PWB Product Data-Driven Analysis Using STEP AP210 An Example XAI Application
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Transcript of PWB Product Data-Driven Analysis Using STEP AP210 An Example XAI Application
PWB Product Data-Driven Analysis Using STEP AP210
An Example XAI Application
Russell S. PeakSenior Researcher & Co-DirectorEngineering Information Systems Labeislab.gatech.edu
CALS Technology CenterGeorgia Institute of Technology
ISTPED WorkshopRoanoke VAJuly 19, 2000
Integration of Software Tools for Power Electronics Designhttp://www-rp.me.vt.edu/bohn/ISTPED/
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Outline
Generalized Analysis Integration Challenges Techniques and Applications
Experiences with AP210 Summary
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X-Analysis Integration (XAI)(X=Design, Mfg., etc.)
Goal:Improve product engineering process by integrating
physical behavior simulations with other life cycle models Challenges:
– Heterogeneous Transformations– Diversity: Information, Behaviors, Disciplines, Fidelity, Feature
Levels, CAD/CAE Tools, etc.– Multidirectional Associativity:
Design Analysis, Analysis Analysis One Approach:
The Multi-Representation Architecture (MRA) Initial Focus:
Automation of ubiquitous analysis for design
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Analysis Integration Challenges: Heterogeneous Transformations
Heterogeneous Transformation
Homogeneous Transformation
Mentor Graphics Cadence
STEPAP210
Mentor Graphics Ansys
STEPAP210
STEPAP209??
DesignModel A
DesignModel B
DesignModel A
AnalysisModel A
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Analysis Integration Challenges:
Information Diversity
EnvironmentalConditions Specification
Semantics
Idealizations
“Manufacturable”Description
“Analyzable”Description
“PWB shouldhave low bow & twist”
“Warpage < 7.5% whenboard is cooled from lamination to 25oC”
laminationtemperature =
200oC
B
STEPAP220
STEPAP210
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Diverse Analysis Disciplines
Thermal
Thermomechanical
Fatigue
Vibration
Electromagnetic
Electrical
PWA 95145
U101
L101 T102
Q105
T101
Q104
R101
CR102
C102
C203 CR154 CR152
R163 CR151 CR101
C104
C103
R109 R110
Q101 Q102 C120
CR133
C153
C146 C147 C106
C111
C112
R230 R232 R233
R102 Q103
U107
U108
U103
U104
U109
U110
U105
U106
C123
R106 R107 R108
R111 R112 R113 R114 R115
R231
C118
x y
PWB 96510
J101
U102
N
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Multi-Fidelity IdealizationsSame Mode; Idealized Geometries of Varying Dimension
inboard beam
Design Model (MCAD) Analysis Models (MCAE)
1D Beam/Stick Model
3D Continuum/Brick Model
flap support assembly
Mode (Behavior) = Deformation
8Engineering Information Systems Lab eislab.gatech.edu© GIT
e
se
tr
Pf
02
21
e
be
ht
PCf
),,( 13 hbrfK
Missing Today:Explicit Design-Analysis Associativity
Analysis Model (with Idealized Features)
Detailed Design Model
Channel Fitting Analysis
“It is no secret that CAD models are driving more of today’s product development processes ... With the growing number of design tools on the market, however, the interoperability gap with downstream applications, such as finite element analysis, is a very real problem. As a result, CAD models are being re-created at unprecedented levels.” Ansys/ITI press Release, July 6 1999
http://www.ansys.com/webdocs/VisitAnsys/CorpInfo/PR/pr-060799.html
idealizations
No explicit
fine-grained
CAD-CAE
associativity
inconsisten
cy littleautomation
littleknowledge capture
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X-Analysis Integration TechniquesMulti-Representation Architecture (MRA)
1 Solution Method Model
ABB SMM
2 Analysis Building Block
4 Context-Based Analysis Model3
SMMABB
APM ABB
CBAM
APM
Design Tools Solution Tools
Printed Wiring Assembly (PWA)
Solder Joint
Component
PWB
body3body2
body1
body4
T0
Printed Wiring Board (PWB)
SolderJoint
Component
AnalyzableProduct Model
I n f o r m a l A s s o c i a t i v i t y D i a g r a m
C o n s t r a i n t S c h e m a t i c ( I n f o r m a t i o n M o d e l )
P l a n e S t r a i n B o d i e s S y s t e m
P W A C o m p o n e n t O c c u r r e n c e
CL
1
m a t e r i a l ,E( , )g e o m e t r y
b o d y
p l a n e s t r a i n b o d y , i = 1 . . . 4P W B
S o l d e rJ o i n t
E p o x y
C o m p o n e n tb a s e : A l u m i n a
c o r e : F R 4
S o l d e r J o i n t P l a n e S t r a i n M o d e l
t o t a l h e i g h t , h
l i n e a r - e l a s t i c m o d e l
A P M A B B
3 A P M 4 C B A M
2 A B Bc
4b o d y 3b o d y
2b o d y
1h oT
p r i m a r y s t r u c t u r a l m a t e r i a l
ii
i
1 S M M
D e s i g n M o d e l A n a l y s i s M o d e l
A B B S M M
s o l d e rs o l d e r j o i n t
p w b
c o m p o n e n t
1 . 2 5
d e f o r m a t i o n m o d e l
t o t a l h e i g h t
d e t a i l e d s h a p e
r e c t a n g l e
[ 1 . 2 ]
[ 1 . 1 ]
a v e r a g e
[ 2 . 2 ]
[ 2 . 1 ]
cT c
T s
i n t e r - s o l d e r j o i n t d i s t a n c ea p p r o x i m a t e m a x i m u m
s j
L s
p r i m a r y s t r u c t u r a l m a t e r i a l
t o t a l t h i c k n e s s
l i n e a r - e l a s t i c m o d e l
P l a n e S t r a i n
g e o m e t r y m o d e l 3
a
s t r e s s - s t r a i nm o d e l 1
s t r e s s - s t r a i nm o d e l 2
s t r e s s - s t r a i nm o d e l 3
B o d i e s S y s t e m
x y , e x t r e m e , 3
T 2
L 1
T 1
T 0
L 2
h 1
h 2
T 3
T s j
h s
h c
L c
x y , e x t r e m e , s jb i l i n e a r - e l a s t o p l a s t i c m o d e l
l i n e a r - e l a s t i c m o d e l
p r i m a r y s t r u c t u r a l m a t e r i a l l i n e a r - e l a s t i c m o d e l
c o m p o n e n to c c u r r e n c e
s o l d e r j o i n ts h e a r s t r a i nr a n g e
[ 1 . 2 ]
[ 1 . 1 ]l e n g t h 2 +
3 A P M 2 A B B
Explicit Design-Analysis Associativity
Analysis Module Creation Methodology
Constrained Objects (COBs)
ProductModel Selected Module
Analysis Module Catalogs
MCAD
ECAD
Analysis Procedures
CommercialAnalysis Tools
Ansys
Abaqus
Solder Joint Deformation Model
Idealization/Defeaturization
CommercialDesign Tools
PWB
Solder Joint
Component
APM CBAM ABB SMM
Routine Analysis(Module Usage)
Routinization(Module Creation)
CAE
Physical Behavior Research,Know-How, Design Handbooks, ...
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Diverse Analysis Integration Projects
Team Integrated Electronic Response (TIGER)– Sponsor: Defense Advanced Research Prog. Admin. (DARPA)
(SCRA subcontract)– Domain: PWA/B thermomechanical analysis
Product Data-Driven Analysis in a Missile Supply Chain (ProAM)– Sponsor: U. S. DoD JECPO National ECRC Program– Stakeholder: U. S. Army Missile Command (AMCOM)– Domain: PWA/B thermomechanical analysis
Design-Analysis Associativity Technology for PSI (PSI-DANTE)– Sponsor: Boeing– Domain: Structural analysis
Design-Analysis Integration Research for Electronic Packaging– Sponsor: Shinko Electric– Domain: Chip package thermal resistance analysis
AP210Usage
AP210Usage
PotentialAP210Usage
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Flexible High Diversity Design-Analysis IntegrationTutorial Examples: Flap Link (Mechanical/Structural Analysis)
A n a ly s is M o d u le s (C B A M s ) o f D iv e rs e M o d e & F id e lity
M C A D T o o ls
M a te r ia ls D B
y
xPP
E , A
LL e ff
,
L
F E A A n sys
A b a q u s *
C A T IA E lfin i*
M S C N a stra n *
M S C P a tra n *
G e n e ra l M a thM a th em a tica
M a tla b *
M a th C A D *
A n a ly z a b le P ro d u c t M o d e l
X a iT o o ls
X a iT o o ls
E x te n s io n
T o rs io n 1 D
1 D
M o d u la r , R e u s a b leT e m p la te L ib ra r ie s
ID E A S * , P ro /E * , C A T IA
temperature change,T
material model
temperature, T
reference temperature, To
cte,
youngs modulus, E
force, F
area, A stress,
undeformed length, Lo
strain,
total elongation,L
length, L
start, x1
end, x2
mv6
mv5
smv1
mv1mv4
E
One D LinearElastic Model
(no shear)
T
e
t
thermal strain, t
elastic strain, e
mv3
mv2
x
FF
E, A,
LLo
T, ,
yL
r1
12 xxL
r2
oLLL
r4
A
F
sr1
oTTT
r3L
L
m ate ria l
e ffec tive le ngth, L e f f
de form a tion m ode l
line ar e las tic m ode l
L o
T ors iona l R od
G
J
r
2
1
sh ear m odu lus , G
cross section:e ffec tive r ing po lar m o m e nt o f ine rtia , J
al1
a l3
a l2 a
linkag e
m ode : shaft tors ion
co ndit ion re action
t s 1
A
S le e v e 1
A ts 2
d s 2
d s 1
S le e v e 2
L
S h a ft
L e f f
s
T
ou ter ra d ius , ro al2 b
stress m os m ode l
a llo w a ble stress
tw ist m os m ode l
M arg in o f S afety(> case )
a llo w a b le
a c tu a l
M S
M arg in o f S afety(> case )
a llo w a b le
a c tu a l
M S
allo w a bletw ist
A n a ly s is T o o ls
* = I te m n o t y e t a v a ila b le in to o lk it (a ll o th e rs h a v e w o rk in g e x a m p le s)
D e s ig n T o o ls
2 D ,3 D *
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Analysis Tools
0.4375 in
0.5240 in
0.0000 in
2.440 in
1.267 in
0.307 in
0.5 in
0.310 in
2.088 in
1.770 in
67000 psi
65000 psi
57000 psi
52000 psi
39000 psi
0.067 in/in
0.030 in/in
5960 Ibs
1
10000000 psi
9.17
5.11
9.77
rear spar fitting attach point
BLE7K18
2G7T12U (Detent 0, Fairing Condition 1)
L29 -300
Outboard TE Flap, Support No 2;Inboard Beam, 123L4567
Bulkhead Fitting Joint
Program
Part
Feature
Channel FittingStatic Strength Analysis
Template
1 of 1Dataset
strength model
r1
e
b
h
tb
te
Pu
Ftu
E
r2
r0
a
FtuLT
Fty
FtyLT
epuLT
tw
MSwall
epu
jm
MSepb
MSeps
Channel FittingStatic Strength Analysis
Fsu
IAS FunctionRef D6-81766
end pad
base
material
wall
analysis context
mode: (ultimate static strength)
condition:
heuristic: overall fitting factor, Jm
bolt
fitting
headradius, r1
hole radius, ro
width, b
eccentricity, e
thickness, teheight, h
radius, r2
thickness, tb
hole
thickness, twangled height, a
max allowable ultimate stress,
allowable ultimate long transverse stress,
max allowable yield stress,
max allowable long transverse stress,
max allowable shear stress,
plastic ultimate strain,
plastic ultimate strain long transverse,
young modulus of elasticity,
load, Pu
Ftu
Fty
FtyLT
Fsu
epu
epuLT
E
FtuLT
product structure (channel fitting joint)
Flexible High Diversity Design-Analysis Integration Aerospace Examples:
“Bike Frame” / Flap Support Inboard Beam
Analysis Modules (CBAMs) of Diverse Feature:Mode, & Fidelity
Design Tools
Materials DBFEA
Elfini*MATDB-like
Analyzable Product Model
XaiTools
XaiTools
Fitting:Bending/Shear
3D
1.5D
Modular, ReusableTemplate Libraries
MCAD ToolsCATIA
Lug:Axial/Oblique; Ultimate/Shear
1.5D
Assembly:Ultimate/
FailSafe/Fatigue*
* = Item not yet available in toolkit (all others have working examples)
diagonal brace lug jointj = top
0.7500 in
0.35 in
0.7500 in
1.6000 in
2
0.7433
14.686 K
2.40
4.317 K
8.633 K
k = norm
Max. torque brake settingdetent 30, 2=3.5º
7050-T7452, MS 7-214
67 Ksi
L29 -300
Outboard TE Flap, Support No 2;Inboard Beam, 123L4567
Diagonal Brace Lug Joint
Program
Part
Feature
Lug JointAxial Ultimate Strength Model
Template
j = top lugk = normal diameter (1 of 4)
Dataset
material
deformation model
max allowable ultimate stress, FtuL
effective width, W
analysis context
objective
mode (ultimate static strength)
condition
estimated axial ultimate strength
Margin of Safety(> case)
allowable
actual
MS
normal diameter, Dnorm
thickness, t
edge margin, e
Plug joint
size,n
lugs
lugj hole
diameters
product structure (lug joint)
r1
n
P jointlug
L [ j:1,n ]
Plug
L [ k]Dk
oversize diameter, Dover
D
PaxuW
e
t
Ftuax
Kaxu
Lug Axial UltimateStrength Model
BDM 6630
Fasteners DB
FASTDB-like
General Math Mathematica
In-HouseCodes
Image API(CATGEO)
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Flexible High Diversity Design-Analysis Integration
Electronic Packaging Examples: Chip Packages/Mounting (Project with Shinko Electric)
EBGA, PBGA, QFP
CuGround
PKG
Chip
Analysis Modules (CBAMs) of Diverse Mode & Fidelity
FEAAnsys
General MathMathematica
Analyzable Product Model
XaiTools
XaiToolsChipPackage
ThermalResistance
3D
Modular, ReusableTemplate Librariestemperature change,T
material model
temperature, T
reference temperature, To
cte,
youngs modulus, E
force, F
area, A stress,
undeformed length, Lo
strain,
total elongation,L
length, L
start, x1
end, x2
mv6
mv5
smv1
mv1mv4
E
One D LinearElastic Model(no shear)
T
e
t
thermal strain, t
elastic strain, e
mv3
mv2
x
FF
E, A,
LLo
T, ,
yL
r1
12 xxL
r2
oLLL
r4
A
F
sr1
oTTT
r3L
L
m a t e r i a l
e f f e c t i v e l e n g t h , L e f f
d e f o r m a t i o n m o d e l
l i n e a r e l a s t i c m o d e l
L o
T o r s i o n a l R o d
G
J
r
2
1
s h e a r m o d u l u s , G
c r o s s s e c t i o n :e f f e c t i v e r i n g p o l a r m o m e n t o f i n e r t i a , J
a l 1
a l 3
a l 2 a
l i n k a g e
m o d e : s h a f t t o r s i o n
c o n d i t i o n r e a c t i o n
t s 1
A
S l e e v e 1
A t s 2
d s 2
d s 1
S l e e v e 2
L
S h a f t
L e f f
s
T
o u t e r r a d i u s , r o a l 2 b
s t r e s s m o s m o d e l
a l l o w a b l e s t r e s s
t w i s t m o s m o d e l
M a r g i n o f S a f e t y( > c a s e )
a l l o w a b l e
a c t u a l
M S
M a r g i n o f S a f e t y( > c a s e )
a l l o w a b l e
a c t u a l
M S
a l l o w a b l et w i s t Analysis Tools
Design Tools
PWB DB
Materials DB*
Prelim/APM Design ToolXaiTools ChipPackage
ThermalStress
Basic3D**
** = Demonstration module
BasicDocumentation
AutomationAuthoringMS Excel
14Engineering Information Systems Lab eislab.gatech.edu© GIT
Outline
Generalized Analysis Integration Challenges Techniques and Applications
Experiences with AP210 Summary
15Engineering Information Systems Lab eislab.gatech.edu© GIT
ProAM Design-Analysis IntegrationElectronic Packaging Examples: PWA/B
Analysis Modules (CBAMs) of Diverse Mode & Fidelity
Design Tools
Laminates DB
FEA Ansys
General MathMathematica
Analyzable Product Model
XaiToolsPWA-B
XaiToolsPWA-B
Solder JointDeformation*
PTHDeformation & Fatigue**
1D,2D
1D,2D,3D
Modular, ReusableTemplate Libraries
ECAD Tools Mentor Graphics,
Accel*
temperature change,T
material model
temperature, T
reference temperature, To
cte,
youngs modulus, E
force, F
area, A stress,
undeformed length, Lo
strain,
total elongation,L
length, L
start, x1
end, x2
mv6
mv5
smv1
mv1mv4
E
One D LinearElastic Model(no shear)
T
e
t
thermal strain, t
elastic strain, e
mv3
mv2
x
FF
E, A,
LLo
T, ,
yL
r1
12 xxL
r2
oLLL
r4
A
F
sr1
oTTT
r3L
L
m a t e r i a l
e f f e c t i v e l e n g t h , L e f f
d e f o r m a t i o n m o d e l
l i n e a r e l a s t i c m o d e l
L o
T o r s i o n a l R o d
G
J
r
2
1
s h e a r m o d u l u s , G
c r o s s s e c t i o n :e f f e c t i v e r i n g p o l a r m o m e n t o f i n e r t i a , J
a l 1
a l 3
a l 2 a
l i n k a g e
m o d e : s h a f t t o r s i o n
c o n d i t i o n r e a c t i o n
t s 1
A
S l e e v e 1
A t s 2
d s 2
d s 1
S l e e v e 2
L
S h a f t
L e f f
s
T
o u t e r r a d i u s , r o a l 2 b
s t r e s s m o s m o d e l
a l l o w a b l e s t r e s s
t w i s t m o s m o d e l
M a r g i n o f S a f e t y( > c a s e )
a l l o w a b l e
a c t u a l
M S
M a r g i n o f S a f e t y( > c a s e )
a l l o w a b l e
a c t u a l
M S
a l l o w a b l et w i s t Analysis Tools
PWBWarpage
1D,2D
Materials DB
PWB Layup ToolXaiTools PWA-B
STEP AP210‡ GenCAM**,
PDIF*
‡ AP210 DIS WD1.7 * = Item not yet available in toolkit (all others have working examples) ** = Item available via U-Engineer.com
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Information Requirementsof TIGER/ProAM Analysis Modules
PWB Warpage(Formula-Based)
PWB Warpage(FEA-Based)
Solder-JointDeformation
PWAWarpage
PTHDeformation
Detailed PWB Layup
Layer Functions
PWB Outline
Package Geometry
Package Materials
Lead/Termination Shape
Lead/Termination Material
Component Location
Solder Joint Shape
Solder Joint Material
PTH Geometry
PTH Plating Material
17Engineering Information Systems Lab eislab.gatech.edu© GIT
Analyzable Product Model (APM) Technique
Combine informationand add idealizations
Use idealizations
Solder-Joint Deformation Model
PWB Warpage Model
PWA Deformation Model
Analysis Models
Analyzable Product Model(APM)
Design Representations
1 Oz. Cu
1 Oz. Cu
1 Oz. Cu
1 Oz. CuM100P1P11184
3 x 1080
3 x 1080
Detailed component
PWA Layout
PWB Design
Ec , c , c
EB , B , B
EB , B , B
ES , S , S
Ec , c , c
T
T
T
EB , B , B
18Engineering Information Systems Lab eislab.gatech.edu© GIT
CAD-APM Integration TechniqueAnalyzable
Product Model
Mapping
CustomSchema DN
SourceFiles Target
File
MappingTool
Analyzable-
ProductDatabase
Analysis Application
A1
Analysis Application
AM
Design Application
D1
TranslatorD1-to-STEP
STEP File D1Design File D1
CustomSchema D1 STEP Schema
Design Application
DN
TranslatorDN-to-STEP
Design File DN STEP File DN
STEP Schema
Design
1
Translation
2
3
Analysis
4
MappingDefinitionLanguage
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characterized_definition
AP210 Board Outline Information
shape_definition_representation product_definition_shape
geometric_curve_set
property_definition_representation
shape_aspect
inter_stratum_feature
curve
bounded_curve
polyline trimmed_curvecartesian_point
geometric_set_select
shape_definition
trimming_select
geometrically_bounded_2d_wireframe_shape_representation
REAL
definition definition
used_representation
items[0] elements
S[ 0 : ? ]
points
L[ 2 : ? ]L[ 1 : 3 ]
coordinates
trim_2
trim_1
S[ 1 : 2 ]
S[ 1 : 2 ]
‘board outline’
‘PCB outline’
name
name
Board outlinecoordinates
curve
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capacitorresistor
surface mountpackage
discretecomponent
integratedcomponent
pwb copperfoil
plated throughpassage
through-holepackage
location
PWA-B APM in TIGER/ProAM Projects
electricalcomponent
assembly
pwa
part
pwbfeature
componentoccurrence
solidmaterial
pwb coppercladded laminate
pwb prepregset
electricalpackage
pwb
pwblayer
pwbpassage
linear elasticmodel
solderjoint
leads
(partial)
21Engineering Information Systems Lab eislab.gatech.edu© GIT
AP210 - APM Mappings
curve
bounded_curve
polyline trimmed_curvecartesian_point
trimming_select
REALpoints
L[ 2 : ? ]L[ 1 : 3 ]
coordinates
trim_2
trim_1S[ 1 : 2 ]
S[ 1 : 2 ]
pwbxy_coordinateREAL outline
L[ 1 : ? ]
x
y
Source schema (AP210)
Target schema (APM)Mappingassignment
curve
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Iterative Design & AnalysisPWB Warpage
AnalyzableProduct Model
PWB Layup Design Tool
1 Oz. Cu
1 Oz. Cu
1 Oz. Cu
1 Oz. Cu
2 Oz. Cu
2 Oz. CuTetra GF
Tetra GF
3 x 1080
3 x 1080
2 x 2116
2D Plane Strain Model
b L T
t
2
Detailed FEA Check
bi i i
i
w y
t w
/ 2
1D Thermal Bending Model
LayupRe-design
PWB Warpage Modules
Quick Formula-based Check
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PWB Warpage Modulesa.k.a. CBAMs: COB-based analysis templates
total_thicknesspwa
layup layers[0]
layers[1]
layers[2]
TOTAL
CU1T
CU2T
POLYT
PREPREGT
TETRA1T
EXCU
ALPXCU
EXEPGL
ALPXEGL
TO
deformation model
ParameterizedFEA Model
ux mos model
Margin of Safety(> case)
allowable
actual
MS
UX
condition
UY
SX
associated_pwb
nominal_thickness
prepregs[0] nominal_thickness
top_copper_layer nominal_thickness
related_core nominal_thickness
prepregs[0] nominal_thicknesslayers[3]
primary_structure_material linear_elastic_model E
cte
primary_structure_material linear_elastic_model E
cte
reference temperature
temperatureDELTAT
APM ABB
SMM
deformation model
Thermal Bending Beam
L
b
T
Treference
t
T
total diagonalassociated_pwb
total thickness
coefficient of thermal bending
al1
al2
al6
al3
t
TLb
2
warpage
wrapage mos model
allowable
MSactual
Marginof Safety
associated condition
al5
al4
temperature
reference temperature
pwa
APM
ABBPWB Thermal Bending Model (1D formula-based)
PWB Plane Strain Model (2D formula-based)
24Engineering Information Systems Lab eislab.gatech.edu© GIT
Experiences Using AP210 to Drive Analysis
AP210 originally geared toward manufacturing, but good source for analysis too.
Some information not available:– in AP210 (e.g., detailed PTH geometry)*
– in typical ECAD database (e.g., detailed PWB layup)
Some design performed by supply chain members– E.g., detailed PWB layup
– Need mechanism to add such info to a common repository
Need to coordinate unique identifiers in AP210 data with data from other sources (e.g., part numbers in laminate database)
*Note: Used c.1997 AP210 DIS WD1.7. The latest AP210 version may now support such information.
25Engineering Information Systems Lab eislab.gatech.edu© GIT
Design-Analysis IntegrationUsing STEP and APMs
Domain-specific models (AP210, AP207) are semantically richer than geometry-focused ones (and therefore easier to use for analysis).– Trend toward feature-based, object-oriented CAD
– “Smart product models”
Analysis has insatiable information appetite (multi-fidelity)– A given product model cannot support every conceivable future
idealization need.
– APMs enable additions as needed
Companies can implement mix of company PMs and APMs (along with standard PMs) to support design-analysis requirements for a given set of analysis modules.– Analysis module information needs dictate APM content
26Engineering Information Systems Lab eislab.gatech.edu© GIT
XAI Summary Emphasis on X-analysis integration (XAI) for design reuse (DAI,SBD) Multi-Representation Architecture (MRA)
– Addressing fundamental XAI/DAI issues» Explicit CAD-CAE associativity: multi-fidelity, multi-directional, fine-grained
– General methodology --> Flexibility & broad application Research advances & applications
– Product data-driven analysis (STEP AP210, GenCAM, etc.)– Internet-based engineering service bureau (ESB) techniques– Object techniques for next-generation aerospace analysis systems– FEA modeling time reduction in pilot tests (chip packages):
> 10:1 (days/hours to minutes)
Improved Simulation-Based Designs Tools and development services
– Analysis integration toolkit: XaiTools™ and applications– Pilot commercial ESB: U-Engineer.com– Company-tailored engineering information system solutions
Motivated by industry & government collaboration
27Engineering Information Systems Lab eislab.gatech.edu© GIT
For Further Information ... EIS Lab web site: http://eislab.gatech.edu/
– Publications, project overviews, tools, etc.– See: Publications DAI/XAI Suggested Starting Points
X-Analysis Integration (XAI) Technologyhttp://eislab.gatech.edu/pubs/reports/EL002/
– Regarding AP210 usage, see especially:» Tamburini, D. R.; Peak, R. S.; Fulton, R. E. (1997) Driving PWA Thermomechanical Analysis from
STEP AP210 Product Models. 1997 ASME Intl. Mech. Engr. Congress & Expo., Dallas. http://eislab.gatech.edu/pubs/conferences/wam97-tamburini/
» Product Data Driven Analysis in a Missile Supply Chain, http://eislab.gatech.edu/projects/proam/
XaiTools™ home page: http://eislab.gatech.edu/tools/XaiTools/
Pilot commercial ESB: http://www.u-engineer.com/– Internet-based self-serve analysis– Analysis module catalog for electronic packaging– Highly automated front-ends to general FEA & math tools
28Engineering Information Systems Lab eislab.gatech.edu© GIT
Nomenclature ABB-SMM transformation idealization relation between design and analysis attributes APM-ABB associativity linkage indicating usage of one or more i
ABB analysis building blockAMCOM U. S. Army Aviation and Missile CommandAPM analyzable product modelCAD computer aided designCAE computer aided engineeringCBAM context-based analysis modelCOB constrained objectCOI constrained object instanceCOS constrained object structureCORBA common ORB architectureDAI design-analysis integrationEIS engineering information systemsESB engineering service bureauFEA finite element analysisFTT fixed topology templateGUI graphical user interfaceIIOP Internet inter-ORB protocolMRA multi-representation architectureORB object request brokerOMG Object Management Group, www.omg.comPWA printed wiring assembly (a PWB populated with components)PWB printed wiring boardSBD simulation-based designSBE simulation-based engineeringSME small-to-medium sized enterprise (small business)SMM solution method modelProAM Product Data-Driven Analysis in a Missile Supply Chain (ProAM) project (AMCOM)PSI Product Simulation Integration project (Boeing)STEP Standard for the Exchange of Product Model Data (ISO 10303).VTMB variable topology multi-bodyXAI X-analysis integration (X= design, mfg., etc.)XCP XaiTools ChipPackage™
XFW XaiTools FrameWork™
XPWAB XaiTools PWA-B™