ITRS Presentation :Modeling & Simulation

Presented By : LAHSAINI Achraf & MAKARA Felipe

Summary

Introduction

Difficult Challenges : > Difficult Challenges between 2013 – 2020 > Difficult Challenges beyond 2020

Technology Requirements > Capabilities and Accuracy Requirements

Reliability Modeling Robustness, Manufacturability & Yield Numerical methods & Interoperability Potential Solutions Cross-Cut issues

Introduction Material, Reliability, Active devices and Interconnects issues

are becoming more and more important in all processes.

Design robutness and manufacturing are affected by all areas simulated.

Modeling Goal :

> Support technology development and Optimization > Reduce development times and costs

Difficult Challenges :Difficult Challenges between 2013 - 2020

Modeling and Simulation requirements must be set in time.

Physical effects interact with each other and must be separated. Equipement Scale

Modeling Lithography Modeling

Compact Modeling Package Modeling

Numericable Methods Materials Modeling Reliability Modeling Robustness Modeling

Front End Process Modeling Device Modeling Interconnects and Integrated Passive Models

Difficult Challenges Beyond 2020

Modeling of chemical,thermoelectrical and electrical properties of new materials.

Nano-Scale Modeling for Emerging Research Devices and Interconnects.

Open common data set for all physical data relevant for modeling.

Technology Requirements :

Lithography Modeling :

> Optical image Modeling > Electromagnetic Scattering Analysis > Direct Pattering Techniques > Resist Modeling > Integrated Modeling Systems > Coupling of Metrology and Modeling

Device Modeling :

> Contact Resistance > 3D Modeling > Dopant, geometric and structural

fluctuations > CMOS Scaling > Modeling requirements for novel devices

Materials Modeling : > Material Properties Database

> Datamining

> Required Parameters

> Materials Models

Package Simulation :

> Increasing pin counts and size contraints result in exprensive Packages.

> Required integrated electrical, thermal

and mechanical simulations.

> Package must meer demanding requirements.

Reliability Modeling

Study and prediction of the failuresDevice faults

Bias Temperature Instability (BTI) Hot Carrier Injection (HCI) Random Telegraph Signals (RTS) Eletrostatic Discharge (ESD)

Memories malfunction (volatile and non-volatile)

Interconnection faultsISO26262 - failure rate for automotive devices

Robustness, Manufacturability & Yield

Design CI’s that are not affected by production variationsSystematic (lithography, proximity...) or

RandomNeed to simulate variations on all transistors

fast Gb memories (bit failure around 10-18)

Implementation of suggested DREstimate the whole circuit performanceMulti-physics modeling

Heat, mechanical...

Numerical methods & Interoperability

Calculate fast and in every caseDeveloping of algorithms for calculations3-dimentional computingMontecarlo simulations (or another stochastic

sim.)Rethink the linear solversImplementation on multicore CPUsInteroperability: use tools from every vendor

Potential Solutions

Increase cross-discipline effortsAdequate resources for research

Evaluate the simulation benefitsShare of the informationSimulation tools for equipementsIntegration of simulators

Cross-cut issuesDesign/System drivers

Manufacturability; impact of parasitics and fluctuations on doping...

Test and Test EquipmentSimulation is needed for tests equipment;

defect detection; simulation of the stress on the testing...

Process Integration, Devices & StructuresReability of a new gamma of materials and

technologies (Ge, III/V, carbon nanotubes, interconnections...)

Cross-Cut issues

Emerging Research DevicesExtension of the scope of the simulation is

needed, as well as standardisation of new devices simulation

Emerging Research MaterialsIncrease in the number of materials; decrease

in the size; Simulation may not be possible yetRadio Frequency for Communications

Simulation of components and interaction; SoC/SiP; 3D eletromagnetic; compact models; Heat...

Cross-Cut issues

Front-end processesModelisation of the processes, performances,

variability and defectsLithography

Push the optical and extreme ultraviolet to its limit; Model for non ideal masks, lenses...; Prediction of the photoresists behavior; Mechanical, thermal and fluidic simulations

Cross-Cut issues Interconnect

Models are based on RC/RLC; Process variations; “3D” integration; electro-thermal-mechanical ...

Factory IntegrationPhysical processes during device fabrication;

Increasing the yield throught simulationAssembly and packaging

Mechanical/Electrical/Thermal/Reability(...); Stacked die; Materials; Soldering;

Cross-Cut issues

Environment, Safety and HealthResource, chemicals, cleaning reduction to

minimum; Better understanding of the processesYield EnhancementMetrology

Bi-directional links (one needs the other)MEMS

Sim. already mentioned + stress, flows, materials...

Thank you for your

attention