Product Technical Specification & Customer Design ...€¦ · 4110931 Rev 001 October 25, 2011 2...

92
4110931 001 October 25, 2011 AirPrime MC8090/MC8092 Product Technical Specification & Customer Design Guidelines

Transcript of Product Technical Specification & Customer Design ...€¦ · 4110931 Rev 001 October 25, 2011 2...

Page 1: Product Technical Specification & Customer Design ...€¦ · 4110931 Rev 001 October 25, 2011 2 Product Technical Specification & Customer Design Guidelines Important Notice Safety

4110931

001

October 25, 2011

AirPrime MC8090/MC8092

Product Technical Specification

& Customer Design Guidelines

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4110931 Rev 001 October 25, 2011 2

Product Technical Specification & Customer Design Guidelines

Important Notice

Safety and Hazards

Note: Some airlines may permit the use of cellular phones while the aircraft is on the ground and the door is open. Sierra Wireless modems may be used at this time.

Limitations of Liability

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Product Technical Specification & Customer Design Guidelines

Patents

Copyright

Trademarks

™ ™

™ ™

Contact Information

Sales Desk:

Phone: 1-604-232-1488

Hours: 8:00 AM to 5:00 PM Pacific Time

E-mail: [email protected]

Post:

Sierra Wireless

13811 Wireless Way

Richmond, BC

Canada V6V 3A4

Fax: 1-604-231-1109

Web: www.sierrawireless.com

www.sierrawireless.com

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Product Technical Specification & Customer Design Guidelines

Document History

Version Date Updates

001

September 28, 2011 Creation

October 13, 2011 Updated product naming convention

October 25, 2011

Updated GPIO and PCM pin numbers.

Updated RF performance and power consumption values.

Updated Figure 4 Dimensioned View

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Contents

1. INTRODUCTION ................................................................................................ 12

1.1. General Features ............................................................................................................ 12

1.2. Support Feature............................................................................................................... 16

1.3. Support Tools .................................................................................................................. 16

1.4. Accessories ..................................................................................................................... 16

1.5. Hardware Development Components ............................................................................. 16

1.6. Ordering Information ....................................................................................................... 16

1.7. Environmental Issues ...................................................................................................... 17

1.7.1. RoHS Directive Compliant ....................................................................................... 17

1.7.2. Disposing of the Product .......................................................................................... 17

2. FUNCTIONAL SPECIFICATIONS ...................................................................... 18

2.1. Functional Architecture .................................................................................................... 18

2.1.1. Chipsets ................................................................................................................... 18

2.2. Extended AT Commands ................................................................................................ 18

3. TECHNICAL SPECIFICATIONS ........................................................................ 19

3.1. Power Supply .................................................................................................................. 19

3.1.1. Burst Emission Current Requirements ..................................................................... 19

3.1.2. Power Input (VCC_3V6) ........................................................................................... 20

3.1.3. Start-up Current ....................................................................................................... 20

3.2. Decoupling of Power Supply Signals .............................................................................. 21

3.3. Mechanical Specifications ............................................................................................... 21

3.3.1. Mechanical Illustrations ............................................................................................ 21

3.4. Labeling ........................................................................................................................... 23

3.5. Thermal Considerations .................................................................................................. 23

3.6. Firmware Upgrade ........................................................................................................... 24

4. INTERFACES ..................................................................................................... 25

4.1. System Design ................................................................................................................ 25

4.1.1. Pin Description ......................................................................................................... 26

4.2. Digital I/O Electrical Information ...................................................................................... 31

4.2.1. Electrical Characteristics .......................................................................................... 31

4.2.2. Pin Types ................................................................................................................. 31

4.2.3. Signal Reset States .................................................................................................. 32

4.3. General Purpose Input/Output ........................................................................................ 32

4.3.1. Pin Description ......................................................................................................... 32

4.4. Main Serial Link (UART1) ................................................................................................ 33

4.4.1. Available Services .................................................................................................... 33

4.4.2. Pin Description ......................................................................................................... 34

4.4.3. Full UART Implementation ....................................................................................... 34

4.4.4. Level Shifter Implementation.................................................................................... 35

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Product Technical Specification & Customer Design Guidelines

4.4.5. Configure the UART Interface .................................................................................. 35 4.4.5.1. Low Power Operation.................................................................................................... 36

4.4.6. Lock the UART Interface .......................................................................................... 36

4.5. USIM Interface................................................................................................................. 36

4.5.1. Pin Description ......................................................................................................... 37

4.5.2. Application ................................................................................................................ 37 4.5.2.1. USIM Socket Pin Description ........................................................................................ 37

4.6. USB 2.0 Interface ............................................................................................................ 38

4.6.1. Pin Description ......................................................................................................... 38

4.6.2. Electrical Characteristics .......................................................................................... 38

4.6.3. USB Configurations .................................................................................................. 39

4.6.4. Application ................................................................................................................ 39

4.6.5. USB Host Drivers ..................................................................................................... 39 4.6.5.1. Host Driver Requirements ............................................................................................. 39

4.7. RF Interface ..................................................................................................................... 40

4.7.1. RF Connections ....................................................................................................... 40

4.7.2. RF Performance ....................................................................................................... 41

4.7.3. GPS Specifications .................................................................................................. 43 4.7.3.1. Standalone GPS ........................................................................................................... 43 4.7.3.2. gpsOneXTRA

TM ............................................................................................................ 43

4.7.3.3. A-GPS Features ............................................................................................................ 43 4.7.3.4. Enhanced Navigation 2.0 Feature ................................................................................. 44 4.7.3.5. NMEA............................................................................................................................ 44 4.7.3.6. Software ........................................................................................................................ 44

4.7.4. Antenna Specifications ............................................................................................. 44 4.7.4.1. Application .................................................................................................................... 44

4.7.5. Radiated Emissions ................................................................................................. 45

4.7.6. Radiated Sensitivity Measurement .......................................................................... 45

4.8. Digital Audio Interface (PCM) .......................................................................................... 45

4.8.1. Pin Description ......................................................................................................... 46

4.8.2. PCM Waveforms ...................................................................................................... 47

4.9. Short Message Service (SMS) ........................................................................................ 48

4.10. UMTS Radio Access Bearers Supported ........................................................................ 48

5. SIGNALS AND INDICATORS ............................................................................ 49

5.1. Reset Signal (SYSTEM_RESET_N) ............................................................................... 49

5.1.1. Pin Description ......................................................................................................... 49

5.1.2. Electrical Characteristics .......................................................................................... 50

5.1.3. Application ................................................................................................................ 50 5.1.3.1. Reset Sequence ........................................................................................................... 50 5.1.3.2. General Notes ............................................................................................................... 50

5.2. Wake Host Signal (WAKE_N) ......................................................................................... 51

5.2.1. Pin Description ......................................................................................................... 51

5.2.2. Electrical Characteristics .......................................................................................... 52

5.2.3. Application ................................................................................................................ 52

5.3. Wireless Disable Signal (W_DISABLE_N) ...................................................................... 52

5.3.1. Pin Description ......................................................................................................... 52

5.3.2. Electrical Characteristics .......................................................................................... 53

5.3.3. Application ................................................................................................................ 53 5.3.3.1. Signal Timing ................................................................................................................ 53

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Product Technical Specification & Customer Design Guidelines

5.4. Flash LED (LED_FLASH) ................................................................................................ 54

5.4.1. Pin Description ......................................................................................................... 54

5.4.2. Electrical Characteristics .......................................................................................... 54

6. POWER CONSUMPTION .................................................................................. 55

6.1. Power States ................................................................................................................... 57

6.1.1. Power State Transitions ........................................................................................... 58

7. NETWORK TECHNOLOGY SPECIFICATIONS ................................................ 59

7.1. UMTS WCDMA FDD Specifications................................................................................ 59

7.2. Supported Specifications ................................................................................................. 60

7.3. UMTS (WCDMA)/GSM Specifications ............................................................................ 65

8. RELIABILITY COMPLIANCE AND RECOMMENDED STANDARDS ............... 68

8.1. Reliability Compliance ..................................................................................................... 68

8.2. Applicable Standards ...................................................................................................... 68

8.3. Environmental Specifications .......................................................................................... 69

8.3.1. Function Status Classification .................................................................................. 70

8.4. Reliability Prediction Model ............................................................................................. 70

8.4.1. Life Stress Test ........................................................................................................ 70

8.4.2. Environmental Resistance Stress Tests .................................................................. 71

8.4.3. Corrosive Resistance Stress Tests .......................................................................... 72

8.4.4. Thermal Resistance Cycle Stress Tests .................................................................. 72

8.4.5. Mechanical Resistance Stress Tests ....................................................................... 73

8.4.6. Handling Resistance Stress Tests ........................................................................... 74

9. DESIGN GUIDELINES ....................................................................................... 76

9.1. SIM Interface Routing Constraint .................................................................................... 76

9.2. EMC and ESD Recommendations .................................................................................. 76

9.3. Mechanical Integration .................................................................................................... 77

9.4. Operating System Upgrade ............................................................................................. 77

10. EMBEDDED TESTABILITY ............................................................................... 78

10.1. Testing Assistance Provided by Sierra Wireless ............................................................. 78

10.2. Integration Requirements ................................................................................................ 78

10.3. IOT/Operator ................................................................................................................... 78

10.4. Module Testing Recommendations ................................................................................. 78

10.5. Serial Link Access ........................................................................................................... 79

10.6. RF Output Accessibility ................................................................................................... 79

11. CERTIFICATION COMPLIANCE AND RECOMMENDED STANDARDS ......... 80

11.1. UMTS Compliance Acceptance and Certification ........................................................... 80

11.2. Certification Compliance ................................................................................................. 80

11.3. Applicable Standards ...................................................................................................... 81

11.3.1. Important Notice ....................................................................................................... 81

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11.3.2. Safety and Hazards .................................................................................................. 81

11.3.3. Important Compliance Information for North American Users ................................. 82

11.3.4. EU Regulatory Conformity ....................................................................................... 82

12. CUSTOMIZATION .............................................................................................. 83

13. SIGNAL REFERENCE SCHEMATICS ............................................................... 84

14. REFERENCES ................................................................................................... 85

14.1. Web Site Support ............................................................................................................ 85

14.2. Reference Documents ..................................................................................................... 85

14.2.1. Sierra Wireless Documentation................................................................................ 85

14.2.2. Industry/ Other Documentation ................................................................................ 85

14.3. List of Abbreviations ........................................................................................................ 86

15. SAFETY RECOMMENDATIONS (FOR INFORMATION ONLY) ....................... 89

15.1. RF Safety ......................................................................................................................... 89

15.1.1. General ..................................................................................................................... 89

15.1.2. Exposure to RF Energy ............................................................................................ 89

15.1.3. Efficient Terminal Operation..................................................................................... 89

15.1.4. Antenna Care and Replacement .............................................................................. 89

15.2. General Safety................................................................................................................. 90

15.2.1. Driving ...................................................................................................................... 90

15.2.2. Electronic Devices .................................................................................................... 90

15.2.3. Vehicle Electronic Equipment .................................................................................. 90

15.2.4. Medical Electronic Equipment .................................................................................. 90

15.2.5. Aircraft ...................................................................................................................... 90

15.2.6. Children .................................................................................................................... 91

15.2.7. Blasting Areas .......................................................................................................... 91

15.2.8. Potentially Explosive Atmospheres .......................................................................... 91

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List of Figures

Figure 1. Functional Architecture .................................................................................................... 18

Figure 2. Power Supply During Burst Emission ............................................................................. 20

Figure 3. AirPrime MC8090/MC8092 Mini Card ............................................................................ 21

Figure 4. Dimensioned View ........................................................................................................... 22

Figure 5. Unit Label ........................................................................................................................ 23

Figure 6. AirPrime MC8090/MC8092 Interface Areas .................................................................... 25

Figure 7. UART RS-232 Level Shifter Implementation ................................................................... 35

Figure 8. AirPrime MC8090/MC8092 RF Connections .................................................................. 40

Figure 9. PCM_Sync Timing ........................................................................................................... 47

Figure 10. PCM_CODEC to MC8090/MC8092 with PCM Timing .................................................... 47

Figure 11. MC8090/MC8092 with PCM to PCM_CODEC Timing .................................................... 47

Figure 12. Reset Sequence Waveform ............................................................................................ 50

Figure 13. Example of SYSTEM_RESET_N Pin Connection with Switch Configuration ................. 51

Figure 14. Example of SYSTEM_RESET_N Pin Connection with Transistor Configuration ........... 51

Figure 15. W_DISABLE_N Signal Timing ........................................................................................ 53

Figure 16. Automatic (―Triggered‖) Power State Transitions ............................................................ 58

Figure 17. Recommended Thermocouple Location ......................................................................... 79

Figure 18. USB Interface .................................................................................................................. 84

Figure 19. SIM Interface ................................................................................................................... 84

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List of Tables

Table 1. Supported Bands/Connectivity ........................................................................................ 12

Table 2. MC8090/MC8092 Mini Card Features ............................................................................ 12

Table 3. Power and Ground Specifications ................................................................................... 19

Table 4. Power Supply Requirements ........................................................................................... 19

Table 5. Radio Burst Rates – Connected Mode ............................................................................ 20

Table 6. Start-up Current Peak Range .......................................................................................... 20

Table 7. Mechanical Specifications ............................................................................................... 21

Table 8. Available Interfaces and Signals ..................................................................................... 25

Table 9. AirPrime MC8090/MC8092 Pin Assignments ................................................................. 26

Table 10. Electrical Characteristics of a 1.8V Type (1V8) Digital I/O .............................................. 31

Table 11. Pin Type Codes ............................................................................................................... 31

Table 12. Reset State Definition ...................................................................................................... 32

Table 13. GPIO Interface Features ................................................................................................. 32

Table 14. GPIO Pin Description ...................................................................................................... 32

Table 15. UART1 Interface Features .............................................................................................. 33

Table 16. 4-wire UART1 Pin Description ......................................................................................... 34

Table 17. Additional Signals for an 8-wire UART ............................................................................ 34

Table 18. Configuration for Supporting a Full UART ....................................................................... 35

Table 19. USIM Interface Features ................................................................................................. 36

Table 20. USIM Pin Description ...................................................................................................... 37

Table 21. SIM Socket Pin Description ............................................................................................. 37

Table 22. USB 2.0 Interface Features ............................................................................................. 38

Table 23. USB Pin Description ........................................................................................................ 38

Table 24. USB Interface Electrical Characteristics ......................................................................... 38

Table 25. Supported USB Configurations ....................................................................................... 39

Table 26. RF Interface Features ..................................................................................................... 40

Table 27. Band Support, Conducted Tx Power and Conducted Rx Sensitivity .............................. 41

Table 28. Main RF Antenna Specification ....................................................................................... 44

Table 29. PCM Audio Interface Features ........................................................................................ 45

Table 30. Audio Pin Description ...................................................................................................... 46

Table 31. Digital Audio Interface Timing Parameters ...................................................................... 47

Table 32. Available Signals ............................................................................................................. 49

Table 33. Reset Signal Features ..................................................................................................... 49

Table 34. Reset Signal Pin Description ........................................................................................... 49

Table 35. Reset Signal Electrical Characteristics ........................................................................... 50

Table 36. Reset Settings ................................................................................................................. 51

Table 37. Wake Host Signal Features ............................................................................................. 51

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Product Technical Specification & Customer Design Guidelines

Table 38. Wake Signal Pin Description ........................................................................................... 51

Table 39. Wake Signal Electrical Characteristics ............................................................................ 52

Table 40. Wireless Disable Signal Features ................................................................................... 52

Table 41. Wireless Disable Signal Pin Description ......................................................................... 52

Table 42. Wireless Disable Signal Electrical Characteristics .......................................................... 53

Table 43. W_DISABLE_N Signal Timing Parameters ..................................................................... 53

Table 44. LED Signal Features ....................................................................................................... 54

Table 45. LED_FLASH Pin Description ........................................................................................... 54

Table 46. LED_FLASH Signal Electrical Characteristics ................................................................ 54

Table 47. Averaged Standby DC Power Consumption (Preliminary/Estimated Values) ................ 55

Table 48. Averaged Call Mode Data DC Power Consumption ....................................................... 55

Table 49. Miscellaneous DC Power Consumption (Preliminary Values) ........................................ 56

Table 50. Supported GPRS/EDGE Power Classes ........................................................................ 56

Table 51. Supported MC8090/MC8092 Power States .................................................................... 57

Table 52. Power State Transitions (including voltage/temperature trigger levels) .......................... 58

Table 53. Supported WCDMA FDD Specifications ......................................................................... 59

Table 54. Supported Specifications ................................................................................................. 60

Table 55. UMTS (WCDMA)/GSM Specifications ............................................................................ 65

Table 56. Standards Conformity for the AirPrime MC8090/MC8092 Mini Card .............................. 68

Table 57. Applicable Standards and Requirements ........................................................................ 68

Table 58. Operating Class Temperature Range ............................................................................. 69

Table 59. ISO Failure Mode Severity Classification ........................................................................ 70

Table 60. Life Stress Test................................................................................................................ 70

Table 61. Environmental Resistance Stress Tests ......................................................................... 71

Table 62. Corrosive Resistance Stress Tests ................................................................................. 72

Table 63. Thermal Resistance Cycle Stress Tests ......................................................................... 72

Table 64. Mechanical Resistance Stress Tests .............................................................................. 73

Table 65. Handling Resistance Stress Tests .................................................................................. 74

Table 66. ESD Specifications .......................................................................................................... 77

Table 67. Standards Conformity for the MC8090/MC8092 Mini Card ............................................ 80

Table 68. Customizable Features ................................................................................................... 83

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1. Introduction

Table 1. Supported Bands/Connectivity

Band/Connectivity MC8090 MC8092

GSM850

EGSM900

DCS1800

PCS1900

Band 1 (UMTS2100)

Band 2 (UMTS1900)

Band 5 (UMTS850)

Band 8 (UMTS900)

RX diversity Band 1 (UMTS2100)

RX diversity Band 2 (UMTS1900)

RX diversity Band 5 (UMTS850)

RX diversity Band 8 (UMTS900)

GPS (1575.42MHz)

1.1. General Features

Table 2. MC8090/MC8092 Mini Card Features

Feature Description

Physical

Small form factor—conforms to F1 as specified in PCI Express

Mini Card Electromechanical Specification Revision 1.

Three U.FL RF connector jacks

Electrical Single supply voltage (VCC) — 3.3V–4.3V

Complete body shielding — No additional shielding required

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Product Technical Specification & Customer Design Guidelines Introduction

Feature Description

SMS

Send and receive (mobile originate and mobile terminate)

Mobile-originated / terminated over CS and PS channels

Mobile-originated SMS over PS falls back to CS if PS service is not available, or there is a PS network failure.

New message notification

Message sorting

Multiple recipients

Return voice call

Save contact details

Mobile-originated SMS e-mail

Mobile-originated / terminated SMS concatenation

Mobile-originated SMS e-mail concatenation

Receipt notification

Application interface

NDIS NIC interface support (Windows XP, Windows Vista, Windows 7, Windows CEa,

Linux)

Multiple non-multiplexed USB channel support

Dial-up networking

USB selective suspend to maximize power savings

AT command interface —(non-voice) 27.007 standard, plus proprietary extended AT commands

CnS — Sierra Wireless' proprietary Control and Status host interface protocol

Software Development Kits (SDK) including APIs (Application Program Interfaces) and drivers (core, device) for Windows, Windows CE, and Linux

Phone book Supports Release 99 phone book features

Packet mode

Dual-mode UMTS (WCDMA) / HSDPA and HSUPA / EDGE / GPRS operation

GPRS class B, multislot class 10 operation — Supports CS1–CS4 coding schemes

EDGE multislot class 12 operation — Supports MCS1–MCS9 coding schemes

UMTS (WCDMA) R99 data rates—384 kbps downlink, 384 kbps uplink

HSDPA Category 10 data rate — 14.4 Mbps (peak rate)

HSUPA Category 6 data rate — 5.76 Mbps

Circuit-switched data bearers — 64 kbps (maximum) uplink and downlink

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Product Technical Specification & Customer Design Guidelines Introduction

Feature Description

Connectivity / GSM

Multiple (up to 16) cellular packet data profiles

Traditional modem COM port support for DUN, CSD, and AT commands (concurrent with NDIS)

Suspend / Resume

Sleep mode for minimum idle power draw

SIM application tool kit with proactive SIM commands

Enhanced Operator Name String (EONS)

Profile list. Typical carrier profiles are available in a drop-down list in Watcher; the user can select a profile rather than enter all the parameters.

Automatic GPRS attach at power-up

GPRS detach

Combined GPRS / IMSI detach; MS-initiated and network-initiated detach

Mobile-originated PDP context activation / deactivation

Support QoS profile

Release 99 QoS negotiation—Background, Interactive, and Streaming

Release 97—Precedence Class, Reliability Class, Delay Class, Peak Throughput, Mean Throughput

Static and Dynamic IP address. The network may assign a fixed IP address or dynamically assign one using DHCP (Dynamic Host Configuration Protocol).

PAP and CHAP support

PDP context type (IPv4). IP Packet Data Protocol context

RFC1144 TCP/IP header compression

Interaction with existing GSM services (MO/MT SMS voice calls) while:

GPRS is attached, or

In a GPRS data session (class B GPRS suspend / resume procedures)

Support for EAP-SIM authentication and PC / SC. EAP-SIM is available through:

The API

AT commands

The PC / SC interface

Voice (Digital Audio)

b

Supports:

All GSM vocoders, Enhanced Full Rate (EFR), Full Rate (FR), Half Rate (HR), and WCDMA Adaptive Multirate (AMR) encoders

MO and MT calling

Echo cancellation and noise reduction

Emergency calls (112, 110, 911, etc.)

Incoming call notification

TTY/TDD compatibility

Supplementary Services

b

Call Barring

Call Forwarding

Call Hold

Caller ID

Call Waiting

Multi-party service

USSD

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Product Technical Specification & Customer Design Guidelines Introduction

Feature Description

GPS

Provides:

Standalone GPS functionality

gpsOneXTRA™

A-GPS features

NMEA support

Note: GPS specifications are preliminary targets that are subject to change without notice. Actual GPS functionality is dependent on the firmware version, and on module configuration.

Network selection

Network selection procedures described in 3G 22.011, R5 (June 2005), 3G 23.122 (June 2005), and 3G 43.022, R4

RRC connection reject message to redirect from a 3G system to a 2G system, according to 25.331, R5 (June 2004)

A CPHS Customer Service Profile-like feature [PLMN Mode bit] on a USIM / SIM that hides network selection related menus

Initial HPLMN scan at two minutes after power on

An HPLMN rescan irrespective of the serving MCC

Selective disabling of any 2G or 3G frequency band

Equivalent PLMN

Network selection generally within 30 seconds of power up

Enhanced network selection (ENS)

RF

Quad-band GSM / GPRS /EDGE (850 MHz, 900 MHz, 1800 MHz, 1900 MHz)

Dual-band UMTS WCDMA FDD

MC8092: 900 MHz, 2100 MHz

Tri-band UMTS WCDMA FDD

MC8090: 850 MHz, 1900 MHz, 2100MHz

GPS (1575.42 MHz)

Environmental

Operating temperature ranges:

Class A: -30°C to +70°C

Class B: -40°C to +85°C

Interfaces

1.8 V digital section

3 V / 1.8 V SIM interface

Serial (UART1)

Digital Audio (PCM)

USIM

USB 2.0 Slave

Operating system

Full GSM or GSM / GPRS / EGPRS operating system stack

a Contact Sierra Wireless for platform-specific Windows CE support details.

b Voice (Digital Audio)/Supplementary services on PCM variants of the MC8090/MC8092.

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Product Technical Specification & Customer Design Guidelines Introduction

1.2. Support Feature

1.3. Support Tools

1.4. Accessories

1.5. Hardware Development Components

1.6. Ordering Information

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Product Technical Specification & Customer Design Guidelines Introduction

1.7. Environmental Issues

1.7.1. RoHS Directive Compliant

1.7.2. Disposing of the Product

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2. Functional Specifications

2.1. Functional Architecture

Figure 1. Functional Architecture

2.1.1. Chipsets

2.2. Extended AT Commands

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3. Technical Specifications

3.1. Power Supply

Table 3. Power and Ground Specifications

Pin # Signal Name Type Specification Parameter Min. Typ. Max. Unit

2, 24, 39, 41, 52

VCC_3V6* V Voltage range VCC 3.30 3.60 4.30 V

4, 9, 15, 18, 21, 26, 27, 29, 34, 35, 37, 40, 43, 50

GND V - 0 - V

* Host-provided input voltage should provide 3 A instantaneous (lasting 5 ms). Refer to Table 48 Averaged Call Mode Data DC Power Consumption.

Table 4. Power Supply Requirements

Requirement Type Value

Power supply 3.6 V (nominal)

Voltage range (Vmin–Vmax) 3.3–4.3 V

Current (instantaneous (5 ms)) 3 A

Current (continuous) Refer to Table 48 Averaged Call Mode Data DC Power Consumption.

Power input capacitor(s) Add capacitance to host power rail (100 µF) to keep module operational with Vin in range.

Additional capacitance may be required if the host cannot meet the module‘s current requirements.

Conditioning capacitor (1µF, 0.1µF, 10 nF and 1 nF) recommended close to the power input for decoupling.

Note: The host must provide safe and continuous power to the mini card; the mini card does NOT have protection circuits to guard against electrical overstress.

3.1.1. Burst Emission Current Requirements

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Product Technical Specification & Customer Design Guidelines Technical Specifications

Table 5. Radio Burst Rates – Connected Mode

GSM/GPRS Multislot Class

RF Power Amplifier Current

Burst Duration Period Rising Time

Class 2 (2 Rx / 1 Tx) 3.0 A peak

577 µs 4.615 ms 10 µs

Class 10 (3 Rx / 2 Tx) 1154 µs 4.615 ms

Figure 2. Power Supply During Burst Emission

3.1.2. Power Input (VCC_3V6)

µ µ

3.1.3. Start-up Current

Table 6. Start-up Current Peak Range

Current Peak at Ambient Temperature (25°C)

VCC_3V6min (3.3V)

VCC_3V6typ (3.6V)

VCC_3V6max (4.3V)

tStartup ~183mA ~177 mA ~162 mA

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3.2. Decoupling of Power Supply Signals

µ

3.3. Mechanical Specifications

Table 7. Mechanical Specifications

Specification Details

Form factor The MC8090/MC8092 are PCI-Express Mini Cards, comprised of an AirPrime SL809x embedded module mounted on the MC_SL adapter board.

Dimensions (nominal) Length: 50.85 mm

Width: 29.85 mm

Thickness: 4.30 mm (typical, including label thickness)

Weight: approximately 11 g

3.3.1. Mechanical Illustrations

Figure 3. AirPrime MC8090/MC8092 Mini Card

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Figure 4. Dimensioned View

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3.4. Labeling

Figure 5. Unit Label

Note: * The MC8090/MC8092 support OEM partner specific label requirements.

3.5. Thermal Considerations

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3.6. Firmware Upgrade

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4. Interfaces

4.1. System Design

Table 8. Available Interfaces and Signals

Name Driven by AT Commands

General Purpose Input/Output

Main Serial Link (UART1) or Digital Audio Interface (PCM)

USIM Interface

USB 2.0 Interface

RF Interface

Figure 6. AirPrime MC8090/MC8092 Interface Areas

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4.1.1. Pin Description

Table 9. AirPrime MC8090/MC8092 Pin Assignments

Pin # Signal Name Description Active State Input/Output of MC8090/MC8092

Voltage (V) Type

Minimum Typical Maximum

1 NC Not connected

2 VCC_3V6 3.6 V supply Power Input 3.30 3.60 4.30 Power

3 NC Not connected

4 GND Ground GND GND - - -

5 NC Not connected

6 GPIO_0 General purpose I/O High / Low Input High 1.23 1.80 2.00 Digital

Input Low -0.30 0.59

Output High 1.25 1.80 1.90

Output Low 0 0.45

7 NC Not connected

8 EXT_VREG_USIM USIM VCC supply Power Output (1.8 V) 1.70 1.80 1.90 Power

Output (3.0 V) 2.95 3.00 3.05

9 GND Ground GND GND - - -

10 EXT_USIM_DATA USIM I/O pin Low Input High (1.8 V) 1.26 1.80 2.10 Digital

Input Low (1.8 V) 0 0.40

Output High (1.8 V) 1.26 1.80 2.10

Output Low (1.8 V) 0 0.40

Input High (3.0 V) 2.10 3.00 3.30

Input Low (3.0 V) 0 0.60

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Pin # Signal Name Description Active State Input/Output of MC8090/MC8092

Voltage (V) Type

Minimum Typical Maximum

Output High (3.0 V) 2.10 3.00 3.30

Output Low (3.0 V) 0 0.60

11 VREF_1V8 1.8 V LDO High (when module is on)

Output 1.70 1.80 1.90 Power

12 EXT_USIM_CLK USIM clock High Output High (1.8V) 1.26 1.80 2.10 Digital

Output Low (1.8V) 0 0.40

Output High (3.0V) 2.10 3.00 3.30

Output Low (3.0V) 0 0.60

13 NC Not connected

14 EXT_USIM_RESET USIM reset Low Output High (1.8V) 1.44 1.80 2.10 Digital

Output Low (1.8V) 0 0.40

Output High (3.0V) 2.40 3.00 3.30

Output Low (3.0V) 0 0.60

15 GND Ground GND GND - - -

16 NC Not connected

17 NC Not connected

18 GND Ground GND GND - - -

19 NC Not connected

20 W_DISABLE_N Wireless disable High / Low Input High 1.23 1.80 2.00 Digital

Input Low -0.30 0.59

21 GND Ground GND GND - - -

22 NC Not connected

23 NC Not connected

24 VCC_3V6 3.6 V supply Power Input 3.30 3.60 4.30 Power

25 NC Not connected

26 GND Ground GND GND - - -

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Pin # Signal Name Description Active State Input/Output of MC8090/MC8092

Voltage (V) Type

Minimum Typical Maximum

27 GND Ground GND GND - - -

28 NC Not connected

29 GND Ground GND GND - - -

30 NC Not connected

31 NC Not connected

32 WAKE_N* Wake Host Interface Low Output High 1.25 1.80 1.90 Digital

Output Low 0 0.45

33 SYSTEM_RESET_N Reset High / Low Input High 1.23 1.80 2.00 Digital

Input Low -0.30 0.59

34 GND Ground GND GND - - -

35 GND Ground GND GND - - -

36 USB_D- USB data negative (Low / Full speed)

Input High 2.00 3.30 3.60 Differential

Input Low 0 0.80

Output High 2.80 3.30 3.60

Output Low 0.30

USB data negative (High speed)

Input High 0.30 0.44

Input Low 0 0.01

Output High 0.36 0.38 0.44

Output Low 0 0.01

37 GND Ground GND GND - - -

38 USB_D+ USB data positive (Low / Full speed)

Input High 2.00 3.30 3.60 Differential

Input Low 0 0.80

Output High 2.80 3.30 3.60

Output Low 0.30

USB data positive (High speed)

Input High 0.30 0.44

Input Low 0 0.01

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Pin # Signal Name Description Active State Input/Output of MC8090/MC8092

Voltage (V) Type

Minimum Typical Maximum

Output High 0.36 0.38 0.44

Output Low 0 0.01

39 VCC_3V6 3.6 V supply Power Input 3.30 3.60 4.30 Power

40 GND Ground GND GND

41 VCC_3V6 3.6 V supply Power Input 3.30 3.60 4.30 Power

42 LED_FLASH LED driver Open Drain Output

Output Low 0 Open Drain Digital

43 GND Ground GND GND

44 GPIO_1* General purpose I/O High / Low Input High 1.23 1.80 2.00 Digital

Input Low -0.30 0.59

Output High 1.25 1.80 1.90

Output Low 0 0.45

45 UART1_CTS_N/ PCM_CLK**

UART Clear To Send/ PCM Clock

High / Low Output High 1.25 1.80 1.90 Digital

Output Low 0 0.45

46 GPIO_3* General purpose I/O High / Low Input High 1.23 1.80 2.00 Digital

Input Low -0.30 0.59

Output High 1.25 1.80 1.90

Output Low 0 0.45

47 UART1_RTS_N/ PCM_DIN**

UART Request To Send/ PCM Data In

High / Low Input High 1.23 1.80 2.00 Digital

Input Low -0.30 0.59

48 GPIO_2* General purpose I/O High / Low Input High 1.23 1.80 2.00 Digital

Input Low -0.30 0.59

Output High 1.25 1.80 1.90

Output Low 0 0.45

49 UART1_RXD/ PCM_DOUT**

UART Receive Data/ PCM Data Out

High / Low Output High 1.25 1.80 1.90 Digital

Output Low 0 0.45

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Pin # Signal Name Description Active State Input/Output of MC8090/MC8092

Voltage (V) Type

Minimum Typical Maximum

50 GND Ground GND GND

51 UART1_TXD/ PCM_SYNC**

UART Transmit Data/PCM Sync Out

High / Low Input High 1.23 1.80 2.00 Digital

Input Low -0.30 0.59

52 VCC_3V6 3.6 V supply Power Input 3.30 3.60 4.30 Power

* This pin may be reconfigured for use in a full UART implementation. Refer to section 4.4.3 Full UART Implementation for more information.

** The MC8090/MC8092 can either have PCM or UART; the function of this pin varies depending on whether the mini card is an MC8090/MC8092 with PCM or with UART.

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4.2. Digital I/O Electrical Information

4.2.1. Electrical Characteristics

Table 10. Electrical Characteristics of a 1.8V Type (1V8) Digital I/O

Parameter* I/O Type Minimum Typical Maximum Condition

Input/Output Pin

VIL CMOS -0.30 V 0.59 V

VIH CMOS 1.23 V 2.00 V

VOL CMOS 0.45 V IOL = -2 mA

VOH CMOS 1.25 V 1.90 V IOH = 2 mA

IOH 2 mA

IOL -2 mA

* ‗IL‘—Input Low; ‗IH‘—Input High; ‗OL‘—Output Low; ‗OH‘—Output High

4.2.2. Pin Types

Table 11. Pin Type Codes

Parameter Definition

A Analog pin

I Input

NP No Pull

O Digital Output

PU Pull Up

PD Pull Down

V Power or Ground pin

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4.2.3. Signal Reset States

Table 12. Reset State Definition

Parameter Definition

0 Set to GND

1 Set to supply 1V8

Pull-down Internal pull-down with ~60 kΩ resistor (TBD)

Pull-up Internal pull-up with ~60 kΩ resistor to supply 1V8 (TBD)

Z High impedance

Undefined Caution: Undefined must not be used in an application if a special state is required at reset. These pins may be toggling a signal(s) during reset.

4.3. General Purpose Input/Output

Table 13. GPIO Interface Features

Feature Details

Purpose OEM-configurable general purpose I/O (control, signaling, monitoring, etc.)

Implementation Defaults to digital output

Power 1.8V (use VREF_1V8 as logic reference)

Output drive current up to 2 mA.

Note: These pins can only be used as either GPIO or additional UART pins.

4.3.1. Pin Description

Table 14. GPIO Pin Description

Pin # Signal Name I/O Type Reset State Description

46 GPIO_3* 1V8

Configurable general purpose I/O 48 GPIO_2* 1V8

44 GPIO_1* 1V8

6 GPIO_0 1V8

* This pin may be reconfigured for use in a full UART implementation. Refer to section 4.4.3 Full UART Implementation for more information.

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Caution: Sierra Wireless reserves the right to dedicate any of these pins for specific purposes in the future. Use at your own risk.

4.4. Main Serial Link (UART1)

Note: MC8090/MC8092 with UART mini cards may be provisioned with the ability to use the UART interface to communicate with peripheral devices. Contact Sierra Wireless for further information.

Table 15. UART1 Interface Features

Feature Details

Purpose Serial host–module communication

Dependent on provisioning, communication with peripheral devices. Contact Sierra Wireless for further information.

Implementation Four-wire serial interface based on TIA-232 (RS232 protocol)

An RS-232 level shifter device may be required, as described in section 4.4.4 Level Shifter Implementation.

Optional full UART configuration as described in section 4.4.3 Full UART Implementation.

Data rates supported High speed (up to 4 Mbps)

Optional functionality Dependent on provisioning, module may be able to communicate with peripheral devices. Contact Sierra Wireless to discuss possible firmware support.

Note: This interface is NOT AVAILABLE in the MC8090/MC8092 with PCM variants.

4.4.1. Available Services

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4.4.2. Pin Description

Table 16. 4-wire UART1 Pin Description

Pin # Signal Name I/O Type

Reset State

Description Direction* Notes

51 UART1_TXD 1V8 High speed UART - Transmit data

Input Digital pin input, internal Pull Down

UART1 serial data transmit line (module input)

49 UART1_RXD 1V8 High speed UART - Receive data

Output UART1 serial data receive line (module output)

45 UART1_CTS_N 1V8 High speed UART - Clear to send

Output Clear to Send

47 UART1_RTS_N 1V8 High speed UART - Request to send

Input Request to Send

* According to PC view.

Table 17. Additional Signals for an 8-wire UART

Signal Name I/O Type

Reset State

Description

Direction with respect to Host

Notes

DTR 1V8 Data Carrier Detect Output

DCD 1V8 Data Terminal Ready Input

DSR 1V8 Data Set Ready Input

RI 1V8 Ring Indicator Input

4.4.3. Full UART Implementation

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Table 18. Configuration for Supporting a Full UART

Additional UART Signal GPIO Pins Used for an Extended UART Configuration

Signal Name Function Value Pin # Signal Name Function

DCD Data Carrier Detect 1V8 output 44 GPIO_1 General Purpose I/O

DTR Data Terminal Ready 1V8 input 48 GPIO_2 General Purpose I/O

DSR Data Set Ready 1V8 output 46 GPIO_3 General Purpose I/O

RI Ring Indicator 1V8 output 32 WAKE_N Wake Host Interface

4.4.4. Level Shifter Implementation

Figure 7. UART RS-232 Level Shifter Implementation

Note: The U1 chip also protects the AirPrime MC8090/MC8092 mini card against ESD at 15kV (air discharge).

4.4.5. Configure the UART Interface

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4.4.5.1. Low Power Operation

4.4.6. Lock the UART Interface

4.5. USIM Interface

Table 19. USIM Interface Features

Feature Details

Purpose Communicate with USIM socket on host device

Implementation Four-wire interface

Voltage levels comply with 3GPP standards

Power 1.8 V (3G) or 3.0 V (2G) operation. Compliant with GSM 11.11 recommendations concerning SIM functions.

Host must keep current draw 10mA

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4.5.1. Pin Description

Table 20. USIM Pin Description

Pin # Signal Name I/O Type

Description Notes

8 EXT_VREG_USIM USIM power supply 1.8 V (3G) or 3 V (2G).

Maximum allowed current draw = 10 mA.

14 EXT_USIM_RESET USIM reset signal

10 EXT_USIM_DATA USIM data Requires a 15–25 kΩ pull-up resistor to EXT_VREG_USIM.

Filtering cap in pF range may be needed.

12 EXT_USIM_CLK USIM clock Typically 4 MHz at EXT_VREG_USIM level.

Host should minimize rise time (< 50 ns) by adjusting trace capacitance and filtering needs as required.

4.5.2. Application

4.5.2.1. USIM Socket Pin Description

Table 21. SIM Socket Pin Description

Pin # Signal Name Description

1 VCC EXT_ VREG_USIM

2 RST EXT_USIM_RESET

3 CLK EXT_USIM_CLK

4 - -

5 GND GROUND

6 - -

7 I/O EXT_USIM_DATA

8 - -

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4.6. USB 2.0 Interface

Table 22. USB 2.0 Interface Features

Feature Details

Standards compliance Universal Serial Bus Specification, Rev 2.0

CDC 1.1 - ACM compliant

Performance Optimized for high speed (480 Mbps) Throughput rates may vary significantly based on packet size, host interface, and firmware revision.

Support for Full speed (12 Mbps) Throughput performance is on an ―as-is‖ basis and must be characterized by the OEM.

Power supply VCC supply

3.3 V type compatible

Additional features Firmware download over USB

4.6.1. Pin Description

Table 23. USB Pin Description

Pin # Signal Name Description Notes

38 USB_D+ HS-USB data + Protected against ±500V Human Body Model ESD.

ESD suppressor with shunt capacitance <1 pF is recommended.

Host must ensure D+ and D- traces are well matched and of differential impedance of 90 Ω. All high-speed differential routing techniques should be applied.

Allocate room to accommodate a common-mode choke filter (90Ω impedance) between the module and destination.

36 USB_D- HS-USB data -

4.6.2. Electrical Characteristics

Table 24. USB Interface Electrical Characteristics

Parameter Minimum Typical Maximum Unit

USB_D+

USB_D-

(Low/Full speed)

2.00 3.30 3.60 V

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Parameter Minimum Typical Maximum Unit

USB_D+

USB_D-

(High speed)

0.30 0.38 0.44 V

4.6.3. USB Configurations

Table 25. Supported USB Configurations

Configuration Interfaces Services

Composite, Direct IP OBEX, ACM, ECM CnS, DM, NMEA, AT, DIP data

Composite, MUX-capable OBEX, ACM CnS, DM, NMEA, AT, PPP data

Composite OBEX, ACM CnS, DM, NMEA, AT, PPP data

Non-composite, MUX-capable OBEX, ACM CnS, DM, NMEA, AT, PPP data

4.6.4. Application

4.6.5. USB Host Drivers

4.6.5.1. Host Driver Requirements

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4.7. RF Interface

Table 26. RF Interface Features

Feature Details

Purpose Primary antenna — Tx / Rx

Diversity antenna — Rx

GPS antenna — GPS functionality

Impedance Nominal: 50Ω

DC: High Impedance

4.7.1. RF Connections

Figure 8. AirPrime MC8090/MC8092 RF Connections

Ω

Note: If the antenna connection is shorted or open, the modem will not sustain permanent damage.

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4.7.2. RF Performance

Table 27. Band Support, Conducted Tx Power and Conducted Rx Sensitivity

Band Frequencies (MHz) MC8090 MC8092 Conducted Tx Power Conducted Rx Sensitivity (dBm)

Average (dBm) Notes

GSM Bands Coding Mode Typical Worst Case

GSM 850 Tx: 824 - 849

Rx: 869 - 894

+33 ± 2 GMSK, connectorized (Class 4) CS1-3a

CS4b

MCS1-3c

MCS4c

MCS5c

MCS6c

MCS7c

MCS8c

MCS9c

GMSK

GMSK

GMSK

GMSK

8PSK

8PSK

8PSK

8PSK

8PSK

-106

-103

-106

-103.5

-100

-98

-95

-92.5

-90

-102

-99

-102

-99.5

-96

-94

-91

-88.5

-86

+27 ± 3 8PSK, connectorized (Class E2)

EGSM 900 Tx: 880 - 915

Rx: 925 - 960

+33 ± 2 GMSK, connectorized (Class 4)

+27 ± 3 8PSK, connectorized (Class E2)

DCS 1800 Tx: 1710 - 1785

Rx: 1805 - 1880

+30 ± 2 GMSK, connectorized (Class 1)

+26 ± 3 8PSK, connectorized (Class E2)

PCS 1900 Tx: 1850 - 1910

Rx: 1930 - 1990

+30 ± 2 GMSK, connectorized (Class 1)

+26 ± 3 8PSK, connectorized (Class E2)

WCDMA Bands Call Details Typical Worst Case

Band I

WCDMA 2100

Tx: 1920–1980

Rx: 2110–2170

+24 +1/-3 Connectorized (Class 3)

Nominal conditions

RMC DL 12.2 kbps; 0.1% BER

-107.5 -106.7

Band II

WCDMA 1900

Tx: 1850–1910

Rx: 1930–1990

-107 -104.7

Band V

WCDMA 850

Tx: 824–849

Rx: 869–894

-108 -104.7

Band VIII

WCDMA 900

Tx: 880–915

Rx: 925–960

-108 -103.7

WCDMA Bands RX Diversity

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Band Frequencies (MHz) MC8090 MC8092 Conducted Tx Power Conducted Rx Sensitivity (dBm)

Average (dBm) Notes

Band I

WCDMA 2100

Tx: 1920 – 1980

Rx: 2110 – 2170

RMC DL 12.2 kbps; 0.1% BER

-107.5 -106.7

Band II

WCDMA 1900

Tx: 1850 – 1910

Rx: 1930 – 1990

-107 -104.7

Band V

WCDMA 850

Tx: 824 – 849

Rx: 869 – 894

-108 -104.7

Band VIII

WCDMA 900

Tx: 880 – 915

Rx: 925 – 960

-108 -103.7

GPS

GPS 1575.42

a 2% Bit Error Rate (BER) circuit switched

b 10% Block Error Rate (BLER)

c WCDMA channel spacing is 5 MHz, but this can be adjusted to optimize performance in a particular deployment scenario.

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4.7.3. GPS Specifications

Note: These specifications are preliminary targets that are subject to change without notice. Actual GPS functionality depends on the firmware version and module configuration.

4.7.3.1. Standalone GPS

Note: For optimum performance, the modem should be registered on the GSM/UMTS network, but does not need to be on an active data or voice call.

4.7.3.2. gpsOneXTRATM

4.7.3.3. A-GPS Features

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4.7.3.4. Enhanced Navigation 2.0 Feature

4.7.3.5. NMEA

4.7.3.6. Software

4.7.4. Antenna Specifications

Table 28. Main RF Antenna Specification

Parameter Minimum Typical Maximum Unit Description

Cable loss - - 0.5 dB Maximum loss to antenna

Impedance - 50 - Ω Antenna load impedance

VSWR - - 1.6:1 Maximum allowed VSWR of antenna

Radiated gain 0 dBi In one direction at least

Note: Sierra Wireless recommends a maximum VSWR of 1.6:1 for both TX and RX bands.

4.7.4.1. Application

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4.7.5. Radiated Emissions

Ω

4.7.6. Radiated Sensitivity Measurement

4.8. Digital Audio Interface (PCM)

Table 29. PCM Audio Interface Features

Feature Details

Implementation Primary PCM supported to interface with external codec

Power 1.8 V (use VREF_1V8 as logic reference)

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Feature Details

Features IOM-2 compatible device on physical level

Master mode only with 6 slots by frame (user only on slot 0)

Bit rate single clock mode at 2.048 MHz

16 bits data word MSB first only

Linear Law only (no compression law)

Long Frame Synchronization only

Push-pull configuration on PCM-OUT and PCM-IN

Note: This interface is NOT AVAILABLE in the MC8090/MC8092 with UART variants.

4.8.1. Pin Description

Table 30. Audio Pin Description

Pin # Signal Name Type Description Notes

51 PCM_SYNC PD PCM synchronization bit

Delivers 8 kHz frequency pulse that synchronizes frame data in / out.

49 PCM_DOUT O PCM output Frame ‗data out‘ relies on selected configuration mode.

47 PCM_DIN PD PCM input Frame ‗data in‘ relies on selected configuration mode.

45 PCM_CLK O PCM clock 2 MHz for primary PCM mode. Controls data transfer with the audio peripheral.

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4.8.2. PCM Waveforms

Figure 9. PCM_Sync Timing

Figure 10. PCM_CODEC to MC8090/MC8092 with PCM Timing

Figure 11. MC8090/MC8092 with PCM to PCM_CODEC Timing

Table 31. Digital Audio Interface Timing Parameters

Signal Description Minimum Typical Maximum Unit

Tsync_low + Tsync_high

PCM-SYNC period 125 µs

Tsync_low PCM-SYNC low time 124.5 µs

Tsync_high PCM-SYNC high time 400 500 ns

TSYNC_CLK PCM-SYNC to PCM-CLK time 60 ns

TCLK-cycle PCM-CLK period 488 ns

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Signal Description Minimum Typical Maximum Unit

TIN-setup PCM-IN setup time 50 ns

TIN-hold PCM-IN hold time 10 ns

TOUT-delay PCM-OUT delay time 350 ns

4.9. Short Message Service (SMS)

4.10. UMTS Radio Access Bearers Supported

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5. Signals and Indicators

Table 32. Available Signals

Name Driven by AT Commands

Reset Signal (SYSTEM_RESET_N)

Wake Host Signal (WAKE_N)

Wireless Disable Signal (W_DISABLE_N)

Flash LED (LED_FLASH)

5.1. Reset Signal (SYSTEM_RESET_N)

Note: An operating system reset is preferred to a hardware reset.

Table 33. Reset Signal Features

Feature Details

Purpose Used by host to reset the module

Implementation

Digital input. 1.8 V logic (active low)

The MC8090/MC8092 has been provided with a 10 kΩ internal pull-up resistor (to module-provided 1.8 V reference (pin 11 — VREF_1V8)).

Caution: This signal should only be used for EMERGENCY resets.

5.1.1. Pin Description

Table 34. Reset Signal Pin Description

Pin # Signal Name I/O I/O Type Description

33 SYSTEM_RESET_N I 1V8 MC8090/MC8092 reset

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5.1.2. Electrical Characteristics

Table 35. Reset Signal Electrical Characteristics

Parameter Minimum Typical Maximum Unit

SYSTEM_RESET_N time (Rt)a 30 ms

SYSTEM_RESET_N time (Rt)b at power up

only 10 20 30 ms

VIL 0.59 V

VIH 1.23 V

a This reset time is the minimum to be carried out on the SYSTEM_RESET_N signal when the power supply is already stabilized.

b This reset time is internally carried out by the mini card power supply supervisor only when the mini card power supplies are powered ON.

5.1.3. Application

5.1.3.1. Reset Sequence

Note: Driving the signal low for a longer period will not damage the module, but will delay the reset process — the baseband circuit needs the line to be high at the end of the reset stage.

Figure 12. Reset Sequence Waveform

5.1.3.2. General Notes

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Figure 13. Example of SYSTEM_RESET_N Pin Connection with Switch Configuration

Figure 14. Example of SYSTEM_RESET_N Pin Connection with Transistor Configuration

Table 36. Reset Settings

Reset Command SYSTEM_RESET_N (Pin 33) Operating Mode

1 0 Reset activated

0 1 Reset inactive

5.2. Wake Host Signal (WAKE_N)

Table 37. Wake Host Signal Features

Feature Details

Purpose Wake Host interface

Wake host when a predetermined condition is satisfied (for example, when a call is received).

Implementation Low = On

Active low, 1.8V logic

During the powered-off state, this pin may not be in a high impedance state. The host side must implement appropriate measures to accommodate this.

5.2.1. Pin Description

Table 38. Wake Signal Pin Description

Pin # Signal Name I/O I/O Type Description

32 WAKE_N* O Digital Wake Host interface

* This pin may be reconfigured for use in a full UART implementation. Refer to section 4.4.3 Full UART Implementation for more information.

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5.2.2. Electrical Characteristics

Table 39. Wake Signal Electrical Characteristics

Parameter Minimum Typical Maximum Unit

Output High 1.25 1.80 1.90 V

Output Low 0 0.45 V

5.2.3. Application

Caution: This section is under review and subject to change.

5.3. Wireless Disable Signal (W_DISABLE_N)

Table 40. Wireless Disable Signal Features

Feature Details

Purpose Wireless disable

Used by host to disable or enable low power mode (‗airplane mode‘).

Implementation Low = Put module in airplane mode

Digital input

Active low, 1.8V logic

The MC8090/MC8092 has been provided with a 10 kΩ internal pull-up resistor (to module-provided 1.8 V reference (pin 11 — VREF_1V8)).

5.3.1. Pin Description

Table 41. Wireless Disable Signal Pin Description

Pin # Signal Name I/O I/O Type Description

20 W_DISABLE_N I Digital Wireless disable

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5.3.2. Electrical Characteristics

Table 42. Wireless Disable Signal Electrical Characteristics

Parameter Minimum Typical Maximum Unit

Input High 1.23 1.80 2.00 V

Input Low -0.30 0.59 V

5.3.3. Application

Caution: This section is under review and subject to change.

5.3.3.1. Signal Timing

Figure 15. W_DISABLE_N Signal Timing

Table 43. W_DISABLE_N Signal Timing Parameters

Parameter Description

Period

Min Typ Max

t_WDIS_db W_DISABLE_N Debounce – Time between changing W_DISABLE_N logic level and RF mode changing.

1s - 7s

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5.4. Flash LED (LED_FLASH)

Table 44. LED Signal Features

Feature Details

Purpose Flash LED output

Used by host to control LED status by controlling LED diode bias.

Implementation Open drain output.

Source / sink maximum — 8 mA

LED behavior can be configured by adjusting software settings.

LED pattern can be used to indicate network connection status.

Blink rate up to 10 Hz supported

5.4.1. Pin Description

Table 45. LED_FLASH Pin Description

Pin # Signal Name I/O I/O Type Reset State Description

42 LED_FLASH O Digital 1 and Undefined LED driving

5.4.2. Electrical Characteristics

Table 46. LED_FLASH Signal Electrical Characteristics

Parameter Condition Minimum Typical Maximum Unit

Tri-state

VOL 0.00 0.45 V

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6. Power Consumption

Note: All specifications in these tables are preliminary, based on chipset published expectations.

Table 47. Averaged Standby DC Power Consumption (Preliminary/Estimated Values)

Signal Description Bands Typ. Peak Units Notes/Configuration

VCC

Standby current consumption with Sleep mode activated (assumes USB bus is fully suspended during measurements)

HSDPA / WCDMA

UMTS bands

2.3 778 mA DRX cycle = 8 (2.56 s)

GSM / GPRS / EDGE

GSM bands

3.2 678 mA MFRM = 5 (1.175 s)

Standby current consumption with Sleep mode deactivated (assumes USB bus is fully suspended during measurements)

HSDPA / WCDMA

UMTS bands

26.7 753 mA DRX cycle = 8 (2.56 s)

Module power up and idle (Assumes Sleep mode is never entered)

GSM / GPRS / EDGE

GSM bands

49.7 662 mA MFRM = 5 (1.175 s)

Module power up and idle (Assumes Sleep mode is never entered)

Low Power Mode (LPM) / Offline Mode

RF disabled, but module is operational

15.3 23.7 mA

State is entered when Watcher shuts down / turns off the radio.

LPM is the lowest possible (‗rock bottom‘) state in Sleep mode.

Table 48. Averaged Call Mode Data DC Power Consumption

Mode Current (at 3.6V) Tx (output) Power Conditions

WCDMA Data Current Consumption (includes USB bus current)

WCDMA Average

712 mA 23 dBm 384kbps*

247 mA 0 dBm

Peak 796 mA Averaged over 100µs

HSDPA Average

734 mA 23 dBm All speeds

263 mA 0 dBm

Peak 863 mA Averaged over 100µs

HSUPA Average

742 mA 23 dBm All speeds

271 mA 0 dBm

Peak 867 mA Averaged over 100µs

GSM / EDGE Data Current Consumption

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Mode Current (at 3.6V) Tx (output) Power Conditions

GSM/GPRS

Average 283 mA (1TX)

468 mA (2TX) +33 dBm

50Ω

Max PCL for each band

Peak 2.24 A Averaged over 100µs

Worst case on 850 / 900 band

Average 94.2 mA (1TX)

117.3 mA (2TX) +10 dBm

50Ω

Peak 238.7 mA (TBD) Averaged over 100µs

Worst case on 850 / 900 band

EDGE

(850 MHz)

Average 206 mA (1TX)

302 mA (2TX)

396 mA (3TX)

482 mA (4TX)

+26 dBm 50Ω

Class 12

Peak 2.315 A +33 dBm

Averaged over 100µs

Worst case on 850 / 900 band

* Highest current is in Band I

Table 49. Miscellaneous DC Power Consumption (Preliminary Values)

Signal Description Band Typ. Max. Units Notes/Configuration

VCC

Module OFF leakage current

All bands 135 (TBD) µA Room temperature

USB transmit current All bands 10* (TBD) mA Full speed USB connection, CL = 50 pF on D+ and D- signals

* Typical value for MC8790 mini card used as estimate.

Table 50. Supported GPRS/EDGE Power Classes

Feature Notes

EGSM 900 / GSM 850 Power Class 4 2 W 33 dBm

GSM 1800 / 1900 Power Class 1 1 W 30 dBm

EDGE Power Class for 850 / 900 MHz Class E2*; 27 dBm, 0.5 W

EDGE Power Class for 800 / 1900 MHz Class E2*; 26 dBm, 0.4 W

* E2 power class applies to 8PSK modulation.

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6.1. Power States

Table 51. Supported MC8090/MC8092 Power States

State Description Host Powered

Module Powered

USB Interface Active

RF Enabled

Normal

(Default state)

Capable of placing / receiving calls or establishing data connections on network

USB interface is fully active

Current consumption in a call or data connection is affected by:

Radio band in use

Tx power

Receive gain settings

Data rate

Number of active Tx time slots

Module defaults to Normal state when VCC is first applied in the absence of POWER_ON_N control.

Airplane Mode (RF off)

‗Airplane‘ mode — Rx / Tx are disabled; USB interface is active

State entered automatically when critical voltage / temperature thresholds are exceeded. Host should consider powering off module to prevent damage to unit.

Sleep (Idle Mode)

Normal state of module between calls or data connections.

Module cycles between wake (polling the network) and sleep, at network provider-determined interval.

Off

Host power is connected

Module is powered down (drawing minimal current from host power supply)

Disconnected

Host power is disconnected from module

All module-related voltages are at 0 V.

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6.1.1. Power State Transitions

Table 52. Power State Transitions (including voltage/temperature trigger levels)

Transition

Voltage Temperature

Notes

Trigger V Trigger °C

Normal to Low Power

VOLT_HI_CRIT 4.4 TEMP_LO_CRIT -45 RF suspended

CNS_RADIO_POWER notification issued*

VOLT_LO_CRIT 3.0 TEMP_HI_CRIT 110

Low Power to Normal

VOLT_HI_NORM 4.3 TEMP_NORM_LO -40

RF suspended

CNS_RADIO_POWER notification issued*

Low Power to Normal

or

Remain in Normal (remove warnings)

VOLT_LO_NORM 3.6 TEMP_HI_NORM 85

Normal (issue warning)

VOLT_LO_WARN 3.3 TEMP_HI_WARN 95

* Notification issued only if previously enabled. Refer to document [6] AirPrime UMTS MC Series CnS Reference for details.

Figure 16. Automatic (“Triggered”) Power State Transitions

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7. Network Technology Specifications

7.1. UMTS WCDMA FDD Specifications

Table 53. Supported WCDMA FDD Specifications

Specification Supported Feature

Physical Layer Specification

DL Channels: BCH, PCH, FACH, DCH, AICH, CPICH

UL Channels: RACH, DCH

Measurement for PCCPCH RSCP RSCP/SIR

BTFD

CCTrCH

As defined by examples in 25.944

Multifinger support

Cell reselection

Soft handover

Power control

PICH / DRX

Measurement for SFN / CFN timing, SFN / SFN timing

Cell selection

RLC Specifications

TM / UM / AM

Max AM entities (4)

3 for signalling

1 for user data

Only timer based polling for AM

No timer based SDU discard for TM / UM / AM

Poll PU polling for AM

Poll prohibit

Polling options: Last ReTX PU Poll, Poll Window, Poll SDU

Status report transfer: Timer Status, Status Prohibit, Missing PU indicator

Reset procedure: Indication to RRC

Suspend / Resume

Timer based SDU discard (UM / AM / TM)

Status report transfer: Piggybacked Status PDUs, EPC based transfer

SUFIs: Sending BITMAP and RLIST

Start / stop for all three modes

RRC Specifications

Cell selection

RRC connection establishment

RRC connection release

System information processing

Idle mode paging

Dedicated mode paging

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Specification Supported Feature

Initial direct transfer

Uplink direct transfer

Downlink direct transfer

Signalling connection release

Signalling connection release request

Radio bearer establishment

Radio bearer release

Cell update

UE capability enquiry

Transmission of UE capability

Cell reselection

Measurement control

Measurement reporting

Soft HO/Active Set update

DRX mode

NV support for RRC channel scan

Radio bearer reconfiguration

Transport channel reconfiguration

Physical channel reconfiguration

UTRAN mobility information

Integrity protection

Security mode control

Encryption: UEA1

Integrity algorithm: U1A11

7.2. Supported Specifications

Table 54. Supported Specifications

Item Comments

8PSK modulation Octagonal Phase Shift Keying

Coding schemes MCS1-4 are GMSK and MCS5-9 are 8PSK.

GPRS header compression Data packet header compression supported

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Item Comments

3GPP compliance

Protocol stack supports the requirements of:

GPRS/EDGE: 3GPP Release 99 and GERAN Feature Package #1

WCDMA: Release 6

GPRS operation mode class B Class B terminals support either circuit-switched or packet-switched traffic (with simultaneous network attachment) but do not support both kinds of traffic simultaneously.

Link Adaptation (LA) Together with IR (next table entry), LA adapts the EGPRS transmission to meet changing radio link conditions.

EGPRS Incremental Redundancy (IR)

IR adjusts the physical layer code rate to actual channel conditions by incrementally transmitting redundant information until decoding is successful.

Automatic Repeat Request (ARQ) protocol takes care of requesting and retransmitting incorrectly received blocks. ARQ enables both dynamic RLC window management (to avoid window stalling) and dynamic RLC polling frequency (to minimize retransmission delay and save radio bandwidth).

GPRS multislot class 10 Multislot class 10 and 12 allow for dynamic allocation of time slots.

EGPRS multislot class 12

NC0 NC0 is the normal mode of control for a GPRS mobile in which the MS (Mobile Station) performs autonomous cell reselection.

DPC

Downlink Power Control

Allows the network to adjust the downlink power of any dedicated channels on the BTS based on measurement reports sent by the mobile. This allows the network to reduce interference between multiple mobiles while still maintaining adequate signal quality for the individual mobiles.

One-phase packet access for GPRS In establishing a TBF (Temporary Block Flow) connection, the MS (Mobile

Station) requests either one-phase or two-phase packet access.

In one-phase access, the network responds to a packet channel request by sending a packet uplink assignment message and reserving resources for uplink transfer of a number of radio blocks.

In two-phase access, a packet resource request is sent on receipt of the packet uplink assignment.

One-phase packet access for EGPRS

Two-phase packet access for GPRS

Two-phase packet access for EGPRS

RLC-acknowledged operation mode The RLC-acknowledged and LLC-acknowledged modes are used to ensure

the integrity of received data where QoS requires it. RLC (Radio Link Control) acknowledgment is typically the default (depending on the network and user profile). LLC-acknowledgment is optional and ensures that all LLC (Logical Link Control) frames are received without error. Since LLC-acknowledged mode requires acknowledgement of all LLC frames, the mode has an impact on throughput.

RLC-unacknowledged operation mode

LLC-acknowledged transmission mode

LLC-unacknowledged transmission mode

GSM network operation mode I and II

The Network Operating Mode specifies the coordination of paging for circuit-switched and packet-switched services.

Mode I - The mobile can receive circuit-switched pages while in a packet-switched call.

Mode II - The mobile cannot receive a circuit-switched page while in a packet-switched call, as it would force the mobile to constantly monitor its CCCH channel.

PBCCH / PCCCHI

Packet Broadcast Control Channel

PBCCH is a packet data signalling channel that can supplement the BCCH GSM control channel, allowing decoupling of voice and packet control channels to set up data calls. PBCCH broadcasts GPRS / EGPRS specific cell re-selection parameters for serving and neighbour cells used in cell selection / re-selection for packet services.

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Item Comments

GPRS test modes (ETSI test mode A and B)

The European Telecommunications Standards Institute (ETSI) defines standards and requirements for testing of GSM mobile equipment.

In test mode A, the mobile requests an uplink TBF and transmits random data on a designated number of timeslots. This causes a device to transmit data without using upper layer protocols. Once the transmission has started, the downlink TBF halts. The device remains in this mode until the testing equipment terminates it.

In test mode B, the mobile is prompted to receive data on a number of specified downlink timeslots and re-transmit the same data back on the corresponding uplink timeslots. Test mode B allows tests to be performed on both the transmitter and receiver within a single session.

NACC (R4 GERAN Feature Set 1)

Network Assisted Cell Change

Enables the network to provide additional information about neighbour cells to the mobile while in a packet data session, which decreases the experienced service delays caused by cell re-selection.

MAIO

Mobile Allocation Index Offset

MAIO and Hopping Sequence Number (HSN) are used in conjunction with Frequency Hopping to determine the hopping sequence used in each frame. The MAIO supports as many values as there are frequencies in the hopping list, and these are used to indicate the offset within the hopping list that identifies the frequency used.

Packet enhanced measurement report (PEMR)

Packet Enhanced Measurement Report (PEMR) is one of the RLC / MAC (Radio Link Control and Medium Access Control) control messages that include a carrier identifier. This message is a requirement of supporting multicarrier TBF.

Delayed TBF Release

Delayed Temporary Block Flow Release (also called Extended Uplink TBF)

Delayed TBF Release reduces latency between uplink data transfers and reduced signalling on the network by maintaining a connection for brief periods when the network is temporarily inactive and the mobile station has no radio link control information to send. For this feature to work properly, the mobile station must support delayed TBF release.

Extended Dynamic Allocation Radio blocks can be transmitted on up to four different PDCHs. Permits full class 12 operation.

Single Antenna Interference Cancellation (SAIC)

SAIC mitigates code-channel interference from neighbouring cells resulting in fewer dropped calls, and faster download rates for e-mail and websites.

Circuit-switched data bearers

These circuit-switched data bearers are supported on 2G networks:

Asynchronous 9,600 bps

Asynchronous 14,400 bps

Security

Encryption support GPRS / EGPRS support GEA1, GEA2, and GEA3 data ciphering.

GSM CSD and SMS use A5/1 and A5/3 encryption.

PAP for RADIUS authentication - GPRS / EGPRS

PAP (Password Authentication Protocol) is a method of authenticating usernames and passwords against a database on a RADIUS (Remote Authentication Dial-In User Service) server. In a standard login, the service provider prompts for a username and password. In PAP authentication, the username and password are entered in the client's dialling software and sent as one data package, rather than the server sending a login prompt and waiting for a response.

CHAP for RADIUS authentication - GPRS / EGPRS

CHAP (Challenge Handshake Authentication Protocol) is a more secure method for connecting to a system than PAP. After a link is established, the server sends a challenge message to the client. The client responds with a value calculated using a one-way hash function. The server compares its own calculation of the expected hash value to the client's response. If the values match, the authentication is acknowledged; otherwise the connection is terminated.

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Item Comments

Support for encryption algorithm UEA1 (Kasumi)

UEA1 (UMTS Encryption Algorithm) generates the keystream as a function of a cipher key that is re-synchronized to every MAC / RLC frame. UEA is based on the Kasumi algorithm.

Support for integrity algorithm UIA1 (Kasumi)

UIA1 (UMTS Integrity Algorithm) is the algorithm used to compute the IK (Integrity Key) used in message authentication. UIA is based on the Kasumi algorithm.

UMTS

WCDMA-to-GPRS reselection in CELL_FACH CELL_FACH is an RRC (Radio Resource Control) service state in which cell

reselection is performed. This feature prevents dropping of RRC connections. Inter-frequency reselection in

Cell_FACH

Radio link failure

Radio link failure is a procedure that indicates an ‗out-of-synch‘ state on one or more radio links. Node B of the RNC (Radio Network Controller) reports this event before attempting resynchronization. The radio link restoration procedure indicates restoration of the ‗synchronized‘ state.

SIB scheduling SIB (System Information Block) scheduling controls the broadcasting of information to user equipment in a cell. The user equipment retrieves the schedule, and is then able to change to sleep mode, receiving only those blocks that it needs.

SIB modification

Re-establishment procedure Following a radio link failure, the RNC maintains the RRC connection, waiting for re-establishment.

VT + PS call (subject to network availability)

Simultaneous VT (Video Terminal) and PS (Packet Switched) calls are supported.

Packet Cell Change Order from

GSMUTRAN Call transfer between GSM-based and UTRAN-based cells is supported.

Background PLMN search Improved algorithm for Higher Priority PLMN (HPPLMN) search while camped on a 3G cell.

Configurable Release 5 or Release 99 support

Circuit-switched data bearers

Data bearers

These circuit-switched data bearers are supported on 3G networks:

Synchronous transparent mode = 64000 bps

Synchronous transparent mode = 56000 bps

Asynchronous V110 UDI = 14400 bps

Asynchronous V110 UDI = 28800 bps

Asynchronous V110 UDI = 38400 bps

Asynchronous V120 = 14400 bps

Asynchronous V120 = 28800 bps

Asynchronous V120 = 56000 bps

HSDPA

Data rates The following data rates are supported:

Category 10 (14.4 Mbps)

HSDPA logical channels

These HSDPA logical channels are supported:

HS-SCCH

HS-DPCCH

HS-PDSCH—Up to ten HS-PDSCH channels are supported.

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Item Comments

HSDPA transport channels

HS-DSCH is supported at these rates:

120 kbps

240 kbps

360 kbps

Incremental redundancy

IR adjusts the physical layer code rate to actual channel conditions by incrementally transmitting redundant information until decoding is successful. Automatic Repeat Request (ARQ) protocol takes care of requesting and retransmitting incorrectly received blocks. ARQ enables both dynamic RLC window management (to avoid window stalling) and dynamic RLC polling frequency (to minimize retransmission delay and save radio bandwidth).

Chase combining retransmission scheme

The Chase combining retransmission scheme is the simplest HARQ (Hybrid Automatic Request) link adaptation technique. HARQ techniques are used to enhance system performance.

HSDPA Compressed Mode Allows the user equipment to interrupt transmission and reception during a call for brief periods in order to measure the signal strength of neighbouring cells that use different frequencies.

(MC8090)

Concurrent voice and HSDPA data

(TBD)

HSDPA Indicator Allows user interface to display an indicator when HSDPA data transfer is in progress.

Receiver equalizer support

Miscellaneous

Fast link adaptation The data rate is adapted to radio conditions.

Vary the effective code rate The effective code rate is varied based on code space resources.

HARQ, MAC-HS disassembly

MAC-HS (High Speed MAC) is the base station MAC (Medium Access Control) protocol. MAC-HS enables fast radio resource allocation.

MAC-HS reordering queue distribution and processing support

Cell change

These cell change methods are supported:

Synchronous and non-synchronous

Intra-Node B (softer repointing)

Inter-Node B (soft repointing)

Up-switching and down-switching of PS RAB between HS-PDSCH and DPCH

RAB (Radio Access Bearer) and channel mappings between the HS-PDSCH (High Speed Physical Downlink Shared Channel) and DPCH (Dedicated Physical Channel) are reallocated according to volume thresholds and inactivity timers.

Ciphering on the HS channel Ciphering on high-speed channels protects radio-transmitted data against unauthorized third parties.

Support to not resume the HS channel if inter-RAT handover fails, but save the RB mapping information

RB (Radio Bearer) mapping information is preserved if a high-speed channel is dropped due to the failure of an inter-RAT (Radio Access Technology) transfer.

Support to not resume the HS channel if a radio link failure occurs, but save the RB mapping information

RB (Radio Bearer) mapping information is preserved if a high-speed channel is dropped due to a radio link failure.

WINS address support primary and secondary

Primary and secondary IP addresses can be assigned for WINS (Windows Internet Name Service) name servers.

(MC8090/MC8092 with PCM)

Voice support Digital audio (PCM) is supported.

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Item Comments

Unstructured supplementary services data (USSD)

USSD provides support for transmitting information over the GSM network signalling channels. It provides fast session-based communication between the user and an application, enabling use of text messaging, prepaid roaming, chat, etc.

Supplementary services Support for supplementary voice services such as Call Hold, Call Forward, Call Waiting, Multi-party Calls, Caller ID, Fixed Number Dialling, Service Dialling Numbers, etc.

Cell reselection / handover Supports InterRat and InterFrequency cell-reselection and handover between supported frequency bands.

Security - IMEI Security

SIM lock The device can be ‗MEP locked‘ to a particular PLMN.

SIM security Both CHV1 and CHV2 are supported (unlock and unblock).

7.3. UMTS (WCDMA)/GSM Specifications

Table 55. UMTS (WCDMA)/GSM Specifications

Item GSM UMTS

Mobility management

Automatic PLMN selection / reselection

Location updating procedure

IMSI attach procedure

IMSI detach procedure

Periodic location update

Authentication procedure

CM connection establishment from MS or network

CM connection release

Encryption key management

TMSI reallocation

Paging response

Abort procedure

Identification

CN system information

Call re-establishment

MM connection establishment emergency calls

Inter-RAT change procedure

CS follow-on procedure

Access class barring

Resumption procedure for Class B operation in GPRS

Handling of domain change CS to CS/PS and other combinations

MM information

Network mode of operation I, II

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Item GSM UMTS

GPRS mobility management

GPRS attach

GPRS detach

Routing area update

GPRS authentication

GPRS identification

GMM status

Periodic routing area update

Ciphering

Access class barring

GMM status

Combined GPRS attach

Combined GPRS detach

Combined routing location / area update

PS SMS

Network initiated combined GPRS detach

Network mode of operation change

RAB management

QoS-based activation, network offers lower / higher QoS

Primary PDP context activation

PDP context deactivation

Data services

AT commands

MS PS data calls

Single PDP context

PDP type PPP

PDP type IP

9.6 / 14.4 CS transparent data N/A

9.6 / 14.4 CS nontransparent data N/A

Fax

MT Sync CS data calls

MO Sync CS data calls

V.80 N/A

V.42bis N/A

Multiple PDP context profiles (up to 16)

SMS specifications

CS domain MT SMS point-to-point

CS domain MO SMS point-to-point

SMMA

Dedicated mode

Message classes 0, 1, 2, 3, none

SMS / SMSP / SMSS access from SIM / USIM

Reply path

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Item GSM UMTS

Validity period

PS domain MT SMS point-to-point

PS domain MO SMS point-to-point

SMS status reports

SMS commands

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8. Reliability Compliance and Recommended Standards

8.1. Reliability Compliance

Table 56. Standards Conformity for the AirPrime MC8090/MC8092 Mini Card

Abbreviation Definition

IEC International Electro technical Commission

ISO International Organization for Standardization

8.2. Applicable Standards

Note: References to any features can be found from these standards.

Table 57. Applicable Standards and Requirements

DocumentCurrent Version

Title

IEC6006826 7.0 Environmental testing - Part 2.6: Test FC: Sinusoidal Vibration.

IEC60068234 73

Basic environmental testing procedures part 2: Test FD: random vibration wide band - general requirements

Cancelled and replaced by IEC60068-2-64. For reference only.

IEC60068264 2.0Environmental testing - part 2-64: Test FH: vibration, broadband random and guidance.

IEC60068232 2.0Basic environmental testing procedures - part 2: Test ED: (procedure 1) (withdrawn & replaced by IEC60068-2-31).

IEC60068231 2.0 Environmental testing part 2-31: Test EC: rough handling shocks, primarily for equipment-type specimens.

IEC60068229 2.0

Basic environmental testing procedures - part 2: Test EB and guidance: bump

Withdrawn and replaced by IEC60068-2-27. For reference only.

IEC60068227 4.0 Environmental testing - part 2-27: Test EA and guidance: shock.

IEC60068214 6.0 Environmental testing - part 2-14: Test N: change of temperature.

IEC6006822 5.0 Environmental testing - part 2-2: Test B: dry heat.

IEC6006821 6.0 Environmental testing - part 2-1: Test A: cold.

IEC60068230 3.0 Environmental testing - part 2-30: Test DB: damp heat, cyclic (12 h + 12 h cycle).

IEC6006823 69 w/A1

Basic environmental testing procedures part 2: Test CA: damp heat, steady State

Withdrawn and replaced by IEC60068-2-78. For reference only.

IEC60068278 1.0 Environmental testing part 2-78: Test CAB: damp heat, steady state.

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DocumentCurrent Version

Title

IEC60068238 2.0 Environmental testing - part 2-38: Test Z/AD: composite temperature/humidity cyclic test.

IEC60068240 1.0 w/A1 Basic environmental testing procedures - part 2: Test Z/AM combined cold/low air pressure tests.

ISO167501 2ND Road vehicles - environmental conditions and testing for electrical and electronic equipment - part 1: general.

ISO167502 2ND Road vehicles - environmental conditions and testing for electrical and electronic equipment - part 2: electrical loads.

ISO167503 2ND Road vehicles - environmental conditions and testing for electrical and electronic equipment - part 3: mechanical loads.

ISO167504 2ND Road vehicles - environmental conditions and testing for electrical and electronic equipment - part 4: climatic loads.

IEC60529 2.1 w/COR2 Degrees of protection provided by enclosures (IP code).

IEC60068217 4.0 Basic environmental testing procedures - part 2: Test Q: sealing.

IEC60068218 2.0 Environmental testing - part 2-18: Tests - R and guidance: water.

IEC60068270 1.0 Environmental testing - part 2: tests - test XB: abrasion of markings and letterings caused by rubbing of fingers and hands.

IEC60068268 1.0 Environmental testing - part 2: tests - test l: dust and sand.

IEC60068211 3.0 Basic environmental testing procedures, part 2: test KA: salt mist.

IEC60068260 2.0 Environmental testing - part 2: Test KE: flowing mixed gas corrosion test.

IEC60068252 2.0 w/COR Environmental testing - part 2: Test KB: salt mist, cyclic (sodium chloride solution).

8.3. Environmental Specifications

Table 58. Operating Class Temperature Range

Conditions Temperature Range

Operating/Class A -30°C to +70°C

Operating/Class B -40°C to +85°C

Storage -40 °C to +85°C

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8.3.1. Function Status Classification

Note: The word “function” as used here concerns only the function performed by the MC8090/MC8092 mini card.

Table 59. ISO Failure Mode Severity Classification

Class Description

Class AThe MC8090/MC8092 mini card remains fully functional during and after environmental exposure; and shall meet the minimum requirements of 3GPP or appropriate wireless standards.

Class B

The MC8090/MC8092 mini card remains fully functional during and after environmental exposure; and shall exhibit the ability to establish a voice, SMS or DATA call at all times even when one or more environmental constraint exceeds the specified tolerance. Unless otherwise stated, full performance should return to normal after the excessive constraint(s) have been removed.

8.4. Reliability Prediction Model

8.4.1. Life Stress Test

Table 60. Life Stress Test

Designation Condition

Performance Test PT3T° & PT

Standard: N/A

Special conditions:

Temperature:

Class A: -30°C to +70°C

Class B: -40°C to +85°C

Rate of temperature change: ± 3°C/min

Recovery time: 3 hours

Operating conditions: Powered

Duration: 14 days

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8.4.2. Environmental Resistance Stress Tests

Table 61. Environmental Resistance Stress Tests

Designation Condition

Cold Test Active

COTA

Standard: IEC 680068-2-1, Test Ad

Special conditions:

Temperature:

Rate of temperature change: dT/dt >= ± 3°C/min

Recovery time: 3 hours

Operating conditions: Powered

Duration: 72 hours

Cold Test Active

COTP

Standard: IEC 680068-2-1, Test Ab

Special conditions:

Temperature: -40°C

Rate of temperature change: dT/dt >= ± 3°C/min

Recovery time: 3 hours

Operating conditions: Un-powered

Duration: 72 hours

Resistance to Heat Test

RH

Standard: IEC 680068-2-2, Test Bb

Special conditions:

Temperature: +85°C

Rate of temperature change: dT/dt >= ± 3°C/min

Recovery time: 3 hours

Operating conditions: The DUT is switched ON for 1 min and then OFF for 1 min

Duration: 50 days

Dry Heat Test

DHT

Standard: IEC 680068-2-2, Test Bb

Special conditions:

Temperature: +85°C

Rate of temperature change: dT/dt >= ± 3°C/min

Recovery time: 3 hours

Operating conditions: Un-powered

Duration: 72 hours

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8.4.3. Corrosive Resistance Stress Tests

Table 62. Corrosive Resistance Stress Tests

Designation Condition

Humidity Test

HT

Standard: IEC 60068-2-3

Special conditions:

Temperature: +65°C

RH:

Rate of temperature change: dT/dt >= ± 3°C/min

Recovery time: 3 hours

Operating conditions: The DUT is switched ON for 15 minutes and then OFF for 15 minutes

Duration: 10 days

Moist Heat Cyclic Test

MHCT

Standard: IEC 60068-2-30, Test Db

Special conditions:

Upper temperature: +40 ± 2°C

Lower temperature: +25 ± 2°C

RH:

Upper temperature: 93%

Lower temperature: 95%

Number of cycles: 21 (1 cycle/24 hours)

Rate of temperature change: dT/dt >= ± 3°C/min

Recovery time: 3 hours

Operating conditions: Un-powered

Duration: 21 days

8.4.4. Thermal Resistance Cycle Stress Tests

Table 63. Thermal Resistance Cycle Stress Tests

Designation Condition

Thermal Shock Test

TSKT

Standard: IEC 60068-2-14, Test Na

Special conditions:

Upper temperature: +90°C

Lower temperature: -40°C

Rate of temperature change: 30s

Number of cycles: 300 (MC8090/MC8092 with PCM), 50 (MC8090/MC8092 with UART)

Duration of exposure: 20 minutes

Recovery time: 3 hours

Operating conditions: Un-powered

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Designation Condition

Duration: 8 days

Temperature Change

TCH

Standard: IEC 60068-2-14, Test Nb

Special conditions:

Upper temperature: +90°C

Lower temperature: -40°C

Rate of temperature change: dT/dt >= ± 3°C/min

Number of cycles: 400

Duration of exposure: 10 minutes

Recovery time: 3 hours

Operating conditions: Un-powered

Duration: 30 days

8.4.5. Mechanical Resistance Stress Tests

Table 64. Mechanical Resistance Stress Tests

Designation Condition

Sinusoidal Vibration Test SVT

Standard: IEC 60068-2-6, Test Fc

Special conditions:

Frequency range Hz to 000Hz

Displacement: 0.35mm (peak)

Frequency range: Hz to 62Hz

Acceleration: 5G

Frequency range: 62Hz to 200Hz

Acceleration: 3G

Frequency range: 200Hz 00Hz

Acceleration: 1G

Sweep rate: 1 octave/min

Test duration

Sweep directions: X, Y and Z

Operating conditions: Un-powered

Duration: 72 hours

Random Vibration Test

RVT

Standard: IEC 60068-2-64

Special conditions:

Density m /s3

Frequency range

0.1 g2/Hz at 10Hz

0.01 g2/Hz at 250Hz

0.0005 g2/Hz at 1000Hz

0.0005 g2/Hz at 2000Hz

Slope: -3dB/octave

Acceleration: 0.9gRMS

Number of axis: 3

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Designation Condition

Operating conditions: Un-powered

Duration: 24 hours

Mechanical Shock Test

MST

Standard: IEC 60068-2-27, Test Ea

Special conditions:

Shock Test 1:

Wave form: Half sine

Peak acceleration: 30G

Duration: 11ms

Number of shocks: 8 per direction

Number of directions: 6 (±X, ±Y, ±Z)

Shock Test 2:

Wave form: Half sine

Peak acceleration: 100G

Duration: 6ms

Number of shocks: 3 per direction

Number of directions: 6 (±X, ±Y, ±Z)

Operating conditions: Un-powered

Duration: 72 hours

8.4.6. Handling Resistance Stress Tests

Table 65. Handling Resistance Stress Tests

Designation Condition

ESD Test

Standard: IEC 1000-4-2

Special conditions:

Contact and Air discharges: 10 positive and 10 negative applied

Contact Voltage:

Air Voltage : 2kV,

Operating conditions: Powered

Duration: 24 hours

Free Fall Test

FFT 1

Standard : IEC 60068-2-32, Test Ed

Special conditions:

Drop: 2 samples for each direction

Equivalent drop height: 1m

Number of directions: 6 (±X, ±Y, ±Z)

Number of drops/face: 2

Operating conditions: Un-powered

Duration: 24 hours

Free Fall Test Standard : Standard Sierra Wireless Methodology

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Designation Condition

FFT 2

Special conditions:

Drop: 2 samples for each direction

Equivalent drop height: 1.5m

Number of directions: 6 (±X, ±Y, ±Z)

Number of

DUT in end-user host device

Operating conditions: Un-powered

Duration: 24 hours

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9. Design Guidelines

9.1. SIM Interface Routing Constraint

9.2. EMC and ESD Recommendations

Note: The AirPrime MC8090/MC8092 mini card does not include any protection against over voltage.

Note: The level of protection required depends on your application.

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Table 66. ESD Specifications

Connection Specification

Operational The RF port (antenna launch and RF connector) complies with the following standard:

IEC 61000-4-2 Electrostatic Discharge Immunity:

Test: Level3

Contact Discharge: ±6 kV

Air Discharge: ±8 kV

Non-operational The host connector Interface complies with the following standards only:

±1 kV Human Body Model (JESD22-A114-B)

±125 V Charged Device Model (JESD22-C101)

9.3. Mechanical Integration

Note: Attention should be paid to antenna cable integration (bending, length, position, etc).

9.4. Operating System Upgrade

Tip: In order to follow regular changes in the GPRS standard and to offer a state-of-the-art operating system, Sierra Wireless recommends that the application designed around a mini card (or mini card based product) should allow easy operating system upgrades on the mini card via the recommended firmware download protocol (see document [7] AirCard/AirPrime USB Driver Developer’s Guide). Therefore, the application shall either allow a direct access to the mini card serial interface through an external connector or implement any mechanism allowing the mini card operating system to be downloaded.

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10. Embedded Testability

10.1. Testing Assistance Provided by Sierra Wireless

10.2. Integration Requirements

10.3. IOT/Operator

10.4. Module Testing Recommendations

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Figure 17. Recommended Thermocouple Location

Note: Make sure that your system design provides sufficient cooling for the module. The RF shield temperature should be kept below 90°C when integrated to prevent damaging the module’s components.

10.5. Serial Link Access

10.6. RF Output Accessibility

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11. Certification Compliance and Recommended Standards

11.1. UMTS Compliance Acceptance and Certification

Note: Tests that require features not supported by the MC8090/MC8092 (as defined by this document) are not supported.

11.2. Certification Compliance

Table 67. Standards Conformity for the MC8090/MC8092 Mini Card

Domain Applicable Standard MC8090 MC8092

Safety standard EN 60950-1 (ed.2006)

Health standard (EMF Exposure Evaluation)

EN 62311 (ed. 2008)

Efficient use of the radio frequency spectrum

EN 301 511 (V 9.0.2)

EMC EN 301 489-1 (v1.8.1)

EN 301 489-7 (v1.3.1)

FCC FCC Part 22, 24

IC RSS-132 Issue 2

RSS-133 Issue 5

EU

FTA GCF regulatory certification

CE Mark regulatory certification of compliance

Interoperability Testing (IOT)

CE CE

A-Tick certification

North / Latin America operators / carriers

PTCRB approval per NAPRD requirement

AT&T

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11.3. Applicable Standards

11.3.1. Important Notice

11.3.2. Safety and Hazards

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11.3.3. Important Compliance Information for North American Users

Note: If this mini card is intended for use in a portable device, you are responsible for separate approval to satisfy the SAR requirements of FCC Part 2.1093 and IC RSS-102.

11.3.4. EU Regulatory Conformity

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12. Customization

Table 68. Customizable Features

Name Description Default

MEP network locked Mobile Equipment Personalization network locked to only allow use with specific preconfigured PLMNs (SIMs). MMI supports the entry of an unlock code subject to permanent locking feature below.

Off

MEP service provider locked

Permanent MEP locked Can block deactivation of MEP locked feature Off

Roaming indicator disable*

Watcher never shows the onscreen roaming indicator.

Indicator enabled

SIM PUK prompt enable If enabled, Watcher shows the message "SIM blocked please enter PIN code".

Disabled, Watcher displays "Contact Service Provider" when SIM PIN is blocked

Scan for profile The modem scans through all its programmed profiles to find successful GPRS connection.

Not scanning. Only the selected profile is used for connection.

Display of IMSI Display of International Mobile Subscriber Identity via AT+CIMI command

Display enabled

UART baudrate Default UART speed 115200 bps

UART enabled Defines whether UART port is enabled by default or not

UART enabled

* Only available if supported in the user interface.

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13. Signal Reference Schematics

Figure 18. USB Interface

Figure 19. SIM Interface

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14. References

14.1. Web Site Support

14.2. Reference Documents

14.2.1. Sierra Wireless Documentation

14.2.2. Industry/ Other Documentation

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14.3. List of Abbreviations

Abbreviation Definition

AC Alternative Current

ADC Analog to Digital Converter

A/D Analog to Digital conversion

AF Audio-Frequency

AT Attention (prefix for modem commands)

AUX Auxiliary

CAN Controller Area Network

CB Cell Broadcast

CEP Circular Error Probable

CLK Clock

CMOS Complementary Metal Oxide Semiconductor

CS Coding Scheme

CTS Clear To Send

DAC Digital to Analogue Converter

dB Decibel

DC Direct Current

DCD Data Carrier Detect

DCE Data Communication Equipment

DCS Digital Cellular System

DR Dynamic Range

DSR Data Set Ready

DTE Data Terminal Equipment

DTR Data Terminal Ready

EDGE Enhance Data rates for GSM Evolution

EFR Enhanced Full Rate

E-GSM Extended GSM

EGPRS Enhance GPRS

EMC Electromagnetic Compatibility

EMI Electromagnetic Interference

EMS Enhanced Message Service

EN Enable

ESD Electrostatic Discharges

FIFO First In First Out

FR Full Rate

FTA Full Type Approval

GND Ground

GPI General Purpose Input

GPC General Purpose Connector

GPIO General Purpose Input Output

GPO General Purpose Output

GPRS General Packet Radio Service

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Abbreviation Definition

GPS Global Positioning System

GSM Global System for Mobile communications

HR Half Rate

I/O Input / Output

LED Light Emitting Diode

LGA Land Grid Array

LNA Low Noise Amplifier

MAX Maximum

MIC Microphone

MIN Minimum

MMS MultiMedia Message Service

MO Mobile Originated

MT Mobile Terminated

na Not Applicable

NC Not Connected

NF Noise Factor

NMEA National Marine Electronics Association

NOM Nominal

NTC Negative Temperature Coefficient

PA Power Amplifier

Pa Pascal (for speaker sound pressure measurements)

PBCCH Packet Broadcast Control Channel

PC Personal Computer

PCB Printed Circuit Board

PDA Personal Digital Assistant

PFM Power Frequency Modulation

PSM Phase Shift Modulation

PWM Pulse Width Modulation

RAM Random Access Memory

RF Radio Frequency

RFI Radio Frequency Interference

RHCP Right Hand Circular Polarization

RI Ring Indicator

RST Reset

RTC Real Time Clock

RTCM Radio Technical Commission for Maritime services

RTS Request To Send

RX Receive

SCL Serial Clock

SDA Serial Data

SIM Subscriber Identification Module

SMS Short Message Service

SPI Serial Peripheral Interface

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Abbreviation Definition

SPL Sound Pressure Level

SPK Speaker

SRAM Static RAM

TBC To Be Confirmed

TDMA Time Division Multiple Access

TP Test Point

TVS Transient Voltage Suppressor

TX Transmit

TYP Typical

UART Universal Asynchronous Receiver-Transmitter

USB Universal Serial Bus

USSD Unstructured Supplementary Services Data

VSWR Voltage Standing Wave Ratio

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15. Safety Recommendations (For Information Only)

15.1. RF Safety

15.1.1. General

15.1.2. Exposure to RF Energy

15.1.3. Efficient Terminal Operation

15.1.4. Antenna Care and Replacement

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Safety Recommendations (For Information Only)

15.2. General Safety

15.2.1. Driving

15.2.2. Electronic Devices

15.2.3. Vehicle Electronic Equipment

15.2.4. Medical Electronic Equipment

15.2.5. Aircraft

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Safety Recommendations (For Information Only)

15.2.6. Children

15.2.7. Blasting Areas

.

15.2.8. Potentially Explosive Atmospheres

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