Processing - Welcome to FTM Board Club · PowerNavigator’s ‘hardware-free’ mode ... the...

Design Note: page 12Micrel explains the need for high-performance gate drivers in BLDC motor-control systems

Technical View: pages 22-23 How to achieve multi-kilometre range with a simple ISM-band star network

Application Spotlight: pages 14-20Atmel extends its SAMA5D3 family of ARM® Cortex™-A5 microprocessors

Component Focus: pages 2-11 Macronix NAND Flash devices provide robust data-storage in 512MB and 1GB densities

Application Spotlight on

EmbeddedProcessing

Fairchild pledges no moreobsolescenceFairchild Semiconductor has announced itwill no longer make any product obsoleteunless it is required to stop making the part.The company is also extending its lifetimesupply policy to a 24-month duration whenit is forced to stop production of a part.

Intersil’s new development GUIeases design of digital powersystemsIntersil has introduced the newPowerNavigator™ GUI, which lets usersdesign digital power into their systemswithout writing a single line of code.

Configuring the power architecture inPowerNavigator’s ‘hardware-free’ modeenables users to select components prior tohardware development, without design risk.The PowerNavigator GUI provides access toall commands and set-up configurations,and includes the ability to load pre-definedconfigurations for common applications.

New LUXEON LEDs offer highflux density

Philips Lumileds hasintroduced LUXEON®

UV, a family of LEDswhich offers veryhigh system fluxdensities. Available inwavelengths of 380-430nm, the emittersare specifically

designed for applications such as ultravioletcuring, counterfeit detection, and medicaland industrial lighting.

CUI provides 3D models ofpower suppliesCUI Inc., has released a complete range of3D models for its entire portfolio of AC-DCpower supplies and DC-DC converters.

This enables engineers to configure, viewand download 2D and 3D drawings in anyof the main mechanical CAD formats; thussimplifying the development process.

S TA R P R O D U C T

2 E M A I L I N F O @ M Y- F T M . C O M F O R S A M P L E S A N D D ATA S H E E T S

STMICROELECTRONICS

my-ftm.com/140201FOR PARTS ANDLATEST PRICING

©Copyright 2014 Future Electronics Ltd. All trademarks contained herein arethe property of their respective owners. Applications for product samples,badge boards, demonstration boards, Future-Blox Boards and otheradvertised materials from Future Electronics are subject to qualification.

Newsin brief

STMicroelectronics (ST) has introducedthe industry’s most energy-efficientBluetooth® chip, enabling longer run-times in a new generation of BluetoothSmart devices using small, lightbatteries.

Compliant with the latest Bluetooth 4.0standard, ST’s new BlueNRG chip is a highlyintegrated design, incorporating its own radio,ARM® Cortex™-M0 processor and Bluetoothfirmware. It provides the functions needed tolink a Bluetooth Smart device, including wireless‘appcessories’ such as fitness wristbands,smart eyewear and interactive clothing, to aBluetooth Smart Ready host such as asmartphone or a tablet.

Drawing extremely low active current,BlueNRG enables Bluetooth Smart devices tooperate for months, or even years, from a smallcoin-cell battery. Bluetooth 4.0 Low-Energy wireless technology consumes only afraction of the power of Classic Bluetooth. Itfeatures in a wave of Bluetooth Smart devicesalready on the market, supported by all themain mobile and desktop operating systems.

The implementation of Bluetooth 4.0 in theBlueNRG chip results in peak current of just8.2mA in Transmit mode at 0dBm and 7.3mA inReceive mode. The device’s low peak currentsalso help applications to meet the tight currentlimits imposed by the use of coin cells.

System designers will benefit from the device’sexcellent power management and rapidtransitions between Normal and Sleep modeswhen trying to achieve low overall powerconsumption.

Moreover, the BlueNRG chip gives designersthe flexibility to choose their preferred hostmicrocontroller, which can be interfaced to it viaSPI. BlueNRG is also supplied with BluetoothLow-Energy profiles to run in the externalapplication processor.

An on-chip non-volatile memory provides foreasy firmware upgrades in the field to maintaincompliance with future editions of the Bluetoothspecification.

APPLICATIONS• Wellness monitors• Fitness equipment• Wearable devices • Proximity tags

FEATURES• Embedded Bluetooth 4.0 Low-Energy

protocol stack• Programmable output power from

-18dBm to 8dBm• Up to 96dB RF link budget• Battery voltage monitor • Temperature sensor

SECURITYAUTOMOTIVEMEDICALLIGHTINGINDUSTRIALENERGY CONSUMER TELECOMMS

Longer battery run-times in view afterlaunch of energy-efficient Bluetooth 4.0 processor


C O M P O N E N T F O C U S

3V I S I T T H E O N L I N E F T M M A G A Z I N E AT: W WW . M Y- F T M . C O M

HS-CAN transceivers save application cost and supporthigher data rates of CAN FD applications

Mantis HS-CAN transceivers: simpler design and smaller boardfootprint

NXP SEMICONDUCTORS

NXP Semiconductors’ Mantis™ family arethe latest High Speed CAN (HS-CAN)transceivers to be released, allowingdesigners to reduce application cost byremoving the common-mode choke andincreasing data rates to support new CANFlexible Data-rate (CAN FD) applications.

The Mantis family consists of the TJA1057T/GTHS-CAN transceiver and TJA1044T/GT HS-CAN transceiver with a low-power modecompliant to ISO 11898-5 and drawing only10µA in standby mode. Both transceivers havea feature-set optimised around 12V applications.

Enhanced EMC performance allowsoperation at 500kbit/s without a common-mode choke, while still meeting the EMCrequirements defined in ‘HardwareRequirements for LIN, CAN and FlexRayInterfaces in Automotive Applications’, Version1.3, May 2012. Eliminating the choke enableslower application costs, simpler design andreduced board size.

Both TJA1057GT and TJA1044GT transceiversare also available in variants designed for fasterdata-rate operation. These products feature aguaranteed loop-delay symmetry up to datarates of 5Mbit/s, an essential parameter forreliable CAN FD operation. Furthermore, at2Mbit/s the transceivers are still compliant tothe EMC limits, demonstrating EMC can besuccessfully controlled at faster data rates.

To support longer cable lengths, theTJA1057GT and TJA1044T additionally featurean improved propagation delay of 210ns.

All four members of the Mantis family are dual-sourced from locations in the Netherlands andSingapore to provide an agile, high-capacityand secure manufacturing base.

APPLICATIONS• In-vehicle networking• Hybrid-electric vehicles• Industrial networks

FEATURES• Optimised for use in 12V automotive

systems• ±42V robustness on bus pins• 6kV ESD handling capability on bus pins

(IEC 61004-2 and HBM)• Logic levels compatible with 3.3V and 5V

microcontrollers • Fully automotive qualified to AEC-Q100



NAND Flash memories available indensities of 1Gbit and 512Mbits

MACRONIX

Macronix has extended its range oflow-density NAND Flash memoryproducts with new 1Gbit and 512Mbitsdevices.

The MX30LF1G08AA is a 1GbitSingle-Level Cell (SLC) NANDFlash memory device, and theMX30LF1208AA offers512Mbits. Their standard NANDFlash features and high reliabilitymake them suitable for use asstorage for embedded systemcode and data.

These NAND Flash memoriesare typically accessed in pagesof 2,048 + 64bytes, both forRead and for Programme

operations. The array is organised in 1,024blocks, in the MX30LF1G08AA, or 512 blocks,in the MX30LF1208AA, of 128kbyte, eachcontaining 64 pages.

Each page includes 64bytes for storing ErrorCorrection Code (ECC) and for other purposes.The devices also feature an on-chip buffer anda cache for data loading and access.

The Read operation of the MX30LF1G08AAand MX30LF1208AA enables first-byte read-access latency of 25µs, and a sequential readtime of 30ns per byte. Page programming canbe performed at an approximate rate of8MB/s.

The devices’ current requirement is 30mAduring all normal modes of operation (Read,Programme and Erase). In Stand-by mode,they draw 50µA.

APPLICATIONS• Embedded data storage• Embedded programme storage

FEATURES• 250µs page-programme time • 2ms block-erase time • 3.3V operating voltage• Multiple device status indicators • Endurance: 100,000 cycles, with 1-bit

ECC per 528bytes • Data retention: 10 years



Part Number VCCCell Type

Page Size

Bus Width

Sequential Read Speed (ns) Packages Temperature

Range

MX30LF1G08AA3V Single-level

Cell 2kB x 8 30 48-TSOP or63-VFBGA -40°C to 85°C

MX30LF1208AA

Macronix NAND Flash can be programmed at a rate of 8MB/s



Smaller power modules boost efficiencyof motor drives up to 300W

* RMS, Fc=16kHz, 2-phase PWM, ∆TCA=70°C, TA ≈ 25°C

INTERNATIONAL RECTIFIER

International Rectifier IRSM808-105MHand IRSM807-105MH half-bridge powermodules have up to 60% smallerfootprint than other 3-phase motor-control power ICs, and are optimised forappliance and light industrial applicationswith motor power up to 300W.

The two devices are the latest members of IR’shighly integrated, ultra-compact, patent-pending µIPM™ intelligent power-modulesfamily. They are available in an ultra-compact8mm x 9mm x 0.9mm PQFN package,enabling a space-efficient solution capable ofsupporting high output current and highenergy efficiency.

Using IR’s µIPM modules not only enablesengineers to minimise board-space but also

shortens design time and significantly reducesassembly time and cost. Combining high-voltage, low on-state resistance FredFETMOSFET switches, optimised for variable-frequency drives, alongside IR’s most advancedhigh-voltage driver ICs, the µIPM can replaceas many as 20 discrete components.Bootstrap functionality, under-voltage and

over-current protection, and leg-shunt current-sensing circuitry are also integrated.

The surface-mount PQFN packagetechnology used throughout IR’s µIPM familysaves second-pass through-hole assembly,which is required if using a conventional dual-in-line module. The package features largeexposed terminals to conduct heat efficientlyinto PCB copper traces, allowing engineers tosave system cost and size by reducing oreliminating the need for an external heatsink.

Advanced infrared diodes deliver speed and powerfor switching or illumination

VISHAY

The VISHAY SurfLight™ portfoliocomprises infrared emitting diodesoffering high speed and high radiantpower for purposes such as remotecontrol, switching or illumination.

The VSMY14940 and VSMB14940 surface-mount side-looking emitters are ideal forremote-control and switching applications, andare based on GaAlAs surface-emitter andMulti-Quantum Well (MQW) technologiesrespectively. Offering an extremely low profileof 1.2mm and narrow ±9° angle ofhalf intensity, these devices are idealfor remote-control applications inspace-constrained end-products. TheVSMY14940 has extremely highradiant intensity to 82mW/sr at 70mAdrive current, rise time of 10nsresulting in fast switchingperformance, and forward voltage of1.48V to minimise energy losses. Forapplications needing a lower opticaloutput, the VSMB14940 offers radiant

APPLICATIONS• Remote controls• IR touch panels• Photo-interrupters• Optical switches• CCTV or gaming systems with CMOS

cameras• Machine-vision systems• 3D televisions

FEATURESVSMB/Y14940 for remotecontrol/switching:

• 70mA continuous forward current• 35mW/sr or 82mW/sr radiant intensity• Dimensions: 3.2mm x 2.51mm x 1.2mm• 940nm peak wavelength

VSMY98545 for illumination:

• 1A continuous forward current• 350mW/sr radiant intensity• Dimensions: 3.85mm x 3.85mm x 2.24mm• 850nm peak wavelength



APPLICATIONS• Compressor drives for refrigeration• Pumps for heating and water circulation• Air-conditioning fans• Dishwashers• Automation systems

FEATURES• Matched propagation delay for both

channels• Optimised dV/dt• Compatible with 3.3V input logic• Motor-power range: 80W to 200W• 1500VRMS minimum isolation voltage



Part Number Voltage IO (DC @25°C)

Motor Current* Motor Power VO = 150/75VRMS

TopologyWithout Heatsink With Heatsink

IRSM808-105MH 500V 10A 1.1A 1.3A 285W/390W Half-BridgeIRSM807-105MH 500V 10A 1.1A 1.3A 285W/390W Half-Bridge

intensity of 35mW/sr with a rise time of 15ns,and forward voltage of 1.33V.

The VSMY98545 delivers radiant intensity ofup to 350mW/sr and has a wide angle of halfintensity of 45°, making this an ideal device toprovide illumination for CMOS cameras ormachine-vision systems. The diode can bedriven at a maximum continuous current of 1Aor pulsed current of 5A, and is capable ofhigh-speed performance thanks to its 15nsrise time. It is moulded in a surface-mountpackage that has low thermal resistance andfeatures a built-in lens. With forward voltage of2.3V at 1A drive current, the VSMY98545helps to simplify system thermal design andminimises energy demands on the battery orpower supply.

µIPM power modules: efficient heat conduction from package to board



Ultra-rugged LDMOS RF transistors boost outputpower, simplify system design

NXP SEMICONDUCTORS

APPLICATIONS• Plasma igniters• Laser systems• Synchrotrons• MRI scanners • FM transmitters• In-Band On-Channel (IBOC) digital radio• VHF televisions

FEATURES• Simplified power control• High thermal stability• Gate-source voltage range: -6V to 11V• 225°C maximum operating junction

temperature• SOT539A bolt-down or SOT539B earless

ceramic package options



SOT23-3 TVS diodes provide leadingsurge and transient protection

LITTELFUSE

The Littelfuse SM series of TVS diodearrays in the industry-standard SOT23-3footprint provide increased protectionfor sensitive data lines against threatsfrom lightning-induced transients,Electrical Fast Transients (EFT) andElectrostatic Discharge (ESD).

This latest family provides up to three timeshigher ESD performance than competingsolutions, thereby ensuring maximum reliabilityof equipment in the field. The devices canabsorb repetitive ESD strikes of ±30kV, air or

contact discharge, which is above themaximum level specified in the IEC 61000-4-2international standard without performancedegradation. EFT protection of 50A (tp =5/50ns)exceeds the 40A required by IEC 61000-4-4,Level 4.

In addition, the devices have very lowdynamic resistance, which greatly reducesclamping voltages thereby offering enhancedprotection for modern small-geometry ICs.Each device in the series offers a dynamicresistance much lower than one ohm.

Moreover, the SM series can dissipate peaktransient power of up to 400W according toIEC 61000-4-5 (tp = 8/20µs). This is 25%higher than other similar devices, givingengineers a greater design margin whenprotecting against surges caused by powerswitching or lightning transients.

APPLICATIONS• Industrial equipment• Test and medical equipment• Point-of-sale terminals• Motor controls• Legacy ports (RS-232, RS-485)• Security and alarm systems

FEATURES• AEC-Q101 qualified• 3-pin SOT23-3 package• Supports bi-directional or uni-directional

application• Working voltages from 5V to 36V• Low leakage current



Part NumberReverse-standoffVoltage

MaximumClamping Voltage

tp = 8/20µsIpp = 1A

Peak PulseCurrent

tp = 8/20µs

DynamicResistance

Maximum LeakageCurrent

SM05-02HTG 5V 9.8V 24A 0.19Ω 1.0µA @ VR = 5VSM12-02HTG 12V 18.5V 17A 0.25Ω 1.0µA @ VR = 12VSM15-02HTG 15V 24V 12A 0.30Ω 1.0µA @ VR = 15VSM24-02HTG 24V 36V 7A 0.50Ω 1.0µA @ VR = 24VSM36-02HTG 36V 52V 5A 0.65Ω 1.0µA @ VR = 36V

The BLF188XR extends NXPSemiconductors’ XR family of‘eXtremely Rugged’ LDMOS transistorsfor RF-energy applications, supportingincreased output power and helping tosimplify design while also enablinglower system cost, replacing traditionalVDMOS-based devices, andeliminating the useof hazardoussubstances.

This latestmember of the family isable to withstand severe loadmismatches with Voltage Standing-Wave Ratio (VSWR) greater than 65:1 at3dB of compression. While capable ofpassing extreme ruggedness testing, the

BLF188XR also has the ability to deliver up to1400W peak output power operating at 50V.

BLF188XR has enhanced integrated ESDprotection featuring a new dual-sided ESD-diode structure, which gives a larger negative-voltage range allowing improved Class-Coperation making the XR device easy todesign-in and fine-tune in a variety ofapplications.

In addition, excellent linearity allows theBLF188XR to deliver a valuable power and

efficiency boost in high-power linearapplications such as terrestrialbroadcast systems.

BLF188XR is ideal for high-power applications in

Industrial, Scientific andMedical (ISM)frequency rangesup to 300MHz,while the popularBLF578XRseries is

recommendedfor frequencyranges up to500MHz.

Littelfuse SM series: unusually high peak transient power capability



NXP SEMICONDUCTORS

Packageless power-switching MOSFET savesspace and energy in handheld devices

VISHAY

The Vishay Si8851EDB is the industry’sfirst -20V P-channel Gen III MOSFET inthe 2.4mm x 2.0mm MICRO FOOT®

outline, combining advanced low-lossTrenchFET® technology with the space-saving advantages of the MICRO FOOTpackageless CSP.

The Si8851EDB is ideal for battery-switchingor load-switching applications. Its on-stateresistance of 8.0mΩ at 4.5V gate voltage isalmost half that of the closest competing 2mmx 2mm MOSFET, which promotes efficient useof energy and delivers advantages such aslonger battery run times. In addition, theSi8851EDB has a profile of only 0.4mm,whereas the conventional 2mm x 2mmpackage is 8mm high.

Compared to existing 3mm x 3mm x 0.8mm

MOSFETs, the Si8851EDB has similar on-stateresistance within a 56% smaller outline deliveringat least 30% better on-state resistance perpackage size and 50% thinner profile.

In addition, with 6kV ESD protection built-in,the Si8851EDB is also able to preventelectrostatic discharges from damaging theinternal circuitry of equipment such ashandheld devices.

APPLICATIONS• Battery switch• Load switch• Power-management applications

FEATURES• 11.0mΩ on-resistance at 2.5V gate

voltage• 70nC gate charge• -5A specified on-state drain current @

25°C and 5V VDS• 6kV (HBM) ESD protection• 8V maximum gate-source voltage



Ultrafast power diodes maximiseefficiency, ruggedness and reliability

APPLICATIONS• Switched-mode power supplies• Uninterruptible power supplies• Motor drives• PFC circuits• Freewheeling-diode applications

FEATURES• Low forward voltage• High thermal efficiency and ruggedness• Soft recovery characteristic• Fast switching performance


STMicro’s SPV1050: page 7PARTNERWORKING

The NXP Semiconductors BYV74W-400and BYR16W-1200 are ultrafastpower diodes featuring a softrecovery characteristic, whichminimises power-consuming oscillationswhen switching, and alsohave low forward voltageand outstanding thermalproperties for enhanced energyefficiency and reliability.

The BYV74W-400 is a dual-diode deviceideally suited to output-rectification duties inhigh-frequency switched-mode powersupplies. The diodes have high averageforward-current rating of 15A, yet have typical

forward voltage of 0.95V thereby minimisingon-state energy losses. Typical reverse-recovery time of 35ns for both diodes helpsreduce switching losses in the associatedMOSFETs or IGBTs. The BYV74W-400 isengineered for high thermal-cyclingperformance and low thermal resistance,

thereby helping to maximise reliability in fast-switching applications.

The BYR16W-1200 contains asingle 1200V ultrafast power

diode in a SOD142, 2-leadTO247, plastic package.

The diode is fabricatedusing planar-

passivated fabricationtechnology for outstanding

voltage ruggedness andreliability. The BYR16W-1200 is

suitable for use in high-voltage switched-modepower supplies, uninterruptible powersupplies, PFC circuits and motor drives.




600V/3A power diode saves moreenergy in on, off and switching states

The NXP Semiconductors NURS360Bultra-fast power diode helps toincrease the efficiency of circuits suchas buck or boost converters andDiscontinuous-Current Mode (DCM)PFC by minimising conduction losses,switching losses, and leakage current.

The speed and efficiency of the NURS360Balso ensure high performance when used asan inverter freewheeling diode or as aprotection diode.

This device has a voltage rating of 600V,maximum average forward current of 3A, andtypical forward voltage of 0.8V whichminimises on-state energy losses. Reverse-recovery time of less than 75ns also helpsreduce switching loss in the associatedMOSFET or IGBT. The maximum reversecurrent of 2.5µA minimises energy losses whenthe diode is not conducting.

The NURS360B is housed in a SOD132(SMB) surface-mount plastic packagemeasuring 5.6mm x 3.95mm. Theterminations allow easy optical inspection ofsolder joints, and have a large surface areawhich helps to lower thermal resistanceleading to enhanced reliability.

APPLICATIONS• Buck or boost converters• Discontinuous-current mode PFC• Inverter freewheeling diode• Protection diode

FEATURES• 600V repetitive peak reverse voltage• 3A maximum average forward current• 6A maximum peak forward current• Reverse recovery time @ 1A forward

current; 30V reverse voltage:Maximum 75nS @ 100A/µs dIF/dtMinimum 38nS @ 50A/µs dIF/dt


New power control IC simplifies design of energy-harvesting applications

STMICROELECTRONICS

The SPV1050 from STMicroelectronicsprovides all the functions needed topower electronic circuits and torecharge batteries using energyharvested from either a solar cell or aThermo-Electric Generator (TEG).

Designs that harvest ambient light or thermalenergy to power small electronic devices suchas wireless sensors, industrial controls andbuilding-automation equipment have no needto replace batteries, need no power cabling andcan provide for maintenance-free operation.

In any such application requiring from a fewmicrowatts up to hundreds of milliwatts, theSPV1050 provides both battery-charging andpower-management functions. It is equallysuitable for indoor and outdoorapplications using either solar orthermal energy. The ultra low-powerenergy-harvesting IC provides morefunctions than competing devices,which aids miniaturisation and savesbill-of-materials costs.

In particular, it includes a MaximumPower-Point Tracking (MPPT) algorithm.This regulates the operation of theSPV1050’s DC-DC converter in order tomaximise the power extracted from thesource by tracking its output voltage.

The device’s battery-charging circuitrysupports a wide variety of battery typesincluding lithium-ion and lithium-polymer, lithium thin-film solid state,NiMH and NiCd, as well assupercapacitors.

APPLICATIONS• Heating and ventilation systems• Industrial control• Access control• Asset tracking• Smart lighting• Body area networks

FEATURES• Up to 70mA maximum battery current • 2.5V to 5.3V trimmable battery charge

voltage level • Battery disconnect function for battery

protection



NXP SEMICONDUCTORS


Vishay’s Si8851EDB: page 6PARTNERWORKINGThe SPV1050’s buck-boost converter allowsthe device to connect to either TEG or solarenergy-harvesting modules by providing awide input-voltage range from 180mV to 8V. A high average operating efficiency of 90%provides for fast battery charging even at lowinput-power levels.

In addition, the integrated battery-chargingcontroller uses highly accurate under-voltageand end-of-charge thresholds in order tomaintain safe operation and to extend the lifeof the battery. For the same reason, the deviceimplements safe control logic which preventsexcessive discharging.

An unregulated voltage output is available,to supply a microcontroller for instance, whiletwo fully independent LDOs embedded in theSPV1050 may power sensors, a microcontrollerand RF transceivers. The 1.8V and 3.3V LDOscan supply up to 70mA each and can beenabled independently through two dedicatedpins.

Apply at: my-boardclub.com

Energy-harvesting application developmentThe STEVAL-ISV019V1 evaluation board may be used tosupport system development using the SPV1050 bytesting the silicon’s performance. It offers multiple jumpersand test points, and enables easy changes to systemconfiguration to help designers find the setting at whichthe SPV1050 operates most effectively.Orderable Part Number: STEVAL-ISV019V1

FREEBOARDS


AC-DC power supplies in space-saving SIP modules deliverhigh performance and reliability

All PBK AC-DC power modules provide 3,000V isolation

CUI INC

The PBK series of ultra-compact AC-DCpower supplies in a miniature SIPpackage, from CUI Inc., are available in1W, 3W, and 5W families and measureas small as 35mm x 11mm x 24mm todeliver a space-saving solutionoccupying less PCB space than otherconventional AC-DC power supplies.

The high-density PBK series is offered insingle output voltages of 3.3V, 5V, 9V, 12V,15V, and 24V DC, and have universal AC-input voltage range of 85V-264V.

For high-voltage DC-DC applications, themodules also provide a DC-input rangespanning 100V to 400V. All models aredesigned for 3,000V AC isolation voltage,input-to-output, for one minute. Over-currentand continuous short-circuit protection arebuilt-in, and wide operating-temperatureranges of -40°C to 85°C, for 1W and 3Wfamilies, and -25°C to 85°C, for the 5W family,allow for use in challenging environments.

The SIP-packaged PBK series is approved toCE and UL/cUL 60950-1 standards andcomplies with EN 55022 Class-B limits forconducted and radiated EMC with fewadditional external components.

APPLICATIONS• Automation systems• Industrial systems• Telecommunication equipment

FEATURES• Wide operating-temperature range• Ultra-compact SIP module package:

• PBK-1 and PBK-3 families: 35mm x11mm x 24mm

• PBK-5 family: 42mm x 11mm x 24mm• Low no-load power consumption• Over-current and short-circuit protections• UL and CE safety marks




PartNumber

OutputVoltage

OutputCurrent

Ripple andNoise

Efficiency(Typical)

PBK-1-5 5V 200mA

120mVP-P

66%PBK-1-9 9V 111mA 67%PBK-1-12 12V 83mA 70%PBK-1-15 15V 67mA 69%PBK-1-24 24V 42mA 68%PBK-3-5 5V 500mA 150mVP-P 69%PBK-3-9 9V 333mA

120mVP-P

76%PBK-3-12 12V 250mA 78%PBK-3-15 15V 200mA 78%PBK-3-24 24V 125mA 78%PBK-5-3 3.3V 1A 150mVP-P 65%PBK-5-5 5V 1A

120mVP-P

70%PBK-5-9 9V 560mA 72%PBK-5-12 12V 420mA 74%PBK-5-15 15V 340mA 75%PBK-5-24 24V 210mA 150mVP-P 75%




MELF resistors set new benchmarks for precisionand stability

VISHAY

Vishay UMB 0207 series ultra-precisionthin-film MELF resistors are first in theindustry to offer TCR down to ±5ppm/Kand tolerances down to ±0.02% in thestandard 0207 case size, for applicationsrequiring high stability and reliability.

The 0207 case size of this latest series isequivalent to the 2512 flat-chip size, ormetric CECC size RC 6123M. The cylindricalconstruction provides an optimal powerrating and pulse-load capability in relation tomounting space, making MELF resistors thepreferred choice for applications requiringlong-term stability, moisture resistance,reliability and the ability to withstandtemperature cycling.

By providing the most advanced level ofprecision and stability ever achieved with

axial thin-film high-precision resistors, combinedwith the proven reliability of professional MELFproducts, the UMB 0207 series is ideal for usein precision circuits and equipment used inharsh environments.

The UMB 0207 series spans the resistancerange from 100Ω to 390kΩ, delivering thebenefits of a high operating voltage of 350V,rated power dissipation to 400mW at 70°C, andlong-term stability within 0.02% after 1000 hours.

APPLICATIONS• Measurement and calibration equipment• Industrial process control systems• Aerospace electronics• Medical equipment

FEATURES• Compatible with automated surface-

mount assembly• 125°C maximum permissible film

temperature• Operating-temperature range:

-55°C to 125°C• DIN 0207 case size equivalent to metric

CECC RC 6123M



Low-voltage logic family eliminatestraditional speed and power compromises

AXP logic family: better trade-off between power consumption andspeed

NXP SEMICONDUCTORS

NXP Semiconductors’ AXP logic familyis fully specified at the 0.8V supplyrange, delivering a unique combinationof very low power consumption withhigh speed at low operating voltagessuch as 1.2V.

Historically, engineers choosing between thefastest or lowest-power logic families at 1.2Vhave been forced to choose between 6xhigher power dissipation or 3x longerpropagation delay. The AXP family nowprovides a much faster solution with the samelow power-dissipation capacitance, CPD, astoday’s lowest-power logic family. As theindustry’s fastest devices with the lowestpower consumption and highest output drive,the AXP family now delivers a no-compromisesolution overcoming the traditional trade-offsbetween power consumption and speed.

Because all devices are fully specified at0.8V, due to the use of low-thresholdtransistors, the AXP family is ideal for migratingapplications from 1.8V to 1.2V and beyond. Inaddition, 3V-tolerant I/Os ensure optimumflexibility for designers and ensure robustperformance in a variety of applications andoperating conditions.

Several variants are available, including singletwo-input logic gates, single and dual invertersand buffers offering Schmitt-trigger input andtri-state or open-drain output options, and asingle configurable multiple-function gate thatcan be configured as AND, OR, NAND, NOR,XNOR, inverter or buffer.

APPLICATIONS• Portable medical devices• Digital cameras• Low-voltage power-sensitive functions

FEATURES• Supply-voltage range: -0.7V to 2.75V• 2.9ns propagation delay @ 1.8V• 4.5mA balanced output drive• Compliant with applicable JEDEC standards• Built-in ESD protection



Part Number Description

Configurable

74AXP1G57 Single configurable multiple-function gate74AXP1G58 Single configurable multiple-function gate74AXP1G97 Single configurable multiple-function gate74AXP1G98 Single configurable multiple-function gateBuffers/Inverters

74AXP1G04 Single inverter74AXP2G07 Dual buffer; open drain74AXP1G125 Single buffer/line driver; 3-state74AXP2G14 Dual inverter; Schmitt trigger74AXP1G17 Single buffer; Schmitt triggerGates

74AXP1G00 Single 2-input NAND gate74AXP1G02 Single 2-input NOR gate74AXP1G08 Single 2-input AND gate74AXP1G09 Single 2-input AND gate; open-drain74AXP1G32 Single 2-input OR gate


Demonstrate seven different logic functionsThree push-button switches and a rotary switch areprovided to toggle the three inputs and select one of theseven outputs to light the on-board LED.Orderable Part Number: 74AXP1G57 Demo Board

FREEBOARDS

UMB 0207 resistors: withstand repeated temperature cycling


Embedded optical modules for mid-board mountingmaximise interconnect density

Pluggable fibre modules for mid-board mounting

AVAGO TECHNOLOGIES

AFBR-811VxxZ and AFBR-821VxxZ 12-channel pluggable fibre-opticsmodules from Avago Technologies areideal for applications requiring veryhigh optical-interconnect density thatcannot be achieved using conventionalboard edge-mount transceivers.

The AFBR-811VxxZ transmitter and AFBR-821VxxZ receiver are members of Avago’sMiniPOD™ family of embedded-optics modulessuitable for mid-board mounting. Thesepluggable modules allow greater utilisation ofPCB area to support optical connections, andare available as AFBR-811RxxZ or AFBR-821RxxZ for use with round jumper cable, orAFBR-811FxxZ or AFBR-821FxxZ for flatoptical ribbon cable. The ribbon cable opticalconnection is top mounted, allowing densetiling of the modules as jumper cables can bethreaded under the dust-cap of the nextmodule avoiding the need for an opticalconnector and strain relief.

Electrical connectivity is via a 9×9 FCI MEG-Array® pluggable connector. 1.2V LVCMOS or3.3V LVTTL connections are supported. Themanagement interface can be used with anindustry-standard two-wire serial protocol, andfeatures a maskable interrupt allowing

Latest-generation automotive MOSFETs boostefficiency with proven reliability

NXP SEMICONDUCTORS

APPLICATIONS• 12V automotive systems• Motors, lamps and solenoid control• Transmission control• Ultra high-performance power switching

FEATURES• AEC-Q101 qualified• Repetitive-avalanche rated• True standard-level gate with VGS(th) rating

@ 175°C:• >1V: BUK7Y3R5-40E• >0.5V: BUK9Y3R5-40E



APPLICATIONS• PCI Express® GEN 3 connections over

fibre-optic link• 100Gb-Ethernet or Infiniband interconnects• Data aggregation, backplane and

proprietary protocol and density applications• High-performance and high-productivity

computer interconnects• Switch-fabric interconnects

FEATURES• 21.95mm × 18.62mm footprint• 3.0W maximum power per

transmitter/receiver pair• Dedicated signals for module address,

module reset and host interrupt




Embedded optical interconnectEvaluation kit for Avago MiniPOD® embedded opticaltransmitters and receivers. Configurable for use with eithertransmit or receive modules, and featuring necessarypower, control and monitoring circuitry as well as 24 SMAconnectors. Transmitter/receiver modules not included.Orderable Part Number: AFBR-800EVK

FREEBOARDS

The BUK7Y3R5-40E and BUK9Y3R5-40Eautomotive-qualified N-channelMOSFETs from NXP Semiconductorsgive designers a choice of either astandard or logic-level gate threshold,taking advantage of the latestTrench6 technology in theLFPAK56, Power SO8,package.

NXP’s Trench6 is the most robusttechnology yet, exceeding thereliability requirements of AEC-Q101 and supporting the 15-year mission profile of modernvehicles as demanded by producersof automotive equipment.

Both devices have a voltage rating of 40V andmaximum on-state resistance of 3.8mΩ, todeliver high energy efficiency in automotive12V systems. Their 175°C temperature rating

allows use in thermallydemanding environments.The MOSFETs areavalanche rugged, andreliability has beenproven throughextended life testing.In addition to theirlow on-stateresistance and high

current-handlingcapability of up to

100A, the BUK7Y3R5-40Eand BUK9Y3R5-40E also

provide high-performanceswitching capability allowing

use in high-frequencyapplications.


enhanced functionality such as individualchannel control, read-back of analogue valueslike module temperature, and upgradingfirmware in the field.

The modules allow data-link lengths up to150 metres over multimode fibre at 850nmnominal wavelength, and are available withouta heatsink or with a clip-on heatsink attached.Data rates of up to 10.3125Gbit/s per lane aresupported with 64b/66b encoded data, as perIEEE 802.3ba: 100GBASE-SR10 and nPPIspecifications. The modules are also compliantwith 12xQDR, Quad Data-Rate, Infiniband,operating up to 10Gbit/s per lane with 8b/10b-encoded data to provide an aggregatebandwidth of 120Gbit/s per port. Forapplications requiring higher speeds, Avagoalso offers MiniPOD solutions supporting datarates up to 12G or 14G per lane.



Inverted Through-Board connectors ease assembly of boards forLED bulbs

TE CONNECTIVITY

TE Connectivity’s (TE’s) Inverted CardEdge and Inverted Poke-In Platform arenew, Inverted Through-Board (ITB)connectors which provide a direct powerconnection between driver boardslocated on the underside of the LEDarray boards found in most LED bulbdesigns.

These connectors provide a minimum of3.0mm creep and clearance distance from theconnector contacts to any dead metalelements in the lighting-system design.

The Inverted Poke-In connector provides anadditional 1.0mm depth to accommodate wireinsulation guide barrels on the bottom of theconnector.

TE’s new ITB connectors help lighting-equipment manufacturers to eliminatesecondary SMT assembly processes, becausethe ITB connectors may be processed at thesame time as all other components on the PCB.

The connector’s low profile also minimises LEDlight obstruction and shadowing.

The new connectors provide high stability,offering surface-mount hold-downs whenmating, poke-in mating and un-mating driverboards.

The Inverted Poke-In Connector canaccommodate 18-22 AWG and 24-26 AWG wire.

Compact wire-to-board connector features secure double-lock mating mechanism

DF57H connectors: tactile click confirms correct mating

HIROSE

Hirose has launched the DF57H, a rangeof wire-to-board connectors for powersupplies which combines small sizewith a high power rating.

The new headers, sockets and crimp contactshave been designed with space-saving inmind: for example, the two-position connectoronly occupies approximately 18mm² of boardspace. The lowest profile connector in therange is just 1.4mm high.

Power performance is not compromised bythe small size, however: an impressive 2.5Amaximum current rating per contact isachievable when using the 2-position connectorwith AWG 28 wire.

The DF57H connectors maintain highlyreliable operation thanks to their ’Swing Lock’,a unique double-locking mechanism. Duringmating, the receptacle is inserted into theheader at a slight angle by first offering thecable end; this engages with the positive lock.The mating operation is then finished by‘swinging’ the other end of the receptacle, toengage with the friction lock, which provides a

A long effective contact mating length of0.42mm ensures good electrical continuity.The termination contacts on the header arefully moulded into the insulator to eliminate anygaps, thus preventing solder wicking.

APPLICATIONS• LED displays• Touch panels• Small motors• Industrial robots• LED lighting modules• Digital cameras

FEATURES• Contact positions: 2 to 6 • 1.2mm pitch, 2.4mm pitch option

available • Voltage rating: 50V AC, 100V DC • Cable sizes: AWG 26-34 • Mated height profile: 1.4mm or 1.6mm



P.I.E.S E C T I O N

tactile click to confirm that mating has beenperformed correctly. It also prevents thereceptacle from floating.

The positive lock can withstand a minimumof 5N of cable-pull force ensuring that thesocket cannot be accidentally removed fromthe header. A small lever makes the unmatingprocess quick and easy. The connector israted to last for 30 mating cycles.

Strong blade contacts are used to ensurethat cable wrenching forces cause no damage.They are located in a strengthened housinglance to reduce the risk of accidental unmating.

APPLICATIONS• Retrofit LED bulbs• Track lighting• Spotlights• Downlights

FEATURES• Inverted mating interface for PCB, card-

edge connector only• Rated for five mating cycles, card-edge

connector only• Tin-plated to mate to tin pads on driver

PCB• Non-releasable Poke-In type, one-time

application• Rated for 400V AC or DC and 3A• 3mm creep and clearance from contacts

to metal-core PCB substrate for non-isolated line voltage



Through-board connectors minimise lightobstruction in LED lamps

D E S I G N N O T E

In recent years, there has been a move to the use of BrushlessDC (BLDC) motors in many markets and applications,sometimes to replace AC induction motors.The benefits of using BLDC motors include higher efficiency,

reduced heat generation, and higher reliability, since there areno brushes to wear out. BLDC motors are also safer, becausethey generate no brush dust or arcing. Moreover, BLDC motorscan reduce a system’s weight.

Inside the motorBLDC motors are synchronous motors withpermanent magnets attached to the rotor, and coilwindings in the stator, as shown in Figure 1. Thestator windings produce magnetic fields whichcan be made to rotate. Precise control of thecurrents through the windings via a commutationscheme ensures that the generated magneticfield interacts with the permanent magnets’ fieldsso as to generate torque that spins the rotor. This calls for switching circuits which can

produce bi-directional currents in the stator windings. These switchingcircuits consist of a high-side and a low-side switch for each winding. Atotal of six switches are needed for one BLDC motor, as shown in Figure 2.

How a commutationscheme worksFor the three windings, aBLDC motor has threephases, and each phase hasa conducting interval of 120°.Since the current is bi-directional, each phase isbroken into two steps foreach conducting interval in acontrol scheme known assix-step commutation, seeFigure 3. One option forsequencing the phases isAB-AC-BC-BA-CA-CB. Only

two phases conduct current at any time, leaving the third phase floating. As described above, the magnetic field in the stator advances ahead

of the rotor. For optimal torque, the stator’s magnetic field should be asnearly orthogonal to the rotor’s magnets as possible, which means thatthe transition from one sector to another must occur at precisely gaugedrotor positions. The algorithms for controlling the switching of the stator current

normally run in a microcontroller. But to drive the MOSFETs or IGBTs, thelow-voltage signal from the MCU must be amplified by gate drivers thathave the appropriate characteristics, such as low propagation delay, andlow rise and fall times, together with sufficient voltage capability to drivethe switch safely. The MIC4605 from Micrel is particularly well suited tothis task in battery-powered applications such as portable power toolsand kitchen equipment. The rotor position is the key to determining the right instant for

commutating the motor winding. In applications where precision isrequired, Hall sensors or tachometers are used to calculate the position,speed and torque of the rotor. When cost is the most important factor,

MICREL

High-efficiency BLDC motors: keydesign considerations

12 E M A I L I N F O @ M Y - F T M . C O M F O R S A M P L E S A N D D A T A S H E E T S

Fig. 2: A BLDC motor’s switching circuit using IGBTs

Fig. 3: Six-step commutation


Stator

Rotor with permanent magnet

Fig. 1: Cross-section ofa BLDC motor

back Electromotive Force (EMF) may be used to calculate position,speed, and torque.This means that BLDC motors typically operate in a closed-loop

control system, in which the MCU performs the servo-loop control,calculations, corrections, and management of sensors such as backEMF, Hall sensors or tachometers.An 8-bit MCU might be sufficient, but often 16- or 32-bit devices are used.

They require EEPROM to store the firmware that performs the algorithmsrequired to set the desired motor speed and direction, and to maintainthe stability of the motor. MCUs often include an adequate ADC thatallows for sensorless motor control, which saves cost and board space.

The MCU offers scope to optimise the algorithms for the application. Butsome external analogue peripherals are also required, as shown inFigure 4. These analogue devices provide the MCU with an energy-efficient power supply, voltage regulation, voltage references, and thecapability to drive MOSFETS or IGBTs while offering fault protection. Thiscombination of digital and analogue technologies allows the designer torealise an efficient three-phase BLDC motor, and to achieve a comparablebill-of-materials cost to that of an induction or brushed DC motor.

Fig. 4: Typical functional block diagram of a 24V BLDC motor-control system

Future Electronics at Embedded Worldhave hundreds of FREE boards to give away!

(Nuremberg, 25-27 February 2014)

STMicroelectronicsSTM32 F3 Discovery kitThe Discovery kit provides everythingrequired to get started quickly with theSTM32 F3 series of ARM® Cortex™-M4 MCUs.Featuring the STM32F303VCT6 MCU, it also includes an ST-LINK/V2 embeddeddebug tool, and a MEMS accelerometer,

gyroscope and e-compass.

Future Electronics: for all your embedded control requirementsFuture Electronics offers a fantastic choice of 8-, 16- and 32-bit microcontrollers from

leading suppliers including NXP Semiconductors and STMicroelectronics, and fullsupport for application development through its FAEs and partners.

NXP SemiconductorsLPCXpresso board

The LPCXpresso™ board with NXP's LPC812ARM® Cortex™-M0+ MCU makes it easy to get

started with a new design project. Combined with the full-featured, Eclipse-based LPCXpresso IDE, this board supports

your entire product design cycle.

Visit Future Electronics at stand 4A-110 at Embedded World for your chance to receive one of hundreds of FREE LPCXpresso boards and STM32 F3 Discovery Kits

FREEFREE

E M B E D D E D P R O C E S S I N G

14 F R E E D E V E L O P M E N T K I T S AT W WW . M Y- B O A R D C L U B . C O M

Embedded ProcessingOn the surface, the market for microcontrollers for embeddedcontrol applications can seem remarkably uniform: almost every32-bit microcontroller manufacturer now offers a line-up ofproducts based on the ARM® Cortex™-M series of processorcores. The one important exception is Microchip, whichprovides a portfolio of PIC32 MCUs based on MIPS processorcores, including the PIC32MX featured on the back cover of thisissue of FTM. Scratch the surface however, and important

differences soon come to light, and they are evidentin the pages of FTM’s Application Spotlight thismonth. Even manufacturers which take a similar

approach to the implementation of the ARM cores,such as STMicroelectronics (ST) and NXPSemiconductors, are finding different ways tomeet the particular needs of system designers.ST, for instance, has done wonders with the ‘ValueLine’ STM32F030 family, on page 17, packing animpressive number of features inside a 48MHz controller thatcosts no more than a mid-range 8-bit microcontroller. And its STM32F373 family, featured below, is distinguished by

its excellent provision of features for digital signal control.Based on the familiar Cortex-M4 core with its embeddedfloating point unit, the device also offers a number of fast

ADCs, comparators and timers, perfect for motor control anddigital power supplies. By contrast, NXP’s LPC4370, on page 18, also makes use of

the Cortex-M4 core, but NXP has included a Cortex-M0 co-processor to handle system-control tasks. Featuring an on-board 80Msamples/s ADC, this device provides an idealhardware base for demanding data-acquisition applications.

Architectural innovation is also evident in otherNXP MCUs: the LPC11x37H family, on page 15, forexample, features a software I/O Handler block.This flexible feature enables designers to implementuncommon interfaces such as DALI, and to makelate changes to a design’s ports or interfaceswithout a wholesale hardware reconfiguration. This Application Spotlight also features a

completely different ARM microcontrollerarchitecture: the programmable PSoC 5LP fromCypress Semiconductor, on page 18, whichoffers the ability to integrate in a single chip

unusual combinations of functions that otherwise would requiremany chips in a more expensive and more complicatedhardware design. And at the high end of the embedded control market, Atmel

provides a wide choice of ARM-based microprocessors, withthe Cortex-A5-based SAMA5D3 family featured on page 16.

New ARM Cortex-M4 MCU series offersmore peripherals for digital signal control

STMICROELECTRONICS

APPLICATIONS• Motor control in home appliances• Portable medical equipment• Entry-level consumer audio equipment• Metering equipment• Solar micro-inverters• Entry-level digital power supplies• LED lighting

FEATURES• One or two DACs• Low-power real-time clock• One or two I2C interfaces• Three serial peripheral interfaces• CAN interface • USB interface




Development platform for the STM32F3series microprocessorsThe STM32373C-EVAL board features anSTM32F373VCT6 MCU with an ECG sensor, pressuresensor and PT100 temperature sensor connected to theMCU’s three sigma-delta ADCs, a touch slider, HDMIconnectors and a light-dependent resistor.Orderable Part Number: STM32373C-EVAL

FREEBOARDS

STMicroelectronics has announced anextension to its entry-level STM32F3series of ARM microcontrollers,providing a wide choice of I/Os andperipherals at competitive prices.

The new STM32F373x line is based on thehigh-performance ARM® Cortex™-M4 32-bitRISC core operating at a maximumfrequency of 72MHz. Thisprocessor includes anembedded floatingpoint unit, amemory protectionunit and an embeddedtrace macrocell. The ARM Cortex-M4

is notable for its reducedpin count and low powerconsumption, whiledelivering outstandingcomputational performanceand an excellent response tointerrupts. The ARM Cortex-M4 core offers exceptional

code efficiency, delivering high performance ina memory footprint more commonly associated

with 8- or 16-bit devices. The processor supports a set of DSP instructionswhich allow efficient signal processing and theexecution of complex algorithms. Its singleprecision FPU speeds-up software developmentby using meta-language development tools,while avoiding saturation.Equipped with this ARM Cortex-M4 core,

the new STM32F373x line is intended for usein digital signal control designs, for which it

offers an attractive combination of afast 12-bit, 5Msamples/s ADC,

as many as three precise 16-bit sigma-delta ADCs,

programmable gainamplifiers, one or two

fast comparatorsand versatiletime control units.

In all, the new devicesprovide a high level of

integration at prices low enough tosuit entry-level equipment.

The devices also feature high-speedembedded memories offering up to 256kbytesof Flash memory and up to 32kbytes ofSRAM. They are offered in five packages rangingfrom 48 pins up to 100 pins. With its embedded ARM core, the

STM32F373 family is compatible with all ARMtools and software.

New 32-bit MCUs provide low-cost route to USB connectivity

STMICROELECTRONICS

The latest addition to the STM32 L1series from STMicroelectronics, theSTM32L100 Value Line, is a perfect fitfor applications that require limitedprocessing power and ultra-low powerconsumption at a budget price.

All STM32 L1 devices share the samearchitecture with the same memory mapping,and are fully pin-compatible. The addition ofthe STM32L100 line therefore provides ameans for manufacturers to extend a family ofend-products based on the L1 series into moreprice-conscious territory with little requirementfor hardware re-design and re-tooling. There are four members of the STM32L100

Value Line, all based on the ARM® Cortex™-M3core. Each contains a mix of standard and

Microcontrollers with I/O Handler boostembedded-design flexibility

NXP SEMICONDUCTORS

The NXP Semiconductors LPC11E37Hand LPC11U37H ARM® Cortex™-M0microcontrollers feature NXP’s I/OHandler, a software-driven block thatenhances performance, connectivityand flexibility by emulating serialinterfaces or performing processing-intensive functions such as DMAtransfers in hardware.

Software libraries currently available for the I/OHandler include I²S, I²C, UART and DALImaster emulation functions, as well asprocessing-intensive functions such as CRC,threshold ADC conversion and DMA. Theselibraries can be downloaded fromwww.lpcware.com/ioh, and more will beadded in the future.The I/O Handler allows developers to tailor

the microcontroller’s features and performanceto meet specific application requirements, byconfiguring additional ports as required oradding functionality not commonly found onmicrocontrollers, such as the hardware DALIinterface. In addition, the I/O Handler enables



APPLICATIONS• Medical equipment• PC peripherals• Gaming equipment• Satellite navigation devices• Security equipment• Utility metering equipment

FEATURES• 0.35µA current draw in Stand-by mode• Operating voltage range: 1.65V to 3.6V• 32MHz maximum core operatingfrequency

• Memory protection unit



APPLICATIONS• Consumer peripherals• Handheld scanners• Medical devices• Industrial controllers• Audio devices with USB connectivity

FEATURES• Up to 54 GPIOs with configurable features• Power-management unit• Easy-to-use power profiles in boot ROM• 12MHz RC oscillator, watchdog oscillatorand PLL

• Downloadable IOH libraries,documentation and application examples,IOH tutorial videos available




Development platform for the STM32L100Value Line microprocessorsBased on the STM32L100RCT6, the32L100CDISCOVERY kit includes an ST-LINK/V2embedded debug tool, LEDs, and push buttons for easyconnection of additional components and modules.Orderable Part Number: 32L100CDISCOVERY

FREEBOARDS


Microcontroller performance and featuresoptimisationNXP Semiconductors I/O Handler LPCXpressodevelopment board, extended to allow evaluation of the I/OHandler functionality and featuring Link2 on-board debug.Orderable Part Number: OM13062

FREEBOARDS

Part Number Flash (kb) EEPROM (B) Timers ADC I/Os (High-current) Display Controller

STM32L100C6 32 2048 6 x 16-bit 16 x 12-bit 37 LCD 4 x 16STM32L100R8 64 2048 6 x 16-bit 20 x 12-bit 51 LCD 4 x 32/8 x 28STM32L100RB 128 2048 6 x 16-bit 20 x 12-bit 51 LCD 4 x 32/8 x 28STM32L100RC 256 8192 8 x 16-bit

1 x 32-bit 21 x 12-bit 51 LCD 4 x 32/8 x 28

developers to implement any late projectchanges quickly and cost-effectively. An extraserial interface can be provided with zero orvery low additional CPU load, while reassigningprocessing-intensive functions to the I/OHandler can help meet system-performancerequirements without changing the MCU.Using the I/O Handler also helps to reduce

the application’s power consumption, byrunning or monitoring signals while the CPUcore is in sleep mode and waking-up the corewhen a certain condition is met.The LPC11E37H and LPC11U37H combine

the ARM Cortex-M0 core operating up to50MHz with up to 128kbyte Flash, 12kbyteRAM, 4kbyte EEPROM and peripheralsincluding a 10-bit ADC and a USART thatsupports an ISO 7816-3 asynchronous smart-card interface. In addition, the LPC11U37Hhas a configurable USB2.0 full-speed devicecontroller with its own dedicated Phase-Locked Loop (PLL).The OM13062 I/O Handler LPCXpresso

development board is available, to help designersexplore the features of the IO Handler and theLPC11E37H and LPC11U37H microcontrollers.

advanced communication interfaces. Inaddition to a USB2.0 interface, they supportI2C, SPI, I2S and USART connections.The STM32L100 parts also come with a

wide range of peripheral features integrated, toreduce the requirement for externalcomponents and to save space and bill-of-materials costs. These include a real-timeclock, 16-bit timers and a 12-bit ADC. Thedevices also integrate an LCD driver suitablefor displays of up to 8 x 28 segments.Like the other STM32L1 devices, the

STM32L100 parts support low-poweroperation with a variety of quiescent modesand a flexible clock tree. The devices offer aset of back-up registers that remain poweredin StanOYWk YbPZM aYV^Yfab N]f Za Zfd\fVYZU UST R Q

abdf_bZ_ dV] e VgW_Ofa T R Q h _bVfZ\\ aZdZfVdb V] f_Vb_e if Z]e ekZf bfY dZhg cbfZ \ f] _gf_cjZYZY e _ckV e i]fX abdfeV fa ZYZcYaaZ [bf Z]e cg_c kbhf_\VPZ

16 F R E E D E V E L O P M E N T K I T S AT W WW . M Y- B O A R D C L U B . C O M

ARM Cortex-A5 processor family in smaller package and widertemperature range

ATMEL

Atmel has expanded its SAMA5D3family of ARM® Cortex™-A5-based MCUswith new devices offering extendedtemperature operation, a new mix ofperipherals, and a new smaller package.

1,328MB/s at a bus speed of 166MHz. At thesame time, they achieve ultra-low powerconsumption of less than 150mW in Activemode at maximum speed, and just 0.5mW inLow-power mode. The SAMA5D3 devices alsofeature advanced user interfaces for homeautomation and control panels.In space-constrained applications such as

wearable electronics, device miniaturisation ishighly desirable, so Atmel has added asmaller package option to the SAMA5D31: a12mm x 12mm BGA324 package with a0.5mm ball pitch. For industrial equipment manufacturers and

the automotive aftermarket, the newSAMA5D36 provides a unique combination ofuser-interface and connectivity featuresincluding an LCD controller, two Ethernetcontrollers, two CAN 2.0 controllers andthree Hi-Speed USB transceivers. In addition,both the SAMA5D36 and the SAMA5D35 arerated for an ambient temperature range of -40°Cto 105°C. Atmel has also expanded the software

ecosystem supporting the SAMA5D3 MPUs toinclude the Yocto Atmel Linux distribution anda free Android 4.2 port, as well as boardsupport packages for Windows Compact 7,QNX and NuttX.

New FPGA reference designs implement flexible MIPI bridges

The features of MachXO2 devices are well suited to display-driving applications

LATTICE SEMICONDUCTOR

Lattice Semiconductor has introducedtwo easy-to-use solutions for bridgingMobile Industry Processor Interface(MIPI) devices to the rest of a system.

MIPI is being adopted more widely by imagesensor, display and system manufacturers,helping them to create products which are lowin cost, highly reliable and consume littlepower while supporting the latest display andaudio features. The new referencedesigns from Lattice give designersverified FPGA IP that implements abridge between an applicationsprocessor and a display, or between aCMOS image sensor and anapplications processor. The Display Serial Interface (DSI)

Transmit reference design is acomplete Hardware DescriptionLanguage (HDL) blueprint for enablingeither a MachXO2 or ECP3 FPGA todrive a low-cost DSI receiving devicesuch as an LCD screen. The output of the design is linked to

a D-PHY interface’s IP core, allowingthe FPGA to directly drive a DSIreceiving device. The DSI Transmit

design enables embedded designers to uselow-cost screens with embedded processors.Lattice also supplies a flexible MIPI DSI

Receive bridge reference design, whichenables an application processor intended formobile devices to interface to a screen that isnot designed for mobile applications.Separately, a parallel-to-CSI-2 Transmit

reference design enables designers to easilyimplement the bridging function between anapplications processor and an image sensorthat is not designed for mobile applications.This might be required because image sensors


APPLICATIONS• Wearable electronics• Industrial equipment• Automotive aftermarket• Medical equipment

FEATURES• Touch-screen interface• CMOS image sensor interface• 12-bit ADC and 32-bit timers• Supports advanced security algorithms



APPLICATIONS• Cameras and camera modules• Displays, monitors and TVs• Portable computing• Mobile phones• Portable medical equipment• Handheld industrial products

FEATURES (DSI Transmit bridge):

• Supports up to four data lanes• Typical power for bridge with two datalanes running at 700Mbits/s: 20mW

• Display command set controller toprogramme the display

• Input parallel RGB bus




Evaluation platform for the AtmelSAMA5D36 embedded microprocessorThe kit consists of a main board, a computer moduleequipped with a SAMA5D36 processor, and a displaymodule. It is supported by the SAMA5D3 Softpack, a freeset of bare-metal C examples, and is delivered with on-board demos for Linux and a Qt-based GUI.Orderable Part Number: SAMA5D36-EK

FREEBOARDS

The SAMA5D3 MPUs can provide highprocessing power of up to 850DMIPS at536MHz, and fast data throughput of

for the embedded or digital still camera marketsoften have sub-LVDS or other proprietaryinterfaces, rather than the Camera SerialInterface-2 (CSI-2) used by applicationsprocessors. Lattice also offers a flexible MIPI CSI-2

Receive bridge, which enables a mobile CSI-2image sensor to interface to an embeddedimage signal processor.

ARM MCU attacks 8-bit territory withattractive price and free tools

STMICROELECTRONICS

STMicroelectronics has brought the costthreshold for using 32-bit microcontrollersto a new low point with the introductionof the STM32F030 Value Line family.

Based on the ARM® Cortex™-M0 core runningat 48MHz, the STM32F030 isintended for cost-sensitiveapplications traditionally realised with8- or 16-bit MCUs, in which the 32-bitdevice can offer far superior featuresand performance.The STM32F030 parts include high-

speed embedded Flash and SRAMmemories, and a wide range ofcommunication interfaces. Embeddedcontrol applications will benefit fromthe STM32F030’s 12-bit ADC capableof capturing 1Msamples/s, as well asits 16-bit timers and PWM timer.In keeping with the low cost of the

STM32F030, a collection of freedevelopment tools is available tosupport development work. Theseinclude: CooCox CoIDE, free for any

STM32F030 design project and Keil MDK-ARM, free for STM32F030 devices with16kbyte or 32kbyte of Flash memory.The STM32F030 operates in the -40°C to

85°C temperature range from a 2.4-3.6Vpower supply. The new family is pin-to-pincompatible with the STM32 F1 and F3 productlines, providing for the easy development ofscalable families of end-products.


APPLICATIONS• Home automation• Heating and ventilation equipment• Home appliances• Power tools• Consumer printers• Gaming equipment• Remote controls

FEATURES• 5-channel DMA controller• Hardware RAM parity check • Real-time clock • Cyclic redundancy check



my-ftm.com/140228FOR MOREINFORMATION


Low-cost 32-bit developmentThe STM32F030 Discovery kit, which features theSTM32F030R8 MCU, includes an on-board ST-LINK/V2debugger, four LEDs, two push buttons, an extensionheader for all LQFP64 I/Os, and an additional boardwhich can be connected to the extension connector foreasy prototyping and probing.Orderable Part Number: STM32F0308-DISCO

FREEBOARDS

STM32F030 Value Line: choice of communications interfaces

18 F R E E D E V E L O P M E N T K I T S A T W W W . M Y - B O A R D C L U B . C O M

Highest performing ARM Cortex-M4 coreteams with 80Msample/s ADC in single-chipdata-acquisition solution

NXP SEMICONDUCTORS

The NXP Semiconductors LPC4370combines the industry’s fastest ARM®

Cortex™-M4 processor with the fastest12-bit ADC currently available on aCortex-M microcontroller to provide acomplete solution for high-speed data-acquisition applications on a single chip.


APPLICATIONS• Spectrum analysis• Current measurement• Digital signal processing• Audio streaming and processing• Analytical instrumentation

FEATURES• Two CAN2.0B controllers• Two SSP controllers with FIFO, multi-protocol and DMA support

• SPI controller• SD-card interface• Timer/counters, motor-control PWM andquadrature-encoder interface



New PSoC controller offers high analogue performanceat lower power levels

CYPRESS SEMICONDUCTOR

Cypress Semiconductor has added thelow-power PSoC® 5LP to its family ofProgrammable System-on-Chip (PSoC)devices.

APPLICATIONS• Highly integrated analogue and mixed-signal designs

FEATURES• Fully functional analogue from 1.71V to 5.5V• CapSense® touch-sensing support• Support for segment LCDs• Operating supply range: 0.5V to 5.5V




Highly integrated analogue and mixed-signal designsThe PSoC 5LP Development Kit is powered by Cypress’sCY8C58LP high-precision analogue controller. The kit isdesigned for high analogue performance: it features avery low noise floor, and care has been taken to separatethe analogue and digital domains.Orderable Part Number: CY8CKIT-050

FREEBOARDS


LPC-Link 2 stand-alone debug adapterLPC-Link 2 is a stand-alone debug adapter that can beconfigured to support various development tools andIDEs by downloadable firmwares.Orderable Part Number: OM13054 (LPC-Link 2)

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By offering conversion performance of up to80Msample/s, the LPC4370’s high-performance ADC provides acompetitive edge in terms of high-speed analogue data conversion,enabling developers to streamlinedata acquisition, processing andcommunications for a wide rangeof data-intensive applications.Alongside the 204MHz Cortex-

M4 core, the LPC4370 also has a204MHz Cortex-M0 co-processorfor offloading control and I/O taskssuch as handling USB stacks. Thismulti-core architecture offers

simplified algorithm partitioning. There is also adedicated subsystem for handling programmabledigital I/O and pre- or post-processing.Moreover, by providing large SRAM and flexiblememory expansion, the LPC4370 allowssystem designers to tailor the memory type andsize to their specific application requirements.The LPC4370 also provides advanced

peripherals including High-Speed USB2.0Host/Device and Host/Device/OTG interfaceswith on-chip PHY and DMA support, a QuadSPI Flash interface, a 10/100 Ethernet MACwith DMA support and IEEE 1588-2008 v2advanced time stamping, and a graphics-LCDcontroller for display interfacing.Developers can also take advantage of

advanced configurableperipherals such as the State-Configurable Timer (SCT) andSerial General-Purpose I/O(SGPIO) interface, as well as282kbyte of SRAM, 64kbyteROM, 64-bit + 256-bitgeneral-purpose OTPmemory, and an external-memory controller supportingexternal SRAM, ROM, NORFlash, and SDRAM devices.

PSoC 5LP combines high-performanceprogrammable analogue capabilities with theability to operate at low power in operatingand quiescent modes. Built around an ARM®

Cortex™-M3 controller core, PSoC 5LPincludes very precise and accurate ADCstogether with 80 verified ‘components’,modular functions, from which the designercan select in the PSoC Creator™ developmentenvironment. Like other PSoC devices, PSoC 5LP

benefits from a highly configurable system-on-chip architecture, offering the flash-basedequivalent of a field-programmable ASIC, butfree of the long lead time and up-frontengineering costs associated with ASICs. PSoC offers the user a choice of configurable

analogue and digital circuits, controlled by anon-chip microcontroller.

A single PSoC device can integrate as manyas 100 peripheral functions, saving customersdesign time, board space and powerconsumption while improving system qualityand reducing system cost. At the same time,the flexible PSoC resources allow designers tofuture-proof their products by enablingfirmware-based changes during design,validation and production, and even in the field.In the PSoC 5LP implementation of this

configurable architecture, high analogueperformance is enabled by the provision ofdifferential 12-bit SAR ADCs and a 20-bitdelta-sigma ADC supported by a 1.024Vinternal reference, accurate to ±0.1%. Developers can extend the device’s

analogue functionality by configuring it with awide variety of PSoC Creator componentsinclude op amps, comparators, trans-impedance amplifiers, programmable gainamplifiers and mixers. At the same time, PSoC 5LP is ideal for

designs powered by a single cell: drawing only300nA in Hibernate mode, the new devicescan be woken by I/Os having retained thestate of the CPU core, SRAM and deviceconfiguration. In addition, boost technologyallows designers to power-up and regulate onas little as 0.5V.

19V I S I T T H E O N L I N E F T M M A G A Z I N E A T: W W W . M Y - F T M . C O M

Cortex-M4 MCUs provide attractive mix ofperformance, power consumption and peripherals

STMICROELECTRONICS

STMicroelectronics has introduced anew entry-level line to its establishedSTM32 F4 series of ARM® Cortex™-M4microcontrollers.

The STM32F401 line is well suited to medical,industrial and consumer applications requiringa combination of high processor performanceand power efficiency with generous provisionof memory and peripherals. The 12 devices inthe line are available in packages as small as3mm x 3mm, and provide up to 512kbytesof Flash memory.

The attractive performance of theSTM32F401 devices is due in part to theARM Cortex-M4 core with floating point unit,which runs at 84MHz while offeringoutstanding power figures in Run and Stopmodes. Delivering CoreMark® performancerated at 105DMIPS/285 when executingfrom Flash memory, the STM32F401 offers aDSP instruction set and a floating point unit,with the result that it can implement a widerange of digital signal-processing applications.

Power efficiency is another strong suit ofthe new family. Dynamic power scaling and

an adaptive real-time ART Accelerator™ enablethe STM32F401 to draw as little as 137µA/MHzin Run mode when executing from Flashmemory. In Stop mode, the devices operatefrom as little as 9µA.

Connectivity is well provided for by a varietyof digital interfaces, including a USB2.0 OTGFull-Speed interface.

The STM32F401 microcontrollers are alsowell suited to consumer audio applications,since they offer a dedicated audio PLL andtwo full-duplex I2S interfaces.

Upgraded FPGAs offer low total cost of ownership

IGLOO2: suitable for control-plane and bridging applications

MICROSEMI

Microsemi has introduced two newgenerations of its mainstream FPGAfamilies. SmartFusion®2 SoC FPGAs andIGLOO®2 FPGAs offer high datathroughput, thanks in part to a richprovision of 5Gbits/s SERDES interfaces,improved fabric performance andintegrated 18x18 Multiply AccumulateDSP blocks. The new device familiesalso offer numerous system-level costbenefits.

Microsemi offers the industry’s largest portfolioof low-density FPGAs and SoC FPGAsequipped with PCI Express Generation 2-compliant 5Gbits/s SERDES. This is importantfor cost-sensitive control-plane designs, aswell as for low-to-mid-bandwidth bridgingapplications. The devices also offer the highestdensity of 5Gbits/s SERDES channels indevices with logic densities lower than150,000 LUTs, enabling designers to specifyredundant lanes or aggregate multiplechannels at a lower cost than in designs usinglarge, expensive and power-hungry FPGAs.


APPLICATIONS• Control panels with LCD screens• Medical patient monitors • Point-of-sale equipment• Surveillance cameras• Home and car audio• HMI in home appliances

FEATURES• 64kbyte internal RAM• Six 16-bit timers• Two 32-bit timers and two watchdog timers• Real-time clock



APPLICATIONS• Secure wireless communications• Surveillance cameras• Automotive sub-systems

FEATURES• No configuration memory device required,

allowing for a smaller and simpler PCB• Instant-on operation with no need for a

companion CPLD • Only two power supplies required• Design and data-security capabilities are

easy to use



The STM32F401 MCUs offer a mix of performance and power efficiency


Development of transceiver I/O-basedFPGA designs in applicationsimplementing PCI Express and GigabitEthernet technologiesOrderable Part Number: M2GL-EVAL-KIT

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Low-cost Cortex-M4 developmentThe STM32F401 Discovery kit, based on theSTM32F401VC microcontroller, includes an ST-LINK/V2embedded debug tool, a gyroscope, an e-compass anddigital MEMS microphone. It also features an audio DACwith an integrated Class-D speaker driver, a USB OTGmicro-AB connector, LEDs and push buttons.Orderable Part Number: STM32F401C‑DISCO

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SmartFusion2 SoC FPGAs offer up to 50%less total power consumption than competingsolutions and IGLOO2 FPGAs offer up to 25%lower power consumption, dramaticallylowering operating expenses and allowing forfanless operation in rugged environments.Both product families help system designers torealise very low total cost of ownership.

The low-cost benefits of these programmabledevices also extend to the integrated ASIC-basedsub-systems, such as the ARM™ Cortex®-M3microcontroller sub-system in SmartFusion2 orthe high-performance memory sub-system inIGLOO2. These ASIC blocks provide ease ofuse, low power and fast time to market,thereby lowering total cost of ownership.

20 F R E E D E V E L O P M E N T K I T S AT W W W . M Y- B O A R D C L U B . C O M

Powerful ARM Cortex-M3 family integratesrich features for industrial control

NXP SEMICONDUCTORS

NXP Semiconductors’ LPC1800microcontrollers provide rich featuresfor industrial-control applications,including motor-control and timingperipherals, CAN2.0B and Ethernetsupport, an I2C engine that can be usedfor SMBus or PMBus communication,and large on-chip Flash and SRAM.

The LPC1800 series features the ARM®

Cortex™-M3 core running at up to 180MHz.The motor-control and timing peripheralsinclude a PWM block and quadrature-encoderinterface, up to four 32-bit timers, and a State-Configurable Timer (SCT) subsystemcomprising a timer array with a state machine.The SCT is a configurable digital peripheralsupporting complex functionality such asevent-controlled PWM generation, ADCsynchronisation and dead-time control. Thisenables designers to create user-definedwaveforms and to tailor signals for motorcontrols or other applications such as powerconversion or lighting.

180MHz microcontroller combineshigh graphics performance with lowstatic power consumption

STMICROELECTRONICS


APPLICATIONS• Industrial control• Motor control• Power conversion and lighting

FEATURES• Two 10-bit ADCs, 10-bit DAC• USB2.0 Host/Device andHost/Device/OTG interfaces

• Eight-channel DMA controller• Optional colour-LCD controller• I2S interface• System-safety features



APPLICATIONS• Medical equipment• Industrial equipment• Consumer devices

FEATURES• Dedicated audio PLL• Two 12-bit DACs• Three 12-bit ADCs (7.2Msamples/s)• Cryptography/hash processor forhardware acceleration of securityalgorithms (STM32F439 only)

• True random number generator



There is also a Global Input-Multiplexer Array(GIMA), which permits cross connection ofmultiple inputs and outputs to event-drivenperipherals like the SCT, other timers, or on-chip ADCs.In addition to peripherals effectively

simplifying networked motion-controlapplications, these devices also offeradvantages such as large on-chip memoriesincluding up to 1Mbyte dual-bank Flash withFlash accelerator, up to 200kbyte SRAMarranged in multiple banks with individualpower-down control, and OTP ROM with thebenefit of secure OTP-key storage. The dual-bank Flash allows reliable in-application re-programming. In addition, the quad-SPI FlashInterface (SPIFI) allows communication withoff-chip 4-lane Flash at up to 80Mbit/s per lane.Fabricated using NXP’s ultra low-leakage

90nm process technology, the LPC1800 seriesoffers fast operation and low dynamic powerconsumption, as well as up to 100x lowerpower consumption in standby modes due toproprietary low-leakage optimisation. Devicesare pin-compatible with the dual-core CortexM4-M0 LPC4300 series, allowing engineers toscale and future-proof designs.


Motor-control developmentLPC1830-Xplorer bundle including NXP Semiconductors’LPC1830 demo board featuring 32Mb Quad SPI Flash,crystals for controller, RTC and audio codec, EthernetPHY with connector and magnetics, and SD-card slot.Bundled with Keil ULINK-ME debug adapter.Orderable Part Number: OM13028

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Development platform for the STM32F4series microcontrollersThe STM32F429 Discovery kit is based on anSTM32F429ZI microcontroller and includes an ST-LINK/V2embedded debug tool interface, 2.4" TFT LCD, 64Mbitsof SDRAM, an ST MEMS gyroscope, LEDs, push buttonsand a USB OTG micro-B connector.Orderable Part Number: 32F429IDISCOVERY

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STMicroelectronics has added two newlines to its popular STM32F4 series ofmicrocontrollers based on theARM™ Cortex®-M4 core withembedded floating point unit.

The STM32F429/439 lines,which run at a maximum180MHz operatingfrequency, provide a highlevel of graphicsperformance while at thesame time offering muchlower static power consumptionthan other parts in the STM32F4 series.At their full 180MHz speed, the

STM32F429/439 parts are rated for225DMIPS/608 CoreMark® performance whenexecuting from Flash memory. Zero-wait statesare supported by ST’s adaptive real-time ARTAccelerator™.

Despite the devices’ high speed andperformance, however, power usage is frugal:in Run mode and executing from Flashmemory, they draw as little as 260µA/MHz. InStop mode, the typical current requirement isjust 100µA, some 3x lower than that of theSTM32F405/F415/F407/F417 parts.The STM32F429/439 MCUs are endowedwith a rich set of connectivity options,

including up to 20 communicationinterfaces, such as USARTs,

UARTs, serial peripheralinterfaces, I2C interfaceswith a new optional digitalfilter capability, CAN andSDIO. Graphics display is another

strong suit of the new lines. TheirLCD-TFT controller interface withdual-layer support takes advantageof ST’s Chrom-ART graphicsaccelerator, accomplishing contentcreation twice as fast as the unassisted

core. As well as raw data copy, additionalfunctions supported by the Chrom-ARTAccelerator include image-format conversionand image blending.

Future Electronics’ Board Club: supporting innovative electronics designEurope’s electronics industry thrives on the application of innovation and creativity, and an essentialinnovator’s tool in design projects is the development board. The Board Club website is a Future Electronicsresource for users of development boards. Here, and only here, Board Club members can gain access toexclusive free development boards and development board offers.If you would like to register for membership, please visit: www.my-boardclub.com/register.php

To apply for these free boards go to: www.my-boardclub.com/ftmTerms and conditions apply. Visit www.my-boardclub.com/about_us for details

B O A R D O F T H E M O N T H

New development boards for ARM MCUsFREE from Future ElectronicsNXP and STMicroelectronics have recently introduced twonew development boards which provide rich environmentsfor the development of embedded-control applications.

Now both boards are available FREE from Future Electronicsvia its Board Club website. Visit www.my-boardclub.com toapply, or to request membership of the Board Club.

FEATURES• 12MHz crystal for CPU• 3.15-3.3V external power supply, or fromUSB via the on-board LPC-LINK JTAGprobe

• UART header for in-system programming• RGB LED • Potentiometer


LPC812LPCXpressoboard

The LPC812-LPCXpresso board from NXPSemiconductors provides a means for users ofits LPC812 ARM® Cortex™-M0+ microcontrollerto get started quickly with new design projects.It is intended to be used with the full-featuredEclipse-based LPCXpresso IntegratedDevelopment Environment (IDE).

Orderable Part Number: OM13053

FREEBOARDS

Apply at: my-boardclub.com/ftm

All the LPC812’s pins are available on theexpansion connector (2 x 27 rows of pins).Embedded JTAG (LPC-LINK) functionality isavailable through the LPCXpresso IDE.

The STM32F3 Discovery kit helpsdesigners to explore the mixed-signalfeatures available in the STM32 F3 seriesof ARM® Cortex™-M4 microcontrollersfrom STMicroelectronics. It includeseverything required for beginners andexperienced users to get started ondevelopment work quickly.Based on the STM32F303VCT6 MCU, the

development board features three MEMSsensors from ST: an accelerometer, agyroscope and an e-compass. It also providesa USB connection, LEDs and push buttons,and an ST-LINK/V2 embedded debug tool. Many free, ready-to-run application firmware

examples are available at www.st.com tosupport quick evaluation and development.

FEATURES• L3GD20 three-axis digital-outputgyroscope

• LSM303DLHC 3D linear accelerationsensor and 3D magnetic sensor

• Mini-B USB connector• Extension header for all LQFP100 I/Os for quick connection to prototyping boardand easy probing


Orderable Part Number: STM32F3DISCOVERY

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Apply at: my-boardclub.com/ftm my-ftm.com/140235FOR PARTS ANDLATEST PRICING


STM32F3Discovery kit

T E C H N I C A L V I E W

In the past decade, the technology for connecting devicesover unlicensed Industrial, Scientific and Medical (ISM) bandfrequencies lower than 1GHz has evolved to offer greatercapability, but at the expense of greater complexity. Here,Alviano Burello, Business Development Manager for RF &Wireless, Future Electronics, explains.

In the 1990s, the limited processing power available from themicrocontrollers of the time constrained the designer’s choice of topology:most wireless networks at that time were in point-to-point, bus or startopologies that ran on simple protocol software. Limitations in the range and number of nodes supported by these

technologies, however, led to the introduction of mesh and tree networktypes. And in recent years, the industry seems to have come to aconsensus that ZigBee®, an industry-standard mesh networkingprotocol, offers the best way to implement a multi-node, long-rangeISM-band network.But mesh networking is inherently complex and more difficult to

implement than a star network configuration. This is a high price to payfor the extra kilometres of range that ZigBee offers, if in every otherrespect the features provided by a star network would be adequate forthe application. This is why the new technology described in this articleis exciting wide interest among RF design engineers by massivelyextending the range of a star network.

Mesh networks: complex by natureA star network has an inherently shorter maximum range than a meshnetwork. Figure 1 shows that the range of a star network is limited to thedistance between one node and another. A mesh network, by contrast, effectively provides an array of repeaters

that can receive and re-transmit a signal from any one node to any othernode. In a mesh network, traffic routing is dynamic, and signals arepassed from one node to the next like the baton in a relay race until theyreach their destination. This means that the range of a mesh networkcan theoretically be made unlimited. In practice, of course, the software for characterising multiple nodes,

implementing system timing and routing traffic between nodes is highlycomplex. In fact, the more nodes in the network, the more potentialroutes for data traffic to take. The software for controlling a meshnetwork can thus easily become large and difficult to manage. This in turn has a marked impact on the memory footprint of the

hardware supporting a mesh network, and therefore also on bill-of-materials cost. A complex mesh-network protocol such as ZigBee callsfor the use of a high-specification microcontroller, as well as requiringlarge memory resources.

On both the hardware and software side, then, a mesh network makeshigh demands on system resources. The problem in the past has been that, for OEMs requiring an ISM-

band network with a range of several kilometres but only a relatively lowdata rate, a mesh network has been the only valid topology; starnetworks were typically limited to a range of around 1km in open space,provided the link used a low bit rate that could support an adequateSignal-to-Noise Ratio (SNR). Yet for most OEMs it would be far preferable to implement a star

network than a mesh network. Because a star network consists of asingle master and multiple slave nodes, the routing of traffic is far simplerthan in a mesh network. An asynchronous system keeps the controltraffic as small as possible, thus making most efficient use of theavailable duty cycles, and minimising power consumption, while entailinga low risk of collisions between data frames. In general, the softwareoverhead in a star network is therefore far smaller than that of a meshnetwork. In addition, while every node in a mesh network must be intelligent,

and therefore complex and expensive, in a star network all theintelligence is concentrated in the controller node; slave nodes aresimple and cheap to make. In fact, a star network can be implemented with just a low-end

microcontroller and a small amount of Flash memory in the control node.This means it will also consume little power, making it well suited forbattery-powered applications. The constraint that deters designers from implementing a star network

has, then, been the range between nodes. This range is stronglyaffected by the modulation scheme used by the RF transceivers. Sub-1GHz RF transceivers today typically implement Frequency Shift Keying(FSK) or Amplitude Shift Keying (ASK) modulation. Both techniques aresensitive to noise and interference that tend to limit the range thattransceivers are able to achieve. Now a new digital modulation technique, introduced by Semtech,

offers massively extended range between nodes: transmissions canreadily be carried as far as 10km in open space at output power levelssanctioned by regulations, for instance up to 14dBm at 868MHz. Thisincreased span between nodes means that systems that previously hadto implement a mesh network in order to achieve a range of severalkilometres can now instead implement a star network, with all theconsequent benefits of this simpler architecture. Semtech’s new modulation scheme, known as LoRa™, for ‘Long

Range’, is a completely asynchronous digital modulation scheme. Basedon the Direct Sequence Spread Spectrum (DSSS) technique, it is able tovary the length of the chipping code and the bandwidth to match the bitrate required, in a range from 300bits/s to 21kbits/s.The high performance of the LoRa technology is demonstrated in its

ability to receive signals as much as -22dB below the noise floor,coupled with adjacent channel rejection of at least 65dB with a 25kHzoffset – some 30dB more than is possible with FSK modulation. At the same time, Semtech has provided for mutual orthogonality

between signals on the same frequency but carrying data at different bitrates – a technique that avoids collisions between the two sets ofsignals, and provides for a higher aggregate bit rate over any given link.

READ THIS TO FIND OUT ABOUT

• The high cost and complexity of RF mesh networks• The range limitations that have constrained the use of the starnetwork topology

• A new digital modulation scheme that dramatically extends node-to-node range in ISM frequency bands

Fig. 1: The star (left) and mesh (right) network topologies

How to achieve multi-kilometre star network

F R E E D E V E L O P M E N T K I T S AT W W W . M Y- B O A R D C L U B . C O M22

T E C H N I C A L V I E W


Since widely-used FSK modulation technology offers higher data rates,such as 300kbits/s in the SX127x devices compared to their maximum40kbits/s in LoRa mode, the introduction of LoRa should not be seen asmarking the death of the old FSK and ASK modulation schemes. Butnevertheless, it is a very large advance in the capability of ISM-band RFtechnology, and looks set to bring about a resurgence of interest in starnetworking. No doubt system designers will also find other interesting ways to make

use of the long range offered by Semtech’s new RF technology. A mixedsolution is one possibility: a local area network in the star topology,implemented with LoRa modulation, in which the gateway node connectsto a wide area network, such as the mobile telephone infrastructure, viaa standard protocol such as WMBus, with the connection to the WANcarried over a GFSK-modulated link. In fact, the LoRa modulationscheme allows the designer to implement a proprietary network protocolas well, so the technology provides almost total freedom to design theappropriate radio network within the constraints of range and SNR.

23V I S I T T H E O N L I N E F T M M A G A Z I N E AT: W W W . M Y- F T M . C O M

range with a simple ISM-band

A number of sub-1GHz transceivers from Semtech implement the LoRamodulation scheme. All offer extremely high sensitivity, up to -148dBmat 169MHz in the case of the multi-frequency SX1276, SX1277 andSX1278, as shown in Figure 2. Peak transmit power at the antenna israted at 20dBm, giving a huge maximum link budget of 168dBm. Thecombination of a large link budget, low sensitivity to interference and lowcollision rate underlies the devices’ ability to achieve a range of severalkilometres. At the same time, the devices are low-powered enough to support

operation by battery supply. All SX127x LoRa devices, including theSX1272 and SX1273, offer an FSK modulation capability as well asLoRa modulation, to provide for backwards compatibility with legacydevices already installed in the field. They draw just 9.5mA in FSK modeand 10mA in LoRa mode, and operate across a wide voltage range of1.8V to 3.7V. Clearly, many OEMs will choose LoRa technology because it allows

the use of a star network topology, which benefits from lower BoM costthan an equivalent mesh network system. Semtech’s LoRa devices alsoenable BoM cost reduction in other respects: for instance, they operatewith a standard, low-cost quartz crystal with a tolerance of ±30ppm forthe PLL reference frequency.

Resurgence of interest in star network topologyRobust, long-range wireless networking in the unlicensed sub-1GHzwireless frequency bands is finding applications in many market sectors.With the introduction of LoRa technology from Semtech, many suchapplications can now be implemented as simple, low-cost star networksrather than more expensive, complex mesh networks. This will make theeconomics of wireless networking much more attractive in functionssuch as automatic meter reading, home automation, sensor networks,the smart grid, car park monitoring and control, security equipment andstreet lighting. The high link budget and rejection of interference makeLoRa devices suitable when long range in open space is required, butalso in environments that are hostile to RF transmissions, such asdevices inside buildings and underground or in spaces containing highlevels of RF noise.

Fig. 2: Block diagram of the SX1276/SX1277/SX1278 transceivers from Semtech

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