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Smart & Innovative Foundry Solution Smart & Innovative Foundry Solution Proven Track Record at 32/28nm Samsung Foundry

Transcript of Proven Track Record at 32/28nm - WikiChip · Proven Track Record at 32/28nm Samsung Foundry . Smart...

Page 1: Proven Track Record at 32/28nm - WikiChip · Proven Track Record at 32/28nm Samsung Foundry . Smart & Innovative Foundry Solution Contents . andscape eadiness . L R ...

Smart & Innovative Foundry Solution Smart & Innovative Foundry Solution

Proven Track Record at 32/28nm

Samsung Foundry

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Contents

andscape

eadiness

L

R

▶ 32/28nm Market Driver

▶ 32/28nm Process & Design Infrastructure

▶ 32/28nm Success Story

onclusion C

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32/28nm Market Driver

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Mobile SoC Design Trend

More integrated functionality in smaller area

More performance at lower VDD

> 20GB/sec

DRAM Bandwidth

> Full HD 1080P (w/ 3D & 3D GFX)

Multimedia Contents

> 25,000 DMIPS

Mobile CPU

Higher Speed & Higher Integration

Lower Power for Longer Battery Life &

Thermal Management

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HKMG Process Benefits – Low Power

Reduced leakage and boosted performance -1.4x device performance or 1/10 total leakage over Poly-Si/SION

Delay (ps/stage)

Conventional Poly-Si/SiON

100

10

1

0.1

0.01

Iddq (a.u.)

1.4x device performance

32/28nm HKMG

1/10 total leakage

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HKMG Process Benefits – The Big Leap

*28nm comparison to 45nm

Advanced 1st Gen

HK/MG 1.4X

Performance Improvement

0.4X Area Reduction

(Std. cell)

0.6X Active power

Reduction

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32/28nm Process & Design Infra

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Process Technology Solution

4 Vth 4 Vth

100nm 90nm

0.149um2 0.120um2

Device Offering

M1x pitch

SRAM Bitcell

Logic CPP

Vdd Core 1.0V

32LP 28LPP

126nm 113.4nm

Advanced Low Power HK/MG Process Technology

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PDK Solution

Comprehensive PDK are proven in multiple

complex SOCs in high volume

SPICE V V

DRC V V

LVS V V

PEX V V V

P&R Techfile V V

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Library Solution

Product Proven Library

ARM Libraries with complementary Samsung IP

Logic Libraries

Memory Compilers

Programmable Options

Interfaces

Multi channel & multi Vt

9 and 12 tracks

Power Management

ECO Kits

Superior SRAM Architecture

DDR 3+

HD, HS Memory Compilers

Multi-Periphery Options

eFUSE

OTP General Purpose

I/Os

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IP Solution

Collaboration is delivering industry leading solutions

From analog to processor cores

Various silicon proven IP

Processor Cores : ARM7/9/11 Series : Cortex M/R/A Series

Multimedia IP : JPEG Codec : NTSC/PAL encoder

Embedded Memory : (HD/HS/LP)SRAM, VROM : eFuse, OTP

Mixed-Signal Core : ADC, DAC, AFE : PLL : Audio CODEC : Temp sensor, LDO Memory Interface : DDR2/3, LPDDR2/3

I/O : In-line, staggered, multi-row : Wide-range GPIO

Processor

M/M IP

High Speed Interface

DDR Memory Interface

Memory

MS Core

System IP : Interconnect IP : Memory controllers : System Controllers : Peripherals : CoreSight

Standard Cell Library : HD/HS : Multi Vth : Multi channel length : Power management kit

High Speed Interface IP : SATA, PCIe : USB2/3, HSIC : LVDS, mini-LVDS, sub-LVDS : MIPI D/M-PHY : HDMI, DisplayPort

32LP – Mass Production 28LPP – Silicon Validation

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Advanced DFM Solution

Advanced IP & Chip-level DFM Methodology

Family Kit IP Chip

32/28nm 32/28nm

Rule-based Verification

DRC M M LUP (Litho Unfriendly Pattern) M M

PHC pattern matching (Process Hotspot Check) M M

MCD/MAS (Recommended Rule Deck) R -

VIA M M

Model-based Verification

LHC (Litho Hotspot Checker) M -

FLHC (Fast Litho Hotspot Checker) M M

CMP R M

CAA R R

Layout Enhancement

LUP-enabled router M M PHR (Process Hotspot Repair) M M

Dummy Fill M M

M : Mandatory, R : Recommend

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Advanced Design Methodology

Product proven DM through market leading products

TSU

TSUTMU

CPU

TCU

TSU

G3D

ThermalData

Thermal Policy

Control Directive

ABBG

ABBG

VDD group 0 VDD group N

SS Corner FF Corner

Process Variation

Adaptive Supply Voltage

RBB

ABB Of f

1.25V

1.3V

Adaptive Body Bias

25C 45C 65C 85C 105C

Tota

l Pow

er [a

.u.]

1 2

3 4

5 6

0

Total power down in hot temp

▶ Advanced DM complemented by

adaptive supply voltage (ASV) and

adaptive body bias (ABB)

▶ ABB is beneficial to sustain thermal

runaway by reducing leakage current

and minimizing Freq drop

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32/28nm Success Story

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32nm HKMG AP with GHz multi-core CPU

Power comparison to 45nm AP -On CPU(2D Flash play) : 45%↓ -On GPU(3D Cube rendering) : 48%↓

32 HKMG

45 PSiON

45 PSiON

32 HKMG

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Conclusion

Product Proven Design and Process Technology in 32nm/28nm

▶ High-K/Metal Gate ▶ PDK / Library / IP / Design Methodology

Collaboration is delivering industry leading solutions

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Thank You