Printed Impedance Elements Fabricated by Micro Dispensingemlab.utep.edu/pdfs/Poster_3DZ.pdf ·...
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Printed Impedance Elements Fabricated by Micro-Dispensing Ubaldo Robles, Paul Deffenbaugh, Harvey Tsang, Raymond C. Rumpf We have designed, manufactured, and tested 3D printed structural impedance elements using micro-dispensing. The technology will find applications in structural electronics, impedance loaded antennas, metamaterials, and more. 21 st Century Electromagnetics Vision • Future EM systems will be 3D enabled by additive manufacturing. • Dielectrics will have a more dominant role due to the ability to sculpt their geometry. • 3D printing will enable different device paradigms such as antennas with arbitrary distributed impedance loading. • Future systems will: (1) have more densely packed functionality, (2) have entire new device concepts based that fully exploit 3D, (3) be more difficult reverse engineer, and (4) be completely infiltrated by spatially variant metamaterials to perform “field management.” Printed Impedance Elements • Truly 3D structural circuit elements must have electronics incorporated with near zero added size and weight. • Metamaterials will be dramatically reduced by incorporating impedance loading into their resonant elements. • Printed impedance elements using 3D printing are a necessity in order to realize their complex geometries. Micro-Dispensing Technology • Micro-dispensing is quickly evolving to become the dominant multi-material 3D printing process • Can manufacture structures with multiple dielectrics, mixed dielectrics and metals, 3D structural elements, several layers, complex geometries, irregular surfaces, and high resolution capabilities to manufacture micro-devices. Results Interdigitated Capacitor Spiral Inductor THE UNIVERSITY OF TEXAS AT EL PASO Measurement Setup Future Work This project was funded in part by Lockheed Martin Missiles and Fire Control. • Structural electronics • Arbitrary distributed impedance loading • Embedded circuits • RF circuits Parameter Modeled Measured Units # turns 4 4 turns Spacing between spirals 110 110.8 m Trace width 170 170.6 m Minimum L 150 158.2 nH Maximum L 150 168.5 nH Parameter Modeled Measured Units # fingers 42 42 fingers Spacing between fingers 60 60.34 m Trace width 140 156.3 m Minimum C 12 10.34 pF Maximum C 12 12.42 pF
Transcript of Printed Impedance Elements Fabricated by Micro Dispensingemlab.utep.edu/pdfs/Poster_3DZ.pdf ·...
Printed Impedance Elements Fabricated by Micro-Dispensing Ubaldo Robles, Paul Deffenbaugh, Harvey Tsang, Raymond C. Rumpf
We have designed, manufactured, and tested 3D printed structural impedance elements using micro-dispensing. The technology will find applications in structural electronics, impedance loaded antennas, metamaterials, and more.
21st Century Electromagnetics
Vision
• Future EM systems will be 3D enabled by additive manufacturing.
• Dielectrics will have a more dominant role due to the ability to sculpt their geometry.
• 3D printing will enable different device paradigms such as antennas with arbitrary distributed impedance loading.
• Future systems will: (1) have more densely packed functionality, (2) have entire new device concepts based that fully exploit 3D, (3) be more difficult reverse engineer, and (4) be completely infiltrated by spatially variant metamaterials to perform “field management.”
Printed Impedance Elements
• Truly 3D structural circuit elements must have electronics incorporated with near zero added size and weight.
• Metamaterials will be dramatically reduced by incorporating impedance loading into their resonant elements.
• Printed impedance elements using 3D printing are a necessity in order to realize their complex geometries.
Micro-Dispensing Technology • Micro-dispensing is quickly evolving to become the dominant multi-material 3D printing
process
• Can manufacture structures with multiple dielectrics, mixed dielectrics and metals, 3D structural elements, several layers, complex geometries, irregular surfaces, and high
resolution capabilities to manufacture micro-devices.
Results
Interdigitated Capacitor
Spiral Inductor
THE UNIVERSITY OF TEXAS AT EL PASO
Measurement Setup Future Work
This project was funded in part by Lockheed Martin Missiles and Fire Control.
• Structural electronics
• Arbitrary distributed impedance loading
• Embedded circuits
• RF circuits
Parameter Modeled Measured Units
# turns 4 4 turns
Spacing between spirals 110 110.8 m
Trace width 170 170.6 m
Minimum L 150 158.2 nH
Maximum L 150 168.5 nH
Parameter Modeled Measured Units
# fingers 42 42 fingers
Spacing between fingers 60 60.34 m
Trace width 140 156.3 m
Minimum C 12 10.34 pF
Maximum C 12 12.42 pF
