Proposal to Flexible PCB Materialsentechelectronics.com.au/pdf/Panasonic Felios Flexible... ·...

Confidential Matsushita Electric Works, Ltd.

Proposal to Proposal to

Flexible PCB MaterialsFlexible PCB Materials

June, 2008June, 2008


1. Core Technology and Capability 1. Core Technology and Capability

2. Total Solution for FPC & Rigid Flex2. Total Solution for FPC & Rigid Flex

3. Technology and Product Advantage 3. Technology and Product Advantage

4. Product Offering Availability4. Product Offering Availability

5. What5. What’’s New?s New?

ContentsContents


1.Core Technology and Capability 1.Core Technology and Capability


Halogen-free Resin Design Technology Core

Technology

ProductionProduction

EngineeringEngineering

Evaluation Evaluation

TechnologyTechnology

Extended

Lamination System(Roll type)

Batch Press System(Sheet type)

Quality Evaluation Technology(Ex.Connection with ACF)

Stress Analysis Simulation

Material Material

TechnologyTechnology

11--1.1. Core TechnologyCore Technology

Confidential Matsushita Electric Works, Ltd.JapanJapan Non JapanNon Japan

FPC UsersFPC Users

Rigid Flex UsersRigid Flex Users

90% share90% share

PWB customers

making Rigid Flex

Small LCD

Hinge

Overseas

PWB customers

making

Rigid Flex

•Total Solution(All HF Materials -Rigid & FCCL)

•Existing Sales Channel

•Focus Application

•Evaluation Technology(Ex; Bending test method

cooperative development with

customer and OEM)Small LCD

Hinge

11--2. FPC Material Marketing Strategy2. FPC Material Marketing Strategy

Multi Layer Multi Layer


0000

20202020

40404040

60606060

80808080

100100100100

120120120120

140140140140

160160160160

180180180180

200200200200

2005 2006 2007 2008

(10K m2/Year)

*Source: Yano Economy Research Report with modification by MEW

11--3. 2Layer D/S FCCL Market 3. 2Layer D/S FCCL Market

No.No.112L D/S Laminator2L D/S Laminator

Production Volume by Supplier

in 2008


11--4. Production Capacity4. Production Capacity

Yokkaichi

1.Roll Style

2.ELS

Koriyama

Yokkaichi

Koriyama

1.Sheet Style

2.BPS

（10K ㎡/year）

0

100

200

300

400

500

2007 2008 2009 2010

180180

240240

360360

120120

BPS

ELS

ELS(Newly Equiped)


■■■■Environmental Friendly

All Halogen Free Type

■■■■ISO

【【【【Koriyama Factory】】】】 ISO9001

ISO14000

ISO14000

TS16949

【【【【Yokkaichi Factory】】】】 ISO9001

TS16949

April 2005

April 2005

May 2007

August 2006

February 2007

March 2007

11--5. ISO & Environmental Friendly5. ISO & Environmental Friendly


2. Total Solution for FPC & Rigid Flex2. Total Solution for FPC & Rigid Flex


22--1. Total Solution for FPC 1. Total Solution for FPC

Proposal for LCD Module with improved ACF connection

■■■■■■■■Test ConditionTest Condition

Supporting board

Test IC

FPC

Pull

Adhesive

ＡＣＦ

1.Test IC and a FPC base material side

are pasted up by ACF

2.After humidity & thermal stress,

measure peel strength.

ACF Peel StrengthACF Peel Strength

N/mm

（（（（80808080℃℃℃℃95%95%95%95%））））

(Hours)(Hours)

0

0.2

0.4

0.6

0.8

1

1.2

0

100

200

300

400

500

600

700

800

900

1000

Company CPanasonic

Company D

R-F785 with Newly Developed Copper

Newly developedNewly developed Copper foil by collaboration with copper supplierCopper foil by collaboration with copper supplier


Proposal 3

Flexible PCB partFlexible PCB part

Low Flow Prepreg

R-1551L

Proposal 1Proposal 1

2Layer FCCL 2Layer FCCL

R-F775

R-F785

R-F705

22--2. Total Solution for Rigid2. Total Solution for Rigid--FlexFlex

Rigid PCB partRigid PCB part

RigidRigid

Flexible

Rigid-Flex Board

Halogen-free FR-4 CCL

R-1566

Proposal 5

Materials for Build-Up

ARCC R-0582

Proposal 4NewNew

Proposal 2Proposal 2

CC--F170,F175F170,F175

CC-- F176,F156,F166F176,F156,F166NewNew

NewNew

FCCL based FCCL based MasslamMasslam


3.Technology and Product Advantage3.Technology and Product Advantage


RR--F775,770F775,770：： Polyimide (Polyimide (UpilexUpilex))

RR--F785,780F785,780：： Polyimide (Polyimide (PixeoPixeo))

RR--F705,700F705,700：： LCP (LCP (VecstorVecstor))

33--11--1. 2Layer FCCL 1. 2Layer FCCL (Face Lamination System)(Face Lamination System)

ELS(Extended Lamination System)

ELSELS(Extended Lamination System)

BPS(Batch Press System)

BPSBPS(Batch Press System)

NewNew

NewNew


Feature of Panasonic ELS

- Stable Quality- Uniform lamination by pressing with large area

- ＜Class100 clean environment in ELS processing

- ELS with various kinds of Films and Copper foils

33--11--2. Panasonic ELS 2. Panasonic ELS (Extended Lamination System)

•Upilex

•Pixeo

•Vecstor, etc

ELS ELS Typical Roll

Lamination SystemFilmFilm

Copper foilCopper foil

•RA type (General, Special)

•ED type (General, Special)

Very Thin (9μm, 12μm)


1414μμμμμμμμm PI based FCCL (Rm PI based FCCL (R--F785F) F785F) ・Copper=Special RA １８ μｍ・Test method ：IPC‐TM‐650

0.2

0

0.2

0.2

0

0.2

0.2

0

0.20.2

0

①

②

③ ④ ⑤

⑥

⑦⑧0.2

0

0

0

0-0.2

MD

After 150After 150℃℃℃℃℃℃℃℃ 30min30minAfter EtchingAfter Etching

0.2

0

0.2

0.2

0

0.2

0.2

0

0.20.2

0

①

②

③ ④ ⑤

⑥

⑦⑧0.2

0

0

0

0-0.2

MD

0.2

0

0.2

0.2

0

0.2

0.2

0

0.20.2

0

①

②

③ ④⑤

⑥

⑦⑧0.2

0

0

0

0-0.2

MD

0.2

0

0.2

0.2

0

0.2

0.2

0

0.20.2

0

①

②

③ ④⑤

⑥

⑦⑧0.2

0

0

0

0-0.2

MD

Company A Company A R-F785F(ELS)

R-F785F(ELS)

33--22--1. Excellent Dimensional Stability 1. Excellent Dimensional Stability


After EtchingAfter Etching After 150After 150℃℃℃℃℃℃℃℃ 30min30min

R-F785F Company A R-F785F Company A

0.050

0.000

0.100

0.150

0.200

-0.050

-0.100

-0.150

-0.200

0.050

0.000

0.100

0.150

0.200

-0.050

-0.100

-0.150

-0.200

MD TD MD TD MD TDMD TD

% %


1414μμμμμμμμm PI based FCCL (Rm PI based FCCL (R--F785F) F785F)

(ELS) (ELS)

・Copper=Special RA １８ μｍ・Test method ：IPC‐TM‐650



2525μμμμμμμμm PI based FCCL (Rm PI based FCCL (R--F775) F775)


Company B Company B R-F775(ELS)

R-F775(ELS)

0.1

0

0.1

0.1

0

0.1

0.1

0

0.10.1

0

①

②

③ ④ ⑤

⑥

⑦⑧0.1

0

0

0

0 -0.1

MD

0.1

0

0.1

0.1

0

0.1

0.1

0

0.10.1

0

①

②

③ ④ ⑤

⑥

⑦⑧0.1

0

0

0

0 -0.1

MD

0.1

0

0.1

0.1

0

0.1

0.1

0

0.10.1

0

①

②

③ ④ ⑤

⑥

⑦⑧0.1

0

0

0

0 -0.1

MD

0.1

0

0.1

0.1

0

0.1

0.1

0

0.10.1

0

①

②

③ ④ ⑤

⑥

⑦⑧0.1

0

0

0

0 -0.1

MD

・Copper=RA １８ μｍ・Test method ：Panasonic method


After EtchingAfter Etching After 150After 150℃℃℃℃℃℃℃℃ 30min30min

0.050

0.000

0.100

0.150

0.200

-0.050

-0.100

-0.150

0.050

0.000

0.100

0.150

0.200

-0.050

-0.100

-0.150

-0.200 -0.200

% %

MD TD MD TD

R-F775 Company B

MD TD MD TD

R-F775 Company B

(ELS) (ELS)

2525μμμμμμμμm PI based FCCL (Rm PI based FCCL (R--F775) F775) ・Copper=RA １８ μｍ・Test method ：Panasonic method



Open Closed

Crank Bending

Open Closed

ααααBending

Open Closed

Slide Bending

FPC FormFPC Form FPC Form

33--33--1. Bending Flexibility 1. Bending Flexibility


Coverlay

(PI12.5,Ad25)

Plan view

Double sided

FCCL R-F775

L/S=100/100um

Side view

0

50000

100000

150000

200000

250000

Number of times (time)

R-F775

18-20-18

(General RA)

R-F775F

18-20-18

(Special RA)

R-F775

18-25-18

(General RA)

■■■■ Test result

33--33--2. Enhanced Flexibility 2. Enhanced Flexibility ((ααBendingBending))

OPEN CLOSE

170170170170°°°°

・・・・Angle：：：： 0 ⇔⇔⇔⇔ 170 °°°°

・・・・Frequency：：：： 60rpm

・・・・αααα-bending diameter ：：：：8ΦΦΦΦ

Test machine

■■■■ Test condition

Note) CoverNote) Cover--lay (PI12.5,Ad25lay (PI12.5,Ad25μμm) was used for the testing.m) was used for the testing.


Analysis ①①①① Thin copper （（（（18μμμμm ⇒⇒⇒⇒ 12μμμμm））））

Analysis ②②②② Thin Film （（（（25μμμμm ⇒⇒⇒⇒ 20μμμμm））））

１８１８１８１８－－－－２５２５２５２５－－－－１８１８１８１８１２１２１２１２－－－－２５２５２５２５－－－－１２１２１２１２Cu－－－－Film－Ｃｕ－Ｃｕ－Ｃｕ－Ｃｕ (μμμμm)

１８１８１８１８－－－－２５２５２５２５－－－－１８１８１８１８１８１８１８１８－－－－２０２０２０２０－－－－１８１８１８１８Cu－－－－Film－Ｃｕ－Ｃｕ－Ｃｕ－Ｃｕ (μμμμm)

50.45 MPa57.52 MPastress

51.95 MPa57.52 MPastress

33--33--3. Finite Element Method (3. Finite Element Method (ααBendingBending))


33--33--4. Enhanced Flexibility 4. Enhanced Flexibility (Slide Bending)(Slide Bending)

PatternPatternPatternPattern

■■■■Test Method

A circuit is

an outside

-Stroke :50ｍｍｍｍｍｍｍｍ-Speed :60ｒｒｒｒpm-Temperature :room temp

-Radius of curvature :1.0mm

-Life judging :20%UP

0

100000

200000

300000

400000

R-F785F

18-14-18

(Special RA)


R-F785

18-14-18

(General RA)

R-F775

18-20-18

(General RA)

R-F775

18-25-18

(General RA)

■■■■ Test result


■■■■Test Sample

0.1mm 0.1mm

TDTD

Confidential Matsushita Electric Works, Ltd.4μm 4μm

Special RA Special RA General RAGeneral RA

Crack formation along

grain boundary

33--33--5. Special RA copper pressed by ELS5. Special RA copper pressed by ELS

Special RA, pressed by ELS, is reSpecial RA, pressed by ELS, is re--crystallized,crystallized,

and features superior performance for slide hinge.and features superior performance for slide hinge.


■■■■ Test condition ■■■■ Test result

33--33--6. Enhanced 6. Enhanced Flexibility Flexibility (Crank Bending)(Crank Bending)

Test machine

Plan view

Double sidde

FCCL R-F775

L/S=100/100um

Side view

170170170170°°°°・・・・Angle :0 <=> 170°°°°

・・・・Frequency : 60rpm

・・・・Circuit :Both side ・・・・Judgment Resistance 10%UP

0

50000

100000

150000


R-F775

18-25-18

R-F775F

18-25-18

R-F775

12-25-12

R-F775

12-20-12

R-F785

12-14-12

(General RA) (Special ED)

Coverlay

(PI12.5,Ad25)


(Special RA)

R-F775

18-25-18


General EDGeneral ED Special ED Special ED

MD MD

TD TD

Special ED, pressed by ELS(<300Special ED, pressed by ELS(<300℃℃））, is re, is re--crystallized, crystallized,

and has the almost same crystal structure as General RAand has the almost same crystal structure as General RA’’s.s.

General RA General RA

33--33--7. Special ED copper pressed by ELS7. Special ED copper pressed by ELS


ELSELS

(R-F775/R-F785)

CastingTypical

Roll

Lamination

1.0

1.7

1.0 0.9

(N/mm)• Test Method: IPC-TM-650

1.7N/mm (ELS) vs 0.9-1.0N/mm (Other system)

33--44--1. Excellent Peel Strength 1. Excellent Peel Strength


33--5. Spring Back Performance 5. Spring Back Performance

CCLCCLCCLCCL

■■■■■■■■Loop TestLoop Test

1gf

Loop Dia at no pressure

F785, F780F785, F780 F775, F770F775, F770

0000

20202020

40404040

60606060

80808080

14μμμμm

18μμμμm

20μμμμm

25μμμμm

Stiffness （（（（%

））））

F785, F780F785, F780 F775, F770F775, F770

0000

20202020

40404040

60606060

80808080

14μμμμm

18μμμμm

20μμμμm

25μμμμm

Stiffness （（（（mg））））

■■■■■■■■Gurley TestGurley Test


4.Product Offering Availability 4.Product Offering Availability


RR--F775 RF775 R--F770F770

RR--F785 RF785 R--F780F780

44--1. Product Offering Availability 1. Product Offering Availability

Max 510㎜㎜㎜㎜

250㎜㎜㎜㎜500㎜㎜㎜㎜, , 510㎜㎜㎜㎜

Roll

Sheet

○○○○

-

○○○○

-○○○○

1414μμμμμμμμ 2020μμμμμμμμ 2525μμμμμμμμ

-

○○○○

5050μμμμμμμμ

Polyimide Thickness

NewNew

1818μμμμμμμμ

○○○○

--

○○○○○○○○ -

○○○○

Copper foil

○○○○

○○○○

○○○○○○○○

99μμμμμμμμmm

(1/4oz)(1/4oz)


(1/3oz)(1/3oz)


(1/2oz)(1/2oz)


(1oz)(1oz)

EDED

RARA

Product Size

Type TD (width)

Double Sided Single Sided

■■■■ Part Number


5.What5.What’’s News New


-Dissipation Factor (Df)

-Dielectric Constant (Dk)

JIS C6471

IPA 23℃ for 5 min

NaOH 2mol/l 23℃ for 5 min No abnormalityNo abnormality-

HCl 2mol/l 23℃ for 5min

Chemical Resistance

IPC-TM-6501.70.8N/m

m

APeel Strength

260℃ Solder for 5 sec

-94V-094VTM-0-A and E-168/70Frame Resistant （UL）

JIS C6471

No abnormalityNo abnormality-260℃ solder float for 1 minSolder Heat Resistance

Internal Method

No abnormalityNo abnormality-288℃ solder float for 1 min

No abormalityNo abnormality-C-96/40/90

260℃ solder float for 1 min

Water Absorption

Solder Heat Resistance

-1.00.04%25℃/50h dippingMoisture Absorption

0.000

-0.023

0.016

0.0027

3.2

4.0E+13

-0.007

0.0015

3.2

R-F775

PI25μμμμm, Cu18μμμμ

IPC-TM650

Method2.5.5.5

IPC-TM650

Method2.5.5.5

0.0016A 10GHz

3.0A 10GHz

0.0008A 2GHz

3.0A 2GHz

0.014E-0.5/150 (MD direction)

-0.005After etching (TD direction)IPC-TM650

0.001

%

After etching (MD direction)

Dimensional Stability

0.019E-0.5/150 (TD direction)

4.9E+14ΩASurface Resistivity

Test MethodR-F705

LCP50μμμμm, Cu18μμμμUnitTest ConditionProperty

55--1. LCP based FCCL 1. LCP based FCCL （（LLiquid iquid CCrystal rystal PPolymerolymer））

RR--F705 F705 ■■■■■■■■General PropertiesGeneral Properties

Note) The above data are our actual values and not assured values.


55--2. Dimensional Stability 2. Dimensional Stability （（LCP based FCCL)LCP based FCCL)

0.1

-0.1

0.1 -0.10

0.1

-0.1

0.1-0.10

0.1

-0.1

0.1 -0.10

0.1-0.1

0.1

-0.1

0

①

②

③ ④⑤

⑥

⑦⑧0.1

-0.1

0.1 -0.10

0.1

-0.1

0.1-0.10

0.1

-0.1

0.1 -0.10

0.1-0.1

0.1

-0.1

0

①

②

③ ④⑤

⑥

⑦⑧ ⑧0.1

-0.1

0.1 -0.10

0.1

-0.1

0.1-0.10

0.1

-0.1

0.1 -0.10

0.1-0.1

0.1

-0.1

0

①

②

③ ④⑤

⑥

⑦0.1

-0.1

0.1 -0.10

0.1

-0.1

0.1-0.10

0.1

-0.1

0.1 -0.10

0.1-0.1

0.1

-0.1

0

①

②

③ ④⑤

⑥

⑦⑧


ELSELS vsvs Typical Roll LaminationTypical Roll Lamination

R-F705 Company D

(ELS)

R-F705 Company D

(ELS)

・LCP=50μｍ、Copper=ＥＤ１８ μｍ・Test method ：Panasonic method


0

0.2

0.4

0.6

0.8

1

ELSELS vsvs Typical Roll LaminationTypical Roll Lamination・LCP=50μｍ、Copper=ＥＤ１８ μｍ・Test method ：IPC-TM-650

55--3. Peel Strength 3. Peel Strength （（LCP based FCCL)LCP based FCCL)

ELSELS

(R-F705)

Typical

Roll

Lamination

(N/mm)


2.80

2.85

2.90

2.95

3.00

3.05

3.10

3.15

3.20

3.25

3.30

2GHｚ 4GHｚ 6GHｚ 8GHｚ 10GHｚ

0.0000

0.0005

0.0010

0.0015

0.0020

0.0025

0.0030

0.0035

0.0040

2GHｚ 4GHｚ 6GHｚ 8GHｚ 10GHｚ

Dk (εεεεr) Df (tanδδδδ)

55--4. 4. Dk/DfDk/Df （（LCP based FCCL)LCP based FCCL)

R-F705 (as it is )

R-F705 (C-96/40/90)

R-F705 (as it is )

R-F705 (C-96/40/90)

R-F775 (as it is )

R-F775 (C-96/40/90)

R-F775 (as it is )

R-F775 (C-96/40/90)

Dk/DfDk/Df is very stable against the moisture uptake. is very stable against the moisture uptake.


18μμμμm

50μμμμm

•LCP film: 50μm

•Copper foil: 18μm

•Characteristic Impedance: 50Ω•Preconditioning: C-96/40/90

after moisture uptake

55--5. Transmission Loss 5. Transmission Loss （（LCP based FCCL)LCP based FCCL)

■■■■Test Sample■■■■Transmission Loss

(dB/cm)

-0.35-0.35-0.35-0.35

-0.3-0.3-0.3-0.3

-0.25-0.25-0.25-0.25

-0.2-0.2-0.2-0.2

-0.15-0.15-0.15-0.15

-0.1-0.1-0.1-0.1

-0.05-0.05-0.05-0.05

0000

1GHz1GHz1GHz1GHz 2GHz2GHz2GHz2GHz 3GHz3GHz3GHz3GHz 4GHz4GHz4GHz4GHz 5GHz5GHz5GHz5GHz

R-F775

R-F705

R-F705w/Special Copper


Thank you!Thank you!

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