Pressure Cure Oven (PCO)
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Transcript of Pressure Cure Oven (PCO)
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Pressure Cure Oven (PCO)
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Introduction
Pressure Cure Oven (PCO) or Autoclave is used to minimize voiding and increase adhesion strength for bonding processes typically used in die attach and underfill applications
PCO pressurizes air into a rigid vessel and heats & cools with forced convection¬Heaters, heat exchangers and blowers are internal to
the pressure vessel When the curing process is complete, the pressure oven
automatically relieves its pressure to 1atm and cools
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PCO[Autoclave]
Semi.
Glass
DisplayFood & etc
Medi-cal
Test/Lab.
Composite forming (for pri-mary in-dustry)
Viable applications for PCO
PCO Introduction
Wafer laminating
Die attach curing
Thermal compress bonding
Via filling
Underfill curing
Film & Tape bonding
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PCO is applied for curing die attach adhesive and removing voids in adhesive or already soldered products
Air bubbles
Solder ball Substrate
Introduction
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Process Specification• Process time: Generally 120 min or
User’s spec
• Operating temp: 60oC ~ 200oC
• Maximum temp: 220oC
• Operating pressure: 1 bar – 10 bar
• Capacity: 24 Magazines (typical)
• Cooling method: PCW (17oC - 23oC)
• Cooling water pressure: 25 – 40 psi
200℃
60℃
0
Temp.
30min 90min 120min Time
10 bar
020min 90min 110min Time
Cooling process
Curing process
Rising process
Pressure.
Representative Pressure/Temp Profiles (User Configurable)
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System Dimensions
※ Wight: About 2.7 Ton1,700㎜
2,200㎜
1,700㎜
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Chamber Dimensions
7
440mm
189mm
199.5mm
608mm
716.5mm
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Chamber with Shelves Extended
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System Air Flow
9
Door inside cover
Return air assistance damper
Heater module
radiator
Fan motor & mechanical seal
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Vacuum Module Option• Vacuum Module (Optional)
Vacuum pump
GaugeVacuum in/out line