QNX Software Systems Ltd. & EID, Intel Corporation Collaborate Ron Sluder EID Software Engineering...

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QNX Software Systems Ltd. & QNX Software Systems Ltd. & EID, Intel Corporation EID, Intel Corporation Collaborate Collaborate Ron Sluder EID Software Engineering Manager Yvette Maldonado Business Alliance Manager

Transcript of QNX Software Systems Ltd. & EID, Intel Corporation Collaborate Ron Sluder EID Software Engineering...

Page 1: QNX Software Systems Ltd. & EID, Intel Corporation Collaborate Ron Sluder EID Software Engineering Manager Yvette Maldonado Business Alliance Manager.

QNX Software Systems Ltd. & QNX Software Systems Ltd. & EID, Intel CorporationEID, Intel CorporationCollaborateCollaborate

QNX Software Systems Ltd. & QNX Software Systems Ltd. & EID, Intel CorporationEID, Intel CorporationCollaborateCollaborate

Ron SluderEID Software Engineering Manager

Yvette MaldonadoBusiness Alliance Manager

Page 2: QNX Software Systems Ltd. & EID, Intel Corporation Collaborate Ron Sluder EID Software Engineering Manager Yvette Maldonado Business Alliance Manager.

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AgendaAgendaAgendaAgenda

• QNX/Intel Educational Announcement• Joint Program Intention • Intel’s Worldwide Educational Programs• Embedded Intel Architecture Division

Focus• Conclusion

Page 3: QNX Software Systems Ltd. & EID, Intel Corporation Collaborate Ron Sluder EID Software Engineering Manager Yvette Maldonado Business Alliance Manager.

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QNX/Intel Announce Joint Global QNX/Intel Announce Joint Global Education ProgramEducation Program

QNX/Intel Announce Joint Global QNX/Intel Announce Joint Global Education ProgramEducation Program

• Announcement:– Collaborating to bring the most advanced hardware and

software platforms to universities and technical colleges through a joint Global Education Collaboration

• Qualifying institutions will receive a range of hardware platforms, from low-power Ultra Low Voltage Intel® Celeron® processor based systems to server-class Dual Processor Intel® Pentium® III processor systems along with a QNX® Momentics® Professional Edition development suite

• The Global Education Program is an extension of QNX and Intel’s existing educational outreach programs.

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Program IntentionsProgram IntentionsProgram IntentionsProgram Intentions• To enable and increase the quality of engineering

graduates coming into the industry by providing them with state-of-the-art tools and techniques.

• Offer colleges and universities a cost-effective way to acquire commercial software and hardware for:

– Classroom instruction

– Academic research to help ensure that engineering graduates enter into the industry

• Students will be able to experiment and familiarize themselves with the very same tools that industry leaders employ for cutting edge design and development.

• Goal: To be known among students as the leaders in the industry.

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Intel’s Worldwide Educational Intel’s Worldwide Educational ProgramsPrograms

Intel’s Worldwide Educational Intel’s Worldwide Educational ProgramsPrograms

• Intel® Innovation in Education• Intel International Science and

Engineering Fair• Intel Teach to the Future• Intel University Programs

• www.intel.com/education• www.intel.com/research/university/

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The Intel® Innovation in The Intel® Innovation in EducationEducation

The Intel® Innovation in The Intel® Innovation in EducationEducation

Mission:Prepare a highly skilled workforce by investing in strategic education programs that focus on science, technology, engineering, and mathematics.

Objectives:• Increase the effective & innovative use of technology in teaching & learning• Accelerate the advancement of university curricula and research in strategic technology areas• Improve technical fluency & problem solving skills among under-served youth via effective community-based education

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Intel International Science and Intel International Science and Engineering Fair Engineering Fair

Intel International Science and Intel International Science and Engineering Fair Engineering Fair

• The world's only international science fair representing all life sciences for students.

• Every year, more than one million students compete in regional science fairs and nearly 500 Intel ISEF-affiliated fairs held around the world.

• Students from 40+ countries win the chance to compete for more than US$3 million in scholarships and prizes in 14 scientific categories and a team project category.

• Additional information at: www.intel.com/education/isef

Page 8: QNX Software Systems Ltd. & EID, Intel Corporation Collaborate Ron Sluder EID Software Engineering Manager Yvette Maldonado Business Alliance Manager.

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Intel Teach to the FutureIntel Teach to the FutureIntel Teach to the FutureIntel Teach to the Future

• Intel Teach to the Future is a free professional development program focused on the integration of computer technology to enhance student learning.

• Teacher led workshops focus on the creation of curricular units and evaluation tools to address standards.

• The program incorporates use of the Internet, Web page design, and student projects.

• Over ONE MILLION teachers in 30 countries have been trained to date, including Russia.

• www97.intel.com/education/teach/index.htm

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Intel University ProgramsIntel University ProgramsIntel University ProgramsIntel University Programs• Intel fosters collaboration

between industry and academia through equipment grants, scholarships and fellowships, research grants, and lectures by senior Intel technologists.

• Intel's support of higher education curricula and research extends to more than 75 schools in 25 countries.

• Opportunities Available:

− University Research Grants− Intel Sponsored University Laboratories− Intel Academic Relations− Intel Research Award Contest

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Embedded Intel Architecture Embedded Intel Architecture Division FocusDivision Focus

Embedded Intel Architecture Embedded Intel Architecture Division FocusDivision Focus

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Trends in Embedded ProcessingTrends in Embedded ProcessingTrends in Embedded ProcessingTrends in Embedded Processing

• General-Purpose Processors Replace Deeply Embedded Proprietary Silicon

– Driven by advances in PC industry

– “Pervasive MIPS”

– Commercial off-the-shelf (COTS) components

• Technology Continues to Progress– Specialized SW applications

– Designed to standardized platforms: processors, OS and boards

• Internet Continues to Grow – Rise of pervasive IP networks

– Driving growth of embedded applications

Before:

ProprietaryBefore:

Proprietary

Transition to Standard Modular Building Blocks

After:

StandardizedAfter:

Standardized

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IntelIntel®® Architecture in Embedded and Architecture in Embedded and Communications Market SegmentsCommunications Market SegmentsIntelIntel®® Architecture in Embedded and Architecture in Embedded and Communications Market SegmentsCommunications Market Segments

• Interactive Clients– Point-of-Sale– ATM– Kiosk– Gaming and Entertainment

• Storage– NAS– SAN– DAS

• Industrial Automation– Industrial Control– Factory Automation– Medical Imaging

• Wireless Infrastructure– 2.5G/3G Rollout– Gateways

• Wireline Infrastructure– Security– Service Provisioning– Media Gateways

Page 13: QNX Software Systems Ltd. & EID, Intel Corporation Collaborate Ron Sluder EID Software Engineering Manager Yvette Maldonado Business Alliance Manager.

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Mapping IntelMapping Intel®® Architecture Value Architecture Value to Embedded and Communicationsto Embedded and CommunicationsMapping IntelMapping Intel®® Architecture Value Architecture Value

to Embedded and Communicationsto Embedded and Communications

• Intel Technology– Universal acceptance of Intel® Architecture– Intel investment in R&D and manufacturing– Extended lifecycle support

• Scalable Product Roadmap– High performance– I/O bandwidth– Scalability

• Rich Ecosystem– Platform enabling with board, system, and

tools vendors– Extensive SW development environment– Development tools and middleware– System-level building blocks

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Embedded IA Value PropositionEmbedded IA Value PropositionEmbedded IA Value PropositionEmbedded IA Value Proposition

• Product Line Stability– 5 year life cycle for EID roadmap components

• Vertical Market Segment– Tailored Platform Configurations for Embedded

Markets• World class technical support

– Broad OS support• PC Economies of Scale

– Volume Manufacturing– Architecture Pervasiveness

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Intel® Pentium® M Intel® Pentium® M Processor ArrivesProcessor ArrivesIntel® Pentium® M Intel® Pentium® M Processor ArrivesProcessor Arrives

• Intel® Pentium® M processpr = next generation low power processor

• Specifically designed for low power, high performance market segments

• 400MHz FSB• 1MB L2 cache• Geyserville III technology support• 2 SKUs supported in embedded

– 1.6GHz (<24.5W), µFCBGA and µFCPGA– LV 1.1GHz (<12W), µFCBGA

Architectural Solution for Power-Performance Balance

Architectural Solution for Power-Performance Balance

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* Performance tests and ratings are measured using specific computer systems and/or components and reflect the approximate performance of Intel products as measured by those tests. Any difference in system hardware or software design or configuration may affect actual performance. Buyers should consult other sources of information to evaluate the performance of systems or components they are considering purchasing. For more information on performance tests and on the performance of Intel products, visit http://www.intel.com/performance/resources/limits.htm.

Pentium® M Processor FeaturesPentium® M Processor FeaturesPentium® M Processor FeaturesPentium® M Processor Features

More instructions per wattMore instructions per wattMore instructions per wattMore instructions per watt

• More efficient execution*– Predicts program flow better » Faster program execution – Changes tasks faster » Lower exception handling overhead – Instruction car-pooling » Faster packet handling: load, store

– Multi-tasks faster » Lower context switching latency • Power optimized circuitry » Lower average power

– Cache and processor bus– Dynamic power control

• Bigger fast memory » Large-table look-ups: routing tables – Large L1/L2 caches

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EIA: Scalable Product RoadmapEIA: Scalable Product RoadmapEIA: Scalable Product RoadmapEIA: Scalable Product Roadmap

2002200220022002

CURRENTCURRENTCURRENTCURRENT DEVELOPMENTDEVELOPMENTDEVELOPMENTDEVELOPMENT FUTUREFUTUREFUTUREFUTURE

20042004200420042003200320032003

ScaleableScaleablePerformancePerformance

ScaleableScaleablePerformancePerformance

Low PowerLow PowerLow PowerLow Power

HighHighPerformancePerformance

HighHighPerformancePerformance

.13.13μμ.13.13μμ 90nm90nm90nm90nm

2002200220022002

CURRENTCURRENTCURRENTCURRENT DEVELOPMENTDEVELOPMENTDEVELOPMENTDEVELOPMENT FUTUREFUTUREFUTUREFUTURE

20042004200420042003200320032003

<30 Watt<30 Watt<30 Watt<30 Watt

<7 Watt<7 Watt<7 Watt<7 Watt

<15 Watt<15 Watt<15 Watt<15 Watt

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Intel® Xeon™ Intel® Xeon™ Processor at Processor at 1.6GHz - 30 Watts1.6GHz - 30 Watts

Intel® Pentium M™ Intel® Pentium M™ processor at processor at 1.1/1.6GHz - 1.1/1.6GHz - 12/24.5 Watts12/24.5 Watts

Ultra Low Voltage Ultra Low Voltage Intel® Celeron® Intel® Celeron® processor at 400MHz processor at 400MHz - 3.75 Watts- 3.75 Watts

Intel may make changes to specifications, product descriptions, and plans at any time, without notice

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EnterpriseEnterprise ServerServerEnterpriseEnterprise ServerServer

MobileMobileMobileMobile

* Other names and brands may be claimed as the property of others.* Other names and brands may be claimed as the property of others.

PCI Express*:PCI Express*:Cross Platform I/OCross Platform I/O

PCI Express*:PCI Express*:Cross Platform I/OCross Platform I/O

Mobile PlatformsMobile Platforms• GraphicsGraphics• LANLAN• Wi FiWi Fi

Desktop PlatformsDesktop Platforms• LANLAN• GraphicsGraphics

Data Center PlatformsData Center Platforms• IBA ClusteringIBA Clustering• FC, SAS, SATA FC, SAS, SATA

StorageStorage• Ethernet LANEthernet LAN

PCI Express*, PCI Express*, X16 - GrfxX16 - Grfx

WorkGroup SwitchWorkGroup Switch

PCI Express*, PCI Express*, X1 - GbEX1 - GbE

ICH6ICH6

WLAN Access PointWLAN Access Point

Comm PlatformsComm Platforms• Chip to ChipChip to Chip• Host base Host base

modulesmodules

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Advanced Switching based on Advanced Switching based on PCI Express* ArchitecturePCI Express* Architecture

Advanced Switching based on Advanced Switching based on PCI Express* ArchitecturePCI Express* Architecture

• Shifts the ‘host-centric’ paradigm of PCI to ‘network-centric’ paradigm preferred in Comms (peer to peer)

• Encapsulation of upper layer protocols allows interoperability, tunneling capability preserve software investment

Advanced SwitchingAdvanced Switching

Traditional PCITraditional PCI

StarStar Dual StarDual Star MeshMesh

Efficient routing (Path based routing) with fail-over capabilities

High availability & congestion avoidance mechanisms

Multicast / Broadcast

*Other names and brands may be claimed as the property of others.

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QNX on Embedded Intel ArchitectureQNX on Embedded Intel ArchitectureQNX on Embedded Intel ArchitectureQNX on Embedded Intel Architecture

• Broad product line support• Leading RTOS for SMP environments• True Hyper-threading support• Utilizing IA thermal technologies for superior

power management

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QNX Roadmap SupportQNX Roadmap SupportQNX Roadmap SupportQNX Roadmap Support

Shipping Development Shipping Development All items subject to changeAll items subject to change..

Intel® E7501Intel® E7501 Intel® 855-GMIntel® 855-GM

QNX Neutrino,

SIM

D

Intel® E7500Intel® E7500

QNX Neutrino

Intel® E7501Intel® E7501

QNX Neutrino QNX Neutrino

QNX NeutrinoQNX Neutrino

Intel® 810/815Intel® 810/815

QNX Neutrino

Intel® 440MX, 440BXIntel® 440MX, 440BX

QNX Neutrino

Intel® 810/815Intel® 810/815 Intel® 845E/GVIntel® 845E/GV

Pentium® MPentium® MProcessorProcessor

Intel® Xeon™ Intel® Xeon™ ProcessorProcessor

Pentium® 4 Pentium® 4 ProcessorProcessor

Pentium® Pentium® III III ProcessorProcessor

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ConclusionConclusionConclusionConclusion

• Intel Silicon Roadmap• Embedded Lifecycle Support (5-7 yrs)• Leadership in Manufacturing • Leadership in Industry Initiatives• Validated Platform Solutions• Strong Technical Support• World-Class Ecosystem• Excellent Relationship with QNX

EID Delivers Performance, Scalability, EID Delivers Performance, Scalability, Low Power & Integrated featuresLow Power & Integrated features

EID Delivers Performance, Scalability, EID Delivers Performance, Scalability, Low Power & Integrated featuresLow Power & Integrated features

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Thank You!Thank You!Thank You!Thank You!

Intel, the Intel logo, Pentium, Celeron, and Xeon are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries.