP,CHIP,.1UF,+10%,-10%,10V-DC

136 6880401P39-O

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SCHEMATIC DIAGRAMS AND COMPONENT LOCATION

i465 Component Locations [Continued]

Ref. No. Part No. Description Ref. No. Part No. Description Ref. No. Part No. Description

C2058 2187893N01 CAP,CER,1UF,20PF+/-,+20%,-20%, C300 2113946K02 CAP,CHIP,.1UF,+80%,-20%,16V-DC C438 2113944A31 CAP,CHIP,33PF,+5%,-5%,50V-DC,0

C2059 2187893N01 CAP,CER,1UF,20PF+/-,+20%,-20%, C301 2113944A34 CAP,CHIP,56PF,+5%,-5%,50V-DC,0 C460 2113946U01 CAP,FXD,.1UF,+10%,-10%,6.3V-DC

C206 2113945B02 CAP,CHIP,.01UF,+10%,-10%,25V-D C302 2113944A26 CAP,CHIP,12PF,+5%,-5%,50V-DC,0 C461 NOTPLACED 64AM DUMMY PART NUMBER

C207 2113944A13 CAP,CHIP,3.3PF,.25PF+/-,50V-DC C303 2113946B04 CAP,CHIP,.1UF,+10%,-10%,10V-DC C462 2113946U01 CAP,FXD,.1UF,+10%,-10%,6.3V-DC

C209 2113944A34 CAP,CHIP,56PF,+5%,-5%,50V-DC,0 C304 2113944A26 CAP,CHIP,12PF,+5%,-5%,50V-DC,0 C463 2113946U01 CAP,FXD,.1UF,+10%,-10%,6.3V-DC

C210 2113945A13 CAP,CHIP,4700PF,+10%,-10%,50V- C305 2113946B02 CAP,CHIP,.047UF,+10%,-10%,10V- C464 NOTPLACED 64AM DUMMY PART NUMBER

C211 2113944A34 CAP,CHIP,56PF,+5%,-5%,50V-DC,0 C306 2113945A09 CAP,CHIP,1000PF,+10%,-10%,50V- C470 2113944E17 CAP,CHIP,33PF,+5%,-5%,25V-DC,0

C212 2113945A12 CAP,CHIP,3300PF,+10%,-10%,50V- C307 2113945A09 CAP,CHIP,1000PF,+10%,-10%,50V- C471 2113944E17 CAP,CHIP,33PF,+5%,-5%,25V-DC,0

C213 2113945A12 CAP,CHIP,3300PF,+10%,-10%,50V- C308 2185419D28 CAP,CHIP,.1UF,+10%,-10%,10V-DC C475 2113946U01 CAP,FXD,.1UF,+10%,-10%,6.3V-DC

C214 2113946C02 CAP,CHIP,.22UF,+10%,-10%,10V-D C309 2185419D28 CAP,CHIP,.1UF,+10%,-10%,10V-DC C476 NOTPLACED 64AM DUMMY PART NUMBER

C215 2113946D02 CAP,CHIP,1UF,+10%,-10%,6.3V-DC C310 2185419D28 CAP,CHIP,.1UF,+10%,-10%,10V-DC C478 NOTPLACED 64AM DUMMY PART NUMBER

C216 2113946D02 CAP,CHIP,1UF,+10%,-10%,6.3V-DC C311 2113945B02 CAP,CHIP,.01UF,+10%,-10%,25V-D C479 NOTPLACED 64AM DUMMY PART NUMBER

C217 2113946K02 CAP,CHIP,.1UF,+80%,-20%,16V-DC C312 2113944E15 CAP,FXD,18PF,+5%,-5%,25V-DC,02 C480 NOTPLACED 64AM DUMMY PART NUMBER

C218 2113944A26 CAP,CHIP,12PF,+5%,-5%,50V-DC,0 C313 2113944E15 CAP,FXD,18PF,+5%,-5%,25V-DC,02 C481 NOTPLACED 64AM DUMMY PART NUMBER

C219 2113946K02 CAP,CHIP,.1UF,+80%,-20%,16V-DC C403 NOTPLACED 64AM DUMMY PART NUMBER C482 NOTPLACED 64AM DUMMY PART NUMBER

C221 2113946K02 CAP,CHIP,.1UF,+80%,-20%,16V-DC C404 2113944E15 CAP,FXD,18PF,+5%,-5%,25V-DC,02 C483 2113946U01 CAP,FXD,.1UF,+10%,-10%,6.3V-DC

C222 2113946K02 CAP,CHIP,.1UF,+80%,-20%,16V-DC C405 2113944E17 CAP,CHIP,33PF,+5%,-5%,25V-DC,0 C484 NOTPLACED 64AM DUMMY PART NUMBER

C223 2113944A34 CAP,CHIP,56PF,+5%,-5%,50V-DC,0 C406 2113944E17 CAP,CHIP,33PF,+5%,-5%,25V-DC,0 C492 2113946K02 CAP,CHIP,.1UF,+80%,-20%,16V-DC

C250 2113944A34 CAP,CHIP,56PF,+5%,-5%,50V-DC,0 C430 2113944E15 CAP,FXD,18PF,+5%,-5%,25V-DC,02 C500 2113944A31 CAP,CHIP,33PF,+5%,-5%,50V-DC,0

C251 2113944A34 CAP,CHIP,56PF,+5%,-5%,50V-DC,0 C432 2113944A23 CAP,CHIP,8.2PF,.5PF+/-,50V-DC, C501 NOTPLACED 64AM DUMMY PART NUMBER

C252 2113944A34 CAP,CHIP,56PF,+5%,-5%,50V-DC,0 C433 2113944A23 CAP,CHIP,8.2PF,.5PF+/-,50V-DC, C502 0613952R66 RES,MF,0OHM,5%,.0625W,SM,0402,

C288 NOTPLACED 64AM DUMMY PART NUMBER C434 2113944A23 CAP,CHIP,8.2PF,.5PF+/-,50V-DC, C506 2113944A34 CAP,CHIP,56PF,+5%,-5%,50V-DC,0

C289 NOTPLACED 64AM DUMMY PART NUMBER C435 2113944A23 CAP,CHIP,8.2PF,.5PF+/-,50V-DC, C507 2113944A34 CAP,CHIP,56PF,+5%,-5%,50V-DC,0

C290 NOTPLACED 64AM DUMMY PART NUMBER C436 2113944A23 CAP,CHIP,8.2PF,.5PF+/-,50V-DC, C508 2113944A34 CAP,CHIP,56PF,+5%,-5%,50V-DC,0

C291 NOTPLACED 64AM DUMMY PART NUMBER C437 2113944A23 CAP,CHIP,8.2PF,.5PF+/-,50V-DC, C509 2113944A23 CAP,CHIP,8.2PF,.5PF+/-,50V-DC,

6880401P39-O 137

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SCHEMATIC DIAGRAMS AND COMPONENT LOCATION

i465 Component Locations [Continued]

Ref. No. Part No. Description Ref. No. Part No. Description Ref. No. Part No. Description

C510 2113945A09 CAP,CHIP,1000PF,+10%,-10%,50V- C60053 NOTPLACED 64AM DUMMY PART NUMBER C630 2113944A34 CAP,CHIP,56PF,+5%,-5%,50V-DC,0

C511 2113944A34 CAP,CHIP,56PF,+5%,-5%,50V-DC,0 C60054 2113944A34 CAP,CHIP,56PF,+5%,-5%,50V-DC,0 C689 2113944A26 CAP,CHIP,12PF,+5%,-5%,50V-DC,0

C512 2113946K02 CAP,CHIP,.1UF,+80%,-20%,16V-DC C60055 2113944A34 CAP,CHIP,56PF,+5%,-5%,50V-DC,0 C690 2113944A26 CAP,CHIP,12PF,+5%,-5%,50V-DC,0

C513 2113945A05 CAP,CHIP,470PF,+10%,-10%,50V-D C60056 2113944A34 CAP,CHIP,56PF,+5%,-5%,50V-DC,0 C701 2187906N01 CAP,CHIP,4.7UF,940000PF+/-,+20

C514 2113945B02 CAP,CHIP,.01UF,+10%,-10%,25V-D C60057 2113944A34 CAP,CHIP,56PF,+5%,-5%,50V-DC,0 C702 2113946B04 CAP,CHIP,.1UF,+10%,-10%,10V-DC

C515 2113944A34 CAP,CHIP,56PF,+5%,-5%,50V-DC,0 C60058 2113944A34 CAP,CHIP,56PF,+5%,-5%,50V-DC,0 C703 2113946B04 CAP,CHIP,.1UF,+10%,-10%,10V-DC

C516 NOTPLACED 64AM DUMMY PART NUMBER C60059 2113944A34 CAP,CHIP,56PF,+5%,-5%,50V-DC,0 C704 2175511A01 CAP,CER,2.2UF,+20%,-20%,6.3V-D

C517 2113944A36 CAP,CHIP,68PF,+5%,-5%,50V-DC,0 C60060 2113944A11 CAP,CHIP,2.7PF,.25PF+/-,50V-DC C705 2113956B54 CAP,FXD,10UF,+20%,-20%,6.3V-DC

C518 2360567A12 CAP,TANTALUM,330UF,+20%,-20%,1 C60061 2113946B04 CAP,CHIP,.1UF,+10%,-10%,10V-DC C706 NOTPLACED 64AM DUMMY PART NUMBER

C519 NOTPLACED 64AM DUMMY PART NUMBER C60062 2187893N01 CAP,CER,1UF,20PF+/-,+20%,-20%, C707 NOTPLACED 64AM DUMMY PART NUMBER

C520 2113944A34 CAP,CHIP,56PF,+5%,-5%,50V-DC,0 C60063 NOTPLACED 64AM DUMMY PART NUMBER C708 NOTPLACED 64AM DUMMY PART NUMBER

C521 2113945B01 CAP,CHIP,6800PF,+10%,-10%,25V- C614 2113944A42 CAP,CHIP,150PF,+5%,-5%,50V-DC, C709 2175511A01 CAP,CER,2.2UF,+20%,-20%,6.3V-D

C522 2113945B04 CAP,FXD,.022UF,+10%,-10%,25V-D C615 2175035B01 CAP,CER CHIP,10UF,+20%,-20%,6. C710 2187906N01 CAP,CHIP,4.7UF,940000PF+/-,+20

C523 2113945B04 CAP,FXD,.022UF,+10%,-10%,25V-D C616 2175181C01 CAP,CER CHIP,22UF,+20%,-20%,6. C711 NOTPLACED 64AM DUMMY PART NUMBER

C524 2113945A11 CAP,CHIP,2200PF,+10%,-10%,50V- C617 2113944A34 CAP,CHIP,56PF,+5%,-5%,50V-DC,0 C713 2175036B01 CAP,CER CHIP,4.7UF,+20%,-20%,6

C525 2113945B05 CAP,FXD,.033UF,+10%,-10%,25V-D C620 2113946K02 CAP,CHIP,.1UF,+80%,-20%,16V-DC C714 2175511A01 CAP,CER,2.2UF,+20%,-20%,6.3V-D

C526 2113956B54 CAP,FXD,10UF,+20%,-20%,6.3V-DC C621 2113944E15 CAP,FXD,18PF,+5%,-5%,25V-DC,02 C715 2175036B01 CAP,CER CHIP,4.7UF,+20%,-20%,6

C527 2113946K02 CAP,CHIP,.1UF,+80%,-20%,16V-DC C622 2113946K02 CAP,CHIP,.1UF,+80%,-20%,16V-DC C716 2175181C01 CAP,CER CHIP,22UF,+20%,-20%,6.

C528 2113946K02 CAP,CHIP,.1UF,+80%,-20%,16V-DC C623 2187893N01 CAP,CER,1UF,20PF+/-,+20%,-20%, C717 2175181C01 CAP,CER CHIP,22UF,+20%,-20%,6.

C529 2113944A34 CAP,CHIP,56PF,+5%,-5%,50V-DC,0 C624 2113944A34 CAP,CHIP,56PF,+5%,-5%,50V-DC,0 C718 2175181C01 CAP,CER CHIP,22UF,+20%,-20%,6.

C530 2113944A23 CAP,CHIP,8.2PF,.5PF+/-,50V-DC, C625 2113946K02 CAP,CHIP,.1UF,+80%,-20%,16V-DC C719 2175511A01 CAP,CER,2.2UF,+20%,-20%,6.3V-D

C531 2113944A34 CAP,CHIP,56PF,+5%,-5%,50V-DC,0 C626 NOTPLACED 64AM DUMMY PART NUMBER C720 2113945B02 CAP,CHIP,.01UF,+10%,-10%,25V-D

C535 2360567A11 CAP,TANTALUM,68UF,+20%,-20%,10 C627 2113946K02 CAP,CHIP,.1UF,+80%,-20%,16V-DC C721 2113945A10 CAP,CHIP,1500PF,+10%,-10%,50V-

C590 2113944A26 CAP,CHIP,12PF,+5%,-5%,50V-DC,0 C628 2187893N01 CAP,CER,1UF,20PF+/-,+20%,-20%, C722 2187893N01 CAP,CER,1UF,20PF+/-,+20%,-20%,

C60052 2113945B02 CAP,CHIP,.01UF,+10%,-10%,25V-D C629 2175035B01 CAP,CER CHIP,10UF,+20%,-20%,6. C723 2113946B04 CAP,CHIP,.1UF,+10%,-10%,10V-DC

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i465 Component Locations [Continued]

Ref. No. Part No. Description Ref. No. Part No. Description Ref. No. Part No. Description

C724 2175181C01 CAP,CER CHIP,22UF,+20%,-20%,6. C758 2113944A31 CAP,CHIP,33PF,+5%,-5%,50V-DC,0 C796 2113956B33 CAP,FXD,2.2UF,+10%,-10%,16V-DC

C725 2175511A01 CAP,CER,2.2UF,+20%,-20%,6.3V-D C759 2113944A31 CAP,CHIP,33PF,+5%,-5%,50V-DC,0 C797 2175181C01 CAP,CER CHIP,22UF,+20%,-20%,6.

C726 2175036B01 CAP,CER CHIP,4.7UF,+20%,-20%,6 C760 2175035B01 CAP,CER CHIP,10UF,+20%,-20%,6. C798 2175181C01 CAP,CER CHIP,22UF,+20%,-20%,6.

C727 2113946K02 CAP,CHIP,.1UF,+80%,-20%,16V-DC C763 2113944A34 CAP,CHIP,56PF,+5%,-5%,50V-DC,0 C799 2187893N01 CAP,CER,1UF,20PF+/-,+20%,-20%,

C728 2113946K02 CAP,CHIP,.1UF,+80%,-20%,16V-DC C764 2187893N01 CAP,CER,1UF,20PF+/-,+20%,-20%, C801 2113944A31 CAP,CHIP,33PF,+5%,-5%,50V-DC,0

C729 2175511A01 CAP,CER,2.2UF,+20%,-20%,6.3V-D C765 2113944A34 CAP,CHIP,56PF,+5%,-5%,50V-DC,0 C802 2187893N01 CAP,CER,1UF,20PF+/-,+20%,-20%,

C730 NOTPLACED 64AM DUMMY PART NUMBER C766 2113956B54 CAP,FXD,10UF,+20%,-20%,6.3V-DC C803 2113944A31 CAP,CHIP,33PF,+5%,-5%,50V-DC,0

C731 2113944A34 CAP,CHIP,56PF,+5%,-5%,50V-DC,0 C769 2113944A34 CAP,CHIP,56PF,+5%,-5%,50V-DC,0 C804 2187893N01 CAP,CER,1UF,20PF+/-,+20%,-20%,

C732 2113944A34 CAP,CHIP,56PF,+5%,-5%,50V-DC,0 C770 2113944A34 CAP,CHIP,56PF,+5%,-5%,50V-DC,0 C805 2113944A31 CAP,CHIP,33PF,+5%,-5%,50V-DC,0

C733 2113946U01 CAP,FXD,.1UF,+10%,-10%,6.3V-DC C771 2113944A34 CAP,CHIP,56PF,+5%,-5%,50V-DC,0 C806 2187893N01 CAP,CER,1UF,20PF+/-,+20%,-20%,

C734 2113945A09 CAP,CHIP,1000PF,+10%,-10%,50V- C777 2113946B04 CAP,CHIP,.1UF,+10%,-10%,10V-DC C807 2113944A31 CAP,CHIP,33PF,+5%,-5%,50V-DC,0

C735 2113945A09 CAP,CHIP,1000PF,+10%,-10%,50V- C778 2113945C31 CAP,FXD,.1UF,+10%,-10%,50V-DC, C808 2113946K02 CAP,CHIP,.1UF,+80%,-20%,16V-DC

C736 2113945C13 CAP,CHIP,1000PF,+10%,-10%,50V- C779 2175036B01 CAP,CER CHIP,4.7UF,+20%,-20%,6 C809 2113944A31 CAP,CHIP,33PF,+5%,-5%,50V-DC,0

C738 2113944A37 CAP,CHIP,75PF,+5%,-5%,50V-DC,0 C780 2113946D01 CAP,CHIP,.47UF,+10%,-10%,6.3V- C810 2113946K02 CAP,CHIP,.1UF,+80%,-20%,16V-DC

C739 2113945B02 CAP,CHIP,.01UF,+10%,-10%,25V-D C781 2113946D01 CAP,CHIP,.47UF,+10%,-10%,6.3V- C811 2113944A31 CAP,CHIP,33PF,+5%,-5%,50V-DC,0

C741 2113946B04 CAP,CHIP,.1UF,+10%,-10%,10V-DC C782 2175181C01 CAP,CER CHIP,22UF,+20%,-20%,6. C812 2113946K02 CAP,CHIP,.1UF,+80%,-20%,16V-DC

C742 2113946K02 CAP,CHIP,.1UF,+80%,-20%,16V-DC C783 2371735M01 CAP,TANTALUM,100UF,+20%,-20%,6 C813 2113944A31 CAP,CHIP,33PF,+5%,-5%,50V-DC,0

C746 2113945B02 CAP,CHIP,.01UF,+10%,-10%,25V-D C784 2113944A28 CAP,CHIP,18PF,+5%,-5%,50V-DC,0 C814 2113946K02 CAP,CHIP,.1UF,+80%,-20%,16V-DC

C751 2113944E20 CAP,CHIP,56PF,+5%,-5%,25V-DC,0 C785 2113944A28 CAP,CHIP,18PF,+5%,-5%,50V-DC,0 C816 2113946K02 CAP,CHIP,.1UF,+80%,-20%,16V-DC

C752 2113944E17 CAP,CHIP,33PF,+5%,-5%,25V-DC,0 C786 2175036B01 CAP,CER CHIP,4.7UF,+20%,-20%,6 C818 2113944A31 CAP,CHIP,33PF,+5%,-5%,50V-DC,0

C753 2113944E17 CAP,CHIP,33PF,+5%,-5%,25V-DC,0 C787 2175181C01 CAP,CER CHIP,22UF,+20%,-20%,6. C820 2113944A35 CAP,CHIP,62PF,+5%,-5%,50V-DC,0

C754 2113944E20 CAP,CHIP,56PF,+5%,-5%,25V-DC,0 C788 NOTPLACED 64AM DUMMY PART NUMBER C824 2113944A31 CAP,CHIP,33PF,+5%,-5%,50V-DC,0

C755 2175181C01 CAP,CER CHIP,22UF,+20%,-20%,6. C789 2175181C01 CAP,CER CHIP,22UF,+20%,-20%,6. C870 2113946L05 CAP,FXD,.33UF,+80%,-20%,16V-DC

C756 2113944A34 CAP,CHIP,56PF,+5%,-5%,50V-DC,0 C790 2175181C01 CAP,CER CHIP,22UF,+20%,-20%,6. C871 2113946K02 CAP,CHIP,.1UF,+80%,-20%,16V-DC

C757 2187893N01 CAP,CER,1UF,20PF+/-,+20%,-20%, C794 2113944A31 CAP,CHIP,33PF,+5%,-5%,50V-DC,0 C872 2113946U01 CAP,FXD,.1UF,+10%,-10%,6.3V-DC

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i465 Component Locations [Continued]

Ref. No. Part No. Description Ref. No. Part No. Description Ref. No. Part No. Description

C873 2175036B01 CAP,CER CHIP,4.7UF,+20%,-20%,6 E703 7605821Z02 FLTR,FERRITE BEAD,4A,SM,0805,C E753 NOTPLACED 64AM DUMMY PART NUMBER

C877 2113946K02 CAP,CHIP,.1UF,+80%,-20%,16V-DC E706 NOTPLACED 64AM DUMMY PART NUMBER E754 NOTPLACED 64AM DUMMY PART NUMBER

D700 4805656W95 DIODE,RSX101M-30,SOD-123,SOD-1 E709 7685268E01 FLTR,FERRITE BEAD,650MA,SM,040 E755 7685268E01 FLTR,FERRITE BEAD,650MA,SM,040

D701 4805656W85 DIODE,SWG,RB520CS-30,SM,100MA, E710 NOTPLACED 64AM DUMMY PART NUMBER E756 NOTPLACED 64AM DUMMY PART NUMBER

D702 4805656W85 DIODE,SWG,RB520CS-30,SM,100MA, E711 NOTPLACED 64AM DUMMY PART NUMBER E757 NOTPLACED 64AM DUMMY PART NUMBER

D704 0613952R66 RES,MF,0OHM,5%,.0625W,SM,0402, E712 NOTPLACED 64AM DUMMY PART NUMBER E758 NOTPLACED 64AM DUMMY PART NUMBER

D705 4805286Z07 DIODE,SWG,SOD-523/SC-79,SCHOTT E713 NOTPLACED 64AM DUMMY PART NUMBER E781 7685268E01 FLTR,FERRITE BEAD,650MA,SM,040

D711 4816402H01 DIODE,SWG,RB751S-40,SOD-523/SC E714 NOTPLACED 64AM DUMMY PART NUMBER E782 7685268E01 FLTR,FERRITE BEAD,650MA,SM,040

D712 4816402H01 DIODE,SWG,RB751S-40,SOD-523/SC E715 NOTPLACED 64AM DUMMY PART NUMBER E8880 2489828Y17 CHIP INDUCTOR,RF,22NH,5%,200MA

D752 4805656W99 DIODE,ZEN,SM,5.6V,5.6V,.1W,ZEN E716 NOTPLACED 64AM DUMMY PART NUMBER E8881 2489828Y17 CHIP INDUCTOR,RF,22NH,5%,200MA

D753 4805656W99 DIODE,ZEN,SM,5.6V,5.6V,.1W,ZEN E717 NOTPLACED 64AM DUMMY PART NUMBER E8882 2489828Y17 CHIP INDUCTOR,RF,22NH,5%,200MA

D802 4805656W85 DIODE,SWG,RB520CS-30,SM,100MA, E718 NOTPLACED 64AM DUMMY PART NUMBER E8883 2489828Y17 CHIP INDUCTOR,RF,22NH,5%,200MA

D855 4805656W85 DIODE,SWG,RB520CS-30,SM,100MA, E719 NOTPLACED 64AM DUMMY PART NUMBER E8884 7685268E01 FLTR,FERRITE BEAD,650MA,SM,040

D866 4805656W85 DIODE,SWG,RB520CS-30,SM,100MA, E720 NOTPLACED 64AM DUMMY PART NUMBER E8885 7685268E01 FLTR,FERRITE BEAD,650MA,SM,040

D871 4805656W85 DIODE,SWG,RB520CS-30,SM,100MA, E731 7685268E01 FLTR,FERRITE BEAD,650MA,SM,040 E8886 7685268E01 FLTR,FERRITE BEAD,650MA,SM,040

D872 4805656W85 DIODE,SWG,RB520CS-30,SM,100MA, E732 7685268E01 FLTR,FERRITE BEAD,650MA,SM,040 E8887 7685268E01 FLTR,FERRITE BEAD,650MA,SM,040

D876 4875676A01 DIODE,SUPR,NUP4060AXV6T1G,V SU E740 NOTPLACED 64AM DUMMY PART NUMBER E8888 7685268E01 FLTR,FERRITE BEAD,650MA,SM,040

E101 7605821Z03 FLTR,FERRITE BEAD,4A,SM,1206,C E741 NOTPLACED 64AM DUMMY PART NUMBER E8889 7685268E01 FLTR,FERRITE BEAD,650MA,SM,040

E405 NOTPLACED 64AM DUMMY PART NUMBER E742 NOTPLACED 64AM DUMMY PART NUMBER E8890 7685268E01 FLTR,FERRITE BEAD,650MA,SM,040

E474 7685268E01 FLTR,FERRITE BEAD,650MA,SM,040 E743 NOTPLACED 64AM DUMMY PART NUMBER E8893 7685268E01 FLTR,FERRITE BEAD,650MA,SM,040

E500 NOTPLACED 64AM DUMMY PART NUMBER E744 NOTPLACED 64AM DUMMY PART NUMBER E8910 7685268E01 FLTR,FERRITE BEAD,650MA,SM,040

E519 7685268E01 FLTR,FERRITE BEAD,650MA,SM,040 E745 NOTPLACED 64AM DUMMY PART NUMBER E8911 7685268E01 FLTR,FERRITE BEAD,650MA,SM,040

E600 0613952R66 RES,MF,0OHM,5%,.0625W,SM,0402, E750 NOTPLACED 64AM DUMMY PART NUMBER E941 NOTPLACED 64AM DUMMY PART NUMBER

E602 7685268E01 FLTR,FERRITE BEAD,650MA,SM,040 E751 7685268E01 FLTR,FERRITE BEAD,650MA,SM,040 E942 NOTPLACED 64AM DUMMY PART NUMBER

E702 7605821Z02 FLTR,FERRITE BEAD,4A,SM,0805,C E752 7685268E01 FLTR,FERRITE BEAD,650MA,SM,040 E943 NOTPLACED 64AM DUMMY PART NUMBER

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i465 Component Locations [Continued]

Ref. No. Part No. Description Ref. No. Part No. Description Ref. No. Part No. Description

E944 NOTPLACED 64AM DUMMY PART NUMBER J7 0971529E05 CONN USB,RCPT,5CONT,GLD,MICRO, L303 2414017P22 IDCTR,CHIP,56NH,5%,200MA,2OHM,

E971 7686949J14 FLTR,FERRITE BEAD,2A,SM,0805,C J752 0964372H01 CONN,BRD TO WR,RCPT,5CONT,GLD, L304 2488090Y10 IDCTR,CHIP,5.6NH,5%,300MA,CER,

E972 7685268E01 FLTR,FERRITE BEAD,650MA,SM,040 J779 09009261001 CONN,RCPT,80CONT,CONNECTOR, HI L405 7685268E01 FLTR,FERRITE BEAD,650MA,SM,040

E973 7685268E01 FLTR,FERRITE BEAD,650MA,SM,040 J780 NOTPLACED 64AM DUMMY PART NUMBER L500 2414017P24 IDCTR,CHIP,82NH,5%,150MA,2.5OH

FL1000 9175824C01 PASSIVE FILTER,CER,BANDPASS,2. L1000 2489828Y17 CHIP INDUCTOR,RF,22NH,5%,200MA L501 0613952M26 RES,MF,1.82KOHM,1%,.0625W,SM,0

FL1420 9185284E01 FLTR,SAW L1001 0613952R66 RES,MF,0OHM,5%,.0625W,SM,0402, L502 2414017G18 IDCTR,CHIP,82NH,5%,300MA,2OHM,

FL200 9105849W17 FLTR,SAW,BANDPASS,50OHM,SM,FLT L1002 2415429H35 IDCTR,WW,82NH,5%,400MA,.54OHM, L503 2413954B16 IDCTR,FXD,18NH,5%,320MA,.6OHM,

FL201 9105849W18 FLTR,SAW,BANDPASS,50OHM,SM,FLT L1003 0613952R66 RES,MF,0OHM,5%,.0625W,SM,0402, L605 0613952R66 RES,MF,0OHM,5%,.0625W,SM,0402,

FL3006 NOTPLACED 64AM DUMMY PART NUMBER L1004 2414017P01 IDCTR,CHIP,1NH,300MA,.1OHM,CER L750 2414017G19 IDCTR,CHIP,100NH,5%,300MA,2.5O

FL3007 NOTPLACED 64AM DUMMY PART NUMBER L1005 2488090Y05 IDCTR,CHIP,2.2NH,5%,300MA,CER, L751 2414017G19 IDCTR,CHIP,100NH,5%,300MA,2.5O

FL3008 NOTPLACED 64AM DUMMY PART NUMBER L1405 2414017P08 IDCTR,CHIP,3.9NH,300MA,.22OHM, L752 2414017P25 IDCTR,CHIP,100NH,5%,100MA,5.5O

FL3010 4885534E14 FLTR,EMI FILTER,LOWPASS,110MHZ L1410 NOTPLACED 64AM DUMMY PART NUMBER L753 7685268E01 FLTR,FERRITE BEAD,650MA,SM,040

FL3011 4885534E14 FLTR,EMI FILTER,LOWPASS,110MHZ L1412 2115153H05 CAP,FXD,1.2PF,.1PF+/-,50V-DC,0 L754 2571104B10 IDCTR,PWR,10UH,20%,580MA,.355O

FL3012 NOTPLACED 64AM DUMMY PART NUMBER L1420 2414017P25 IDCTR,CHIP,100NH,5%,100MA,5.5O L755 2571104B04 IDCTR,WW,4.7UH,20%,850MA,.155O

FL401 4885534E14 FLTR,EMI FILTER,LOWPASS,110MHZ L1498 2489828Y09 CHIP INDUCTOR,RF,4.7NH,30MA,.2 L801 7685268E01 FLTR,FERRITE BEAD,650MA,SM,040

FL402 4885534E14 FLTR,EMI FILTER,LOWPASS,110MHZ L1499 2489828Y17 CHIP INDUCTOR,RF,22NH,5%,200MA L802 7685268E01 FLTR,FERRITE BEAD,650MA,SM,040

FL751 9176000B01 EMI FILTER,EMI,6V-DC,PI,AU 2 L L1500 2571104B10 IDCTR,PWR,10UH,20%,580MA,.355O L803 7685268E01 FLTR,FERRITE BEAD,650MA,SM,040

GPSIFOUT NOTPLACED 64AM DUMMY PART NUMBER L1501 2414017G19 IDCTR,CHIP,100NH,5%,300MA,2.5O M1011 NOTPLACED 64AM DUMMY PART NUMBER

GPSIFOUTX NOTPLACED 64AM DUMMY PART NUMBER L200 2471237B04 IDCTR,6.8NH,5%,430MA,.2OHM,CER M104 NOTPLACED 64AM DUMMY PART NUMBER

GPSMAGBIT NOTPLACED 64AM DUMMY PART NUMBER L201 2415429H39 IDCTR,WW,150NH,5%,280MA,.92OHM M1400 NOTPLACED 64AM DUMMY PART NUMBER

GPSSIGNBIT NOTPLACED 64AM DUMMY PART NUMBER L202 2488090Y18 IDCTR,CHIP,27NH,5%,300MA,CER,S M1401 NOTPLACED 64AM DUMMY PART NUMBER

GPSTIMESYN NOTPLACED 64AM DUMMY PART NUMBER L204 2414017P22 IDCTR,CHIP,56NH,5%,200MA,2OHM, M500 3987977Y02 CONT,CONN,1CONT,ANT UNIV 4.5MM

ICRNE_CS NOTPLACED 64AM DUMMY PART NUMBER L300 2414017P22 IDCTR,CHIP,56NH,5%,200MA,2OHM, M501 3987977Y02 CONT,CONN,1CONT,ANT UNIV 4.5MM

J492 3971599M01 CONT,PIN,6CONT,CONN, SIM L301 2488090Y10 IDCTR,CHIP,5.6NH,5%,300MA,CER, M513 NOTPLACED 64AM DUMMY PART NUMBER

J500 0985502E02 RF CONNECTOR,MISC,F,SM L302 2414017P22 IDCTR,CHIP,56NH,5%,200MA,2OHM, PCB 8475171D01 PWB,PCB BLACKSTONE

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SCHEMATIC DIAGRAMS AND COMPONENT LOCATION

i465 Component Locations [Continued]

Ref. No. Part No. Description Ref. No. Part No. Description Ref. No. Part No. Description

Q1408 NOTPLACED 64AM DUMMY PART NUMBER R1024 NOTPLACED 64AM DUMMY PART NUMBER R505 0613952R25 RES,MF,100KOHM,5%,.0625W,SM,04

Q1410 4888695V01 XSTR,FET GEN PURPOSE SMALL SIG R103 0613952Y66 RES,MF,0OHM,5%,.05W,SM,0201,PB R506 0613952Q25 RES,MF,10OHM,5%,.0625W,SM,0402

Q1411 4809807C45 XSTR,FET GP PWR,MOSFET,P-CH,FD R1030 0613952Q08 RES,MF,2OHM,5%,.0625W,SM,0402, R507 NOTPLACED 64AM DUMMY PART NUMBER

Q500 4813973A82 XSTR,BIP GP SS,DIG,NPN AND PNP R104 0613952Y66 RES,MF,0OHM,5%,.05W,SM,0201,PB R518 0613952K85 RES,MF,75OHM,1%,.0625W,SM,0402

Q700 4809807C45 XSTR,FET GP PWR,MOSFET,P-CH,FD R1099 NOTPLACED 64AM DUMMY PART NUMBER R598 0613952R01 RES,MF,10KOHM,5%,.0625W,SM,040

Q701 4809807C45 XSTR,FET GP PWR,MOSFET,P-CH,FD R1414 0613952R66 RES,MF,0OHM,5%,.0625W,SM,0402, R599 NOTPLACED 64AM DUMMY PART NUMBER

Q702 4809807C45 XSTR,FET GP PWR,MOSFET,P-CH,FD R1440 2414017P07 IDCTR,CHIP,3.3NH,300MA,.19OHM, R600 0613952Q43 RES,MF,56OHM,5%,.0625W,SM,0402

Q703 4813970M54 XSTR,FET GP PWR,MOSFET,P,ENHN, R1441 0613952R32 RES,MF,200KOHM,5%,.0625W,SM,04 R6000 NOTPLACED 64AM DUMMY PART NUMBER

Q704 4809607E17 XSTR,BIP GP POWER,PNP,NSS35200 R1443 0613952R66 RES,MF,0OHM,5%,.0625W,SM,0402, R601 0613952Q52 RES,MF,130OHM,5%,.0625W,SM,040

Q705 4809607E17 XSTR,BIP GP POWER,PNP,NSS35200 R200 0613952Q74 RES,MF,1.1KOHM,5%,.0625W,SM,04 R602 0613952Q47 RES,MF,82OHM,5%,.0625W,SM,0402

Q706 4813972A34 XSTR,FET GP SS,MOSFET,N AND P, R201 0613952Q69 RES,MF,680OHM,5%,.0625W,SM,040 R603 0613952Q36 RES,MF,30OHM,5%,.0625W,SM,0402

Q707 4885316E06 XSTR,BIP GP SS,SLCN,NPN AND PN R202 0613952Q83 RES,MF,2.7KOHM,5%,.0625W,SM,04 R604 0613952Z43 RES,MF,3KOHM,1%,.0625W,SM,0402

Q708 4885316E36 XSTR,FET GP PWR,N,SOT-723,20V, R203 0613952R25 RES,MF,100KOHM,5%,.0625W,SM,04 R605 0613952R66 RES,MF,0OHM,5%,.0625W,SM,0402,

Q709 NOTPLACED 64AM DUMMY PART NUMBER R204 0613952R66 RES,MF,0OHM,5%,.0625W,SM,0402, R606 0613952R66 RES,MF,0OHM,5%,.0625W,SM,0402,

Q855 4885316E13 XSTR,BIP GP SS,NPN,DTC144,XSTR R401 0613952Y66 RES,MF,0OHM,5%,.05W,SM,0201,PB R608 0613952R66 RES,MF,0OHM,5%,.0625W,SM,0402,

R1001 0613952R66 RES,MF,0OHM,5%,.0625W,SM,0402, R430 2489828Y17 CHIP INDUCTOR,RF,22NH,5%,200MA R609 0613952R66 RES,MF,0OHM,5%,.0625W,SM,0402,

R1005 NOTPLACED 64AM DUMMY PART NUMBER R431 2489828Y17 CHIP INDUCTOR,RF,22NH,5%,200MA R610 0613952R66 RES,MF,0OHM,5%,.0625W,SM,0402,

R1009 0613952R66 RES,MF,0OHM,5%,.0625W,SM,0402, R432 2489828Y17 CHIP INDUCTOR,RF,22NH,5%,200MA R700 0613952Q73 RES,MF,1KOHM,5%,.0625W,SM,0402

R101 0613952X91 RES,MF,5.6KOHM,5%,.05W,SM,0201 R453 0613952Y66 RES,MF,0OHM,5%,.05W,SM,0201,PB R701 0613958J74 RES,MF,0OHM,5%,.125W,SM,0805,P

R1010 0613952Y66 RES,MF,0OHM,5%,.05W,SM,0201,PB R470 0613952S19 RES,MF,15.4OHM,1%,.05W,SM,0201 R702 NOTPLACED 64AM DUMMY PART NUMBER

R1011 2488090Y05 IDCTR,CHIP,2.2NH,5%,300MA,CER, R471 0613952S17 RES,MF,14.7OHM,1%,.05W,SM,0201 R704 0613952Y01 RES,MF,10KOHM,5%,.05W,SM,0201,

R1012 NOTPLACED 64AM DUMMY PART NUMBER R492 0613952Q91 RES,MF,5.6KOHM,5%,.0625W,SM,04 R706 0613952R16 RES,MF,43KOHM,5%,.0625W,SM,040

R1020 0613952Y66 RES,MF,0OHM,5%,.05W,SM,0201,PB R500 0613952K85 RES,MF,75OHM,1%,.0625W,SM,0402 R707 0613952R25 RES,MF,100KOHM,5%,.0625W,SM,04

R1022 0613952Y66 RES,MF,0OHM,5%,.05W,SM,0201,PB R501 0613952L01 RES,MF,100OHM,1%,.0625W,SM,040 R708 0613952R17 RES,MF,47KOHM,5%,.0625W,SM,040

R1023 0613952R17 RES,MF,47KOHM,5%,.0625W,SM,040 R503 0685660C01 RES,THRM,47KOHM,AT 25DEG C,3%, R709 NOTPLACED 64AM DUMMY PART NUMBER

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i465 Component Locations [Continued

Ref. No. Part No. Description Ref. No. Part No. Description Ref. No. Part No. Description

R710 0613952N01 RES,MF,10KOHM,1%,.0625W,SM,040 R745 0613952R01 RES,MF,10KOHM,5%,.0625W,SM,040 R776 0613952R66 RES,MF,0OHM,5%,.0625W,SM,0402,

R711 0613952N80 RES,MF,66.5KOHM,1%,.0625W,SM,0 R746 0613952Q73 RES,MF,1KOHM,5%,.0625W,SM,0402 R777 NOTPLACED 64AM DUMMY PART NUMBER

R712 0613952M96 RES,MF,9.76KOHM,1%,.0625W,SM,0 R748 0613958K63 RES,MF,4.42OHM,1%,.25W,SM,1206 R778 0613952R66 RES,MF,0OHM,5%,.0625W,SM,0402,

R713 0613952N82 RES,MF,69.8KOHM,1%,.0625W,SM,0 R749 NOTPLACED 64AM DUMMY PART NUMBER R780 NOTPLACED 64AM DUMMY PART NUMBER

R714 0688044N02 RES,METAL STRIP,.02OHM,1%,.125 R750 0613952Y66 RES,MF,0OHM,5%,.05W,SM,0201,PB R781 NOTPLACED 64AM DUMMY PART NUMBER

R715 0685512E01 RES,CER,.16OHM,1%,.25W,SM,0805 R751 0613952Q73 RES,MF,1KOHM,5%,.0625W,SM,0402 R782 NOTPLACED 64AM DUMMY PART NUMBER

R716 0613952R66 RES,MF,0OHM,5%,.0625W,SM,0402, R752 NOTPLACED 64AM DUMMY PART NUMBER R783 0613952R66 RES,MF,0OHM,5%,.0625W,SM,0402,

R719 0613952Q01 RES,MF,1OHM,5%,.0625W,SM,0402, R753 NOTPLACED 64AM DUMMY PART NUMBER R784 0613952R66 RES,MF,0OHM,5%,.0625W,SM,0402,

R720 0613952R17 RES,MF,47KOHM,5%,.0625W,SM,040 R754 0613952Q83 RES,MF,2.7KOHM,5%,.0625W,SM,04 R785 NOTPLACED 64AM DUMMY PART NUMBER

R721 0613952R32 RES,MF,200KOHM,5%,.0625W,SM,04 R755 7685268E01 FLTR,FERRITE BEAD,650MA,SM,040 R786 0613952R66 RES,MF,0OHM,5%,.0625W,SM,0402,

R722 0613952R66 RES,MF,0OHM,5%,.0625W,SM,0402, R757 0613952R66 RES,MF,0OHM,5%,.0625W,SM,0402, R787 0613952R66 RES,MF,0OHM,5%,.0625W,SM,0402,

R723 0613952R66 RES,MF,0OHM,5%,.0625W,SM,0402, R758 2413954B25 IDCTR,FXD,100NH,5%,170MA,2.1OH R788 NOTPLACED 64AM DUMMY PART NUMBER

R724 0613952R66 RES,MF,0OHM,5%,.0625W,SM,0402, R759 0689057L01 RES,CHIP,.05OHM,1%,0805,2X1.27 R789 0613952Q73 RES,MF,1KOHM,5%,.0625W,SM,0402

R725 0613952R01 RES,MF,10KOHM,5%,.0625W,SM,040 R760 0613952Q91 RES,MF,5.6KOHM,5%,.0625W,SM,04 R791 0613952X36 RES,MF,30OHM,5%,.05W,SM,0201,2

R726 0613958C10 RES,MF,124OHM,1%,.125W,SM,0805 R762 NOTPLACED 64AM DUMMY PART NUMBER R792 0613952X36 RES,MF,30OHM,5%,.05W,SM,0201,2

R727 0613952R01 RES,MF,10KOHM,5%,.0625W,SM,040 R764 0613952Y08 RES,MF,20KOHM,5%,.05W,SM,0201, R793 0613952R66 RES,MF,0OHM,5%,.0625W,SM,0402,

R728 0613952P58 RES,MF,392KOHM,1%,.0625W,SM,04 R765 0613952Y22 RES,MF,75KOHM,5%,.05W,SM,0201, R796 0613952R66 RES,MF,0OHM,5%,.0625W,SM,0402,

R729 0613952N93 RES,MF,90.9KOHM,1%,.0625W,SM,0 R766 0613952Y39 RES,MF,390KOHM,5%,.05W,SM,0201 R806 NOTPLACED 64AM DUMMY PART NUMBER

R730 0613952P09 RES,MF,121KOHM,1%,.0625W,SM,04 R768 NOTPLACED 64AM DUMMY PART NUMBER R8070 0613952X81 RES,MF,2.2KOHM,5%,.05W,SM,0201

R731 0613952Y01 RES,MF,10KOHM,5%,.05W,SM,0201, R769 0613952R01 RES,MF,10KOHM,5%,.0625W,SM,040 R8071 0613952X81 RES,MF,2.2KOHM,5%,.05W,SM,0201

R732 NOTPLACED 64AM DUMMY PART NUMBER R770 0613952Q73 RES,MF,1KOHM,5%,.0625W,SM,0402 R8076 NOTPLACED 64AM DUMMY PART NUMBER

R734 0613952R66 RES,MF,0OHM,5%,.0625W,SM,0402, R771 NOTPLACED 64AM DUMMY PART NUMBER R8077 NOTPLACED 64AM DUMMY PART NUMBER

R735 0613952R32 RES,MF,200KOHM,5%,.0625W,SM,04 R772 NOTPLACED 64AM DUMMY PART NUMBER R8078 NOTPLACED 64AM DUMMY PART NUMBER

R739 0613952R01 RES,MF,10KOHM,5%,.0625W,SM,040 R773 0613952P97 RES,MF,1MOHM,1%,.0625W,SM,0402 R8079 NOTPLACED 64AM DUMMY PART NUMBER

R741 0613952Q73 RES,MF,1KOHM,5%,.0625W,SM,0402 R775 NOTPLACED 64AM DUMMY PART NUMBER R8080 NOTPLACED 64AM DUMMY PART NUMBER

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i465 Component Locations [Continued]

Ref. No. Part No. Description Ref. No. Part No. Description Ref. No. Part No. Description

R8082 0613952Y66 RES,MF,0OHM,5%,.05W,SM,0201,PB R8116 0613952Y66 RES,MF,0OHM,5%,.05W,SM,0201,PB R878 0613952Y17 RES,MF,47KOHM,5%,.05W,SM,0201,

R8083 0613952R25 RES,MF,100KOHM,5%,.0625W,SM,04 R8117 NOTPLACED 64AM DUMMY PART NUMBER R880 0613952R66 RES,MF,0OHM,5%,.0625W,SM,0402,

R8084 0613952Y66 RES,MF,0OHM,5%,.05W,SM,0201,PB R8119 0613952Y66 RES,MF,0OHM,5%,.05W,SM,0201,PB R881 NOTPLACED 64AM DUMMY PART NUMBER

R8085 NOTPLACED 64AM DUMMY PART NUMBER R8120 0613952Y66 RES,MF,0OHM,5%,.05W,SM,0201,PB R882 0613952R66 RES,MF,0OHM,5%,.0625W,SM,0402,

R8086 0613952Y66 RES,MF,0OHM,5%,.05W,SM,0201,PB R8121 NOTPLACED 64AM DUMMY PART NUMBER R894 NOTPLACED 64AM DUMMY PART NUMBER

R8087 NOTPLACED 64AM DUMMY PART NUMBER R8122 0689057L01 RES,CHIP,.05OHM,1%,0805,2X1.27 R895 NOTPLACED 64AM DUMMY PART NUMBER

R8088 0613952Y66 RES,MF,0OHM,5%,.05W,SM,0201,PB R8123 0613952Y66 RES,MF,0OHM,5%,.05W,SM,0201,PB R896 NOTPLACED 64AM DUMMY PART NUMBER

R8089 NOTPLACED 64AM DUMMY PART NUMBER R8124 0613952Y01 RES,MF,10KOHM,5%,.05W,SM,0201, R897 NOTPLACED 64AM DUMMY PART NUMBER

R8090 0613952Y66 RES,MF,0OHM,5%,.05W,SM,0201,PB R8125 0613952Y01 RES,MF,10KOHM,5%,.05W,SM,0201, R901 0613952Q33 RES,MF,22OHM,5%,.0625W,SM,0402

R8091 NOTPLACED 64AM DUMMY PART NUMBER R8126 0613952Y66 RES,MF,0OHM,5%,.05W,SM,0201,PB R902 0613952Q33 RES,MF,22OHM,5%,.0625W,SM,0402

R8093 0613952R66 RES,MF,0OHM,5%,.0625W,SM,0402, R8127 0613952Y66 RES,MF,0OHM,5%,.05W,SM,0201,PB RS232_RX NOTPLACED 64AM DUMMY PART NUMBER

R8094 0613952Y66 RES,MF,0OHM,5%,.05W,SM,0201,PB R8128 0613952Y66 RES,MF,0OHM,5%,.05W,SM,0201,PB RS232_TX NOTPLACED 64AM DUMMY PART NUMBER

R8099 0613952Y66 RES,MF,0OHM,5%,.05W,SM,0201,PB R820 0613952Q91 RES,MF,5.6KOHM,5%,.0625W,SM,04 RXEN_STROB NOTPLACED 64AM DUMMY PART NUMBER

R810 0613952R66 RES,MF,0OHM,5%,.0625W,SM,0402, R824 0613952R01 RES,MF,10KOHM,5%,.0625W,SM,040 SH1000 2671785L02 SHLD,SMOOTH,SHLD , BLU

R8100 0613952Y66 RES,MF,0OHM,5%,.05W,SM,0201,PB R827 0613952R66 RES,MF,0OHM,5%,.0625W,SM,0402, SH300 26009257001 SHLD,SHLD , VCO

R8102 0613952Y01 RES,MF,10KOHM,5%,.05W,SM,0201, R828 NOTPLACED 64AM DUMMY PART NUMBER SH301 2671768L02 SHLD,SMOOTH,SHLD , TCXO

R8106 0613952Y01 RES,MF,10KOHM,5%,.05W,SM,0201, R829 NOTPLACED 64AM DUMMY PART NUMBER SH500 26009256001 SHLD,SHLD , PA

R8107 0613952Y01 RES,MF,10KOHM,5%,.05W,SM,0201, R835 0613952Y66 RES,MF,0OHM,5%,.05W,SM,0201,PB SH600 26009254001 SHLD,SHLD , SLDG

R8108 NOTPLACED 64AM DUMMY PART NUMBER R850 0613952R17 RES,MF,47KOHM,5%,.0625W,SM,040 SH700 26009216001 SHLD,SHLD PM

R8109 NOTPLACED 64AM DUMMY PART NUMBER R853 0613952R01 RES,MF,10KOHM,5%,.0625W,SM,040 SH800 26009215001 SHLD,SHLD DIG

R811 NOTPLACED 64AM DUMMY PART NUMBER R855 0613952R09 RES,MF,22KOHM,5%,.0625W,SM,040 SPIA_CLK NOTPLACED 64AM DUMMY PART NUMBER

R8110 NOTPLACED 64AM DUMMY PART NUMBER R856 0613952R01 RES,MF,10KOHM,5%,.0625W,SM,040 SPIA_MISO NOTPLACED 64AM DUMMY PART NUMBER

R8111 0613952Y66 RES,MF,0OHM,5%,.05W,SM,0201,PB R869 0613952R66 RES,MF,0OHM,5%,.0625W,SM,0402, SPIA_MOSI NOTPLACED 64AM DUMMY PART NUMBER

R8112 0613952Y66 RES,MF,0OHM,5%,.05W,SM,0201,PB R870 0613952R66 RES,MF,0OHM,5%,.0625W,SM,0402, SPIB_CLK NOTPLACED 64AM DUMMY PART NUMBER

R8113 NOTPLACED 64AM DUMMY PART NUMBER R877 NOTPLACED 64AM DUMMY PART NUMBER SPIB_MISO NOTPLACED 64AM DUMMY PART NUMBER

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i465 Component Locations [Continued]

Ref. No. Part No. Description Ref. No. Part No. Description Ref. No. Part No. Description

SPIB_MOSI NOTPLACED 64AM DUMMY PART NUMBER TP_DMCS NOTPLACED 64AM DUMMY PART NUMBER TP_TXCLK NOTPLACED 64AM DUMMY PART NUMBER

SPKR_R_M NOTPLACED 64AM DUMMY PART NUMBER TP_EAR_M NOTPLACED 64AM DUMMY PART NUMBER TP_TXE NOTPLACED 64AM DUMMY PART NUMBER

SPKR_R_P NOTPLACED 64AM DUMMY PART NUMBER TP_EAR_P NOTPLACED 64AM DUMMY PART NUMBER TP_TXFS NOTPLACED 64AM DUMMY PART NUMBER

T1400 2585130E04 XFMR,BALUN,SM,BALUN 1500 MHZ 5 TP_EB0 NOTPLACED 64AM DUMMY PART NUMBER TP_TXI NOTPLACED 64AM DUMMY PART NUMBER

T200 2585130E05 XFMR,BALUN,SM,BALUN 800-900 MH TP_EB1 NOTPLACED 64AM DUMMY PART NUMBER TP_TXIX NOTPLACED 64AM DUMMY PART NUMBER

T500 2585130E03 XFMR,BALUN,XFMR RF BALUN TP_EOL NOTPLACED 64AM DUMMY PART NUMBER TP_TXQ NOTPLACED 64AM DUMMY PART NUMBER

TEST1_SL NOTPLACED 64AM DUMMY PART NUMBER TP_GPIO10 NOTPLACED 64AM DUMMY PART NUMBER TP_TXQX NOTPLACED 64AM DUMMY PART NUMBER

TEST2_SL NOTPLACED 64AM DUMMY PART NUMBER TP_GPIO6 NOTPLACED 64AM DUMMY PART NUMBER TP_USB_EOP NOTPLACED 64AM DUMMY PART NUMBER

TP_16_8MHZ NOTPLACED 64AM DUMMY PART NUMBER TP_GPS_CLK NOTPLACED 64AM DUMMY PART NUMBER TP_VIB NOTPLACED 64AM DUMMY PART NUMBER

TP_23 NOTPLACED 64AM DUMMY PART NUMBER TP_LBAN NOTPLACED 64AM DUMMY PART NUMBER TP_WAITB NOTPLACED 64AM DUMMY PART NUMBER

TP_24 NOTPLACED 64AM DUMMY PART NUMBER TP_LNA_EN NOTPLACED 64AM DUMMY PART NUMBER TP_WDOG NOTPLACED 64AM DUMMY PART NUMBER

TP_32KHZ NOTPLACED 64AM DUMMY PART NUMBER TP_MIC NOTPLACED 64AM DUMMY PART NUMBER TPRXQX NOTPLACED 64AM DUMMY PART NUMBER

TP_A1 NOTPLACED 64AM DUMMY PART NUMBER TP_OEN NOTPLACED 64AM DUMMY PART NUMBER U1000 5103535B46 IC,XCVR,BT,BC313141A18-IXF-E4M

TP_ACQ_CLK NOTPLACED 64AM DUMMY PART NUMBER TP_RF_ATTN NOTPLACED 64AM DUMMY PART NUMBER U1001 5175813M01 IC,CONFIGURABLE MULTIPLE-FUNCT

TP_ADTRIG NOTPLACED 64AM DUMMY PART NUMBER TP_RRA_CS NOTPLACED 64AM DUMMY PART NUMBER U1420 51007599001 AMP,20.0DB,1.58GHZMIN,1.58GHZM

TP_AGC_DAC NOTPLACED 64AM DUMMY PART NUMBER TP_RTS NOTPLACED 64AM DUMMY PART NUMBER U200 5115443H01 IC,RF AMPLIFIER,QFN12,QFN,15.5

TP_ANA_CLK NOTPLACED 64AM DUMMY PART NUMBER TP_RWN NOTPLACED 64AM DUMMY PART NUMBER U2051 5164852H14 IC,CUST,RF TRANSCEIVER,BGA,IC,

TP_ASW NOTPLACED 64AM DUMMY PART NUMBER TP_RX_ACQ NOTPLACED 64AM DUMMY PART NUMBER U300 5175772B65 OSC,VCO,1.8824GHZ MAX,1.6996GH

TP_BCLK NOTPLACED 64AM DUMMY PART NUMBER TP_RXFS NOTPLACED 64AM DUMMY PART NUMBER U3003 5171972L01 IC,SW,SP3T RF SW

TP_CKO NOTPLACED 64AM DUMMY PART NUMBER TP_RXI NOTPLACED 64AM DUMMY PART NUMBER U3004 5171972L01 IC,SW,SP3T RF SW

TP_CKOH NOTPLACED 64AM DUMMY PART NUMBER TP_RXIX NOTPLACED 64AM DUMMY PART NUMBER U3005 5175772B22 IC,VDET,MAX803,SC70-3,1PER PKG

TP_CS0 NOTPLACED 64AM DUMMY PART NUMBER TP_RXQ NOTPLACED 64AM DUMMY PART NUMBER U403 5170200A43 IC,ASIC,W2240,TFBGA,GRAPHICS A

TP_CS2 NOTPLACED 64AM DUMMY PART NUMBER TP_SH_CS NOTPLACED 64AM DUMMY PART NUMBER U501 5185633C54 IC,AMP,LOW TIER ADJUSTABLE GAI

TP_CS4 NOTPLACED 64AM DUMMY PART NUMBER TP_SRDB NOTPLACED 64AM DUMMY PART NUMBER U502 5189153N01 IC,BUFFER AMPLIFIER,,N-I,,,OPE

TP_D0 NOTPLACED 64AM DUMMY PART NUMBER TP_STD NOTPLACED 64AM DUMMY PART NUMBER U700 5109817F82 IC,COMPTR,NCS2200,SM,LOW V W18

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SCHEMATIC DIAGRAMS AND COMPONENT LOCATION

i465 Component Locations [Continued]

Ref. No. Part No. Description Ref. No. Part No. Description Ref. No. Part No. Description

U701 5175771A73 IC,CUST,BGA,IC, ROADRUNNER (PM Y600 5185633C78 OSC,TCXO,33.6MHZ,SM,M3.2LX2.5W

U703 5114014A82 IC,LNR V REGLTR,FXD,3.7V,100MA

U801 5185594F15 IC,CUST,DIGITAL PROCESSING,BAS

U802 51009305001 IC,FLASH/PSRAM,512/128MBIT,X16

U803 NOTPLACED 64AM DUMMY PART NUMBER

U805 5189153N01 IC,BUFFER AMPLIFIER,,N-I,,,OPE

USB_TXENB NOTPLACED 64AM DUMMY PART NUMBER

USB_VBUS NOTPLACED 64AM DUMMY PART NUMBER

USB_VPIN NOTPLACED 64AM DUMMY PART NUMBER

VR106 4805656W99 DIODE,ZEN,SM,5.6V,5.6V,.1W,ZEN

VR107 4805656W46 DIODE,ZEN,SM,16V,SNGL

VR109 4805656W99 DIODE,ZEN,SM,5.6V,5.6V,.1W,ZEN

VR405 4805656W46 DIODE,ZEN,SM,16V,SNGL

VR430 4805656W65 DIODE,ZEN,SM,SC-89,5.6V,DL ZEN

VR432 4805656W99 DIODE,ZEN,SM,5.6V,5.6V,.1W,ZEN

VR433 NOTPLACED 64AM DUMMY PART NUMBER

VR434 4805656W99 DIODE,ZEN,SM,5.6V,5.6V,.1W,ZEN

VR702 4813979B24 DIODE ARRAY,TRNSNT PROT,SM,SOT

VR703 4805656W99 DIODE,ZEN,SM,5.6V,5.6V,.1W,ZEN

VR704 4813978M23 DIODE,SWG,SM,SOT-563,1A,23V,.2

VR750 4805656W65 DIODE,ZEN,SM,SC-89,5.6V,DL ZEN

VR755 4813978M23 DIODE,SWG,SM,SOT-563,1A,23V,.2

VR801 4805656W46 DIODE,ZEN,SM,16V,SNGL

VR802 4813978M23 DIODE,SWG,SM,SOT-563,1A,23V,.2

Y1 4809995L13 RESON,QRTZ,.032768MHZ,,,,SM,,F

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i465 Component Locations]

Ref. No. Part No. Description Ref. No. Part No. Description Ref. No. Part No. Description

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ORDERING REPLACEMENT PARTS AND KITS: Ordering Replacement Parts and Kits

APPENDIX A

ORDERING REPLACEMENT PARTS AND KITS Parts should be replaced with identical replacement parts. Replacement parts and kits for i465 units can be ordered directly from the Motorola Accessories and Aftermarket Division (AAD) at 1-800-422-4210 and listen to the prompts; or FAX 800-622-6210.

A.1 Customer Service For warranty and customer service assistance, call:

1-800-453-0920 U.S./Canada 1-954-723-3000 FAX 1-954-723-4910 International (outside U.S ./Canada)

A.2 Replacement Parts When ordering replacement and accessory parts, the complete part number should be included. If the correct part number cannot be located, call Motorola Parts Identification at 1-800-422-4210.

A.3 Domestic Orders

Send written orders for replacement parts, test equipment, or manuals to:

Motorola, Inc. Accessories and Aftermarket Division Attn: Order Processing 1313 E. Algonquin Road Schaumburg, IL 60196

Call, fax, or telex orders to:

1-800-422-4210 1-847-538-8198 FAX 280 127 TELEX

A.4 International Orders For international orders: Motorola, Inc. Accessories and Aftermarket Division Attn: International Order Processing 1313 E. Algonquin Road Schaumburg, IL 60196

Call, fax, or telex orders to: 1-847-538-8023 1-847-576-3023 FAX 403305 TELEX

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ORDERING REPLACEMENT PARTS AND KITS: Replacement Kits

A.5 Replacement Kits When ordering replacement kits, the complete kit number should be included. If the correct number cannot be located, call Motorola Parts Identification at 1-800-422-4210. Refer to the exploded view and parts list in Chapter 7.

Automotive & Navigation IHF1700 Music OEM BT Carkit CKG181xxxx Bluetooth Car Kit, T307 Portable Hands-Free Speaker SYN2715 TN30 GPS Navigation System (4.3" PND) SYN2847 Bluetooth Car Kit / Speakerphone - High Tier, Self Install, T505 SYN1717 Bluetooth Car Kit, T305 Portable Hands-Free Speaker SYN1716 Bluetooth ProInstall Carkit IHF1700 OEM CKG171V010BT Pro-Install CarkIt IHF1000r 98676L Pro Install Bluetooth Carkit T605 Americas 98799N Universal Dash Mount System (iDEN) NNTN7295 MobileVoice (Wireless BT Headsets) ASSY,MOB/VOICE,BT HSET,H390 , BLACK SYN2644 Bluetooth Headset Black H375 ROM BLK SYN2162 Bluetooth Headset H350 Black SYN1439 Bluetooth Headset H550 Silver (SLVR) SYN1822 Bluetooth Headset H560 Black SYN2518 Bluetooth Headset H620 Black SYN2259 Bluetooth Headset H710 SYN2305 Bluetooth Mono Headset, Nickel- H500 SYN1290 BT Headset and Charging case H680 Midnight SYN2168 H15, BT,HIGH TIER,BOOM FLIP MONO HS Midnight SYN2530A H690 Bluetooth Headset Kit SYN2616 H780 Kit Contains Mono Bluetooth headset kit and Cushions SYN2708 ASSY, Mob/Voice, BT Hset, H270 SYN2646 MOTOPURE H12 Bluetooth headset KIT SYN2487 Music & Entertainment 2-wire Surveillance Hdst Kit (iDEN) NNTN5211 3 wire surveillance headst kit (iDEN) NNTN6312 Headst PTT, Earbud (iDEN) NNTN5330 Personalization Blackstone Holster NNTN7627A

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ORDERING REPLACEMENT PARTS AND KITS: Replacement Kits (continued)

Replacement Kits (Continued)

Power Battery BK10 Li-Ion 1750mAh SNN5793 Battery BK70 Li-Ion 1100mAh SNN5823A Battery Door -Standard (BK70) TBD Battery Door -Extended (BK10) TBD Charger Adapter - Aust/NZ Plug SYN8127 Charger Adapter - Euro Plug SYN7456 Charger Adapter - UK Plug SYN7455 Charger Adapter REFRESH - EMU/MU SKN6252 Data cable Micro USB SKN6238 Data cable Micro USB -w/2 pc USBA charger SKN6254 Data cable Micro USB (heat sealed) -w/2 pc USBA charger SKN6268 P313 Standard Car Charger Micro Connector SYN1830 P513 VPA MicroUSB High Performance "Loop" SPN5400 Travel Charger MicroUSB Fast Rate Fixed Blade- ARG SPN5370 Travel Charger MicroUSB Fast Rate Fixed Blade- Brazil SPN5403 Travel Charger MicroUSB Fast Rate Fixed Blade- EURO SPN5383 Travel Charger MicroUSB Fast Rate Fixed Blade- INDIA SPN5372 Travel Charger MicroUSB Fast Rate Fixed Blade- KOREA SPN5373 Travel Charger MicroUSB Fast Rate Fixed Blade- MEX SPN5362 Travel Charger MicroUSB Fast Rate Fixed Blade- SPRINT SPN5374 Travel Charger MicroUSB Fast Rate Fixed Blade- US SPN5358 Travel Charger MicroUSB Rapid - ARG SPN5327 Travel Charger MicroUSB Rapid - MEX SPN5329 Travel Charger MicroUSB Rapid - SPRINT SPN5355 Travel Charger MicroUSB Rapid - US SPN5328 Travel Charger MicroUSB Standard- ARG SPN5339 Travel Charger MicroUSB Standard- Brazil US Blades SPN5402 Travel Charger MicroUSB Standard- EURO SPN5342 Travel Charger MicroUSB Standard- INDIA SPN5346 Travel Charger MicroUSB Standard- KOREA SPN5343 Travel Charger MicroUSB Standard- MEX SPN5337 Travel Charger MicroUSB Standard- SPRINT SPN5356 Travel Charger MicroUSB Standard- US SPN5334 Travel Charger USBA Fast Rate Fixed- ARG SPN5508 Travel Charger USBA Fast Rate Fixed- Brazil BREURO SPN5506 Travel Charger USBA Fast Rate Fixed- EURO SPN5507 Travel Charger USBA Fast Rate Fixed- India SPN5510 Travel Charger USBA Fast Rate Fixed- Korea SPN5511 Travel Charger USBA Fast Rate Fixed- MEX SPN5517 Travel Charger USBA Fast Rate Fixed- Sprint Heat Sealed SPN5505 Travel Charger USBA Fast Rate Fixed- US SPN5504

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ORDERING REPLACEMENT PARTS AND KITS: Recommended Test Equipment

A.6 Recommended Test Equipment and Tools

The following table lists the standard test equipment recommended for troubleshooting i465 units at the field level of service.

Table: A-2. Recommended Test Tools

Description Part Number

Battery Eliminator, Regulated NNTN5590A

Black Stick SLN7223A

Cable, Audio Jack Test NNTN5171A

Cable, SMA to N-Type RF Contact Motorola

Communications System Analyzer Motorola R-2660

Data Cable, Flash MYA2003B

Data Cable, Micro-USB SKN6238

Digital Volt-Ohm Meter Keithley 2001 or eq.

Power Supply, 0-15VDC, 0-3A S1348D

SIM Card, Reference 5185956E60

Torx Bit, T-4 Commercially available

Torx Bit, T-6 6680387A70

Torx Driver, calibrated RSX4043

Wrist Strap, Static ground NTN98 12

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ORDERING REPLACEMENT PARTS AND KITS: Recommended Programming Equipment

A.7 Recommended Programming Equipment

The following tables list the programming equipment and software recommended for troubleshooting i465 units at the field level of service.

Table: A-3. Recommended Programming Equipment

Name Part Number Description

Cable, Data, codeplug Cable, Data, USB

RJD2005A SKN6371A

Connects unit to the computer for monitoring the codeplug.

Table A-3. Recommended Programming Equipment (Continued) Cable, Data (2.5mm) TTY

Connects unit to a teletypewriter (TTY) device for making phone calls.

Cable, Data (for GPS interface) GPS Connects unit to a laptop or other device for sending location information.

Computer, IBM PC-Compatible N/A Pentium microprocessor with: (RSS Workstation) 32MB RAM min.; 4MB hard disk

space min.; Two serial ports and one para l le l por t ; ne twork- capability;

Microsoft Windows 2000, Windows 98, or Windows NT

3.5.1 or later

Table: A-4. Recommended Software

Name Part Number Description

Radio Service Software (RSS) Carrier Version Super Agent Version RVN4 121

RVN4 122

Monitors the unit’s code plug parameters.

iDEN Wireless Data Services Software

Programs a laptop, handheld device, or desktop computer to use the i465 unit as a modem to transfer circuit or packet data.

Interactive Map Software (such as that made by DeLorme or Microsoft) that supports NEMA 3.0 format

Allows i465 unit’s GPS feature to provide approximate location data to a laptop computer or other device.

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