PRINTED CIRCUIT BOARD DESIGN AND MANUFACTURING CORP .

Corporate Information

• Established in 2004• Headquarter office in San Jose, CA• Production factory located in Binh Duong, Vietnam

- Center of hi-tech industrial parks- 30 min. from Ho Chi Minh City- 20,000 sq. ft. manufacturing facility- 2,000 sq. ft. office space

• 35 employees combined• 100% US owned company• Revenue for Y2009: USD 1.0M• Revenue for Y2010E: USD 1.2M

Mission Statement

FAB-9 strives to become the Low Cost Solution for the PCB design & manufacturing service while maintaining consistent quality, delivery and customer support

Quality Policy

It is the policy of Fab-9 to provide all customers with the highest quality workmanship. We enforce strict Quality Management System and continuous improvement process to ensure our products exceed customer’s specifications

Fab-9 Vietnam have achieved ISO 9001 certification in March 2007

Management Team

Anthony Viet Tran – CEOCo-founder of Hytek Services USA since 1993, he has extensive experience background in the PCB design layout. Anthony holds a BS Computer Science from the University of Indiana

Prudencio Valdez –Technical VPPrudencio has more than 25 years of experience in the manufacturing of printed circuit boards. He has helped startup various PCB companies in the silicon valley, CA. Prudencio have managed teams at the Tyco Elec. Div. and Sanmina

Company Structure

FAB-9 JOINT STOCK CO.,

Headquarter OfficeCalifornia, USA

ManufacturingBinh Duong, VN

Sales

Design Services

Customer Support

PCB Manufacturing

Design Services

Sales

Customer Support

Professional Services

PCB Manufacturing� Complex-Multilayer Printed Circuit Board � UL and RoHS certified materials � Impedance Controlled (50 ohm, 5%)� Quick-turn Prototypes (3 days, 4-10 layers)�Medium Volume Production (20,000 sq ft / month)

Layout Design� Net Topology Optimization�Material Performance Recommendation� Stack-up Creation� PCB Layout Guideline Creation� Pad-Stack / Component Footprint Creation & Verification

Manufacturing Capabilities

10:18:1Aspect Ratio64Maximum Layer Count – (rigid +flex)

5 mil (0.13mm)7 mil (0.18mm)Drill to Metal Minimum Spacing12Maximum Layer Count – flexible

n/a2.5 mil (0.06mm)Image to Hole Location Accuracy3016Maximum Layer Count – rigid

n/a2 mil (0.05mm)Hole Location AccuracyLayer Count

6.0 mil (0.15mm)10.0 mil (0.25mm)Minimum Drilled Hole0.003“(0.07mm)0.004” (0.1mm)Spaces – External (1/2oz copper thk)

Drilling Capability0.003“(0.07mm)0.004” (0.1mm)Spaces – Internal (1/2oz copper thk)

2.0 mil (0.05mm)2.5 mil (0.06mm)External Layers0.003“(0.07mm)0.004” (0.1mm)Lines – External (1/2oz copper thk)

2.0 mil (0.05mm)2.5 mil (0.06mm)Internal Layers0.003“(0.07mm)0.004” (0.1mm)Lines – Internal (1/2oz copper thk)

Annular RingMinimum Lines & Spaces

yesn/a4.0 oz (144um)n/a16x22“(406x559)Maximum Board Dimensions

yesn/a3.0 oz (108um)n/a18x24“(457x610)Maximum Panel Dimensions

n/ayes2.0 oz (72um)n/a18x24“(457x610)Minimum Panel Dimensions

n/ayes1.0 oz (36um)Panel / Board Dimensions

n/ayes0.5 oz (18um).200“ (5.08mm).125“ (3.175mm)Maximum

yesn/a0.25 oz (9um).024" (0.61mm).040" (1mm)Minimum

Based Copper Thickness (All Layers)Board Thickness

SPECIALSTANDARDCATEGORIESSPECIALSTANDARDCATEGORIES

Manufacturing Capabilities Cont.

0.75%1.50%Maximum Warpage

Board Warpagen/an/aImmersion Silver

9 mil (0.23mm)11 mil (0.28mm)Minimum Pitch (pad-to-pad)n/an/aImmersion Gold Thickness

5 mil (0.13mm)7 mil (0.18mm)Minimum pad sizen/an/aHAL Thickness

n/ayesMin Continuity Resistancen/an/aOSP Thickness

n/ayesMax Isolation Resistancen/an/aGold Edge Connector Thickness

n/ayesTest Voltage30uinch (0.7 um)2-3 uinch (0.07um)Selective Electrolytic Gold Plating

5%10%Differential Impedance

250uinch

(6.35um)150 uinch (3.8um)Nickel Thickness

5%10%Single Ended Impedancen/a1 mil (.025mm)Minimum Copper Plating (inside hole)

Electrical Testn/a1 mil (.025mm)Average Copper Plating (inside hole)

yes (30, 45, 60,

90 deg)

yes (30, 45, 60, 90

deg)V-Groove Angles CapabilityPlating Capability

025 mil (.63mm)Metal to Edge Minimum>0.8 mil0.8 mil (0.02mm)Minimum Solder Mask Thickness

7 mil(.18mm)10.0 mil ( .25mm)Hole to Edge Location2.0 mil (0.05mm)3.0 mil (0.08mm)Minimum Solder Mask Dam Between SMD Pads

+/-5mil(.12mm)+/- 10mil ( .25mm)Routing Tolerance2 mil (0.05mm)4.0 mil (0.05mm)Minimum Solder Mask Clearance SMD Pads

MachiningSolder Mask

SPECIALSTANDARDCATEGORIESSPECIALSTANDARDCATEGORIES

Equipment List

Photo• Orbotech 5008 Express (1998)• Orbotech 5008• CA Picard film registration punch (2001)

Primary Imaging• 2 Colight Exposure Unit (8kW)• Colight Exposure Unit (5kW)• CA Picard material registration punch (2001)• 2 Teknek CM6 clean machines

Equipment List

Wet Processing:• Chemcut clean line 547XL (2000)• Chemcut DES line 547XL• Chemcut SES lines 547• Chemcut Deburrer 604• MacDermid Multibond line (1998)• IS pumice scrubber, Pumiflex• Vertical Electroless and DC plating lines

Water Purification and Waste Treatment:• DI water system• Clarifier waste treatment system

Equipment List

Lamination:• TMP vacuum assisted press. 4 openings hot and cold. Automatic loader

Drilling/Fabrication:• 2 Excellon Mark VI drill with CNC-6 controllers• 1 Excellon Mark V Driller/Router• 1 Excellon Mark IV drill• 1 Excellon XL-3 Router

Inspection/Testing:• AOI Orbotech 206E• Probot Super Six-D

Material Suppliers

Fab-9 uses high end materials from top quality manufacturers to fabricate our PCBs. The materials we use are also UL listed and RoHS compliant

Yesn/an/aGoBrightUyemuraNickel/Gold Finishing

Yesn/an/aCupracidAtotechCopper Plating

YesYes1/2 oz, 1 ozHTENikko MaterialsCopper Foil

YesYesWhiteS-200WTaiyoLegend Ink

YesYes

LPI Green, Blue,

ClearPSR-2000, 4000,..TaiyoSolder Mask

YesYesHigh Tg > 170

R1766T,

IT-180, NP-170

Matsushita,

Iteq, NanYa

Polyimide ISOLAPrepregs

YesYesHigh Tg >170

R1766T,

IT-180, NP-170

Matsushita,

Iteq, NanYa,

Polyimide ISOLACopper Clad Laminate

RoHS CompliantUL ListedSpecsSeriesManufacturerMaterials Description

Certifications

UL Listed• FAB-9 is UL Listed under product code E257250

ISO 9001:2008• FAB-9 obtained its ISO 9001 standard certification in March 2007

RoHS •FAB-9 products have been certified by TUV Vietnam as RoHS compliant

E257250

RoHSCOMPLIANT

Business Partners

Thank You

Fab-9 Corp.- Headquarter1630 Old Oakland Rd. Suite A212San Jose, CA 95131. USATel: (408)761-5267, 436-8896email: viet.tran@fab-9.com

Fab-9 Joint Stock Company1B St. Dong An Industrial ParkBinh Duong Province, VietnamTel: (+84) 0650-783423, 783424, 783425Fax: (+84) 0650-783426email: toan.nguyen@fab-9.com

http://fab-9.comEmail: sales@fab-9.com