PRODUCT / PROCESS CHANGE NOTIFICATION PCN-000401.r3 … · PRODUCT / PROCESS CHANGE NOTIFICATION...

PRODUCT / PROCESS CHANGE NOTIFICATION

PCN-000401.r3

Date: 5APR2020 P1/2

Semtech Corporation • 200 Flynn Road • Camarillo • Ca • 93012 • Phone +1 (805) 498-2111

Semtech Corporation, 200 Flynn Road, Camarillo CA 93012 Semtech Canada Corporation, 4281 Harvester Road, Burlington, Ontario L7L 5M4 Canada Semtech Irvine, 5141 California Ave., Suite 100, Irvine CA 92617 Semtech Neuchatel Sarl, Route des Gouttes d’Or 40, CH-2000 Neuchatel Switzerland Nanotech Semiconductor, Semtech Corporation, 2 West Point Court, Bristol, United Kingdom, BS32 4PY Semtech Corpus Christi SA de CV, Carretera Matamorros Edificio 7, Reynosa, Tamaulipas, Mexico 88780

Change Details Semtech Part Number(s) Affected:

San Antonio Fab 9 Huatian Assembly

RClamp3331ZA RClamp3331ZA

RClamp5011ZA RClamp5011ZA

Customer Part Number(s) Affected: N/A

Description, Purpose and Effect of Change: For the benefit of our customers, Semtech has qualified additional manufacturing capacity for Protection Products. A second wafer fabrication facility and a second assembly facility have been brought on line that duplicates our current wafer and assembly manufacturing processes. a. Additional Wafer Fabrication Capacity – “San Antonio, Fab 9”, San Antonio, TX USA b. Additional Assembly and Test Capacity – Huatian Electronics Co, Ltd, China

Change Classification Major Minor Impact to Form, Fit,

Function Yes No

Impact to Data Sheet Yes No New Revision or Date N/A

Impact to Performance, Characteristics or Reliability:

• NO impact to data sheet content or package dimensions • NO impact to performance, characteristics; or reliability

Implementation Date 5JUL2020 Work Week Predicated upon receipt

of customer approval Last Time Ship (LTS)

Of unchanged product N/A

Additional Capacity Affecting Lot No. /

Serial No. (SN) N/A

Sample Availability Immediate Reliability Report Availability Enclosed

Supporting Documents for Change Validation/Attachments:

a. Rel Report: 6247_1_2_UClamp3331ZA_3321ZA_final – Enclosure 1 b. Rel Report: 6273_1_RClamp5011ZA_final – Enclosure 2 c. Char Report - RC3331ZA RJ6276 3 AER-3808 _Validation R1 – Enclosure 3 d. Char Report - RC5011ZA RJ6276 2 AER-3813 _Validation R1 – Enclosure 4 e. Site Audit Report: San Antonio, Fab 9 – Enclosure 5 f. Site Audit Report: Huatian, Kunshan – Enclosure 6

Issuing Authority

PRODUCT / PROCESS CHANGE NOTIFICATION

PCN-000401.r3

Date: 5APR2020 P2/2

Semtech Corporation • 200 Flynn Road • Camarillo • Ca • 93012 • Phone +1 (805) 498-2111

Semtech Business Unit: Protection

Semtech Contact Info:

Les Fang Yuen Sr.Engineering Manager, QA Semtech Corporation 200 Flynn Road Camarillo, CA 93012 [email protected] Office: (949) 269 4443 Fax: (805) 498-3804

FOR FURTHER INFORMATION & WORLDWIDE SALES COVERAGE: http://www.semtech.com/contact/index.html#support

Enclosures:

http://www.semtech.com/contact/index.html#support

Rel Job Detail Report by Sublot, by Sequence Contact: Gurmail Sajjan

(805) 480 2142 [email protected]

Friday, February 03, 2017 Page 1 of 3

6247 RClamp3331ZA / uClamp3321ZA

New Vendor (Kun Shan China) Package Qu

New Product on qualified process and qualified package

20-Oct-2016

20-Oct-2016

ASMC14TVS

HTKS

Rel Testing Complete Passes All Requirements

Actual Start Date:.

Job Accepted:

Job ECD: 02_Feb-2017

Requested CD:

ECD for Conditional:

18 Precond_HTS_24hr 154 Pass on Zero Fails 04-Nov-2016 0 Camarillo

5 BI_BD_Valid NA Meet HTOL Schematics

02-Nov-2016 0 Camarillo

6 HTRB_150°C_0072 105 Pass on Zero Fails 07-Nov-2016 0 Camarillo

7 HTRB_150°C _0408 105 Pass on Zero Fails 21-Nov-2016 0 Camarillo

4 HTRB_Pre_Elect 105 Pass on Zero Fails 02-Nov-2016 0 Camarillo

1 Data-Prep None None 01-Nov-2016 Camarillo

2 HTRB_Pre_Elect_150°C_RT24 210 Pass on Zero Fails 02-Nov-2016 0 Camarillo

3 HTRB_150°C_Real Time_0024 210 Pass on Zero Fails 04-Nov-2016 0 Camarillo

15 Pre_Conditioning_Level_1 NA MSL 1 02-Nov-2016 Camarillo

16 Pre_Elect_Precond 154 Pass on Zero Fails 03-Nov-2016 0 Camarillo

17 Precond_Temp_Cyc_5cyc 154 Pass on Zero Fails 03-Nov-2016 0 Camarillo

11 HTS_1000 77 Pass on Zero Fails 14-Dec-2016 0 Camarillo

8 HTS_Pre_Elect 77 Pass on Zero Fails 02-Nov-2016 0 Camarillo

9 HTS_0168 77 Pass on Zero Fails 09-Nov-2016 0 Camarillo


1.0 Lot AssemblyLot DateCodeAER3570 Wafer # 5 AER3570 Wafer # 5 1638

Seq TaskCode SampleSize Criteria Complete Failures DataSource Results/Comments

Completed Tasks

.

Businessunit Protection

Reljob# Part_Number, Job Name/Type Key Dates:Fab, Package Rel Job Status




4 HTRB_Pre_Elect 105 Pass on Zero Fails 02-Nov-2016 0 Camarillo


02-Nov-2016 0 Camarillo

6 HTRB_150°C_0072 105 Pass on Zero Fails 07-Nov-2016 0 Camarillo

1 Data-Prep None None 01-Nov-2016 Camarillo

2 HTRB_Pre_Elect_150°C_RT24 210 Pass on Zero Fails 02-Nov-2016 0 Camarillo

3 HTRB_150°C_Real Time_0024 210 Pass on Zero Fails 08-Nov-2016 0 Camarillo

7 HTRB_150°C _0408 105 Pass on Zero Fails 21-Nov-2016 0 Camarillo

8 HTS_Pre_Elect 77 Pass on Zero Fails 02-Nov-2016 0 Camarillo


2.0 Lot AssemblyLot DateCodeAER3571 Wafer # 9 AER3571 Wafer # 9 1636


28 85°C/85%RH_Biased_500hrs 77 Pass on Zero Fails 13-Dec-2016 0 Camarillo

27 85°C/85%RH_Biased_168hrs 77 Pass on Zero Fails 29-Nov-2016 0 Camarillo

26 85°C/85%RH_BD_Valid 77 Pass on Zero Fails 21-Nov-2016 0 Camarillo

29 85°C/85%RH_Biased_1000hrs 77 Pass on Zero Fails 03-Jan-2017 0 Camarillo

32 Pack_Clos 0 0 04-Jan-2017 Camarillo

31 Rider_Card_Wash/Bake 154 Pass on Zero Fails 02-Nov-2016 0 Camarillo

30 Construct_Package 5 unique packaged devices minimum.

No Major Findings, Q&R to review construction analysis report.

05-Dec-2016 0 Camarillo

21 T/C_Pre_Elect 77 Pass on Zero Fails 11-Nov-2016 0 Camarillo

20 Precond_260°C_IR_Ref_Char 154 Pass on Zero Fails 11-Nov-2016 0 Camarillo

19 Precond_85/85_NoElec168hr 154 Pass on Zero Fails 11-Nov-2016 0 Camarillo

22 T/C_wPre_0250 77 Pass on Zero Fails 17-Nov-2016 0 Camarillo

25 85°C/85%RH_W/Pre_Pre Elec 77 Pass on Zero Fails 11-Nov-2016 0 Camarillo

24 T/C_wPre_1000 77 Pass on Zero Fails 02-Dec-2016 0 Camarillo





24 85°C/85%RH_W/Pre_Pre Elec 77 Pass on Zero Fails 11-Nov-2016 0 Camarillo

25 85°C/85%RH_BD_Valid 77 Pass on Zero Fails 21-Nov-2016 0 Camarillo


23 T/C_wPre_1000 77 Pass on Zero Fails 02-Dec-2016 0 Camarillo

26 85°C/85%RH_Biased_168hrs 77 Pass on Zero Fails 29-Nov-2016 0 Camarillo

29 Rider_Card_Wash/Bake 154 Pass on Zero Fails 12-Nov-2016 0 Camarillo


27 85°C/85%RH_Biased_500hrs 77 Pass on Zero Fails 13-Dec-2016 0 Camarillo


15 Pre_Elect_Precond 154 Pass on Zero Fails 03-Nov-2016 0 Camarillo

16 Precond_Temp_Cyc_5cyc 154 Pass on Zero Fails 03-Nov-2016 0 Camarillo


11 HTS_1000 77 Pass on Zero Fails 14-Dec-2016 0 Camarillo

17 Precond_HTS_24hr 154 Pass on Zero Fails 04-Nov-2016 0 Camarillo

20 T/C_Pre_Elect 77 Pass on Zero Fails 11-Nov-2016 0 Camarillo


18 Precond_85/85_NoElec168hr 154 Pass on Zero Fails 11-Nov-2016 0 Camarillo

19 Precond_IR_Refl_Char 154 Pass on Zero Fails 11-Nov-2016 0 Camarillo

Lot Assembly_Lot Date_Code

Seq Task_Code SampleSize Criteria ECD I-Failures Data_Source Results/Comments FA

In-Complete Tasks



Wednesday, February 01, 2017 Page 1 of 6

6273 RClamp5011ZA

Process Qual

New Product on un-qualified process with qualified package

02-Dec-2016

02-Dec-2016

Tower

SLP0603P2X3F

Rel Testing Complete Passes All Requirements

Actual Start Date:.

Job Accepted:

Job ECD: 02-Feb-2017

Requested CD:

ECD for Conditional:

16 Precond_Temp_Cyc_5cyc 154 Pass on Zero Fails 07-Dec-2016 0 Camarillo

17 Precond_HTS_24hr 154 Pass on Zero Fails 08-Dec-2016 0 Camarillo

15 Pre_Elect_Precond 154 Pass on Zero Fails 07-Dec-2016 0 Camarillo

4 HTRB_Pre_Elect 105 Pass on Zero Fails 03-Jan-2017 0 Camarillo


03-Jan-2017 0 Camarillo

6 HTRB_150°C_0072 105 Pass on Zero Fails 06-Jan-2017 0 Camarillo

1 Data-Prep None None 05-Dec-2016 Camarillo

2 HTRB_Pre_Elect_150°C_RT24 105 Pass on Zero Fails 09-Jan-2017 0 Camarillo

3 HTRB_150°C_Real Time_0024 105 Pass on Zero Fails 13-Jan-2017 0 Camarillo

12 85/85_W/Pre_Pre Elec 27 Pass on Zero Fails 11-Jan-2017 0 Camarillo

13 85°C/85%RH_BD_Valid 20 Pass on Zero Fails 11-Jan-2017 0 Camarillo

14 85/85_120hr_On/Off 20 Pass on Zero Fails 16-Jan-2017 0 Camarillo

7 HTRB_150°C _0408 105 Pass on Zero Fails 20-Jan-2017 0 Camarillo

8 HTS_Pre_Elect 77 Pass on Zero Fails 08-Dec-2016 0 Camarillo

11 HTS_1000 77 Pass on Zero Fails 19-Jan-2017 0 Camarillo

1.0 Lot AssemblyLot DateCodeAER3687 AER3687 1646


Completed Tasks

.

Businessunit Protection

Reljob# Part_Number, Job Name/Type Key Dates:Fab, Package Rel Job Status



Wednesday, February 01, 2017 Page 2 of 6


25 85°C/85%RH_BD_Valid 77 Pass on Zero Fails 16-Dec-2016 0 Camarillo



29 Rider_Card_Wash/Bake 154 06-Dec-2016 0 Camarillo

19 Precond_IR_Refl_Char 154 Pass on Zero Fails 15-Dec-2016 0 Camarillo

18 Precond_85/85_NoElec168hr 154 Pass on Zero Fails 15-Dec-2016 0 Camarillo

20 T/C_Pre_Elect 77 Pass on Zero Fails 15-Dec-2016 0 Camarillo

24 85°C/85%RH_W/Pre_Pre Elec 77 Pass on Zero Fails 05-Dec-2016 0 Camarillo

23 T/C_wPre_1000 77 Pass on Zero Fails 05-Jan-2017 0 Camarillo

Lot Assembly_Lot Date_Code

Seq Task_Code SampleSize Criteria ECD I-Failures Data_Source Results/Comments FA

In-Complete Tasks

SEMDOC001607 SIP BU - Internal Audit Report Template Rev 3

1

Audit Report

Audit #: AUD-000218

Process: Fab Process Qualification

Audit Date: Dec 6th and 7th, 2016

Auditor: Luis Blanco, Nour Matine, Dan Rodriguez - Semtech

Auditee: TJ Texas Team – Semtech main contact (Anilkumar Kodali)

Department: Quality Manager

Location: 9651 Westover Hills Blvd, San Antonio, TX 78251, USA

Audit non- conformance summary

Major Minor OFI Actions 0 3 7 9

1 Audit trail & evidence: • ISO Certificates for ISO9001, ISO14001, ISO18001 • Quality Management System: Document ID# 10-0139 • SPC Manual: Document ID#10-0009 • Change Control Procedure: Document ID#03-1074 • MRB Procedure Spec: Document ID# 03-0811 • Manufacturing Line Audit

2 Highlights: • The Process Release Documentation (PRD’s) for process transfer is an excellent initiative to

document and freeze processes. • The SAMENESS process for tool correlation provides robust methodology for customer’s

confidence. • Excellent synergy between Operation team and Engineering. • Calibration has good tracking and compliance. • PM records showed consistency and proper management. • Engineering personnel holds >15 years’ experience


2

3 Audit Notes:

3.1 Texas Site Overview: - Texas plant was acquired by TJ beginning of 2015. Formally a Maxim’s facility. - It has around 100 Acres, ~ 500 employees on which 20% are on the engineering level. Rest of

personnel is operations and supporting teams. - Technologies includes from 0.18 um to 0.8 um BCD and some customs processes. - Under today’s loading scenario, Texas TJ operations can ramp 2X PALM process (going from 150

wafers a week to 300X) without major concerns. - Attrition rate is on the single digit percentage. - Majority of previous Maxim’s employees stayed as part the TJ acquisition.

o OFI_1: Only one QA personnel to assist current Fab operations and Customers’ issues; may not be sufficient. Consider increasing the Customer service support.

- Factory is ISO certified and planned to move to 2015 revision spec next year. - Quality Management System is under Document ID# 10-0139.

3.2 Process Flow Overview

- PALM process is a shared development process between Semtech and TJ. - There are currently weekly integration meetings between MH, TX and SMTC teams to ensure

proper transition to MH. - Several Systems are still in transition (TX still adopting TJ’s practices) such as the SPC, ELS, eBizz - FMEA and Process Control Plan are still pending to be closed and released between MH and TX.

o Action_1: Provide timeline on when the PALM’s Process FMEA will be completed and shared with Semtech.

o Action_2: Provide copy of PALM’s Process Control Plan once it is closed. - If lot goes “on hold”, only assigned Eng can release material. - FabGuard is used as software for on-line Fault Detection and Classification (FDC) capabilities to

analyze aspect of process and equipment behavior.

3.3 In Line Monitoring - Cpk goal is to have 98% of parameters >1.33. - Fab monitors parameters with Cpk >1.67. PALM has all PCM parameters >1.33 and 8 higher than

1.67. - SPC is monitored weekly by engineers and presented once a month to management.

o OFI_2: Consider implementing a SPC alarm notification to customer when PCM >4sigma but still within limits (Similar than Fab3)

- Quarterly goals are set based on the monthly analysis and assigned to eng team to drive improvement.

- MRB is raised if more than 1 lot is affected or parameter is out of spec or if it > $$ value. - Rest of OCC are managed individually by engineers.


3

- Process Release Documentation (PRD’s) is used to document main parameters (Ave, Standard Dev, Maximum, Minimum) at the moment of production release. PRD is approved by the transferring and receiving Fab. - Action_3: Provide copy of PALM’s related PRDs once it is approved.

- Tools for analysis includes: JMP, Klarity ACE XP, Wafer Sleuth (20% of the fab). - 90% of the Fab is Automated to the Control Plan. - Inline data set is statistical based (4 sigma) and some are set at 3 sigma based on Eng judgment

and/or FMEA feedback. - Action_4: Align incoming Inspection practices between MH and Texas.

- SAMENESS process is used for tool comparison and qualification. Data needs to overlap >97.3%. - There are currently only two parameters within PALM that are not meeting SAMENESS criteria.

Dan/Alex are aware and it will be presented to Semtech’s CMT once Fab is ready for production released.

3.4 PCM Monitoring - There are 18 PCM structures tested on PALM process. Agreement with TJ is to buy wafers if less

than 2 PCM fails per wafer. o Action_5: Provide a plan to publish the PCM data on eBizz and the change on the

format. - PCM are monitored if OCC is raised, however trends (“white space”) is not proactively analyzed.

o OFI_3: Consider improving the proactive monitoring of the “White space” trends for PCM and inline data.

- Example of PCM Hold Lot C39858 was reviewed and showed to be adequate. - PROMIS is used to manage WIP and test recipes on production flow. - Currently all PALM WIP is under Eng status and it will be transfer to production through a MRB once

it has been approved by SMTC. - It was noticed TX does not have the same waiver process than rest of TJ Fab’s.

o Action_6: Align Waiver process to TJ’s practices. - CPK is currently shared via email on weekly basis. But still not available on eBizz.

o Action_7: Provide a plan to publish CPK data on eBizz and the change on the format. - Inline data is reviewed daily/weekly and monthly formats. - Data retention is 5 years on site and 10 years on tape. - Data is back-up in 2 data centers. Tapes are kept in a fire safe location. 3.5 Defect Density Reduction Initiatives/Monitor - Particle Monitor is done once month on a fix point and every 5 years on every filter. - Every Bay has 2 point measurement. - Alarm for humidity and temperature is in placed. - Processes are monitored for the top 10 hitters. Examples were shown for BCD process. - Automated inspections flows/processes are in place around specific critical steps in the process


4

flow. - Formal review is conducted once >15% of the projected annual volume has been run at the fab for

PALM. o Action_8: Provide plan to implement Defect Reduction Program for PALM (review data

and top hitters against MH). o Action_9: Provide a GDPW for PALM on eBizz.

3.6 Training Process - LMS (Learning Management System) is an automated software that tracks personal training and

locks employees out of operations if their training is expired. - New Employee Training program was reviewed and show critical information to employees,

however ISO9001 was not part of the induction. o Minor_1: ISO9001 training is not part of the induction program

- Employees can be disqualified to operate specific equipment if: o There are quality issues with the employee. o Training is expired. o Not running the equipment in a certain period of time. o Not up to date with the latest procedures.

3.7 CAPA - 8D format contains all key elements of proper report. - Review process is appropriate and contains key players. - Turn around to close 8D’s are too long (90 days) and Semtech requests improves these TAT.

o OFI_4: Consider improving CAR/8D TAT as 90 days for full report is not aligned with Semtech’s expectations (14 days with root cause and corrective action identified)

3.8 Change Control Procedure - Process Change Review Board (PCRB) is in charge to review/approve any changes. - Proper experts are on the approval loop. - PCRB flow:

o PCRB1 is called to review new request. Changes are requested first under engineering for a split lot. Process Experiment Form is filled.

o PCRB2 is call to review results. Run changes on 10 lots if approved.

o PCRB3 is called for final approval. o Update on document control. o PROMIS Change.

- TX agreed to notify Semtech on Level 1 changes during development. Level 2 and 3 are always


5

notified to customers.

3.9 Preventative Maintenance: - PM Checklists are well in place for processes. - Task completion windows are defined:

o Monthly ± 7 days. o Quarterly ± 14 days. o Semi-annual and Annual ± 28 days.

- These goals feed the technicians’ goals. - Machine will go down if PM is not performed at the established time and not based on the task

completion time. - PM records were reviewed for J6MOD machine

o Minor_2: Lug Inspection was not performed on the monthly PM for J6MOD tool.

3.10 Non-conformant material: - Proper NCMR system is in place. - Notification to customers will be done when PCM out of spec but inline data shows within specs. - Example PLD1224 was reviewed for PALM where incorrect mask set was indicated by Semtech. 3.11 RMA Capabilities: - Even though TX can access TJ FA capabilities, most of the activities are done outsourced. 3.12 Line Audit: - Proper location for non-compliance material was in place. - Movement of material was ok but:

o OFI_5: Consider restricting moving of the wafers in cassette without box. o OFI_6: Consider restricting the storage of the wafers in cassette without box.

- Tungsten CMP (2CMP) process control points were reviewed and checked. All data looked ok. - PM records for 2SCRIBE and 52STEP machines were corroborated. - Ionizer on the mask room did not have any calibration sticker.

o Minor_3: Ionizer on 3BLBOX module was found with no indication of PM or calibration. o OFI_7: Consider regular ESD program for Ionizers on the PCM Testing Area.

- Training records for operators Rudy Ramirez and Julie De La Cruz were checked and they were compliant.

- 5S Checklist is performed daily every shift change. - Masks are managed in a special staging area to improve TAT. - There is a maximum of 2 staging cassettes allowed. - One Point Lessons are printed across the fab for reminders to operators. - Current P1 status is defined as 0.8 days/layer, P2 as 1.3 days/layer and P4 as 3.5 days/layer.

CORPORATE QUALITY PROCEDURE NBAD-5E9ECH

Attention! Printed Copies Are Uncontrolled Documents! 1

SITE AUDIT REPORT 4T H QUARTER FY17

Name Company To: Jianjun Chen Huatian Technology (Kunshan) Electronics Co.Ltd.

Harry Han Huatian Technology (Kunshan) Electronics Co.Ltd. Yaxiang Han Huatian Technology (Kunshan) Electronics Co.Ltd. Ray Wang Huatian Technology (Kunshan) Electronics Co.Ltd. Tina Zhang Huatian Technology (Kunshan) Electronics Co.Ltd.

Cc: Mark Costello Mike Wilson

Semtech Corporation Semtech Corporation

Michael Zhang Rob Mauro Samuel Jiang

Semtech Corporation Semtech Corporation Semtech Corporation

Patrick Cui Semtech Corporation Andrew Pan Semtech Corporation William Wang

Grace Kim Semtech Corporation Semtech Corporation

Company/Location: Huatian Technology (Kunshan) Electronics Co.Ltd

Audit Dates: Dec.6 &14,2016

Auditor(s): Semtech : Samuel Jiang Grace Kim

Audit Purpose: Z-package assembly supplier Audit

Audit Scope: Full scope audit covers the following areas IQC Assembly lines Quality system

Summary of Findings

Major Finding: 1

Minor Finding: 1

Observations: 9

Action Items: 1

Total: 12

Pass/Fail/Conditional: passed

Initial Response Due: 3 days from SCAR notification

Non-Conformity Closure Due: 30 days from initial report.

Provide Responses to: [email protected],

All findings and actions items must be closed within 60 days. Actions on observations should be reported by the initial response date. In situations where long term corrective action is required, major milestones with commitment dates needs to be reported monthly until closed. Supplier may use this file document to provide responses.

Definitions Action Item: Action requested by Semtech during the audit that the supplier must respond

mailto:[email protected]



to or complete.

Observation: An observation made by an auditor who determined that if not acted upon it is likely to lead to a product non-conformity.

A finding made by an auditor who determined that a condition that appears to violate an accepted industry standard.

A recommendation for improving the process / An opportunity for improvement

When a continuous improvement has been identified showing a significant improvement trend that is meaningful to the supplier and customer.

Response/comments are required.

Formal corrective action is not required but encouraged.

Minor Finding: A finding by an auditor identifying an incident failure to comply with a procedure or quality management system/element.

A finding made by an auditor who verified that a condition violates an accepted industry standard.

Minor inconsistencies in implementation of a requirement that will not reduce the ability to assure controlled processes or result in the probable shipment of nonconforming product.

Response on root-cause analysis and corrective action to address the finding is required.

Major Finding: A finding made by an auditor who verified that a condition violates a Semtech product requirement (includes assembly and test requirements).

A finding made by an auditor who verified that a condition violates a quality system element requirement.

Multiple minor findings indicating the breakdown of a quality-system element.

Major inconsistencies in implementation that would probably result in shipment of nonconforming product or reduce product reliability / usability.

Response on root-cause analysis and corrective action to address the finding is required.

Fail: Failed the supplier audit if there is more than one major finding

Conditional: Conditionally passed the supplier audit if there is only one major finding

Pass: Passed supplier audit if there is no major finding

Summary Agenda IQC Assembly lines Quality system Q2FY16 site line audit The line audit was carried out on Dec.6 & 14, 2016

Category # of findings Remarks

Action 1

Observation 9

Minor 1



Major 1

Audit Findings Summary is tabulated at below:

Action Items

1. Action Item: Document review 1.Au plating SOP, did not define plating time 2.Ni Plating SOP, 1

st plating time in 7.6.1,1 is 40 Sec, but in 7.6.3.3 is 20 Sec

3.Post plating visual inspection spec define defect rate <2%, it need to be tightened for Semtech devices

Response:

Driver:

Projected Completion Date:

Status

Observations

1. Observation: Bonding station

1. On Dec.2.2016, humidity record data is 57, which is out of spec(40~50),but there is

no action was recorded

Root Cause:

Containment Action:

Corrective Action:

Implementation Plan:

Preventive Action:

Driver:

Status

2. Observation: Plating station 1.Plating line cabinet cover should be closed during production 2.Plating line, cassette should be hold with special box to avoid the chemical leakage to the ground 3.The cleaning tank cover was not covered tightly, need modify the design 4.When Chemical analysis result is out of spec, need add chemicals and do the analysis again, but no record for post adjusting 5. Process control data is recorded from Nov.2016, no record for previously built AER lots 6. Process Q-time spec is <5hours, but it is not controlled by system. Suggest to control through system.

Root Cause:

Containment Action:

Corrective Action:


Preventive Action:

Driver:

Status



3. Observation: Pre-cut/ Final-cut station 1. No record of 1st sample inspection after blade change 2. No blade life time control spec

Root Cause:

Containment Action:

Corrective Action:


Preventive Action:

Driver:

Status

4. Observation: Au-plating station 1. Process control data was recorded from November, no record for products built before November. 2. The the machine # is not consistent with the record sheet, (the machine marked as #2, the record sheet is #3). 3.Chemical storage room roof is damaged due to some corrosion, there is dust on the table, and water leakage issue was observed on the ground

Root Cause:

Containment Action:

Corrective Action:


Preventive Action:

Driver:

Status

5. Observation: Back side grinding station 1. The tape mounting machine, no cleaning SOP 2. Broken wafer disposition request inform engineer if >=0.01%, need issue abnormal sheet. But it did not define when it should be notified to Semtech. 3.The machine was fixed with many tape, it could not meet 5S requirement 4.Lamination equipment, there is no temperature calibration record 5.Bake oven, there is no temperature calibration record

Root Cause:

Containment Action:

Corrective Action:


Preventive Action:

Driver:

Status

6. Observation: Top side grinding station 1.SOP defined the grinding thickness set up should be double confirmed by 2

nd

person, but there is no record

Root Cause:

Containment Action:

Corrective Action:




Preventive Action:

Driver:

Status

7. Observation: Epoxy filling station 1.There is no calibration record on vacuum machine 2. Epoxy filling SOP defined to measure squeeze height, but no record 3. Epoxy filling process, there is dust and foam under the printing machine 4. There is some dust and water under the vacuum machine

Root Cause:

Containment Action:

Corrective Action:


Preventive Action:

Driver:

Status

8. Observation:

Demount station 1.SOP did not define weight process post de-mount 2 The manual de-mount operation method has higher risk and it’s not easy to handle. Need to optimize operation method

Root Cause:

Containment Action:

Corrective Action:


Preventive Action:

Driver:

Status

9. Observation:

Test station 1. Tape & Reel process, some peeling force result files are not able to open. 2. No golden units were kept, but some 0402 lots are running on the line during audit.

Root Cause:

Containment Action:

Corrective Action:


Preventive Action:

Driver:

Status

Minor Findings

1. Minor Finding: OCAP procedure set up

There is no OCAP for critical defects and Q-time control.

Root Cause: Containment Action: Corrective Action:



Implementation Plan: Preventive Action: Driver: Status

Major Findings

1. Major Finding: Saw station

Saw machine #41, was not qualified for Semtech devices and was not informed Semtech, but it’s running Semtech devices during audit.

Root Cause: Containment Action: Corrective Action: Implementation Plan: Preventive Action: Driver: Status

RClamp3331ZA RJ6276.3_AER-3808 (TJT + HTKS) Validation Report

2/1/2017

The Information in this presentation contains CONFIDENTIAL SEMTECH INFORMATION.

NOTE: all company non-public information must be kept confidential and should not be disclosed.

Build History

Confidential Information – Property of Semtech Corporation 2 2/3/2017

Date Completed 1/10/2017 2/23/2015

Part Number: RClamp3331ZA Rclamp3331ZA

AER: AER-003808 AER-002243

Build Number: DD648202 DD503201

Date Code: 1648 1504

Lot Number: C43370 T406992.1

Device: PAE015X3 PAE015T1

Wafer # 6, 13, 17 1

Rel #: 6276.3 5930.1

Note:

Wafer fabrication -

TowerJazz (San Antonio

Texas, US), Assembly –

Huatian Kunshan (China)

Wafer fabrication -

TowerJazz (Migdal

Haemek, Israel), Assembly

- ICI (US), tape and reel -

Diodes (China)

Owner: Dan Rodriguez Huang, Changjun

8x20uS Vc


0

1

2

3

4

5

6

7

8

0 1 2 3 4 5 6 7

Cla

mp

ing

Vo

lta

ge

-V

C (

V)

Peak Pulse Current - IPP (A)

POR

RJ6276.3

DS Limits

Waveform

Parameters:

tr = 8µs

Cap over Bias


0

0.05

0.1

0.15

0.2

0.25

0.3

0.35

0.4

0.45

0.5

0 0.5 1 1.5 2 2.5 3 3.5

Ca

pa

cit

an

ce

- C

j(p

f)

Reverse Voltage - VR(V)

POR 6276.3 DS

f = 1 MHz

Positive ESD


0

10

20

30

40

50

60

0 2 4 6 8 10

Cla

mp

ing

Vo

lta

ge

(V

)

ESD Surge (kV)

POR RJ6276.3Impedance: 50 Ohm / Attenuator: 20dB

Negative ESD


-60

-50

-40

-30

-20

-10

0

-10 -8 -6 -4 -2 0

Cla

mp

ing

Vo

ltag

e

ESD Surge (kV)

POR RJ6276.3Impedance: 50 Ohm / Attenuator: 20dB

ESD Reliabiltiy


Datasheet

Air ±18KV

Contact ±18KV

RJ6276.3

Contact (Line-Line) Pass Fail Fail Mode Air (Line-Line) Pass Fail Fail Mode

Device 1: Pin 1-2 ±20kV ±21kV vf Device 1: Pin 1-2 ±25kV ±26kV vf

Device 2: Pin 1-2 ±21kV ±22V vf Device 2: Pin 1-2 ±26kV ±27kV vf

Device 3: Pin 1-2 ±20kV ±21kV short Device 3: Pin 1-2 ±25kV ±26kV vf



POR

Contact (Line-Line) Pass Fail Fail Mode Air (Line-Line) Pass Fail

Fail

Mode

Device 1: Pin 1-2 ±21kV ±22kV Vf Device 1: Pin 1-2 ±26kV ±27kV Vf






Device 7: Pin 2-1 ±21kV ±22kV short Device 7: Pin 2-1 ±26kV ±27kV Vf




Positive TLP


0

5

10

15

20

25

30

35

0 2 4 6 8 10 12

TLP

Cu

rre

nt

(A)

TLP Voltage (V)

RJ 6276.3 POR

TLP

Parameters:

tp = 100ns

Negative TLP


-35

-30

-25

-20

-15

-10

-5

0

-12 -10 -8 -6 -4 -2 0

TLP

Cu

rre

nt

(A)

TLP Voltage (V)

RJ 6276.3 POR

TLP

Parameters:

tp = 100ns

tr = 200ps

Note: copy or use of the material in this presentation can only be done with Semtech authorization

Semtech and the Semtech logo are trademarks of the Semtech Corporation. All other product or service names are the property of their respective owners

© Copyright 2015 Semtech Corporation

RClamp5011ZA RJ6276.2 (TJT + HTKS) Validation Report

2/1/2017

The Information in this presentation contains CONFIDENTIAL SEMTECH INFORMATION.

NOTE: all company non-public information must be kept confidential and should not be disclosed.

Build History


Date Completed 12/13/2016 09/16/2016

Part Number: RClamp5011ZA RClamp5011ZA

AER: AER-003813 AER-002126

Build Number: DD649203 N/A

Lot Number: C42421 T406904.3

Wafer #: 1, 17, 25 15,16,17

Device: PAD003X3 PAD003T2FCN

Date Code: 1648 N/A

Rel #: 6276.2 5788.1

Notes: Wafer fabrication -

TowerJazz (San

Antonio Texas, US),

Assembly – Huatian

Kunshan (China)

Wafer fabrication -

TowerJazz (Migdal

Haemek, Israel),

Assembly - ICI

(US), tape and reel -

Diodes (China)

Owner: Dan R. Maykel Ghorbanzadeh

8x20uS Vc


0

2

4

6

8

10

12

14

0 1 2 3 4 5

Cla

mp

ing

Vo

lta

ge

-V

C (

V)

Peak Pulse Current - IPP (A)

POR

6276.2

DS Limits

Waveform

Parameters:

tr = 8µs td = 20µs

Cap over Bias


0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1

0 1 2 3 4 5

Ca

pa

cia

tan

ce

(C

j)

Reverse Voltage (VR)

POR RJ6276.2

f = 1 MHz

Positive ESD


0

20

40

60

80

100

120

0 2 4 6 8 10

Cla

mp

ing

Vo

lta

ge

(V

)

ESD Surge (kV)

6276.2

POR-09-28-16

Impedance: 50 Ohm / Attenuator:

Negative ESD


-120

-100

-80

-60

-40

-20

0

-10 -8 -6 -4 -2 0

Cla

mp

ing

Vo

lta

ge

ESD Surge (kV)

6276.2

POR-09-28-16

Impedance: 50 Ohm / Attenuator:

ESD Reliabiltiy


Datasheet

Air ±18KV

Contact ±15KV

Positive TLP


0

5

10

15

20

25

30

35

0 2 4 6 8 10 12 14 16 18 20

TLP

Cu

rre

nt

(A)

TLP Voltage (V)

AER-3813 POR

TLP

Parameters:

tp = 100ns

tr = 200ps

Negative TLP


-30

-25

-20

-15

-10

-5

0

-20 -18 -16 -14 -12 -10 -8 -6 -4 -2 0

TLP

Cu

rre

nt

(A)

TLP Voltage (V)

AER-3813 POR

TLP

Parameters:

tp = 100ns tr = 200ps

Note: copy or use of the material in this presentation can only be done with Semtech authorization

Semtech and the Semtech logo are trademarks of the Semtech Corporation. All other product or service names are the property of their respective owners

© Copyright 2015 Semtech Corporation

PRODUCT / PROCESS CHANGE NOTIFICATION PCN-000401.r3 … · PRODUCT / PROCESS CHANGE NOTIFICATION...

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