SL.NO:TITLE OF THE PAPERAUTHORS NAMEABSTRACT

1Manufacturing an environmentally friendly PCB using existingindustrial processes and equipment

A. Ryan, H. LewisRobotics and Computer-Integrated Manufacturing 23 (2007) 720726This paper investigates the possibility of utilising an additive screen printing process with conductive ink and adhesive together with a degradable substrate to identify whether this process offers a viable alternative to current subtractive methods of PCB manufacture.Existing manufacturing equipment and production process were adopted in order to establish the compatibility of a sustainable and environmental friendly PCB with these processes. Experimental trials have shown that by using a stainless steel stencil 150 mm thick in conjunction with an MPM Ultraprint machine with a printing speed of 89 mm/s, a squeegee pressure of 0.97 bar and a downstop of 1.9 mm successful printing of the electrically conductive adhesive was achieved. It was also shown that the substrate was compatible with electronic placement technology and convection oven. Comparisons of the electronic assemblies to an industrial IPC standard illustratedthat it is possible to develop a circuit, which is deemed acceptable under this standard. It can be concluded therefore that a screen printed conductive ink pattern, when printed on a degradable substrate can offer a viable alternative to current printed circuit boards and can be manufactured using existing technology and manufacturing processes.

2Optimisation for Surface Mount Placement Machines

1Masri Ayob , 2Peter Cowling, And 3Graham Kendall.3Automated Scheduling, Optimisation and Planning (ASAP) Research Group,

Optimisation of feeder setup and component placement sequence are very important to the efficiency of surface mount placement machines. Much works have been conducted to solve this problem. However, the technological characteristics of the placement machine influences the nature of the planning problems to be solved and the formulation of the associated models. As a result, little consensus exists as to what a suitable model should be for a given machine characteristics, and the formulations proposed by different authors tend to be difficult to compare. Hence, this paper will survey the relation between models, assembly machine technologies and heuristic methods. Keywords:Modelling, Optimisation, Electronic Assembly, Printed Circuit Board Assembly, SMT.

3Inline Component Placement Inspection:Lowering PCB Assembly Costs with Continuous Quality Improvement

Bob Kelley and John WeisgerberGSI LumonicsIn-line inspection during SMT assembly is becoming a requirement to assure the quality of todays electronic products and to reduce the manufacturers costs of scrap and rework. It is important to simultaneously meet the goals of producing a cost competitiveproduct while continuing to meet or exceed customers quality expectations. An effective way to work towards this goal is to implement Continuous QualityImprovement (CQI). Two of the basic principals in implementing CQI are to continuously improve all processes and to mobilize data and team knowledge to improve decision making. REF 1In-line inspection during SMT assembly provides the data and knowledge needed for this effort.There are three major applications for inspection during SMT assembly: solder paste inspection before component placement, component placement inspection before reflow, and post-reflow inspection, which often includes some type of solder joint checking.This article focuses on the uses of automated inspection technology for component placement before reflow. (See the Sidebar Choose the Right Place for In-LineInspection for a summary of in-line inspection applications.)In-line inspection for component placement is becoming more popular as component sizes continue to shrink, boards become smaller and more densely populated, placement rates become faster, and cycle times become shorter. Errors such as missing, misaligned, or incorrectly rotated components can cause over one-half of all defects that are found after reflow. Advantages of pre-reflow in-line inspection for component placementinclude lower rework costs, better process control, and the capability for improvement of the placement process to further reduce defect rates.Inspection cycle time is critical for in-line applications. As manufacturing cycle times become shorter, it becomes more difficult to manually check each board for proper assembly. In-line automated systems must be fast enough to do the job within the allowed cycle time. Most people are not willing to increase overall manufacturing cycle time to do inspection. Because product life cycles are getting shorter, and many differentproducts are often run on a single SMT line, short programming times and product changeover times are also important.

4Setup Optimization in High-MixSurface Mount PCB AssemblyKari Salonen

University of TurkuDepartment of Information Technology2008The thesis discusses machine setup problems which arise in high-mix, low volume production environments of printed circuit board assembly (PCB) industry. We concentrate especially on the hybrid setup problem that is a combination of the job grouping and minimum setup problems. We need an objective function that minimizes a weighted sum of the number of setup occasions and the number of feeder changeovers. The aim of this function is to model real-world production situation. With the help of the weighting parameter one can put more weight on the number of setup occasions or on feeder changes depending on the introduction planning situations. We describe the problem in an exact way by constructing an integer programming (IP) model. While there are problem instances of practical size which can be solved optimally by current software systems there are still cases where the problem solving with exact methods turns out to be inefficient and time consuming. Unfortunately, the hybrid problem is also so hard combinatorial problem that it can be solved optimally only in small problem instances even with the best exact methods. Therefore, we develop heuristics methods that help us to _nd near optimal solutions and sometimes even optimal solutions in an easy way. In our publications we present several new algorithms for the problem and compare their efficiency with other methods found in literature.Furthermore, we give a general model that can be applied to construct an efficient hybrid setup heuristic.

5OPTIMIZING PRINTED CIRCUIT BOARD ASSEMBLY DURING THE DESIGN PROCESSRonald E. Giachetti Department of Industrial and Systems Engineering Florida International University MiamiIn the file

6Virtual Prototyping of Electronics Assembly SystemsD. A. Bodner, M. Damrau, P. M. Griffin, L. F. McGinnis and A. McLaughlinKeck Virtual Factory LabSchool of Industrial & Systems EngineeringGeorgia Institute of TechnologyAtlantaElectronics assembly systems typically are capital intensive and highly automated. At the sametime, due to product sophistication and complexity, they are difficult to design, configure and reconfigure, and operate. A significant body of research has investigated problems involved in these areas, with the goals of cycle time minimization and line balancing. Equally important is the ability to experiment with different designs, configurations and control policies off-line, and to test the results of algorithms developed to minimize cycle times and balance assembly lines.This requires development of high-fidelity models of system behavior to serve as virtual prototyping environments. In this paper, we describe our work to date in developing such models for single machines and in using these models in an instructional setting to aid student understanding and learning.Keywords:Virtual prototyping, simulation, 3D animation, electronics assembly, experimental platform,system performance.

7COMPUTER MACHINE VISION INSPECTIONON PRINTED CIRCUIT BOARDS FLUX DEFECTSAmerican Journal of Engineering and Applied Sciences 6 (3): 263-273, 2013ISSN: 1941-7020The new visual inspection systems techniques using real time machine vision replace the human visualmanual inspection on PCB flux defects, which brings harmful effects on the board which may come in the form of corrosion and can cause harm to the assembly. In short, it brings improvement in Printed Circuit Boards (PCB) production quality, principally concerning the acceptance or rejection of the PCB boards. To develop new algorithm in image processing which detects flux defect at PCB board during re-flow process and achieve good accuracy of the PCB quality checking. The machine will be designed and fabricated with the total automation control system with mechanical PCB loader/unloader, pneumatic system handler with vacuum cap, vision inspection station and final classification station (accept or reject). The image processing system is based on shape (pattern) and color image analysis techniques with Matrox Imaging Library. The shape/texture of the PCB pins is analyzed by using pattern matching technique to detect the PCB flux defect area. The color analysis of the flux defect in a PCB boards are processed based on their red color pixel percentage in Red, Green and Blue (RGB) model. The red color filter band mean value of histogram is measured and compared to thevalue threshold to determine the occurring on the PCB flux defects. The system was tested with PCBboards from factory production line and achieved PCB board flux defects sorting accuracy at 86.0%based on proposed pattern matching technique combined with red color filter band histogram.Keywords: Machine Vision, Pattern Matching Technique, RGB Color Model, Red Color Filter Band,Threshold, Histogram

8THE DEVELOPMENT OF A BPN DATA MINING CALIBRATION SYSTEM IN A SMT PCB ASSEMBLY LINEWurong ShihInternational Journal of Electronic Business Management, Vol. 7, No. 4, pp. 286-296 (2009)Printed Circuit Boards (PCBs) are extensively used in diverse electronic products today. The placement process tends to be a bottleneck in a PCB assembly line, and many SMT PCB assembly researches focused on improving the process perspective of the machine operations. This research proposed a BPN data mining model to analyze the effect of a head calibration process on the defects of placement operation in a PCB assembly line. The analysis was able to generate a set of values for head calibration which reduced component placement defects caused by inappropriate calibration processes. Based on the data collected from assembly lines, this research first uses a regression analysis to predict the total defects caused by the placement heads of the machinethe process is even able to predict the defects of single Placement head. Next, the Back-Propagation Network (BPN) is used as a framework for parameter training. The development of BPN is able to predict the placement defects caused by each placement head of the machine. Furthermore, the placement head with highest defect number is selected and a further sensitivity analysis performed. Based on the results of the analysis, the individual parameter calibration of the head is performed again to reduce the expected defects and increase production efficiency. The developed model can assist engineers to perform the calibration process of placement heads in a PCB assembly line and is able to reduce defects in placement operations so as to improve productivity. Keywords: Printed Circuit Board (PCB), Surface Mount Technology (SMT), Placement Machine, Data Mining, Back Propagation Network (BPN).

9A PRINTED CIRCUIT BOARD INSPECTION SYSTEM WITH DEFECT CLASSIFICATION CAPABILITYISMAIL IBRAHIM1,SYED ABDUL RAHMAN SYED ABU BAKAR2 MUSA MOHD MOKJI3, JAMEEL ABDULLA AHMED MUKRED4 ZULKIFLI MD YUSOF5, ZUWAIRIE IBRAHIM6 KAMAL KHALIL7, MOHD SABERI MOHAMAD8

International Journal of Innovative Management, Information & Production ISME International2011 ISSN 2185-5439 Volume 3, Number 1, March 2012An automated visual printed circuit board (PCB) inspection is an approach used to counter difficulties occurred in humans manual inspection that can eliminates subjective aspects and then provides fast, quantitative, and dimensional assessments. In this study, referential approach has been implemented on template and defective PCB images to detect numerous defects on bare PCBs before etching process, since etching usually contributes most destructive defects found on PCBs. The PCB inspection system is then improved by incorporating a geometrical image registration, minimum thresholding technique and median filtering in order to solve alignment and uneven illumination problem. Finally, defect classification operation is employed in order to identify the source for six types of defects namely, missing hole, pin hole, underetch, short-circuit, mousebite, and open-circuit. Keywords: Automated Visual Inspection System; Image Subtraction; Thresholding; Image Registration; Printed Circuit Board

10Automatic PCB Inspection Algorithms: A SurveyMadhav Moganti1Fikret Ercal2, Cihan H. Dagli3In file

11Production planning problems in printed circuit board assemblyYves Crama1Joris van de Klundert2Frits C.R. Spieksma2February 24, 2000Journal title: Discrete applied mathematicsPublisher: Elsevier ScienceVolume: 123Issue/season: 1-3Pages: 339-361

This survey describes some of the main optimization problems arising in the context of productionplanning for the assembly of printed circuit boards. The discussion is structured around a hierarchical decomposition of the planning process into distinct optimization subproblems, addressing issues such as the assignment of board types to machine groups, the allocation ofcomponent feeders to individual machines, the determination of optimal production sequences,etc. The paper reviews the literature on this topic with an emphasis on the most recent developments,on the fundamental structure of the mathematical models and on the relation between these models and some `environmental' variables such as the layout of the shop or the product mix.Keywords: production planning, scheduling, sequencing, printed circuit boards, integer programmingModels.

12A Review on Printed Circuit Boards Waste Recycling Technologies and Reuse of Recovered Nonmetallic MaterialsA Review on Printed Circuit Boards Waste Recycling Technologies and Reuse of Recovered Nonmetallic MaterialsInternational Journal of Scientific & Engineering Research, Volume 3, Issue 2, February-2012 1

From the use of renewable resources and environmental protection viewpoints, recycling of waste printed circuit boards (PCBs) receives wide concerns as the amounts of scrap PCBs increases dramatically In recent years there has been increasing concern about the growing volume of end of life electronics and the fact that much of it is consigned to landfill without any attempt being made to recycle the nonmetallic materials it contains. The production of electric and electronic equipment (EEE) is growing rapidly in most developed countries. Waste of electric and electronic equipment (WEEE) is significantly increasing. A large amount of nonmetallic materials in printed circuit board (PCBs) are disposed of by combustion and disposal in landfill as the main method for treating nonmetals in PCBs, but it may cause secondary pollution and resource wasting. Therefore, it is urgent to develop a proper recycling technology for waste PCBs. Several recycling technologies and potential reuses of recovered nonmetallic PCBs were reviewed in this paper. From the review, it can be said that, PCBs recycling process usually includes three process which is pretreatment, physical recycling, and chemical recycling and the recovered nonmetals w ere used to make models, construction materials and composite boards. The PCB nonmetal products have better mechanical characteristics and durability than traditional materials and fillers. Products derived from PCB waste processing have been brought into industrial production. The study shows that PCB nonmetals can be reused in profitable and environmentally friendly ways. Keywords printed circuit board, nonmetallic, recovery, precious metals, recycling technology

13Optimizing the Operations of Chip Shooter MachinesEkrem DUMAN Ali Fuat ALKAYAHseyin DEMiRKALE Artificial bee colony (ABC) algorithm is recently proposed algorithm that is inspired from the foraging behavior of honey bees in nature. ABC has been applied to the continuous numerical problems. In this study, we present ABC algorithm to chip shooter machines which are used for printed circuit board(PCB) assembly, proposed new methodologies and compared it with Simulated Annealing(SA). Experimental results comparing the proposed ABC and SA are presented. Keywords, Artificial bee colony, Simulated annealing, Chip Shooter Machines.

14Optimization of Printed Circuit board design assembly based on DPMO metricsR. Soukup 11Katedra technologi a men, Fakulta elektrotechnick, ZU v Plzni,Univerzitn 26, PlzeElectroscope. 2010The paper deals with optimization of printed circuit board assembly (PCBA) design based on defects per million opportunities (DPMO) metric. Due to DPMO data predictions for a given new PCBA design is possible to optimize its layout in terms of yield and quality even before the PCBA pilot production. The DPMO data areobtained from the below presented yield-DPMO model. The model is based on a combination of elements from DPMO calculation according to the IPC 7912 standard and two most used yield prediction methodologies, namely: process yield and board design yield. The model provides not only DPMO data, but also assembly process yield prediction that can assist the manufacturers in determining reliable estimates of productioncapabilities.

15Product Assembly Sequence Optimization Based on Genetic Algorithm.

Azman Yasin1, Nurnasran Puteh2Ruslizam Daud3Mazni Omar4, Sharifah Lailee Syed-Abdullah--Azman Yasin et al. / (IJCSE) International Journal on Computer Science and Engineering Vol. 02, No. 09, 2010, 3065-3070Genetic algorithm (GA) is a search technique used in computing to find approximate solution to optimization and search problem based on the theory of natural selection. This study investigates the application of GA in optimizing product assembly sequences. The objective is to minimize the time taken for the parts to be assembled into a unit product. A single objective GA is used to obtain the optimal assembly sequence, exhibiting the minimum time taken. The assembly experiment is done using a case study product and results were compared with manual assembly sequences using the Design for Assembly (DFA) method. The results indicate that GA can be used to obtain a near optimal solution for minimizing the process time in sequence assembly. This shows that GA can be applied as a tool for assembly sequence planning that can be implemented at the design process to obtain faster result than the traditional methods. Keywords: Genetic Algorithm; Product Sequence Assembly; Design for Assembly; Artificial Intelligence

16Guidelines for the deployment and implementation of manufacturing scheduling systems

Jose M. Framinan1, Rubn Ruiz2

March 26, 2010International Journal of Production , 2012 - Taylor & FrancisIt has frequently been stated that there exists a gap between production scheduling theory and practice. In order to put theoretical findings into practice, advances in scheduling models and solution procedures should be embedded into a piece of software a scheduling system in companies. This results in a process that entails (1) determining its functional features, and (2) adopting a successful strategy for its development and deployment. In this paper we address the latter question and review the related literature in order to identify descriptions and recommendations of the main aspects to be taken into account when developing such systems. These issues are then discussed and classified, resulting in a set of guidelines that can help practitioners during the process of developing and deploying a scheduling system.

17Scheduling Component Placement Operations for Collect-and-Place Type PCB Assembly Machines

Journal: International Journal of Production Research

23-Apr-2006

Guenther, Hans-Otto; TU Berlin, Production Management Yimaz, Ihsan; TU Berlin, Production Management Kulak, Osman; Pamukkale University, Dept. of Industrial Engineering Keywords: GENETIC ALGORITHMS, ELECTRONICS ASSEMBLY.Component placement is one of the most time-consuming operations in printed circuit board (PCB) assembly and dominates the cycle time of any PCB assembly line. In our study, we focus on collect-and-place machines which first collect a number of electronic components from the component magazine and then place them one-by-one onto the PCB. With this type of machinery two problems arise, i.e. generating placement tours and determining the placement sequence within each tour. The objective is to minimise the assembly cycle time per board. Numerical experiments show that high-quality solutions are obtained within very short CPU time.

18Minimizing total tardiness of orders with re-entrant lots in a hybrid flowshop

SW Choi, YD Kim*, GC Lee - International Journal of Production , 2005 - Taylor & FrancisThis study focuses on a hybrid flowshop scheduling problem, in which there are serial stages, each with identical parallel machines. In the hybrid flowshop, each order is composed of multiple lots with the same due date, and each lot can be processed on any one of parallel machines at each stage. In addition, there are reentrant flows since lots of certain orders have to visit the stages twice. Heuristic algorithms are suggested for the scheduling problem with the objective of minimizing total tardiness of a given set of orders. In these algorithms, the list-scheduling method is employed, and lots are scheduled with priorities determined with a construction method. Computational experiments are performed on randomly generated test problems. Results show that the suggested algorithms perform better than well-known dispatching rules for various scheduling problems and an algorithm that is used in a real system.

19Methodology To Develop Heuristic For Re-Entrant Flow Shop With TwoPotential Dominant Machines Using Bottleneck ApproachSalleh Ahmad Bareduan & Sulaiman HasanInternational Journal of Combinatorial Optimization Problems and Informatics, Vol. 3, No. 3, Sep-Dec2012, pp. 81-93. ISSN: 2007-1558Component placement is one of the most time-consuming operations in printed circuit board (PCB) assembly and dominates the cycle time of any PCB assembly line. In our study, we focus on collect-and-place machines which first collect a number of electronic components from the component magazine and then place them one-by-one onto the PCB. With this type of machinery two problems arise, i.e. generating placement tours and determining the placement sequence within each tour. The objective is to minimise the assembly cycle time per board. Numerical experiments show that high-quality solutions are obtained within very short CPU time.

20DEVELOPMENT OF MULTI-OBJECTIVE GENETIC ALGORITHMS FORSCHEDULINGPei-Chann Chang *, Jih-Chang Hsieh ** and Yen-Wen Wang * Proceedings of the Fifth Asia Pacific Industrial Engineering and Management Systems Conference 2004Scheduling in the drilling operation of the printed circuit board industry deeply annoys theproduction management staff on the shop floor due to its high complexity of permutations orcombination of jobs, machines, and resource constraints. In this research, two multi-objectivegenetic algorithms are proposed to deal with such a complicated real-world case. Real-worldinstances are applied as well to evaluate the proposed algorithms. The result indicates thatboth VMOGA and AMOGA are effective.Keywords: Multi-Objective Genetic Algorithm, Scheduling, Printed Circuit Board

21A particle swarm optimization approach for components placement inspection on printed circuit boards

CH Wu, DZ Wang, A Ip, DW Wang, CY Chan - IntelligentManufacturing, Journal of Intelligent ManufacturingOctober 2009,Volume 20,Issue 5,pp 535-549 - Springer

The importance of the inspection has been magnified by the requirements of the modern manufacturing environment. In electronics mass-production manufacturing facilities, especially in the printed circuit board (PCB) industry, 100% quality assurance of all work-in-process and finished goods is required in order to reduce the scrap costs and re-work rate. One of the challenges for PCB inspection is in the use of a surface mount device (SMD) placement check. Missing, misaligned or wrongly rotated components are the critical causes of defects. To prevent the PCB from having these defects, inspection must be done before the solder reflow process commences, otherwise, everything will be too late. The research reported in this paper concentrates on automatic object searching techniques, in a grey-scale captured image, for locating multiple components on a PCB. The presented approach includes the normalized cross correlation (NCC) based multi-template matching (MTM) method. The searching process has been carried out by using the proposed accelerated species based particle swarm optimization (ASPSO) method and the genetic algorithm (GA) approach as a reference. The experimental results of the ASPSO-based MTM approaches are reported.

22Grouping components in printed circuit board assembly with limitedcomponent staging capacity and single card setup: problemcharacteristics and solution proceduresM. S. DASKIN , O. MAIMON , A. SHTUB and D. BRAHA*int. j. prod. res., 1997, vol. 35, no. 6, 16171638

New England Complex Systems InstituteThe problem of grouping Printed Circuit Board (PCB) components to minimizethe total component and PCB loading cost subject to a capacity constraint on thenumber of types of components per group is formulated as an integer linearprogramming problem. The problem is shown to be NP-complete.Characteristics of the solution are outlined and a heuristic algorithm isdiscussed. For the case in which it is optimal to load each PCB exactly once,the solution characteristics can be used to obtain a lower bound on the objectivefunction for any set of constraints on pairs of PCBs that must be produced usingthe same group of components. The bounds and the heuristic procedure are usedto develop a branch and bound algorithm. Computational results are given forfour test problems derived from industrial contexts.

23Simulation-based performance analysis and optimizationof electronics assembly equipment

J. vanara and Z. Krlov Institute of Control and Industrial Informatics, Faculty of ElJune 9 12, 2009In file

24 A Flexible Simulation Tool for Manufacturing Cell Design, II:Response Surface Analysis and Case StudyMARIA DE LOS A. IRIZARRY1 JAMES R. WILSON2 JAIME TREVINO3January 2000)In file

25THE HYBRID HEURISTIC SYSTEM IN BALANCING THE PCB ASSEMBLY LINE OF SURFACE MOUNT TECHNOLOGY WITH MULTIPLE PLACEMENT MACHINESWurong ShihInternational Journal of Electronic Business Management, Vol. 7, No. 1, pp. 37-44 (2009)Printed circuit boards (PCBs) are extensively used in diverse electronic products today. The placement process is generally the bottleneck in a PCB assembly line. Many researchers have indicated that an optimal component placement sequence reduces the cycle time of an assembly line with single placement machines. However, in current PCB assembly lines, more than one placement machine, including Pick-and-Place and Chip Shooter machines, are concurrently used. Therefore, in the PCB assembly lines with multiple placement machines, the improvement of a single placement machine is no longer an issue in increasing throughput rate. The line balancing tasks within machines has a greater impact on the throughput rate. This research uses a hybrid heuristic approach in designing a prototype system to implement line balancing tasks within the multiple placement machines of a PCB assembly line. First a minimum spanning tree algorithm is introduced to solve the problem in allocating components to various feeder slots. Then, by incorporating with the initial results of this step, a mathematical model is developed to solve the line balancing problem faced in the assembly line. The developed line balancing model uses the combination of formulations and experts reasoning knowledge to rearrange the component groups which are placed by the placement machines. The proposed system model is used to construct a prototype system that assists the process planners to reduce the cycle time of the assembly line so as to increase the throughput rate. Keywords: Surface Mount Technology, PCB Assembly, Line Balancing, Genetic Algorithm

26A Research on the Mixed-Line Production Scheduling Problem of a Flow-shop System Hsiang-Hsi Huang1*, Peihua Sung2, Chianying Huang,3 Cheng-hsun Li4This paper is to establish and solve the re-scheduling problems under a flow-shop mixed-line production planning. A case study of the final stage, module manufacturing, of TFT-LCD is provided for illustration of the developed mechanism. In this research, the mixed-line production system and its rescheduling problems are discussed. The buffer management and the DBR scheduling methods based on the Theory of Constraints are used to detect, identify, and level the bottleneck problems in the system. The direct contribution of the results is to increase the production flexibility and mobility of the manufacturing scheduling system and to benefit the entire members of supply chain system. The simulation software, Flexsim, is used to construct and evaluate the developed model, some phenomena of simulated system performance on the maximum delay of orders, the total cost of delay, and make span are discussed. Keywords: bottleneck, DBR, mixed-line production, re-scheduling.