PwrPack2019 LF-MCeP
Transcript of PwrPack2019 LF-MCeP
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LF-MCePHigh Thermal Performance Module for Power Supply
Shuji TsuchiyaIC Assembly Division
SHINKO ELECTRIC INDUSTRIES CO., LTD.
PwrPack2019
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Outline
■ Introduction of device embedded package- MCeP® introduction
■ Requirements for power modules
■ Introduction of LF-MCeP- Heat dissipation
- Miniaturization / Modularization- Substrate routing efficiency
■ Package Characteristics- PKG warpage- MSL Result
■ Conclusion- PKG structure road map
- Future development challenge
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Introduction of Device Embedded Package
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MCeP® AdvantagesoFine pitch flip chip interconnection w/ thin die
oSmaller package size than other PoP
oFlexible pad array on top substrate
oLow package warpage w/ thin body
oHigh yield, high reliability & short TAT
MCeP® : Molded Core embedded Package
Top Substrate
Embedded Layer
Bottom Substrate
Chip SMTMold Resin
Cu Core Solder Ball
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Features of Manufacturing Process Flow
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Tested top substrate with Cu core solder balls
FC bonding on tested bottom substrate
Connect top and bottom substrate
Encapsulate with transfer molding
✓Device embedded structure used only assembly technologies
✓ Tested top and bottom substrates
✓Short TAT
✓High Yield
Go to backend processes
Die last process (MCeP®) delivers high assembly yield.
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Modified MCeP®
Application MCeP sectional structure PKG concept
Package under PoP(Mobile, DSC, etc.)
- Pre-stack memory PKG
RF, for antenna(high frequency)
- One substrate used for antenna- Embedded Chip
For high-density mounting(Device embedded package, Module)
- Parts placement on PKG surface and Embedded layer- Make Cu core ball into Cu post and embed passive components etc.
∙ The embedded layer can be thickenedwith a narrow pitch between posts⇒ Favorable for built-in parts
Mold IC
Substrate
Passive
PassiveCu
post
Mold
SubstrateCu
Core ball IC
Mold
Substrate
CuCore ball
IC
MCeP® is ideal for device embedded packages.
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Outline
■ Introduction of device embedded package- MCeP® introduction
■ Requirements for power modules
■ Introduction of LF-MCeP- Heat dissipation
- Miniaturization / Modularization- Substrate routing efficiency
■ Package Characteristics- PKG warpage- MSL Result
■ Conclusion- PKG structure road map
- Future development challenge
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Miniaturization / Modularization
Heat dissipation requirements
Increased substrate routing efficiency
Module for Power Supply Package
Request to Power Supply Module PKG
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Outline
■ Introduction of device embedded package- MCeP® introduction
■ Requirements for power modules
■ Introduction of LF-MCeP- Heat dissipation
- Miniaturization / Modularization- Substrate routing efficiency
■ Package Characteristics- PKG warpage- MSL Result
■ Conclusion- PKG structure road map
- Future development challenge
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LF-MCeP AdvantagesoCan use existing MCeP® assembly process
oHeat dissipation is advantageous by using LF
oMiniaturization / modularization possible
oSubstrate routing efficiency
(can shorten routing path)
oLow package warpage
LF-MCeP : Lead Frame Molded Core embedded Package
Substrate
Embedded Layer
Lead Frame
CuCore ball IC
Lead frame
Substrate
Mold Passive
LF-MCeP Introduction
LF
Cu core Ball
PCB
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Heat Dissipation Advantage (Mounting Application)
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#1 : By using LF as the PKG TOP surface, LF can be used as a heat sink.
#2 : By making LF PKG Bottom, heat dissipation from the bottom of the PKGcan be improved.
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■ Analysis model
Heat Dissipation Advantage (Thermal Simulation)
Leg.1 Leg.2 Leg.3
MCeP (2L+4L) LF-MCeP (LF+4L) LF-MCeP (LF+4L) with TIM
PKG size: 10 x 10 mmChip size: 5 x 5 mm
MC
ePSo
lder
JED
ECB
oar
d
Chip
4L substrate
Mold
NCP
2L substrate
Chip
4L substrate
Mold
NCP
LF
Chip
4L substrate
Mold
NCP
LF
TIM
4L Substrate : 0.37mm2L Substrate : 0.15mm
LF : 0.15mmJEDEC Board : 1.6mm
Dimension Thickness
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■ Analysis conditions
Analysis area MCePor
LF-MCeP
JEDEC Board
Chip
Solver FloTHERM v12.0
Analysis type Steady state thermal fluid analysis
Analysis area 304.5x342.9x100㎜
Ambient environment 25 ℃, no wind speed
Radiation Yes
IC Power Chip:2.0W
PartsThermal conductivity
[W/m・K]Radiation ratio
Chip 150 - - -
Solder 64.2 - - -
LF 220 - - -
TIM 30 - - -
Mold 3 0.9
NCP 0.54 - - -
SR 0.23 0.9
Core 0.73 - - -
Prepreg 0.73 - - -
JEDEC board 0.38 0.9
Air @ 25degC 0.026 - - -
Heat Dissipation Advantage (Thermal Simulation)
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• The chip temperature and thermal resistance θja of LF-MCeP are lower than MCeP.• When the TIM material is applied, the chip temperature and the thermal resistance θjaare further reduced.
■ Analysis result 1 : θja , Chip temperature
Leg.1 Leg.2 Leg.3
MCeP (2L+4L) LF-MCeP (LF+4L) LF-MCeP (LF+4L) with TIM
θja:24.5[K/W]Chip temperature:74.1℃
θja:22.9 [K/W]Chip temperature:70.9℃
θja:22.7[K/W]Chip temperature:70.4℃
A
A’
A-A’ A-A’ A-A’
Expansionof PKG part
Heat Dissipation Advantage (Thermal Simulation)
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Leg.1 Leg.2 Leg.3
MCeP (2L+4L) LF-MCeP (LF+4L) LF-MCeP (LF+4L) with TIM
A 0.953 1.333 1.333
B 0.988 0.632 0.547
C 0.978 0.598 0.510
D 1.916 1.920 1.920
E 1.913 1.916 1.917
Chip
L/F
4L substrate
Mold
NCP
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■ Analysis result 2 : Thermal flow analysis
Chip
4L substrate
Mold
NCP
2L substrate
JEDEC Board
A
BC
ED
BC
ED
:Conduction
• Most of the chip heat is dissipated from the JEDEC board.• In the case of LF, the chip heat is transferred directly to the JEDEC board via LF.
:Radiation
Chip
L/F
4L substrate
Mold
NCP
A
BC
ED
A TIM
Unit: [W]
Heat Dissipation Advantage (Thermal Simulation)
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Conventional(2D)
LF-MCeP (3D)
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Miniaturization / Modularization
■ PKG area comparison Module PKG vs LF-MCeP
Surface mounting
Shrink of 25% is possible in the PKG area ratio
Backside mounting(Embedded layer)
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■ By placing components on the front and back of the substrate, the routing path between components can be shortened.
Substrate Routing Efficiency
Conventional(2D)
LF-MCeP(3D)
Image of routing path
■Calculation conditions・WLCSP :BGA 0.50mm Pitch・SMT Size : 0603[mm]・4L Substrate : t=0.37mm
Calculation results of routing path⇒ Routing path can be shortened to about 1/4
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■ Introduction of device embedded package- MCeP® introduction
■ Requirements for power modules
■ Introduction of LF-MCeP- Heat dissipation
- Miniaturization / Modularization- Substrate routing efficiency
■ Package Characteristics- PKG warpage- MSL Result
■ Conclusion- PKG structure road map
- Future development challenge
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Outline
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PKG Warpage
■ Sample・ PKG size: 9.0㎜SQ.・ Embedded chip and component
4L Substrate
Lead Frame
Embedded Layer
Small warpage range from room temperature to high temperatureLow warpage PKG possible
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MSL Result
MSL Test condition NResult(SAT)
MSL3Bake125℃24h ⇒30℃60%192h⇒260℃MaxReflow×3
10pcs10 / 10pcs
PASS
■ Sample・ PKG size: 9.0㎜SQ.・ Embedded chip and component
4L Substrate
Lead Frame
Embedded Layer
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Outline
■ Introduction of device embedded package- MCeP® introduction
■ Requirements for power modules
■ Introduction of LF-MCeP- Heat dissipation
- Miniaturization / Modularization- Substrate routing efficiency
■ Package Characteristics- PKG warpage- MSL Result
■ Conclusion- PKG structure road map
- Future development challenge
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PKG Structure Road MapVoltage [
V]
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CuCore ball
Lead frame
Substrate
Mold IC
Substrate
Lead frame (Bottom)
Lead frame (Top)
Electric current [A]
High power module■Adoption of Cu Cube・ Improved thermal conductivity of upper and lower substrates.・ Stable connectivity and lower electrical resistance.
■High thermal conductive mold resin
■MCeP adoption of LF + LF・ Improves heat dissipation
from the top and bottom of the PKG
■Thermally conductive resin is used on the back of the chip
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Future Development challenge
■Summary・ Use of LF can improve heat dissipation of PKG.・ Can be miniaturized and modularized by embedding components.・ The routing length can be shortened by 3D PKG structure.
■ Improved heat dissipation・ Development of high thermal conductive mold resin.・ Development of high thermal conductive resin between chip and LF.
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Thank you for your attention