Qorvo QM76018 RFFEM in the Apple iPhone Xr - System Plus … · 2019-10-10 · ©2019 by System...

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22 Bd Benoni Goullin 44200 NANTES - FRANCE +33 2 40 18 09 16 [email protected] www.systemplus.fr Qorvo QM76018 RFFEM in the Apple iPhone Xr First mid/high-band Front-End Module from Qorvo in an Apple phone with advanced packaging.. SP19478 RF report by Stéphane ELISABETH Laboratory Analysis by Nicolas RADUFFE September 2019 – Sample REVERSE COSTING® – STRUCTURAL, PROCESS & COST REPORT

Transcript of Qorvo QM76018 RFFEM in the Apple iPhone Xr - System Plus … · 2019-10-10 · ©2019 by System...

©2019 by System Plus Consulting | Qorvo QM76018 RFFEM in the Apple iPhone Xr | Sample 1

22 Bd Benoni Goullin44200 NANTES - FRANCE +33 2 40 18 09 16 [email protected] www.systemplus.fr

Qorvo QM76018 RFFEM in the Apple iPhone XrFirst mid/high-band Front-End Module from Qorvo in an Apple phone with advanced packaging..SP19478 RF report by Stéphane ELISABETH

Laboratory Analysis by Nicolas RADUFFESeptember 2019 – Sample

REVERSE COSTING® – STRUCTURAL, PROCESS & COST REPORT

©2019 by System Plus Consulting | Qorvo QM76018 RFFEM in the Apple iPhone Xr | Sample 2

Table of Contents

Overview / Introduction 4

o Executive Summary

o Reverse Costing Methodology

Company Profile 8

o Qorvo

o Company Major Customers

o Apple History

o Filter technologies

o Apple iPhone Xr Teardown

Market Analysis 26

o RF Components Market Forecast

o Supply Chain

Physical Analysis 31

o Summary of the Physical Analysis

o Module

Package Views & Dimensions

Package Opening:

Power amplifier, Switch, RF IC, Filters

Package Cross-Section:

Overview, Dimensions, Substrate, Internal & External Shielding

Summary of physical data

o Power Amplifier, Switch

Die Views & Dimensions

Die Cross-Section

Die Process Characteristics

o LNA Die

Die View & Dimensions

Die Overview, Delayering & Main Block ID

Die Process

Die Cross-Section

Die Process Characteristic

o Filter Dies 80

High/Mid band repartition

Dies Views, Dimensions & Opening

Dies Overview: Cap, Substrate, Cells

Die Cross-Section:

Sealing Frame, Anchor, TSV, Holes, FBAR Structure

Die Physical Data Summary

Comparison with Mid/High band FEM from Broadcom 111

Manufacturing Process 122

o Switch & LNA Die Front-End Process

o Filter Die Front-End Process & Fabrication Unit

o Filter Die Front-End Process Flow

o Packaging Process & Fabrication unit

o Packaging Process Flow

Cost Analysis 137

o Summary of the cost analysis

o Yields Explanation & Hypotheses

o Filter die

Die Front-End Cost

Die front Cost per process steps

Die Wafer & Die Cost

o LNA & Switch die

Die Front-End Cost

Die Wafer & Die Cost

o Packaged Component

Packaging Cost

Packaging Cost per process steps

Component Cost

Filter & Front-End Module Estimated Price 156

Feedbacks 160

Company services 162

©2019 by System Plus Consulting | Qorvo QM76018 RFFEM in the Apple iPhone Xr | Sample 3

Overview / Introductiono Executive Summaryo Reverse Costing Methodologyo Glossary

Company Profile & Supply Chain

Market Analysis

Physical Analysis

Physical Comparison

Manufacturing Process Flow

Cost Analysis

Selling Price Analysis

Related Reports

About System Plus

Executive Summary

Every year, Apple adopts innovative technology in the radio-frequency (RF) area. In its 2018 mid-range flagship, theiPhone Xr, the company used the latest and most advanced filter and packaging technology, dual sourcing fromBroadcom, formerly Avago Technologies, and Qorvo. This latest Front-End Module (FEM) is the first High/Mid-BandPower Amplifier Module with integrated Duplexer (HB/MB PAMiD) from Qorvo to be integrated in an Apple phone. Themodule includes a flip-chip power amplifier on a GaAs substrate and advanced Electro-Magnetic Interference (EMI)shielding, allowing frequency band isolation in the same System-in-Package (SiP).

In 2018, Qorvo supplied the Xr version of the iPhone with a module that is pin-to-pin compatible with the BroadcomAFEM-8092, the QM76018. Like the AFEM-8092, the QM78016 is a Mid/High-Band Long Term Evolution (LTE) FEM. Asusual, it features several dies: Power Amplifier, Silicon-on-Insulator (SOI) Switch, Filters and Power ManagementIntegrated Circuit (PMIC). The Filters still use Qorvo’s Copper Flip technology with a polymer cavity enabling thermaldissipation. For the first time, the Bulk Acoustic Wave (BAW) filters are using Scandium Doped Aluminum Nitride (AlScN)as a piezoelectric material and integrate passive capacitor devices on the die.

For this special version, Qorvo has integrated the same advanced features as Broadcom. The first is a Low NoiseAmplifier (LNA) on a SOI substrate. The second is EMI micro shielding inside the PCB substrate to reduce interferencebetween the dies. Thanks to all these innovations, Qorvo is able to supply a similar device to Broadcom’s in terms ofperformance, but also a cost-effective component with a very low number of input/output (I/O) connections.

In this report, we analyze the complete FEM SiP, including a complete analysis of the LNA, the filtering dies, the internaland external EMI shielding and the Power Amplifier. The report also features a cost analysis and a price estimation ofthe component. Finally, it also integrates a physical and cost comparison of the AFEM-8092 Mid/High band LTE FEM alsoused in the Apple iPhone Xr.

©2019 by System Plus Consulting | Qorvo QM76018 RFFEM in the Apple iPhone Xr | Sample 4

Overview / Introduction

Company Profile & Supply Chaino Broadcomo Broadcom Customer Historyo Broadcom & Appleo Filter Technologieso Apple iPhone Xr Teardown

Market Analysis

Physical Analysis

Physical Comparison

Manufacturing Process Flow

Cost Analysis

Selling Price Analysis

Related Reports

About System Plus

Apple iPhone Xr Teardown

Apple iPhone Xr main Board©2019 by System Plus Consulting

• XXXXXXXXXXXXX.

RFFE Area: ~ XX mm²Mid/High band LTE

RFFELow band LTE RFFE

2G PAM + UHB FEM

Baseband Processor

Diversity Switch

©2019 by System Plus Consulting | Qorvo QM76018 RFFEM in the Apple iPhone Xr | Sample 5

Overview / Introduction

Company Profile & Supply Chain

Market Analysis

Physical Analysis o Package Overviewo Package Cross-Sectiono Power Amplifiero Switcho LNAo Filter Overviewo Filter Cross-Section

Physical Comparison

Manufacturing Process Flow

Cost Analysis

Selling Price Analysis

Related Reports

About System Plus

SiP Assembly:

o Pick & Place Components on PCB Substrate

o Electrical Connections and support:

XXXXXXXXX

o Special Features:

XXXX

Components:

Power amplifier:

o XX

o Substrate: GaAs

o Placement : XX

Switch:

o XX

o Substrate: SOI

o Placement : XX.

LNA:

o XX

o Substrate: SOI

o Placement : XX.

Filter Die:

o Cu Flip

o Placement : XX.

Summary of the Physical Analysis

©2019 by System Plus Consulting | Qorvo QM76018 RFFEM in the Apple iPhone Xr | Sample 6

Overview / Introduction

Company Profile & Supply Chain

Market Analysis

Physical Analysis o Package Overviewo Package Cross-Sectiono Power Amplifiero Switcho LNAo Filter Overviewo Filter Cross-Section

Physical Comparison

Manufacturing Process Flow

Cost Analysis

Selling Price Analysis

Related Reports

About System Plus

Package Views & Dimensions

Package Top View – Optical View©2019 by System Plus Consulting

Package Bottom View – Optical View©2019 by System Plus Consulting

Package Side View – Optical View©2019 by System Plus Consulting

• Package Type : XXX-pins LGA

• Dimensions : XX mm² x XX mm(XX x XX x XX mm)

• Pin Pitch : XX mm

• Marking : <Logo Qorvo>

7601810SZZ

XX

mm

XX

mm

XX mm

©2019 by System Plus Consulting | Qorvo QM76018 RFFEM in the Apple iPhone Xr | Sample 7

Overview / Introduction

Company Profile & Supply Chain

Market Analysis

Physical Analysis o Package Overviewo Package Cross-Sectiono Power Amplifiero Switcho LNAo Filter Overviewo Filter Cross-Section

Physical Comparison

Manufacturing Process Flow

Cost Analysis

Selling Price Analysis

Related Reports

About System Plus

Package Overview

©2019 by System Plus Consulting | Qorvo QM76018 RFFEM in the Apple iPhone Xr | Sample 8

Overview / Introduction

Company Profile & Supply Chain

Market Analysis

Physical Analysis o Package Overviewo Package Cross-Sectiono Power Amplifiero Switcho LNAo Filter Overviewo Filter Cross-Section

Physical Comparison

Manufacturing Process Flow

Cost Analysis

Selling Price Analysis

Related Reports

About System Plus

Power Amplifier – Die Cross-Section

©2019 by System Plus Consulting | Qorvo QM76018 RFFEM in the Apple iPhone Xr | Sample 9

Overview / Introduction

Company Profile & Supply Chain

Market Analysis

Physical Analysis o Package Overviewo Package Cross-Sectiono Power Amplifiero Switcho LNAo Filter Overviewo Filter Cross-Section

Physical Comparison

Manufacturing Process Flow

Cost Analysis

Selling Price Analysis

Related Reports

About System Plus

Switch – Die Cross-Section

©2019 by System Plus Consulting | Qorvo QM76018 RFFEM in the Apple iPhone Xr | Sample 10

Overview / Introduction

Company Profile & Supply Chain

Market Analysis

Physical Analysis o Package Overviewo Package Cross-Sectiono Power Amplifiero Switcho LNAo Filter Overviewo Filter Cross-Section

Physical Comparison

Manufacturing Process Flow

Cost Analysis

Selling Price Analysis

Related Reports

About System Plus

LNA – Die Views & Dimensions

• Die Area: XX mm²(XX x XX mm)

• Pad number: XX

• Die Marking: XX• Die Substrate: SOI

Die Top View – Optical View©2019 by System Plus Consulting

©2019 by System Plus Consulting | Qorvo QM76018 RFFEM in the Apple iPhone Xr | Sample 11

Overview / Introduction

Company Profile & Supply Chain

Market Analysis

Physical Analysis o Package Overviewo Package Cross-Sectiono Power Amplifiero Switcho LNAo Filter Overviewo Filter Cross-Section

Physical Comparison

Manufacturing Process Flow

Cost Analysis

Selling Price Analysis

Related Reports

About System Plus

LNA – Die Cross-Section

©2019 by System Plus Consulting | Qorvo QM76018 RFFEM in the Apple iPhone Xr | Sample 12

Overview / Introduction

Company Profile & Supply Chain

Market Analysis

Physical Analysis o Package Overviewo Package Cross-Sectiono Power Amplifiero Switcho LNAo Filter Overviewo Filter Cross-Section

Physical Comparison

Manufacturing Process Flow

Cost Analysis

Selling Price Analysis

Related Reports

About System Plus

Filters – Die Overview – Mid-Band

©2019 by System Plus Consulting | Qorvo QM76018 RFFEM in the Apple iPhone Xr | Sample 13

Overview / Introduction

Company Profile & Supply Chain

Market Analysis

Physical Analysis o Package Overviewo Package Cross-Sectiono Power Amplifiero Switcho LNAo Filter Overviewo Filter Cross-Section

Physical Comparison

Manufacturing Process Flow

Cost Analysis

Selling Price Analysis

Related Reports

About System Plus

Filters – Die Opening

©2019 by System Plus Consulting | Qorvo QM76018 RFFEM in the Apple iPhone Xr | Sample 14

Overview / Introduction

Company Profile & Supply Chain

Market Analysis

Physical Analysis o Package Overviewo Package Cross-Sectiono Power Amplifiero Switcho LNAo Filter Overviewo Filter Cross-Section

Physical Comparison

Manufacturing Process Flow

Cost Analysis

Selling Price Analysis

Related Reports

About System Plus

Filters – Die Cross-Section

©2019 by System Plus Consulting | Qorvo QM76018 RFFEM in the Apple iPhone Xr | Sample 15

Overview / Introduction

Company Profile & Supply Chain

Market Analysis

Physical Analysis

Physical Comparison o Package Overviewo Package Cross-Sectiono Die Number & Area

Manufacturing Process Flow

Cost Analysis

Selling Price Analysis

Related Reports

About System Plus

Package View & Dimension

Apple iPhone Xr – A2108©2019 by System Plus Consulting

Apple iPhone Xr – A2106©2019 by System Plus Consulting

Qorvo QM76018©2019 by System Plus Consulting

Broadcom AFEM-8092©2019 by System Plus Consulting

©2019 by System Plus Consulting | Qorvo QM76018 RFFEM in the Apple iPhone Xr | Sample 16

Overview / Introduction

Company Profile & Supply Chain

Market Analysis

Physical Analysis

Physical Comparison o Package Overviewo Package Cross-Sectiono Die Number & Area

Manufacturing Process Flow

Cost Analysis

Selling Price Analysis

Related Reports

About System Plus

Package Opening – Die Number

Qorvo QM76018©2019 by System Plus Consulting

©2019 by System Plus Consulting | Qorvo QM76018 RFFEM in the Apple iPhone Xr | Sample 17

Overview / Introduction

Company Profile & Supply Chain

Market Analysis

Physical Analysis

Physical Comparison

Manufacturing Process Flowo Dies Processo Filter Fabrication Unito Filter Process Flowo Packaging Fabrication Unito Packaging Process Flow

Cost Analysis

Selling Price Analysis

Related Reports

About System Plus

Filters – Process Flow (2/7)

©2019 by System Plus Consulting | Qorvo QM76018 RFFEM in the Apple iPhone Xr | Sample 18

Overview / Introduction

Company Profile & Supply Chain

Market Analysis

Physical Analysis

Physical Comparison

Manufacturing Process Flow

Cost Analysiso Synthesiso Filter Wafer & Die Costo LNA Wafer & Die Costo Switch Wafer & Die Costo Packaging Costo Component Cost

Selling Price Analysis

Related Reports

About System Plus

Filter Front-End Cost

©2019 by System Plus Consulting | Qorvo QM76018 RFFEM in the Apple iPhone Xr | Sample 19

Overview / Introduction

Company Profile & Supply Chain

Market Analysis

Physical Analysis

Physical Comparison

Manufacturing Process Flow

Cost Analysiso Synthesiso Filter Wafer & Die Costo LNA Wafer & Die Costo Switch Wafer & Die Costo Packaging Costo Component Cost

Selling Price Analysis

Related Reports

About System Plus

System in Package BOM Cost

©2019 by System Plus Consulting | Qorvo QM76018 RFFEM in the Apple iPhone Xr | Sample 20

Overview / Introduction

Company Profile & Supply Chain

Market Analysis

Physical Analysis

Physical Comparison

Manufacturing Process Flow

Cost Analysis

Selling Price Analysiso Financial Ratioso Manufacturer Price

Related Reports

About System Plus

Filter & FEM Estimated Selling Price

©2019 by System Plus Consulting | Qorvo QM76018 RFFEM in the Apple iPhone Xr | Sample 21

Overview / Introduction

Company Profile & Supply Chain

Market Analysis

Physical Analysis

Physical Comparison

Manufacturing Process Flow

Cost Analysis

Selling Price Analysis

Related Reports

About System Plus

REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING

RF• Qualcomm’s First 5G mmWave Chipset: SDX50M and

QTM052• RF Front-End Module Technical Comparison 2019• Broadcom AFEM-8092 System-in-Package in the Apple

iPhone Xs/Xr Series

MARKET AND TECHNOLOGY REPORTS - YOLE DÉVELOPPEMENT

RF• 5G’s Impact on RF Front-End Module and Connectivity for Cell

phones 2019• Advanced RF System-in-Package for Cellphones 2019

Related Reports

©2019 by System Plus Consulting | Qorvo QM76018 RFFEM in the Apple iPhone Xr | Sample 22

COMPANYSERVICES

©2019 by System Plus Consulting | Qorvo QM76018 RFFEM in the Apple iPhone Xr | Sample 23

Overview / Introduction

Company Profile & Supply Chain

Market Analysis

Physical Analysis

Physical Comparison

Manufacturing Process Flow

Cost Analysis

Selling Price Analysis

Related Reports

About System Pluso Company serviceso Contact

Business Models Fields of Expertise

Custom Analyses(>130 analyses per year)

Reports(>60 reports per year)

Costing Tools

Trainings

©2019 by System Plus Consulting | Qorvo QM76018 RFFEM in the Apple iPhone Xr | Sample 24

Overview / Introduction

Company Profile & Supply Chain

Market Analysis

Physical Analysis

Physical Comparison

Manufacturing Process Flow

Cost Analysis

Selling Price Analysis

Related Reports

About System Pluso Company serviceso Contact

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