13th International Workshop on

Advanced Infrared

Technology & Applications

PROCEEDINGS

September 29- October 2, 2015

Area della Ricerca CNR

Pisa, Italy

ISBN: 978-88-7958-025-0

Fondazione “Giorgio Ronchi”, Firenze

CNR-ITC, Sez. di Padova

CNR-IFAC “Nello Carrara”, Firenze

CNR-ISTI “Alessandro Faedo”, Pisa

13th International Workshop on

Advanced Infrared

Technology & Applications

PROCEEDINGS

Edited by: Laura Ronchi, Paolo Bison, Mario D’Acunto, Davide Moroni, Valentina

Raimondi, Ovidio Salvetti, Xavier Maldague, Antoni Rogalski, Takahide Sakagami,

Marija Strojnik

General Chair

L. Ronchi Abbozzo

Co-Chairs

P. Bison, CNR-ITC, Padova, Italy

M. D’Acunto, CNR-ISM, Rome, Italy

X. Maldague, Laval University, Quebec, Canada

D. Moroni, CNR-ISTI, Pisa, Italy

V. Raimondi, CNR-IFAC, Firenze, Italy

A. Rogalski, Military University of Technology, Warsaw, Poland

T. Sakagami, Osaka University, Osaka, Japan

M. Strojnik, CIO, Leon Gto, Mexico

Scientific Committee

D. Balageas, ONERA, France

C. Corsi, CREO, Italy

E. Dereniak, Univ. of Arizona, USA

C.T. Elliott, Heriot-Watt Univ., Scotland.

C. Maierhofer, BAM, Germany

C. Meola, Univ. of Naples, Italy

G. Paez, CIO, Mexico

I. Pippi, CNR-IFAC, Italy

H. Rutt, Southampton University, UK

O. Salvetti, CNR-ISTI, Italy

J.L. Tissot, ULIS, Veurey Voroize, France

V.P. Vavilov, Tomsk University, Tomsk, Russia

H. Zogg, ETH, Zurich, Switzerland

Organizing &Technical Secretariat

F. Pardini, CNR-ISTI, Italy

A.M. Meriggi, Fondazione “Giorgio Ronchi”, Firenze, Italy

E. Ricciardi, C.O.C.E.S., Italy

M. Tampucci, CNR-ISTI, Italy

M. Volinia, Politecnico di Torino, Italy

V

Table of Contents

Session: Systems and applications in near-, mid- and far-infrared - Part I

C. Corsi Infrared sensors' history in Italy

2

Yingjie Ma, Yonggang Zhang, Yi Gu, Xingyou Chen, Li Zhou, Suping Xi, Hsby Li and Aizhen Li Control the operating voltage and gain slope of InAlAs/InGaAs avalanche

photodetectors

3

Songmin Zhou, Bin Weng and Chun Lin

The PN junction width of HgCdTe conversed through ion implantation and ion beam

etching

6

Session: Systems and applications in near-, mid- and far-infrared - Part II

Michal Švantner, Zdeněk Veselý and Lukáš Muzika

Depth limits of flash-pulse IRNDT method for low- and high-diffusivity materials

11

A. G. Unil Perera, Yan-Feng Lao, L. H. Li, S. P. Khanna and E. H. Linfield

Tunable hot-carrier photodectectors

16

Zhizhong Bai, Chen J., Xu Zh., Zhou Y., Xu G. and Zhu H. Investigation of High Quantum Efficiency Resonant Cavity Enhanced InAs/GaSb type II

Superlattice Long Wavelength Infrared Detectors

20

Session: Aerospace and industrial applications

Louis-Daniel Théroux, Jean Dumoulin and Erick Merliot Automatic installation of thermoplastic CFRP monitored by infrared thermography for

pipelines

24

Eric Johnson and Yong Kim

Thermographic Testing of Microwave Circulator Adhesive Bonds

28

Donatella Guzzi, Cinzia Lastri, Vanni Nardino, Lorenzo Palombi, Ivan Pippi, Valentina Raimondi and Alessandro Barducci Compressive sensing and its potential for infrared applications

32

Daiki Shiozawa, Tsuyoshi Inagawa, Atsushi Akai and Takahide Sakagami (invited

lecture)

Accuracy improvement of dissipated energy measurement and fatigue limit estimation by

using phase information

36

VI

Session: Environmental monitoring - Part I

Veronica Redaelli, Gaia Dominique Bariffi, Silvia Mazzola, Raffaella Rossi, Leonardo Nanni Costa and Fabio Luzi Infrared termography (IRT) in horses trained for endurance races

41

Alessandro Bortolin, Paolo Bison, Gianluca Cadelano, Giovanni Ferrarini, Lei Lei and Xavier Maldague

Mapping the heat flux of an insulated small container by infrared thermography

45

Susana Lagüela, Natalia Caparrini and Luján López

Evaluation of infrared thermography as standalone technique for detection of sediment-

pollution in water

49

Francesco Salamone, Ludovico Danza, Italo Meroni and Maria Cristina Pollastro

Design and optimization through thermography: nEMoS architecture

53

Matteo Ghellere, Alice Bellazzi, Lorenzo Belussi and Italo Meroni Urban monitoring from infrared satellite images

59

Session: Environmental monitoring - Part II

M. Miguel Valero, Oriol Rios, Elsa Pastor and Eulàlia Planas

Automatic detection of wildfire active fronts from aerial thermal infrared images

63

Fabio Sansivero and Giuseppe Vilardo

Advances in automated processing of thermal infrared images from Osservatorio

Vesuviano TIR permanent surveillance network at Campi Flegrei (Pozzuoli, Italy)

68

Atsushi Hashimoto, Ken-Ichiro Suehara and Takaharu Kameoka

Applications of infrared spectroscopic techniques to quality evaluation in agriculture

and food process

72

Barbara Bukowska-Belniak, Andrzej Leśniak and Daniel Kessler

Thermographical monitoring of leak processes in embankments

76

Rebecca Whetton, Toby Waine and Abdul Mouazen

A practical approach to In-situ hyperspectral imaging of wheat crop canopies

79

Marc-André Gagnon, Pierre Tremblay, Simon Savary, Marc Duval, Vincent Farley, Philippe Lagueux, Éric Guyot and Martin Chamberland

Airborne thermal infrared hyperspectral imaging for mineral mapping

83

Session: Advanced technology and materials - Part I

Małgorzata Kopytko and Antoni Rogalski (invited lecture)

HgCdTe barrier infrared detectors

87

Yoshifumi Ohbuchi, Nobuaki Nagatomo and Hidetoshi Sakamoto

Thermal image analysis of plastic deformation and fracture beaviors by thermo-video system

91

Hai Zhang, Wolfgang Holub, Ulf Hassler and Xavier Maldague

Micro-laser Line Thermography and High Resolution X-ray Tomography on Micro-porosities: A

Comparative Study of Experiments and Simulation

95

VII

Jianxin Chen, Zhicheng Xu, Yi Zhou, Fangfang Wang, Jiajia Xu and Li He

LWIR InAs/GaSb Superlattice Photodiodes with Different Barrier Structures

99

Session: Biomedical applications - Part I

Mario D'Acunto, Antonio Cricenti, Marco Luce, Davide Moroni and Ovidio Salvetti

NIR window and Near-Field detection of gold nanoshells

103

Steffen Frahm, Carsten Dahl Mørch, Ole Kæseler Andersen and Lars Arendt-Nielsen

Temperature controlled laser stimulator for pain research

107

Marco Gargano, Nicola Ludwig, Athos Trecroci, Damiano Formenti, Andrea Bosio,

Ermanno Rampinini and Giampietro Alberti

Skin temperature dynamics during an incremental maximal test in elite male cyclists

111

Session: Advanced technology and materials - Part II

Alessandro Tredicucci (invited lecture)

Graphene-based devices for Terahertz photonics

114

Elżbieta A Pieczyska, Maria Staszczak, Michał Maj, Katarzyna Kowalczyk-Gajewska,

Dominik Kukla, Hisaaki Tobushi and Shunichi Hayashi

Infrared thermography analysis of thermomechanical shape memory polymer behavior – initial

loading stage

115

A. Amato, A.S. Aricò, M. Lo Faro, R. Montanini, S.A. Piccolo, A. Quattrocchi, G. Squadrito,

S. Trocino and S.C. Zignani

Infrared thermography applied to solid oxide fuel cells at operating temperatures

119

Mustafa Hostut, Yuksel Ergun, Sezai Elagoz, Abidin Kilic, Tunay Tansel and Atilla Aydinli

Electrical Performance of N-Structure T2SL Photodetectors

123

Antonio Cricenti and Marco Luce

Infrared scanning near-field optical microscopy in material science and biology

127

Pawel Madejczyk, Waldemar Gawron, Piotr Martyniuk, Artur Keblowski, Wioletta Pusz,

Jaroslaw Pawluczyk, Malgorzata Kopytko, Antoni Rogalski and Jozef Piotrowski

The focus on engineering steps for high temperature HgCdTe photodiodes optimization.

129

Session: Biomedical applications - Part II

Chi-En Lee and Chung-Ming Chen

The automated marker-free longitudinal IR breast image registration algorithm

133

Cuc Stanca, Prodan Doina, Sarosi Codruta, Saplontai Aniela, Silaghi-Dumitrescu Laura,

Prejmerean Vasile and Moldovan Marioara

Degradation of some experimental dental composite materials

138

Mihaela Streza, Dorin Dadarlat, Doina Prodan, Ioana Hodisan, Cristina Prejmerean and

Stanca Boboia

Adhesion studies of dental sealants to enamel by using optical microscopy and lock-in infrared

thermography

142

VIII

Cristina Prejmerean, Doina Prodan, Mihaela Vlassa, Tinca Buruiana, Loredana Colceriu

and Marioara Moldovan

Influence of composition and light curing modes upon the degree of conversion of dental giomers

evaluated by FTIR spectroscopy

147

Bardia Yousefi, Julien Fleuret, Seyed Alireza Ghaffari, Simon Fréchet, Félix Labrie

Larrivée, Marcelo Sung Ma Jo, Xavier Maldague and Raymon Watts

Unsupervised Automatic tracking of Thermal changes in Human Body

152

Session: Advanced technology and materials - Part III

Marija Strojnik and Gonzalo Paez (invited lecture)

Propagation of thermal pulse in tissue

157

Rosa De Finis, Davide Palumbo, Francesco Ancona and Umberto Galietti

New thermal method to assess endurance limit of stainless steels

162

Changzhi Shi, Chun Lin, Yanfeng Wei, Lu Chen, Mingxing Zhu and Quanzhi Sun

Barrier Layer Induced Channeling Effect of As Ion-implantation in HgCdTe and Its Influences on

Electrical Properties of p-n Junctions

167

Konstantin Petrosyants and Igor Kharitonov

Analysis of temperature-current rise in modern pcb traces by means of thermography

171

Valeri Kotelnikov and Elena Ryazanova

Method of 3d solar energy conversion

175

Changzhi Shi, Chun Lin, Yanfeng Wei, Lu Chen, Mingxing Zhu and Quanzhi Sun

Influences of Ion Beam Current on Dopant Profiles and Barrier Layer Induced Channeling Effect

in Arsenic Implanted HgCdTe Epilayer

179

Session: Biomedical applications - Part III

Trabelsi Hedi, Elkadri Noomene and Sediki Ezeddine

Detection of abnormalities under skin tissue by thermography

183

Maryam Asrar and Amin Al-Habaibeh

A comparison between Visual, Near-infrared and Infrared Images for the Detection of Veins

186

Renée Lampe, Blumenstein Tobias, Varvara Turova and Ana Alves Pinto

Sensomotor waistcoat – a helpful tool for blind people and children with cerebral palsy to support

space perception and improve body scheme

190

Slokom Nesrine, Zghal Imen and Trabelsi Hedi

Detection and Quantification of Macular Edema from Optical Coherence Tomography Images

194

Bushra Jalil, Ovidio Salvetti, Valentina Hartwig , L. Potì and A. L’Abbate

Infrared imaging to study hand skin microcirculation in healthy and systemic sclerosis volunteer

201

Session: Image processing and data analysis - Part I

Simone Boccardi, Carosena Meola and Giovanni Maria Carlomagno

Measurements with a QWIP infrared camera: signal treatment and noise correction

206

IX

Piotr Hellstein and Mariusz Szwedo

IR3D Analysis - three-dimensional imaging in active thermography and non-destructive testing

210

Gerhard Traxler and Amirreza Baghbanpourasl

Monitoring of the cross wedge rolling process by thermographY

214

Olivier Janssens, Lothar Verledens, Raiko Schulz, Veerle Ongenae, Kurt Stockman, Mia

Loccufier, Rik Van de Walle and Sofie Van Hoecke

Infrared and Vibration Based Bearing Fault Detection Using Neural Networks

220

Session: Non destructive test and evaluation - Part I

Kwang-Hee Im, Je-Woung Park, In-Young Yang, Jeong-An Jung, David K. Hsu and Sun-

Kyu Kim

Characterization of terahertz penetration and applications for composite materials

224

Takahide Sakagami, Daiki Shiozawa, Yoshitaka Tamaki, Hiroki Ito, Akihisa Moriguchi,

Tatsuya Iwama, Kazuyoshi Sekine and Teruya Shiomi

Nondestructive detection of corrosion damage under corrosion protection coating using infrared

thermography and terahertz imaging

229

Henrique Fernandes, Clemente Ibarra-Castanedo and Xavier Maldague

Carbon fiber composites inspection and defect characterization using active infrared

thermography

234

Eva Barreira, Elton Bauer, Niubis Mustelier and Vasco P. Freitas

Measurement of materials emissivity – Influence of the procedure

242

Session: Non destructive test and evaluation - Part II

Fariba Khodayar, Saeed Sojasi and Xavier Maldague

Infrared Thermography and NDT: 2050 Horizon

246

Rachael Tighe, Janice Dulieu-Barton and Simon Quinn

Stress based NDE using infrared thermography

247

Hirotaka Tanabe, Yui Izumi, Takayuki Hibino, Tohru Takamatsu and Takahide Sakagami

Study on heat generation behaviors in Sonic-IR method

251

Giovanni Ferrarini, Alessandro Bortolin, Gianluca Cadelano and Paolo Bison

Thermal response measurement of building insulating materials by infrared thermography

255

Session: Systems and applications for the cultural heritage - Part I

Stefano Sfarra, Paolo Bison, Alessandro Bortolin, Gianluca Cadelano, Giovanni Ferrarini,

Domenica Paoletti, Clemente Ibarra-Castanedo, Xavier Maldague and Fabio Peron

Solar loading thermography for architectural heritage surveys: plumb the depth by looking at the

façade

259

Iole Nardi, Stefano Sfarra, Dario Ambrosini, Donatella Dominici and Elisa Rosciano

Complementarity of terrestrial laser scanning and IR thermography for the diagnosis of cultural

heritage: the case of Pacentro castle

263

X

Fabrizio Clarelli, Gabriele Inglese and Paolo Bison

Thermography for depth profiling in cultural heritage

267

Session: Non destructive test and evaluation - Part III

Paul Toasa and Thomas Ummenhofer

Lock-in thermography applied to real time crack detection in constructional steelwork

270

Yui Izumi, Hirotaka Tanabe, Takayuki Hibino, Tohru Takamatsu and Takahide Sakagami

Development of new sonic-ir method using ultrasonic wave inputted through water

275

Patrizia Aversa, Umberto Galietti, Vincenza Luprano, Davide Palumbo, Cristina Racioppo

and Rosanna Tamborrino

Comparison between thermographic and heat flux meter technique: a case study

279

Mohamed El Afi and Sougrati Belattar Infrared thermography applied to characterization of a pipe internally and externally corroded

283

Waldemar Swiderski

Detecting Defects in Marine Structures by Using Eddy Current Infrared Thermography

288

Sofie Van Hoecke, Olivier Janssens, Raiko Schulz, Kurt Stockman, Mia Loccufier and Rik

Van de Walle

Towards thermal imaging based condition monitoring in offshore wind turbines

291

Session: Systems and applications for the cultural heritage - Part II

Stefano Sfarra, Eleni Cheilakou, Panagiotis Theodorakeas, Domenica Paoletti and Maria

Koui

An eye to the future, an eye to the past, thinking to a full-scale restoration process: physical and

chemical ndt analysis in cooperation

296

Anna De Falco, Tiziana Santini and Maurizio Sguazzino

Applications of the infrared thermography to the assessment of historic buildings: a case study in

Pisa

300

Marco Gargano, Nicola Ludwig and Elisabetta Rosina

Non destructive characterization of thermal and optical properties on high performances textiles

304

Francesca Pietrarca, Mauro Mameli, Sauro Filippeschi and Fabio Fantozzi

Non intrusive wall material recognition through active thermography and numerical modeling

308

Lorenzo Palombi, Monica Galeotti, Emanuela Massa, Roberto Olmi, Marcello Picollo,

Alessia Andreotti, Giovanni Bartolozzi, Marco Bini, Ilaria Bonaduce, Emma Cantisani,

Massimo Chimenti, Maria Perla Colombini, Costanza Cucci, Ute Dercks, Laura Fenelli,

Irene Malesci, Alessandra Malquori, Marco Montanelli, Annalisa Morelli, Sara Penoni,

Louis David Pierelli, Cristiano Riminesi, Sara Rutigliano, Barbara Sacchi, Sergio Stella,

Gabriella Tonini and Valentina Raimondi

The use of IR-based techniques in the PRIMARTE project: an integrated approach to the

diagnostics of the cultural heritage

313

XI

Session: Astronomy and Earth observation

Roberto Bonsignori (invited lecture)

Satellite remote sensing of Earth thermal emission for weather, climate and ocean operational

applications

317

Marija Strojnik and Gonzalo Paez

Telescope array for extra-solar planet detection from far side of Moon

318

Anum R. Barki, Kory J. Priestley and J. Robert Mahan

An Initiative to Include Coherence and Polarization in Earth Scene Identification

322

Graham Ferrier

The Potential and Challenges in the use of field-based Fourier Transform InfraRed Spectroscopy

for geological applications

326

Session: Image processing and data analysis - Part II

Jonathan Gaspar, Michael Houry and Jean-Laurent Gardarein

Wide & accurate thermal control of plasma facing component in fusion facility

330

Qiong Zhang, Frank Ferrie and Xavier Maldague

A NSCT-based infrared-visible image fusion approach using fast iterativeshrinking compressed

sensing

334

Gian Marco Revel, Paolo Chiariotti, Edoardo Copertaro and Giuseppe Pandarese

Stationary Wavelet Transform denoising in Pulsed Thermography: influence of camera resolution

on defect detection

340

Session: Non destructive test and evaluation - Part IV

Paolo Bison, Alessandro Bortolin, Gianluca Cadelano, Giovanni Ferrarini, Lorenzo Finesso

and Ravibabu Mulaveesala

Frequency modulated heating source in IR thermography

344

Nobuhiro Shimoi and Carlos Cuadra

Comparison of natural frequencies of vibration for a bridge obtained from measurements with

accelerometers and piezoelectric sensor

346

Session: Image processing and data analysis - Part III

Gabriele Inglese

Perturbations of the heat transfer coefficient due to surface damages

350

Nebi Gül and Ali Berkol

Improvement of predefined electooptical system performance by a mathematical model for image

intensifier tube

354

Kai He, X. Wang, Chun Lin, Qinyao Zhang and Ruijun Ding

Numerical method for the capacitance of HgCdTe MIS structure and band-to-band tunneling

effect on the low frequency behavior in high frequency C-V characteristics

358

Author Index 363

171

ANALYSIS OF TEMPERATURE-CURRENT RISE IN MODERN PCB TRACES BY MEANS OF THERMOGRAPHY

K. Petrosyants1,2, I. Kharitonov1, A.A. Popov1

1 Moscow Institute of Electronics and Mathematics of National Research University

“Higher School of Economics”, eande@miem.edu.ru 2 Institute for Design Problems in Microelectronics, Russian Academy of Sciences

Higher functionality of today’s electronic products demands high density integration of

electronic components. In this field, printed-circuit-board (PCB) are the perspective

technology to build a variety of electronic systems for different applications. Two types of

boards were investigated: high current for power applications and high density boards for

modern electronic equipment. The set of IR images and temperature-current diagrams for

different substrate materials were investigated. Current and temperature limits for all test

boards were defined to provide high level of board reliability.

Introduction

The global trend in the electronic industry

driven by automotive, aerospace, computer,

telecommunication, hand held equipment and

other products is showing up in improved

performance and better human interface. So the

electronic equipment is demanding

miniaturization and function integration. In this

field, printed-circuit-board (PCB) embedding

technology has the potential to play the

important role with the possibility to build a

variety of electronic modules and systems for

different applications. However,

miniaturization and function integration

increase the equipment power density and as a

result - increase the operating temperatures of

electronic components and current caring

traces. These factors decrease the reliability and

life time of electronic equipment. So the very

important problem of PCB design is the thermal

analysis to provide the optimal technology

solution.

The thermal effects in active and passive

electronic components were completely

investigated and analyzed [1,2]. But the

physical and technological limitations in

modern PCB copper traces in the context of

their thermal stability are still under

consideration. A few works where

thermographic technique was used for control

and monitoring of PCB systems were published

[3,4]. The purpose of this work was investigation

and analysis of modern PCB current currying

capacity of traces (CCCT) in dependence of

board materials and trace sizes (thickness, width,

length) to provide high levels of electro-thermal

stability and operating reliability of electronic

systems realized on new boards.

Test boards for thermographic analysis of temperature-current rise in traces

Two types of test boards [5,6] have been

fabricated and investigated:

1) Test board for high current application (power

supply units, electromechanical, automotive and

other power equipment). The boards (Fig. 1) were

manufactured using FR-4 substrate (of 1.5mm

thickness) with dimensions 100x200 mm2. The

board was manufactured in two versions: with

nominal copper layer thicknesses of 18 and 35 μm

and traces with the different shapes, widths and

lengths.

2) High density boards for modern equipment

(Fig. 2). The boards were manufactured using

perspective substrates: Al2O3 ceramic substrate

(of 500 μm thickness) and aluminium/polymide

(240 μm / 4,0 μm) substrate with dimensions

60x48 mm2. Trace parameters: material Ti-Cu-

Ni-Au (0,05-2-0.3-0.2 μm), length L = 1,5 – 28

mm, widths W = 150 - 530 μm.

172

Thermographic analysis of temperature-current rise in test PCB traces

Thermographic analysis of temperature-current

rise in PCB traces was conducted using Flir

A40 IR camera with macro (17 μm resolution)

lens, precise micro positioning system and

specially developed software tool (IRDataProc)

for object emissivity coefficients map

generation and object temperatures correction

[7,8].

Thermal images of all conducting traces of test

boards were investigated in dependence of

electric current. Maximal temperatures of the

traces were defined and plotted as a function of

electric current.

Results for high current test board.

The measured I-T characteristics and IR images

of traces with different shapes, widths and

lengths (see Fig. 1) and Cu layer thickness of 18

and 35 μm values are presented in Fig. 3 – Fig.

4 .

It is seen from Fig. 4 that (for the same current

values) trace “G“ has much more higher

temperature values in comparison with the

other traces.

Results for high density test boards (Fig.2).

The measured I-T characteristics and IR images

are presented for different trace widths (Fig. 5),

ceramic and aluminium/polymide substrates

(Fig. 6), trace lengths (Fig. 7).

It is seen from Fig. 6 that ceramic substrate

provides much more better heat removing for

traces in comparison with aluminium/

polyimide substrate.

Analyzing the temperature measurement results

for traces with different lengths in Fig. 7 it is

seen that the maximal length 27.5 mm is limited

by the temperature value of 122.4oC.

Conclusion

Temperature- current characteristics of PCB

conducting traces were measured and analyzed

by means of thermography techniques for two

types of boards: high current for power

applications and high density for modern

electronic equipment.

- Current and temperature limits for traces with

different layer thickness, substrate materials,

trace widths and lengths were defined based on

board reliability.

- The results allowed to provide

recommendations on design of reliable boards for

modern electronic equipment. These results were

used by PCB designers in their projects.

This work was carried out within the

framework of the National Research University

Higher School of Economics’ Academic Fund

Program under grant 15-01-0165 and the Russian

Foundation for Basic Research under grant 14-

29-09145.

References

1. D. Wolpert, P. Ampadu. Managing temperature effects

in nanoscale adaptive systems, Springer

Science+Business Media ,2012.

2. A. D. Kraus, A. Bar-Cohen. Thermal Analysis and

Control of Electronic Equipment, Hemisphere

Publishing Corporation, 1983.

3. F. Lehtiniemi, A. Hynninen. Applications of infrared

thermography in electronics research, Nokia Research

Center, 2000.

4. C. R. Wagh, V. B. Baru. Detection of Faulty Region on

Printed Circuit Board With IR Thermography,

International Journal of Scientific & Engineering

Research, Vol. 4, Issue 11, pp. 1-4, 2013.

5. Dr. Johannes Adam, ADAM Research. Thermal

Management of Boards and Current Carrying Capacity

of Trac, Bodo´s Power Systems. Germany, 2011,

http://www.bodospower.com/

6. A. Lese, U. Scheuermann. High Load Current on FR-

4 Printed Circuit Board – Design Considerations and

Limits, Proceedings of PCIM 2004, pp. 42-47, 2004.

7. K. O. Petrosyants, I. A. Kharitonov, P. A. Kozynko

A.A. Popov. Electronic components thermal regimes

investigation by IR thermography, Proceedings of the

12-the International Workshop on Advanced Infrared

Technology and Applications. Torino : Politecnico di

Torino, pp. 185-189, 2013.

8. K. O. Petrosyants, I. A. Kharitonov, P. A. Kozynko, N.

I. Rjabov. The Multilevel System for Thermal Control

of Electronic Components, Proceedings of the

International Conference on Advances in Computer

Science and Electronics Engineering (CSEE 2014), 08-

09 March, 2014, Kuala Lumpur, Malaysia. Institute of

Research engineers and Doctors, pp. 150-155, 2014.

173

(a) (b)

Fig. 1 Layouts of high current test board [6] with

different trace structures: top layer (a), bottom layer (b).

(a) (b)

Fig. 2 Structures of modern high density test board: with

ceramic Al2O3 (500 μm) substrate (a) , with aluminium /

polymide (240 / 4,0 μm) substrate (b).

(a) (b)

(c) (d) (e)

Fig. 3. I-T characteristics for traces A-D (Fig. 1) with 18 μm (a), 35 μm (b) layer thickness. IR images of the mentioned

traces for 7.5A current and 18 μm thickness (c) –(e).

-

(a) (b)

(c) (d) (e)

Fig. 4. I-T characteristics for traces E- G (Fig. 1) with 18 μm (a), 35 μm (b) layer thickness ; IR images of traces with the

mentioned structures for 7.5A current and 18 μm thickness (c) –(e).

174

(a) (b) (c)

Fig. 5. I-T characteristics (a) for high density traces (see Fig 2) with different widths and IR images (for 2A current) for

trace placed on a polyimide board for the different trace widths of traces (b) – (c ).

(a) (b) (c )

Fig.6. I-T characteristics (a) for high density traces (Fig 2) for different substrates; IR trace images (for current of 1.1A) for

trace placed on a ceramic (b) and Al/polyimide (c) substrates .

(a) (b) (c )

(d)

Fig. 7. I-T characteristics (a) for high density traces (Fig 2) with different lengths; IR images (for current of 1.2 A) for trace

placed on Al/polyimide substrate for different trace lengths (c)-(d).